A production process for embedded circuit boards

Abstract

The application provides a production process of embedded circuit board, comprising the following steps: opening a base hole on a substrate, the base hole is used for accommodating a chip; positioning the substrate and the chip by using a fixing member, and pressing the substrate and the chip to a first layer board; removing the fixing member; providing an integrated pickling chamber and a plasma cleaning chamber, transferring the chip and the substrate to a lifting device, driving the chip and the substrate to rise to the plasma cleaning chamber by the lifting device, and performing plasma cleaning on the chip and the substrate; driving the chip and the substrate to descend to the pickling chamber by the lifting device, driving a water spraying assembly in the pickling chamber to move above the chip and the substrate, and uniformly spraying pickling liquid on the chip and the substrate; taking out the chip and the substrate; pressing the substrate and the chip to a second layer board, the first layer board and the second layer board are respectively located on opposite sides of the chip; manufacturing a circuit on the first layer board and the second layer board, and welding components and elements. The application can improve production efficiency.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of circuit board production, and particularly relates to a production process of embedded circuit board. BACKGROUND

[0002] The embedded circuit board is a special electronic device integrating microprocessors, memories, input / output interfaces and other functional modules on a circuit board. It has high integration and can realize complex functions in limited space. In the conventional method for manufacturing the embedded circuit board, the chips are usually positioned by using adhesive tape, and then are pressed. Residual glue is generated after the first pressing, which will affect the second pressing. Therefore, the chips after the first pressing need to be cleaned. In the prior art, the plasma cleaning and the acidic process use different devices, resulting in low production efficiency. SUMMARY

[0003] The present application aims to solve at least one of the above technical problems in the prior art. To this end, the present application provides a production process of embedded circuit board, which can improve production efficiency.

[0004] According to the production process of embedded circuit board, the base hole is provided on the substrate, and the base hole is used to accommodate the chip. The substrate and the chip are positioned by using the fixing member, and the substrate and the chip are pressed onto the first layer plate. The fixing member is removed. An integrated acid washing chamber and plasma cleaning chamber are provided. The chip and the substrate are transferred to the lifting device. The lifting device drives the chip and the substrate to rise into the plasma cleaning chamber, and the chip and the substrate are plasma cleaned. The lifting device drives the chip and the substrate to descend into the acid washing chamber. The water spraying assembly in the acid washing chamber is driven to move above the chip and the substrate. The acid washing liquid is uniformly sprayed onto the chip and the substrate. The chip and the substrate are taken out. The substrate and the chip are pressed onto the second layer plate. The first layer plate and the second layer plate are respectively located on the opposite sides of the chip. The laser is used to drill the pin hole on the first layer plate and the second layer plate. The pin hole is used to expose the pin of the chip. The electroplating is used to fill the hole to form the conductive layer in the pin hole. The circuit is made on the first layer plate and the second layer plate, and the components are welded.

[0005] According to the embodiment of the present application, at least the following advantages are achieved: the fixing member is used to fix the chip and the substrate when the first compression is carried out, and after the fixing member is removed, the residual glue is left on the chip and the substrate, so the high-energy active particles are used to remove the organic contaminants and the small particles on the surface by the plasma cleaning, the organic layer which may hinder the contact of the acid solution is removed, the acid cleaning reaction is more uniform and thorough, and then the acid solution is used to dissolve the inorganic contaminants such as the metal oxide and the rust. The organic and inorganic contaminants are effectively removed by the stage processing. The quality of the subsequent electroplating and compression is ensured. The acid cleaning and the plasma cleaning of the chip and the substrate are completed on the lifting device, the long-distance transportation between different devices is avoided, and the production efficiency is effectively improved.

[0006] According to some embodiments of the present application, transferring the chip and the substrate to the lifting device in the acid cleaning chamber comprises: controlling the lifting device to descend until the bearing platform on the lifting device is lowered into the acid cleaning chamber, opening the box door on the side of the acid cleaning chamber, placing the chip and the substrate on the substrate table above the bearing platform, and closing the box door.

[0007] According to some embodiments of the present application, driving the chip and the substrate to ascend into the plasma cleaning chamber by the lifting device comprises: controlling the lifting device to ascend, moving the bearing platform on the lifting device to abut against the partition plate between the plasma cleaning chamber and the acid cleaning chamber, and moving the substrate table above the bearing platform into the partition hole in the center of the partition plate.

[0008] According to some embodiments of the present application, the plasma cleaning of the chip and the substrate comprises: controlling the air extraction device connected with the acid cleaning chamber to extract the air in the acid cleaning chamber and extract the air in the plasma cleaning chamber through the air vent hole on the partition plate, injecting the process gas into the plasma cleaning chamber, and electrifying the electrodes on the top end of the plasma cleaning chamber and the bearing platform to ionize the process gas into plasma.

[0009] According to some embodiments of the present application, driving the chip and the substrate to descend into the acid cleaning chamber by the lifting device comprises: stopping the air extraction device, making the air pressure in the acid cleaning chamber equal to the atmospheric pressure, controlling the lifting device to descend, so that the bearing platform is separated from the partition plate and moves below the nozzle of the water spraying assembly.

[0010] According to some embodiments of the present application, driving the water spraying assembly in the acid cleaning chamber to move above the chip and the substrate comprises: controlling the output shaft of the rotating motor outside the acid cleaning chamber to rotate, the output shaft drives the spray pipe of the water spraying assembly in the acid cleaning chamber to swing horizontally, and controlling the nozzle on the spray pipe to move above the substrate table on the lifting device.

[0011] According to some embodiments of the present application, the lower end of the pickling chamber is vertically connected with a water inlet pipe, the upper end of the water inlet pipe extends into the pickling chamber. The lower end of the water inlet pipe is provided with a mounting plate for closing the lower end of the water inlet pipe, a rotary motor 802 is bolted below the mounting plate, the output shaft penetrates through the mounting plate, a rotary seal is arranged between the output shaft and the mounting plate, the output shaft penetrates the water inlet pipe, the spray pipe is rotatably mounted on the water inlet pipe, the inner wall of the spray pipe is provided with a square groove, and the upper end of the output shaft is embedded in the groove to drive the spray pipe to rotate.

[0012] According to some embodiments of the present application, uniformly spraying the pickling solution onto the chip and the substrate includes: controlling the horizontal rotation of the chip and the substrate on the lifting device, controlling the reciprocating movement of the nozzle on the spray pipe by the rotary motor, and the nozzle movement path passes through the rotation axis of the substrate table, sequentially inputting the pickling solution and deionized water into the water inlet pipe, and controlling the exhaust device to exhaust the accumulated liquid in the pickling chamber.

[0013] According to some embodiments of the present application, taking out the chip and the substrate includes: moving the nozzle on the spray pipe to exit above the substrate table by the rotary motor, then inputting dry inert gas into the pickling chamber, blowing the chip and the substrate dry, opening the door, and taking out the chip and the substrate.

[0014] According to some embodiments of the present application, after the welding of components is completed, the cleaning agent is used to remove the welding residues, and then the electrical performance detection and appearance inspection are performed.

[0015] Additional aspects and advantages of the present application will be given in part in the following description, and some additional aspects and advantages will become apparent from the following description or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0016] The present application will be further described below in conjunction with the drawings and examples, wherein:

[0017] Figure 1 The pickling chamber and the plasma cleaning chamber of an embodiment of the present application are shown in the sectional view;

[0018] Figure 2 The Figure 1 The enlarged view of A in FIG. 4;

[0019] Figure 3 The schematic view of the fixed member connecting the substrate and the chip of an embodiment of the present application is shown in FIG. 5;

[0020] Figure 4 The schematic view of the first layer plate pressing of an embodiment of the present application is shown in FIG. 6;

[0021] Figure 5A schematic view of the removal of the fixing member of one embodiment of the present application;

[0022] Figure 6 A schematic view of the pressing of the second layer board of one embodiment of the present application;

[0023] Figure 7 A schematic view of the air extraction device of one embodiment of the present application;

[0024] Figure 8 A schematic view of the water spraying assembly of one embodiment of the present application;

[0025] Figure 9 A schematic view of the pickling chamber of one embodiment of the present application. DETAILED DESCRIPTION

[0026] Embodiments of the present application are described in detail below with reference to the attached drawings, which show by way of example, embodiments in which the same or similar elements or elements having the same or similar functions are denoted by the same or similar reference numerals throughout the drawings. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present application, and are not to be understood as limiting the present application.

[0027] In the description of the present application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right, etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0028] In the description of the present application, if the meaning of several is more than one, the meaning of multiple is more than two, greater than, less than, more than, etc. are understood as not including the number, above, below, etc. are understood as including the number. If it is described as first, second, it is only for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or the order of technical features indicated.

[0029] In the description of the present application, unless otherwise explicitly limited, the words such as setting, mounting, connecting, etc. should be broadly understood, and the person skilled in the art can reasonably determine the specific meaning of the above words in the present application in combination with the specific content of the technical solution.

[0030] In the description of the application, the description of the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the application. In the description, the exemplary description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0031] Referring to Figures 1 to 9 An embodiment of the production process of the embedded circuit board of the application comprises the following steps:

[0032] A base hole 110 is formed on the base plate 100, the base hole 110 is used to accommodate the chip 200, the chip 200 is placed into the base hole 110, the fixing member 300 is used to position the base plate 100 and the chip 200, the fixing member 300 is selected from the commonly used high-temperature adhesive tape used for fixing in the process of electronic parts. The base plate 100 and the chip 200 are adhered to the fixing member 300 to play a fixing and positioning role, and the base plate 100 and the chip 200 are pressed and combined to the first layer plate 400. Generally, the lower end of the base plate 100 and the chip 200 is adhered to the fixing member 300, and the upper end of the base plate 100 and the chip 200 is pressed and combined to the first layer plate 400. Due to the fixing role of the fixing member 300, the position accuracy of the first layer plate 400, the base plate 100 and the chip 200 in the pressing process can be improved.

[0033] The fixing member 300 is removed. Since the fixing member 300 will affect the subsequent processing, the fixing member 300 needs to be removed. Since the removal of the fixing member 300 only needs to tear it off, the labor intensity is not high, so manual operation is adopted.

[0034] An acid pickling chamber 500 and a plasma cleaning chamber 700 are provided in an integrated manner, and the acid pickling chamber 500 and the plasma cleaning chamber 700 are connected through flanges and bolts. The chip 200 and the base plate 100 are transferred to the lifting device 600 in the acid pickling chamber 500, and the chip 200 and the base plate 100 are driven by the lifting device 600 to rise into the plasma cleaning chamber 700, and the chip 200 and the base plate 100 are subjected to plasma cleaning. Since the pressing process and the fixing member 300 will leave some residual glue on the chip 200 and the base plate 100, the chip 200 and the base plate 100 need to be cleaned to avoid affecting the subsequent processing.

[0035] The chip 200 and the substrate 100 are lowered into the pickling chamber 500 by the lifting device 600, the water spraying assembly 800 in the pickling chamber 500 is driven to move above the chip 200 and the substrate 100, and the pickling liquid is uniformly sprayed onto the chip 200 and the substrate 100; the plasma cleaning is performed first and then the pickling is performed, the pollution is removed in stages, the high-energy active particles are used in the plasma cleaning to remove the organic pollutants such as surface grease, residual photoresist and small particles, the organic layer that may hinder the contact of the acid liquid is removed, the pickling reaction is more uniform and complete, the acid solution is used in the pickling to dissolve the inorganic pollutants such as metal oxides and rust, and the stage processing ensures that the organic and inorganic pollutants are effectively removed.

[0036] The chip 200 and the substrate 100 are taken out; after the pollutants are effectively removed, the chip 200 and the substrate 100 are moved to the next process.

[0037] The substrate 100 and the chip 200 are pressed onto the second layer plate 410, and the bonding strength and stability of the chip 200 and the substrate 100 are further ensured. The temperature, the pressure and the time are controlled to avoid material deformation caused by excessive pressing. The second layer plate 410 is located on the side of the chip 200 and the substrate 100 away from the first layer plate 400, and the first layer plate 400 and the second layer plate 410 are respectively located on the opposite sides of the chip 200; the chip 200 and the substrate 100 are embedded between the first layer plate 400 and the second layer plate 410.

[0038] According to the circuit design drawing, the drilling position and the hole diameter are determined, and a laser drilling machine is used to drill pin holes on the first layer plate 400 and the second layer plate 410, the pin holes are used to expose the pins of the chip 200; since the chip 200 is surrounded by the first layer plate 400 and the second layer plate 410, the holes need to be opened to electrically connect the pins of the chip 200.

[0039] The pin holes are electroplated to form a conductive layer, and the conductive layer is formed in the pin holes to enable the chip 200 to be connected to external circuits;

[0040] Circuits are made on the first layer plate 400 and the second layer plate 410, and components are welded.

[0041] The fixing member 300 is used to fix the chip 200 and the substrate 100 when the first compression is carried out, and after the fixing member 300 is removed, the residue glue is left on the chip 200 and the substrate 100. Therefore, the organic layer which may hinder the contact of the acid liquid is removed by using the plasma cleaning to remove the organic contaminants and the small particles by using the high-energy active particles, so that the acid cleaning reaction is more uniform and thorough, and then the acid cleaning is carried out to dissolve the inorganic contaminants such as the metal oxide and the rust by using the acidic solution. The phased processing ensures that the organic and inorganic contaminants are effectively removed. The quality of the subsequent electroplating and compression is ensured. Moreover, the acid cleaning and the plasma cleaning of the chip 200 and the substrate 100 are completed on the lifting device 600, which avoids the long-distance transfer between different devices and effectively improves the production efficiency.

[0042] With reference to Figures 1 to 5 As shown in FIG. 1, it can be understood that the chip 200 and the substrate 100 are transferred to the lifting device 600 in the acid cleaning chamber 500, and the specific steps include the following: the lifting device 600 is selected from common driving modes such as the air cylinder, the electric push rod or the motor lead screw to realize the vertical lifting, the main body of the lifting device 600 is arranged in the closed shell, the shell is bolted to the bottom of the acid cleaning chamber 500. The telescopic end of the lifting device 600 penetrates through the shell and is connected with the bearing platform 610. The telescopic end of the lifting device 600 and the shell are sealed by the sliding sealing ring. The shell is used to prevent the acid cleaning liquid from damaging the lifting device 600, the bearing platform 610 is horizontally arranged to be used for mounting the substrate table 620, the substrate table 620 is used to support the chip 200, and the substrate table 620 is usually made of an insulating material to meet the process requirements of the plasma cleaning. The lifting device 600 is controlled to be lowered until the bearing platform 610 on the lifting device 600 is lowered into the acid cleaning chamber 500, the box door 510 on the side of the acid cleaning chamber 500 is opened, the chip 200 and the substrate 100 are placed on the substrate table 620 above the bearing platform 610 by the transfer of the artificial or mechanical arm, and the box door 510 on the side of the acid cleaning chamber 500 is closed. The box door 510 is arranged to form a closed environment for the acid cleaning chamber 500 after the box door 510 is closed to facilitate the vacuumization.

[0043] With reference to Figures 4 to 9As shown, it can be understood that the chip 200 and the substrate 100 are lifted into the plasma cleaning chamber 700 by the lifting device 600, including the following steps: control the lifting device 600 to lift, the plasma cleaning chamber 700 is located above the pickling chamber 500, and the plasma cleaning chamber 700 and the pickling chamber 500 are separated by the partition plate 900. The carrier platform 610 is moved to abut the partition plate hole 910 in the partition plate 900 between the plasma cleaning chamber 700 and the pickling chamber 500, and the substrate table 620 is moved to the partition plate hole 910 in the center of the partition plate 900. The size of the carrier platform 610 is larger than the size of the partition plate hole 910, and the carrier platform 610 is aligned with the partition plate hole 910 in the vertical direction, so that the upper edge of the carrier platform 610 abuts the partition plate 900 to prevent electromagnetic field leakage from the plasma cleaning chamber 700 into the pickling chamber 500. The chip 200 and the substrate 100 on the substrate table 620 are lifted into the plasma cleaning chamber 700 through the partition plate hole 910.

[0044] Referring to Figures 1 to 9 As shown, it can be understood that the chip 200 and the substrate 100 are plasma cleaned, including the following steps: control the air exhaust device 920 connected with the pickling chamber 500 to exhaust air in the pickling chamber 500, control the air exhaust device 920 to exhaust air in the plasma cleaning chamber 700 through the plurality of ventilation holes on the partition plate 900, the ventilation holes on the partition plate 900 are used to communicate the plasma cleaning chamber 700 and the pickling chamber 500, the diameter of a single ventilation hole is less than 1mm, the electromagnetic field in the plasma cleaning chamber 700 cannot enter the pickling chamber 500 through the ventilation hole, and the smoke generated by the plasma cleaning can also be discharged from the ventilation hole. The plasma cleaning chamber 700 is connected with an air pipe. Process gas is injected into the plasma cleaning chamber 700 through the air pipe, the process gas is selected from hydrogen, argon or nitrogen, the electrodes at the top of the plasma cleaning chamber 700 and the electrodes inside the carrier platform 610 are powered by a radio frequency power source, so that the process gas becomes plasma and bombards the surface of the chip 200 and the substrate 100 through the plasma. Remove organic matter such as residue on the surface of the chip 200 and the substrate 100.

[0045] Referring to Figures 1 to 9As shown, it can be understood that the lowering of the chip 200 and the substrate 100 into the pickling chamber 500 by the lifting device 600 includes the following steps: cutting off the RF power supply, stopping the air pumping device 920, injecting nitrogen into the plasma cleaning chamber 700 through the air pipe, and protecting the chip 200 and the substrate 100 from oxidation by oxygen in the air during pickling. The air pressure in the pickling chamber 500 is equal to the atmospheric pressure, the lifting device 600 is controlled to lower, the carrier platform 610 is separated from the partition plate 900, and the substrate table 620 is moved to a height lower than the nozzle 801 of the water spraying assembly 800. The substrate table 620 is moved into the pickling chamber 500 to facilitate the pickling step.

[0046] Referring to Figures 1 to 9 As shown, it can be understood that the driving of the water spraying assembly 800 in the pickling chamber 500 to move above the chip 200 and the substrate 100 includes the following steps: controlling the rotary motor 802 to rotate the output shaft 803, the output shaft 803 is inserted into the water inlet pipe 810 and then drives the spray pipe 820 located in the pickling chamber 500 to rotate, and the nozzle 801 on the spray pipe 820 is controlled to move above the substrate table 620. The lower end of the pickling chamber 500 is vertically connected with the water inlet pipe 810, and the water spraying assembly 800 is composed of the water inlet pipe 810 and the spray pipe 820. The upper end of the water inlet pipe 810 extends into the pickling chamber 500. The lower end of the water inlet pipe 810 is provided with a mounting plate for closing the lower end of the water inlet pipe 810. The rotary motor 802 is bolted below the mounting plate, the output shaft 803 vertically penetrates the mounting plate into the water inlet pipe 810, the upper end of the output shaft of the rotary motor 802 extends out of the upper end of the water inlet pipe 810, and a rotary seal is arranged between the output shaft 803 and the mounting plate. The rotary seal is a prior art and will not be described in detail. The output shaft 803 is inserted into the water inlet pipe 810, the spray pipe 820 is rotatably mounted on the water inlet pipe 810, and the inner wall of the spray pipe 820 is provided with a square groove, and the upper end of the output shaft 803 is embedded in the groove to drive the spray pipe 820 to rotate. One part of the spray pipe 820 is vertically sleeved on the outer wall of the water inlet pipe 810, and the other part extends horizontally, and the nozzle 801 is arranged on the side wall of the part of the spray pipe 820 away from the water inlet pipe 810. The rotary motor 802 is arranged outside the pickling chamber 500, which can avoid corrosion of the pickling liquid to the rotary motor 802, improve the service life of the rotary motor 802, and also has the advantages of being convenient to replace.

[0047] Referring to Figures 1 to 8As shown, it can be understood that uniformly spraying the pickling solution on the chip 200 and the substrate 100 includes the following steps: controlling the bearing motor 611 on the bearing platform 610 to drive the substrate table 620 on the bearing platform 610 to rotate horizontally, controlling the nozzle 801 on the spray pipe 820 to reciprocate by the rotating motor 802, and the reciprocating path of the nozzle 801 passes through the rotation axis of the substrate table 620 and the edge of the substrate table 620, inputting the pickling solution into the water inlet pipe 810, the pickling solution passes through the spray pipe 820 and is sprayed downward from the nozzle 801, after flushing for 2 minutes, inputting deionized water into the water inlet pipe 810, the deionized water passes through the spray pipe 820 and is sprayed downward from the nozzle 801, and the residual pickling solution is flushed clean. The gas extraction device 920 extracts the accumulated liquid in the pickling chamber 500. The substrate table 620 is rotatably installed on the bearing platform 610, and the bearing motor 611 of the bearing platform 610 drives the substrate table 620 to rotate. The specific structure and installation method of the bearing motor 611 are prior art, and therefore will not be described in detail. The nozzle 801 passes through the center of the substrate table 620 during movement, and cooperates with the rotation of the substrate table 620, so that the pickling solution sprayed by the nozzle 801 can uniformly flush the chip 200 and the substrate 100 on the substrate table 620 clean. The gas extraction device 920 includes a temporary storage tank 921 and a vacuum pump 922. The vacuum pump 922 is used to extract the gas in the temporary storage tank 921. The temporary storage tank 921 is in communication with the bottom of the pickling chamber 500 through the gas extraction pipe 923. The gas extraction device 920 can extract both liquid and gas by adopting this structure. The gas extraction device 920 extracts the waste liquid after cleaning during the pickling process, and extracts the gas to generate a vacuum during the plasma cleaning process.

[0048] Referring to Figures 5 to 9 As shown, it can be understood that taking out the chip 200 and the substrate 100 includes the following steps: stopping the bearing motor 611, moving the nozzle 801 on the spray pipe 820 to a position avoiding the substrate table 620 in the up-down direction by the rotating motor 802, injecting dry inert gas such as nitrogen into the plasma cleaning chamber 700 through the gas pipe, then the dry inert gas is introduced into the pickling chamber 500 through the ventilation hole of the partition plate 900, starting to dry the chip 200 and the substrate 100, and the gas extraction device 920 extracts the humid inert gas. Open the door 510 and take out the chip 200 and the substrate 100. The nozzle 801 and the spray pipe 820 can be moved to a position that does not affect the lifting of the substrate table 620, providing sufficient vertical space for taking out the chip 200 and the substrate 100 and subsequently placing the chip 200 and the substrate 100.

[0049] It can be understood that the hole filling by electroplating includes the following steps: cleaning the hole wall with a chemical cleaning agent to ensure good bonding between the electroplated layer and the hole wall, and depositing metal in the hole by an electroplating process.

[0050] It can be understood that after the welding component is completed, the cleaning agent is used to remove the welding residues, and then the electrical performance detection and appearance inspection are performed.

[0051] The above describes the embodiments of the present application in detail in combination with the drawings, but the present application is not limited to the above-described embodiments, and various changes can be made within the knowledge range possessed by those skilled in the art without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A production process of an embedded circuit board, characterized by, The application relates to a chip and substrate positioning and processing method. A base hole (110) is formed on a substrate (100), and the base hole (110) is used for accommodating a chip (200); The substrate (100) and the chip (200) are positioned by using a fixing member (300), and the substrate (100) and the chip (200) are pressed to a first layer plate (400); The fixing member (300) is removed; An integrated pickling chamber (500) and plasma cleaning chamber (700) are provided, the chip (200) and the substrate (100) are transferred to a lifting device (600), the chip (200) and the substrate (100) are lifted to the plasma cleaning chamber (700) by the lifting device (600), and the chip (200) and the substrate (100) are subjected to plasma cleaning; The chip (200) and the substrate (100) are lowered to the pickling chamber (500) by the lifting device (600), a water spraying assembly (800) in the pickling chamber (500) is driven to move above the chip (200) and the substrate (100), and pickling liquid is uniformly sprayed on the chip (200) and the substrate (100); The chip (200) and the substrate (100) are taken out; The substrate (100) and the chip (200) are pressed to a second layer plate (410), and the first layer plate (400) and the second layer plate (410) are located on opposite sides of the chip (200) respectively; A pin hole is drilled on the first layer plate (400) and the second layer plate (410) by using laser, and the pin hole is used for exposing a pin of the chip (200); A conductive layer is formed in the pin hole by electroplating; Circuit is made on the first layer plate (400) and the second layer plate (410), and components are welded.

2. The production process of the embedded circuit board according to claim 1, characterized by: The chip (200) and the substrate (100) are transferred to the lifting device (600) in the pickling chamber (500), the lifting device (600) is controlled to descend until the carrying platform (610) on the lifting device (600) is lowered into the pickling chamber (500), the box door (510) on the side of the pickling chamber (500) is opened, the chip (200) and the substrate (100) are placed on the substrate table (620) above the carrying platform (610), and the box door (510) is closed.

3. The production process of the embedded circuit board according to claim 1, characterized by: The chip (200) and the substrate (100) are lifted to the plasma cleaning chamber (700) by the lifting device (600), the lifting device (600) is controlled to ascend, the carrying platform (610) on the lifting device (600) is moved to abut against the partition plate (900) between the plasma cleaning chamber (700) and the pickling chamber (500), and the substrate table (620) above the carrying platform (610) is moved into the partition plate hole (910) in the center of the partition plate (900).

4. The production process of the embedded circuit board according to claim 3, characterized by: The plasma cleaning of the chip (200) and the substrate (100) comprises: controlling the air extraction device (920) in communication with the pickling chamber (500) to extract air in the pickling chamber (500) and through the air vent hole on the partition plate (900) to extract air in the plasma cleaning chamber (700), injecting process gas into the plasma cleaning chamber (700), and electrifying the electrode at the top of the plasma cleaning chamber (700) and the electrode of the bearing platform (610) to ionize the process gas into plasma.

5. The production process of the embedded circuit board according to claim 3, characterized by: The lowering of the chip (200) and the substrate (100) into the pickling chamber (500) by the lifting device (600) comprises: stopping the air extraction device (920), equalizing the air pressure in the pickling chamber (500) with the atmospheric pressure, and controlling the lifting device (600) to lower, so that the bearing platform (610) is separated from the partition plate (900) and moves below the nozzle (801) of the water spraying assembly (800).

6. The production process of the embedded circuit board according to claim 1, characterized by: The driving of the water spraying assembly (800) in the pickling chamber (500) to move above the chip (200) and the substrate (100) comprises: controlling the output shaft (803) of the rotary motor (802) outside the pickling chamber (500) to rotate, the output shaft (803) drives the spray pipe (820) of the water spraying assembly (800) inside the pickling chamber (500) to swing horizontally, and controls the nozzle (801) on the spray pipe (820) to move above the substrate table (620) on the lifting device (600).

7. The production process of an embedded circuit board according to claim 6, characterized in that: The lower end of the pickling chamber (500) is vertically connected with the water inlet pipe (810), the upper end of the water inlet pipe (810) extends into the pickling chamber (500); the lower end of the water inlet pipe (810) is provided with a mounting plate for closing the lower end of the water inlet pipe (810), the rotary motor 802 is bolted below the mounting plate, the output shaft (803) penetrates the mounting plate, a rotary sealing element is arranged between the output shaft (803) and the mounting plate, the output shaft (803) penetrates the water inlet pipe (810), the spray pipe (820) is rotatably mounted on the water inlet pipe (810), and a square groove is arranged on the inner wall of the spray pipe (820), the upper end of the output shaft (803) is embedded in the groove to drive the spray pipe (820) to rotate.

8. The production process of an embedded circuit board according to claim 6, characterized by: The uniform spraying of the pickling liquid onto the chip (200) and the substrate (100) comprises: controlling the horizontal rotation of the chip (200) and the substrate (100) on the lifting device (600), controlling the nozzle (801) on the spray pipe (820) to reciprocate by the rotary motor (802), and the nozzle (801) moves along a path passing through the rotation axis of the substrate table (620), sequentially inputting the pickling liquid and the deionized water into the water inlet pipe (810), and controlling the air extraction device (920) to extract the accumulated liquid in the pickling chamber (500).

9. The production process of an embedded circuit board according to claim 6, characterized in that: The chip (200) and the substrate (100) are taken out, including: moving the nozzle (801) on the spray pipe (820) to above the substrate table (620) by the rotary motor (802), then blowing the chip (200) and the substrate (100) dry by introducing dry inert gas into the pickling chamber (500), opening the box door (510), and taking out the chip (200) and the substrate (100).

10. The production process of an embedded circuit board according to claim 1, characterized by: After the welding component is completed, the cleaning agent is used to remove the welding residue, and then the electrical performance detection and appearance inspection are carried out.

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