Testing system and method for detecting etching effect of thick copper PCB

Abstract

The invention discloses a test system and method for detecting the etching effect of a thick copper PCB, and the system comprises an etching condition analysis unit, an etching defect analysis unit, an etching normal analysis unit, an etching adjustment analysis unit, and a test information output unit, and relates to the technical field of PCB testing. The technical problems that systematicness and scientificity are lacked during etching data analysis and process adjustment, and high-precision PCB production requirements are difficult to meet are solved, the defects such as copper nodules, etching pits and residual copper are effectively recognized through careful analysis on the appearance, the comprehensiveness and accuracy of etching effect evaluation are improved, and the production efficiency is improved. Meanwhile, screening and analysis are carried out according to parameters such as the size and the number of layers of the PCBs in allusion to the condition that etching abnormity exists, and appropriate etching factor records are selected as reference standards to generate adjustment test information, so that the etching process can be optimized more scientifically and accurately, the rejection rate caused by the etching abnormity is reduced, and the production efficiency and the product quality stability are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board testing, and specifically to a testing system and method for detecting the etching effect of thick copper PCB boards. Background Art

[0002] In the field of printed circuit board (PCB) manufacturing, especially in the production process of thick copper PCB boards, etching is a key link. The etching effect directly affects the electrical performance, line accuracy, and overall quality of the PCB board. With the continuous miniaturization and high-performance development of electronic products, the requirements for the etching quality of PCB boards are becoming increasingly stringent.

[0003] The patent application with the publication number CN116600483A discloses a super-thick copper stepped chip test board PCB board, which includes a copper substrate, a heat-conducting PP sheet, and a 100Z circuit layer stacked in sequence from bottom to top. The circuit layer is provided with a plurality of stepped grooves for chip testing, and the stepped grooves are connected to the circuits of the gold fingers for inserting card slots on the PCB board.

[0004] However, traditional etching effect detection and process control methods often rely on manual experience and simple measurement tools, and there are problems such as low detection efficiency and insufficient accuracy. For example, it is difficult for manual detection to quickly and accurately identify minute etching defects on the surface of the PCB board, such as copper nodules, etching pits, and residual copper, etc., and there is a lack of systematicness and scientificity in analyzing etching data and adjusting the process, making it difficult to meet the requirements of large-scale and high-precision PCB board production. In addition, for abnormal situations occurring during the etching process, it is difficult to quickly locate the root cause of the problem and take effective adjustment measures, resulting in a decrease in production efficiency and an increase in product rejection rate. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a testing system and method for detecting the etching effect of thick copper PCB boards, which solves the problems of lack of systematicness and scientificity in analyzing etching data and adjusting the process, and difficulty in meeting the requirements of high-precision PCB board production.

[0006] To achieve the above objectives, the present invention is realized through the following technical solutions: A testing system for detecting the etching effect of thick copper PCB boards, comprising: A PCB board information acquisition unit, configured to transmit the collected etching information to the etching situation analysis unit; An etching situation analysis unit, configured to analyze the obtained etching information, judge whether there is an abnormal etching situation by analyzing the appearance of the PCB board, and simultaneously generate an etching defect result and an etching normal result, and transmit the etching defect result to the etching defect analysis unit and the etching normal result to the etching normal analysis unit; The etching defect analysis unit is used to analyze the obtained etching defect results. By analyzing the etching data corresponding to different etching positions on the PCB board, it judges the etching data to generate normal etching data results and abnormal etching data results. At the same time, it analyzes the abnormal etching data results to generate data abnormal results and mark the abnormal positions, and transmits the data abnormal results to the etching adjustment analysis unit; The etching adjustment analysis unit is used to analyze the obtained data abnormal results. At the same time, it adjusts the etching data in combination with the obtained historical data, analyzes according to the parameters of the PCB board to generate adjustment test information, and transmits the adjustment test information to the test information output unit; The normal etching analysis unit is used to analyze the obtained normal etching results. By calculating the etching factors corresponding to different etching positions, it conducts adjustment analysis on the etching positions that do not meet the etching requirements. At the same time, it generates adjustment test information and transmits the adjustment test information to the test information output unit.

[0007] As a further solution of the present invention, the specific method for the etching situation analysis unit to analyze the etching information is as follows: Obtain the appearance image of the PCB board, and at the same time identify the appearance of the PCB board based on the appearance image. If there are defects in the appearance image, generate an etching defect result. On the contrary, if there are no defects in the appearance image, generate a normal etching result, and transmit the etching defect result to the etching defect analysis unit and the normal etching result to the normal etching analysis unit.

[0008] As a further solution of the present invention, the specific method for the etching defect analysis unit to analyze the etching defect results is as follows: Obtain the etching defect results, and at the same time obtain the corresponding etching positions on the PCB board, and label them as i, and i = 1, 2,..., j, where j represents the number label of the etching positions. Then obtain the etching depth Di and etching width Ki corresponding to the etching position i, and calculate the corresponding etching factor Qi. The specific calculation formula is At the same time, compare the calculated etching factor Qi with the normal threshold Qy, and the specific value of the normal threshold Qy is set by the operator; If the etching factor Qi is greater than the normal threshold Qy, it means that the etching effect corresponding to the current etching position i meets the corresponding etching requirements, and a normal etching data result is generated. On the contrary, if the etching factor Qi is less than the normal threshold Qy, it means that the etching effect corresponding to the current etching position i does not meet the corresponding etching requirements, and an abnormal etching data result is generated; Process all etching positions in this way, and mark the etching positions corresponding to the abnormal etching data results as abnormal etching positions. At the same time, label them as a, and a = 1, 2, …, b, where b represents the number label of the abnormal etching positions. Then, analyze the abnormal etching positions to generate marked abnormal positions and data abnormal results.

[0009] As a further solution of the present invention, the specific way for the etching defect analysis unit to analyze the abnormal etching positions is as follows: Obtain all abnormal etching positions a. At the same time, obtain the etching data corresponding to the abnormal etching position a as the etching data to be analyzed. Taking the etching data to be analyzed as the standard, obtain the etching data that is the same as the etching data to be analyzed as the preselected etching data. Then, analyze the etching positions corresponding to the preselected etching data. If the etching positions corresponding to the preselected etching data are all normal etching positions, generate a data normal result. Then, mark the abnormal etching position a as the marked abnormal position and transmit the marked abnormal position to the test information output unit. If there are abnormal etching positions among the etching positions corresponding to the preselected etching data, generate a data abnormal result and transmit the data abnormal result to the etching adjustment analysis unit.

[0010] As a further solution of the present invention, the specific way for the etching adjustment analysis unit to analyze the data abnormal result is as follows: Obtain the abnormal etching position a corresponding to the data abnormal result. At the same time, obtain the corresponding etching data to be analyzed. Then, obtain the satisfied records in the historical data and mark the corresponding PCB board parameters in the satisfied records. Then, screen the satisfied records with the current PCB board parameters as the standard to obtain the screened records and label them as n, and n = 1, 2, …, m, where m represents the number label of the screened records. At the same time, obtain the etching factor Qn corresponding to the screened record n and sort them in descending order according to the etching factor Qn. Then, select the screened record corresponding to the largest etching factor Qn as the analysis object. At the same time, obtain the etching depth and etching width corresponding to the analysis object and judge whether the etching depth and etching width meet the etching requirements of the current PCB board. If the etching depth and etching width are satisfied, generate adjustment test information based on the analysis object. On the contrary, if the etching depth and etching width are not satisfied, analyze them in order from large to small in turn, and transmit the generated adjustment test information to the test information output unit.

[0011] As a further solution of the present invention, the specific way for the etching normal analysis unit to analyze the etching normal result is as follows: Obtain all the etching positions denoted as r, where r = 1, 2, …, e, and e represents the quantity label of the etching positions. At the same time, calculate the etching factor Qr corresponding to the etching position r, and compare the etching factor Qr with the normal threshold Qy. If the etching factor Qr is greater than the normal threshold Qy, generate satisfied information; conversely, if the etching factor Qr is less than the normal threshold Qy, generate a parameter adjustment signal, and at the same time analyze the parameter adjustment signal to generate adjustment test information.

[0012] As a further solution of the present invention, the specific manner in which the etching normal analysis unit analyzes the parameter adjustment signal to generate adjustment test information is as follows: Obtain the etching position corresponding to the parameter adjustment signal and denote it as the position to be adjusted. Then obtain the etching data corresponding to the position to be adjusted. At the same time, obtain historical data, and select the records that satisfy the etching data of the position to be adjusted in the historical data and denote them as analysis records. Then obtain the parameters of the current PCB board, and screen the analysis records based on the PCB board parameters. At the same time, generate adjustment test information, and then transmit the adjustment test information to the test information output unit.

[0013] A test method for detecting the etching effect of a thick copper PCB board, which specifically includes the following steps: Step 1, analyze the etching information of the PCB board, and generate an etching defect result and an etching normal result by judging the appearance of the PCB board. Step 2, analyze the etching defect result, analyze the etching data corresponding to different etching positions on the PCB board, and judge the etching data to generate a data analysis result, and the data analysis result includes an abnormal etching data result and a normal etching data result. Step 3, analyze the obtained abnormal etching data result, adjust the etching data in combination with the obtained historical data, and analyze and generate adjustment test information according to the parameters of the PCB board. Step 4, analyze the obtained etching normal result, calculate the etching factors corresponding to different etching positions, and perform adjustment analysis on the etching positions that do not meet the etching requirements, and at the same time generate adjustment test information.

[0014] The present invention provides a test system and method for detecting the etching effect of a thick copper PCB board. Compared with the prior art, it has the following beneficial effects: Through a dedicated PCB board information acquisition unit, the present invention can accurately collect key information such as etching depth, width, and position, and combine an industrial camera to conduct a detailed analysis of the PCB board appearance, effectively identifying defects such as copper tumors, etching pits, and residual copper, improving the comprehensiveness and accuracy of etching effect evaluation. After detecting etching anomalies, it can obtain detailed etching data of the abnormal etching positions, and use this as a standard to screen out all positions with the same etching data (including abnormal and normal positions) for comprehensive analysis; By combining historical data, the etching adjustment analysis unit performs screening and analysis based on parameters such as the size and number of layers of the PCB board, selects appropriate etching factors for recording as reference standards to generate adjustment test information. This data-driven process adjustment method can more scientifically and accurately optimize the etching process, effectively reducing the scrap rate caused by etching anomalies, and improving production efficiency and product quality stability; The normal etching analysis unit not only confirms the normal etching results but also further calculates and compares the etching factors at different etching positions. For normal positions that do not meet the etching requirements, like abnormal positions, it can use historical data for analysis and screening to generate adjustment test information, thereby fine-tuning the etching process at these positions and improving the overall etching quality uniformity and stability of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a block diagram of the system principle of the present invention; Figure 2 is a flowchart of the method steps of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0017] Embodiment 1 Please refer to Figure 1 , this application provides a test system for detecting the etching effect of thick copper PCB boards, including: a PCB board information acquisition unit, an etching situation analysis unit, an etching defect analysis unit, a normal etching analysis unit, an etching adjustment analysis unit, and a test information output unit. At the same time, referring to the block diagram shown Figure 1 , it can be known that all the above functional units are connected in a one-way electrical connection.

[0018] The PCB board information acquisition unit is used to collect the etching information of the PCB board, and at the same time transmit the collected etching information to the etching situation analysis unit. The etching information here includes the etching depth, etching width, and the corresponding etching position.

[0019] The etching situation analysis unit is used to analyze the obtained etching information. By analyzing the appearance of the PCB board, it judges whether there is an abnormal etching situation, and at the same time generates an etching analysis result. The etching analysis result includes an etching defect result and an etching normal result.

[0020] The appearance image of the PCB board is obtained through an industrial camera, and at the same time the appearance of the PCB board is recognized based on the appearance image. The recognition here is mainly to recognize the appearance under the etching situation, mainly checking whether the surface after etching is flat, and whether there are defects such as copper nodules, etching pits, and residual copper. A copper nodule refers to the accumulation of excess copper on the circuit during the etching process, which will cause the circuit width to increase and may cause a short circuit; an etching pit will affect the strength and electrical performance of the circuit; residual copper may pose a short circuit risk between circuits. If there are defects in the appearance image, an etching defect result is generated. On the contrary, if there are no defects in the appearance image, an etching normal result is generated, and the etching defect result is transmitted to the etching defect analysis unit, and the etching normal result is transmitted to the etching normal analysis unit.

[0021] The etching defect analysis unit is used to analyze the obtained etching defect result. By analyzing the etching data corresponding to different etching positions on the PCB board and judging the etching data to generate a data analysis result, and at the same time transmitting the data analysis result to the etching adjustment analysis unit.

[0022] Obtain the etching defect result, and at the same time obtain the corresponding etching position on the PCB board, and label it as i, where i = 1, 2, …, j, and j represents the number label of the etching position. Then obtain the etching depth Di and etching width Ki corresponding to the etching position i. Here, any group of etching positions is obtained, and the corresponding etching factor Qi is calculated. The specific calculation formula is , and at the same time compare the calculated etching factor Qi with the normal threshold Qy. The specific value of the normal threshold Qy is set by the operator. The higher the etching factor, the more vertical the etching sidewall and the better the etching effect. For example, in the case of an etching depth of 0.05 mm and an etching width of 0.1 mm, the etching factor is 0.5. Generally speaking, an etching factor greater than 0.7 is considered to have a good etching effect; If the etching factor Qi is greater than the normal threshold Qy, it means that the etching effect corresponding to the current etching position i meets the corresponding etching requirements, and the etching data is generated to be normal. On the contrary, if the etching factor Qi is less than the normal threshold Qy, it means that the etching effect corresponding to the current etching position i does not meet the corresponding etching requirements, and the etching data is generated to be abnormal. Suppose a multi-layer PCB board has a total of 100 etching positions on the PCB board that need to detect the etching effect (i.e., i=1 to 100). After professional measurement and calculation, the normal threshold Qy is determined to be 0.75. For etching position 1, the etching depth is measured to be 0.06mm and the etching width is 0.07mm. According to the etching factor calculation formula (etching factor Qi=etching depth / etching width), Qi=0.06 / 0.07≈0.86. Since 0.86>0.75 (Qi>Qy), it means that the etching effect corresponding to etching position 1 meets the corresponding etching requirements, and the etching data is generated normally.

[0023] Then check the etching position 2, measure the etching depth to be 0.04mm, the etching width to be 0.06mm, calculate Qi=0.04 / 0.06≈0.67, because 0.67<0.75 (Qi <Qy),所以蚀刻位置2对应的蚀刻效果不满足对应的蚀刻需求,生成蚀刻数据异常结果,将蚀刻位置2记作异常蚀刻位置a,此时a=1(因为这是第一个被标记的异常蚀刻位置)。

[0024] All etching positions are processed in this way, and the etching positions corresponding to the abnormal results of the etching data are recorded as abnormal etching positions, and the labels are recorded as a, and a=1, 2, ..., b, where b represents the number of abnormal etching positions; Then, all abnormal etching positions a are obtained, and etching data corresponding to the abnormal etching positions a are obtained and recorded as etching data to be analyzed. Here, any group of abnormal etching positions is obtained, and the etching data to be analyzed is used as a standard, and etching data identical to the etching data to be analyzed is obtained and recorded as pre-selected etching data. Here, the pre-selected etching data is etching data corresponding to all etching positions, including etching data of abnormal etching positions and etching data of normal etching positions. Then, the etching positions corresponding to the pre-selected etching data are analyzed. If the etching positions corresponding to the pre-selected etching data are all normal etching positions, a normal data result is generated, and the abnormal etching position a is recorded as a marked abnormal position, and the marked abnormal position is transmitted to the test information output unit. If there is an abnormal etching position among the etching positions corresponding to the pre-selected etching data, an abnormal data result is generated, and the abnormal data result is transmitted to the etching adjustment analysis unit.

[0025] Etching adjustment analysis unit, which is used to analyze the abnormal results of the acquired data, adjust the etching data in combination with the acquired historical data, and generate adjustment test information according to the parameters of the PCB board.

[0026] Obtain the abnormal etching position a corresponding to the abnormal result of the acquired data, and at the same time obtain the etching data to be analyzed. Then obtain the historical data, and obtain the satisfied records in the historical data. Here, the satisfied records mean that the corresponding etching factor is greater than 0.7. At the same time, mark the PCB board parameters corresponding to the satisfied records. Then, using the current PCB board parameters as the standard, screen the satisfied records to obtain the screened records and label them as n, where n = 1, 2,..., m, and m represents the number label of the screened records. Specifically, the PCB board parameters here include parameters such as size and number of layers. At the same time, obtain the etching factor Qn corresponding to the screened record n, and sort them from largest to smallest according to the etching factor Qn; Then select the screened record corresponding to the largest etching factor Qn as the analysis object, and at the same time obtain the etching depth and etching width corresponding to the analysis object, and judge whether the etching depth and etching width meet the etching requirements of the current PCB board. Specifically, here it means whether the current etching depth or etching width can be modified with the etching depth or etching width of the analysis object. For example, if the etching depth of the analysis object is 0.06 mm and the etching width is 0.07 mm, while the current etching depth is 0.05 mm and the etching width is 0.08 mm, since the etching depth of the analysis object is less than the current etching width, the analysis object is excluded. Another example is that the etching depth of the analysis object is 0.06 mm and the etching width is 0.07 mm, while the current etching depth is 0.04 mm and the etching width is 0.06 mm. Both the etching depth and etching width meet the etching requirements, so adjust with the analysis object as the standard. If the etching depth and etching width meet, generate adjustment test information with the analysis object as the standard. Otherwise, if the etching depth and etching width do not meet, analyze in order from largest to smallest, and transmit the generated adjustment test information to the test information output unit.

[0027] Test information output unit, which is used to display the acquired adjustment test information to the corresponding operator.

[0028] Embodiment 2 As Embodiment 2 of the present invention, it is implemented on the basis of Embodiment 1, and the difference from Embodiment 1 is as follows: Etching normal analysis unit, which is used to analyze the normal results of the acquired etching, calculate the etching factors corresponding to different etching positions, and perform adjustment analysis on the etching positions that do not meet the etching requirements, and at the same time generate adjustment test information.

[0029] Obtain all the etching positions denoted as r, where r = 1, 2, …, e. Here, e represents the quantity label of the etching positions, and the meaning of the etching positions here is the same as that in Embodiment 1. At the same time, calculate the etching factor Qr corresponding to the etching position r, and compare the etching factor Qr with the normal threshold Qy. If the etching factor Qr is greater than the normal threshold Qy, it means that the etching position r does not need to be adjusted, and the etching requirement is met, and satisfaction information is generated. On the contrary, if the etching factor Qr is less than the normal threshold Qy, it means that the etching position r needs to be adjusted, and a parameter adjustment signal is generated; Analyze the generated parameter adjustment signal, and obtain the etching position corresponding to the parameter adjustment signal and denote it as the position to be adjusted. Then obtain the etching data corresponding to the position to be adjusted. At the same time, obtain the historical data, and select the records in the historical data that meet the etching data of the position to be adjusted and denote them as analysis records. Then obtain the parameters of the current PCB board, and screen the analysis records based on the PCB board parameters. Here, the screening method is the same as that of the etching adjustment analysis unit in Embodiment 1, and generate adjustment test information in the same analysis method. At the same time, generate adjustment test information, and then transmit the adjustment test information to the test information output unit.

[0030] The test information output unit is used to display the obtained adjustment test information to the corresponding operator.

[0031] Embodiment 3 As Embodiment 3 of the present invention, the key lies in combining the implementation processes of Embodiment 1 and Embodiment 2.

[0032] Embodiment 4 Please refer to Figure 2 , this application provides a test method for detecting the etching effect of a thick copper PCB board. The method specifically includes the following steps: Step 1: Analyze the etching information of the PCB board, and generate an etching defect result and an etching normal result by judging the appearance of the PCB board. The specific analysis method is the same as that of the etching situation analysis unit in Embodiment 1; Step 2: Analyze the etching defect result. By analyzing the etching data corresponding to different etching positions on the PCB board, and judge the etching data to generate a data analysis result. The data analysis result includes an etching data abnormal result and an etching data normal result. The specific analysis method is the same as the processing process of the etching defect analysis unit in Embodiment 1; Step 3: Analyze the obtained etching data abnormal result, adjust the etching data in combination with the obtained historical data, and generate adjustment test information by analyzing according to the parameters of the PCB board. The specific analysis method is the same as the processing process of the etching adjustment analysis unit in Embodiment 1; Step 4: Analyze the obtained normal etching results. Calculate the etching factors corresponding to different etching positions, conduct adjustment analysis on the etching positions that do not meet the etching requirements, generate adjustment test information at the same time, and the specific analysis method is the same as the processing process of the normal etching analysis unit in Embodiment 1.

[0033] Some data in the above formulas are numerically calculated after removing their dimensions, and the content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0034] The above embodiments are only used to illustrate the technical method of the present invention and not to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical method of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical method of the present invention.

Claims

1. A test system for detecting the etching effect of a thick copper PCB board, characterized in that Including: A PCB board information acquisition unit, which is used to transmit the collected etching information to the etching situation analysis unit; An etching situation analysis unit, which is used to analyze the obtained etching information. By analyzing the appearance of the PCB, it judges whether there is an abnormal etching situation, and at the same time generates an etching defect result and an etching normal result, and transmits the etching defect result to the etching defect analysis unit and the etching normal result to the etching normal analysis unit; An etching defect analysis unit, which is used to analyze the obtained etching defect result. By analyzing the etching data corresponding to different etching positions on the PCB board and judging the etching data, it generates an etching data normal result and an etching data abnormal result. At the same time, it analyzes the etching data abnormal result to generate a data abnormal result and marks the abnormal position, and transmits the data abnormal result to the etching adjustment analysis unit; An etching adjustment analysis unit, which is used to analyze the obtained data abnormal result, and at the same time adjust the etching data in combination with the obtained historical data, and generate adjustment test information according to the parameters of the PCB board, and transmit the adjustment test information to the test information output unit; An etching normal analysis unit, which is used to analyze the obtained etching normal result. By calculating the etching factors corresponding to different etching positions and performing adjustment analysis on the etching positions that do not meet the etching requirements, it generates adjustment test information at the same time and transmits the adjustment test information to the test information output unit.

2. The test system for detecting the etching effect of a thick copper PCB board according to claim 1, wherein The specific method for the etching situation analysis unit to analyze the etching information is as follows: Obtain the appearance image of the PCB board, and at the same time identify the appearance of the PCB board based on the appearance image. If there are defects in the appearance image, generate an etching defect result. On the contrary, if there are no defects in the appearance image, generate an etching normal result, and transmit the etching defect result to the etching defect analysis unit and the etching normal result to the etching normal analysis unit.

3. The test system for detecting the etching effect of a thick copper PCB board according to claim 1, wherein, The specific method for the etching defect analysis unit to analyze the etching defect result is as follows: Obtain the etching defect results, and at the same time obtain the corresponding etching positions on the PCB board, and label them as i, where i = 1, 2, …, j, and j represents the quantity label of the etching positions. Then obtain the etching depth Di and the etching width Ki corresponding to the etching position i, and calculate the corresponding etching factor Qi. The specific calculation formula is , and at the same time compare the calculated etching factor Qi with the normal threshold Qy, and the specific value of the normal threshold Qy is set by the operator; If the etching factor Qi is greater than the normal threshold Qy, it means that the etching effect corresponding to the current etching position i meets the corresponding etching requirements, and an etching data normal result is generated. On the contrary, if the etching factor Qi is less than the normal threshold Qy, it means that the etching effect corresponding to the current etching position i does not meet the corresponding etching requirements, and an etching data abnormal result is generated; And so on, all etching positions are processed, and the etching positions corresponding to the etching data abnormal result are recorded as abnormal etching positions, and the label is recorded as a, and a = 1, 2,..., b, where b represents the number label of the abnormal etching positions. Then, the abnormal etching positions are analyzed to generate a marked abnormal position and a data abnormal result.

4. The test system for detecting the etching effect of a thick copper PCB board according to claim 3, characterized in that, The specific method for the etching defect analysis unit to analyze the abnormal etching positions is as follows: Obtain all abnormal etching positions a, and at the same time obtain the etching data corresponding to the abnormal etching position a as the etching data to be analyzed. Taking the etching data to be analyzed as the standard, obtain the etching data that is the same as the etching data to be analyzed as the preselected etching data, and then analyze the etching positions corresponding to the preselected etching data; If all the etching positions corresponding to the preselected etching data are normal etching positions, a normal data result is generated, and the abnormal etching position a is recorded as a marked abnormal position. At the same time, the marked abnormal position is transmitted to the test information output unit. If there are abnormal etching positions among the etching positions corresponding to the preselected etching data, an abnormal data result is generated, and the abnormal data result is transmitted to the etching adjustment analysis unit at the same time.

5. The test system for detecting the etching effect of a thick copper PCB board according to claim 1, wherein, The specific way for the etching adjustment analysis unit to analyze the abnormal data result is as follows: Obtain the abnormal etching position a corresponding to the abnormal data result, and at the same time obtain the etching data to be analyzed corresponding thereto. Then, obtain the records that meet the requirements in the historical data, and mark the corresponding PCB board parameters in the records that meet the requirements. Then, screen the records that meet the requirements based on the current PCB board parameters to obtain the screened records and label them as n, and n = 1, 2,..., m, where m represents the number label of the screened records. At the same time, obtain the etching factor Qn corresponding to the screened record n, and sort them in descending order according to the etching factor Qn; Then, select the screened record corresponding to the largest etching factor Qn as the analysis object, and at the same time obtain the etching depth and etching width corresponding to the analysis object, and determine whether the etching depth and etching width meet the etching requirements of the current PCB board; If the etching depth and etching width meet the requirements, adjustment test information is generated based on the analysis object. Otherwise, if the etching depth and etching width do not meet the requirements, sequential analysis is performed in descending order, and the generated adjustment test information is transmitted to the test information output unit.

6. The test system for detecting the etching effect of a thick copper PCB board according to claim 1, wherein, The specific way for the etching normal analysis unit to analyze the normal etching result is as follows: Obtain all the etching positions and label them as r, and r = 1, 2,..., e, where e represents the number label of the etching positions. At the same time, calculate the etching factor Qr corresponding to the etching position r, and compare the etching factor Qr with the normal threshold Qy. If the etching factor Qr is greater than the normal threshold Qy, a satisfaction message is generated. Otherwise, if the etching factor Qr is less than the normal threshold Qy, a parameter adjustment signal is generated, and adjustment test information is generated by analyzing the parameter adjustment signal.

7. The test system for detecting the etching effect of a thick copper PCB board according to claim 6, characterized in that, The specific way for the etching normal analysis unit to analyze the parameter adjustment signal and generate adjustment test information is as follows: Obtain the etching position corresponding to the parameter adjustment signal and label it as the position to be adjusted. Then, obtain the etching data corresponding to the position to be adjusted, and at the same time obtain the historical data. Select the records in the historical data that meet the etching data of the position to be adjusted as the analysis records. Then, obtain the parameters of the current PCB board, screen the analysis records based on the PCB board parameters, and generate adjustment test information at the same time. Then, transmit the adjustment test information to the test information output unit.

8. A test method for detecting the etching effect of a thick copper PCB board, which is executed by a test system for detecting the etching effect of a thick copper PCB board according to any one of claims 1-7, characterized in that, This method specifically includes the following steps: Step 1: Analyze the etching information of the PCB board, and generate an etching defect result and a normal etching result by judging the appearance of the PCB board; Step 2: Analyze the etching defect results. Analyze the etching data corresponding to different etching positions on the PCB board, judge the etching data to generate a data analysis result, and the data analysis result includes an abnormal etching data result and a normal etching data result; Step 3: Analyze the obtained abnormal etching data result, adjust the etching data in combination with the acquired historical data, and generate adjustment test information based on the analysis of the PCB board parameters; Step 4: Analyze the obtained normal etching result, calculate the etching factor corresponding to different etching positions, perform adjustment analysis on the etching positions that do not meet the etching requirements, and generate adjustment test information at the same time.

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