Heat sink device
By adopting a split structure and spiral flow channel design in the heat sink device, the problem of uneven heat dissipation of crystals is solved, uniform heat dissipation and economy are achieved, and the performance and reliability of laser equipment are improved.
Patent Information
- Application Number
- CN202510507729.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-22
- Publication Date
- 2025-07-11
AI Technical Summary
The existing heat sink structure has an uneven heat distribution problem when dissipating heat to the crystal, which affects the output laser quality of the crystal, and the complex heat sink assembly increases the manufacturing cost and difficulty.
A heat sink device is designed, adopting a first heat sink part and a second heat sink part of a split structure, forming a hollow cavity inside and enclosing a spiral flow channel for fixing the crystal, achieving uniform heat dissipation through the spiral flow channel, and temperature monitoring and control are carried out in combination with a sealing ring and thermistor.
The uniform temperature field of the crystal is realized, the temperature gradient is reduced, the heat dissipation efficiency and the economics of the device are improved, the crystal is operated within the appropriate temperature range, and the stability and quality of the laser output are improved.
Smart Images
Figure CN120300581A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of crystal heat dissipation devices, and particularly to a heat sink device. Background Art
[0002] With the continuous development of industries such as optoelectronics towards miniaturization, high performance, and high integration, the requirements for heat dissipation technology in the crystal regions that generate a large amount of heat during their operation are also increasing day by day. Currently, for the heat sink structure of crystals, materials with high thermal conductivity are mostly combined with processing structures such as channels and fins to improve the heat transfer efficiency by increasing the heat transfer area and heat transfer rate, so that the crystal is more likely to be in a suitable working range; however, due to the relatively single current heat sink heat dissipation method, it usually can only dissipate heat from one or several directions to the crystal, resulting in uneven heat distribution within the crystal. Not only are the temperatures of each vertical cross-section in the crystal axis direction uneven, but also the temperatures in each direction on each cross-section of the crystal are uneven, which seriously affects the output laser quality of the crystal and reduces the application effect. For a single form of crystal, setting too complex a heat sink component will lead to an increase in manufacturing cost and difficulty, and reduce the economy of crystal heat dissipation.
[0003] Therefore, how to improve the heat dissipation effect of the heat sink structure on the crystal and ensure the economy of the heat sink structure is a technical problem that those skilled in the art urgently need to solve. Summary of the Invention
[0004] In view of this, the purpose of this application is to provide a heat sink device to improve the heat dissipation effect of the heat sink structure on the crystal and ensure the economy of the heat sink structure.
[0005] To achieve the above purpose, this application provides the following technical solutions:
[0006] A heat sink device includes at least a first heat sink part and a second heat sink part, and channels are respectively formed in the first heat sink part and the second heat sink part;
[0007] The first heat sink part and the second heat sink part enclose a hollow cavity, the hollow cavity is used for fixedly arranging a crystal with a circular, rectangular or diamond cross-section, and the first heat sink part and the second heat sink part are enclosed and fixed, and the channels inside them are communicated to form a spiral flow channel surrounding the hollow cavity.
[0008] Preferably, in the above heat sink device, the spiral flow channel is at least independently arranged in two circles around the hollow cavity, and the spiral flow channel is uniformly arranged along the circumferential direction of the hollow cavity.
[0009] Preferably, in the above heat sink device, it includes a heat sink base and a small hole aperture stop. The first heat sink part and the second heat sink part are arranged on the heat sink base. Two small hole aperture stops are oppositely arranged along the axial direction of the hollow cavity. The two small hole aperture stops are located at both ends of the hollow cavity in the axial direction, and their opening positions are correspondingly arranged with the hollow cavity.
[0010] Preferably, in the above heat sink device, it further includes a waterproof cover plate. The waterproof cover plate is fixedly arranged on the heat sink base and seals the first heat sink part and the second heat sink part in the axial direction of the hollow cavity.
[0011] Preferably, in the above heat sink device, it includes a first sealing ring. The first sealing ring is sleeved on the outer wall surrounded by the first heat sink part and the second heat sink part. At least two first sealing rings are arranged at both ends of the hollow cavity in the axial direction and are pressed by the waterproof cover plate.
[0012] Preferably, in the above heat sink device, it includes a second sealing ring arranged on the outer wall of the heat sink base. The heat sink base is provided with a communication port communicating with the spiral flow channel. One second sealing ring is respectively arranged at both ends of the single communication port in the axial direction of the hollow cavity.
[0013] Preferably, in the above heat sink device, it includes a thermistor. The thermistor axially penetrates through the first heat sink part and / or the second heat sink part along the hollow cavity.
[0014] Preferably, in the above heat sink device, the crystal is in the hollow cavity and is welded and fixed with the first heat sink part and the second heat sink part. The thickness of the welding layer is 48μm - 52μm.
[0015] Preferably, in the above heat sink device, both the first heat sink part and the second heat sink part are semi-cylindrical structures, or,
[0016] The heat sink device further includes a third heat sink part. The first heat sink part, the second heat sink part and the third heat sink part are spliced into a cylindrical structure and the corresponding central angles of the three are equal.
[0017] Preferably, in the above heat sink device, the cross-sectional area of the spiral flow channel is circular, rectangular or triangular.
[0018] As can be seen from the above technical solution, the heat sink device provided in this application is provided with a first heat sink part and a second heat sink part with a split structure, so as to be independently processed to reduce the production and manufacturing difficulty of the heat sink device. At the same time, channel structures are respectively provided in the first heat sink part and the second heat sink part. After the first heat sink part and the second heat sink part are enclosed and fixed, a hollow cavity structure can be formed for accommodating crystals, and the channels are fixed through the first heat sink part and the second heat sink part to form a connected spiral flow channel. The spiral flow channel is arranged around the hollow cavity to uniformly dissipate heat inside the hollow cavity along the axial direction of the hollow cavity when the heat dissipation medium passes through, thereby being able to achieve a uniform temperature field in the axial direction of the crystal to reduce the temperature gradient, weaken the thermal lens effect of the crystal. At the same time, the spiral flow channel can also increase the impact times and residence time of the cooling medium in the flow channel through frequent commutation, thereby improving the heat exchange efficiency of the cooling medium for the inside of the hollow cavity and enhancing the heat dissipation effect of the heat sink device. Description of the Drawings
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0020] Figure 1 Schematic diagram of the front structure of the heat sink device provided by the present disclosure;
[0021] Figure 2 For Figure 1 Schematic diagram of the A-A cross-sectional structure of
[0022] Figure 3 Axonometric view of the heat sink device;
[0023] Figure 4 Schematic diagram of the connection structure between the first heat sink part and the second heat sink part;
[0024] Figure 5 For Figure 4 Top view of
[0025] Figure 6 For Figure 4 Side view of
[0026] Among them, 10 - first heat sink part; 20 - second heat sink part; 30 - hollow cavity; 40 - spiral flow channel; 50 - heat sink base; 510 - communication port; 60 - aperture stop; 70 - waterproof cover plate; 810 - first sealing ring; 820 - second sealing ring; 90 - thermistor; 100 - crystal; 110 - welding layer. Detailed Embodiments
[0027] The core of this application is to disclose a heat sink device to improve the heat dissipation effect of the heat sink structure on the crystal and ensure the economy of the heat sink structure.
[0028] To enable those skilled in the art to better understand the solution of this application, the embodiments of this application will be described below with reference to the accompanying drawings. In addition, the embodiments shown below do not impose any limitation on the inventive content recited in the claims. Furthermore, all the contents of the configurations shown in the following embodiments are not limited to what is necessary for the solution of the invention recited in the claims.
[0029] As Figure 1 、 Figure 2 and Figure 3 shown, the present invention provides a heat sink device, which at least includes a first heat sink part 10 and a second heat sink part 20 that are separately arranged, and the first heat sink part 10 and the second heat sink part 20 can be enclosed and fixed to form a hollow cavity 30, so as to provide an installation space for the crystal 100 and at the same time realize the heat dissipation of the crystal 100. Specifically, channel structures are provided inside both the first heat sink part 10 and the second heat sink part 20, and the channel structures are the flow paths of the cooling medium. At the same time, as Figure 4 and Figure 5 shown, when the first heat sink part 10 and the second heat sink part 20 are enclosed and in contact, the channel structures of the two will be connected to form a spiral flow channel 40 arranged around the hollow cavity 30, thereby providing a path for the cooling medium to flow around the hollow cavity 30.
[0030] It should be noted that the design of the spiral flow channel 40 has unique advantages. Compared with traditional straight and broken-line flow channels, the spiral flow channel 40 can significantly increase the contact area and contact time between the cooling medium and the heat sink device, and can provide more effective heat dissipation for the area inside the hollow cavity 30 of the heat sink device; the cooling medium flows in a spiral shape in the spiral flow channel 40 to form a flow path surrounding the hollow cavity 30, and can cover all areas of the hollow cavity 30 in the axial direction of the hollow cavity 30. The flow channel state of the periphery of any cross-sectional area of the hollow cavity 30 in its axial direction is the same, so that the temperature gradient in the axial direction of the hollow cavity 30 is reduced. The cooling medium can uniformly carry out the heat in any area inside the hollow cavity 30 in the spiral flow channel 40, thereby improving the heat dissipation uniformity of the area of the hollow cavity 30 inside the heat sink device. The uniform heat dissipation effect is particularly important for the stable operation of the crystal 100. Especially in application scenarios where the crystal 100 has high requirements for temperature uniformity, such as in high-precision laser devices or electronic components, if the heat dissipation of the crystal 100 is uneven, it may cause local overheating of the crystal 100, thereby affecting the stability and quality of the laser output. The design of the spiral flow channel 40 can effectively avoid this situation and ensure that the crystal 100 can maintain a relatively stable temperature range throughout the working process.
[0031] It should be further noted that for the heat sink device provided in the embodiment of the present disclosure, since the spiral flow channel 40 can cover all areas of the hollow cavity 30 in the axial direction of the hollow cavity 30, the flow channel state of the periphery of any cross-sectional area of the hollow cavity 30 in its axial direction is the same, so that the temperature gradient in the axial direction of the hollow cavity 30 is reduced. Based on this, it is not necessary to only install the crystal 100 with a cylindrical structure inside the hollow cavity 30. For the crystal 100 structure with a rectangular or rhombic cross-section, it also has the function of uniformly dissipating heat along the circumference of the crystal 100, and can adapt to crystals 100 with different cross-sectional structures, thereby improving the general applicability of the heat sink device provided in this embodiment.
[0032] Furthermore, in terms of structure, the shapes and sizes of the first heat sink portion 10 and the second heat sink portion 20 can be designed according to actual requirements to adapt to crystals 100 of different sizes and shapes. It can be a semi-cylindrical structure with the same structure or other shapes with different structures, as long as it can meet the design requirements of enclosing to form a hollow cavity 30 and realizing the spiral flow channel 40. In the actual manufacturing process, the first heat sink portion 10 and the second heat sink portion 20 are usually made of materials with good heat conduction performance, such as copper or aluminum. These materials can not only quickly conduct the heat generated by the crystal 100 to the heat sink device, but also take away the heat through the cooling medium in the spiral flow channel 40, thereby achieving efficient heat dissipation. At the same time, in the actual use process, the heat sink device can be connected to an external cooling system to introduce the cooling medium into the spiral flow channel 40. The cooling medium can be water, oil or other special coolants.
[0033] Furthermore, in order to improve the heat dissipation effect of the heat sink device on the crystal 100, in the heat sink device provided in the embodiment of the present invention, the spiral flow channel 40 is independently arranged at least two times around the hollow cavity 30, and at the same time, the spiral flow channel 40 is evenly arranged along the circumferential direction of the hollow cavity 30. It should be noted that, first, the spiral flow channel 40 being evenly arranged along the circumferential direction of the hollow cavity 30 specifically means that at least two groups of spiral flow channels 40 are symmetric about the axis of the hollow cavity 30. For any cross-sectional area of the hollow cavity 30 in its axial direction, the cross-sectional flow channel structures of several spiral flow channels 40 are evenly distributed in the circumferential direction of the axis of the hollow cavity 30. Secondly, when the spiral flow channel 40 is arranged in at least two layers, the flow path of the cooling medium in the flow channel increases, thereby increasing the total contact area between the cooling medium and the heat sink device. More heat can be transferred from the heat sink device to the cooling medium, thereby improving the heat dissipation efficiency; and for the outer periphery of the cross-sectional area of the hollow cavity 30 in its axial direction, it has a larger flow channel coverage area, and can further improve the temperature uniformity of the crystal 100 inside the hollow cavity 30 in its circumferential direction.
[0034] In addition, it should be noted that for the structural design of multiple spiral flow channels 40, the channel structures of the first heat sink portion 10 and the second heat sink portion 20 need to be processed more precisely to achieve the accurate docking of multiple groups of flow channel docking points, which increases the manufacturing complexity and processing cost, but can significantly improve the performance of the heat sink device. In the actual application process, the number of processed spiral flow channels 40 can be designed according to the usage requirements. For example, in some high-power laser devices, the heat dissipation requirement of the crystal 100 is relatively high. At this time, more spiral flow channels 40 can be designed to improve the heat dissipation efficiency. In some low-power devices, the number of spiral flow channels 40 can be appropriately reduced to simplify the structure and reduce the cost.
[0035] Furthermore, the heat sink device provided by the embodiment of the present invention further includes a heat sink base 50 and a small aperture diaphragm 60. Among them, the heat sink base 50 is the main load-bearing structure, and the first heat sink part 10 and the second heat sink part 20 are both arranged on the heat sink base 50. It should be noted here that the channel structures arranged on the first heat sink part 10 and the second heat sink part 20 can be arranged inside the first heat sink part 10 and the second heat sink part 20, so that after the first heat sink part 10 and the second heat sink part 20 are fixedly connected, the channel structures can form a spiral flow channel 40 for the cooling medium to flow through. At the same time, the channel structures on the first heat sink part 10 and the second heat sink part 20 can also be arranged by grooving on the outer walls of the first heat sink part 10 and the second heat sink part 20, so that when the first heat sink part 10 and the second heat sink part 20 are arranged inside the heat sink base 50, they are wrapped by the heat sink base 50, and then the channel structures on the first heat sink part 10 and the second heat sink part 20 form a spiral flow channel 40 structure by means of the inner wall of the heat sink base 50 to meet the flow requirements of the cooling medium. And grooving on the outer walls of the first heat sink part 10 and the second heat sink part 20 has more convenient processing, and can further reduce the processing cost.
[0036] And two small aperture diaphragms 60 are arranged oppositely along the axis of the hollow cavity 30. The two small aperture diaphragms 60 are fixedly arranged on the heat sink base 50 and are respectively located at both ends of the hollow cavity 30 in the axial direction. At the same time, the opening positions of the small aperture diaphragms 60 are correspondingly arranged with the hollow cavity 30, that is, the openings of the small aperture diaphragms 60 are located on the axis of the hollow cavity 30. The above structure uses the heat sink base 50 as the basic structure of the whole device to provide installation and support for the first heat sink part 10 and the second heat sink part 20, while the small aperture diaphragm 60 can intercept the stray light of the light beam in two directions on the front and rear end faces of the crystal 100 in the axial direction of the crystal 100, and realize the concentration and stability of the light emitted by the crystal 100 through the opening; the opening area of the small aperture diaphragm 60 can also be set as a structure with an adjustable opening area, so as to conveniently adjust the light emitted by the crystal 100 by adjusting the area of the opening area.
[0037] In addition, it should be noted that the arrangement of the small aperture diaphragms 60 at both ends of the hollow cavity 30 in the axial direction can also provide a certain degree of protection for the crystal 100 inside the hollow cavity 30, that is, it can prevent impurities such as dust from falling on the surface of the crystal 100 and damaging the crystal 100.
[0038] Based on the above embodiments, the heat sink device further includes a waterproof cover plate 70. The waterproof cover plate 70 is fixedly arranged on the heat sink base 50 and seals the first heat sink part 10 and the second heat sink part 20 in the axial direction of the hollow cavity 30, providing an additional sealing layer for the heat sink device. The waterproof cover plate 70 is fixed on the heat sink base 50 to closely cover the upper parts of the first heat sink part 10 and the second heat sink part 20, thereby forming a closed space in the axial direction of the hollow cavity 30. This design of the closed space can not only prevent the cooling medium from leaking from above, but also prevent external impurities such as dust and moisture from entering the interior of the heat sink device and contaminating the crystal 100 and the flow channel, improving the reliability and service life of the device.
[0039] To further optimize the above technical solution, in some embodiments of the present invention, as Figure 2 shown, the heat sink device further includes a first sealing ring 810. The first sealing ring 810 is sleeved on the outer wall formed by the enclosure of the first heat sink part 10 and the second heat sink part 20 for local sealing. At the same time, at least two first sealing rings 810 are arranged at both ends in the axial direction of the hollow cavity 30 and are pressed by the waterproof cover plate 70 to cooperate with the waterproof cover plate 70 to achieve end sealing in the axial direction of the hollow cavity 30. It should be noted that since there may be a certain joint when the first heat sink part 10 and the second heat sink part 20 enclose to form the hollow cavity 30, if there is no good sealing measure in the joint area, it may cause the cooling medium to leak to the end position. The first sealing ring 810 is sleeved on the outer wall of the heat sink part, which can form a sealing layer at the ends of the first heat sink part 10 and the second heat sink part 20, thereby effectively preventing the cooling medium from leaking from the joint to the end position. At the same time, since the first sealing ring 810 is located at both ends in the axial direction of the hollow cavity 30 and is pressed by the waterproof cover plate 70, it can ensure that the sealing ring always maintains a good sealing state during operation. The pressing action of the waterproof cover plate 70 can not only fix the position of the first sealing ring 810, but also increase the contact pressure between the sealing ring and the heat sink part, thereby further improving the sealing performance.
[0040] In addition, it should be noted that the material of the first sealing ring 810 is usually selected as rubber or silica gel and other materials with good elasticity and heat resistance, so as to maintain good sealing performance under different temperature and pressure conditions and can also adapt to the slight deformation that may occur during the operation of the heat sink device
[0041] In order to further improve the use stability of the heat sink device, in some embodiments of the present invention, the heat sink device further includes a second sealing ring 820 arranged on the outer wall of the heat sink base 50. Specifically, as Figure 2As shown, a communication port 510 communicating with the spiral flow channel 40 is formed on the heat sink base 50, so that the cooling medium can enter and flow out of the spiral flow channel 40 at the outer wall position of the heat sink base 50; at the same time, for each communication port 510, a second sealing ring 820 is respectively arranged at both ends of the communication port 510 in the axial direction of the hollow cavity 30 to prevent the cooling medium from leaking from the communication port 510, thereby further enhancing the sealing performance of the heat sink device.
[0042] It should be noted that the setting of the second sealing ring 820 needs to match the outer wall of the heat sink base 50 and the structure of the communication port 510. In some embodiments of the present invention, a recessed groove is formed on the outer wall of the heat sink base 50 for the second sealing ring 820 to be embedded; at the same time, the second sealing ring 820 is usually selected from materials similar to the first sealing ring 810 with good elasticity and heat resistance, such as rubber or silica gel, etc., to ensure good sealing performance under different working conditions.
[0043] The settings of the first sealing ring 810 and the second sealing ring 820 are of great significance for improving the reliability and heat dissipation efficiency of the heat sink device. In some high-power laser devices, the leakage of the cooling medium may cause the device to overheat, affecting the stability and quality of the laser output. By setting the first sealing ring 810 and the second sealing ring 820, the device overheating can be effectively prevented to ensure the normal operation of the device. At the same time, good sealing performance can also reduce the loss of the cooling medium, improve the efficiency of the cooling system, and reduce the operating cost.
[0044] Furthermore, the heat sink device provided by the embodiment of the present invention further includes a thermistor 90. The thermistor 90 is arranged along the axial direction of the hollow cavity 30. It should be noted that a group of thermistors 90 can be arranged to penetrate through the first heat sink part 10 or the second heat sink part 20 in the axial direction of the hollow cavity 30. At the same time, two groups or multiple groups of thermistors 90 can be arranged so that the first heat sink part 10 and the second heat sink part 20 are both penetrated by the thermistor 90. The thermistor 90 is used for real-time temperature monitoring inside the heat sink device, so as to better control the heat dissipation process and ensure that the crystal 100 works within a suitable temperature range. Specifically, the thermistor 90 is an element that is very sensitive to temperature changes, and its resistance value will change significantly with the change of temperature. By penetrating the thermistor 90 in the heat sink part, the temperature change inside the heat sink device can be monitored in real time to prompt the operator to adjust the flow rate or temperature of the cooling medium in time according to the temperature change, so as to ensure that the crystal 100 always works within a suitable temperature range.
[0045] It should also be noted that the intelligent control of the heat sink device can be realized through the temperature monitoring function of the thermistor 90. In some embodiments of the present invention, the operating state of the cooling medium can be automatically adjusted in terms of flow rate or temperature through the control system according to the measurement results of the thermistor 90, so as to improve the operating efficiency of the equipment and reduce the labor cost. In addition, the thermistor 90 can also be communicatively connected to an audible and visual alarm device. When the thermistor 90 detects an abnormal increase in temperature, it can issue an alarm in time to remind the operator to take corresponding measures to avoid equipment damage or accidents.
[0046] Further, in some embodiments of the present invention, in this embodiment, the crystal 100 is disposed in the hollow cavity 30 and is fixedly welded to the first heat sink portion 10 and the second heat sink portion 20, as Figure 4 and Figure 6 shown. The weld area can be set at the end position of the crystal 100 to have sufficient welding space, and the welding process is a planar welding, which is simple to operate and does not require a weld flaw detection process, reducing the welding cost. It should also be noted that the welding layer 110 can be made of relatively soft metal indium, and the thickness of the weld is controlled within 48 μm - 52 μm to avoid the risk of the crystal 100 being thermally expanded due to excessive welding while maintaining the connection strength.
[0047] Further, in some embodiments of the present invention, both the first heat sink portion 10 and the second heat sink portion 20 are semi-cylindrical structures, so as to be able to be spliced into a cylindrical structure and form a hollow cavity 30. When the first heat sink portion 10 and the second heat sink portion 20 are semi-cylindrical structures, the two can closely enclose to form a complete hollow cavity 30, and this structural design has high symmetry and stability, and can evenly distribute heat. At the same time, the heat sink portion with a semi-cylindrical structure is also relatively simple in the processing and manufacturing process, which can reduce the production cost.
[0048] In some other embodiments of the present invention, the heat sink device further includes a first heat sink portion 10, a second heat sink portion 20 and a third heat sink portion, and the central angles corresponding to the first heat sink portion 10, the second heat sink portion 20 and the third heat sink portion are equal. The three heat sink portions are jointly spliced to form a cylindrical structure and form a hollow cavity 30. The volume of a single heat sink portion is smaller and it is easier to produce.
[0049] It should be noted that adjacent heat sink portions have a splicing surface at the outer wall position, and the fixed connection of the heat sink portions is achieved by welding at the outer edge of the splicing surface. It should also be noted that the contact surfaces of the two heat sinks with the crystal 100 need to be treated with a gold film to improve the heat dissipation efficiency.
[0050] In addition, in the heat sink device provided by the present invention, the cross-sectional area of the spiral flow channel 40 can be circular, rectangular or triangular. Among them, the flow channel with a circular cross-section has a relatively small flow resistance, which can make the cooling medium flow more smoothly. At the same flow rate, the flow velocity of the cooling medium can be faster, thereby improving the heat dissipation efficiency. At the same time, the flow channel with a circular cross-section is also relatively simple in the processing process, which can reduce the manufacturing cost. The flow channel with a rectangular cross-section can increase the contact area between the cooling medium and the heat sink device, thereby improving the heat dissipation efficiency. This larger contact area means that more heat can be transferred from the heat sink device to the cooling medium, thereby achieving more efficient heat dissipation. In addition, the heat dissipation performance of the flow channel with a rectangular cross-section can be further improved by optimizing its aspect ratio. The flow channel with a triangular cross-section can increase the stability of the flow channel to a certain extent, and can also achieve a good heat dissipation effect. The flow channel with a triangular cross-section is relatively stable in structure, which can reduce the vortex or other phenomena that are not conducive to heat dissipation generated by the cooling medium during the flow process. In the actual use process, the appropriate cross-sectional shape of the flow channel can be selected according to needs to effectively optimize the heat dissipation performance of the heat sink device.
[0051] The terms "first", "second", "left side" and "right side" in the specification, claims and above-mentioned drawings of this application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may include steps or units that are not listed.
[0052] The above description of the disclosed embodiments enables those skilled in the art to implement or use this application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application will not be limited to these embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A heat sink device, characterized in that, It includes at least a first heat sink part and a second heat sink part, and channels are respectively formed in the first heat sink part and the second heat sink part; The first heat sink part and the second heat sink part enclose to form a hollow cavity. The hollow cavity is used for fixedly arranging a crystal with a circular, rectangular or diamond cross-section. The first heat sink part and the second heat sink part are enclosed and fixed, and the channels inside them are communicated to form a spiral flow channel arranged around the hollow cavity.
2. The heat sink device according to claim 1, wherein The spiral flow channel is independently arranged at least two times around the hollow cavity, and the spiral flow channel is uniformly arranged along the circumferential direction of the hollow cavity.
3. The heat sink device according to claim 1, characterized in that, It includes a heat sink base and a pinhole aperture stop. The first heat sink part and the second heat sink part are arranged on the heat sink base. Two pinhole aperture stops are oppositely arranged along the axial direction of the hollow cavity. The two pinhole aperture stops are located at both ends of the hollow cavity in the axial direction, and their opening positions correspond to the hollow cavity.
4. The heat sink device according to claim 3, wherein It further includes a waterproof cover plate. The waterproof cover plate is fixedly arranged on the heat sink base and seals the first heat sink part and the second heat sink part in the axial direction of the hollow cavity.
5. The heat sink device according to claim 4, wherein, It includes a first sealing ring. The first sealing ring is sleeved on the outer wall after the first heat sink part and the second heat sink part are enclosed. At least two first sealing rings are arranged at both ends of the hollow cavity in the axial direction and are pressed by the waterproof cover plate.
6. The heat sink device according to claim 3, wherein It includes a second sealing ring arranged on the outer wall of the heat sink base. A communication port communicating with the spiral flow channel is formed on the heat sink base. One second sealing ring is respectively arranged at both ends of a single communication port in the axial direction of the hollow cavity.
7. The heat sink device according to claim 1, wherein It includes a thermistor. The thermistor axially penetrates the first heat sink part and / or the second heat sink part along the hollow cavity.
8. The heat sink device according to claim 1, wherein, The crystal is in the hollow cavity and is welded and fixed to the first heat sink part and the second heat sink part. The thickness of the welding layer is 48μm - 52μm.
9. The heat sink device according to claim 1, wherein Both the first heat sink part and the second heat sink part are semi-cylindrical structures, or, The heat sink device further includes a third heat sink part. The first heat sink part, the second heat sink part and the third heat sink part are spliced into a cylindrical structure and the central angles corresponding to the three are equal.
10. The heat sink device according to any one of claims 1-9, characterized in that, The cross-sectional area of the spiral flow channel is circular, rectangular or triangular.