Wafer loading device and cleaning machine

Abstract

The present application provides a wafer loading device and a cleaning machine, which belongs to the field of wafer cleaning technology and solves the problem of high damage rate in the wafer loading process of the prior art. The wafer loading device of the present application includes a feeding assembly and a collecting assembly. The feeding assembly includes a transmission roller group and a first driving mechanism. The transmission roller group has multiple transmission rollers. A conveying channel is formed between the multiple transmission rollers. The conveying channel allows wafers to be put in and conveyed. The conveying channel extends along a first direction. The first direction is vertically downward or inclined downward. The first driving mechanism acts on the transmission roller; the collecting assembly includes a material frame and a second driving mechanism. The material frame is arranged below the transmission roller group. A collecting station is provided in the material frame. The second driving mechanism acts on the material frame to drive the material frame to move and switch the collecting station to dock with the conveying channel; a clearance area is formed between the collecting station and the transmission roller group to avoid wafers that move synchronously with the collecting station. The present application provides a new loading method that can reduce the damage rate of wafer loading.

Description

Technical Field

[0001] The present application belongs to the field of wafer cleaning technology, and specifically relates to a wafer loading device and a cleaning machine. Background Art

[0002] In the semiconductor cleaning process, wafer surface flatness and defect-freeness are key factors in ensuring chip quality. During the post-grinding cleaning process, wafer loading is typically performed manually, involving transferring the wafers from the grinder to the cleaning machine. Existing post-grinding cleaning machine wafer loading devices mostly utilize a water slide. While this system plays an important role in improving production efficiency, it also presents certain challenges, particularly a high risk of scratches on the wafer surface.

[0003] Wafers are extremely delicate and fragile materials. Even tiny scratches on their surfaces can cause defects in subsequent processing, impacting product quality and yield. Existing loading methods, lacking effective protective measures, are susceptible to unstable water flow, leading to collisions and friction during loading, which can cause scratches on the wafer surface and, in severe cases, even render the wafer scrapped.

[0004] Based on the above content, the technical problem of this application is: how to reduce the damage rate of the wafer loading process. Summary of the Invention

[0005] The purpose of this application is to address the above-mentioned problems existing in the prior art and propose a wafer loading device and a cleaning machine to solve the problem of high damage rate in the wafer loading process of the prior art and reduce the damage rate of the wafer loading process.

[0006] The objectives of the present application can be achieved through the following technical solutions: A wafer loading device, comprising: a feeding assembly, the feeding assembly comprising: a drive roller group, the drive roller group having a plurality of drive rollers, a conveying channel formed between the plurality of drive rollers, the conveying channel allowing wafers to be put in and conveyed, the conveying channel extending along a first direction, the first direction being vertically downward or inclined downward; a first driving mechanism, the first driving mechanism acting on the drive roller to drive the wafer to move along the conveying channel; a collecting assembly, the collecting assembly comprising: a material frame, the material frame being arranged below the drive roller group, a plurality of collecting stations being arranged in the material frame, the collecting stations being located below the conveying channel; a second driving mechanism, the second driving mechanism acting on the material frame to drive the material frame to move and switch one of the collecting stations to dock with the conveying channel; wherein a clearance area is formed between the collecting station and the drive roller group, the clearance area being used to avoid wafers that move synchronously with the collecting station.

[0007] In the above-mentioned wafer loading device, the clearance area includes a first area and a second area. The first area is formed by the hollow setting of the transmission roller group on the side close to the moving direction of the material frame. The space of the first area gradually expands from top to bottom. The second area is formed between the first area and the collection station.

[0008] In the above-mentioned wafer loading device, the transmission roller group includes: a first roller group, the first roller group includes: a first main roller, the first main roller is connected to the output end of the first driving mechanism; a first auxiliary roller, the first auxiliary roller and the first main roller are spaced apart by the conveying channel; a second roller group, the second roller group includes: a second main roller, the second main roller is arranged below the first main roller; a second auxiliary roller, the second auxiliary roller and the second main roller are spaced apart by the conveying channel, and the middle part of the second auxiliary roller is disconnected to form a second gap; and a third roller group, the third roller group includes: a third main roller, the third main roller is arranged below the second main roller; a third auxiliary roller, the third auxiliary roller and the third main roller are spaced apart by the conveying channel, and the middle part of the third auxiliary roller is disconnected to form a third gap; wherein the length of the second gap is smaller than the length of the third gap, the second gap and the third gap constitute part of the first zone, and the second zone is formed below the third gap and between the collection station.

[0009] In the above-mentioned wafer loading device, a plurality of second roller groups are provided in the first direction, and the second gaps of the second roller groups gradually increase from top to bottom.

[0010] In the above-mentioned wafer loading device, the second auxiliary roller has the freedom of movement in the axial direction to adjust the length of the second gap, and / or the third auxiliary roller has the freedom of movement in the axial direction to adjust the length of the third gap.

[0011] In the above-mentioned wafer loading device, at least two first main rollers are provided in the first direction, the distance between at least two first main rollers does not exceed the radius of the first main roller, and the number of the first auxiliary rollers distributed in the first direction matches the number of the first main rollers distributed.

[0012] In the above-mentioned wafer loading device, a guide plate is provided above the transmission roller group, and the guide plate is hollowed out to form a guide groove, and the guide groove leads to the conveying channel.

[0013] The above-mentioned wafer loading device also includes a spray assembly, which includes: a nozzle, which is arranged on the outside of the transmission roller group and is used to transport fluid; and a nozzle, which is connected to the nozzle and faces the transmission roller group.

[0014] In the above-mentioned wafer loading device, a plurality of supporting rollers are provided on the material frame, a plurality of material troughs are arranged in the axial direction of the supporting rollers, and the material troughs of the plurality of supporting rollers in the same radial direction constitute a single material collecting station.

[0015] In the above-mentioned wafer loading device, a detection sensor is provided outside the collecting station, and the detection sensor acts on the collecting station to detect whether the wafer is in place. The detection sensor is electrically connected or communicatively connected to the second driving mechanism.

[0016] In the above-mentioned wafer loading device, an elastic buffer sleeve layer is provided on the transmission roller. The elastic buffer sleeve layer is made of a flexible polymer material with a predetermined friction coefficient. There are multiple elastic buffer sleeve layers and they are distributed at intervals along the axial direction of the transmission roller. A separator is provided between adjacent elastic buffer sleeve layers, and the separator is used to form friction contact with the wafer.

[0017] Another object of the present application is to provide a wafer cleaning machine, comprising the wafer loading device as described above.

[0018] Compared with the prior art, this application has the following beneficial effects:

[0019] The wafer loading device of the present application forms a conveying channel through multiple transmission rollers arranged at intervals. The conveying channel allows for accommodating wafers. Both sides of the wafer can be tightly attached to adjacent transmission rollers, thereby cooperating with the drive of the first drive mechanism. The transmission rollers rotate to drive the wafers along the conveying channel to the collection station below. The width of the conveying channel, the friction coefficient between the transmission rollers and the wafers, and the driving power of the first drive mechanism are controllable, thereby ensuring the stability of the feeding process and reducing the damage rate of the wafer feeding process; and by setting a yield area between the collection station and the transmission roller group to avoid moving wafers, the material frame can switch multiple collection stations for interval filling, with a faster loading speed. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the three-dimensional structure of the wafer loading device of the present application;

[0021] Figure 2 This is a simplified structural diagram of the transmission roller assembly and the yield area of ​​the present application;

[0022] Figure 3 It is a structural diagram of the transmission roller group and the first driving mechanism of the present application;

[0023] Figure 4 It is a top view schematic diagram of the transmission roller group and the first driving mechanism of the present application;

[0024] Figure 5 yes Figure 4 Schematic diagram of the enlarged structure of area A in the middle;

[0025] Figure 6 It is a structural diagram of the material frame and the second driving mechanism of the present application;

[0026] In the figure, 100, feeding assembly; 110, transmission roller group; 111, first roller group; 1111, first main roller; 1112, first auxiliary roller; 112, second roller group; 1121, second main roller; 1122, second auxiliary roller; 113, third roller group; 1131, third main roller; 1132, third auxiliary roller; 1101, transmission roller; 11011, elastic buffer layer; 11012, separator; S, conveying channel; 120 , first driving mechanism; 130, conveyor belt; 200, material collection assembly; 210, material frame; 211, support roller; 2111, material trough; 212, detection sensor; G, material collection station; 220, second driving mechanism; Q, give way area; Q1, first area; Q2, second area; J2, second gap; J3, third gap; 300, guide plate; 310, guide groove; 400, spray assembly; 410, nozzle; 420, nozzle. DETAILED DESCRIPTION

[0027] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0030] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0031] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0032] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0033] Please refer to the attached drawings in the manual Figure 1 、 Figure 2 and Figure 4The wafer loading device of the present application includes a feeding assembly 100 and a collecting assembly 200. The feeding assembly 100 includes a transmission roller group 110 and a first driving mechanism 120. The transmission roller group 110 has a plurality of transmission rollers 1101. A conveying channel S is formed between the plurality of transmission rollers 1101. The conveying channel S allows wafers to be put in and conveyed. The conveying channel S extends along a first direction, which is vertically downward or inclined downward. The first driving mechanism 120 acts on the transmission rollers 1101 to drive the wafers to move along the conveying channel S. The material collection component 200 includes a material frame 210 and a second driving mechanism 220. The material frame 210 is arranged below the transmission roller group 110. A plurality of material collection stations G are provided in the material frame 210. The material collection station G is located below the conveying channel S. The second driving mechanism 220 acts on the material frame 210 to drive the material frame 210 to move and switch one of the material collection stations G to dock with the conveying channel S; wherein, a clearance area Q is formed between the material collection station G and the transmission roller group 110, and the clearance area Q is used to avoid wafers that move synchronously with the material collection station G. It should be noted that the width of the conveying channel S depends on the spacing between two adjacent drive rollers 1101. Since the radial surfaces of the drive rollers 1101 are circular or nearly circular, the spacing between adjacent drive rollers 1101 varies. The entrance width of the conveying channel S should be slightly larger than the thickness of the wafer, and the minimum spacing between two adjacent drive rollers 1101 should be substantially the same as the thickness of the wafer. This allows the drive rollers 1101 to contact and generate friction with the wafer. When the drive rollers 1101 rotate, they drive the wafer downward. The first drive mechanism 120 can be configured as a drive motor. The output end, i.e., the output shaft, of the first drive mechanism 120 drives the drive rollers 1101 to rotate, thereby conveying the wafer in the first direction along the conveying channel S. Since the wafer itself tends to move downward due to gravity, it is clamped by the two adjacent drive rollers 1101 to maintain stability and prevent it from falling directly into the material frame 210. When the wafer is conveyed, the first drive mechanism 120 only needs to provide a small driving force to achieve the rotation of the drive rollers 1101. And because the falling speed of the wafer is consistent with the rotation speed of the transmission roller 1101, the corresponding rotation speed is controlled by the first drive mechanism 120, that is, the falling speed of the wafer can be synchronously controlled, and the transportation stability and controllability are effectively improved, thereby reducing the damage rate of wafer loading. For the collection component 200, each collection station G of the material frame 210 collects the wafers, and then transfers them to the remaining processes for cleaning. In this application, a second drive mechanism 220 is additionally provided. The second drive mechanism 220 can be configured as a linear module. The second drive mechanism 220 is used to drive the material frame 210 to move linearly, thereby driving the collection station G to move to the bottom of the conveying channel S for docking. After one of the wafers falls to one of the collection stations G, the material frame 210 can move to switch different collection stations G to dock with the conveying channel S in turn, so that wafers are collected at each collection station G.It should be noted that by providing a clearance zone Q between the collecting station G and the transmission roller assembly 110, it is possible to prevent the wafers on the collecting station G from moving synchronously with the transmission roller assembly 110 when the material frame 210 moves, thereby ensuring a smooth wafer loading process and improving the loading rate. Figure 1 In some embodiments, a guide plate 300 is provided above the transmission roller assembly 110. The guide plate 300 is hollowed out to form a guide groove 310, which leads to the conveying channel S. It is understandable that the guide groove 310 is hollowed out in the guide plate 300, which can facilitate operators or robots to directly insert wafers without the need to precisely align the gap between the transmission rollers 1101, i.e., the conveying channel S, thereby achieving rapid feeding. More specifically, the thickness of the guide groove 310 needs to be configured to be greater than the thickness of a general wafer and can be slightly greater than the width of the conveying channel S. The length of the guide groove 310 needs to be configured to be greater than the outer diameter of a general wafer to facilitate the passage of the wafer.

[0034] See also Figure 1 and Figure 2 In some embodiments, the clearance zone Q includes a first zone Q1 and a second zone Q2. The first zone Q1 is formed by the hollowing of the drive roller assembly 110 on the side near the moving direction of the material frame 210. The space in the first zone Q1 gradually expands from top to bottom. The second zone Q2 is formed between the first zone Q1 and the collection station G. It can be understood that by arranging the side of the drive roller assembly 110 near the moving direction of the material frame 210 to be hollow, space in the first zone Q1 is reserved to avoid wafer movement. The space in the first zone Q1 gradually expands from top to bottom to adapt to the shape of the wafer. The cross-section of the first zone Q1 is approximately fan-shaped. The space in the second zone Q2 also avoids wafer movement. The space in the second zone Q2 is larger than that in the first zone Q1, providing more room for wafer movement.

[0035] See also Figure 1 and Figure 2 In some embodiments, a detection sensor 212 is provided on the outside of the material collection station G. The detection sensor 212 acts on the material collection station G to detect whether the wafer is in place. The detection sensor 212 is electrically connected or communicatively connected to the second drive mechanism 220. Exemplarily, the detection sensor 212 can be a photoelectric sensor, a proximity sensor, a pressure / weighing sensor, a visual sensor, an ultrasonic sensor, and the like. By setting the detection sensor 212 to detect and determine whether the wafer has arrived at the material collection station G, a corresponding signal is sent to the second drive mechanism 220. If it is determined that the wafer is in place, the second drive mechanism 220 can drive the material frame 210 to move its position, thereby switching the next material collection station G to dock with the conveying channel S for the next material collection, thereby realizing automatic loading and improving loading efficiency.

[0036] See also Figure 2 and Figure 3In some embodiments, the transmission roller group 110 includes a first roller group 111, a second roller group 112, and a third roller group 113. The first roller group 111 includes a first main roller 1111 and a first auxiliary roller 1112. The first main roller 1111 is connected to the output end of the first driving mechanism 120. The first auxiliary roller 1112 and the first main roller 1111 are separated by a conveying channel S. The second roller group 112 includes a second main roller 1121 and a second auxiliary roller 1122. The second main roller 1121 is arranged below the first main roller 1111. The second auxiliary roller 1122 and the second main roller 1121 are separated by a conveying channel S. The third roller group 113 includes a third main roller 1131 and a third auxiliary roller 1132. The third main roller 1131 is arranged below the second main roller 1121. The third auxiliary roller 1132 and the third main roller 1131 are separated by a conveying channel S, and the third auxiliary roller 1132 is disconnected in the middle to form a third gap J3. The length of the second gap J2 is less than that of the third gap J3. The second gap J2 and the third gap J3 form part of the first zone Q1. The second zone Q2 is formed below the third gap J3 and between the collecting station G. It should be noted that the first main roller 1111, the first auxiliary roller 1112, the second main roller 1121, the second auxiliary roller 1122, the third main roller 1131 and the third auxiliary roller 1132 in this application all belong to the transmission roller 1101 mentioned above. Exemplarily, the second main roller 1121 can be connected to the first main roller 1111 via a conveyor belt 130, and the third main roller 1131 can be connected to the second main roller 1121 via a conveyor belt 130. After the first main roller 1111 is driven by the first driving mechanism 120, the wafer can be dropped into the conveying channel S, so that one side of the wafer contacts the first main roller 1111 and the other side of the wafer contacts the first auxiliary roller 1112. The movement of the first main roller 1111 can simultaneously drive the wafer to fall and the first auxiliary roller 1112 to rotate. Similarly, since the rotation of the first main roller 1111 can also synchronously drive the second main roller 1121 and the third main roller 1131 to rotate synchronously, the wafer can be continuously conveyed along the conveying channel S until it falls onto the collection station G. Exemplarily, the second main roller 1121 and the third main roller 1131 can also be independently provided with corresponding driving mechanisms for driving, without the need for transmission by the conveyor belt 130. It should be noted that the middle parts of the second auxiliary roller 1122 and the third auxiliary roller 1132 in the present application are hollow to form the second gap J2 and the third gap J3. Alternatively, the second auxiliary roller 1122 may be composed of two independent and spaced short rollers, and the gap between the short rollers is the second gap J2. The third auxiliary roller 1132 may be composed of two independent and spaced ultra-short rollers, and the gap between the ultra-short rollers is the third gap J3.The second gap J2 and the third gap J3 are both formed to allow clearance for wafer movement. The first zone Q1 includes not only the second gap J2 and the third gap J3, but also the space between the second gap J2 and the third gap J3, and may also include the space between the second gap J2 and the first auxiliary roller 1112. This allows a portion of the wafer to pass through the first zone Q1. The second zone Q2, encompassing the area below the third gap J3 and between the collection station G, allows the remaining portion of the wafer to pass through. In some embodiments, the first auxiliary roller 1112 may be hollow to form the first gap (not shown), with the length of the first gap being smaller than the second gap J2.

[0037] In some embodiments, multiple second roller sets 112 are provided in the first direction, and the second gap J2 between each second roller set 112 gradually increases from top to bottom. It is understood that by providing more second roller sets 112, a more stable transmission and conveying effect can be ensured when the wafers enter the collection station G from the conveying channel S. Furthermore, the second gap J2 between each second roller set 112 is gradually increased to adapt to the shape of the wafer and meet the clearance requirements.

[0038] In some embodiments, the second auxiliary roller 1122 has axial freedom of movement to adjust the length of the second gap J2, and / or the third auxiliary roller 1132 has axial freedom of movement to adjust the length of the third gap J3. For example, the second auxiliary roller 1122 can be configured as a multi-section telescopic roller, whose axial length can be adjusted by telescoping to adjust the length of the second gap J2, thereby accommodating wafers of different sizes. Similarly, the third auxiliary roller 1132 can be configured as a multi-section telescopic tube, whose axial length can be adjusted by telescoping to adjust the length of the third gap J3, thereby accommodating wafers of different sizes. Furthermore, the second and third auxiliary rollers 1122, 1132 can also be configured as hinged, foldable structures that can be retracted and expanded to adjust the length of the second and third gaps J2 and J3, respectively.

[0039] See also Figure 2 and Figure 3In some embodiments, at least two first main rollers 1111 are provided in the first direction, with the spacing between the at least two first main rollers 1111 not exceeding the radius of the first main roller 1111. The number of first auxiliary rollers 1112 distributed in the first direction matches the number of first main rollers 1111. It will be appreciated that by providing at least two first main rollers 1111 and a corresponding number of first auxiliary rollers 1112 in the first direction, wafers can be simultaneously restrained by multiple sets of first rollers 111 when being loaded. This allows the wafer head to quickly correct its position and align with the conveying channel S, preventing wafer skew and blockage, and increasing wafer loading speed.

[0040] See also Figure 3 and Figure 4 In some embodiments, the wafer loading device of the present application further includes a spray assembly 400, which includes: a nozzle 410, which is disposed outside the transmission roller assembly 110 and is used to transport a fluid; and a nozzle 420, which is connected to the nozzle 410 and faces the transmission roller assembly 110. It is understood that the nozzle 410 can be connected to a fluid supply source to input a fluid, and finally eject the fluid through the nozzle 420. The fluid is not limited to a liquid or a gas, and is preferably a cleaning fluid. When a wafer is loaded, the nozzle 420 can continuously eject the cleaning fluid, thereby cleaning away dirt remaining on the transmission roller 1101 and part of the wafer, further reducing the wear of the wafer and the transmission roller 1101.

[0041] See also Figure 5 In some embodiments, the transmission roller 1101 is provided with an elastic buffer layer 11011. The elastic buffer layer 11011 is made of a flexible polymer material with a predetermined friction coefficient. There are multiple elastic buffer layers 11011 and they are spaced apart along the axial direction of the transmission roller 1101. Separators 11012 are provided between adjacent elastic buffer layers 11011. The separators 11012 are used to form frictional contact with the wafer. Exemplarily, the elastic buffer layer 11011 is a polyurethane sleeve, and the separators 11012 are O-rings that protrude from each elastic buffer layer 11011. The separators 11012 can be made of fluororubber. When a wafer is placed between the two transmission rollers 1101, both sides of the wafer respectively contact the separators 11012 on both sides of the transmission rollers 1101, generating frictional contact. When the transmission rollers 1101 rotate, the wafer can be driven to move up and down, i.e., move along the conveying channel S between the two transmission rollers 1101. Since the main body of the transmission roller 1101 is generally made of rigid material, by providing an elastic buffer sleeve layer 11011 on the transmission roller 1101, it is possible to prevent the wafer from being damaged by direct contact with the rigid transmission roller 1101.

[0042] See also Figure 1 、 Figure 2 and Figure 6In some embodiments, the material frame 210 is provided with multiple support rollers 211, and multiple material grooves 2111 are arranged in the axial direction of the support rollers 211. The material grooves 2111 of multiple support rollers 211 in the same radial direction constitute a single material collection station G. It is understood that by providing multiple support rollers 211 to support the wafer at multiple points, an example configuration can be four support rollers 211, and each support roller 211 is provided with multiple material grooves 2111. The material grooves 2111 have a certain depth to allow for the accommodation of a portion of the wafer to form a limit, preventing the wafer from tilting, falling, and being damaged. A single material collection station G is composed of multiple material grooves 2111, thereby fixing at least one wafer at multiple points.

[0043] The working principle of the wafer loading device of this application:

[0044] First, a wafer is grasped manually or by a robot and placed into the guide groove 310, and then the first driving mechanism 120 is started. The output end of the first driving mechanism 120 drives the first main roller 1111 to rotate. The separator 11012 on the first main roller 1111 and the first auxiliary roller 1112 contacts the wafer and drives the wafer to move. The first main roller 1111 drives the second main roller 1121 to rotate through the conveyor belt 130, and the second main roller 1121 drives the third main roller 1131 to rotate through the conveyor belt 130. Therefore, the wafer can continue to move downward along the conveying channel S. When the bottom of the wafer moves to the material groove 2111 on the support roller 211, the detection sensor 212 can detect that the wafer is in place on the collection station G. The detection sensor 212 can send a signal to the second drive mechanism 220, so that the second drive mechanism 220 drives the material frame 210 to move. When the material frame 210 moves, the transmission roller group 110 avoids the wafer in place through the clearance area Q to prevent interference with the wafer and damage to the wafer. In this way, after each wafer is in place at the collection station G, the second drive mechanism 220 drives the material frame 210 to move the distance of the collection station G. The empty collection station G can continue to dock with the conveying channel S to collect wafers.

[0045] The wafer cleaning machine (not shown) of the present application includes the wafer loading device of the present application and also includes a cleaning device (not shown). After the wafer loading device delivers the wafer to the material frame 210, the material frame 210 can be transported to multiple cleaning devices by a robot arm to perform multiple cleaning processes on the multiple wafers in the material frame 210.

[0046] Beneficial effects:

[0047] The wafer loading device of the present application forms a conveying channel S through a plurality of transmission rollers 1101 arranged at intervals. The conveying channel S allows for accommodating wafers. Both sides of the wafer can be in close contact with the adjacent transmission rollers 1101, thereby cooperating with the drive of the first drive mechanism 120. The transmission rollers 1101 rotate to drive the wafers along the conveying channel S to the collecting station G below, ensuring the stability of the feeding process and reducing the damage rate of the wafer feeding process; and by setting a clearance area Q between the collecting station G and the transmission roller group 110 to avoid the moving wafers, the material frame 210 can switch between multiple collecting stations G for interval filling, which has a relatively high Fast loading speed; by adjusting the axial length of the second auxiliary roller 1122 and / or the third auxiliary roller 1132 by telescopic adjustment, the length of the second gap J2 and / or the third gap J3 can be adjusted, so that wafers of various sizes can be adapted for making way for loading; by setting a detection sensor 212 to detect and determine whether the wafer has arrived at the collection station G, a corresponding signal is sent to the second drive mechanism 220. If it is determined that the wafer is in place, the second drive mechanism 220 can drive the material frame 210 to move the position, thereby switching the next collection station G to docking conveying channel S for the next collection, realizing automatic loading and improving loading efficiency.

[0048] The specific embodiments described herein are merely illustrative of the spirit of the present application. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present application or exceeding the scope defined by the appended claims.

Claims

1. A wafer loading device, characterized in that: include: A feeding assembly (100), the feeding assembly (100) comprising: A transmission roller group (110), wherein the transmission roller group (110) comprises a plurality of transmission rollers (1101), wherein an elastic buffer sleeve layer (11011) is provided on the transmission roller (1101), wherein the elastic buffer sleeve layers (11011) are multiple and are spaced apart along the axial direction of the transmission roller (1101), wherein a separator (11012) is provided between adjacent elastic buffer sleeve layers (11011), wherein the separator (11012) is used to form frictional contact with a wafer, and wherein a conveying channel (S) is formed between the plurality of transmission rollers (1101), wherein the conveying channel (S) allows wafers to be put in and conveyed, and wherein the conveying channel (S) extends along a first direction, wherein the first direction is vertically downward or inclined downward; a first driving mechanism (120), the first driving mechanism (120) acting on the transmission roller (1101) to drive the wafer to move along the conveying channel (S); An aggregate assembly (200), the aggregate assembly (200) comprising: A material frame (210), the material frame (210) is arranged below the transmission roller group (110), a plurality of material collection stations (G) are arranged in the material frame (210), and the material collection stations (G) are located below the conveying channel (S); a second driving mechanism (220), the second driving mechanism (220) acting on the material frame (210) to drive the material frame (210) to move and switch one of the material collecting stations (G) to dock with the conveying channel (S); Wherein, a clearance area (Q) is formed between the material collecting station (G) and the transmission roller group (110), and the clearance area (Q) is used to avoid wafers that move synchronously with the material collecting station (G); The yield zone (Q) includes a first zone (Q1) and a second zone (Q2), wherein the first zone (Q1) is formed by the hollow setting of the drive roller group (110) on one side close to the moving direction of the material frame (210), and the space of the first zone (Q1) gradually expands from top to bottom, and the second zone (Q2) is formed between the first zone (Q1) and the gathering station (G).

2. The wafer loading device according to claim 1, characterized in that: The transmission roller set (110) comprises: A first roller set (111), the first roller set (111) comprising: a first main roller (1111), the first main roller (1111) being connected to an output end of the first driving mechanism (120); a first auxiliary roller (1112), the first auxiliary roller (1112) and the first main roller (1111) being spaced apart from each other through the conveying channel (S); A second roller set (112), the second roller set (112) comprising: a second main roller (1121), the second main roller (1121) being arranged below the first main roller (1111); a second auxiliary roller (1122), the second auxiliary roller (1122) and the second main roller (1121) being spaced apart from each other through the conveying passage (S), and the middle portion of the second auxiliary roller (1122) being disconnected to form a second gap (J2); and A third roller set (113), the third roller set (113) comprising: a third main roller (1131), the third main roller (1131) being arranged below the second main roller (1121); a third auxiliary roller (1132), the third auxiliary roller (1132) and the third main roller (1131) being spaced apart from each other through the conveying channel (S), and the middle portion of the third auxiliary roller (1132) being disconnected to form a third gap (J3); The length of the second gap (J2) is smaller than the length of the third gap (J3), the second gap (J2) and the third gap (J3) constitute a part of the first zone (Q1), and the second zone (Q2) is formed below the third gap (J3) and between the aggregate station (G).

3. The wafer loading device according to claim 2, characterized in that: A plurality of second roller groups (112) are arranged in the first direction, and the second gaps (J2) of the second roller groups (112) gradually increase from top to bottom.

4. The wafer loading device according to claim 2, characterized in that: The second auxiliary roller (1122) has freedom of movement in the axial direction to adjust the length of the second gap (J2), and / or the third auxiliary roller (1132) has freedom of movement in the axial direction to adjust the length of the third gap (J3).

5. The wafer loading device according to claim 2, characterized in that: At least two first main rollers (1111) are provided in the first direction, and the spacing between the at least two first main rollers (1111) does not exceed the radius of the first main roller (1111), and the number of the first auxiliary rollers (1112) distributed in the first direction matches the number of the first main rollers (1111).

6. The wafer loading device according to claim 1, characterized in that: A guide plate (300) is provided above the transmission roller group (110), and the guide plate (300) is hollowed out to form a guide groove (310), and the guide groove (310) leads to the conveying channel (S).

7. The wafer loading device according to claim 1, characterized in that: The invention also includes a spray assembly (400), wherein the spray assembly (400) includes: a nozzle (410), the nozzle (410) being arranged outside the transmission roller assembly (110), the nozzle (410) being used for conveying fluid; A nozzle (420), wherein the nozzle (420) is connected to the nozzle pipe (410), and the nozzle (420) faces the transmission roller group (110).

8. The wafer loading device according to claim 1, characterized in that: The material frame (210) is provided with a plurality of supporting rollers (211), and a plurality of material troughs (2111) are arranged in the axial direction of the supporting rollers (211). The material troughs (2111) of the plurality of supporting rollers (211) in the same radial direction constitute a single material collecting station (G).

9. The wafer loading device according to claim 1, characterized in that: A detection sensor (212) is provided outside the material collection station (G), and the detection sensor (212) acts on the material collection station (G) to detect whether the wafer is in place. The detection sensor (212) is electrically connected or communicatively connected to the second driving mechanism (220).

10. The wafer loading device according to claim 1, characterized in that: The elastic buffer sleeve layer (11011) is made of a flexible polymer material with a predetermined friction coefficient.

11. A wafer cleaning machine, characterized in that: It comprises a wafer loading device as described in any one of claims 1-10.

Images