A high-efficiency heat dissipation circuit board

Abstract

This application discloses a high-efficiency heat dissipation circuit board, including a substrate, a circuit board body, and multiple heat dissipation units. Multiple temperature sensors are installed on the circuit board body. Each heat dissipation unit includes a heat-conducting plate fixedly connected to the substrate via support pillars, upper heat dissipation fins, lower heat dissipation fins, and a thermoelectric cooling unit mounted on the heat-conducting plate. The cold side of the thermoelectric cooling unit faces the circuit board body, and the hot side abuts against the heat-conducting plate. This circuit board can monitor the temperature of various areas of the circuit board body, thus enabling comprehensive monitoring of the circuit board body temperature. Furthermore, it can achieve efficient and rapid localized heat dissipation of the circuit board body, thereby ensuring long-term stable operation of the circuit board.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, and more specifically, to a high-efficiency heat dissipation circuit board. Background Technology

[0002] Circuit boards play a crucial role in electronic devices, providing support and connections for electronic components and ensuring the normal operation of circuits. They are widely used in electronic products across various industries, including communication equipment, computers, home appliances, and industrial equipment, and are an indispensable component of modern electronic devices.

[0003] The heat generated in different areas of a circuit board often varies, due to factors such as the operating power of different components and their density. Existing circuit boards often lack the ability to monitor localized temperatures, making it difficult for operators to accurately understand the heat distribution and thus hindering the implementation of effective heat dissipation measures, resulting in low heat dissipation efficiency. Furthermore, existing circuit boards cannot achieve efficient and rapid localized heat dissipation, easily leading to localized overheating. Localized overheating not only degrades circuit board performance and accelerates component aging but can also cause serious malfunctions such as short circuits and burnouts, posing a serious threat to the normal operation of equipment. Summary of the Invention

[0004] The present invention aims to overcome the shortcomings of the prior art and provide a high-efficiency heat dissipation circuit board.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a circuit board, comprising a substrate, a circuit board body, and multiple heat dissipation units. Multiple temperature sensors are installed on the circuit board body. The heat dissipation unit includes a heat-conducting plate fixedly connected to the substrate by a support column, an upper heat dissipation fin, a lower heat dissipation fin, and a thermoelectric cooling unit installed on the heat-conducting plate. The cold side of the thermoelectric cooling unit faces the circuit board body, and the hot side abuts against the heat-conducting plate.

[0006] Furthermore, the circuit board body is mounted on the substrate, and the heat dissipation unit is mounted on the substrate.

[0007] Furthermore, the upper heat dissipation fins are fixed to the upper surface of the heat-conducting plate, and the lower heat dissipation fins are fixed to the lower surface of the heat-conducting plate.

[0008] Furthermore, the upper and lower heat dissipation fins are perpendicular in direction.

[0009] Furthermore, the first tube is parallel to the upper heat dissipation fins; the lower heat dissipation fins are parallel to the second tube.

[0010] This allows the direction of the upper heat sink fins to better match the direction of the heat dissipation airflow when the heat is blown from the side.

[0011] Furthermore, each heat dissipation unit has at least one temperature sensor underneath.

[0012] Furthermore, multiple temperature sensors are arranged in a rectangular array.

[0013] This makes it easier to monitor the temperature of various areas of the circuit board.

[0014] Furthermore, the thermoelectric refrigeration unit is a semiconductor thermoelectric refrigeration unit.

[0015] Furthermore, the circuit board body and the substrate are fixedly connected by bolts.

[0016] Furthermore, a thermal pad or thermal adhesive is provided between the hot surface and the heat-conducting plate.

[0017] Furthermore, it also includes an airflow generating unit and an air outlet shroud connected to the airflow generating unit via a first pipe. There are three heat dissipation units, and the air outlet shroud and the three heat dissipation units are arranged in a row.

[0018] Furthermore, the three heat dissipation units are arranged in a row with equal spacing.

[0019] Furthermore, the air vent covers face one end of the circuit board body.

[0020] Furthermore, the air outlet cover is fixedly connected to the base plate via a support rod.

[0021] Furthermore, it also includes two air guide units and two drive units. The air guide unit includes two end plates, an air inlet chamber, an air outlet chamber, and a top plate. The ends of the air inlets of the two air guide units facing each other are open. The air inlet chamber farther from the airflow generating unit is connected to a flexible tube. The airflow generating unit is also connected to a second tube. One end of the flexible tube is inserted into the second tube. A limiting seat with a U-shaped limiting channel is fixed at the base plate. The flexible tube passes through the U-shaped limiting channel. The two drive units and the two air guide units work together to achieve independent translational drive of the two air guide units.

[0022] Because the flexible tube is flexible, it can be made of materials such as rubber. While being flexible, its shape will not collapse. As the air guide unit connected to it moves, and under the limitation of the limiting seat, the end of the flexible tube inserted into the second tube can be inserted more or less.

[0023] Furthermore, the air inlet chamber is connected to one of the end plates, and the air outlet chamber is connected to the other end plate.

[0024] Furthermore, the top plate connects to two end plates.

[0025] Furthermore, the end plate connected to the air inlet chamber has an air inlet hole that communicates with the air inlet chamber.

[0026] Furthermore, the end plate connected to the air outlet chamber has an air outlet hole that communicates with the air outlet chamber.

[0027] Furthermore, the first tube is fixedly connected to the substrate by a plurality of first support blocks.

[0028] Furthermore, the second tube is fixedly connected to the substrate via multiple second support blocks.

[0029] Furthermore, the three heat dissipation units are a first heat dissipation unit, a second heat dissipation unit, and a third heat dissipation unit; both the first and second pipe sections are rigid pipe sections, with a first valve installed at the first pipe section and a second valve installed at the second pipe section; the circuit board can be in a first heat dissipation state and a second heat dissipation state. In the first heat dissipation state, the airflow generating unit and the first valve are open, and the second valve is closed. One air guide unit is located between the first and second heat dissipation units, and the other air guide unit is located between the second and third heat dissipation units; in the second heat dissipation state, the airflow generating unit and the second valve are open, and the first valve is closed. The two air guide units are located at the same heat dissipation unit position.

[0030] Furthermore, the drive unit includes a first mounting base, a second mounting base, two motors mounted on the first mounting base, two bearings mounted on the second mounting base, and two lead screws connected between the motors and the bearings; the air inlet chamber is connected to a first slide block, and the air outlet chamber is connected to a second slide block. The first slide block has a first threaded hole that mates with one of the lead screws and a first through hole through which the other lead screw passes. The second slide block has a second threaded hole that mates with one of the lead screws and a second through hole through which the other lead screw passes.

[0031] Furthermore, the first perforated portion does not contact the lead screw passing through it; the second perforated portion does not contact the lead screw passing through it.

[0032] Thus, the two drive units have a total of four motors, four bearings, and four lead screws. Two motors, two bearings, and two lead screws are used to drive one air guide unit, and the other two motors, two bearings, and two lead screws are used to drive the other air guide unit.

[0033] Furthermore, limiting protrusions are connected to both end plates of the air guide unit, and strip blocks are fixedly connected to both ends of the heat conduction plate. The strip blocks have strip-shaped limiting grooves that cooperate with the limiting protrusions.

[0034] This limits the translation of the air guide unit on the one hand, and the contact between the air guide unit and the strip block can also help dissipate heat on the other hand.

[0035] Furthermore, the side of the top plate closer to the air outlet hood is higher than the side farther from the air outlet hood, and the angle between the top plate and the base plate is between 5 and 15 degrees.

[0036] Therefore, in the first heat dissipation state, the side of the top plate facing the heat dissipation airflow is higher, which can concentrate the heat dissipation airflow and allow the heat dissipation airflow to be better blown towards the heat dissipation unit at a distance.

[0037] Furthermore, the substrate has a rectangular through hole and a rectangular frame-shaped groove surrounding the rectangular through hole, and the circuit board body is mounted in the groove.

[0038] This enables the mounting of the circuit board body and the substrate.

[0039] Furthermore, the airflow generating unit includes an airflow generating chamber and a fan unit installed inside the airflow generating chamber.

[0040] Furthermore, the airflow generating chamber has multiple ventilation holes.

[0041] Furthermore, the upper heat dissipation fins have strip-shaped notches.

[0042] The strip-shaped notch allows the cooling airflow to be better directed towards the cooling units further away.

[0043] Furthermore, some components on the circuit board body are in contact with the thermoelectric cooling unit via thermal pads.

[0044] Therefore, for some components that generate a lot of heat, such as power components, they can be brought into contact with the thermoelectric cooling unit, so that when needed, the thermoelectric cooling unit can quickly cool down and dissipate heat from the components that generate a lot of heat.

[0045] Beneficial effects:

[0046] 1. The circuit board of this application can monitor the temperature of various areas of the circuit board body, thereby enabling comprehensive monitoring of the temperature of the circuit body.

[0047] 2. The circuit board of this application can achieve efficient and rapid heat dissipation of the circuit board body, thereby ensuring the long-term stable operation of the circuit board. Attached Figure Description

[0048] Figure 1 A first-person perspective schematic diagram of the first heat dissipation state;

[0049] Figure 2 This is a magnified view of region A;

[0050] Figure 3 This is a magnified view of region B.

[0051] Figure 4 A schematic diagram from a second perspective showing the first heat dissipation state;

[0052] Figure 5 This is a magnified view of region C;

[0053] Figure 6 This is a magnified view of region D;

[0054] Figure 7 A first-person perspective schematic diagram of the second heat dissipation state;

[0055] Figure 8 This is a magnified view of region E.

[0056] Figure 9 This is a schematic diagram from a second perspective showing the second heat dissipation state.

[0057] Figure 10 This is a magnified view of region F.

[0058] Explanation of reference numerals in the attached drawings: Substrate 1; Rectangular through hole 1.1; Circuit board body 2; Support column 3.1; Heat-conducting plate 3.2; Strip-shaped limiting groove 3.2.1; Upper heat dissipation fin 3.3; Strip-shaped notch 3.3.1; Lower heat dissipation fin 3.4; Thermoelectric cooling unit 4; Airflow generating unit 5; First pipe section 5.1; First valve 5.1.1; First support block 5.1.2; Air outlet hood 5.2; Support rod 5.2.1; Second pipe section 5.3; Second support block 5.3.2; End plate 6.1; Limiting protrusion 6.1.1; Air inlet chamber 6.2; Air outlet chamber 6.3; Top plate 6.4; Flexible pipe section 6.5; Limiting seat 6.6; First slide 6.7; Second slide 6.8; First mounting seat 7.1; Second mounting seat 7.2; Motor 7.3; Bearing 7.4; Lead screw 7.5. Detailed Implementation

[0059] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0060] This invention provides a high-efficiency heat dissipation circuit board as shown in the figure, including a substrate 1, a circuit board body 2 mounted on the substrate 1, and multiple heat dissipation units mounted on the substrate 1. Multiple temperature sensors are mounted on the circuit board body 2. Each heat dissipation unit includes a heat-conducting plate 3.2 fixedly connected to the substrate 1 via a support column 3.1, upper heat dissipation fins 3.3 fixed to the upper surface of the heat-conducting plate 3.2, lower heat dissipation fins 3.4 fixed to the lower surface of the heat-conducting plate 3.2, and a thermoelectric cooling unit 4 mounted on the heat-conducting plate 3.2. The cold side of the thermoelectric cooling unit 4 faces the circuit board body 2, and the hot side abuts against the heat-conducting plate 3.2. The circuit board also includes an airflow generating unit 5 and an air outlet shroud 5.2 connected to the airflow generating unit 5 via a first pipe 5.1. There are three heat dissipation units, and the air outlet shroud 5.2 and the three heat dissipation units are arranged in a row. The circuit board also includes two air guiding units and two drive units. The air guiding unit includes two end plates 6.1, an air inlet chamber 6.2 connected to one end plate 6.1, an air outlet chamber 6.3 connected to the other end plate 6.1, and a top plate 6.4 connecting the two end plates 6.1. The ends of the air inlets 6.2 of the two air guiding units facing each other are open. The air inlet chamber 6.2 farther from the airflow generating unit 5 is connected to a flexible tube 6.5. The airflow generating unit 5 is also connected to a second tube 5.3. One end of the flexible tube 6.5 is inserted into the second tube 5.3. A limiting seat 6.6 with a U-shaped limiting channel is fixed at the base plate 1. The flexible tube 6.5 passes through the U-shaped limiting channel. The two drive units and the two air guiding units cooperate to realize independent translational drive of the two air guiding units.

[0061] The three heat dissipation units are a first heat dissipation unit, a second heat dissipation unit, and a third heat dissipation unit. The first tube section 5.1 and the second tube section 5.3 are both rigid tube sections. A first valve 5.1.1 is installed at the first tube section 5.1, and a second valve is installed at the second tube section 5.3. The circuit board can be in a first heat dissipation state and a second heat dissipation state. In the first heat dissipation state, the airflow generating unit 5 and the first valve 5.1.1 are open, and the second valve is closed. One air guide unit is located between the first heat dissipation unit and the second heat dissipation unit, and the other air guide unit is located between the second heat dissipation unit and the third heat dissipation unit. In the second heat dissipation state, the airflow generating unit 5 and the second valve are open, and the first valve 5.1.1 is closed. The two air guide units are located at the same heat dissipation unit position. The drive unit includes a first mounting base 7.1, a second mounting base 7.2, two motors 7.3 mounted on the first mounting base 7.1, two bearings 7.4 mounted on the second mounting base 7.2, and two lead screws 7.5 connected between the motors 7.3 and the bearings 7.4; the air inlet chamber 6.2 is connected to a first slide 6.7, and the air outlet chamber 6.3 is connected to a second slide 6.8. The first slide 6.7 has a first threaded hole that mates with one of the lead screws 7.5 and a first through hole through which the other lead screw 7.5 passes. The second slide 6.8 has a second threaded hole that mates with one of the lead screws 7.5 and a second through hole through which the other lead screw 7.5 passes.

[0062] Both end plates 6.1 of the air guide unit are connected to limiting protrusions 6.1.1. Both ends of the heat-conducting plate 3.2 are fixedly connected to strip blocks, which have strip-shaped limiting grooves 3.2.1 that mate with the limiting protrusions 6.1.1. The side of the top plate 6.4 near the air outlet shroud 5.2 is higher than the side away from the air outlet shroud 5.2, and the angle between the top plate 6.4 and the base plate 1 is between 5 and 15 degrees. The base plate 1 has a rectangular through hole 1.1 and a rectangular frame-shaped groove surrounding the rectangular through hole, and the circuit board body 2 is mounted in the groove. The airflow generating unit 5 includes an airflow generating chamber and a fan unit installed in the airflow generating chamber; the upper heat dissipation fins 3.3 have strip-shaped notches 3.3.1. Some components on the circuit board body 2 abut against the thermoelectric cooling unit 4 through thermal pads.

[0063] Working Principle: The circuit board of this application has multiple temperature sensors on its body, enabling comprehensive temperature monitoring of various parts of the circuit board. When no localized high temperature occurs, natural heat conduction is achieved using the heat-conducting plate, supplemented by air cooling from the airflow generation unit when necessary. Furthermore, when an abnormally high local temperature occurs, rapid cooling of the circuit board is achieved through the thermoelectric cooling unit. Heat is transferred to the heat-conducting plate via the hot surface of the cooling unit and then dissipated by the cooling airflow from the airflow generation unit.

[0064] Furthermore, the airflow generating unit has two air-cooling modes, such as... Figure 1 As shown, two air guide units are located between the two gaps of the three heat dissipation units. The air outlet shroud allows for airflow. Due to the strip-shaped notch on the upper heat dissipation fins and the higher position of the top plate facing the airflow, the airflow can better sweep across the upper heat dissipation fins. Although the airflow rises as it moves further away, the top plate guides more airflow to pass under it, further sweeping the upper heat dissipation fins. In this configuration, the airflow effectively dissipates heat from the upper heat dissipation fins of the three heat dissipation units.

[0065] In the second heat dissipation state, if the temperature of the circuit board corresponding to a certain heat dissipation unit rises abnormally, two air guiding units can be positioned above this heat dissipation unit. The airflow generated by the airflow generating unit then passes through the second duct section, the flexible duct section, the two air inlets, the two top plates, and the two air outlets, allowing the cooling airflow to sweep across the upper heat dissipation fins of this heat dissipation unit, thus achieving rapid heat dissipation. This heat dissipation method enables rapid cooling of locally heated areas on the circuit board.

[0066] Although the present invention has been illustrated and described with reference to preferred embodiments, those skilled in the art should understand that various changes and modifications can be made to the present invention without departing from the scope defined by the claims.

Claims

1. A high-efficiency heat dissipation circuit board, characterized in that, It includes a substrate, a circuit board body, and multiple heat dissipation units. Multiple temperature sensors are installed on the circuit board body. The heat dissipation unit includes a heat-conducting plate fixedly connected to the substrate by a support column, an upper heat dissipation fin, a lower heat dissipation fin, and a thermoelectric cooling unit installed on the heat-conducting plate. The cold side of the thermoelectric cooling unit faces the circuit board body, and the hot side abuts against the heat-conducting plate. It also includes an airflow generating unit and an air outlet shroud connected to the airflow generating unit through the first pipe. The heat dissipation unit has three units, and the air outlet shroud and the three heat dissipation units are arranged in a row. It also includes two air guide units and two drive units. The air guide unit includes two end plates, an air inlet chamber, an air outlet chamber, and a top plate. The air inlets of the two air guide units are open at their facing ends. The air inlet farther from the airflow generating unit is connected to a flexible tube. The airflow generating unit is also connected to a second tube. One end of the flexible tube is inserted into the second tube. A limiting seat with a U-shaped limiting channel is fixed at the base plate. The flexible tube passes through the U-shaped limiting channel. The two drive units and the two air guide units work together to achieve independent translational drive of the two air guide units. The three heat dissipation units are designated as a first heat dissipation unit, a second heat dissipation unit, and a third heat dissipation unit. Both the first and second tube sections are rigid tube sections. A first valve is installed at the first tube section, and a second valve is installed at the second tube section. The circuit board can operate in a first heat dissipation state and a second heat dissipation state. In the first heat dissipation state, the airflow generating unit and the first valve are open, and the second valve is closed. One air guide unit is located between the first and second heat dissipation units, and the other air guide unit is located between the second and third heat dissipation units. In the second heat dissipation state, the airflow generating unit and the second valve are open, and the first valve is closed. The two air guide units are located at the same heat dissipation unit position.

2. The high-efficiency heat dissipation circuit board according to claim 1, characterized in that, The drive unit includes a first mounting base, a second mounting base, two motors mounted on the first mounting base, two bearings mounted on the second mounting base, and two lead screws connected between the motors and the bearings; the air inlet chamber is connected to a first slide block, and the air outlet chamber is connected to a second slide block. The first slide block has a first threaded hole that mates with one of the lead screws and a first through hole through which the other lead screw passes. The second slide block has a second threaded hole that mates with one of the lead screws and a second through hole through which the other lead screw passes.

3. The high-efficiency heat dissipation circuit board according to claim 2, characterized in that, Limiting protrusions are connected to both end plates of the air guide unit, and strip blocks are fixedly connected to both ends of the heat conduction plate. The strip blocks have strip-shaped limiting grooves that cooperate with the limiting protrusions.

4. The high-efficiency heat dissipation circuit board according to claim 1, characterized in that, The side of the top plate closer to the air outlet hood is higher than the side farther from the air outlet hood, and the angle between the top plate and the base plate is between 5 and 15 degrees.

5. The high-efficiency heat dissipation circuit board according to claim 2, characterized in that, The substrate has a rectangular through hole and a rectangular frame-shaped groove surrounding the rectangular through hole, and the circuit board body is mounted in the groove.

6. The high-efficiency heat dissipation circuit board according to claim 2, characterized in that, The airflow generating unit includes an airflow generating chamber and a fan unit installed inside the airflow generating chamber; the upper heat dissipation fins have strip-shaped notches.

7. The high-efficiency heat dissipation circuit board according to claim 2, characterized in that, Some components on the circuit board body are connected to the thermoelectric cooling unit via thermal pads.

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