Antenna module and high-frequency module

Abstract

An antenna module disclosed in an embodiment of the present invention comprises: a substrate to which a first antenna is coupled; the low-pass filtering part is arranged in one part of the substrate; the first transmission line is connected with the first antenna and the low-pass filtering part, and the low-pass filtering part comprises a first conductive layer and is provided with a first pattern, a second pattern and a third pattern; a second conductive layer having a ground pattern having a gap from the first conductive portion, the second conductive portion, and the third conductive portion; a third conductive layer having a fourth pattern facing the first pattern and a fifth pattern facing the third pattern; a fourth conductive layer having a linear sixth pattern and a linear seventh pattern; and first to third dielectric layers between the first to fourth conductive layers. The first and third patterns of the first conductive layer, the fourth and fifth patterns of the third conductive layer, and the first and second dielectric layers form first and second capacitors, and the second, sixth and seventh patterns have a linear shape and may form first to third inductors.

Description

Technical Field

[0001] The present invention relates to an antenna module having Wi-Fi and Bluetooth antennas and a high-frequency module having the antenna module. Background Art

[0002] Bluetooth communication is a series of chips and antennas, and refers to a device that communicates in a frequency band of about 2.4 GHz to 2.5 GHz within a range of about 10 meters to 100 meters according to the Bluetooth wireless interface standard. Wi-Fi (Wireless Fidelity) refers to a device that communicates in a range of about 2.4 GHz to 2.5 GHz or 5 GHz, such as a short-range communication device, and enables wireless Internet access using radio waves or infrared transmission methods at a location where a wireless access point (AP: access point) is installed, or enables direct connection (Wi-Fi Direct) with other Wi-Fi modules under the P2P concept.

[0003] These Bluetooth modules and Wi-Fi modules were previously configured as independent (separate) modules and installed in electronic products. Therefore, when it is necessary to install both a BT module and a Wi-Fi module in a specific electronic product, various problems may occur in terms of product miniaturization, system stability, etc. Both the Bluetooth module and the Wi-Fi module are devices that communicate via RF signals, and there are components that can be commonly included in each other. However, when configured as independent modules, these components may be used redundantly. Therefore, it may hinder product miniaturization, result in social waste of electronic components, and cause system instability due to redundant configuration of components.

[0004] In addition, although Bluetooth uses channels that overlap with those of Wi-Fi, it does not use the frequency band of 5 GHz to 6 GHz. Therefore, a Bluetooth antenna requires a filter that can filter the frequency band of 5 GHz to 6 GHz, but if a circuit is composed of passive components, the size may increase and the price competitiveness may decrease. Summary of the Invention

[0005] Technical Problem

[0006] Embodiments of the present invention provide a novel antenna module capable of solving the above problems. Embodiments of the present invention provide an antenna module having a Bluetooth filter built in a substrate without using passive components. Embodiments of the present invention provide an antenna module having a low-pass filter built in a substrate and connected to a Bluetooth antenna without using passive components.

[0007] Technical Solution

[0008] An antenna module according to an embodiment of the present invention includes: a substrate, a first antenna coupled to the substrate; a low-pass filter unit built into a part of the substrate; and a first transmission line connecting the first antenna and the low-pass filter unit, wherein the low-pass filter unit includes a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer, and first dielectric layers, second dielectric layers, and third dielectric layers disposed between the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer, respectively, wherein the first conductive layer includes a first pattern having a first conduction part, a second pattern connecting between one end of the first pattern and a second conduction part, and a third pattern connected to a third conduction part, wherein the second conductive layer has a ground pattern having a gap with the first conduction part, the second conduction part, and the third conduction part inside, wherein the third conductive layer includes a fourth pattern facing the first pattern and a fifth pattern spaced apart from the fourth pattern and facing the second conduction part and the third pattern, wherein the fourth conductive layer includes a sixth pattern connecting between the second conduction part inside and a ground conduction part and a seventh pattern connecting between the second conduction part and the third conduction part, wherein the first pattern and the third pattern of the first conductive layer, the fourth pattern and the fifth pattern of the third conductive layer, and the first dielectric layer and the second dielectric layer form a first capacitor and a second capacitor, and the second pattern, the sixth pattern, and the seventh pattern have a wire shape and can form a first inductor, a second inductor, and a third inductor.

[0009] According to an embodiment of the present invention, the first pattern and the third pattern of the first conductive layer and the fourth pattern and the fifth pattern of the third conductive layer may have a polygonal plate shape.

[0010] According to an embodiment of the present invention, the upper surface area of the fifth pattern may be smaller than the upper surface area of the third pattern and larger than the upper surface area of the first pattern. The upper surface area of the third pattern may be smaller than the upper surface area of the first pattern.

[0011] According to an embodiment of the present invention, the first conductive layer may include a first input / output pattern connected to the other end of the first pattern and the first transmission line and a second input / output pattern connected to the second pattern and a second transmission line on the other side of the low-pass filter unit.

[0012] According to an embodiment of the present invention, the length of the sixth pattern may be longer than the length of the second pattern. The number of bends of the sixth pattern may be greater than the number of bends of the second pattern and the seventh pattern.

[0013] According to an embodiment of the present invention, the first capacitor may have a first capacitance generated by the first dielectric layer between the first pattern of the first conductive layer and a first circular pattern connected to the first conduction part of the second conductive layer, and a second capacitance generated by the second dielectric layer between the first circular pattern and the fourth pattern.

[0014] According to an embodiment of the present invention, the second capacitor may be connected to the fifth pattern, the third circular pattern connected to the third conduction part of the second conductive layer, and the third pattern of the first conductive layer through the third conduction part connected to the seventh pattern of the fourth conductive layer, and the second capacitor may include a third capacitance between the third circular pattern and the fourth pattern, and a fourth capacitance generated by the first dielectric layer between the fifth pattern and the third circular pattern.

[0015] According to an embodiment of the present invention, the second capacitor may include a fifth capacitance generated by the first dielectric layer between the first conduction part of the first conductive layer and the second circular pattern connected to the second conduction part of the second conductive layer, and a sixth capacitance generated by the second dielectric layer between the second circular pattern and the fourth circular pattern connected to the second conduction part of the third conductive layer. The third capacitance and the fifth capacitance may be connected in parallel with each other, and the fourth capacitance and the sixth capacitance may be connected in parallel with each other.

[0016] According to an embodiment of the present invention, the antenna module includes: a Wi-Fi module connected to a low-pass filtering unit through a second transmission line; and a second antenna connected to the Wi-Fi module, wherein the first antenna may be a Bluetooth antenna, and the second antenna may be a Wi-Fi antenna. The low-pass filtering unit may pass a frequency band from 2402 MHz to 2480 MHz and filter a frequency band from 5 GHz to 6 GHz.

[0017] A high-frequency module according to an embodiment of the present invention includes a low-pass filter section. In the low-pass filter section, a first input / output pattern is electrically connected to a Bluetooth antenna, and a second input / output pattern is electrically connected to a Wi-Fi module. The low-pass filter section includes: a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer; dielectric layers respectively disposed between the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer; and a plurality of conduction portions vertically penetrating the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, and the dielectric layers and selectively connecting patterns of different conductive layers. Among them, the dielectric layer disposed between the side patterns of the first conductive layer, the second conductive layer, and the third conductive layer faces the side patterns of the first conductive layer, the second conductive layer, and the third conductive layer and forms a first capacitor connected in parallel to a first branch node connected to the first input / output pattern. The first line pattern of the first conductive layer forms a first inductor connected in series to the first branch node. The second line pattern of the fourth conductive layer forms a second inductor connected in parallel from a third branch node connected to the other end of the first inductor. The third line pattern of the fourth conductive layer forms a third inductor connected in parallel from a second branch node connected to the second input / output pattern and the third branch node. And the dielectric layer disposed between the other side patterns of the first conductive layer, the second conductive layer, and the third conductive layer faces the other side patterns of the first conductive layer, the second conductive layer, and the third conductive layer and forms a second capacitor connected in series to the third inductor. And the other end of the first capacitor, the other end of the second inductor, and the other end of the second capacitor can be connected to a ground pattern.

[0018] According to an embodiment of the present invention, the low-pass filter section can pass a frequency band from 2402 MHz to 2480 MHz and filter a frequency band from 5 GHz to 6 GHz. Each of the first branch node, the second branch node, and the third branch node can be formed by a conduction portion arranged within the low-pass filter section.

[0019] Advantageous Effects

[0020] The present invention can reduce the size of the antenna module by integrating a filter into the substrate without using inductor components and capacitor components. The present invention can also reduce the cost of the antenna module. In addition, by connecting a low-pass filter (LPF: low-pass filter) built into the substrate of the antenna module to the Bluetooth antenna, a frequency band from 5 GHz to 6 GHz can be filtered, and the insertion loss characteristic of the frequency band from 5 GHz to 6 GHz can be configured to meet below -3 dB. Description of the Drawings

[0021] Figure 1 is a block diagram of an antenna module according to an embodiment of the present invention.

[0022] Figure 2 is a plan view of a part of the antenna module shown Figure 1 herein.

[0023] Figure 3 is a perspective view of the low-pass filter section shown Figure 2 herein.

[0024] Figure 4 is Figure 3 a side view of the other side of the low-pass filter section shown

[0025] Figure 5 an example of the circuit configuration of a low-pass filter according to the present invention.

[0026] Figure 6 is Figure 3 an exploded perspective view of the low-pass filter section shown

[0027] Figure 7 is a view showing Figure 6 the pattern shapes of the first to fourth conductive layers of the low-pass filter section shown

[0028] Figure 8 is Figure 3 an example of the A-A side cross-section of the low-pass filter section shown

[0029] Figure 9 is Figure 3 an example of the B-B side cross-section of the low-pass filter section shown

[0030] Figure 10 is a graph showing the operating characteristics of the low-pass filter section of the antenna module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0031] Hereinafter, an antenna module according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The described embodiments are provided so that those skilled in the art can easily understand the technical concept of the present invention, but the present invention is not limited thereto. In addition, the content shown in the drawings is a schematic diagram for easily explaining the embodiments of the present invention and may be different from the actual implemented form. In the specification, unless specifically stated in a phrase, the singular also includes the plural. As used in the specification, the terms "comprising" and / or "including" do not exclude the presence or addition of one or more other components, steps, operations, and / or elements mentioned.

[0032] Figure 1 is a block diagram of an antenna module according to an embodiment of the present invention, Figure 2 is a plan view of a part of the antenna module shown Figure 1 herein, Figure 3 is a perspective view of the low-pass filter section shown Figure 2 herein,Figure 4 is Figure 3 the other side view of the low-pass filter section of Figure 5 an example of the circuit configuration of a low-pass filter according to the present invention, Figure 6 is Figure 3 the exploded perspective view of the low-pass filter section of Figure 7 shows Figure 6 the pattern shapes of the first to fourth conductive layers of the low-pass filter section of Figure 8 is Figure 3 an example of the A-A side cross-section of the low-pass filter section of Figure 9 is Figure 3 an example of the B-B side cross-section of the low-pass filter section of Figure 10 and is a graph showing the operating characteristics of the low-pass filter section of the antenna module according to an embodiment of the present invention.

[0033] Referring to Figure 1 , the antenna module includes a first antenna 210 for transmitting and receiving a first high-frequency signal, a low-pass filter section 100 connected to transmission lines 251 and 252 of the first antenna 210, a second antenna 220 for transmitting and receiving a second high-frequency signal, and a communication signal processing section 200 for generating and processing the transmission / reception signals of the first antenna 210 and the second antenna 220.

[0034] The first antenna 210 is a Bluetooth antenna, the second antenna 220 is a Wi-Fi antenna, and the communication signal processing section 200 can be implemented as a Wi-Fi module. The first high-frequency signal includes, for example, Bluetooth signals in the frequency band of 2402 MHz to 2480 MHz. The second high-frequency signal includes, for example, Wi-Fi signals in the frequency bands of 2400 MHz to 2483 MHz and 5 GHz to 6 GHz. Here, the first high-frequency signal uses channels overlapping with the low-frequency band (e.g., 2402 MHz to 2480 MHz) of the second high-frequency signal and does not use channels overlapping with the high-frequency band (e.g., 5 GHz to 6 GHz).

[0035] As Figures 2 to 4 shown, the low-pass filter section 100 is connected to the transmission lines 251 and 252 between the first antenna 210 and the communication signal processing section 200 and can pass the low-frequency band and filter the high-frequency band. The low-pass filter section 100 can be connected between the first transmission line 251 connected to the first antenna 210 and the second transmission line 252 connected to the communication signal processing section 200. The first transmission line 251 and the second transmission line 252 are feed lines for feeding signals.

[0036] The low-pass filter unit 100 can form a resonant circuit using an inductor and a capacitor, and the inductor and the capacitor can be implemented by patterns of a conductive layer and a dielectric layer instead of passive components. Therefore, since passive components are not used, the cost can be reduced, and the size of the low-pass filter unit 100 can be decreased.

[0037] The first antenna 210 and the second antenna 220 can be coupled to the substrate 250. The first antenna 210 can be coupled to the coupling portion 255 of the substrate 250, and the coupling portion 255 can be a coupling hole to which the lower coupling protrusion of the first antenna 210 is fastened. One of the coupling portions 255 of the substrate 250 can be connected to the first transmission line 251. In addition, the low-pass filter unit 100 can be built in the substrate 250 of the communication signal processing unit 200. The substrate 250 can be a multilayer substrate having a plurality of conductive layers.

[0038] As Figure 5 shown, the circuit configuration of the low-pass filter unit 100 is implemented as a passive filter having a first input / output port and a second input / output port for transmitting and receiving signals, and a first capacitor C1 is connected in parallel to a first branch node N1 connected to the first input / output port, and the other end of the first capacitor C1 is grounded. One end of a first inductor N1 is connected in series to the first branch node N1, and a third branch node N3 is connected to the other end of the first inductor N1, and one end of a second inductor L2 is connected in parallel to the third branch node N3, and the other end of the second inductor L2 is grounded.

[0039] A second branch node N2 connected to the second input / output port is connected in parallel to one end of a third inductor L3, and the other end of the third inductor L3 is connected in series to a second capacitor C2, and the other end of the second capacitor C2 is grounded. The second branch node N2 is connected in series to the third branch node N3. Here, the first input / output port can be connected to the first transmission line 251 or can be integrally formed therewith. The second input / output port can be connected to the second transmission line 252 or can be integrally formed therewith. The low-pass filter unit 100 passes a first frequency band (e.g., 2400 MHz to 2483 MHz) transmitted to the first input / output port and the second input / output port, and filters a second frequency band (e.g., 5 GHz to 6 GHz).

[0040] The first inductor L1, the second inductor L2, and the third inductor L3 may have a range of 0.5 nH to 4 nH and may have different inductances. For example, the first inductor L1 may have a range of 1.3 nH ± 0.2 nH, the second inductor L2 may have 2.7 nH ± 0.2 nH, and the third inductor L3 may have 1.5 nH ± 0.2 nH. The first capacitor C1 and the second capacitor C2 may have a range of 0.3 pF to 2.5 pF and may be different from each other. For example, the first capacitor C1 may have 0.9 pF ± 0.05 pF, and the second capacitor C2 may have 0.5 pF ± 0.01 pF.

[0041] As Figure 3 , Figure 4 , Figures 6 to 9 shown, the low-pass filter section 100 may be Figure 2 a part of the substrate 250 or a substrate area built in the substrate 250. The low-pass filter section 100 may include a plurality of conductive layers 110, 120, 130, and 140 and a plurality of dielectric layers 151, 152, and 153 respectively disposed between the plurality of conductive layers 110, 120, 130, and 140. The plurality of conductive layers 110, 120, 130, and 140 may be made of copper or may be a layer in which at least one plating layer is stacked on the surface of the copper material. The plating layer may include at least one of nickel, gold, tin, lead, palladium, silver, and mixtures thereof.

[0042] The materials of the dielectric layers 151, 152, and 153 may include at least one of insulating materials such as FR-4, CEM-1, RF-35, Teflon, polyimide, and PTEE (polytetrafluoroethylene). The dielectric layers 151, 152, and 153 may include the dielectrics of a capacitor, for example, Ta2O5, BaO4SrTi, and TiO2, as well as BaO, Al2O3, PbO, CaO, and B2O3. The plurality of conductive layers 110, 120, 130, and 140 may include a first conductive layer 110, a second conductive layer 120, a third conductive layer 130, and a fourth conductive layer 140 stacked from the upper surface to the lower surface of the substrate 250, and the plurality of dielectric layers 151, 152, and 153 may include a first dielectric layer 151, a second dielectric layer 152, and a third dielectric layer 153 disposed between the first conductive layer 110, the second conductive layer 120, the third conductive layer 130, and the fourth conductive layer 140, respectively. The first dielectric layer 151 and the second dielectric layer 152 may include the dielectrics of a capacitor, and the thickness of the second dielectric layer 152 may be greater than the thickness of the first dielectric layer 151. For example, the thicknesses of the first dielectric layer 151 and the third dielectric layer 153 may be formed to be 300 μm or less, for example, in the range of 100 μm to 300 μm, and the thickness of the second dielectric layer 152 may be formed to be 300 μm or more, for example, in the range of 300 μm to 500 μm.

[0043] The first dielectric layer 151 is disposed between the first conductive layer 110 and the second conductive layer 120, the second dielectric layer 152 is disposed between the second conductive layer 120 and the third conductive layer 130, and the third dielectric layer 153 is disposed between the third conductive layer 130 and the fourth conductive layer. The first conductive layer 110 may be exposed on the upper surface of the substrate, and the fourth conductive layer 140 may be exposed on the lower surface of the substrate.

[0044] As Figure 3 and Figure 4 shown, the width between the first side surface S1 and the third side surface S3 of the low-pass filter unit 100 may be smaller than the length between the second side surface S2 and the fourth side surface S4. Therefore, the conductive pattern of the inductor having a longer length may be arranged in the first direction (for example, the length direction) from the second side surface S2 toward the fourth side surface S4. In addition, the conductive pattern of the inductor having a shorter length may be arranged in the second direction (for example, the width direction) from the first side surface S1 toward the third side surface S3. The first conductive layer 110 may be exposed on the upper surface of the substrate, and the fourth conductive layer 140 may be exposed on the lower surface of the substrate. As Figure 4 shown, a part of the pattern 132 of the second conductive layer 140 may be exposed on the side surface S13.

[0045] As Figure 4 and Figure 6 shown, the first conductive layer 110 includes a first pattern 111, a second pattern 112, and a third pattern 119. The second conductive layer 120 has a ground pattern 121. The third conductive layer 130 includes a fourth pattern 131 and a fifth pattern 132 spaced apart from each other. And the fourth conductive layer 140 may include a sixth pattern 141 and a seventh pattern 142 connected to the first conduction part V2. The first pattern 111 and the second pattern 112 of the first conductive layer 110 are connected to a first conduction part V1 and a first conduction part V2 spaced apart in the first direction. The first pattern 111 is a plate-like pattern having a polygon, and the second pattern 112 is a linear pattern having a width narrower than the width of the plate-like pattern. The first pattern 111 has the first conduction part V1 inside thereof and is connected to one end of the second pattern 112, and the other end of the second pattern 112 is connected to the first conduction part V2. The second pattern 112 has a bent structure. For example, it has a bent structure of two or more times or three or more times. The second pattern 112 can increase or decrease the inductance value according to the shape and length of the bend. The length of the second pattern 112 and L1 may be in the range of 0.5 mm to 3 mm. Here, the length of the second pattern 112 and L1 is the length extending from one end to the other end. The width of the second pattern 112 and L1 may be in the range of 10 μm to 200 μm.

[0046] One end of the first pattern 111 is connected to the second pattern 112, and the other end is connected to the first input / output pattern 113. And the second pattern 112 and the second conduction part V2 are connected to the second input / output pattern 114. The first input / output pattern 113 and the second input / output pattern 114 are the first input / output port and the second input / output port. The second conduction part V2 has a circular pattern around it, and the diameter of the circular pattern may be greater than the width of the second pattern 112.

[0047] The third pattern 119 is a plate-shaped pattern having a third conduction part V3 and can be spaced apart from the first pattern 111 and the second pattern 112 in space. The third pattern 119 may have a polygonal shape. A hemispherical pattern may be formed along one side of the third conduction part V3. The upper surface area of the third pattern 119 may be smaller than the upper surface area of the first pattern 111. The third conduction part V3 is disposed between the fifth conduction part V5 and the seventh conduction part V7 in the first direction and may be closer to the seventh conduction part V7 than the fifth conduction part V5. At each corner of the first conductive layer 110, patterns 115, 116, 117, and 118 having fifth conduction parts V5 to eighth conduction parts V8 are provided, and the patterns 115, 116, 117, and 118 are physically separated from the first pattern 111, the second pattern 112, and the third pattern 119. The patterns 115, 116, 117, and 118 having fifth conduction parts V5 to eighth conduction parts V8 in the first conductive layer 110 may have a polygonal shape.

[0048] As Figure 6 and Figure 7 shown, the second conductive layer 120 is a ground pattern 121, and the ground pattern 121 includes a first circular pattern P1 connected to the first conduction part V1, a second circular pattern P2 connected to the first conduction part V2, and a third circular pattern P3 connected to the third conduction part V3. Each of the first circular pattern P1, the second circular pattern P2, and the third circular pattern P3 may be spaced apart from the ground pattern 121 by a predetermined gap Q1, Q2, and Q3. Each of the first circular pattern P1, the second circular pattern P2, and the third circular pattern P3 is not physically connected to the ground pattern 121. The ground pattern 121 is connected to the fifth conduction part V5 to the eighth conduction part V8 and may have a surface area larger than the surface area of the pattern of the first conductive layer 110 or larger than the surface area of the pattern of the third conductive layer 130.

[0049] The third conductive layer 130 includes a fourth pattern 131 connected to the first conduction part V1 and the second conduction part V2, and a fifth pattern 132 connected to the third conduction part V3. The fourth pattern 131 and the first pattern 111 of the first conductive layer 110 face each other on both sides of the ground pattern 121. The upper surface area of the fourth pattern 131 may be smaller than the upper surface area of the first pattern 111. The first conduction part V2 provided in the fifth pattern 132 may have a fourth circular pattern P4 and may be spaced apart from the fifth pattern 132 by a predetermined gap Q4. The fourth circular pattern P4 is not physically connected to the fifth pattern 132. The fifth pattern 132 may be connected to the third pattern 119 on the inside. The fifth pattern 132 faces the second pattern 111 and the third pattern 112 on both sides of the ground pattern 121. The fourth pattern 131 and the fifth pattern 132 may be implemented as plate-shaped patterns having a polygonal shape. The upper surface area of the fourth pattern 131 may be larger than the upper surface area of the first pattern 111 and may be larger than the upper surface area of the fifth pattern 132. Additionally, the upper surface area of the fifth pattern 132 may be larger than the upper surface area of the first pattern 111. Here, the polygonal shape may include a square.

[0050] The fifth conduction part V5 to the eighth conduction part V8 may be disposed at respective corners of the third conductive layer 130, and the fifth conduction part V5 to the eighth conduction part V8 of the third conductive layer 130 may have circular patterns. As Figure 8 and Figure 9 shown, the gaps Q1, Q2, Q3, and Q4 may be filled with a material of a dielectric layer. The fourth conductive layer 140 includes a sixth pattern 141 and a seventh pattern 142, and the sixth pattern 141 and the seventh pattern 142 are connected to the first conduction part V2. The sixth pattern 141 is a line pattern extending between the first conduction part V2 and the sixth conduction part V6 and may have a line shape including two or more bent structures. For example, it may have four or more bent structures.

[0051] The total length of the sixth pattern 141 may be greater than the total length of the second pattern 112. The number of bends of the sixth pattern 141 may be greater than the number of bends of the second pattern 112. For example, it may be two or more. The length of the sixth pattern 141 and L2 is 3 mm to 10 mm and represents the total length. The width of the sixth pattern 141 and L2 is 10 μm to 200 μm. The seventh pattern 142 is a line pattern connected between the first conduction part V2 and the third conduction part V3 and may have a line shape including one or more bent structures (for example, two or three or more bent structures). The length of the seventh pattern 142 and L3 is 0.5 mm to 3 mm and represents the total length. The width of the seventh pattern 142 and L3 is 10 μm to 200 μm.

[0052] The fifth through - conduction part V5 to the eighth through - conduction part V8 can be disposed at respective corners of the fourth conductive layer 140, and the fifth through - conduction part V5 to the eighth through - conduction part V8 of the fourth conductive layer 140 can have circular patterns. Here, the first capacitor C1 can include a first capacitance generated by a first dielectric layer 151 between a first pattern 111 of the first conductive layer 110 and a first circular pattern P1 of the second conductive layer 120, and a second capacitance generated by a second dielectric layer 152 between the first circular pattern P1 and a fourth pattern 131. The first pattern 111 of the first conductive layer 110 and the fourth pattern 131 of the third conductive layer 130 can act as opposite electrode terminals of the first capacitor. The first capacitance and the second capacitance can be connected in series. The first inductor L1 is implemented by a second pattern 112 connected between the first pattern 111 and the first through - conduction part V2. The first inductor L1 can have an inductance value that varies according to the length and / or area of the first pattern 111. The second pattern 112, the sixth pattern 116, and the seventh pattern 117 can each be a line pattern for an inductor. The second inductor L2 is implemented as a linear sixth pattern 141 connected between the first through - conduction part V2 and the sixth through - conduction part V6 of the fourth conductive layer 140, and the inductance value can vary according to the length and / or area of the sixth pattern 141. The second inductor L2 can be connected to the ground pattern 121 through the sixth through - conduction part V6. The inductance value of the sixth pattern 141 can be greater than the inductance value of the second pattern 112. The third inductor L3 is implemented as a linear seventh pattern 142 connected between the first through - conduction part V2 and the third through - conduction part V3, and the inductance value can vary according to the length and / or area of the seventh pattern 142. The inductance value of the seventh pattern 142 can be greater than the inductance value of the second pattern 112.

[0053] The second capacitor C2 can be formed by connecting via the third through - conduction part V3 connected to the seventh pattern 142 to a fifth pattern 132, a third circular pattern P3, and a third pattern 119. At this time, it can have a third capacitance generated by a first dielectric layer 151 between the third pattern 119 and the third circular pattern P3, and a fourth capacitance generated by a second dielectric layer 152 between the third circular pattern P3 and the fifth pattern 132. Additionally, the second capacitor C2 can have a fifth capacitance generated by a first dielectric layer 151 between the first through - conduction part V2 and a second circular pattern P2, and a sixth capacitance generated by a second dielectric layer 152 between the second circular pattern P2 and a fourth circular pattern P4. The third capacitance and the fourth capacitance can be connected in series, and the fifth capacitance and the sixth capacitance can be connected in series. The third capacitance and the fifth capacitance can be connected in parallel with each other, and the fourth capacitance and the sixth capacitance can be connected in parallel with each other. Therefore, the second capacitor C2 can have the third capacitance to the sixth capacitance generated by patterns on both sides of the first dielectric layer 151 and the second dielectric layer 152 and be connected in series to the seventh pattern 142.

[0054] Since the area of the first pattern 111 is larger than the area of the third pattern 119, and the area of the fourth pattern 131 is larger than the area of the fifth pattern 132, the capacitance of the second capacitor C2 can be smaller than the capacitance of the first capacitor C1.

[0055] As Figure 8 shown, the first pattern 111, the second circular pattern P2, and the fourth pattern 131 are connected to the first conduction part V1, and the second pattern 112, the second circular pattern P2, the fourth circular pattern P4, and the sixth pattern 141 are connected to the first conduction part V2. As Figure 9 shown, the third conduction part V3 is connected to the third pattern 119, the third circular pattern P3, the fifth pattern 132, and the seventh pattern 142. The fifth conduction part V5 is connected to the ground pattern 121 and can be connected to the conduction part patterns of the first conductive layer 110, the third conductive layer 130, and the fourth conductive layer 140. The fifth conduction part V5 may not be connected to the conduction part patterns of the third conductive layer 130 and the fourth conductive layer 140. That is, the fifth conduction part V5, the seventh conduction part V7, and the eighth conduction part V8 of the third conductive layer and the fourth conductive layer may be patterns arranged to support between the two dielectric layers. The seventh conduction part V7 can be connected to the ground pattern 121 and can be connected to the conduction part patterns of the first conductive layer 110, the third conductive layer 130, and the fourth conductive layer 140. Each of the first branch node N1, the second branch node N2, and the third branch node N3 may be formed by the first conduction part V1, the second conduction part V2, and the third conduction part V3 arranged in the low-pass filter part 100.

[0056] As another example of the present invention, Figure 6 the conductive layer / dielectric layer may be arranged in reverse. For example, the pattern of the first conductive layer 110 may be arranged in the pattern of the fourth conductive layer, the pattern of the second conductive layer 110 may be arranged in the pattern of the third conductive layer, the pattern of the third conductive layer 130 may be arranged in the pattern of the second conductive layer, and the pattern of the fourth conductive layer 140 may be implemented as the pattern of the first conductive layer. That is, Figure 6 the configuration disclosed in

[0057] The low-pass filter part 100 built in the substrate as described above may have as Figure 10The frequency response characteristics shown. In the S-parameters, S21 represents the insertion loss of the low-pass filter, and the magnitude of the signal output from the first input / output port is compared with the magnitude of the signal output from the second input / output port. It can be seen that the minimum value of -3 dB or less is satisfied in the frequency band from 5 GHz to 6 GHz. That is to say, it can be seen that the low-pass filter unit 100 exhibits a high filtering effect in the frequency band from 5 GHz to 6 GHz. The closer the insertion loss is to 0, the better the signal flow. In the S-parameters, S11 represents the reflection coefficient or return loss at the first input / output port, and S22 represents the reflection coefficient or return loss at the second input / output port. The frequencies of the transmission zeros (-22.41, -26.01) in the curves of S11 and S22 can be adjusted, and the transmission zero at 4.25 GHz is adjusted to be lower than the transmission zero at 2.45 GHz, and as much input power as possible is transmitted in the frequency band above 5 GHz, so that it can be set to values for bandwidth control and frequency suppression.

[0058] The antenna module according to an embodiment of the present invention is a Wi-Fi module having a Bluetooth antenna and a Wi-Fi antenna, and can be applied to a mobile phone, a television that receives high-frequency signals, and a high-frequency module of a mobile vehicle.

[0059] The features, structures, effects, etc. described in the above embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. In addition, the features, structures, effects, etc. exemplified in each embodiment can be combined, modified, and implemented by those skilled in the art with ordinary knowledge in the field to which the embodiment belongs in other embodiments. Therefore, the content related to such combination and modification should be interpreted as being included within the scope of the present invention.

[0060] In addition, although the embodiments have been described above, they are merely examples and do not limit the present invention, and those skilled in the art with ordinary knowledge in the field to which the present invention belongs will understand that various modifications and applications not exemplified above can be made without departing from the essential features of the embodiments. For example, each component specifically shown in the embodiments can be modified and implemented. And the differences related to such modification and application should be interpreted as being included within the scope of the present invention defined in the appended claims.

Claims

1. An antenna module, comprising: a substrate, with a first antenna bonded to the substrate; a low-pass filter section, which is built into a part of the substrate; and a first transmission line, which connects the first antenna and the low-pass filter section, wherein the low-pass filter section includes a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer, and a first dielectric layer, a second dielectric layer, and a third dielectric layer respectively disposed between the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer, wherein the first conductive layer includes a first pattern having a first conduction portion, a second pattern connected between one end of the first pattern and a second conduction portion, and a third pattern connected to a third conduction portion, wherein the second conductive layer has a ground pattern, and the ground pattern has a gap with the first conduction portion, the second conduction portion, and the third conduction portion inside, wherein the third conductive layer includes a fourth pattern facing the first pattern and a fifth pattern spaced apart from the fourth pattern and facing the second conduction portion and the third pattern, wherein the fourth conductive layer includes a sixth pattern connected between the second conduction portion inside and a ground conduction portion and a seventh pattern connected between the second conduction portion and the third conduction portion, wherein the first pattern and the third pattern of the first conductive layer, the fourth pattern and the fifth pattern of the third conductive layer, and the first dielectric layer and the second dielectric layer form a first capacitor and a second capacitor, and wherein the second pattern, the sixth pattern, and the seventh pattern are linear and form a first inductor, a second inductor, and a third inductor.

2. The antenna module according to claim 1, wherein The first pattern and the third pattern of the first conductive layer, and the fourth pattern and the fifth pattern of the third conductive layer have a polygonal plate shape.

3. The antenna module according to claim 2, wherein, The upper surface area of the fifth pattern is smaller than the upper surface area of the third pattern and larger than the upper surface area of the first pattern.

4. The antenna module according to claim 3, wherein, The upper surface area of the third pattern is smaller than the upper surface area of the first pattern.

5. The antenna module according to claim 4, wherein, The first conductive layer includes a first input / output pattern connected to the other end of the first pattern and the first transmission line, and a second input / output pattern connected to the second pattern and a second transmission line on the other side of the low-pass filter section.

6. The antenna module according to claim 5, wherein, The length of the sixth pattern is longer than the length of the second pattern.

7. The antenna module according to claim 6, wherein, The number of bends of the sixth pattern is greater than the number of bends of the second pattern and the seventh pattern.

8. The antenna module according to any one of claims 1 to 7, wherein, The first capacitor has a first capacitance generated by the first dielectric layer between the first pattern of the first conductive layer and a first circular pattern connected to the first conduction portion of the second conductive layer, and a second capacitance generated by the second dielectric layer between the first circular pattern and the fourth pattern.

9. The antenna module according to any one of claims 1 to 7, Among them, The second capacitor is connected to the fifth pattern, the third circular pattern connected to the third conduction part of the second conductive layer, and the third pattern of the first conductive layer through a third conduction part connected to the seventh pattern of the fourth conductive layer. Wherein, the second capacitor includes a third capacitance between the third circular pattern and the fourth pattern, and a fourth capacitance generated by a first dielectric layer between the fifth pattern and the third circular pattern.

10. The antenna module according to claim 9, wherein, The second capacitor includes a fifth capacitance generated by a first dielectric layer between the first conduction part of the first conductive layer and a second circular pattern connected to the second conduction part connected to the second conductive layer, and a sixth capacitance generated by a second dielectric layer between the second circular pattern and a fourth circular pattern connected to the second conduction part connected to the third conductive layer.

11. The antenna module according to claim 10, wherein, The third capacitance and the fifth capacitance are connected in parallel with each other, and the fourth capacitance and the sixth capacitance are connected in parallel with each other.

12. The antenna module according to any one of claims 1 to 7, comprising: A Wi-Fi module, the Wi-Fi module being connected to the low-pass filtering part through a second transmission line; And A second antenna, the second antenna being connected to the Wi-Fi module, Wherein, the first antenna is a Bluetooth antenna, Wherein, the second antenna is a Wi-Fi antenna, Wherein, the low-pass filtering part allows a frequency band from 2402 MHz to 2480 MHz to pass through and filters a frequency band from 5 GHz to 6 GHz.

13. A high-frequency module, comprising: A low-pass filtering part, in the low-pass filtering part, a first input / output pattern is electrically connected to a Bluetooth antenna and a second input / output pattern is electrically connected to a Wi-Fi module, Wherein, the low-pass filtering part includes: a first conductive layer, a second conductive layer, a third conductive layer, and a fourth conductive layer; dielectric layers respectively disposed between the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer; and a plurality of conduction parts vertically penetrating the first conductive layer, the second conductive layer, the third conductive layer, the fourth conductive layer, and the dielectric layers and selectively connecting patterns of different conductive layers. Wherein, dielectric layers between side patterns of the first conductive layer, the second conductive layer, and the third conductive layer and side patterns of the first conductive layer, the second conductive layer, and the third conductive layer face each other and form a first capacitor connected in parallel to a first branch node connected to the first input / output pattern. Wherein, a first line pattern of the first conductive layer forms a first inductor connected in series to the first branch node. Wherein, a second line pattern of the fourth conductive layer forms a second inductor connected in parallel from a third branch node connected to the other end of the first inductor. Wherein, a third line pattern of the fourth conductive layer forms a third inductor connected in parallel from a second branch node connected to the second input / output pattern and the third branch node, and Among them, dielectric layers provided between patterns on the other sides of the first conductive layer, the second conductive layer, and the third conductive layer and the patterns on the other sides of the first conductive layer, the second conductive layer, and the third conductive layer face each other and form a second capacitor connected in series to the third inductor, and Among them, the other end of the first capacitor, the other end of the second inductor, and the other end of the second capacitor are connected to a ground pattern.

14. The high-frequency module according to claim 13, wherein, The low-pass filtering unit passes a frequency band from 2402 MHz to 2480 MHz and filters a frequency band from 5 GHz to 6 GHz.

15. The high-frequency module according to claim 14, wherein, Each of the first branch node, the second branch node, and the third branch node is formed by a conductive part provided in the low-pass filtering unit.

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