Trimming test device and trimming test method

Abstract

The invention discloses a trimming test device and a trimming test method. According to the embodiment of the invention, the trimming test device comprises a resistance measurement unit, a test sub-circuit and a trimming unit, wherein the resistance measurement unit is used for measuring the resistance value of the test sub-circuit; and the laser head emits laser to the test sub-circuit so as to heat the test sub-circuit, and the trimming result is judged according to the resistance value of the test sub-circuit. According to the trimming test device and the trimming test method provided by the embodiment of the invention, the time required by the whole test is greatly shortened.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit technology, and particularly relates to a trimming test device and a trimming test method. Background Art

[0002] In electronic devices, the performance of a chip often directly affects whether the electronic device can achieve its intended functions. Errors caused by chip manufacturing, packaging, and other processes can cause deviations between the actual test values and the design values of the chip.

[0003] In the prior art, in order to improve the yield of chip production, developers usually set up a trimming circuit in the chip. During the wafer test (Chip Probing, CP) stage, it is determined whether the actual value of the chip meets the application range by testing the actual value of the chip. If the value does not reach the application range value, the fuse of the trimming circuit is sintered. Since the fuse (poly fuse) is under the chip metal layer, after sintering, substances cannot be evaporated, and there will be a situation where the sintering is incomplete. To improve the reliability and yield of chip production, after the poly fuse is sintered, the above process needs to be repeated at normal temperature and high temperature for re-testing, and the resistance value of the poly fuse is detected (the resistance value of abnormal sintering will be abnormal at a specific temperature). The wafer test uses an ATE (Automated Test Equipment) tester to detect wafer parameters. Measuring the poly fuse resistance requires adding a small current. The test line of the ATE machine is usually long, which may cause measurement errors, and the test time is too long due to the switching between normal temperature and high temperature.

[0004] Therefore, it is desirable to have a new trimming test device and a trimming test method that can overcome the above problems. Summary of the Invention

[0005] In view of the above problems, an object of the present invention is to provide a trimming test device and a trimming test method, particularly a test method after the Fuse (fuse) is burned (trimmed), so as to shorten the overall test time required.

[0006] According to one aspect of the present invention, there is provided a trimming test device, including: A resistance measurement unit for measuring the resistance value of a test sub-circuit; and A laser head for emitting laser to the test sub-circuit to heat the test sub-circuit, wherein the trimming result is judged according to the resistance value of the test sub-circuit.

[0007] Optionally, the trimming test device further includes a probe card; the probe card includes: A substrate; and A probe, the probe being disposed on the substrate; The resistance measurement unit is disposed on the probe card and is connected to the probe; the resistance measurement unit is connected to the test sub-circuit via the probe to measure the resistance value.

[0008] Optionally, the trimming test device further includes a probe card; the probe card includes: A substrate; A probe, the probe being disposed on the substrate, the probe being connected to the test sub-circuit to measure the resistance value; A connector, the connector being disposed on the substrate, the connector being respectively connected to the probe and the resistance measurement unit; The laser head is disposed on the substrate and / or the probe, and a lens is disposed on the transmission path of the laser.

[0009] Optionally, the resistance measurement unit includes: A first current lead and a second current lead, the first current lead and the second current lead are respectively connected to the test sub-circuit to provide a first current to the test sub-circuit; A first voltage lead and a second voltage lead, the first voltage lead and the second voltage lead are respectively connected to the first end and the second end of the test sub-circuit to measure the voltage drop between the first end and the second end of the test sub-circuit, wherein the resistance value of the test sub-circuit is obtained according to the first current and the voltage drop.

[0010] Optionally, there are multiple test sub-circuits; The resistance measurement unit is respectively connected to multiple probes, and different probes are respectively connected to different test sub-circuits to respectively measure the resistance values of different test sub-circuits; There are multiple laser heads, and different laser heads respectively emit lasers to different test sub-circuits to respectively heat different test sub-circuits.

[0011] Optionally, the trimming test device further includes: An electrical parameter test unit, the electrical parameter test unit is respectively connected to different test sub-circuits to respectively measure the electrical parameters of different test sub-circuits; A judgment unit, the judgment unit is connected to the electrical parameter test unit to receive the electrical parameters, and judges whether the corresponding test sub-circuit measures the resistance value according to the electrical parameters; and A control unit, which is connected to the judgment unit to receive the judgment result of whether the test sub-circuit measures the resistance value, and controls the laser head corresponding to the test sub-circuit that needs to measure the resistance value to heat the corresponding test sub-circuit.

[0012] Optionally, the trimming test device further includes: A temperature sensor for measuring the temperature of the test sub-circuit; and A temperature control unit, which is respectively connected to the temperature sensor and the laser head, and adjusts the heating power of the corresponding laser head according to the temperature of the test sub-circuit, wherein, the resistance measurement unit measures the resistance value of the test sub-circuit at different temperatures; Judge the trimming result according to the resistance value of the test sub-circuit at different temperatures.

[0013] Optionally, the trimming test device further includes: A conversion unit, which is connected to the resistance measurement unit to receive the measured resistance value and converts the measured resistance value into a digital signal.

[0014] Optionally, the trimming test device further includes: A probe station for placing the wafer; A test headstock, on which a probe card is provided; the probe card includes probes and the resistance measurement unit; A test machine, which includes at least one of a power card, a digital card, an analog card, and a digital-analog hybrid card, wherein, the resistance measurement unit contacts the test sub-circuit on the wafer via the probe to measure the resistance value; The test machine is connected to the test headstock via a test cable; the test machine is connected to the probe station via a communication cable.

[0015] According to another aspect of the present invention, a trimming test method is provided, including the following steps: Emit laser to the test sub-circuit to heat the test sub-circuit; Measure the resistance value of the test sub-circuit; and Judge the trimming result according to the resistance value of the test sub-circuit.

[0016] The trimming test device and the trimming test method provided by the present invention use a laser head to heat the test sub-circuit to be tested, can quickly reach the required temperature, and greatly shorten the overall test time required.

[0017] Further, the resistance measurement unit is integrated on the probe card, which can independently complete the resistance measurement without occupying the resources of the tester, reducing the cost and improving the test efficiency.

[0018] Further, the four-wire test resistance is realized through the first current lead, the second current lead, the first voltage lead and the second voltage lead, which can reduce the measurement error and improve the measurement accuracy.

[0019] Further, there are multiple test sub-circuits and correspondingly multiple laser heads, which can independently heat different test sub-circuits, avoiding the heating process of the entire wafer, shortening the test time and reducing the cost.

[0020] Further, the electrical parameter test unit determines whether to measure the resistance value according to the measured electrical parameters of the test sub-circuit, so as to heat and measure the test sub-circuits within the qualified range and not heat those that do not meet the requirements, which can reduce the useless heating duration and the test cost.

[0021] Further, adjusting the heating power of the corresponding laser head according to the temperature of the test sub-circuit can accurately and quickly obtain the resistance values at different temperatures without secondary probing. The number of times the probe card probes the wafer is reduced, and the data can be directly compared while ensuring the reliability of the wafer.

[0022] Further, the conversion unit converts the resistance value of the analog signal into the resistance value of the digital signal, enabling the tester to directly obtain the resistance value data, which can reduce the use of the hardware resources of the test machine and lower the cost. Description of the Drawings

[0023] Through the following description of the embodiments of the present invention with reference to the drawings, the above and other objects, features and advantages of the present invention will become clearer. In the drawings: Figure 1 Shows a schematic diagram of the application scenario of the trimming test device according to Embodiment 1 of the present invention; Figure 2 Shows a schematic diagram of the structure of the trimming test device according to Embodiment 2 of the present invention; Figure 3 Shows a schematic diagram of the structure of the control card according to Embodiment 3 of the present invention; Figure 4 Shows a schematic diagram of the structure of the control card according to Embodiment 4 of the present invention; Figure 5 Shows a schematic diagram of the structure of the resistance measurement unit according to Embodiment 5 of the present invention; Figure 6 Shows a schematic diagram of the structure of the trimming test device according to Embodiment 6 of the present invention; Figure 7Shows a schematic diagram of the trimming principle according to an embodiment of the present invention; Figure 8 Shows a method flowchart of the trimming test method according to an embodiment of the present invention. Detailed implementation manners

[0024] The various embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. In the respective drawings, the same elements are denoted by the same or similar reference numerals. For the sake of clarity, the various parts in the drawings are not drawn to scale. In addition, some well-known parts may not be shown in the figures.

[0025] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. Many specific details of the present invention are described below, such as the structure, material, size, processing technology and techniques of components, so as to understand the present invention more clearly. However, as those skilled in the art can understand, the present invention can be implemented without these specific details.

[0026] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "above" or "on top of" another layer or another region, it may mean directly above the other layer or another region, or there may be other layers or regions between it and the other layer or another region. And if the component is flipped, this layer or region will be "below" or "beneath" the other layer or region.

[0027] Figure 1 Shows a schematic diagram of the application scenario of the trimming test device according to Embodiment 1 of the present invention. As Figure 1 shown, the trimming test device according to Embodiment 1 of the present invention includes a resistance measurement unit 100 and a laser head 200.

[0028] Specifically, the resistance measurement unit 100 is used to measure the resistance value of the test sub-circuit.

[0029] The laser head 200 emits laser light to the test sub-circuit to heat the test sub-circuit. Optionally, a lens 300 is provided on the transmission path of the laser.

[0030] The trimming test device determines the trimming result according to the resistance value of the test sub-circuit.

[0031] In a specific application scenario, multiple chips are arranged on a wafer 400. A trimming circuit is provided inside the chip. During the wafer testing stage, the actual performance of the chip is tested to see if it meets the standards. For chips that do not meet the standards, the trimming circuit of the chip is fused (or anti-fused, etc.) to adjust the performance of the chip. For the chips after fuse trimming, in order to ensure the fuse sintering effect, the above process needs to be repeated at normal temperature and high temperature for re-testing, and the resistance value of the poly fuse is detected (the resistance value will be abnormal at a specific temperature for abnormal sintering).

[0032] For the trimmed chip, the resistance measurement unit 100 is connected to its test sub-circuit to measure the resistance value of the test sub-circuit. The test sub-circuit is a part of the circuit on the chip. The test sub-circuit includes, for example, a trimming circuit. The laser head 200 emits laser to the test sub-circuit to heat the test sub-circuit to a certain temperature, and then the resistance value at this temperature is obtained through the resistance measurement unit 100. The trimming result is judged according to whether the resistance value of the test sub-circuit (at a specific temperature) meets the corresponding expected value; when the measured resistance value meets the expected value, it is judged that the trimming is successful; when the measured resistance value does not meet the expected value, it is judged that the trimming is unsuccessful.

[0033] In an alternative embodiment of the present invention, the trimming test device further includes a probe card. The probe card includes a substrate and probes. The probes are arranged on the substrate. The resistance measurement unit is also arranged on the probe card and is connected to the probes. The resistance measurement unit is connected to the test sub-circuit via the probes to measure the resistance value. Optionally, the resistance measurement unit can independently complete the resistance test without the control and support of other devices (such as test machines).

[0034] Optionally, the trimming test device further includes a probe card. The probe card includes a substrate, probes and a connector. The probes are arranged on the substrate, and the probes are connected to the test sub-circuit to measure the resistance value. The connector is arranged on the substrate, and the connector is respectively connected to the probes and the resistance measurement unit. The laser head is arranged on the substrate and / or the probes, and a lens is arranged on the transmission path of the laser.

[0035] Figure 2 The structural schematic diagram of the trimming test device according to the second embodiment of the present invention is shown. As Figure 2 shown, the trimming test device according to the second embodiment of the present invention includes a probe card. The probe card includes a substrate 501 and probes 500.

[0036] Specifically, the resistance measurement unit 100 is arranged on one side (such as above) of the substrate 501. The probes 500 are arranged on the other side (such as below) of the substrate 501. The laser head 200 is connected to the resistance measurement unit 100. An opening is arranged at the position on the substrate 501 corresponding to the laser head 200, and the laser emitted by the laser head 200 can be emitted through the opening.

[0037] Optionally, there are multiple test sub - circuits. Specifically, there are multiple chips arranged on the wafer. Each of the multiple chips has its own test sub - circuit. The resistance measurement unit 100 is respectively connected to multiple probes 500. Different probes are respectively connected to different test sub - circuits (chips) to measure the resistance values of different test sub - circuits. The laser heads 200 are multiple ( Figure 2 only one is shown in the figure), and different laser heads 200 respectively emit lasers to different test sub - circuits to heat different test sub - circuits respectively.

[0038] Optionally, the trimming test device further includes an electrical parameter test unit 110, a judgment unit (not shown in the figure) and a control unit (not shown in the figure). The electrical parameter test unit 110 is respectively connected to different test sub - circuits to measure the electrical parameters of different test sub - circuits. Combining with the application scenario part described above, the electrical parameter test unit 110 is used, for example, in the wafer test stage to test whether the actual performance of the chip meets the standard. The judgment unit is connected to the electrical parameter test unit 110 to receive the electrical parameters and judge whether the corresponding test sub - circuit measures the resistance value according to the electrical parameters. The control unit is connected to the judgment unit to receive the judgment result of whether the test sub - circuit measures the resistance value, and controls the laser head corresponding to the test sub - circuit that needs to measure the resistance value to heat the corresponding test sub - circuit.

[0039] Figure 3 FIG. shows a schematic structural diagram of a control card according to Embodiment III of the present invention. Specifically, a top view of the control card is shown. The control card includes an interface 600, a resistance measurement unit 100 and an electrical parameter test unit 110. The resistance measurement unit 100 and / or the electrical parameter test unit 110 are connected to the interface 600 and communicate with the rest through the interface 600.

[0040] Figure 4 FIG. shows a schematic structural diagram of a control card according to Embodiment IV of the present invention. Specifically, a bottom view of the control card is shown. The control card includes an interface 600 and probes 500. The probes 500 are, for example, connected to the interface 600 to communicate with the rest through the interface 600.

[0041] In an alternative embodiment of the present invention, the resistance measurement unit adopts a four - wire method for measuring resistance. The four - wire method for testing resistance provides a constant current I flowing through the resistance under test (test sub - circuit) R through the current leads, and measures the voltage drop V across the resistance under test R through the voltage leads. The resistance under test R can be calculated according to the measured voltage drop V and the constant current I. The four - wire method for measuring resistance can eliminate the influence of lead resistance and contact resistance by separating the current application and voltage measurement paths, and can achieve high - precision measurement of (low) resistance.

[0042] Specifically, the resistance measurement unit includes a first current lead and a second current lead, a first voltage lead and a second voltage lead. The first current lead and the second current lead are respectively connected to the test sub-current to supply a first current to the test sub-circuit. The first voltage lead and the second voltage lead are respectively connected to the first end and the second end of the test sub-circuit to measure the voltage drop between the first end and the second end of the test sub-circuit. The resistance value of the test sub-circuit is obtained based on the first current and the voltage drop.

[0043] Figure 5 The structural schematic diagram of the resistance measurement unit according to Embodiment 5 of the present invention is shown. As Figure 5 shown, in a specific embodiment, the resistance measurement unit includes a drive control circuit, a laser head, an analog-to-digital conversion device, and a four-wire resistance measurement circuit.

[0044] Specifically, the drive control circuit receives the input (signal) from the ATE (Automated Test Equipment). The drive control circuit is also connected to the laser head to control the laser head to output laser.

[0045] The analog-to-digital conversion device receives the input (signal) from the ATE. The four-wire resistance measurement circuit is connected to the test sub-circuit to measure the resistance value. The resistance value (analog signal) measured by the four-wire resistance measurement circuit is converted by the analog-to-digital conversion device and outputs a digital signal (of the resistance value).

[0046] In an alternative embodiment of the present invention, the trimming test device further includes a temperature sensor and a temperature control unit. The temperature sensor is used to measure the temperature of the test sub-circuit. The temperature control unit is respectively connected to the temperature sensor and the laser head, and adjusts the heating power of the corresponding laser head according to the temperature of the test sub-circuit (to heat the test sub-circuit to the required temperature). The resistance measurement unit measures the resistance value of the test sub-circuit at different temperatures. The trimming result is judged based on the resistance values of the test sub-circuit at different temperatures.

[0047] In an alternative embodiment of the present invention, the trimming test device further includes a conversion unit. The conversion unit is connected to the resistance measurement unit to receive the measured resistance value and converts the measured resistance value (of the analog signal) into a digital signal (of the resistance value).

[0048] Figure 6 The structural schematic diagram of the trimming test device according to Embodiment 6 of the present invention is shown. As Figure 6 shown, the trimming test device according to Embodiment 6 of the present invention includes a probe station 700, a test head 900, and a test machine 800.

[0049] Specifically, the probe station 700 is used to place the wafer 400. The probe station 700 fixes the wafer 400 through a precision mechanical platform, for example, and uses an optical system (such as a microscope, a camera, etc.) to accurately align the chip positions on the wafer, ensuring that the probes 500 are in accurate contact with the chip pads.

[0050] A probe card 510 is provided on the test head 900. The probe card 510 includes probes 500 and a resistance measurement unit 100. The resistance measurement unit 100 contacts the test sub-circuits on the wafer 400 via the probes 500 to measure the resistance values. The test head 900 is directly responsible for, for example, performing electrical signal interactions with the chips on the wafer 400 to complete functional verification and performance testing. The test head 900 transmits the voltage, current, digital signals, high-frequency signals, etc. generated by the tester 800 to the chip pads on the wafer 400 through the probe card 510, and at the same time returns the response signals of the chips to the tester 800 for analysis.

[0051] The tester 800 is connected to the test head 900 via a test cable 820 and performs information interactions through the test cable 820. The tester 800 is connected to the probe station 700 via a communication cable 810 and performs information interactions through the communication cable 810. The tester 800 includes at least one of a power card 801, a digital card 802, an analog card 803, and a digital-analog hybrid card 804, etc. The power card 801 provides a stable DC power supply and current for the chip under test. The digital card 802 sends digital excitation signals (such as clock signals, data streams, etc.) to the chip and captures the output responses. The analog card 803 is used to generate analog signals such as sine waves, square waves, ramps, etc. for measuring analog parameters such as the voltage, current, impedance, temperature, etc. of the chip. The digital-analog hybrid card 804 supports the generation and acquisition of both digital signals and analog signals at the same time.

[0052] In an alternative embodiment of the present invention, the resistance measurement unit includes a laser head, and a lens is installed on the laser head corresponding to the area to be heated on the wafer. The heating method of the laser head enables multiple temperature parameters (the resistance values below) to be measured with each probe insertion. The data obtained from the test is recorded by the resistance measurement unit and transmitted back to the tester 800 for direct judgment. The resistance measurement unit can control the laser (heating) time, and the built-in temperature sensor can transmit back the laser heating temperature to achieve precise temperature control.

[0053] Figure 7 The schematic diagram of the trimming principle according to an embodiment of the present invention is shown. Figure 7 The part shown is the partial structure of a certain chip on the wafer (including the sintered part). As Figure 7As shown, the functional circuit part 403 is used to implement the chip functions; the sintered resistor device 402 is disposed on the chip, and a sintering test point 401 is arranged on one side of the sintered resistor device 402. The number, position, etc. of the sintered resistor devices 402 on the chip can be set according to the required functions. After the sintered resistor device 402 is sintered, the resistance value of the sintering test point 401 to the ground is measured by a resistance measurement unit to determine whether the sintering is good, and then the trimming result is obtained.

[0054] According to another aspect of the present invention, there is provided a trimming test method, for example, for the trimming test device as described above. As Figure 8 shown, the trimming test method according to an embodiment of the present invention includes the following steps: In step S101, a laser is emitted to the test sub-circuit to heat the test sub-circuit; The emitting head emits a laser to the test sub-circuit to heat the test sub-circuit.

[0055] In step S102, the resistance value of the test sub-circuit is measured; The resistance measurement unit 100 measures the resistance value of the test sub-circuit.

[0056] In step S103, the trimming result is judged according to the resistance value of the test sub-circuit.

[0057] The trimming result is judged according to the resistance value of the test sub-circuit. When the measured resistance value meets the expected value, it is judged that the trimming is successful; when the measured resistance value does not meet the expected value, it is judged that the trimming is unsuccessful.

[0058] In an alternative embodiment of the present invention, the trimming test method further includes: Measuring the resistance value of the test sub-circuit at a first temperature; Emitting a laser to the test sub-circuit to heat the test sub-circuit to a second temperature; Measuring the resistance value of the test sub-circuit at the second temperature; Judging the trimming result according to the resistance value at the first temperature and the resistance value at the second temperature. Wherein, the first temperature is, for example, normal temperature, and the second temperature is greater than the first temperature.

[0059] In an alternative embodiment of the present invention, the trimming test method further includes: Testing the electrical parameters of a plurality of test sub-circuits respectively; Judging whether the corresponding test sub-circuit needs to measure the resistance value according to the electrical parameters.

[0060] It should be noted that, in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.

[0061] As described above in accordance with the embodiments of the present invention, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the above description. These embodiments are selected and specifically described in this specification in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can make good use of the present invention and its modifications based on the present invention. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A trimming test device, comprising: A resistance measurement unit configured to measure the resistance value of a test sub - circuit; And A laser head that emits laser light towards the test sub - circuit to heat the test sub - circuit, wherein the trimming result is judged according to the resistance value of the test sub - circuit.

2. The trimming test device according to claim 1, wherein, The trimming test device further includes a probe card; the probe card includes: A substrate; and Probes disposed on the substrate; The resistance measurement unit is disposed on the probe card and connected to the probes; the resistance measurement unit is connected to the test sub - circuit via the probes to measure the resistance value.

3. The trimming test device according to claim 1, wherein, The trimming test device further includes a probe card; the probe card includes: A substrate; Probes disposed on the substrate, the probes being connected to the test sub - circuit to measure the resistance value; A connector disposed on the substrate, the connector being respectively connected to the probes and the resistance measurement unit; The laser head is disposed on the substrate and / or the probes, and a lens is provided on the transmission path of the laser.

4. The trimming test device according to claim 1, wherein, The resistance measurement unit includes: A first current lead and a second current lead, the first current lead and the second current lead are respectively connected to the test sub - circuit to supply a first current to the test sub - circuit; A first voltage lead and a second voltage lead, the first voltage lead and the second voltage lead are respectively connected to the first end and the second end of the test sub - circuit to measure the voltage drop between the first end and the second end of the test sub - circuit, wherein the resistance value of the test sub - circuit is obtained according to the first current and the voltage drop.

5. The trimming test device according to claim 1, wherein, There are multiple test sub - circuits; The resistance measurement unit is respectively connected to multiple probes, and different probes are respectively connected to different test sub - circuits to respectively measure the resistance values of different test sub - circuits; There are multiple laser heads, and different laser heads respectively emit laser light towards different test sub - circuits to respectively heat different test sub - circuits.

6. The trimming test device according to claim 5, wherein, The trimming test device further includes: An electrical parameter test unit that is respectively connected to different test sub - circuits to respectively measure the electrical parameters of different test sub - circuits; A judgment unit connected to the electrical parameter test unit to receive the electrical parameters and judge whether the corresponding test sub - circuit measures the resistance value according to the electrical parameters; and A control unit connected to the judgment unit to receive the judgment result of whether the test sub - circuit measures the resistance value and control the laser head corresponding to the test sub - circuit that needs to measure the resistance value to heat the corresponding test sub - circuit.

7. The trimming test device according to claim 1, wherein, The trimming test device further includes: A temperature sensor configured to measure the temperature of the test sub - circuit; and A temperature control unit respectively connected to the temperature sensor and the laser head, and adjusting the heating power of the corresponding laser head according to the temperature of the test sub - circuit. Among them, the resistance measurement unit measures the resistance value of the test sub-circuit at different temperatures; Judge the trimming result according to the resistance value of the test sub-circuit at different temperatures.

8. The trimming test device according to claim 1, wherein, The trimming test device further includes: A conversion unit, which is connected to the resistance measurement unit to receive the measured resistance value and convert the measured resistance value into a digital signal.

9. The trimming test device according to claim 1, wherein, The trimming test device further includes: A probe station for placing a wafer; A test head on which a probe card is provided; the probe card includes probes and the resistance measurement unit; A tester, which includes at least one of a power card, a digital card, an analog card, and a digital-analog hybrid card, Among them, the resistance measurement unit contacts the test sub-circuit on the wafer through the probe to measure the resistance value; The tester is connected to the test head via a test cable; the tester is connected to the probe station via a communication cable.

10. A trimming test method, comprising the following steps: Emit a laser to the test sub-circuit to heat the test sub-circuit; Measure the resistance value of the test sub-circuit; And Judge the trimming result according to the resistance value of the test sub-circuit.

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