Dispensing height measuring mechanism of die bonder

Abstract

The invention relates to a dispensing height measurement mechanism of a die bonder, which comprises a workbench, a transmission assembly, a dispensing function head and a height measurement function head, the workbench is provided with a first vertical frame and a second vertical frame, the top of the first vertical frame is provided with an X-axis displacement mechanism, the output end of the X-axis displacement mechanism is provided with a Y-axis displacement mechanism, and the output end of the Y-axis displacement mechanism is provided with a Y-axis displacement mechanism; a Z-axis displacement mechanism is arranged at the output end of the Y-axis displacement mechanism, a dispensing functional head and a height measuring functional head are arranged at the output end of the Z-axis displacement mechanism, and the transmission assembly is arranged on the second vertical frame. The whole structure of the equipment is simplified, the occupied area is reduced, more production equipment can be arranged in a limited space, the utilization rate of a production site is improved, dispensing and height measurement can be completed at the same station, errors caused by multiple times of positioning are reduced, the reliability and consistency of products are improved, and the production efficiency is improved. And flexible adjustment can be carried out according to different production process requirements, the fixing requirements of various types of chips are met, and a wider application prospect is provided.

Description

Technical Field

[0001] The present invention relates to the technical field of die bonders, and particularly to a dispensing and height measuring mechanism of a die bonder. Background Art

[0002] With the development of semiconductor packaging technology, die bonders are increasingly widely used in the electronics manufacturing industry. A die bonder is mainly used to accurately fix chips on a substrate or a lead frame, and is one of the key devices indispensable in the semiconductor packaging process. Among them, dispensing and height measurement, as crucial steps in the die bonding process, directly affect the fixing effect of the chips and the quality of the entire packaging.

[0003] Traditional die bonders usually include separately provided dispensing devices and height measuring devices. However, this separate design has some obvious disadvantages: on the one hand, since the dispensing and height measuring functions belong to different modules, the overall structure of the device is complex, occupying a large space, and increasing the maintenance difficulty and cost; on the other hand, during the dispensing operation, if the height measurement is inaccurate, it is easy to cause uneven dispensing thickness, affecting the subsequent chip bonding quality, and even possibly causing product quality problems. Summary of the Invention

[0004] The present invention aims to at least solve the technical problems existing in the prior art. For this purpose, the present invention provides a dispensing and height measuring mechanism of a die bonder, which can achieve precise positioning, simplify the device structure, reduce the floor area, and also improve the accuracy and efficiency of dispensing and height measurement, thereby enhancing the overall production quality and work efficiency. Dispensing and height measurement can be completed at the same station, reducing the error caused by multiple positioning, and further improving the reliability and consistency of the product.

[0005] A dispensing and height measuring mechanism of a die bonder according to some embodiments of the present invention is characterized in that: it includes a workbench, a transmission assembly, a dispensing function head, and a height measuring function head. A first vertical frame and a second vertical frame are provided on the workbench. An X-axis displacement mechanism is provided at the top of the first vertical frame. A Y-axis displacement mechanism is provided at the output end of the X-axis displacement mechanism. A Z-axis displacement mechanism is provided at the output end of the Y-axis displacement mechanism. A first connecting plate is provided at the output end of the Z-axis displacement mechanism. The dispensing function head and the height measuring function head are provided at the front end of the first connecting plate. The transmission assembly is provided on the second vertical frame. The transmission assembly is arranged along the X-axis direction and is located at the bottom of the Z-axis displacement mechanism.

[0006] A dispensing and height measuring mechanism of a die bonder according to some embodiments of the present invention has at least the following beneficial effects:

[0007] By integrating the dispensing function head and the height measuring function head on the same moving platform, the overall structure of the device is greatly simplified, the floor area is reduced, which is conducive to arranging more production equipment in a limited space, improving the utilization rate of the production site. The X-axis, Y-axis and Z-axis displacement mechanisms are used to achieve precise positioning in three-dimensional directions, ensuring the accuracy of dispensing and height measurement. Since dispensing and height measurement can be completed at the same station, the error caused by multiple positionings is reduced, thereby improving the reliability and consistency of the product. It can be flexibly adjusted according to different production process requirements, adapting to the fixing requirements of various types of chips, and has strong versatility and expandability, providing a broader application prospect.

[0008] For the dispensing and height measuring mechanism of a die bonder according to some embodiments of the present invention, the height measuring function head includes a 2D camera, a height measuring sensor, a beam splitter and a light source. A first connecting block is provided at the upper end of the first connecting plate, and the 2D camera is arranged on the first connecting block. A second connecting block is provided at the lower end of the first connecting plate, the beam splitter is arranged on the second connecting block, the light source is arranged at the bottom of the second connecting block, the height measuring sensor is arranged outside the second connecting block, and the 2D camera and the height measuring sensor are respectively arranged on the top and the front end of the beam splitter.

[0009] For the dispensing and height measuring mechanism of a die bonder according to some embodiments of the present invention, the bottom of the first vertical frame extends forward to form an assembly platform, the height of the second vertical frame is less than that of the first vertical frame, and the transmission assembly is located at the bottom of the assembly platform.

[0010] For the dispensing and height measuring mechanism of a die bonder according to some embodiments of the present invention, a third connecting plate is provided at the output end of the Y-axis displacement mechanism, a fourth connecting plate is provided at the rear end of the Z-axis displacement mechanism, a fixing frame is provided on the third connecting plate, and the fixing frame is connected to the fourth connecting plate.

[0011] For the dispensing and height measuring mechanism of a die bonder according to some embodiments of the present invention, the Z-axis displacement mechanism includes a driving motor and a right-angle commutator. The driving motor is arranged on the third connecting plate, a rotating shaft is provided at the output end of the driving motor, the right-angle commutator is arranged at the rear end of the fourth connecting plate, the rotating shaft is connected to the input end of the right-angle commutator, a lead screw is provided at the output end of the right-angle commutator, a lead screw nut is provided at the rear end of the first connecting plate, and the lead screw nut is connected to the lead screw. The rotating shaft is arranged along the Y-axis direction, and the lead screw is arranged along the Z-axis direction.

[0012] A dispensing and height measuring mechanism of a die bonder according to some embodiments of the present invention, the transfer assembly includes a frame, a linear drive mechanism, a lifting mechanism, and a lifting platform. A first connecting frame is provided at the front end of the frame, a second connecting frame is provided at the front end of the first connecting frame, a first avoidance space is provided between the frame and the first connecting frame, a second avoidance space is provided between the first connecting frame and the second connecting frame. The linear drive mechanism is provided on the top of the frame, the output end of the linear drive mechanism is connected to the lifting mechanism, the lifting mechanism is located in the first avoidance space, the output end of the lifting mechanism is connected to the lifting platform. A connecting portion is provided at the rear end of the lifting platform, a first avoidance groove is provided at the top of the connecting portion, the first connecting frame is located in the first avoidance groove, and the front end of the lifting platform extends into the second avoidance space.

[0013] A dispensing and height measuring mechanism of a die bonder according to some embodiments of the present invention, a first fixing plate is provided at the output end of the lifting mechanism, a second fixing plate is provided at the bottom of the first fixing plate. Positioning blocks are provided on both sides of the rear end of the lifting platform, a positioning groove is provided between the two positioning blocks, and the bottom of the second fixing plate is connected to the bottom of the positioning groove.

[0014] A dispensing and height measuring mechanism of a die bonder according to some embodiments of the present invention, gas connection ports are provided on the positioning blocks, first gas flow channels are provided at the left and right ends of the connecting portion, a second gas flow channel is provided at the rear end of the lifting platform, the second gas flow channel, a receiving space is provided in the middle of the lifting platform, a plurality of receiving grooves are provided on the top of the lifting platform, the gas connection ports, the first gas flow channels, the second gas flow channels, the receiving space, and the receiving grooves are sequentially communicated, and the receiving grooves are arranged in an array.

[0015] A dispensing and height measuring mechanism of a die bonder according to some embodiments of the present invention, the second gas flow channel is arranged horizontally, the two first gas flow channels are respectively communicated with the two ends of the second gas flow channel, a long strip-shaped notch is provided at the top of the first gas flow channel, and the receiving space is communicated with the second gas flow channel through the notch.

[0016] A dispensing and height measuring mechanism of a die bonder according to some embodiments of the present invention, the dispensing function head and the height measuring function head are both located at the top of the second avoidance space.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, will become apparent in part from the following description, or will be understood through the practice of the present invention. Description of the Drawings

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the following description of embodiments in conjunction with the accompanying drawings, in which:

[0019] Figure 1 It is a schematic structural diagram of an embodiment of the present invention.

[0020] Figure 2 It is a side view of an embodiment of the present invention.

[0021] Figure 3 It is a schematic structural diagram of the dispensing function head and the height measuring function head of an embodiment of the present invention.

[0022] Figure 4 It is a schematic structural diagram of the Y-axis displacement mechanism of an embodiment of the present invention after removing the fixing frame.

[0023] Figure 5 It is a schematic structural diagram of the transmission component of an embodiment of the present invention.

[0024] Figure 6 It is a schematic structural diagram of the lifting mechanism of an embodiment of the present invention.

[0025] Figure 7 It is a cross-sectional view of the lifting mechanism of an embodiment of the present invention.

[0026] Figure 8 For Figure 7 An enlarged view of part A in

[0027] Reference numerals: 1, workbench; 2, transmission component; 3, dispensing function head; 4, height measuring function head; 5, first vertical frame; 6, second vertical frame; 7, X-axis displacement mechanism; 8, Y-axis displacement mechanism; 9, Z-axis displacement mechanism; 10, first connecting plate; 11, 2D camera; 12, height measuring sensor; 13, beam splitter; 14, light source; 15, first connecting block; 16, second connecting block; 17, assembly platform; 18, third connecting plate; 19, fourth connecting plate; 20, fixing frame; 21, drive motor; 22, right-angle commutator; 23, rotating shaft; 24, lead screw; 25, lead screw nut; 26, frame; 27, linear drive mechanism; 28, lifting mechanism; 29, lifting platform; 30, first connecting frame; 31, second connecting frame; 32, first avoidance space; 33, second avoidance space; 34, connecting portion; 35, first avoidance groove; 36, first fixing plate; 37, second fixing plate; 38, positioning block; 39, positioning groove; 40, gas connection port; 41, first gas flow channel; 42, second gas flow channel; 43, long strip-shaped notch; 44, accommodation space; 45, receiving groove; 46, assembly plate; 47, first step portion; 48, second step portion; 49, third connecting plate; 50, second avoidance groove; 51, first boss; 52, second boss; 53, third connecting frame; 54, third avoidance groove. Detailed implementation manners

[0028] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0029] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, left, right, front, back, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. This is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the modules or elements referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0030] In the description of the present invention, if the first and second are described only for the purpose of distinguishing technical features, they should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence of the indicated technical features.

[0031] In the description of the present invention, unless otherwise clearly defined, words such as setting, installing, and connecting should be understood in a broad sense. Those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0032] As Figures 1-8 shown, an embodiment of the present invention provides a dispensing height measuring mechanism for a die bonder.

[0033] A dispensing height measuring mechanism for a die bonder includes a workbench 1, a transmission assembly 2, a dispensing function head 3, and a height measuring function head 4. A first upright frame 5 and a second upright frame 6 are provided on the workbench 1. An X-axis displacement mechanism 7 is provided at the top of the first upright frame 5. A Y-axis displacement mechanism 8 is provided at the output end of the X-axis displacement mechanism 7. A Z-axis displacement mechanism 9 is provided at the output end of the Y-axis displacement mechanism 8. A first connecting plate 10 is provided at the output end of the Z-axis displacement mechanism 9. A dispensing function head 3 and a height measuring function head 4 are provided at the front end of the first connecting plate 10. The transmission assembly 2 is provided on the second upright frame 6. The transmission assembly 2 is arranged along the X-axis direction and is located at the bottom of the Z-axis displacement mechanism 9.

[0034] By integrating the dispensing function head 3 and the height measuring function head 4 on the same moving platform, the overall structure of the device is greatly simplified, the floor area is reduced, which is conducive to arranging more production equipment in a limited space, improving the utilization rate of the production site. The X-axis, Y-axis and Z-axis displacement mechanisms are used to achieve precise positioning in three-dimensional directions, ensuring the accuracy of dispensing and height measurement. Since dispensing and height measurement can be completed at the same station, the error caused by multiple positionings is reduced, thereby improving the reliability and consistency of the product. It can be flexibly adjusted according to different production process requirements to adapt to the fixing requirements of various types of chips, and has strong versatility and expandability, providing a broader application prospect.

[0035] For the dispensing and height measuring mechanism described in this embodiment, the height measuring function head 4 includes a 2D camera 11, a height measuring sensor 12, a beam splitter 13 and a light source 14. A first connecting block 15 is provided at the upper end of the first connecting plate 10, and the 2D camera 11 is arranged on the first connecting block 15. A second connecting block 16 is provided at the lower end of the first connecting plate 10, the beam splitter 13 is arranged on the second connecting block 16, the light source 14 is arranged at the bottom of the second connecting block 16, and the height measuring sensor 12 is arranged outside the second connecting block 16. The 2D camera 11 and the height measuring sensor 12 are respectively arranged on the top and the front end of the beam splitter 13. Specifically, the height measuring sensor 12 uses a laser sensor. The setting of the beam splitter 13 makes the 2D camera 11 and the height measuring sensor 12 coaxial. The 2D camera can accurately position, and the height measuring sensor can monitor the dispensing amount. The next dispensing amount can be adjusted according to the previous dispensing amount. This design provides more accurate height measurement data to ensure the accuracy of the dispensing process, not only improving the detection accuracy, but also enhancing the adaptability and flexibility of the system.

[0036] For the dispensing and height measuring mechanism described in this embodiment, the bottom of the first vertical frame 5 extends forward to form an assembly platform 17. The height of the second vertical frame 6 is less than that of the first vertical frame 5, and the transmission component 2 is located at the bottom of the assembly platform 17. Specifically, the assembly platform 17 formed by the forward extension of the bottom of the first vertical frame provides a stable foundation for other components. The lower height design of the second vertical frame optimizes the overall structural layout. The assembly platform 17 can avoid interfering with the transmission component 2. The first vertical frame 5 and the second vertical frame 6 lift the overall structure, facilitating the layout of various equipment and circuits.

[0037] In the dispensing height measuring mechanism of this embodiment, a third connecting plate 18 is provided at the output end of the Y-axis displacement mechanism 8, and a fourth connecting plate 19 is provided at the rear end of the Z-axis displacement mechanism 9. A fixing frame 20 is provided on the third connecting plate 18, and the fixing frame 20 is connected to the fourth connecting plate 19. Specifically, by providing the third connecting plate 18 at the output end of the Y-axis displacement mechanism 8, the fourth connecting plate 19 at the rear end of the Z-axis displacement mechanism 9, and connecting the fixing frame 20 to both of them, the stability of the entire moving system is increased, ensuring the accuracy and repeatability of the position during dispensing and height measurement. The third connecting plate 18 is connected to the output end of the Y-axis displacement mechanism 8 through the fixing frame 20.

[0038] In the dispensing height measuring mechanism of this embodiment, the Z-axis displacement mechanism 9 includes a driving motor 21 and a right-angle commutator 22. The driving motor 21 is provided on the third connecting plate 18. A rotating shaft 23 is provided at the output end of the driving motor 21. The right-angle commutator 22 is provided at the rear end of the fourth connecting plate 19. The rotating shaft 23 is connected to the input end of the right-angle commutator 22. A lead screw 24 is provided at the output end of the right-angle commutator 22. A lead screw nut 25 is provided at the rear end of the first connecting plate 10. The lead screw nut 25 is connected to the lead screw 24. The rotating shaft 23 is arranged along the Y-axis direction, and the lead screw 24 is arranged along the Z-axis direction. Specifically, the design of the driving motor in the Z-axis displacement mechanism 9 in cooperation with the right-angle commutator 22 realizes efficient vertical motion conversion, improves the positioning speed and accuracy in the Z-axis direction, reduces energy consumption at the same time, and extends the service life of the equipment. It can be understood that since the transmission component is located at the bottom of the X, Y, and Z-axis displacement mechanisms, and the assembly platform 17 is formed by the front-end extension of the bottom of the first vertical frame 5, the setting of the driving motor 21 on the third connecting plate 18 in the present invention can adjust the center of gravity to a certain extent.

[0039] The dispensing and height measuring mechanism described in this embodiment, the transmission assembly 2 includes a frame 26, a linear drive mechanism 27, a lifting mechanism 28 and a lifting platform 29. A first connecting frame 30 is provided at the front end of the frame 26, and a second connecting frame 31 is provided at the front end of the first connecting frame 30. A first avoidance space 32 is provided between the frame 26 and the first connecting frame 30, and a second avoidance space 33 is provided between the first connecting frame 30 and the second connecting frame 31. The linear drive mechanism 27 is provided on the top of the frame 26, the output end of the linear drive mechanism 27 is connected to the lifting mechanism 28, the lifting mechanism 28 is located in the first avoidance space 32, the output end of the lifting mechanism 28 is connected to the lifting platform 29, a connecting portion 34 is provided at the rear end of the lifting platform 29, and a first avoidance groove 35 is provided at the top of the connecting portion 34. The first connecting frame 30 is located in the first avoidance groove 35, and the front end of the lifting platform 29 extends into the second avoidance space 33. Specifically, by designing the first avoidance space 32 and the second avoidance space 33, the linear drive mechanism 27 and the lifting mechanism 28 are prevented from directly contacting the track or other fixed components during operation, thereby greatly reducing the possibility of metal dust generated by friction and mechanical vibration, helping to prevent semiconductor products from being contaminated, ensuring that their electrical performance is not affected, protecting the chips from the risk of falling due to vibration, thereby improving the quality of the final product, reducing the maintenance cost. At the same time, a first avoidance groove 35 is provided at the connecting portion at the rear end of the lifting platform 29, and the first connecting frame 30 is located therein, so that the overall structure does not occupy the space at the bottom of the frame, and the avoidance is carried out skillfully, which is beneficial to the arrangement of various components at the bottom of the frame.

[0040] The dispensing and height measuring mechanism described in this embodiment, a first fixing plate 36 is provided at the output end of the lifting mechanism 28, a second fixing plate 37 is provided at the bottom of the first fixing plate 36, positioning blocks 38 are provided on both sides of the rear end of the lifting platform 29, a positioning groove 39 is provided between the two positioning blocks 38, and the bottom of the second fixing plate 37 is connected to the bottom of the positioning groove 39. Specifically, by providing a gas connection port on the positioning block 38 and providing a first gas flow channel, a second gas flow channel, a accommodating space and a accommodating groove on the lifting platform 29 to form a complete gas circulation path, the chip can be adsorbed in the accommodating groove, greatly improving the stability of chip transmission.

[0041] For the dispensing and height measuring mechanism described in this embodiment, gas connection ports 40 are provided on the positioning blocks 38. First gas flow channels 41 are provided at both the left and right ends of the connecting portion 34. A second gas flow channel 42 is provided at the rear end of the lifting platform 29. The second gas flow channel 42 is horizontally arranged. The two first gas flow channels 41 are respectively communicated with both ends of the second gas flow channel 42. A long strip-shaped notch 43 is provided at the top of the first gas flow channel 41. The accommodation space 44 is communicated with the second gas flow channel 42 through the notch 43. An accommodation space 44 is provided in the middle of the lifting platform 29. A plurality of accommodation grooves 45 are provided at the top of the lifting platform 29. The gas connection ports 40, the first gas flow channels 41, the second gas flow channels 42, the accommodation space 44, and the accommodation grooves 45 are sequentially communicated. The accommodation grooves 45 are arranged in an array. Specifically, by providing the gas connection ports 40 on the positioning blocks 38 and the first and second gas flow channels 41, 42, the accommodation space 44, and the accommodation grooves 45 on the lifting platform 29, a complete gas circulation path is formed, and the chip can be adsorbed in the accommodation grooves 45, greatly improving the stability of chip transmission.

[0042] For the dispensing and height measuring mechanism described in this embodiment, since the positioning blocks 38 in this embodiment are located on both sides of the positioning grooves 39, the first gas flow channels 41 will be connected to both sides of the second gas flow channel 42, and the connecting portion 34 is provided with a first avoidance groove 35, and the first gas flow channels 41 need to be provided with corners. Therefore, the width L3 of the first gas flow channel 41 and the width L4 of the second gas flow channel 42 should be greater than the height L5 of the accommodation space 44 to ensure the efficiency of sucking the gas in the accommodation space 44 from the second gas flow channel 42 into the first gas flow channel 41 and finally sucking it out from the gas connection port 40. The size settings of the above-mentioned flow channels and the accommodation space 44 ensure the chip adsorption effect of this embodiment under the condition of providing the first avoidance groove 35.

[0043] For the dispensing and height measuring mechanism described in this embodiment, both the dispensing function head 3 and the height measuring function head 4 are located at the top of the second avoidance space 33. Specifically, the design that both the dispensing function head 3 and the height measuring function head 4 are located at the top of the second avoidance space 33 not only makes full use of the space but also avoids interference between each other, ensuring the efficient progress of dispensing and height measuring operations and improving the overall work efficiency and product quality.

[0044] For the dispensing and height measuring mechanism described in this embodiment, an output end assembly plate 46 is provided for the linear drive mechanism 27, and the lifting mechanism 28 is provided on the assembly plate 46. Specifically, an assembly plate 46 is provided at the output end of the linear drive mechanism 27 to ensure precise control during its operation and improve the reliability of the entire transmission assembly.

[0045] For the dispensing height measuring mechanism in this embodiment, a first step portion 47 is provided at the top of one side of the first connecting plate 10 close to the second connecting plate 19, and a second step portion 48 is provided at the top of one side of the second connecting plate 19 close to the first connecting plate 10. The first step portion 47 and the second step portion 48 are arranged corresponding to each other. Specifically, corresponding step portions are provided between the first connecting plate 10 and the second connecting plate 19, so that the lifting platform 29 can be lifted between the two step portions, defining the range of the front-back movement of the lifting platform 29.

[0046] For the dispensing height measuring mechanism in this embodiment, the distance between the top of the first avoidance groove 35 and the bottom of the first connecting frame 30 is L1, and the height of the first step portion 47 and the second step portion 48 is L2, then L1 is less than L2. Specifically, L1 refers to the distance between the top of the first avoidance groove 35 and the bottom of the first connecting frame 30 when the lifting platform 29 is at the bottommost position, that is, the maximum height that the lifting platform 29 can rise is less than the height of the first step portion 47 and the second step portion 48, ensuring that the lifting platform 29 is always located between the first step portion 47 and the second step portion 48.

[0047] For the dispensing height measuring mechanism in this embodiment, a plurality of third connecting plates 49 are provided between the first connecting frame 30 and the second connecting frame 31. The bottom of each third connecting plate 49 is recessed upward to form a second avoidance groove 50, and the second avoidance groove 50 is located at the top of the second avoidance space 33. Specifically, a plurality of third connecting plates 49 are provided between the first connecting frame 30 and the second connecting frame 31, and the bottom is recessed upward to form the second avoidance groove 50. Such a design not only ensures the connection stability but also provides an avoidance space, ensuring that the chips during transmission will not contact the chips on the lifting platform 29.

[0048] For the dispensing height measuring mechanism in this embodiment, two second vertical frames 6 are provided. First bosses 51 and second bosses 52 are respectively provided at the front and rear ends of the second vertical frame 6. A third connecting frame 53 is provided at the front end of the second connecting frame 31, and the third connecting frame 53 is connected to the top of the first boss 51. Both ends of the frame 26 are respectively connected to the two second bosses 52. A third avoidance groove 54 is provided between the first boss 51 and the second boss 52, and both the first avoidance space 32 and the second avoidance space 33 are located at the top of the third avoidance groove 54. Specifically, the first bosses 51 and second bosses 52 respectively provided at the front and rear ends of the vertical frame, and the design of the third connecting frame 53 provide a firm basic support for the whole device. The formed third avoidance groove 54 can provide an avoidance space for the lifting mechanism 28 and the lifting platform 29, that is, both the lifting mechanism 28 and the lifting platform 29 are within the third avoidance groove 54 and can slide smoothly without interference.

[0049] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A dispensing height measuring mechanism of a die bonder, characterized in that: It includes a workbench, a transmission component, a dispensing function head, and a height measurement function head. A first vertical frame and a second vertical frame are provided on the workbench. An X-axis displacement mechanism is provided at the top of the first vertical frame. The output end of the X-axis displacement mechanism is provided with a Y-axis displacement mechanism. The output end of the Y-axis displacement mechanism is provided with a Z-axis displacement mechanism. The output end of the Z-axis displacement mechanism is provided with a first connecting plate. The front end of the first connecting plate is provided with a dispensing function head and a height measurement function head. The transmission component is provided on the second vertical frame. The transmission component is arranged along the X-axis direction and is located at the bottom of the Z-axis displacement mechanism.

2. The dispensing height measuring mechanism of a die bonder according to claim 1, characterized in that: The height measurement function head includes a 2D camera, a height measurement sensor, a beam splitter, and a light source. A first connecting block is provided at the upper end of the first connecting plate. The 2D camera is provided on the first connecting block. A second connecting block is provided at the lower end of the first connecting plate. The beam splitter is provided on the second connecting block. The light source is provided at the bottom of the second connecting block. The height measurement sensor is provided on the outside of the second connecting block. The 2D camera and the height measurement sensor are respectively provided on the top and the front end of the beam splitter.

3. The dispensing height measuring mechanism of a die bonder according to claim 1, characterized in that: The bottom of the first vertical frame extends forward to form an assembly platform. The height of the second vertical frame is less than that of the first vertical frame. The transmission component is located at the bottom of the assembly platform.

4. The dispensing height measuring mechanism of a die bonder according to claim 1, characterized in that: The output end of the Y-axis displacement mechanism is provided with a third connecting plate. The rear end of the Z-axis displacement mechanism is provided with a fourth connecting plate. A fixing frame is provided on the third connecting plate. The fixing frame is connected to the fourth connecting plate.

5. The dispensing height measuring mechanism of a die bonder according to claim 4, characterized in that: The Z-axis displacement mechanism includes a driving motor and a right-angle commutator. The driving motor is provided on the third connecting plate. The output end of the driving motor is provided with a rotating shaft. The right-angle commutator is provided at the rear end of the fourth connecting plate. The rotating shaft is connected to the input end of the right-angle commutator. The output end of the right-angle commutator is provided with a lead screw. A lead screw nut is provided at the rear end of the first connecting plate. The lead screw nut is connected to the lead screw. The rotating shaft is arranged along the Y-axis direction. The lead screw is arranged along the Z-axis direction.

6. The dispensing height measuring mechanism of a die bonder according to claim 1, characterized in that: The transmission component includes a frame, a linear driving mechanism, a lifting mechanism, and a lifting platform. A first connecting frame is provided at the front end of the frame. A second connecting frame is provided at the front end of the first connecting frame. A first avoidance space is provided between the frame and the first connecting frame. A second avoidance space is provided between the first connecting frame and the second connecting frame. The linear driving mechanism is provided on the top of the frame. The output end of the linear driving mechanism is connected to the lifting mechanism. The lifting mechanism is located in the first avoidance space. The output end of the lifting mechanism is connected to the lifting platform. A connecting part is provided at the rear end of the lifting platform. A first avoidance groove is provided at the top of the connecting part. The first connecting frame is located in the first avoidance groove. The front end of the lifting platform extends into the second avoidance space.

7. The dispensing height measuring mechanism of a die bonder according to claim 6, characterized in that: The output end of the lifting mechanism is provided with a first fixing plate, the bottom of the first fixing plate is provided with a second fixing plate, positioning blocks are arranged on both sides of the rear end of the lifting platform, a positioning groove is arranged between the two positioning blocks, and the bottom of the second fixing plate is connected to the bottom of the positioning groove.

8. The dispensing height measuring mechanism of a die bonder according to claim 7, characterized in that: Gas connection ports are arranged on the positioning blocks, first gas flow channels are arranged at both the left and right ends of the connecting portion, a second gas flow channel is arranged at the rear end of the lifting platform, the second gas flow channel, a receiving space is arranged in the middle of the lifting platform, a plurality of receiving grooves are formed in the top of the lifting platform, the gas connection ports, the first gas flow channels, the second gas flow channel, the receiving space and the receiving grooves are communicated in sequence, and the receiving grooves are arranged in an array.

9. The dispensing height measuring mechanism of a die bonder according to claim 8, characterized in that: The second gas flow channel is arranged horizontally, the two first gas flow channels are respectively communicated with both ends of the second gas flow channel, a long strip-shaped notch is arranged at the top of the first gas flow channel, and the receiving space is communicated with the second gas flow channel through the notch.

10. The dispensing height measuring mechanism of a die bonder according to claim 6, characterized in that: Both the dispensing function head and the height measuring function head are located at the top of the second avoidance space.

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