EM path finding system for semiconductor material flow direction

Abstract

The invention relates to the field of semiconductor factory material handling, and discloses a semiconductor material flow direction EM path-finding system, which comprises a layout drawing module, a path and equipment configuration module, an information acquisition module, a task generation module, a path planning module and a task execution module. The method comprises the following steps of: selecting a plurality of devices, marking material nodes and functions of the nodes, inputting state information and task information of each device obtained in a scheduling system into a path-finding system to analyze a dynamic adjustment path weight, and sending a path-finding instruction to the path-finding system through the scheduling system to trigger planning of a material carrying path. And the planned optimal path is returned to the scheduling system, and the execution task of the corresponding equipment is called according to the path configuration, so that the problems of independent scheduling of each equipment and low path planning efficiency in a traditional path-finding system are solved, efficient cooperation among the equipment is realized, conflicts and resource waste are eliminated, and the overall material handling efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of material handling in semiconductor factories, and more particularly to an EM pathfinding system for semiconductor material flow directions. Background Art

[0002] Semiconductor manufacturing is a highly complex process that encompasses multiple processes and equipment. With the continuous advancement of semiconductor manufacturing technology, especially the reduction of process nodes, semiconductor production has put forward higher requirements for the accuracy, reliability, and efficiency of material handling. Automated Material Handling Systems (AMHS) have become an indispensable part of modern semiconductor factories, which achieve automatic material handling through equipment such as Automated Guided Vehicles (AGV) and Overhead Conveyor (OHCV).

[0003] However, existing material handling systems usually rely on independent pathfinding algorithms and scheduling systems. Each system is independent and lacks an efficient cooperation mechanism, resulting in poor coordination and low efficiency between systems. In addition, there are still certain challenges in the optimization of equipment scheduling and the efficiency of path planning during the material handling process. Therefore, most existing pathfinding systems are designed for a single device and cannot effectively consider the collaborative work between different devices. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides an EM pathfinding system for semiconductor material flow directions to solve the problems existing in the above-mentioned background art.

[0005] The present invention provides the following technical solutions: An EM pathfinding system for semiconductor material flow directions, comprising:

[0006] A layout drawing module: Draw a complete factory layout drawing based on the layout status inside the factory and the distribution of equipment.

[0007] A path and equipment configuration module: Mark all material nodes and the functions of each node on the layout drawing, design the moving paths of AGV and OHCV, and then number each moving path for identifying and tracking material handling.

[0008] An information acquisition module: Real-time acquire and update the status information and task information of each device in the scheduling system, and analyze the dynamic adjustment of path weights based on inputting the device status information and task information into the EM pathfinding system to obtain a dynamic adjustment path weight factor.

[0009] A task generation module: Automatically generate material handling tasks through the scheduling system and automatically generate and send pathfinding instructions.

[0010] Path planning module: When receiving a path-finding instruction, it triggers the planning and analysis of the handling path of the material to obtain the optimal path, which is used to plan the handling path of the material;

[0011] Task execution module: Based on the planned optimal path, it returns to the scheduling system and calls the corresponding equipment to execute tasks according to the path configuration.

[0012] Preferably, the layout drawing module is used to collect the detailed information of all equipment, including name, size, weight, required power supply and cooling requirements, determine the path of material flow, including raw material input, product output and storage area, and determine the specific position of each node. Based on the starting point, ending point and intermediate processing nodes of the material, it uses drawing software to draw the basic structure of the factory and the placement information of the equipment, and draws the interior of the factory into a complete factory layout drawing.

[0013] Preferably, the path and equipment configuration module marks the positions of material nodes on the layout drawing with different colors or symbols respectively, including raw material warehouse, production line, inspection area, finished product warehouse, loading area and storage area, and marks the functions of each node, including storage, processing and inspection. Then, by designing the moving paths of AGV and OHCV, where AGV refers to the path running on the ground and travels along the preset path through technologies such as magnetic strips, laser reflectors, two-dimensional codes or visual navigation, and OHCV refers to the path running on the elevated track, which is mainly used for vertical cargo handling and traveling. Check that there is no intersection between the paths, represent the moving paths of AGV and OHCV with lines on the layout drawing, and number each moving path as AGV1, AGV2... AGVn and OHCV1, OHCV2... OHCVm. At the same time, configure the AGV and OHCV handling equipment and their action information. The specific operation steps are as follows:

[0014] Step S211: Used to configure the equipment. Select a suitable AGV model according to the load, size and battery life, mark the starting point, charging point and possible docking points of the AGV on the layout drawing, and select the type and quantity of OHCV according to the layout and height of the production line, and mark the track and docking points of the OHCV on the layout drawing;

[0015] Step S212: Used to configure the equipment action information. Configure the AGV action information by writing an action script for the AGV, including starting, moving, loading, unloading and charging. Configure the OHCV action information by writing an action script for the OHCV, including starting, moving, loading and unloading;

[0016] Finally, integrate the control systems of AGV and OHCV with the central control system of the factory to ensure that all equipment can receive and execute the instructions of the central control system.

[0017] Preferably, the information acquisition module uses sensors and RFID scanning methods to collect the status information of all devices in real time, including device location, moving speed, and device load rate, and obtains the priority, destination, and estimated completion time of the current tasks of all devices from the production management system in real time, so as to acquire task information, automatically update the acquired status information and task information of all devices to the scheduling system for storage, and then preprocess the status information and task information. The specific preprocessing operation process includes data cleaning and data conversion, and fuses the status information and task information of the devices into a unified data set to match the status information of each device with its corresponding task information. Then, the data set of the fused device status information and task information is transmitted to the EM pathfinding system to analyze and dynamically adjust the path weight factor;

[0018] Based on the analysis of the data set of the fused device status information and task information, the dynamic adjustment path weight factor is calculated. The specific calculation formula is W = α1×d kj +α2×v k +α3×l k +α4×p + α5×t, where W represents the dynamic adjustment path weight factor, d kj represents the distance from path k to node j, v k represents the moving speed of the device on path k, l k represents the device load rate on path k, p represents the current task priority, t represents the estimated completion time of the current task, and α1, α2, α3, α4, α5 represent weight coefficients. The specific values are adjusted according to the production environment and scheduling strategy of the device. The dynamic adjustment path weight factor can be dynamically adjusted based on historical data and the actual status information of material handling.

[0019] Preferably, the task generation module creates a material handling task according to the type, quantity, starting point, and ending point of the material to be handled by the scheduling system and assigns a unique task ID. When the AMHS receives the material handling task generated by the scheduling system and confirms the task details, based on the confirmed handling path, the AMHS prepares to execute the task and sends a pathfinding instruction to the EM pathfinding system. The pathfinding instruction includes the task ID, the starting point and ending point of the material, the material type, the handling equipment type, and the special handling requirements of the task.

[0020] Preferably, the path planning module receives the path finding instruction sent by the scheduling system, identifies and confirms the key parameters of the task, including ID, starting point, ending point, material type, handling equipment type, and special handling requirements of the task. Combining with the factory layout drawing, it creates a digital model of the factory layout, including all handling paths, nodes, intersections, workstations, and storage areas. At the same time, it collects the real-time status information inside the factory, including traffic conditions, equipment availability, and safety areas. By applying the Dijkstra algorithm, combining the digital model, real-time status information, and dynamically adjusting the path weight factor, it analyzes the material handling path and calculates the optimal path. The specific calculation formula is R = Dijkstra(G, StartPoint, EndPoint, W), where R represents the optimal path, G represents a directed graph containing nodes and edges, StartPoint represents the starting point of the task, EndPoint represents the ending point of the task, and W represents the dynamically adjusted path weight factor, to determine the most effective material handling path.

[0021] Preferably, the task execution module returns the calculation result of the optimal path completed by the EM path finding system to the scheduling system. The scheduling system decomposes the optimal path into a series of specific task steps and assigns the task steps to the corresponding equipment. After the equipment receives the instruction from the scheduling system and confirms the task parameters, it starts to execute the material handling task. During the execution of the task, it feeds back the status information of the equipment to the scheduling system in real time. When the equipment completes the task, it sends a completion signal to the scheduling system.

[0022] The technical effects and advantages of the present invention:

[0023] The present invention draws a complete factory layout diagram through a layout diagram drawing module based on the layout status inside the factory and the distribution of equipment, marks all material nodes and the functions of each node on the layout diagram through a path and equipment configuration module, designs the moving paths of AGVs and OHCVs, and numbers each moving path for identifying and tracking the handling of materials. The information acquisition module obtains and updates the status information and task information of each device in real time in the scheduling system. Based on inputting the device status information and task information into the EM pathfinding system for analyzing the dynamic adjustment of path weights, a dynamic adjustment path weight factor is obtained. The task generation module automatically generates material handling tasks based on the scheduling system, and automatically generates and sends pathfinding instructions. When receiving the pathfinding instructions, the path planning module triggers the planning and analysis of the material handling path to obtain the optimal path for planning the material handling path. The task execution module returns to the scheduling system based on the planned optimal path, and calls the corresponding device to execute the task according to the path configuration, solving the problem of independent scheduling of each device and low path planning efficiency in the traditional pathfinding system. By integrating the path planning of multiple devices, it can calculate the optimal path in real time according to the requirements of material handling tasks, and flexibly call different types of handling devices according to task requirements, avoiding the limitation of path nodes depending on device types in the traditional system, facilitating the sharing of path information between different devices, improving the overall handling efficiency, integrating the information of all devices into the same map, and unifying the path planning and task scheduling mechanism to achieve efficient cooperation between devices, eliminate conflicts and resource waste, thereby improving the overall material handling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a block diagram of the system structure of the present invention.

[0025] Figure 2 It is a system flowchart of this embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] Next, the technical solutions in the present invention will be clearly and completely described in conjunction with the accompanying drawings in the present invention. In addition, the forms of each structure described in the following embodiments are merely examples, and an EM pathfinding system for the flow direction of semiconductor materials involved in the present invention is not limited to the structures described in the following embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0027] As Figure 1 shown, this embodiment provides an EM pathfinding system for the flow direction of semiconductor materials, including:

[0028] Layout drawing module: Draw a complete factory layout diagram based on the layout status inside the factory and the distribution of equipment.

[0029] In this embodiment, the layout drawing module is used to collect detailed information of all equipment, including name, size, weight, required power supply and cooling requirements, determine the path of material flow, including raw material input, product output and storage areas, and determine the specific location of each node. Based on the starting point, ending point and intermediate processing nodes of the material, use drawing software to draw the basic structure of the factory and the placement information of the equipment, and draw the interior of the factory into a complete factory layout diagram.

[0030] Path and equipment configuration module: Mark all material nodes and the functions of each node on the layout diagram, design the movement paths of AGVs and OHCVs, and number each movement path for identifying and tracking the handling of materials.

[0031] In this embodiment, the path and equipment configuration module marks the positions of material nodes on the layout diagram with different colors or symbols respectively, including raw material warehouse, production line, inspection area, finished product warehouse, loading area and storage area, and marks the functions of each node, including storage, processing and inspection. Then, by designing the movement paths of AGVs and OHCVs, an AGV refers to a path running on the ground and travels along a preset path through technologies such as magnetic strips, laser reflectors, two-dimensional codes or visual navigation. An OHCV refers to a path running on an elevated track and is mainly used for vertical cargo handling. Check that there are no intersections between the paths, represent the movement paths of AGVs and OHCVs with lines on the layout diagram, and number each movement path as AGV1, AGV2... AGVn and OHCV1, OHCV2... OHCVm. At the same time, configure the AGV and OHCV handling equipment and their action information. The specific operation steps are as follows:

[0032] Step S211: Used to configure the equipment. Select a suitable AGV model according to the load, size and battery life, mark the starting point, charging point and possible stopping points of the AGV on the layout diagram, and select the type and quantity of OHCVs according to the layout and height of the production line, and mark the tracks and stopping points of the OHCVs on the layout diagram;

[0033] Step S212: Used to configure the equipment action information. Configure the AGV action information by writing an action script for the AGV, including starting, moving, loading, unloading and charging. Configure the OHCV action information by writing an action script for the OHCV, including starting, moving, loading and unloading;

[0034] Finally, integrate the control systems of AGV and OHCV with the central control system of the factory to ensure that all devices can receive and execute the instructions of the central control system.

[0035] Specifically, the specific execution operation process of configuring device action information is as follows: When the AGV starts from the raw material warehouse and moves along AGV Route 1 to the production line, after arriving at the production line, the AGV waits for the material loading to be completed. After the loading is completed, the AGV moves along AGV Route 2 to the inspection area, and after unloading the materials in the inspection area, it returns to the raw material warehouse or the charging point; When the OHCV starts at Section A of the production line, it moves along OHCV Route 1 to Section B. After arriving at Section B, the OHCV performs the material handling operation. After the handling is completed, the OHCV returns to Section A or continues to execute the next task.

[0036] Information acquisition module: By obtaining and updating the status information and task information of each device in real time in the scheduling system, and analyzing the dynamic adjustment of path weights based on inputting the device status information and task information into the EM path finding system, a dynamic adjustment path weight factor is obtained.

[0037] In this embodiment, the information acquisition module uses sensors to collect and RFID scanning methods to obtain the status information of all devices in real time, including device location, moving speed, and device load rate, and obtains the priority, destination, and estimated completion time of the current tasks of all devices from the production management system in real time, so as to obtain the task information. Automatically update the obtained status information and task information of all devices to the scheduling system for storage, and then preprocess the status information and task information. The specific preprocessing operation process includes data cleaning, data conversion, and fusing the status information and task information of the devices into a unified data set to match the status information of each device with its corresponding task information. Then, the fused device status information and task information data set is transmitted to the EM path finding system to analyze the dynamic adjustment path weight factor;

[0038] Based on the analysis of the fused device status information and task information data set, and calculating the dynamic adjustment path weight factor, its specific calculation formula is W = α1×d kj +α2×v k +α3×l k +α4×p + α5×t, where W represents the dynamic adjustment path weight factor, d kj represents the distance from path k to node j, v k represents the moving speed of the device on path k, l k$k$ represents the device load rate on the path, $p$ represents the current task priority, $t$ represents the expected completion time of the current task, and $\alpha_1$, $\alpha_2$, $\alpha_3$, $\alpha_4$, $\alpha_5$ represent weight coefficients, and the specific values are adjusted according to the production environment and scheduling strategy of the device. The dynamic adjustment path weight factor can be dynamically adjusted based on historical data and actual status information of material handling.

[0039] Task generation module: Automatically generate material handling tasks through the scheduling system, and automatically generate and send path-finding instructions.

[0040] In this embodiment, the task generation module creates a material handling task according to the type, quantity, starting point, and ending point of the material to be handled by the scheduling system, and assigns a unique task ID. When the AMHS receives the material handling task generated by the scheduling system and confirms the task details, based on the confirmed handling path, the AMHS prepares to execute the task and sends a path-finding instruction to the EM path-finding system. The path-finding instruction includes the task ID, the starting and ending points of the material, the material type, the handling equipment type, and the special handling requirements of the task.

[0041] Path planning module: When receiving the path-finding instruction, trigger the planning and analysis of the material handling path to obtain the optimal path for planning the material handling path.

[0042] In this embodiment, the path planning module receives the path-finding instruction sent by the scheduling system, identifies and confirms the key parameters of the task, including ID, starting point, ending point, material type, handling equipment type, and special handling requirements of the task, and combines with the factory layout diagram to create a digital model of the factory layout, including all handling paths, nodes, intersections, workstations, and storage areas. At the same time, collect the real-time status information inside the factory, including traffic conditions, equipment availability, and safety areas. By applying the Dijkstra algorithm, combining the digital model, real-time status information, and dynamic adjustment path weight factor, analyze the material handling path and calculate the optimal path. The specific calculation formula is $R = Dijkstra(G, StartPoint, EndPoint, W)$, where $R$ represents the optimal path, $G$ represents a directed graph containing nodes and edges, $StartPoint$ represents the starting point of the task, $EndPoint$ represents the ending point of the task, and $W$ represents the dynamic adjustment path weight factor to determine the most effective material handling path.

[0043] Task execution module: Based on the planned optimal path, return to the scheduling system and call the corresponding equipment to execute the task according to the path configuration.

[0044] As Figure 2 shown, this embodiment provides a specific process of an EM path-finding system for semiconductor material flow to execute the AMHS, including:

[0045] Step 1: Draw a Layout diagram based on the layout status inside the factory and the distribution of equipment.

[0046] Step 2: Configure node path information for the drawn Layout diagram.

[0047] Step 3: Obtain and update the status information and task information of each device in real time through the scheduling system, and then push the device status information and task information to the EM pathfinding system in real time for analysis and calculation of dynamically adjusted path weights.

[0048] Step 4: Automatically generate material handling tasks through the scheduling system, and automatically generate and send pathfinding instructions.

[0049] Step 5: When receiving the pathfinding instruction, use the pathfinding algorithm to plan and analyze the material handling path to obtain the optimal path and find the optimal path for material handling.

[0050] Step 6: Based on the planned optimal path, return to the scheduling system, and call the corresponding device to execute the task according to the path configuration until the task is completed.

[0051] In this embodiment, the task execution module returns the calculation result of the optimal path completed by the EM pathfinding system to the scheduling system. The scheduling system decomposes the optimal path into a series of specific task steps and assigns the task steps to the corresponding devices. After the device receives the instruction from the scheduling system and confirms the task parameters, it starts to execute the material handling task. During the execution of the task, the status information of the device is fed back to the scheduling system in real time. When the device completes the task, it sends a completion signal to the scheduling system.

[0052] Finally: The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

[0053] The above is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed in this application can easily think of changes or replacements, which should all be covered by the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claimed rights.

Claims

1. An EM pathfinding system for the flow direction of semiconductor materials, characterized in that, Including: Layout drawing module: Draw a complete factory layout diagram based on the layout status inside the factory and the distribution of equipment. Path and equipment configuration module: Mark all material nodes and the functions of each node on the layout diagram, design the movement paths of AGVs and OHCVs, and then number each movement path for identifying and tracking the handling of materials. Information acquisition module: Real-time acquire and update the status information and task information of each device in the scheduling system, analyze the dynamic adjustment of path weights by inputting the device status information and task information into the EM pathfinding system, and obtain the dynamic adjustment path weight factor. Task generation module: Automatically generate material handling tasks through the scheduling system, and automatically generate and send pathfinding instructions. Path planning module: When receiving the pathfinding instruction, trigger the planning and analysis of the material handling path to obtain the optimal path for planning the material handling path. Task execution module: Based on the planned optimal path, return to the scheduling system and call the execution tasks of the corresponding devices according to the path configuration.

2. The EM pathfinding system for the semiconductor material flow according to claim 1, characterized in that The layout drawing module is used to collect the detailed information of all devices, including name, size, weight, required power supply and cooling requirements, determine the paths of material flow, including raw material input, product output and storage areas, and determine the specific positions of each node. Based on the starting point, ending point and intermediate processing nodes of the materials, use drawing software to draw the basic structure of the factory and the placement information of the equipment, and draw the inside of the factory into a complete factory layout diagram.

3. The EM pathfinding system for the semiconductor material flow according to claim 1, wherein, The path and equipment configuration module marks the positions of material nodes on the layout diagram with different colors or symbols respectively, including raw material warehouse, production line, inspection area, finished product warehouse, loading area and storage area, and marks the functions of each node, including storage, processing and inspection. Then, by designing the movement paths of AGVs and OHCVs, an AGV refers to a path running on the ground and travels along a preset path through technologies such as magnetic strips, laser reflectors, two-dimensional codes or visual navigation, and an OHCV refers to a path running on an elevated track and is mainly used for vertical cargo handling and traveling. Check that there are no intersections between the paths, represent the movement paths of AGVs and OHCVs with lines on the layout diagram, and number each movement path as AGV1, AGV2... AGVn and OHCV1, OHCV2... OHCVm. At the same time, configure the AGV and OHCV handling equipment and their action information. The specific operation steps are as follows: Step S211: Used to configure the equipment, select a suitable AGV model according to the load capacity, size and battery life, mark the starting point, charging point and possible docking points of the AGV on the layout diagram, and select the type and quantity of OHCVs according to the layout and height of the production line, and mark the tracks and docking points of the OHCVs on the layout diagram. Step S212: Configure the device action information. Configure the AGV action information by writing an action script for the AGV, including start, move, load, unload, and charge. Configure the OHCV action information by writing an action script for the OHCV, including start, move, load, and unload; Finally, integrate the control systems of the AGV and OHCV with the central control system of the factory to ensure that all devices can receive and execute the instructions of the central control system.

4. An EM pathfinding system for the flow direction of semiconductor materials according to claim 1, wherein The information acquisition module uses sensors and RFID scanning methods to collect the status information of all devices in real time, including device location, moving speed, and device load rate, and obtains the priority, destination, and estimated completion time of the current tasks of all devices from the production management system in real time, so as to obtain the task information. Automatically update the obtained status information and task information of all devices to the scheduling system for storage, and then preprocess the status information and task information. The specific preprocessing operation process includes data cleaning and data conversion, and fuse the status information and task information of the device into a unified data set to match the status information of each device with its corresponding task information. Then, send the fused device status information and task information data set to the EM pathfinding system to analyze the dynamic adjustment of the path weight factor; Based on the analysis of the fused device status information and task information data set, a dynamic adjustment path weight factor is calculated, and its specific calculation formula is W = α1×d kj +α2×v k +α3×l k +α4×p + α5×t, where W represents the dynamic adjustment path weight factor, d kj represents the distance from path k to node j, v k represents the device moving speed on path k, l k represents the device load rate on path k, p represents the current task priority, t represents the estimated completion time of the current task, α1, α2, α3, α4, α5 represent weight coefficients, and the specific values are adjusted according to the production environment and scheduling strategy where the device is located. The dynamic adjustment path weight factor can be dynamically adjusted based on historical data and the actual status information of material handling.

5. An EM pathfinding system for the flow direction of semiconductor materials according to claim 1, characterized in that The task generation module creates a material handling task according to the type, quantity, starting point, and ending point of the transported material by the scheduling system, and assigns a unique task ID. When the AMHS receives the material handling task generated by the scheduling system and confirms the task details, based on the confirmed handling path, the AMHS is ready to execute the task and sends a pathfinding instruction to the EM pathfinding system. The pathfinding instruction includes the task ID, the starting point and ending point of the material, the material type, the handling equipment type, and the special handling requirements of the task.

6. The EM pathfinding system for the semiconductor material flow according to claim 1, wherein, The path planning module receives the pathfinding instruction sent by the scheduling system, identifies and confirms the key parameters of the task, including ID, starting point, ending point, material type, handling equipment type, and special handling requirements of the task, and combines with the factory layout drawing to create a digital model of the factory layout, including all handling paths, nodes, intersections, workstations, and storage areas. At the same time, collect the real-time status information inside the factory, including traffic conditions, equipment availability, and safety areas. By applying the Dijkstra algorithm, combining the digital model, real-time status information, and dynamic adjustment of the path weight factor, analyze the material handling path and calculate the optimal path. The specific calculation formula is R = Dijkstra(G, StartPoint, EndPoint, W), where R represents the optimal path, G represents a directed graph containing nodes and edges, StartPoint represents the starting point of the task, EndPoint represents the ending point of the task, and W represents the dynamic adjustment of the path weight factor, to determine the most effective material handling path.

7. The EM pathfinding system for the semiconductor material flow according to claim 1, characterized in that, The task execution module returns the calculation result of the optimal path completed by the EM pathfinding system to the scheduling system. The scheduling system decomposes the optimal path into a series of specific task steps and assigns the task steps to the corresponding devices. After the devices receive the instructions from the scheduling system and confirm the task parameters, they start to execute the material handling task. During the execution of the task, the devices feedback the status information to the scheduling system in real time. When the devices complete the task, they send a completion signal to the scheduling system.

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