A new liquid cooling device

Abstract

The application belongs to the technical field of computer heat dissipation, in particular to a novel liquid cooling device; temperature acquisition components of multiple positions are included, temperature data of positions are acquired, which are used as information input and formula two is used to process data information of multiple points, and the results are calculated to obtain output power indexes of the liquid cooling device, and according to the indexes, it is determined which cooling instruction mode is used for cooling of the liquid cooling device, the liquid cooling device is more accurately controlled, and the cooling effect of the liquid cooling device is improved; meanwhile, CPU occupancy of the computer is acquired and substituted into the calculation of the output power indexes of the device, the heat and subsequent temperature of the computer can be predicted, the output power indexes of the liquid cooling device can be improved in advance, the temperature of the cooling liquid is reduced in advance, the CPU can be prevented from being too high, and the cooling effect of the liquid cooling device is improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of computer heat dissipation, and particularly relates to a novel liquid cooling device. BACKGROUND

[0002] The core components include a water pump: driving the cooling liquid to circulate in the system, usually integrated in the cold head of an all-in-one water cooling (AIO) or an independent water tank. The cold head: directly contacting the heat generating components such as CPU / GPU, absorbing heat through the copper / aluminum base and micro water channel design. The cooling radiator: composed of aluminum / copper heat dissipation fins and fans, transferring heat from the cooling liquid to the environment through air flow. Water pipe: high flexibility pipe connecting each component, with high temperature resistance and corrosion resistance (such as rubber or nylon braided pipe). Cooling liquid: commonly used deionized water (anti-conduction), ethylene glycol mixture or special fluorinated liquid, some high-end systems use nanofluid to enhance heat conduction. Water tank / reservoir (split type water cooling): used to store and adjust the cooling liquid capacity, convenient for maintenance.

[0003] Compared with the traditional air-cooled radiator, the liquid cooling device has much higher heat dissipation efficiency; the heat capacity of the water cooling liquid is more than 4 times that of air, and a single cold head can support a CPU power consumption of more than 300W. The cooling radiator dissipates heat through multiple fans, and the heat dissipation area is increased by 3-5 times compared with the air-cooled radiator of the same volume. The noise of the water pump and low-speed fan is lower than 30 decibels, while the noise of the fan in the air-cooled device under high load can reach 45 decibels. The cooling liquid has large thermal inertia, and the hardware temperature change range is reduced under short-time load fluctuation.

[0004] The existing liquid cooling device of the computer mainly works by transferring the cooling liquid with lower temperature to the heat conduction plate arranged at the CPU mounting position of the computer through the work of the liquid cooling pump, and then transferring the heat on the heat conduction plate to the outside of the computer case through the fan to achieve the effect of dissipating the heat in the computer case. SUMMARY

[0005] In order to make up for the shortcomings of the prior art, the application provides a novel liquid cooling device. The application is mainly used to solve the problem that the existing water cooling device often only relies on single temperature information for control when working, resulting in inaccurate cooling effect.

[0006] The technical scheme adopted by the present application to solve its technical problems is: a novel liquid cooling device, comprising a liquid cooling pump (integrated with a cold head), a heat dissipation grid, a liquid storage tank and a heat dissipation fan, the liquid cooling pump, the liquid storage tank and the channels in the heat dissipation grid are sequentially communicated through pipelines, and the heat dissipation fan is fixedly installed on one side of the heat dissipation grid; the heat dissipation grid comprises a cooling liquid flow channel, and heat dissipation fins are uniformly and spacedly arranged outside the channel; the channel and the pipeline are both filled with cooling liquid; further comprising a collecting groove, a collecting groove is formed on the side of the heat dissipation grid away from the inlet end, and an extension tube is fixedly installed in the collecting groove;

[0007] A mounting rack is symmetrically and fixedly connected to the heat dissipation grid at one end of the extension tube, a motor is fixedly connected to one end of the mounting rack, a screw rod is rotatably connected to the lower part of the mounting rack, and one end of the screw rod is fixedly connected with the output shaft of the motor; a guide rod is fixedly arranged on the mounting rack, a sliding frame is arranged on the screw rod, and the sliding frame is threadedly connected with the screw rod and slidably connected with the guide rod;

[0008] The sliding frame is fixedly connected with the end of the extension tube away from the heat dissipation grid;

[0009] A temperature collecting component, comprising temperature sensors arranged at the inlet end of the liquid cooling pump, the outlet end of the liquid cooling pump, the CPU and the outside of the case, respectively used for collecting the cooling liquid temperature at the inlet end and the outlet end of the liquid cooling pump, the real-time temperature at the CPU and the environmental temperature data outside the case;

[0010] An operation collecting component, used for collecting the real-time occupancy rate data of the computer CPU;

[0011] A data processing component, used for receiving the data obtained by the temperature collecting component and the operation collecting component, and processing the data;

[0012] A cooling regulation component, used for generating a cooling regulation instruction according to the processing result information of the data processing component, and transmitting the instruction to a cooling execution component; the cooling execution component comprises one or a combination of several of the heat dissipation fan, the liquid cooling pump and the motor.

[0013] Preferably, the cooling liquid comprises 100-120 parts by weight of mineral oil, 10-20 parts by weight of metal nanoparticles, 5-8 parts by weight of polyethylene glycol, 3-5 parts by weight of sodium molybdate, 0.1-0.5 parts by weight of silver nanoparticles, 0.3-0.5 parts by weight of organic bactericide and 3-5 parts by weight of deionized water.

[0014] Preferably, the liquid cooling device further comprises a cooling bin, the cooling bin is used for being installed on the outside of the video card of the computer to cool it; the inlet end of the cooling bin is communicated with the outlet end of the liquid cooling pump through a pipeline, the outlet end thereof is communicated with the inlet end of the channel in the heat dissipation grid, and a flow guide strip is arranged in the cooling bin along the vertical direction;

[0015] The cooling bin is composed of two symmetrical shell clamps, one of which is provided with a protrusion at the edge, and the other is provided with a clamping groove at the edge, and a sealing ring is arranged in the clamping groove.

[0016] Preferably, the sealing ring comprises a ring body and an expansion part arranged along the length direction of the ring body, the expansion part is made of water-absorbing expansion material, and the ring body is hollow and filled with a heat expansion medium.

[0017] Preferably, a guide rod is symmetrically arranged on one side of the cooling bin, a return spring is sleeved on the guide rod, a moving plate is slidably connected to the guide rod, and the moving plate is in contact with the return spring near one side of the cooling bin.

[0018] A first electromagnet is fixedly installed on the side of the cooling bin close to the moving plate, and an adsorption iron block is fixedly installed on the moving plate opposite to the first electromagnet.

[0019] A rotating rod is symmetrically and rotatably connected to the side of the cooling bin close to the moving plate, a sliding rod is arranged on the outer side of the rotating rod, a spiral sleeve is slidably connected to the sliding rod, a spiral groove is formed in the inner side of the spiral sleeve, a guide column is fixedly connected to the rotating rod and slidably connected to the spiral groove, a limiting spring is sleeved on the rotating rod between the spiral sleeve and the cooling bin, and an impeller is fixedly connected to the end of the rotating rod extending into the cooling bin.

[0020] Preferably, a flow meter is arranged at the outlet end of the heat dissipation rack, an electromagnetic valve for controlling the opening and closing of the inlet end of the cooling bin is arranged at the inlet end of the cooling bin, a second electromagnet is fixedly connected to the moving plate, and the magnetic surface of the second electromagnet faces the side of the cooling bin.

[0021] The liquid cooling device further comprises a data comparison component for comparing the data detected by the flow meter with a set threshold value.

[0022] A dredging instruction generating component is arranged for generating a dredging instruction according to the comparison result of the data comparison component and transmitting the instruction to a dredging execution component, and the dredging execution component comprises a motor, an electromagnetic valve, a second electromagnet or a combination of several of the liquid cooling pump.

[0023] Preferably, the outlet end of the liquid storage tank is arranged at the top of the liquid storage tank, a movable pipe is slidably connected to the outlet end of the liquid storage tank, one end of the movable pipe extends into the liquid storage tank, and the other end of the movable pipe is communicated with the inlet end of the liquid cooling pump through a pipeline.

[0024] An electric push rod is fixedly connected to the top of the liquid storage tank, and the end of the movable rod of the electric push rod is fixedly connected to the movable pipe through a support.

[0025] A clearing instruction component is arranged for generating a clearing instruction of the liquid cooling pump according to the shutdown instruction information read by the information reading component and transmitting the instruction to the liquid cooling pump and the electric push rod.

[0026] Preferably, the expansion ring is fixedly connected in the outlet of the liquid storage tank, the expansion ring is sleeved outside the movable pipe, the top plate is fixedly connected on the movable pipe inside and outside the liquid storage tank, the extrusion capsule is embedded in the top cover of the liquid storage tank, and the two ends of the extrusion capsule extend to the upper and lower surfaces of the top cover of the liquid storage tank respectively; the extrusion capsule is communicated with the expansion ring through the hose; and the extrusion capsule and the expansion ring are filled with liquid medium.

[0027] Preferably, the heat-conducting fins are uniformly and spacedly arranged at the ends of the telescopic pipe.

[0028] The present application has the following advantages:

[0029] 1. In the present application, temperature data of multiple positions are collected as information input, and formula two is used to process data information of multiple points, and the results are processed by formula one to obtain the output power index of the liquid cooling device, and according to the size of the index, it is determined which cooling instruction mode the liquid cooling device will adopt to cool down, and the liquid cooling device is more accurately controlled, thereby improving the cooling effect of the liquid cooling device; in the process of using the computer, the heat of the computer and the CPU usage rate have a positive correlation, but the temperature does not immediately rise as soon as the CPU occupancy rate increases, and there is a certain delay, that is, the CPU occupancy rate remains at a high level for a period of time, and then the heat increases to cause the temperature to rise, therefore, the present application collects the CPU occupancy rate of the computer and substitutes it into the calculation of the output power index of the device, so as to predict the heat of the computer and the subsequent temperature, thereby the output power index of the liquid cooling device can be improved in advance, so as to reduce the temperature of the cooling liquid in advance, so as to avoid the CPU from having too high temperature, thereby improving the cooling effect of the liquid cooling device.

[0030] 2. In the present application, a certain amount of metal particles are added to the cooling liquid to improve the heat conduction efficiency of the cooling liquid, and when the cooling liquid passes through the heat-conducting fins at the CPU, more heat can be absorbed in the same time, so that the heat at the CPU can be transferred to the heat dissipation grid faster, and then the heat is transferred away through the heat dissipation grid, thereby improving the overall heat dissipation effect of the liquid cooling device; since the density of the metal particles is large, when the substrate is selected, mineral oil with certain viscosity is selected, and when the metal particles are mixed into the mineral oil, the overall mixed system can maintain better stability, so as to improve the uniformity of the distribution of the metal particles in the cooling liquid, thereby improving the uniformity of heat transfer and ensuring the stability of the heat dissipation performance of the liquid cooling device; the polyethylene glycol plays the role of dispersant, which can effectively prevent the agglomeration of metal nanoparticles, so as to maintain the suspension stability of the metal nanoparticles in the mixed system; since copper has good heat conduction performance, copper is generally used for heat dissipation fins, in order to protect the heat dissipation grid from corrosion, sodium molybdate is added to improve its corrosion resistance.

[0031] 3. The application is characterized in that the expansion part is arranged on the sealing ring along the length direction, the expansion part is arranged near the inside of the cooling bin during installation, the cooling liquid contains moisture, the expansion part is made of water-absorbing expansion material, when the cooling liquid enters the inside of the cooling bin and contacts the expansion part, the expansion part absorbs water and expands, and the expansion part is in contact with the edge of the protruding block and the clamping groove, so that the sealing performance of the cooling bin is improved; meanwhile, the ring body of the sealing ring is hollow and contains thermal expansion medium, the temperature of the cooling liquid increases after being discharged from the liquid cooling pump during the cooling process, and the medium in the sealing ring is heated and expanded after contacting the sealing ring, so that the expansion ring is in contact with the side walls of the cooling bin on both sides, the sealing performance is further improved, the risk of leakage of the cooling liquid of the liquid cooling device is reduced, and the operation stability of the device is improved.

[0032] 4. The application is characterized in that the channel of the heat dissipation grid is arranged to be narrow to ensure that the temperature of the cooling liquid after heat dissipation is low, but when the cooling liquid with metal nanoparticles is used in the narrow channel, there is a risk of blockage, therefore, a flow meter is arranged at the outlet end of the heat dissipation grid to monitor the flow data of the outlet end, the data is transmitted to the data comparison component, the monitored data is compared with the set threshold value through the data comparison component, and then the comparison result is transmitted to the dredging instruction generation component; if the result of continuous monitoring is lower than the set threshold value to avoid misjudgment caused by the stretching and shrinking of the telescopic pipe, the dredging instruction is generated; if the telescopic pipe is in the contracted state, the motor is first controlled to operate, so that the telescopic pipe is in the stretched state, then the motor is stopped, the electromagnetic valve is controlled to be closed, the communication between the cooling bin and the liquid cooling pump is cut off, then the motor is controlled to rotate to drive the telescopic pipe to retract, so that the cooling liquid in the telescopic pipe is quickly squeezed into the channel, the blockage in the channel is dredged, and the effect of dredging the channel is achieved. BRIEF DESCRIPTION OF DRAWINGS

[0033] The application will be further described below with reference to the drawings.

[0034] Figure 1 is the first overall structure of the liquid cooling device in the application;

[0035] Figure 2 is the first installation structure of the liquid cooling device in the application;

[0036] Figure 3 is the second installation structure of the liquid cooling device in the application;

[0037] Figure 4 is the second overall structure of the liquid cooling device in the application;

[0038] Figure 5It is the third overall structure schematic diagram of the liquid cooling device in the application;

[0039] Figure 6 It is the overall structure schematic diagram of the heat dissipation grid in the application;

[0040] Figure 7 It is the internal structure schematic diagram of the heat dissipation grid in the application;

[0041] Figure 8 It is the installation schematic diagram of the telescopic pipe in the contracted state in the application;

[0042] Figure 9 It is the installation structure schematic diagram of the moving plate and the second electromagnet in the application;

[0043] Figure 10 It is the installation structure schematic diagram of the first electromagnet in the application;

[0044] Figure 11 It is the installation structure schematic diagram of the spiral sleeve and the rotating rod in the application;

[0045] Figure 12 It is the internal structure schematic diagram of the rotating rod and the spiral sleeve in the application;

[0046] Figure 13 It is the internal structure schematic diagram of the rotating rod and the spiral sleeve in the application; Figure 12 The local enlarged schematic diagram of A in the application;

[0047] Figure 14 It is the internal structure schematic diagram of the cooling bin in the application;

[0048] Figure 15 It is the overall structure schematic diagram of the liquid storage tank in the application;

[0049] Figure 16 It is the internal structure schematic diagram of the liquid storage tank in the application;

[0050] In the figure: liquid cooling pump 1, heat dissipation grid 2, heat dissipation fan 3, confluence groove 4, telescopic pipe 5, mounting frame 6, motor 7, lead screw 8, guide rod 9, sliding frame 10, cooling bin 11, flow guide strip 12, protruding block 13, clamping groove 14, sealing ring 15, expansion part 16, guide rod 17, return spring 18, moving plate 19, first electromagnet 20, adsorbing iron block 21, rotating rod 22, sliding rod 23, spiral sleeve 24, spiral groove 25, guide column 26, limiting spring 27, impeller 28, flow meter 29, electromagnetic valve 30, second electromagnet 31, movable pipe 32, electric push rod 33, expansion ring 34, top plate 35, extrusion capsule 36, heat conduction sheet 37, liquid storage tank 38. DETAILED DESCRIPTION

[0051] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0052] Embodiment 1;

[0053] like Figures 1 to 5 As shown, a novel liquid cooling device includes a liquid cooling pump 1, a heat dissipation grid 2, a liquid storage tank, and a cooling fan 3. The liquid cooling pump 1, the liquid storage tank, and the channels within the heat dissipation grid 2 are sequentially connected by pipes, and the cooling fan 3 is fixedly mounted on one side of the heat dissipation grid 2. The heat dissipation grid 2 includes a channel for the flow of coolant, and the outside of the channel is evenly spaced with heat dissipation fins. The channel and the pipe are filled with coolant. The device also includes a confluence groove 4. The confluence groove 4 is opened on the side of the heat dissipation grid 2 away from its inlet end, and a telescopic tube 5 is fixedly mounted in the confluence groove 4.

[0054] like Figures 6 to 8 As shown, a mounting bracket 6 is symmetrically fixedly connected to the heat dissipation grid 2 at one end of the telescopic tube 5, one end of the mounting bracket 6 is fixedly connected to a motor 7, a screw rod 8 is rotatably connected to the lower part of the mounting bracket 6, and one end of the screw rod 8 is fixedly connected to the output shaft of the motor 7; a guide rod 9 is fixedly provided on the mounting bracket 6, and a sliding bracket 10 is provided on the screw rod 8, which is threadedly connected to the screw rod 8 and slidably connected to the guide rod 9;

[0055] The sliding frame 10 is fixedly connected to the end of the telescopic tube 5 away from the heat dissipation grid 2;

[0056] The temperature collection component includes temperature sensors arranged at the inlet and outlet of the liquid cooling pump 1, the CPU, and the outside of the chassis, which are respectively used to collect the coolant temperature at the inlet and outlet of the liquid cooling pump 1, the real-time temperature at the CPU, and the ambient temperature data outside the chassis;

[0057] Run the collection component to collect real-time occupancy data of the computer CPU;

[0058] A data processing component is used to receive the data acquired by the temperature acquisition component and the operation acquisition component, and process the data;

[0059] The cooling control component is used to generate a cooling control instruction based on the processing result information of the data processing component and transmit the instruction to the cooling execution component; the cooling execution component includes one or a combination of the cooling fan 3, the liquid cooling pump 1 and the motor 7.

[0060] In this solution, when the computer is running, the general setting running collection component collects and calculates the real-time CPU occupancy data Meanwhile, the liquid temperature T1 of the inlet end of the liquid cooling pump 1, the outlet liquid temperature T2, the real-time temperature T3 at the CPU, and the environmental temperature T4 outside the case are collected by the temperature collection component; then the above data are transmitted to the data calculation component to obtain the output power index of the liquid cooling device through formula one;

[0061] Formula one: ;

[0062] Wherein, the output power index of the liquid cooling device; is the instantaneous deviation of the set temperature value and the actual value during the use of the device (i.e., ), wherein the set temperature is set by the user, and the actual temperature is obtained according to formula two, and t represents the unit time, which is in seconds; the accumulation of the error from the initial time to the current time; the error rate changes with time;

[0063] , , are all control coefficients, which are set by the user according to the actual use needs and , and are determined according to formula ; ;

[0064] Formula two: ;

[0065] Wherein, a, b, c, and m are proportionality coefficients of data collected by different temperature sensors, which satisfy a+b+c+m=1, and c is not less than 0.7; the proportionality coefficients are set by the user;

[0066] After the output power index is determined, it is transmitted to the cooling control component, and then the cooling control component generates the corresponding temperature control instruction according to formula three;

[0067] Formula three: Wherein, the groups , respectively represent the cooling instruction mode one, the cooling instruction mode two, and the cooling instruction mode three;

[0068] The cooling instruction mode one means that the cooling fan 3 operates at not less than 50% of the rated power, and the liquid cooling pump 1 operates at not less than 40% of the rated power;

[0069] The cooling instruction mode two means that the cooling fan 3 operates at not less than 60% of the rated power, and the liquid cooling pump 1 operates at not less than 50% of the rated power;

[0070] The cooling instruction mode three indicates that the heat dissipation fan 3 operates at not less than 80% of the rated power, the liquid cooling pump 1 operates at not less than 75% of the rated power, and the motor 7 drives the telescopic pipe 5 to extend, so as to increase the heat dissipation area and the cooling time of the liquid in the backflow process, and the temperature of the cooling liquid at the inlet of the liquid cooling pump 1.

[0071] When the cooling instruction mode three is adopted, the sliding frame 10 is driven to move by the rotation of the output shaft of the motor 7, and then drives one end of the telescopic pipe 5 connected thereto to move away from one end of the heat dissipation net rack 2. Since the current collecting groove 4 is communicated with the inside of the telescopic pipe 5, the inside space of the current collecting groove is increased with the extension of the telescopic pipe 5, so as to be able to collect more cooling liquid. Since the cooling liquid stays at the heat dissipation fan 3 for a longer time, the cooling area of the cooling liquid can be increased with the extension of the telescopic pipe 5. In this way, the temperature of the cooling liquid backflowing to the inlet of the liquid cooling pump 1 can be reduced, the temperature difference between the cooling liquid and the CPU can be increased, the heat transfer efficiency can be improved, the CPU can be kept at a lower temperature, and the cooling effect of the liquid cooling device can be improved.

[0072] In the scheme, the temperature data of multiple positions are collected as input information, and the data information of multiple points is processed by formula two, and the result is processed by formula one to obtain the output power index of the liquid cooling device. According to the size of the index, it is determined which cooling instruction mode the liquid cooling device will adopt for cooling. The liquid cooling device is more accurately controlled, and the cooling effect of the liquid cooling device is improved. Since the heat of the computer and the CPU usage rate have a positive correlation during the use of the computer, but the temperature does not immediately rise when the CPU occupancy rate just increases. There is a certain delay, that is, the heat increases to cause the temperature to rise after the CPU occupancy rate remains at a high level for a period of time. Therefore, the CPU occupancy rate of the computer is collected and substituted into the calculation of the output power index of the device, so as to predict the heat and subsequent temperature of the computer, and then the output power index of the liquid cooling device can be improved in advance, so as to reduce the temperature of the cooling liquid in advance, avoid the CPU from appearing too high temperature, and improve the cooling effect of the liquid cooling device.

[0073] The cooling liquid includes 100-120 parts by weight of mineral oil, 10-20 parts by weight of metal nanoparticles, 5-8 parts by weight of polyethylene glycol, 3-5 parts by weight of sodium molybdate, 0.1-0.5 parts by weight of silver nanoparticles, 0.3-0.5 parts by weight of organic bactericide, and 3-5 parts by weight of deionized water.

[0074] Since the heat conduction efficiency of metal is obviously higher than that of water, by adding a certain amount of metal particles into the cooling liquid, the heat conduction efficiency of the cooling liquid is improved, and more heat can be absorbed in the same time when the cooling liquid passes through the heat conduction sheet 37 at the CPU, so that the heat at the CPU can be transmitted to the heat dissipation grid 2 faster, and then transmitted away by the heat dissipation grid 2, thereby improving the overall heat dissipation effect of the liquid cooling device; since the density of the metal particles is large, when selecting the base, mineral oil with certain viscosity is selected, and when the metal particles are mixed into the mineral oil, the overall mixed system can maintain better stability, so that the distribution of the metal particles in the cooling liquid is more uniform, thereby improving the uniformity of heat transfer and ensuring the stability of the heat dissipation performance of the liquid cooling device.

[0075] The metal nanoparticles involved need to have high thermal conductivity and certain magnetic properties when selected, and can include iron, nickel, cobalt, iron-nickel alloy or iron-silicon alloy, etc.

[0076] The polyethylene glycol acts as a dispersing agent and can effectively prevent the agglomeration of metal nanoparticles to maintain the suspension stability of the metal nanoparticles in the mixed system; since copper has good heat conduction performance, copper is generally used for heat dissipation sheets, and in order to protect the heat dissipation grid 2 from corrosion, sodium molybdate is added to improve its corrosion resistance (the main action mechanism is that molybdate ions are adsorbed on the surface of metals such as aluminum, steel and copper, and react with metal ions such as iron ions and copper ions to form a dense molybdate-metal oxide composite film and block the oxidation reaction: This film covers the anode area of the metal (the easy-to-corrode area), preventing metal atoms from losing electrons, thereby inhibiting corrosion).

[0077] Silver ions and organic bactericides can effectively inhibit the growth of microorganisms in the cooling liquid, avoid the formation of microbial membranes during microbial reproduction to cause system blockage, and improve the operation stability of the liquid cooling device.

[0078] As shown in Figures 6 to 8 The ends of the telescopic pipe 5 are uniformly and spacedly provided with heat conduction sheets 37. By providing heat dissipation sheets at the ends of the telescopic pipe 5, the heat dissipation effect of the cooling liquid in the telescopic pipe 5 is increased, and the cooling effect of the liquid cooling device is further improved.

[0079] Example two;

[0080] On the basis of example one, another technical solution is proposed, as shown in Figures 9 to 11 The liquid cooling device further comprises a cooling bin 11 for installing outside the graphics card of the computer to cool it; the inlet end of the cooling bin 11 is in communication with the outlet end of the liquid cooling pump 1 through a pipeline, and the outlet end is in communication with the inlet end of the channel in the heat dissipation grid.

[0081] As shown in Figure 14 The inner edge of the cooling bin 11 is provided with a flow guide strip 12 in the vertical direction; by providing the flow guide strip 12 inside the cooling bin, it is avoided that the cooling liquid passing through the liquid cooling pump 1 directly flows from the inlet end to the outlet end, so that the cooling liquid inside the cooling bin 11 cannot be well circulated, causing the cooling liquid heat to accumulate at this place, thereby improving the cooling effect of the cooling bin 11.

[0082] The cooling bin 11 is composed of two symmetrical shell clamps, one of which is provided with a protrusion 13 at the edge of the shell, and the other is provided with a clamping groove 14 at the edge of the shell, and the clamping groove 14 is provided with a sealing ring 15.

[0083] The conventional liquid cooling device can only cool the CPU, but the heat generated during the movement of the computer is not only the CPU, and the graphics card will also generate a lot of heat when the computer runs more complex software programs, so the cooling bin 11 is provided in this scheme, which is arranged at the graphics card to achieve the cooling of the graphics card and improve the cooling effect of the liquid cooling device.

[0084] As shown in Figure 12 and Figure 13 The sealing ring 15 includes a ring body and an expansion part 16 arranged along the length direction of the ring body, the expansion part 16 is made of water-absorbing expansion material, and the ring body is hollowly arranged, and the inside of the ring body is filled with thermal expansion medium (which can be nitrogen or carbon dioxide gas).

[0085] Since the cooling bin 11 adopts a split design and the inside will be provided with high-speed flowing cooling liquid, there is a risk of leakage, therefore, in this scheme, the expansion part 16 is arranged on the sealing ring 15 along the length direction, and the expansion part 16 is arranged close to the inside of the cooling bin 11 during installation. Since the cooling liquid contains water, and the expansion part 16 is made of water-absorbing expansion material, when the cooling liquid enters the inside of the cooling bin 11 and contacts the expansion part 16, the expansion part 16 will absorb water and expand, and will abut against the edges of the protrusion 13 and the clamping groove 14, thereby improving the sealing performance of the cooling bin 11.

[0086] At the same time, since the ring body of the sealing ring 15 is hollowly arranged and the inside is provided with thermal expansion medium, and the temperature of the cooling liquid discharged from the liquid cooling pump 1 will rise during the cooling work, and then the medium inside the sealing ring 15 will be heated and expanded after contacting the sealing ring 15, so as to abut the expansion ring against the side walls of the two cooling bins 11, further improving the sealing performance, thereby reducing the leakage risk of the cooling liquid of the liquid cooling device and improving the operation stability of the device.

[0087] Secondly, since the sealing ring 15 is annular structure and hollow, when the local force is uneven, the medium inside the sealing ring 15 will move, and then improve the expansion of other areas, and then ensure that all contact positions of the two parts of the cooling bin 11 can achieve better sealing.

[0088] As shown in Figures 1 to 3 , the cooling bin 11 is symmetrically provided with a guide rod 17 on one side, the guide rod 17 is sleeved with a reset spring 18, the guide rod 17 is slidably connected with a moving plate 19, and the moving plate 19 is in contact with the reset spring 18 near one side of the cooling bin 11;

[0089] The cooling bin 11 is fixedly installed with a first electromagnet 20 near the moving plate 19, and the moving plate 19 is fixedly installed with an adsorption iron block 21 opposite to the first electromagnet 20;

[0090] The cooling bin 11 is symmetrically rotatably connected with a rotating rod 22 near the moving plate 19, the rotating rod 22 is provided with a sliding rod 23 outside, the sliding rod 23 is slidably connected with a spiral sleeve 24, the spiral sleeve 24 is provided with a spiral groove 25 inside, the rotating rod 22 is fixedly connected with a guide column 26, and the guide column 26 is slidably connected in the spiral groove 25; The rotating rod 22 is sleeved with a limiting spring 27 between the spiral sleeve 24 and the cooling bin 11; One end of the rotating rod 22 extends into the cooling bin 11 and is fixedly connected with an impeller 28.

[0091] When working, since the cooling liquid contains metal nanoparticles, the metal particles will settle under the condition that the computer is not used for a long time, which will cause uneven heat transfer and easily cause system blockage. Therefore, in the present scheme, a first electromagnet 20 is arranged on one side of the cooling bin 11, and when the liquid cooling device is started, the first electromagnet 20 is controlled to adsorb the adsorption iron block 21 on the moving plate 19, so that the moving plate 19 moves towards the cooling bin 11. Further, the moving plate 19 pushes the spiral sleeve 24 sleeved on the rotating rod 22 to move towards the cooling bin 11. Since the spiral groove 25 is arranged on the spiral sleeve 24, and the guide column 26 on the rotating rod 22 is slidably connected with the spiral groove 25, and the sliding rod 23 is arranged on both sides of the spiral sleeve 24; Therefore, when the spiral sleeve 24 moves towards the cooling bin 11, the rotating rod 22 will be driven to rotate by the spiral groove 25 and the guide column 26, and then drive the impeller 28 in the cooling bin 11 to rotate, so as to mix the cooling liquid entering the cooling bin 11, improve the uniformity of the distribution of metal nanoparticles in the cooling liquid, and ensure the uniformity of the heat transfer of the cooling liquid, and realize the uniformity of the heat dissipation effect of the liquid cooling device.

[0092] The limiting spring 27 is compressed during the movement of the spiral sleeve 24 towards the cooling bin 11, and after the electromagnetic iron removes the magnetic attraction, the spiral sleeve 24 moves outward under the action of the limiting spring 27, which reversely drives the rotating rod 22 to rotate again to realize the reverse stirring of the cooling liquid and improve the mixing efficiency.

[0093] By controlling the adsorption and removal of the magnetic force of the No. 1 electromagnetic iron 20 multiple times, the mixing of the cooling liquid is achieved, and at the same time, the cooling liquid in the liquid cooling device circulates to achieve the state that the cooling liquid in the liquid cooling device is uniformly mixed, thereby ensuring the uniform heat conduction and smooth flow of the cooling liquid.

[0094] Example three;

[0095] On the basis of example two, another technical solution is proposed, which includes, as shown in the figure, Figures 3 to 5 The outlet end of the heat dissipation grid 2 is provided with a flow meter 29, the inlet end of the cooling bin 11 is provided with an electromagnetic valve 30 for controlling the opening and closing of the inlet end, the moving plate 19 is fixedly connected with a No. 2 electromagnetic iron 31, and the magnetic surface of the No. 2 electromagnetic iron 31 faces the side of the cooling bin 11.

[0096] The liquid cooling device further comprises a data comparison component for comparing the data detected by the flow meter 29 with a set threshold value.

[0097] A dredging instruction generating component is used to generate a dredging instruction according to the comparison result of the data comparison component, and the dredging instruction is transmitted to a dredging execution component, which comprises a motor 7, an electromagnetic valve 30, a No. 2 electromagnetic iron 31 or a combination of several of the liquid cooling pump 1.

[0098] Due to the need for heat dissipation, the channel on the heat dissipation grid 2 is relatively narrow to ensure that the temperature of the cooling liquid after heat dissipation is relatively low. However, when the channel with a relatively narrow width is matched with the cooling liquid containing metal nanoparticles, there is a risk of blockage. Therefore, in this solution, the flow meter 29 is arranged at the outlet end of the heat dissipation grid 2 to monitor the flow data at the outlet end, and the data is transmitted to the data comparison component. The data comparison component compares the monitored data with the set threshold value, and then transmits the comparison result to the dredging instruction generating component. If the result of continuous monitoring is lower than the set threshold value to avoid misjudgment caused by the stretching and contraction of the telescopic pipe 5, a dredging instruction is generated. If the telescopic pipe 5 is in a contracted state, the motor 7 is first controlled to operate so that the telescopic pipe 5 is in an extended state. Then the motor 7 is paused, and the electromagnetic valve 30 is controlled to be closed to cut off the connection between the cooling bin 11 and the liquid cooling pump 1. Then, the motor 7 is controlled to rotate to drive the telescopic pipe 5 to retract, thereby realizing the rapid extrusion of the cooling liquid in the telescopic pipe 5 into the channel to dredge the blockage in the channel and achieve the effect of dredging the channel.

[0099] If the telescopic pipe 5 is in the extended state, the control motor 7 is rotated to directly retract the telescopic pipe 5 to impact the passage on the heat dissipation grid 2;

[0100] Meanwhile, after the blockage occurs, the second electromagnet 31 can also work to adsorb the metal particles flowing into the cooling pump, so as to reduce the content of metal nanoparticles in the cooling liquid flowing into the telescopic pipe 5, thereby avoiding aggravation of the blockage. After dredging, the metal nanoparticles adsorbed by the second electromagnet 31 are released, and the stirring is performed again through the rotating rod 22 and the impeller 28 to achieve uniformity of the system.

[0101] As shown in Figure 3 , Figure 5 and Figure 16 , the outlet end of the liquid storage tank is arranged at the top thereof, and the movable pipe 32 is slidably connected to the outlet end of the liquid storage tank. One end of the movable pipe 32 extends into the liquid storage tank, and the other end is communicated with the inlet end of the liquid cooling pump 1 through a pipeline.

[0102] The top of the liquid storage tank is fixedly connected with the electric push rod 33, and the end of the movable rod of the electric push rod 33 is fixedly connected with the movable pipe 32 through a support.

[0103] The liquid cooling device further comprises an information reading assembly for reading the shutdown instruction of the computer.

[0104] The emptying instruction assembly is configured to generate an emptying instruction of the liquid cooling pump 1 according to the shutdown instruction information read by the information reading assembly, and transmit the instruction to the liquid cooling pump 1 and the electric push rod 33.

[0105] In order to avoid the deposition of metal nanoparticles in the cooling liquid in the liquid cooling pump 1 on the rotating blades of the liquid cooling pump 1 during long-term shutdown, causing the blades to be stuck, the information reading assembly is arranged. After reading the shutdown instruction of the computer, the emptying instruction assembly generates an emptying instruction. First, the electric push rod 33 is controlled to move upward, so that the bottom end of the movable pipe 32 rises above the liquid level of the cooling liquid in the liquid storage tank. At this time, no cooling liquid enters the liquid cooling pump 1. After ensuring that the liquid cooling pump 1 continuously operates for a set time (3-5 seconds after the movable rod of the electric push rod 33 is raised), the residual cooling liquid in the liquid cooling pump is emptied, thereby avoiding the deposition and sticking caused by long-term shutdown, and improving the operation stability of the liquid cooling device.

[0106] As shown in Figure 15 and Figure 16As shown, the expansion ring 34 is fixedly connected in the outlet of the liquid storage tank, the expansion ring 34 is sleeved outside the movable pipe 32, the top plate 35 is fixedly connected on the movable pipe 32 inside and outside the liquid storage tank, the extrusion capsule 36 is embedded in the top cover of the liquid storage tank, and the two ends of the extrusion capsule 36 extend to the upper and lower surfaces of the top cover of the liquid storage tank respectively; the extrusion capsule 36 is communicated with the expansion ring through a hose; the extrusion capsule 36 and the expansion ring are filled with liquid medium.

[0107] In order to ensure the sealing between the liquid storage tank and the movable pipe 32, the top plate 35 is arranged on the movable pipe 32 in the scheme, when the lower end of the movable pipe 32 is immersed in the cooling liquid, the top plate 35 on the movable pipe 32 outside the liquid storage tank extrudes the upper part of the extrusion capsule 36, so that the liquid in it enters the expansion ring 34, and then the expansion ring 34 tightly abuts against the movable pipe 32, so that the sealing effect is achieved; when the movable rod moves, the top plate 35 outside the liquid storage tank is removed, the extrusion in the extrusion capsule 36 is removed, so that the expansion ring 34 is retracted to reduce the friction between the movable pipe 32, and then the movement of the movable pipe 32 is facilitated;

[0108] With the continuous upward movement of the movable pipe 32, the top plate 35 inside the liquid storage tank abuts against the lower part of the extrusion capsule 36, so that the liquid medium in it enters the expansion ring 34, and the sealing connection between the expansion ring 34 and the movable pipe 32 is realized again. The above arrangement realizes the sealing connection of the movable pipe 32 in the two working positions, and relaxes during movement, so as to facilitate the completion of movement.

[0109] In order to enable the medium in the extrusion capsule on the pressing side to enter the expansion ring 34 efficiently, the material of the extrusion capsule 36 adopts a structure of metal woven mesh as a skeleton and rubber as a surface layer, so that the extrusion capsule 36 can be compressed and the expansion is limited, so that the expansion ring 34 can realize the function of tightly holding the movable pipe 32 after extrusion.

[0110] In order to prevent the cooling liquid from leaking during transportation, buckles are arranged on the top cover, during transportation, the top plate 35 outside the liquid storage tank is fixed on the upper part of the extrusion capsule 36 through the buckles, so as to ensure the sealing property.

[0111] The embodiments of the application are described above in combination with the drawings, but the application is not limited to the above specific embodiments, the above specific embodiments are only illustrative but not restrictive, and those skilled in the art can make many forms under the inspiration of the application without departing from the purpose of the application and the scope protected by the claims, which all belong to the protection of the application.

Claims

1. A novel liquid cooling device, comprising a liquid cooling pump (1), a heat dissipation grid (2), a liquid storage tank (38) and a heat dissipation fan (3), wherein the channels inside the liquid cooling pump (1), the liquid storage tank (38) and the heat dissipation grid (2) are sequentially connected through pipes and are filled with coolant; characterized in that: It also includes a confluence groove (4), wherein the heat dissipation grid (2) is provided with a confluence groove (4) on a side away from the inlet end thereof, and a telescopic tube (5) is fixedly installed in the confluence groove (4); A mounting frame (6) is symmetrically fixedly connected to the heat dissipation grid (2) at one end of the telescopic tube (5), one end of the mounting frame (6) is fixedly connected to a motor (7), a screw rod (8) is rotatably connected to the lower part of the mounting frame (6), one end of the screw rod (8) is fixedly connected to the output shaft of the motor (7); a guide rod (9) is fixedly provided on the mounting frame (6), a sliding frame (10) is provided on the screw rod (8), the sliding frame (10) is threadedly connected to the screw rod (8) and is slidably connected to the guide rod (9); The sliding frame (10) is fixedly connected to an end of the telescopic tube (5) away from the heat dissipation grid (2); The temperature collection component comprises temperature sensors arranged at the inlet end of the liquid cooling pump (1), the outlet end of the liquid cooling pump (1), the CPU and the outside of the chassis; Run the collection component to collect real-time occupancy data of the computer CPU; A data processing component is used to receive the data acquired by the temperature acquisition component and the operation acquisition component, and process the data; A cooling control component is used to generate a cooling control instruction based on the processing result information of the data processing component, and transmit the instruction to the cooling execution component; the cooling execution component includes one or a combination of the cooling fan (3), the liquid cooling pump (1) and the motor (7).

2. A novel liquid cooling device according to claim 1, characterized in that: The coolant comprises, by weight, 100-120 parts of mineral oil, 10-20 parts of metal nanoparticles, 5-8 parts of polyethylene glycol, 3-5 parts of sodium molybdate, 0.1-0.5 parts of silver nanoparticles, 0.3-0.5 parts of organic fungicide and 3-5 parts of deionized water.

3. A novel liquid cooling device according to claim 2, characterized in that: The liquid cooling device further comprises a cooling chamber (11), which is used to be installed outside the graphics card of the computer to cool it; the inlet end of the cooling chamber (11) is connected to the outlet end of the liquid cooling pump (1) through a pipeline, and the outlet end thereof is connected to the inlet end of the channel in the heat dissipation grid (2); a guide bar (12) is provided in the vertical direction along the inner side of the cooling chamber (11); The cooling chamber (11) is composed of two symmetrical shells that are clamped together, wherein a protrusion (13) is provided at the edge of one shell, and a clamping groove (14) is provided at the edge of the other shell, and a sealing ring (15) is provided in the clamping groove (14).

4. A novel liquid cooling device according to claim 3, characterized in that: The sealing ring (15) comprises a ring body and an expansion portion (16) arranged along the length direction of the ring body, wherein the expansion portion (16) is made of a water-absorbing and expanding material, the ring body is hollow, and the interior of the ring body is filled with a thermal expansion medium.

5. A novel liquid cooling device according to claim 4, characterized in that: A guide rod (17) is symmetrically provided on one side of the cooling bin (11), a return spring (18) is sleeved on the guide rod (17), a movable plate (19) is slidably connected to the guide rod (17), and a side of the movable plate (19) close to the cooling bin (11) contacts the return spring (18); A first electromagnet (20) is fixedly mounted on one side of the cooling chamber (11) close to the movable plate (19), and an adsorption iron block (21) is fixedly mounted on the movable plate (19) facing the first electromagnet (20); The cooling bin (11) is symmetrically rotatably connected to a rotating rod (22) on one side close to the movable plate (19); a sliding rod (23) is provided on the outside of the rotating rod (22); a spiral sleeve (24) is slidably connected to the sliding rod (23); a spiral groove (25) is provided inside the spiral sleeve (24); a guide column (26) is fixedly connected to the rotating rod (22); the guide column (26) is slidably connected in the spiral groove (25); a limit spring (27) is sleeved on the rotating rod (22) between the spiral sleeve (24) and the cooling bin (11); one end of the rotating rod (22) extends into the interior of the cooling bin (11) and is fixedly connected to an impeller (28).

6. A novel liquid cooling device according to claim 5, characterized in that: The outlet of the heat dissipation grid (2) is provided with a flow meter (29); the inlet of the cooling chamber (11) is provided with an electromagnetic valve (30) for controlling the on / off of the inlet; a second electromagnet (31) is fixedly connected to the movable plate (19), and the magnetic surface of the second electromagnet (31) faces one side of the cooling chamber (11); The liquid cooling device further comprises a data comparison component for comparing the data detected by the flow meter (29) with a set threshold value; The dredging instruction generating component is used to generate a dredging instruction based on the comparison result of the data comparison component and transmit it to the dredging execution component, wherein the dredging execution component includes several combinations of a motor (7), a solenoid valve (30), a second electromagnet (31) or a liquid cooling pump (1).

7. A novel liquid cooling device according to claim 6, characterized in that: The outlet end of the liquid storage tank (38) is arranged at the top thereof, and a movable tube (32) is slidably connected to the outlet end of the liquid storage tank (38), one end of the movable tube (32) extends into the interior of the liquid storage tank (38), and the other end is connected to the inlet end of the liquid cooling pump (1) through a pipeline; The top of the liquid storage tank (38) is fixedly connected to an electric push rod (33), and the end of the movable rod of the electric push rod (33) is fixedly connected to the movable tube (32) via a bracket; The liquid cooling device also includes an information reading component for reading a shutdown instruction of the computer; The clearing instruction component is used to generate a clearing instruction for the liquid cooling pump (1) based on the shutdown instruction information read by the information reading component, and transmit the instruction to the liquid cooling pump (1) and the electric push rod (33).

8. The novel liquid cooling device according to claim 7, characterized in that: An expansion ring (34) is fixedly connected to the outlet of the liquid storage tank (38), and the expansion ring (34) is sleeved on the outside of the movable tube (32). A top plate (35) is fixedly connected to the inside and outside of the liquid storage tank (38) on the movable tube (32). An extrusion bag (36) is embedded in the top cover of the liquid storage tank (38), and the two ends of the extrusion bag (36) extend to the upper and lower surfaces of the top cover of the liquid storage tank (38) respectively; the extrusion bag (36) is connected to the expansion ring (34) through a hose; and the extrusion bag (36) and the expansion ring (34) are filled with liquid medium.

9. The novel liquid cooling device according to claim 8, characterized in that: Heat conducting plates (37) are evenly spaced apart at the ends of the telescopic tube (5).

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