Three-dimensional printing stock printing method, device and equipment and storage medium

Abstract

The invention provides a three-dimensional printing stock printing method, device and equipment and a storage medium, relates to the technical field of ink-jet printing, and solves the problem of unqualified printing quality caused by ink flow between two adjacent surfaces on a three-dimensional printing stock. The method comprises the steps that S1, the preset thickness, needing to be covered by ink jet, of the surface of the three-dimensional printing stock is obtained; s2, acquiring a printing mode according to the preset thickness, wherein the printing mode comprises an ink jet mode and a curing mode; s3, performing ink-jet covering on the surface of the three-dimensional printing stock according to the ink-jet mode; s4, the ink on the surface of the three-dimensional printing stock is cured according to the curing mode; and S5, the step S3 and the step S4 are repeated until printing is completed. The ink layer with the preset thickness is divided into a plurality of times of printing and curing, and it is guaranteed that the situation that the thickness of the ink layer on the surface and the thickness of the ink layer on the adjacent surface do not meet the printing requirement due to the fact that ink cannot be attached to the surface due to large amount and flows to other adjacent surfaces is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of inkjet printing, and particularly to a method, device, equipment and storage medium for printing on a three-dimensional substrate. Background Art

[0002] Inkjet printing technology refers to spraying ink in the form of ink droplets onto the surface of a substrate through a print head to form specific patterns and characters according to printing requirements. With the development of inkjet printing technology and printing requirements, inkjet printing technology is used in more and more places to meet different printing needs of people. In existing inkjet printing equipment, the print head sprays not only inks of different colors, but also other metal materials, liquid resin materials, etc. When it is necessary to control the inkjet printing equipment to perform inkjet printing on the surface of a three-dimensional substrate according to printing requirements, due to the fluidity of the ink, the sprayed ink flows to adjacent surfaces of the substrate (ink bleeding phenomenon), resulting in poor printing quality. At the same time, if the ink sprayed onto the surface of the substrate by the print head is required to protect the substrate or play other roles, according to printing requirements, the ink sprayed onto the surface of the substrate should have a certain thickness. However, due to the ink bleeding phenomenon, the ink on the surface of the substrate will flow to adjacent surfaces, resulting in an insufficient thickness of the formed ink layer and unable to fully protect the substrate. Moreover, the ink flowing to the adjacent surface will also affect the ink layer thickness of this surface, resulting in unqualified or directly damaged products during the use of the substrate products, an increase in the unqualified rate of products, waste of resources and an increase in costs at the same time. Summary of the Invention

[0003] In view of this, embodiments of the present invention provide a method, device, equipment and storage medium for printing on a three-dimensional substrate, so as to solve the problem of unqualified printing quality caused by ink flow between two adjacent surfaces on a three-dimensional substrate in the prior art.

[0004] In a first aspect, an embodiment of the present invention provides a method for printing on a three-dimensional substrate, the method comprising:

[0005] S1: Obtain a preset thickness that needs to be covered by inkjet on the surface of the three-dimensional substrate;

[0006] S2: Obtain a printing mode according to the preset thickness, the printing mode including an inkjet mode and a curing mode;

[0007] S3: Perform inkjet coverage on the surface of the three-dimensional substrate according to the inkjet mode;

[0008] S4: Cure the ink on the surface of the three-dimensional substrate according to the curing mode;

[0009] S5: Repeat step S3 and step S4 until printing is completed.

[0010] Preferably, the S2 includes:

[0011] Dividing several ink layers according to the preset thickness, and obtaining the ink layer thickness corresponding to each ink layer;

[0012] Determining the inkjet mode according to the number of ink layers and the ink layer thickness; obtaining the curing parameters corresponding to the ink layer according to the ink layer thickness, where the curing parameters include curing time and curing power.

[0013] Preferably, before the S3 includes:

[0014] Obtaining image data, and generating print data according to the image data, the number of ink layers, and the ink layer thickness.

[0015] Preferably, when the ink layer in the inkjet mode includes a first ink layer and a second ink layer, and the curing mode includes pre-curing corresponding to the first ink layer and final curing corresponding to the second ink layer, the S5 includes:

[0016] Controlling the nozzle to perform inkjet printing on the printing area according to the print data corresponding to the first ink layer;

[0017] Pre-curing the ink layer on the printing area according to the curing parameters corresponding to the pre-curing;

[0018] Controlling the nozzle to perform inkjet printing on the pre-cured ink layer according to the print data corresponding to the second ink layer;

[0019] Performing final curing on the ink layer according to the curing parameters corresponding to the final curing.

[0020] Preferably, the curing parameters corresponding to the pre-curing of the first ink layer are determined according to the ink layer thickness of the first ink layer, and the curing parameters corresponding to the final curing of the second ink layer are determined according to the ink layer thickness of the second ink layer.

[0021] Preferably, the method further includes:

[0022] Obtaining the size of the printing area on each surface of the three-dimensional substrate;

[0023] Sorting according to the size of the printing area from small to large, and obtaining the printing order for inkjetting on the surface;

[0024] Controlling the nozzle to perform inkjet printing on the surface of the three-dimensional substrate according to the printing order.

[0025] Preferably, the S2 includes:

[0026] Obtaining the joining angle of two adjacent surfaces of the three-dimensional substrate;

[0027] Determine the inkjet mode according to the connection angle and the preset thickness.

[0028] In a second aspect, an embodiment of the present invention provides a three-dimensional printing device for a printing substrate, the device comprising:

[0029] A preset thickness module configured to obtain a preset thickness that needs to be covered by inkjet on the surface of the three-dimensional printing substrate;

[0030] A printing mode module configured to obtain a printing mode according to the preset thickness, the printing mode including an inkjet mode and a curing mode;

[0031] An inkjet module configured to perform inkjet coverage on the surface of the three-dimensional printing substrate according to the inkjet mode;

[0032] A curing module configured to cure the ink on the surface of the three-dimensional printing substrate according to the curing mode;

[0033] A circulation module configured to repeat the inkjet module and the curing module until printing is completed.

[0034] In a third aspect, an embodiment of the present invention provides a three-dimensional printing device for a printing substrate, comprising: at least one processor, at least one memory, and computer program instructions stored in the memory, where when the computer program instructions are executed by the processor, the method according to the first aspect in the above embodiment is implemented.

[0035] In a fourth aspect, an embodiment of the present invention provides a storage medium, on which computer program instructions are stored, where when the computer program instructions are executed by the processor, the method according to the first aspect in the above embodiment is implemented.

[0036] In summary, the beneficial effects of the present invention are as follows:

[0037] The three-dimensional substrate printing method, device, equipment and storage medium provided by the embodiments of the present invention obtain the printing mode according to the acquired and preset thickness, obtain the number of ink layers to be divided according to the preset thickness, and the volume of ink to be ejected for each corresponding ink layer, that is, the inkjet mode. Based on the fact that for each inkjet printing completed, the printed area covered with ink needs to be irradiated and cured by a UV lamp once. That is, the present invention divides according to the ink amount of the preset thickness, controls the nozzle to stack ink layer by layer on the printing area according to the divided ink layers and the ink layer thickness corresponding to each ink layer, and obtains an ink layer with a preset thickness on the surface of the substrate. During the printing process, the UV lamp is controlled to perform light curing again and again to prevent the ink of the ink layer from flowing to other adjacent surfaces. The present invention splits the ink amount to be ejected, performs sub-printing during inkjet printing, and cures the ink after each printing, ensuring that the ink will not fail to adhere to the surface due to a large amount and flow to other adjacent surfaces, resulting in the ink layer thickness on the surface and adjacent surfaces not meeting the printing requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, and all of these are within the protection scope of the present invention.

[0039] Figure 1 It is a flowchart of the three-dimensional substrate printing method according to Embodiment 1 of the present invention.

[0040] Figure 2 It is a flowchart of the three-dimensional substrate printing method according to Embodiment 1 of the present invention.

[0041] Figure 3 It is a schematic diagram of the three-dimensional substrate and ink layer structure according to Embodiment 1 of the present invention.

[0042] Figure 4 It is a schematic diagram of the split ink layer according to Embodiment 1 of the present invention.

[0043] Figure 5 It is a flowchart of the three-dimensional substrate printing method according to Embodiment 1 of the present invention.

[0044] Figure 6 It is a flowchart of the three-dimensional substrate printing method according to Embodiment 1 of the present invention.

[0045] Figure 7 It is a flowchart of the three-dimensional substrate printing method according to Embodiment 1 of the present invention.

[0046] Figure 8It is a schematic flow chart of the three-dimensional printing method for a printing substrate according to Embodiment 2 of the present invention.

[0047] Figure 9 It is a schematic structural diagram of the three-dimensional printing apparatus for a printing substrate according to Embodiment 3 of the present invention.

[0048] Figure 10 It is a schematic structural diagram of the three-dimensional printing equipment for a printing substrate according to Embodiment 4 of the present invention. Detailed Description of the Invention

[0049] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. For the purpose of making the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present invention by showing examples of the present invention.

[0050] It should be noted that in this document, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Thus, features defined with "first", "second" may explicitly or implicitly include one or more of these features. In the description of this embodiment, unless otherwise specified, the meaning of "a plurality" is two or more. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, elements defined by the statement "including..." do not exclude the existence of additional identical elements in the process, method, article or device including the said elements.

[0051] Please refer to Figure 1 , an embodiment of the present invention provides a three-dimensional printing method for a printing substrate, the method comprising:

[0052] S1: Obtain a preset thickness required for inkjet coverage on the surface of the three-dimensional printing substrate.

[0053] With the development of printing requirements, it is necessary to perform inkjet printing on the surfaces of three-dimensional printing substrates with different shapes and form an ink layer of a certain thickness on the surface. When the thickness of the ink layer is large, if the nozzle is controlled to spray the ink volume required for the ink layer thickness onto the printing area at one time, the ink will flow onto other surfaces, resulting in the ink layer thickness on the printing area not meeting the requirements, and the ink layer thickness of adjacent surfaces will also be affected accordingly, resulting in the printing quality not meeting the requirements.

[0054] S2: Obtain a printing mode according to the preset thickness, where the printing mode includes an inkjet mode and a curing mode.

[0055] Specifically, in order to enable the ink to be cured in a timely manner, it is necessary to cure the ejected ink in a timely manner. Confirm the ink layer thickness and the number of layers corresponding to each layer during layered printing according to the preset thickness, and set the corresponding curing parameters according to the ink layer thickness corresponding to each layer.

[0056] Confirm the printing mode according to the ink layer thickness and the number of layers. The printing mode is the number of times the nozzle scans and sprays ink on the printing area during printing, including the number of times of scanning and spraying ink corresponding to each ink layer, the thickness of a single scan and spray of ink, and the total number of times of scanning and spraying ink.

[0057] Since it is necessary to form an ink layer of a certain thickness on the surface of the three-dimensional printing substrate, in order to improve the printing efficiency and ensure the printing quality, it is necessary to set a curing lamp for irradiation curing so that the ink can be cured quickly.

[0058] In one embodiment, as Figure 2 shown, the S2: Obtain a printing mode according to the preset thickness, where the printing mode includes an inkjet mode and a curing mode, includes:

[0059] S21: Divide a number of ink layers according to the preset thickness, and at the same time obtain the ink layer thickness corresponding to each ink layer;

[0060] S22: Determine the inkjet mode according to the number of ink layers and the ink layer thickness;

[0061] S23: Obtain the curing parameters corresponding to the ink layer according to the ink layer thickness, where the curing parameters include curing time and curing power.

[0062] Specifically, as Figure 3 、 Figure 4 shown, spray ink m covering a certain thickness. According to the properties of the ink, split the ink m on the surface of the three-dimensional printing substrate j according to the printing requirements, and split the ink m into several ink layers 1, 2,..., n layers; obtain the ink layer thickness of each ink layer, and confirm the curing parameters of the curing lamp after printing the ink layer according to the thickness.

[0063] Determine the number of scanning inkjet times corresponding to each ink layer and the scanning inkjet thickness during each scanning inkjet according to the thickness of each ink layer and the accuracy of the inkjet head.

[0064] In this embodiment, the ink m is split and printed to avoid too much ink during one-time inkjet printing, resulting in the ink not being cured in time and flowing to other adjacent surfaces. At the same time, to ensure the curing quality of the ink layer and improve the printing efficiency, each time an ink layer is printed, it is necessary to control the curing lamp to cure the ink on the printing area once. According to the amount of ink ejected, the corresponding curing parameters of the curing lamp can be set, including the irradiation time of the curing lamp and the power of the curing lamp.

[0065] S3: Perform an inkjet coverage on the surface of the three-dimensional substrate according to the inkjet mode once.

[0066] In one embodiment, the S3 includes: obtaining image data, and generating printing data according to the image data, the number of ink layers, and the thickness of the ink layer.

[0067] Specifically, obtain the image data, adjust the image data according to the number of ink layers and the thickness of the ink layer, and generate printing data, so that when the inkjet head ejects ink, the ejected ink can form an ink layer with a certain thickness on the printing area.

[0068] S4: Cure the ink on the surface of the three-dimensional substrate according to the curing mode.

[0069] Specifically, in case of an inkjet printing abnormality in the printing area according to S3, after completing one inkjet printing, control the curing lamp to cure the ink on the printing area according to the curing parameters in the curing mode. The curing parameters include the irradiation time of the curing lamp, i.e., the curing time, and the power of the curing lamp, i.e., the curing power, so that the ink can be cured quickly, shortening the interval time between two inkjet printings in the same area, improving the curing efficiency and at the same time improving the printing efficiency.

[0070] S5: Repeat steps S3 and S4 until the printing is completed.

[0071] Specifically, perform inkjet printing and ink curing on the printing area according to S3 and S4. After curing, repeat steps S3 and S4 according to the inkjet mode and the curing mode, eject the corresponding amount of ink in the original same printing area, and then perform curing, so as to form another ink layer with a certain thickness on the position of the previous ink layer. Print in this way, continuously stacking ink layers until an ink layer with a preset thickness is obtained according to the inkjet mode and the curing mode. It realizes printing an ink layer with a certain thickness on the three-dimensional substrate.

[0072] In one embodiment, as Figure 5 shown, the method further includes:

[0073] S51: Obtain the sizes of the printing areas on each surface of the three-dimensional printing substrate;

[0074] S52: Sort in ascending order according to the sizes of the printing areas, and obtain the printing sequence for inkjetting on the surfaces;

[0075] S53: Control the print head to perform inkjet printing on the surfaces of the three-dimensional printing substrate according to the printing sequence.

[0076] When the sizes of the printing areas on each surface of the three-dimensional printing substrate are different, in order to ensure the printing effect, before printing on the three-dimensional printing substrate, it is necessary to determine the printing sequence of the surfaces of the printing substrate according to the sizes of the printing areas, perform inkjet printing starting from the small printing area, reduce the ink flowing from the inkjetting during small-area printing to adjacent large-area surfaces, reduce the amount of ink flowing on the large-area printing area, and ensure the printing effect.

[0077] The three-dimensional printing substrate printing method, device, equipment and storage medium provided by the present invention obtain the printing mode according to the preset thickness of the ink amount covered on the surface required for printing, obtain how many times of printing are required to obtain the ink amount of the preset thickness after inkjetting according to the preset thickness, and the volume of ink to be ejected each time, that is, the inkjet mode. Based on that for each completion of inkjet printing, it is necessary to perform UV lamp irradiation curing on the printing area covered with ink once, that is, the present invention divides according to the ink amount of the preset thickness, controls the print head to stack ink layer by layer on the printing area according to the divided ink layers and the corresponding ink layer thickness of each ink layer, obtains an ink layer with a preset thickness on the surface of the printing substrate, and during the printing process, controls the UV lamp to perform light curing again and again to prevent the ink of the ink layer from flowing to other adjacent surfaces. The present invention splits the ink amount to be ejected, performs sub-printing during inkjet printing, and cures the ink after each printing, ensuring that the ink will not fail to adhere to the surface due to a large amount and flow to other adjacent surfaces, resulting in the ink layer thickness on the surface and adjacent surfaces not meeting the printing requirements.

[0078] In an embodiment, as Figure 6 shown, when the ink layer in the inkjet mode includes a first ink layer and a second ink layer, and the curing mode includes pre-curing corresponding to the first ink layer and final curing corresponding to the second ink layer, the S5 includes:

[0079] S51: Control the print head to perform inkjet printing on the printing area according to the printing data corresponding to the first ink layer;

[0080] S52: Perform pre-curing on the ink layer on the printing area according to the curing parameters corresponding to the pre-curing;

[0081] S53: Control the print head to perform inkjet printing on the pre-cured ink layer according to the print data corresponding to the second ink layer;

[0082] S54: Perform final curing on the ink layer according to the curing parameters corresponding to the final curing.

[0083] Specifically, split the ink layer printed by inkjet into a first ink layer and a second ink layer according to a preset thickness, and the curing modes correspondingly include pre-curing and final curing. Control the print head to print the first ink layer on the printing area, and after the first ink layer is printed, control the curing lamp to cure the first ink layer according to the curing parameters corresponding to the pre-curing; control the print head to print the second ink layer on the first ink layer, and after the second ink layer is printed, control the curing lamp to cure the second ink layer according to the curing parameters corresponding to the final curing.

[0084] The curing parameters corresponding to the first ink layer for the pre-curing are determined according to the ink layer thickness of the first ink layer, and the curing parameters corresponding to the second ink layer for the final curing are determined according to the ink layer thickness of the second ink layer. The curing parameters corresponding to each ink layer need to be determined according to the ink layer thickness to avoid problems such as ink over-curing and cracking in the ink layer with less ink volume when using the same curing parameters for curing when the thicknesses of the first ink layer and the second ink layer are different, which affects the printing quality.

[0085] In one embodiment, as Figure 7 shown, S2 includes:

[0086] S201: Obtain the joining angle of two adjacent surfaces of the three-dimensional substrate;

[0087] S202: Determine the inkjet mode according to the joining angle and the preset thickness.

[0088] When performing inkjet printing on the surface of a three-dimensional substrate, it is found that when printing an ink layer with a certain preset thickness, the number of split prints and the thickness corresponding to each print are also related to the size of the joining angle of two adjacent surfaces of the three-dimensional substrate.

[0089] The joining angle is the included angle formed by two adjacent surfaces, and can also be expressed as the included angle formed by the normal vectors of two adjacent planes. The included angle formed by two surfaces is equal to the included angle formed by the normal vectors of two adjacent planes.

[0090] Specifically, through research, the flow situation of ink on adjacent surfaces at different joining angles can be obtained as shown in Table 1 below:

[0091]

[0092]

[0093] It can be obtained from the table that the ink spreading decreases with the increase of the joining angle. Between 0 and 45 degrees, the ink is more likely to spread to the adjacent surface and cause pollution to the adjacent surface. When the joining angle is between 45 and 90 degrees, the ink spreading is less. When the joining angle is between 90 and 150 degrees, there is almost no ink spreading. The printing substrates with too large a difference in the joining angle require different numbers of ink layers to be split. To avoid the magic spreading of the ink to the adjacent surface, each surface needs to confirm the thickness of each split ink layer according to the size of the joining angle, ensuring that under the condition of the ink layer thickness, the ink will not spread to the adjacent surface or the spreading amount is so small that it will not affect the printing quality of the adjacent surface.

[0094] Specifically, obtain the spreading situation of inks with different thicknesses on the adjacent surface under the same joining angle, and determine the ink layer thickness corresponding to the joining angle according to the spreading situation. When forming the ink with the ink layer thickness on the printing substrate surface, it will not spread to the adjacent surface and cause pollution.

[0095] Determine the inkjet mode according to the ink layer thickness and the nozzle accuracy, including: obtaining the number of ink layers according to the ink layer thickness and the preset thickness, and determining the inkjet mode according to the number of ink layers and the ink layer thickness.

[0096] Determine the number of scanning inkjet times required for each ink layer to complete printing according to the ink layer thickness and the nozzle accuracy, as well as the single-scan inkjet thickness, and determine the total number of scans according to the scanning inkjet times corresponding to each ink layer and the number of ink layers.

[0097] Determine the curing power and curing time of the curing lamp according to the thickness of each ink layer, that is, determine the curing mode.

[0098] At the same time, create a relationship curve Z = f(y) between the joining angle y and the single-scan inkjet thickness Z according to the corresponding relationship. The single-scan inkjet thickness corresponding to the joining angle can be directly obtained according to the curve Z = f(y).

[0099] The three-dimensional printing method, device, equipment and storage medium provided by the embodiments of the present invention obtain the ink layer thickness of the corresponding surface through the joining angle of the printing substrate surface to be inkjet, and confirm the printing modes: the inkjet mode and the curing mode according to the ink layer thickness and the preset thickness; obtain the number of ink layers to be divided according to the preset thickness and the ink layer thickness, obtain the single-scan thickness according to the number of ink layers and the nozzle accuracy, that is, the ink data ejected each time of scanning, obtain the inkjet mode, and confirm the curing time and curing power according to the thickness of each ink layer. Each ink layer corresponds to one curing, and obtain the curing mode.

[0100] Based on the fact that for each inkjet printing, the printed area covered with ink needs to be irradiated and cured by a UV lamp once. That is, in the present invention, it is divided according to the ink volume of a preset thickness, and the nozzle is controlled to stack ink layer by layer on the printing area according to the divided ink layers and the ink layer thickness corresponding to each ink layer. A ink layer with a preset thickness is obtained on the surface of the substrate. During the printing process, the UV lamp is controlled to perform light curing again and again to prevent the ink of the ink layer from flowing to other adjacent surfaces. By splitting the ink volume to be ejected and performing sub-printing during inkjet printing, and curing the ink after each printing, it is ensured that the ink will not fail to adhere to the surface due to a large amount and flow to other adjacent surfaces, resulting in the ink layer thickness on the said surface and adjacent surfaces not meeting the printing requirements.

[0101] Embodiment 2

[0102] Based on the three-dimensional substrate printing method provided in the above embodiment, as Figure 8 shown, the embodiment of the present invention provides a three-dimensional substrate printing method, and the method includes:

[0103] S10: Obtain the connection angle between two adjacent surfaces of the three-dimensional substrate and the ink viscosity of the inkjet printing ink;

[0104] S20: Perform inkjet printing on the substrate surface according to the ink viscosity and the connection angle to obtain the ink layer thickness covered by a single scan inkjet corresponding to different ink viscosities and different connection angles;

[0105] S30: Obtain the preset thickness that needs to be covered by inkjet on the three-dimensional substrate surface;

[0106] S40: Generate a printing mode according to the preset thickness and the ink layer thickness, and the printing mode includes an inkjet mode and a curing mode;

[0107] S50: Perform inkjet printing on the three-dimensional substrate surface according to the inkjet mode and the curing mode until the printing is completed.

[0108] Specifically, the ink viscosity is obtained. Inks with different viscosities will affect the ink hanging rate on the substrate surface to a certain extent, that is, the ink layer thickness covered by a single scan inkjet of the nozzle on the same printing area. Due to the problem of the connection angle, the ink will flow to the adjacent surface, resulting in the thickness of the ink on the ejected substrate surface being smaller than the ink layer thickness in the ideal case without flow.

[0109] Determine the ink layer thickness covered by a single inkjet at different bridging angles according to the ink viscosity and the bridging angle. The ink layer thickness covered by a single scan inkjet corresponding to different bridging angles is different. For the convenience of printing, inkjet printing is performed on the surface of the substrate with specific different bridging angles according to the ink of the same viscosity, and the ink flow situation corresponding to different bridging angles is obtained. The ink layer thickness covered by a single inkjet corresponding to similar or the same ink flow situation is set to be the same. For example, when the bridging angle is A1, the ink flow situation is B1; when the bridging angle is A2, the ink flow situation is B2; when the bridging angle is A3, the ink flow situation is B3. When B1 and B2 in the ink flow situations are similar or the same, set the ink layer thickness covered by a single inkjet corresponding to the bridging angles A1 and A2 to be the same; when B3 in the ink flow situations is quite different from B1 and B2, set the ink layer thickness covered by a single inkjet corresponding to the bridging angle A3 to be different from the ink layer thickness covered by a single inkjet corresponding to A1 and A2.

[0110] In one embodiment, S20: performing inkjet printing on the surface of the substrate according to the ink viscosity and the bridging angle, and obtaining the ink layer thickness covered by a single scan inkjet corresponding to different ink viscosities and different bridging angles includes:

[0111] Establish the corresponding relationship between different ink viscosities, different bridging angles and the ink layer thickness covered by a single scan inkjet;

[0112] Obtain the ink layer thickness covered by a single scan inkjet corresponding to each surface of the substrate according to the corresponding relationship.

[0113] Specifically, obtain different ink viscosities, perform inkjet printing on the surfaces with different bridging angles according to the inks of different viscosities, record their ink flow situations, and obtain the corresponding relationship between different ink viscosities, different bridging angles and the ink layer thickness covered by a single scan inkjet.

[0114] Meanwhile, create a curve Z = f(x, y) of ink viscosity x, bridging angle y and the ink layer thickness Z covered by a single inkjet according to the corresponding relationship. The ink layer thickness covered by a single scan inkjet corresponding to the ink viscosity and the bridging angle can be directly obtained according to the curve Z = f(x, y).

[0115] The three-dimensional substrate printing method, device, equipment and storage medium provided by the embodiments of the present invention obtain the ink layer thickness covered by a single scanning inkjet through the ink viscosity of the ink to be printed and the corresponding connection angle of the substrate surface to be printed, obtain the printing mode according to the ink layer thickness covered by a single scanning inkjet and the preset thickness, obtain the number of ink layers to be divided, the number of scanning inkjet times corresponding to each ink layer, the volume of ink to be sprayed for each ink layer and the ink data corresponding to each scanning inkjet according to the preset thickness and the ink layer thickness, that is, the inkjet mode, based on the need to perform UV lamp irradiation and curing on the printed area covered with ink for each completed inkjet printing of an ink layer, that is, the present invention divides the ink according to the preset thickness of the ink volume, controls the nozzle according to the divided ink layers and the ink layer thickness corresponding to each ink layer to control the nozzle to stack ink layer by layer on the printing area, obtains the ink layer of preset thickness on the substrate surface, and controls the UV lamp to perform light curing again and again during the printing process to prevent the ink of the ink layer from flowing onto other adjacent surfaces. The present invention divides the amount of ink that needs to be sprayed, performs printing in batches during inkjet printing, and solidifies the ink after each printing, thereby ensuring that the ink is unable to adhere to the surface due to the large amount, and does not flow to other adjacent surfaces, causing the ink layer thickness on the surface and adjacent surfaces to fail to meet the printing requirements.

[0116] Example 3

[0117] See also Figure 9 The embodiment of the present invention provides a three-dimensional substrate printing device, the device comprising:

[0118] A preset thickness module 1 is used to obtain a preset thickness of the surface of the three-dimensional substrate that needs to be covered by inkjet;

[0119] Printing mode module 2, used for obtaining the printing mode according to the preset thickness, wherein the printing mode includes inkjet mode and curing mode;

[0120] The inkjet module 3 is used to cover the surface of the three-dimensional substrate with ink according to the inkjet mode;

[0121] A curing module 4, used for curing the ink on the surface of the three-dimensional substrate according to the curing mode;

[0122] The circulation module 5 is used for repeating the inkjet module and the curing module.

[0123] The printing mode module comprises:

[0124] An ink layer dividing unit, used for dividing a plurality of ink layers according to the preset thickness, and obtaining the ink layer thickness corresponding to each ink layer;

[0125] An inkjet mode determination unit for determining the inkjet mode according to the number of ink layers and the thickness of the ink layer;

[0126] A curing parameter setting unit for obtaining the curing parameters of the corresponding ink layer according to the thickness of the ink layer, the curing parameters including the curing time and the curing power.

[0127] The inkjet module 3 further includes: for obtaining image data and generating print data according to the image data, the number of ink layers, and the thickness of the ink layer.

[0128] The circulation module 5 includes:

[0129] An area parameter acquisition unit for acquiring the size of the printing area of each surface of the three-dimensional substrate;

[0130] A sorting unit for sorting in ascending order according to the size of the printing area to obtain the printing order of inkjetting on the surface;

[0131] An inkjet control unit for controlling the inkjet head to perform inkjet printing on the surface of the three-dimensional substrate according to the printing order.

[0132] When the ink layer in the inkjet mode includes a first ink layer and a second ink layer, and the curing mode includes pre-curing corresponding to the first ink layer and final curing corresponding to the second ink layer, the circulation module includes:

[0133] A first ink layer printing unit for controlling the inkjet head to perform inkjet printing on the printing area according to the print data corresponding to the first ink layer;

[0134] A pre-curing unit for pre-curing the ink layer on the printing area according to the curing parameters corresponding to the pre-curing;

[0135] A second ink layer printing unit for controlling the inkjet head to perform inkjet printing on the pre-cured ink layer according to the print data corresponding to the second ink layer;

[0136] A final curing unit for performing final curing on the ink layer according to the curing parameters corresponding to the final curing.

[0137] In an embodiment, the printing mode module 2 includes:

[0138] An abutting angle acquisition unit for acquiring the abutting angle between two adjacent surfaces of the three-dimensional substrate;

[0139] An inkjet mode determination unit for determining the inkjet mode according to the abutting angle and the preset thickness.

[0140] The three-dimensional substrate printing device provided in this embodiment obtains a printing mode according to the amount of ink covered on the surface of the substrate corresponding to a preset thickness, and obtains the split number of ink layers, the corresponding number of scanning inkjet times for each ink layer, and the ink data to be ejected for each scanning inkjet, that is, the inkjet mode, based on the preset thickness. That is, for each inkjet printing completed, the printed area covered with ink needs to be irradiated and cured by a UV lamp once. That is, the present invention divides according to the amount of ink with a preset thickness, controls the nozzle to stack ink layer by layer on the printing area according to the divided ink layers and the ink layer thickness corresponding to each ink layer, and obtains an ink layer with a preset thickness on the surface of the substrate. During the printing process, the UV lamp is controlled to perform light curing again and again to prevent the ink of the ink layer from flowing to other adjacent surfaces. The present invention splits the amount of ink to be ejected, performs sub-printing during inkjet printing, and cures the ink after each printing, ensuring that the ink will not fail to adhere to the surface due to a large amount and flow to other adjacent surfaces, resulting in the ink layer thickness on the surface and adjacent surfaces not meeting the printing requirements.

[0141] Embodiment 4

[0142] In addition, combined with Figure 1 The three-dimensional substrate printing method described in the embodiments of the present invention can be implemented by a three-dimensional substrate printing device. Figure 10 The schematic diagram of the hardware structure of the three-dimensional substrate printing device provided in the embodiments of the present invention is shown.

[0143] The three-dimensional substrate printing device may include a processor and a memory storing computer program instructions.

[0144] Specifically, the above-mentioned processor may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present invention.

[0145] The memory may include a mass storage for data or instructions. By way of example and not limitation, the memory may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. Where appropriate, the memory may include removable or non-removable (or fixed) media. Where appropriate, the memory may be internal or external to the data processing device. In a particular embodiment, the memory is a non-volatile solid-state memory. In a particular embodiment, the memory includes a read-only memory (ROM). Where appropriate, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically rewritable ROM (EAROM), or a flash memory, or a combination of two or more of these.

[0146] The processor reads and executes the computer program instructions stored in the memory to implement any one of the three-dimensional substrate printing methods in the above embodiments.

[0147] In one example, the three-dimensional substrate printing device may further include a communication interface and a bus. Among them, as Figure 10 shown, the processor, the memory, and the communication interface are connected by the bus and complete communication with each other.

[0148] The communication interface is mainly used to implement communication between the various modules, devices, units, and / or devices in the embodiments of the present invention.

[0149] The bus includes hardware, software, or both, and couples the components of the three-dimensional substrate printing device to each other. By way of example and not limitation, the bus may include an accelerated graphics port (AGP) or other graphics bus, an enhanced industry standard architecture (EISA) bus, a front-side bus (FSB), a hyperTransport (HT) interconnect, an industry standard architecture (ISA) bus, an InfiniBand interconnect, a low-pin count (LPC) bus, a memory bus, a microChannel architecture (MCA) bus, a peripheral component interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a serial advanced technology attachment (SATA) bus, a video electronics standards association local (VLB) bus, or other suitable buses, or a combination of two or more of these. Where appropriate, the bus may include one or more buses. Although the embodiments of the present invention describe and illustrate specific buses, the present invention contemplates any suitable bus or interconnect.

[0150] In addition, in combination with the three-dimensional substrate printing method in the above embodiments, the embodiments of the present invention can provide a computer-readable storage medium to implement. Computer program instructions are stored on the computer-readable storage medium; when the computer program instructions are executed by a processor, any one of the three-dimensional substrate printing methods in the above embodiments is implemented.

[0151] In summary, the three-dimensional substrate printing method, device, equipment and storage medium provided by the embodiments of the present invention obtain a preset thickness that needs to be inkjet-covered on the surface of the three-dimensional substrate, and the preset thickness obtains a printing mode, where the printing mode includes an inkjet mode and a curing mode. The surface of the three-dimensional substrate is inkjet-covered once according to the inkjet mode, and the ink on the surface of the three-dimensional substrate is cured according to the curing mode. After the curing is completed, inkjet and curing are repeated until the printing is completed. The present invention obtains a printing mode according to the preset thickness of the ink amount required to be covered on the surface, obtains how many times of printing are required to obtain the ink amount of the preset thickness after inkjet according to the preset thickness, and the volume of ink that needs to be ejected each time, that is, the inkjet mode. Based on the fact that for each inkjet printing completed, the printed area covered with ink needs to be irradiated and cured by a UV lamp once, that is, the present invention divides according to the ink amount of the preset thickness, controls the nozzle to stack the ink layer by layer on the printing area according to the divided ink layers and the ink layer thickness corresponding to each ink layer, and obtains an ink layer with a preset thickness on the surface of the substrate. During the printing process, the UV lamp is controlled to perform light curing again and again to prevent the ink of the ink layer from flowing to other adjacent surfaces. The present invention splits the ink amount that needs to be ejected, performs sub-printing during inkjet printing, and cures the ink after each printing, ensuring that the ink will not fail to adhere to the surface due to a large amount and flow to other adjacent surfaces, resulting in the ink layer thickness on the surface and adjacent surfaces not meeting the printing requirements.

[0152] It should be clear that the present invention is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, the detailed description of known methods is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between steps after understanding the spirit of the present invention.

[0153] The functional blocks shown in the above-described structural block diagrams can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a functional card, and so on. When implemented in software, the elements of the present invention are programs or code segments for performing the required tasks. The program or code segment can be stored in a machine-readable medium or transmitted via a data signal carried in a carrier wave on a transmission medium or a communication link. A "machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROMs, flash memories, erasable ROMs (EROMs), floppy disks, CD-ROMs, optical disks, hard disks, fiber optic media, radio frequency (RF) links, and so on. The code segment can be downloaded via a computer network such as the Internet, an intranet, and so on.

[0154] It should also be noted that in the exemplary embodiments mentioned in the present invention, some methods or systems are described based on a series of steps or devices. However, the present invention is not limited to the order of the above steps, that is, the steps can be executed in the order mentioned in the embodiments, or different from the order in the embodiments, or several steps can be executed simultaneously.

[0155] As described above, the above is only the specific implementation manner of the present invention. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described systems, modules, and units can refer to the corresponding processes in the foregoing method embodiments and will not be repeated here. It should be understood that the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present invention.

Claims

1. A three-dimensional substrate printing method, characterized in that, The method includes: S1: Obtain the preset thickness that needs to be covered by inkjet on the surface of the three-dimensional printing substrate; S2: Obtain the printing mode according to the preset thickness, where the printing mode includes an inkjet mode and a curing mode; S3: Perform inkjet coverage on the surface of the three-dimensional printing substrate according to the inkjet mode; S4: Cure the ink on the surface of the three-dimensional printing substrate according to the curing mode; S5: Repeat steps S3 and S4 until printing is completed.

2. The method for printing on a three-dimensional substrate according to claim 1, wherein, The S2 includes: Divide a plurality of ink layers according to the preset thickness, and obtain the ink layer thickness corresponding to each ink layer; Determine the inkjet mode according to the number of ink layers and the ink layer thickness; obtain the curing parameters corresponding to the corresponding ink layer according to the ink layer thickness, where the curing parameters include a curing time and a curing power.

3. The three-dimensional substrate printing method according to claim 2, characterized in that, Before the S3 includes: Obtain image data, and generate printing data according to the image data, the number of ink layers, and the ink layer thickness.

4. The three-dimensional printing method for printing substrates according to claim 3, characterized in that When in the inkjet mode, the ink layer includes a first ink layer and a second ink layer, and the curing mode includes pre-curing corresponding to the first ink layer and final curing corresponding to the second ink layer, the S5 includes: Control the print head to perform inkjet printing on the printing area according to the printing data corresponding to the first ink layer; Pre-cure the ink layer on the printing area according to the curing parameters corresponding to the pre-curing; Control the print head to perform inkjet printing on the pre-cured ink layer according to the printing data corresponding to the second ink layer; Perform final curing on the ink layer according to the curing parameters corresponding to the final curing.

5. The printing method for a three-dimensional substrate according to claim 4, wherein The curing parameters corresponding to the pre-curing of the first ink layer are determined according to the ink layer thickness of the first ink layer, and the curing parameters corresponding to the final curing of the second ink layer are determined according to the ink layer thickness of the second ink layer.

6. The method for printing on a three-dimensional substrate according to claim 5, characterized in that, The method further includes: Obtain the size of the printing area on each surface of the three-dimensional printing substrate; Sort according to the size of the printing area from small to large, and obtain the printing order for inkjetting on the surface; Control the print head to perform inkjet printing on the surface of the three-dimensional printing substrate according to the printing order.

7. The three-dimensional substrate printing method according to any one of claims 1-6, characterized in that, The S2 includes: Obtain the joining angle of two adjacent surfaces of the three-dimensional printing substrate; Determine the inkjet mode according to the joining angle and the preset thickness.

8. A three-dimensional printing device for printing substrates, characterized in that, The device includes: A preset thickness module, configured to obtain the preset thickness that needs to be covered by inkjet on the surface of the three-dimensional printing substrate; A printing mode module, configured to obtain the printing mode according to the preset thickness, where the printing mode includes an inkjet mode and a curing mode; An inkjet module, configured to perform inkjet coverage on the surface of the three-dimensional printing substrate according to the inkjet mode; A curing module, configured to cure the ink on the surface of the three-dimensional printing substrate according to the curing mode; A loop module, configured to repeat the inkjet module and the curing module until printing is completed.

9. A three-dimensional printing device for printing substrates, characterized in that, Includes: At least one processor, at least one memory, and computer program instructions stored in the memory, where when the computer program instructions are executed by the processor, the method described in any one of claims 1-7 is implemented.

10. A storage medium, on which computer program instructions are stored, characterized in that, When the computer program instructions are executed by the processor, the method described in any one of claims 1-7 is implemented.

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