Through-flow module and preparation method thereof

Abstract

The invention relates to a through-flow module and a preparation method thereof.The through-flow module comprises a first through-flow block, a second through-flow block and an insulating part, the second through-flow block comprises a body and bosses arranged at the two ends of the body, the first through-flow block is arranged between the two bosses, and the insulating part is arranged between the first through-flow block and the second through-flow block. The insulating part is clamped between the first through-flow block and the main body and between the first through-flow block and the boss, a first welding surface is formed on the surface, deviating from the main body, of the first through-flow block, a second welding surface is formed on the end face of the boss, and the first welding surface and the second welding surface are coplanar. The number of the through-flow channels is increased by using the space in the height direction, the occupation of the through-flow module on the board surface area is reduced, the layout of the circuit board is more compact, the space is saved, the structure is stable and reliable, and the product performance is effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of circuit boards, and more particularly, to a current-carrying module and a method for preparing the same. Background Art

[0002] At present, the functions of processors and cameras in mobile phones or other consumer products are becoming more and more powerful, and their working power is also increasing. However, the area of the main control board is becoming smaller and smaller to leave more space for the battery. Therefore, there is not enough space on the main control board to pass current. The current solution is to mount copper sheets on the surface of the main control board to increase the current-carrying capacity through the copper sheets. The existing current-carrying modules can only meet the current-carrying of a single channel. With the development of technology, the number of required current-carrying channels is also increasing, and multiple current-carrying modules need to occupy a larger area, which is not conducive to the layout of components. Summary of the Invention

[0003] The purpose of the present invention is to provide a current-carrying module and a method for preparing the same, which increase the number of current-carrying channels by using the space in the height direction, are beneficial to reducing the occupation of the board surface area by the current-carrying module, making the layout of the circuit board more compact, thus saving space, and having a stable and reliable structure, effectively improving the product performance.

[0004] A current-carrying module includes a first current-carrying block, a second current-carrying block, and an insulating member. The second current-carrying block includes a main body and bosses provided at both ends of the main body. The first current-carrying block is disposed between the two bosses. The insulating member is clamped between the first current-carrying block and the main body and the bosses. The surface of the first current-carrying block facing away from the main body forms a first welding surface, and the end surface of the boss forms a second welding surface. The first welding surface and the second welding surface are coplanar.

[0005] In the above technical solution, both ends of the first current-carrying block can be respectively connected to the circuit board to form a first current-carrying channel. The second current-carrying block stacks the main body above the first current-carrying block through the bosses and respectively connects to the circuit board through the two bosses to form a second current-carrying channel, effectively utilizing the space in the height direction, reducing the occupation of the surface area of the circuit board, being beneficial to the layout of the circuit board, and making the circuit design more flexible. The insulating member is clamped between the first current-carrying block and the second current-carrying block, which can ensure the insulation performance between the two, thereby improving the stability and reliability of the structure.

[0006] Further, it further includes an insulating outer layer, which wraps around the outer periphery of the first current-carrying block and the second current-carrying block. The insulating outer layer includes a functional surface and a non-functional surface. The first welding surface and the second welding surface are located on the functional surface.

[0007] In the above technical solution, by providing an insulating outer layer, it is possible to insulate the other surfaces of the current-carrying module except for the first welding surface and the second welding surface, thereby improving the reliability of the current-carrying module. Other components can be arranged closer to the current-carrying module, which is beneficial for high-density component layout and further improves the utilization rate of the circuit board. Moreover, due to the peripheral insulation of the current-carrying module, the distance between two adjacent current-carrying modules can be closer while meeting the withstand voltage requirements.

[0008] Further, a metal coating is provided on the non-functional surface, and at least one grounding portion is provided on the functional surface, and the grounding portion is electrically connected to the metal coating.

[0009] In the above technical solution, a metal coating is provided on the non-functional surface, and the metal coating can be connected to the ground of the circuit board through the grounding portion, so that the metal coating plays an electromagnetic shielding role to prevent the large current of the current-carrying module from causing signal interference to the outside.

[0010] Further, the metal coating includes a first metal layer and a second metal layer, and the first metal layer and the second metal layer are copper and stainless steel respectively.

[0011] In the above technical solution, copper has good electrical conductivity and shielding performance, and stainless steel has a corrosion-resistant effect. By the cooperation of the first metal layer and the second metal layer, the performance of the current-carrying module is effectively improved.

[0012] Further, at least one signal channel is provided on the non-functional surface, and a first signal connection surface and a second signal connection surface are provided on the functional surface, and the first signal connection surface and the second signal connection surface are electrically connected to both ends of the signal channel respectively.

[0013] In the above technical solution, the signal channel can be formed by the LDS (Laser-Direct-structuring) process. The first signal connection surface and the second signal connection surface cooperate with the signal channel to form a signal transmission line on the current-carrying module, enabling the current-carrying module to have both current-carrying and communication functions, further improving the flexibility of the current-carrying module in use and making the layout of the circuit more convenient.

[0014] Further, the insulating member includes an insulating layer, and a first adhesive layer and a second adhesive layer are respectively provided on both side surfaces of the insulating layer, and the first adhesive layer and the second adhesive layer are respectively adhered to the first current-carrying block and the second current-carrying block.

[0015] In the above technical solution, the insulating member is provided with an insulating layer, a first adhesive layer and a second adhesive layer, so that the insulating member not only has the function of insulation, but also can connect the first current-carrying block and the second current-carrying block, making the assembly more convenient.

[0016] A method for manufacturing a current-carrying module includes the following steps: The first current-carrying block and the second current-carrying block are made of conductive metal; The first current-carrying block and the second current-carrying block are bonded by an insulating part to obtain a current-carrying main body; Isolation adhesive paper is pasted on the first welding surface and the second welding surface of the current-carrying main body; Insulating material is used for injection molding to form an insulating outer layer on the outer periphery of the current-carrying main body; The isolation adhesive paper is separated from the injection-molded current-carrying main body; The injection-molded current-carrying main body is cut to obtain a current-carrying module.

[0017] Further, after cutting the injection-molded current-carrying main body to obtain a current-carrying module, it further includes generating a metal coating on the non-functional surface of the current-carrying module.

[0018] Further, it further includes manufacturing a grounding part, and the grounding part is electrically connected to the metal coating.

[0019] Further, it further includes ablating the metal coating to form a signal channel, and manufacturing a first signal connection surface and a second signal connection surface that communicate with the signal channel.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows: Both ends of the first current-carrying block can be respectively connected to a circuit board to form a first current-carrying channel. The second current-carrying block enables the main body to be stacked above the first current-carrying block through a boss, and the two bosses are respectively connected to the circuit board to form a second current-carrying channel, effectively utilizing the space in the height direction, reducing the occupation of the surface area of the circuit board, being beneficial to the layout of the circuit board, and making the design of the circuit more flexible. The insulating part is clamped between the first current-carrying block and the second current-carrying block, which can ensure the insulation performance between the two, thereby improving the stability and reliability of the structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic structural diagram of the first embodiment of the current-carrying module of the present invention.

[0022] Figure 2 It is a schematic structural diagram of the second embodiment of the current-carrying module of the present invention.

[0023] Figure 3 It is a schematic structural diagram of the functional surface of the second embodiment of the current-carrying module of the present invention.

[0024] Figure 4 It is a schematic structural diagram of the third embodiment of the current-carrying module of the present invention.

[0025] Figure 5 It is a schematic structural diagram of the functional surface of the third embodiment of the current-carrying module of the present invention.

[0026] Figure 6Schematic diagram of the communication channel of the fourth embodiment of the flow-through module of the present invention.

[0027] Figure 7 Schematic diagram of the functional surface of the fourth embodiment of the flow-through module of the present invention.

[0028] Figure 8 Schematic diagram of the insulating part of the present invention.

[0029] Figure 9 Flow chart of the method for preparing the flow-through module of the present invention.

[0030] Figure 10 Flow chart of the first embodiment of the method for preparing the flow-through module of the present invention.

[0031] Figure 11 Schematic diagram of step 103 of the first embodiment of the method for preparing the flow-through module of the present invention.

[0032] Figure 12 Flow chart of the second embodiment of the method for preparing the flow-through module of the present invention.

[0033] Figure 13 Schematic diagram of the first wire frame of the second embodiment of the method for preparing the flow-through module of the present invention.

[0034] Figure 14 Schematic diagram of the second wire frame of the second embodiment of the method for preparing the flow-through module of the present invention.

[0035] Figure 15 Schematic diagram of the insulating part of the second embodiment of the method for preparing the flow-through module of the present invention.

[0036] Figure 16 Schematic diagram of the isolation adhesive tape and the flow-through main frame of the second embodiment of the method for preparing the flow-through module of the present invention.

[0037] First flow-through block 1, first welding surface 11, second flow-through block 2, main body 21, convex platform 22, second welding surface 23, insulating part 3, insulating layer 31, first adhesive layer 32, second adhesive layer 33, insulating outer layer 4, functional surface 41, non-functional surface 42, metal plating layer 5, grounding part 53, signal channel 54, first signal connection surface 55, second signal connection surface 56, isolation adhesive tape 6, flow-through main body 7, first wire frame 8, first frame edge 81, second wire frame 9, second frame edge 91. Detailed implementation manners

[0038] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0039] Please refer to Figure 1 , Figure 1 which is the first embodiment of the current-carrying module of the present invention. The current-carrying module includes a first current-carrying block 1, a second current-carrying block 2, and an insulating member 3. The second current-carrying block 2 includes a main body 21 and bosses 22 provided at both ends of the main body 21. The first current-carrying block 1 is disposed between the two bosses 22. The insulating member 3 is clamped between the first current-carrying block 1 and the main body 21 and the bosses 22. The surface of the first current-carrying block 1 facing away from the main body 21 forms a first welding surface 11, and the end surface of the boss 22 forms a second welding surface 23. The first welding surface 11 and the second welding surface 23 are coplanar.

[0040] Exemplarily, both the first current-carrying block 1 and the second current-carrying block 2 are made of conductive metal. In this embodiment, the first current-carrying block 1 and the second current-carrying block 2 are preferably made of copper. The first current-carrying block 1 is formed as a cuboid. From Figure 1 a certain angle, the lower end surface of the first current-carrying block 1 is the first welding surface 11. The first current-carrying block 1 can be welded to the circuit board through both ends of the first welding surface 11 to form a first current-carrying channel.

[0041] The second current-carrying block 2 overlaps the main body 21 above the first current-carrying block 1 through the bosses 22 and is respectively connected to the circuit board through the two bosses 22 to form a second current-carrying channel, effectively utilizing the space in the height direction, reducing the occupation of the surface area of the circuit board, being beneficial to the layout of the circuit board, and making the design of the circuit more flexible. The insulating member 3 is clamped between the first current-carrying block 1 and the second current-carrying block 2, which can ensure the insulation performance between the two, thereby improving the stability and reliability of the structure.

[0042] Please refer to Figure 2 and Figure 3 , which is the second embodiment of the current-carrying module of the present invention. The difference between this embodiment and the first embodiment is that it further includes an insulating outer layer 4. The insulating outer layer 4 wraps around the outer periphery of the first current-carrying block 1 and the second current-carrying block 2. The insulating outer layer 4 includes a functional surface 41 and a non-functional surface 42. The first welding surface 11 and the second welding surface 23 are located on the functional surface 41.

[0043] Specifically, the insulating outer layer 4 can be formed by injection molding with an insulating material such as EMC (Epoxy Molding Compound). After molding, the insulating outer layer 4 is generally in the shape of a cuboid. From Figure 2Viewed in a certain direction, the lower end face thereof is formed as a functional surface 41, the first welding surface 11 and the second welding surface 23 are both located on the functional surface 41, and the five surfaces of the insulating outer layer 4 except the functional surface 41 are formed as non-functional surfaces 42.

[0044] By providing the insulating outer layer 4, the other surfaces of the current-carrying module except the first welding surface 11 and the second welding surface 23 can be insulated, thereby improving the reliability of the current-carrying module. Other components can be arranged closer to the current-carrying module, which is beneficial to high-density component layout and further improves the utilization rate of the circuit board. And because the outer periphery of the current-carrying module is insulated, the distance between two adjacent current-carrying modules can be closer while meeting the withstand voltage requirements.

[0045] Please refer to Figure 4 and Figure 5 For the third embodiment of the current-carrying module of the present invention, the difference between this embodiment and the second embodiment is that a metal coating 5 is provided on the non-functional surface 42, and at least one grounding portion 53 is provided on the functional surface 41, and the grounding portion 53 is electrically connected to the metal coating 5.

[0046] Among them, the metal coating 5 can be formed by PVD (Physical Vapor Deposition) or LDS (Laser-Direct-structuring). In this embodiment, the metal coating 5 includes a first metal layer and a second metal layer. Viewed from Figure 4 a certain direction, the first metal layer is located on the side close to the insulating outer layer 4, that is, the first metal layer is located inside the second metal layer. The first metal layer and the second metal layer are formed by using conductive metal and stainless steel respectively. Among them, copper metal has good electrical conductivity and shielding performance, and stainless steel has a corrosion-resistant effect. Through the cooperation of the first metal layer and the second metal layer, the performance of the current-carrying module is effectively improved. Specifically in implementation, the thickness of the first metal layer is preferably 1um to 5um, the thickness of the second metal layer is preferably 0.5um to 2um, and the total thickness of the metal coating 5 is preferably 1.5um to 6um, so as to optimize the size of the current-carrying module while ensuring the performance of the metal coating 5.

[0047] The grounding portion 53 can be made of conductive metal, which is formed as a thin flat surface and is electrically connected to the metal coating 5. The grounding portion 53 can be connected to the ground of the circuit board, so that the metal coating 5 plays an electromagnetic shielding role to prevent the large current of the current-carrying module from causing signal interference to the outside.

[0048] Please refer to Figure 6 and Figure 7, a fourth embodiment of the flow-through module of the present invention. In this embodiment, at least one signal channel 54 is provided on the non-functional surface 42, and a first signal connection surface 55 and a second signal connection surface 56 are provided on the functional surface 41. The first signal connection surface 55 and the second signal connection surface 56 are respectively electrically connected to both ends of the signal channel 54.

[0049] Specifically, the signal channel 54 can be formed by using a high-precision laser to ablate the unnecessary metal coating 5 to form a pattern, or by the LDS (Laser-Direct-structuring) process. The first signal connection surface 55 and the second signal connection surface 56 cooperate with the signal channel 54 to form a signal transmission line on the flow-through module, enabling the flow-through module to have both flow-through and communication functions, further improving the flexibility of use of the flow-through module and making the layout of the line more convenient.

[0050] Please refer to Figure 8 , the insulating member 3 includes an insulating layer 31. First adhesive layers 32 and second adhesive layers 33 are respectively provided on both side surfaces of the insulating layer 31. The first adhesive layers 32 and the second adhesive layers 33 are respectively adhered to the first flow-through block 1 and the second flow-through block 2. Exemplarily, the insulating layer 31 can be made of PI (Polyimide), and the first adhesive layers 32 and the second adhesive layers 33 can use adhesives. By providing the insulating member 3 with the insulating layer 31, the first adhesive layers 32 and the second adhesive layers 33, the insulating member 3 not only has the function of insulation, but also can connect the first flow-through block 1 and the second flow-through block 2, making the assembly more convenient.

[0051] Please refer to Figure 9 , the present invention also provides a method for preparing a flow-through module, including the following steps: S1. The first flow-through block 1 and the second flow-through block 2 are made of conductive metal.

[0052] S2. The first flow-through block 1 and the second flow-through block 2 are bonded by using the insulating member 3 to obtain a flow-through main body 721; S3. The isolation adhesive paper 6 is pasted on the first welding surface 11 and the second welding surface 23 of the flow-through main body 721; S4. Insulating material is injection-molded to form an insulating outer layer 4 on the outer periphery of the flow-through main body 721; S5. The isolation adhesive paper 6 is separated from the injection-molded flow-through main body 721; S6. The injection-molded flow-through main body 721 is cut to obtain a flow-through module.

[0053] Furthermore, in order to improve the corrosion resistance of the flow-through module, it further includes: S7. A metal coating 5 is formed on the non-functional surface 42 of the flow-through module.

[0054] Further, to endow the flow-through module with electromagnetic shielding performance, it further includes: S8. Fabricate a grounding part 53, and conduct the grounding part 53 to the metal coating 5.

[0055] Further, to endow the flow-through module with communication function, it further includes: S9. Ablate the metal coating 5 to form a signal channel 54, and fabricate a first signal connection surface 55 and a second signal connection surface 56 that communicate with the signal channel 54.

[0056] The preparation method of the flow-through module is introduced below through specific embodiments.

[0057] Please refer to Figure 10 , the first embodiment of the preparation method of the flow-through module of the present invention, includes the steps: S101. Fabricate a single-piece first flow-through block 1 and a single-piece second flow-through block 2 using a conductive metal.

[0058] In this step, the first flow-through block 1 and the second flow-through block 2 are preferably made of copper. The first flow-through block 1 is formed as a rectangular copper bar, and the main body 21 of the second flow-through block 2 is formed as a cuboid, and bosses 22 perpendicular to the main body 21 are formed at both ends of the main body 21.

[0059] S102. Bond the first flow-through block 1 and the second flow-through block 2 using an insulating part 3 to obtain a flow-through main body 721.

[0060] In this step, the insulating part 3 can be first attached to the surface of the first flow-through block 1. Specifically, it can be attached to the three surfaces of the first flow-through block 1 facing the main body 21 and the bosses 22, and then the second flow-through block 2 is pressed on the insulating part 3 to form the flow-through main body 721.

[0061] S103. Obtain a release paper 6, and arrange and paste a plurality of flow-through main bodies 721 on the release paper 6.

[0062] Please refer to Figure 11 , in this step, the release paper 6 can be a large-area integral adhesive paper. The release paper 6 is laid flat on a preset fixture, and the sticky side faces up. A plurality of fabricated flow-through main bodies 721 are arranged and pasted on the surface of the release paper 6, where the first welding surface 11 and the second welding surface 23 face the release paper 6.

[0063] S104. Inject using an insulating material to form an insulating outer layer 4 on the outer periphery of the flow-through main body 721 to obtain an injection-molded part.

[0064] In this step, use an injection molding machine to evenly spread EMC on the release paper 6 until the flow-through main body 721 is completely wrapped to form an integral injection-molded part.

[0065] S105. Place the injection molded part in a high-temperature environment to make the release paper 6 lose its adhesiveness, and separate the release paper 6 from the injection molded part.

[0066] In this step, the injection molded part can be placed in an environment of 180 °C for a preset time so that the release paper 6 loses its adhesiveness at high temperature, facilitating the removal of the injection molded part.

[0067] S106. Cut the injection molded part to break the product into individual flow-through modules.

[0068] In this step, the injection molded part can be cut using a laser panel cutting device or a cutting device to obtain independent flow-through modules.

[0069] In this embodiment, to improve the performance of the flow-through module, the following steps are further included: S107. Generate a metal coating 5 on the non-functional surface 42 of the flow-through module.

[0070] In this step, the metal coating 5 can be generated by PVD (Physical Vapor Deposition) or LDS (Laser-Direct-structuring). The metal coating 5 includes a first metal layer and a second metal layer. The first metal layer and the second metal layer are made of conductive metal and stainless steel respectively. The thickness of the first metal layer is preferably 1 μm to 5 μm, the thickness of the second metal layer is preferably 0.5 μm to 2 μm, and the total thickness of the metal coating 5 is preferably 1.5 μm to 6 μm.

[0071] To enable the flow-through module to have the function of electromagnetic shielding, after generating the metal coating 5, the following steps are further included: S108. Fabricate a grounding portion 53 that is electrically connected to the metal coating 5.

[0072] In this step, the grounding portion 53 can be generated by PVD, or before generating the insulating outer layer 4, grounding copper sheets are arranged beside the first welding surface 11 and the second welding surface 23 through a fixture, and then injection molding is performed to form an integrated flow-through module.

[0073] This embodiment further includes the following steps: S109. Ablate the metal coating 5 to form a signal channel 54, and fabricate a first signal connection surface 55 and a second signal connection surface 56 that communicate with the signal channel 54.

[0074] In this step, ablation can be performed by a high-precision laser. The first signal connection surface 55 and the second signal connection surface 56 can be generated by PVD, or before generating the insulating outer layer 4, copper blocks can be arranged beside the first welding surface 11 and the second welding surface 23 through a fixture, and then injection molding is performed to form an integrated flow-through module. One end of the copper block exposes the functional surface 41 to form the first signal connection surface 55 and the second signal connection surface 56, and the other end extends out of the non-functional surface 42 or is flush with the non-functional surface 42. After manufacturing the signal channel 54, the copper block is connected to the signal channel 54.

[0075] Please refer to Figure 12 to the figures, the second embodiment of the method for preparing the flow-through module of the present invention. The difference between this embodiment and the first embodiment is that in this embodiment, the first flow-through block 1 and the second flow-through block 2 are manufactured in batches, thereby improving the manufacturing efficiency. Specifically, it includes the steps: S201. Make the first wire frame 8 and the second wire frame 9 using a conductive metal, where the first wire frame 8 and the second wire frame 9 respectively include a plurality of first flow-through blocks 1 and second flow-through blocks 2.

[0076] Please refer to Figure 13 and Figure 14 , in this step, the first wire frame 8 and the second wire frame 9 are preferably made of copper. The first wire frame 8 includes a first frame 81 and a plurality of first flow-through blocks 1 provided inside the first frame 81. The second wire frame 9 includes a second frame 91 and a plurality of second flow-through blocks 2 provided inside the second frame 91. The first flow-through blocks 1 and the second copper blocks are connected by connecting ribs.

[0077] S202. Bond the first wire frame 8 and the second wire frame 9 using the insulating member 3 to obtain the flow-through main body 721 frame.

[0078] Please refer to Figure 15 , in this step, the insulating member 3 can be made into a shape adapted to the first wire frame 8. The insulating member 3 is first attached to the surface of the first wire frame 8, and then the second wire frame 9 is pressed on the insulating member 3 to form the flow-through main body 721 frame.

[0079] S203. Obtain the isolation adhesive tape 6, and paste a plurality of flow-through main body 721 frames integrally on the isolation adhesive tape 6.

[0080] Please refer to Figure 16 , in this step, the isolation adhesive tape 6 can adopt a large-area whole piece of adhesive tape. The isolation adhesive tape 6 is laid flat on the surface of the flow-through main body 721 frame, where the first welding surface 11 and the second welding surface 23 face the isolation adhesive tape 6.

[0081] S204. Inject using an insulating material to form an insulating outer layer 4 on the outer periphery of the flow-through main body 721 frame to obtain an injection molded part.

[0082] S205. Place the injection molded part in a high temperature environment to make the isolation adhesive tape 6 lose its adhesiveness, and separate the isolation adhesive tape 6 from the injection molded part.

[0083] S206. Cut the injection molded part to break the product into individual flow-through modules.

[0084] S207. Generate a metal coating 5 on the non-functional surface 42 of the flow-through module.

[0085] S208. Fabricate a grounding portion 53 on the functional surface 41, and the grounding portion 53 is electrically connected to the metal coating 5.

[0086] S209. Ablate the metal coating 5 to form a signal channel 54, and fabricate a first signal connection surface 55 and a second signal connection surface 56 that communicate with the signal channel 54.

[0087] Among them, steps S204 - S209 are respectively the same as steps S104 - S109 of the first embodiment, and will not be elaborated here.

[0088] It should be noted that in other possible embodiments, the above method for preparing the flow-through module can adaptively change the shape of the flow-through module according to the requirements of the circuit. For example, the flow-through module can be fabricated into an "L" shape, and the grounding portion 53 is arranged on the first welding surface 11 or on one side of the first welding surface 11.

[0089] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0090] In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more, unless otherwise specifically defined.

[0091] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A flow-through module, characterized in that, It includes a first flow-through block, a second flow-through block, and an insulating part. The second flow-through block includes a main body and bosses provided at both ends of the main body. The first flow-through block is disposed between the two bosses. The insulating part is clamped between the first flow-through block and the main body and the bosses. The surface of the first flow-through block facing away from the main body forms a first welding surface, and the end surface of the boss forms a second welding surface. The first welding surface and the second welding surface are coplanar.

2. The flow-through module according to claim 1, characterized in that, It further includes an insulating outer layer. The insulating outer layer wraps around the outer perimeters of the first flow-through block and the second flow-through block. The insulating outer layer includes a functional surface and a non-functional surface. The first welding surface and the second welding surface are located on the functional surface.

3. The flow-through module according to claim 2, characterized in that, The non-functional surface is provided with a metal coating, and the functional surface is provided with at least one grounding part. The grounding part is electrically connected to the metal coating.

4. The flow-through module according to claim 3, characterized in that The metal coating includes a first metal layer and a second metal layer. The first metal layer and the second metal layer are copper and stainless steel respectively.

5. The flow-through module according to claim 2, wherein The non-functional surface is provided with at least one signal channel, and the functional surface is provided with a first signal connection surface and a second signal connection surface. The first signal connection surface and the second signal connection surface are electrically connected to both ends of the signal channel respectively.

6. The flow-through module according to claim 1, wherein, The insulating part includes an insulating layer. First adhesive layers and second adhesive layers are respectively provided on both side surfaces of the insulating layer. The first adhesive layer and the second adhesive layer are adhesively bonded to the first flow-through block and the second flow-through block respectively.

7. A method for preparing a flow-through module, characterized in that, It includes the following steps: Manufacture the first flow-through block and the second flow-through block using conductive metal; Bond the first flow-through block and the second flow-through block using the insulating part to obtain a flow-through main body; Paste isolation adhesive tapes on the first welding surface and the second welding surface of the flow-through main body; Inject mold using an insulating material to form an insulating outer layer on the outer perimeter of the flow-through main body; Separate the isolation adhesive tapes from the flow-through main body after injection molding; Cut the flow-through main body after injection molding to obtain a flow-through module.

8. The method for preparing the flow-through module according to claim 7, wherein After cutting the flow-through main body after injection molding to obtain a flow-through module, it further includes generating a metal coating on the non-functional surface of the flow-through module.

9. The method for preparing a flow-through module according to claim 8, wherein, It further includes manufacturing a grounding part, and the grounding part is electrically connected to the metal coating.

10. The method for preparing the flow-through module according to claim 8, wherein, It further includes ablating the metal coating to form a signal channel, and manufacturing a first signal connection surface and a second signal connection surface communicating with the signal channel.

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