Electronic package and fabrication method thereof

Abstract

The invention relates to an electronic package and a method of fabricating the same. The electronic package includes: a carrier structure; the electronic component is arranged on the bearing structure and is electrically connected with the bearing structure; the supporting structure is arranged on the bearing structure; a semiconductor element disposed on the carrier structure; and the photoelectric element is arranged on the semiconductor element and is electrically connected with the semiconductor element, and the photoelectric element is locally supported by the supporting structure. Through the implementation of the invention, the photoelectric element in the electronic packaging piece and / or the optical fiber connected to the electronic packaging piece can be well and stably supported, and the photoelectric element and / or the optical fiber are / is prevented from being broken, so that the manufacturing yield and the use reliability of the electronic packaging piece are improved, and the service life of the electronic packaging piece is prolonged.

Description

Technical Field

[0001] The present invention relates to a semiconductor device, and more particularly to an electronic package having a photonic component and a manufacturing method thereof. Background Art

[0002] With the vigorous development of the electronics industry, electronic products are gradually moving towards the trend of multi-function and high performance. The application of the current fifth-generation (5G) communication technology has been extended to various fields such as the Internet of Things (IoT), Industrial Internet of Things (IIoT), Cloud, artificial intelligence (AI), autonomous cars, and medical. And with the expansion of the application level, a very large amount of data needs to be efficiently transmitted, calculated, and stored. Especially for the data transmission demand, it has emerged in large quantities, making the industry start to use "light" instead of "electricity" as the carrier of data transmission to increase the transmission capacity, efficiency, or distance, and reduce the energy consumption during transmission. Under this background, silicon photonics components and their application products, as well as co-package optics, have become the development trend of future semiconductor and packaging technologies.

[0003] Figure 1A And Figure 1B FIG. is a cross-sectional schematic view of a semiconductor package 1 of an existing co-package optic. As Figure 1A shown, on a substrate 10 of the semiconductor package 1, there are respectively provided an electronic integrated circuit (Electronic IC, EIC for short) component 11A, an electronic component 11B, and a photonic integrated circuit (Photonic IC, PIC for short) component 12 combined above the electronic integrated circuit component 11A. One side end of the photonic integrated circuit component 12 is connected to an optical fiber 70, and a shelf 13 is provided below the connection between the photonic integrated circuit component 12 and the optical fiber 70.

[0004] However, in the above-mentioned existing semiconductor package 1, in order to connect the photonic integrated circuit component 12 to the optical fiber 70, one end thereof connected to the optical fiber 70 must be adjacent to or even protrude from the side of the substrate 10. Although the shelf 13 is provided below the connection between the two, since the shelf 13 is located outside the semiconductor package 1, it is not firmly supported itself. In this case, when subjected to an external force caused by, for example, the optical fiber 70 being shaken or pulled, the photonic integrated circuit component 12 is very easy to be like Figure 1BThe general breakage shown causes a reduction in reliability and service life. Moreover, the structure that slightly protrudes from the substrate 10 may also be damaged due to collisions or other reasons during the manufacturing process, thus reducing the yield rate of the manufacturing process.

[0005] Therefore, how to overcome the problems of the above-mentioned prior art has actually become an urgent issue to be solved currently. Summary of the Invention

[0006] In view of the various deficiencies of the above-mentioned prior art, the present invention provides an electronic package, including: a carrier structure; an electronic component disposed on the carrier structure and electrically connected to the carrier structure; a support structure disposed on the carrier structure; a semiconductor component disposed on the carrier structure and electrically connected to the carrier structure; and an optoelectronic component disposed on the semiconductor component and electrically connected to the semiconductor component, and the optoelectronic component is partially supported by the support structure.

[0007] The present invention also provides a method for manufacturing an electronic package, including: providing a carrier structure; disposing an electronic component on the carrier structure and electrically connecting the electronic component to the carrier structure; disposing a support structure on the carrier structure; disposing a semiconductor component on the carrier structure and electrically connecting the semiconductor component to the carrier structure; and disposing an optoelectronic component on the semiconductor component and electrically connecting the optoelectronic component to the semiconductor component, and the optoelectronic component is partially supported by the support structure.

[0008] In the above-mentioned electronic package and its manufacturing method, the semiconductor component is an electronic integrated circuit (Electronic IC, hereinafter referred to as EIC).

[0009] In the above-mentioned electronic package and its manufacturing method, the optoelectronic component is a photonic integrated circuit (Photonic IC, hereinafter referred to as PIC).

[0010] In the above-mentioned electronic package and its manufacturing method, the optoelectronic component is connected to an optical fiber.

[0011] In the above-mentioned electronic package and its manufacturing method, the optical fiber passes through at least part of the top end of the support structure.

[0012] In the above-mentioned electronic package and its manufacturing method, the support structure is provided with a groove so that at least part of the optical fiber is accommodated in the groove.

[0013] In the above-mentioned electronic package and its manufacturing method, the support structure is provided with a protective layer, and at least part of the optical fiber is fixed by the protective layer.

[0014] In the above-mentioned electronic package and its manufacturing method, the support structure is made of a heat-conducting material.

[0015] In the foregoing electronic package and its manufacturing method, the electronic component is a switch chip.

[0016] As can be seen from the above, in the electronic package and its manufacturing method of the present invention, by providing a support structure on the carrier structure, the optoelectronic components in the electronic package and / or the optical fibers connected to the electronic package can be well and stably supported, avoiding breakage of the optoelectronic components and / or the optical fibers near the connection, thereby improving the manufacturing yield, reliability and service life of the electronic package during use. Description of the Drawings

[0017] Figures 1A to 1B It is a schematic cross-sectional view of a semiconductor package of co-packaged optics in the prior art.

[0018] Figures 2A to 2C It is a schematic cross-sectional view of the manufacturing method of the electronic package of the present invention.

[0019] Figure 2B-1 It is a schematic top view of the manufacturing method of the electronic package of the present invention.

[0020] Figure 2D It is a schematic top view of an embodiment of the electronic package of the present invention.

[0021] Figures 3A to 3C It is a schematic side view of the support structure of the electronic package of the present invention in different embodiments.

[0022] Description of Reference Numerals

[0023] 1 Semiconductor package

[0024] 10 Substrate

[0025] 11A Electronic integrated circuit component

[0026] 11B, 30 Electronic component

[0027] 12 Photonic integrated circuit component

[0028] 13 Bracket

[0029] 2 Electronic package

[0030] 20 Carrier structure

[0031] 210 Insulating layer

[0032] 310 Conductive bump

[0033] 40 Support structure

[0034] 41 Slot

[0035] 42 Groove

[0036] 43 Protective layer

[0037] 50 Semiconductor component

[0038] 60 Optoelectronic component

[0039] 70 Optical fiber. Detailed implementation manners

[0040] The following describes the implementation manners of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0041] It should be noted that the structures, ratios, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they do not have a substantial technical meaning. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "first", "second", "third", "one", etc. cited in this specification are only for the convenience of clear narration, and are not used to limit the scope of implementation of the present invention. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope that the present invention can implement.

[0042] Figures 2A to 2C It is a cross-sectional schematic view of the manufacturing method of the electronic package 2 of the present invention.

[0043] As Figure 2A shown, first, a carrier structure 20 is provided. The carrier structure 20 can be a redistribution layer (RDL) structure or a semiconductor packaging substrate. In this embodiment, the carrier structure 20 is a semiconductor packaging substrate, such as a packaging substrate with a core layer or a coreless circuit structure, and the circuit structure includes at least one insulating layer 210 and at least one circuit layer (not shown in the figure) that combines with the insulating layer 210. The material of the insulating layer 210 is, for example, a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc. The circuit layer is, for example, a fan-out type redistribution layer. It should be understood that the carrier structure 20 can also be other plates, such as a lead frame, a wafer, or other carrier plates with metal routing, and is not limited to the above.

[0044] Next, an electronic component 30 is disposed on the carrier structure 20, and the electronic component 30 is electrically connected to the carrier structure 20.

[0045] Then, as Figure 2B and Figure 2B-1 shown, a support structure 40 is disposed on one side of the carrier structure 20. The support structure 40 has a slot 41 communicating its top surface and bottom surface, such that the bottom of the slot 41 can expose a partial surface of the carrier structure 20.

[0046] As Figure 2C shown, a semiconductor component 50 is respectively disposed in each slot 41 of the carrier structure 20. Each semiconductor component 50 is electrically connected to the carrier structure 20 exposed at the bottom of the slot 41, and the height of the semiconductor component 50 does not exceed the height of the surrounding carrier structure 20, so its top surface does not protrude beyond the periphery of the slot 41.

[0047] Then, an optoelectronic component 60 is disposed on the semiconductor component 50. A part of the bottom of the optoelectronic component 60 is placed on the semiconductor component 50 and is electrically connected to the semiconductor component 50. The other side end of the optoelectronic component 60 is located outside the slot 41 and abuts against the support structure 40 and is supported by the support structure 40. That is, the optoelectronic component 60 is partially supported by the support structure 40, such that even when the outer end of the optoelectronic component 60 is subjected to an external force, especially an external force in the up and down direction, the optoelectronic component 60 will not break or be damaged, so the yield of the manufacturing process can be improved.

[0048] Specifically, one or more electronic components 30 can be disposed on the carrier structure 20. For the sake of simplicity of description, in this embodiment, the case of only disposing one electronic component 30 is used as an example for explanation. The electronic component 30 can be an active component such as a switch chip, a High Bandwidth Memory (HBM) chip, or other functional chips, or can also be a passive component such as a resistor, a capacitor, or an inductor. As long as it is a component that can meet the designed functional requirements, this embodiment has no limitation in this regard.

[0049] The electronic component 30 can be electrically connected to the carrier structure 20 in a flip-chip manner through a plurality of conductive bumps 310 such as solder bumps, copper bumps, or others, for example, electrically connected to a circuit layer (not shown) provided on the surface or inside of the carrier structure 20. In practice, there are various ways to electrically connect the electronic component 30 to the carrier structure 20, not limited to the above.

[0050] The number of semiconductor components 50 and optoelectronic components 60 can each be one or more, depending on the functional requirements of this electronic package 2. In this embodiment, two semiconductor components 50 are provided on the carrier structure 20 as an example. The semiconductor component 50 can be various active or passive components. For example, it can be an electronic integrated circuit (Electronic IC, abbreviated as EIC), but is not limited thereto.

[0051] In order to allow the semiconductor component 50 to be disposed on the carrier structure 20 and electrically connected to the carrier structure 20, slots 41 are provided at positions corresponding to the semiconductor component 50 on the support structure 40, so that each semiconductor component 50 can be received in the slots 41. In this embodiment, a slot 41 is formed at a position corresponding to each semiconductor component 50 on the support structure 40, that is, an embodiment in which a total of two slots 41 are provided on the support structure 40 is taken as an example. In other variant embodiments, only one larger slot 41 can also be provided on the support structure 40 and a plurality of semiconductor components 50 can be received therein. In this regard, there is no special limitation in this embodiment.

[0052] The optoelectronic component 60 is disposed on the semiconductor component 50 and protrudes above the slot 41, and the optoelectronic component 60 is electrically connected to the semiconductor component 50 below it. And the part of the optoelectronic component 60 close to the outside of the carrier structure 20 is leaned against the top of the support structure 40 and is supported by the support structure 40.

[0053] As for the type of the optoelectronic component 60, it can be an optical-electric converter, an optical signal receiver, an optical signal transmitter, or a photonic integrated circuit (Photonic IC, abbreviated as PIC) that meets the functional requirements. Taking the embodiment with two optoelectronic components 60 in this embodiment as an example, one of the two optoelectronic components 60 can be used to receive an optical signal, and the other can be used to transmit an optical signal. Or they can be optoelectronic components 60 of the same type respectively connected to two different external signal sources. This depends on the functional design and planning of this package and there is no particularity.

[0054] In actual application, the optoelectronic component 60 is connected to an external optical fiber 70 to receive or transmit an optical signal. In order to enable the part where the optoelectronic component 60 is connected to the optical fiber 70 to be better supported and protected to prevent breakage, the optical fiber 70 connected to the optoelectronic component 60 will all pass through at least part of the top end of the support structure 40. And as Figure 3A shown, the part of the optical fiber 70 passing through the top end of the support structure 40 is supported by the support structure 40. In this way, in addition to enabling the optoelectronic component 60 itself to be supported and protected by the support structure 40, it can also prevent the optoelectronic component 60 from being damaged due to accidental movement of the optical fiber 70 in the vertical direction and pulling on the optoelectronic component 60.

[0055] In addition, asFigure 3B As shown, in order to provide a better supporting effect, a groove 42 may be formed on the support structure 40 so that at least a part of each optical fiber 70 is received and fixed in the corresponding groove 42. In this way, the optical fiber 70 can be supported not only in the vertical direction, but also fixed or restricted in the horizontal direction, so that it will not accidentally move in these two directions and affect the optoelectronic element 60, resulting in damage or even breakage of the optoelectronic element 60.

[0056] In addition to the above method of fixing or restricting the optical fiber 70 with the groove 42, it is also possible to Figure 3C as shown, provide a protective layer 43 on the support structure 40 and fix at least a part of each optical fiber 70 in the protective layer 43. This can also achieve the purpose of restricting the accidental movement of the optical fiber 70 in the horizontal direction.

[0057] The protective layer 43 can be made of materials such as polyimide (PI for short), dry film, or encapsulation colloids or encapsulation materials (molding compound) such as epoxy resin, or materials such as green paint and ink. It is formed on the support structure 40 by means such as liquid compound or spraying, and at least the bottom of the optical fiber 70 is placed therein before it is cured. Then, after the protective layer 43 is cured, the optical fiber 70 can be firmly fixed. Of course, the material of the protective layer 43 can also be made of any other suitable material, not limited to those listed here.

[0058] In some preferred embodiments, the support structure 40 can also be made of a heat-conducting material. Even the inner wall of the slot 41 of the support structure 40 made of such a heat-conducting material can form thermal contact with the semiconductor element 50 in the slot 41 and the optoelectronic element 60 leaning on the support structure 40. In this way, in addition to providing support for the optoelectronic element 60, the support structure 40 can also help the heat generated by the optoelectronic element 60 or even the semiconductor element 50 below during operation to be quickly conducted and dissipated, thereby further improving the reliability and service life of the electronic package 2.

[0059] In addition to the above manufacturing method, the present invention also provides an electronic package 2 corresponding to the manufacturing method. The electronic package 2 includes: a carrier structure 20; an electronic component 30 disposed on the carrier structure 20 and electrically connected to the carrier structure 20; a support structure 40 disposed on the carrier structure 20; a semiconductor component 50 disposed on the carrier structure 20 and electrically connected to the carrier structure 20, and the height of the semiconductor component 50 is not higher than the height of the support structure 40; and an optoelectronic component 60 disposed on the semiconductor component 50 and electrically connected to the semiconductor component 50, and the optoelectronic component 60 is partially supported by the support structure 40.

[0060] In one embodiment, the semiconductor component 50 is an electronic integrated circuit (EIC).

[0061] In one embodiment, the optoelectronic component 60 is a photonic integrated circuit (PIC).

[0062] In one embodiment, the optoelectronic component 60 is connected to an optical fiber 70.

[0063] In one embodiment, the optical fiber 70 passes through at least a part of the top end of the support structure 40.

[0064] In one embodiment, a groove 42 is provided on the support structure 40 to accommodate at least a part of the optical fiber 70 in the groove 42.

[0065] In one embodiment, a protective layer 43 is provided on the support structure 40, and at least a part of the optical fiber 70 is fixed by the protective layer 43.

[0066] In one embodiment, the support structure 40 is made of a heat-conducting material.

[0067] In one embodiment, the electronic component 30 is a conversion chip.

[0068] In summary, for the electronic package 2 and its manufacturing method of the present invention, by providing the support structure 40 on the carrier structure 20, the optoelectronic component 60 in the electronic package 2 and / or the optical fiber 70 connected to the electronic package 2 can be well and stably supported, avoiding breakage of the optoelectronic component 60 and / or the optical fiber 70 near the connection, thereby improving the manufacturing yield of the electronic package 2 and the reliability and lifespan during use.

[0069] The above embodiments are used to illustrate the principles and effects of the present invention by way of example, rather than to limit the present invention. Any person skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of the claims of the present invention shall be as set forth in the claims.

Claims

1. An electronic package, comprising: A carrier structure; An electronic component, which is disposed on the carrier structure and electrically connected to the carrier structure; A support structure, which is disposed on the carrier structure; A semiconductor component, which is disposed on the carrier structure and electrically connected to the carrier structure; And An optoelectronic component, which is disposed on the semiconductor component and electrically connected to the semiconductor component, and the optoelectronic component is partially supported by the support structure.

2. The electronic package according to claim 1, wherein, The semiconductor component is an electronic integrated circuit.

3. The electronic package according to claim 1, wherein, The optoelectronic component is a photonic integrated circuit.

4. The electronic package according to claim 1, wherein, The optoelectronic component is connected to an optical fiber.

5. The electronic package according to claim 4, wherein, The optical fiber passes through at least a part of the top of the support structure.

6. The electronic package according to claim 5, wherein, A groove is provided on the support structure to accommodate at least a part of the optical fiber therein.

7. The electronic package according to claim 5, wherein, A protective layer is provided on the support structure, and at least a part of the optical fiber is fixed by the protective layer.

8. The electronic package according to claim 1, wherein The support structure is made of a heat-conducting material.

9. The electronic package according to claim 1, wherein, The electronic component is a conversion chip.

10. A method for manufacturing an electronic package, comprising: Disposing an electronic component on a carrier structure and electrically connecting the electronic component to the carrier structure; Disposing a support structure on the carrier structure; Disposing a semiconductor component on the carrier structure and electrically connecting the semiconductor component to the carrier structure; and Disposing an optoelectronic component on the semiconductor component and electrically connecting the optoelectronic component to the semiconductor component, and the optoelectronic component is partially supported by the support structure.

11. The manufacturing method according to claim 10, wherein, The semiconductor component is an electronic integrated circuit.

12. The manufacturing method according to claim 10, wherein, The optoelectronic component is a photonic integrated circuit.

13. The manufacturing method according to claim 10, wherein, The optoelectronic component is connected to an optical fiber.

14. The manufacturing method according to claim 13, wherein, The optical fiber passes through at least a part of the top of the support structure.

15. The manufacturing method according to claim 14, wherein, A groove is provided on the support structure to accommodate at least a part of the optical fiber therein.

16. The manufacturing method according to claim 14, wherein, A protective layer is provided on the support structure, and at least a part of the optical fiber is fixed by the protective layer.

17. The manufacturing method according to claim 10, wherein, The support structure is made of a heat-conducting material.

18. The manufacturing method according to claim 10, wherein, The electronic component is a conversion chip.

Images