Large-size double-sided PDLC (polymer dispersed liquid crystal) multi-electrode multi-station bonding equipment
The dual-face PDLC bonding device addresses the limitations of single-mode thermal bonding and fixed pressure by implementing adjustable mechanisms for dual-face synchronous bonding, enhancing efficiency and versatility.
Patent Information
- Application Number
- CN202510675164.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-23
- Publication Date
- 2025-07-15
AI Technical Summary
Existing Binding equipment cannot achieve dual-sided synchronization of constant temperature and pulsed hot pressing Binding, and the pressure head cannot be adjusted to meet the needs of PDLC processing of multiple sizes.
Large-size double-sided PDLC multi-electrode multi-station bonding equipment is designed, and platform combination, CCD group and constant temperature head mechanism are used to achieve up and down synchronization bonding through multiple sets of constant temperature head components and pulse head components, and position adjustment is performed by combining the back plate screw module and the head screw module.
The two-sided synchronous bonding has been achieved, which reduces production costs, improves work efficiency, enhances bonding effect, and expands the scope of equipment to adapt to PDLC processing of various sizes.
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Figure CN120321889A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of PDLC bonding, and particularly to a large-size double-sided PDLC multi-electrode multi-station bonding device. Background Art
[0002] PDLC is a composite material in which liquid crystal materials are dispersed in a polymer matrix. Its working principle is to change the arrangement direction of liquid crystal molecules by applying an electric field, thereby realizing the modulation of light. At present, with the continuous development of technology, PDLC has broad application prospects in the fields of display, optoelectronic switches, smart windows, etc. For example, in the construction field, smart dimming windows can automatically adjust transparency according to light intensity and user needs, achieving energy conservation and improved comfort. However, when processing PDLC, a bonding device is required to bond it with FPC.
[0003] Currently, existing bonding devices are all single-sided bonding. After one side is completed, the workpiece is flipped through a flipping mechanism to perform the bonding work on the other side. Therefore, synchronous double-sided bonding work cannot be achieved. This method will increase production costs and also reduce work efficiency. Moreover, existing bonding devices can only achieve hot pressing bonding work in one way, either constant-temperature hot pressing bonding or pulse hot pressing bonding, and synchronous bonding of the two methods cannot be achieved. Therefore, the bonding effect is poor. In addition, the pressing heads in existing bonding devices are fixed and cannot achieve an adjustment function, so the scope of use is reduced and PDLCs of multiple sizes cannot be bonded. Summary of the Invention
[0004] The purpose of the present invention is to provide a large-size double-sided PDLC multi-electrode multi-station bonding device to solve the problems in the above background art that the existing devices cannot achieve synchronous constant-temperature and pulse hot pressing bonding on both sides, and cannot achieve adjustment.
[0005] To achieve the above object, the present invention provides the following technical solutions: a large-size double-sided PDLC multi-electrode multi-station bonding device, including a frame, on the surface of which a control panel is installed for controlling the entire device; inside the frame, a platform combination is provided, which is composed of a main pressing platform, a glass alignment platform, an FPC alignment platform, and a platform backplane group. On the surface of the main pressing platform, a glass alignment platform is installed for transporting the PDLC; at one end of the main pressing platform surface away from the glass alignment platform, an FPC alignment platform is installed for transporting the FPC. On the surface of the main pressing platform, a platform backplane group is also installed for thermocompression bonding the lower layers of the PDLC and the FPC; at both ends of the frame surface, CCD groups are installed for taking pictures of the positions of the PDLC and the FPC. Inside the frame, a constant-temperature pressing head mechanism is also provided for thermocompression bonding the upper layers of the PDLC and the FPC.
[0006] Preferably, the main pressing platform includes a base, a carrier plate, and a Y-axis linear module, and the base is fixedly connected inside the frame.
[0007] Preferably, a Y-axis linear module is installed on the surface of the base, and the sliding end of the Y-axis linear module is fixed with a carrier plate, and the carrier plate is slidably connected to the base through a slide rail and a slider.
[0008] Preferably, the glass alignment platform is composed of an X-axis linear module, a glass UVW platform, and a glass extension frame. The X-axis linear module is fixedly connected to the surface of the carrier plate, the sliding end of the X-axis linear module is fixed with a glass UVW platform, and the glass UVW platform is slidably connected to the carrier plate through a slide rail and a slider. On the surface of the glass UVW platform, a glass extension frame is installed for placing the PDLC.
[0009] Preferably, the FPC alignment platform is composed of an FPC UVW platform, a lifting component, and a vacuum plate combination. The FPC UVW platform is fixedly connected to the surface of the carrier plate, a lifting component is installed at the top of the FPC UVW platform, a vacuum plate for placing the FPC is provided above the lifting component, and the bottom end of the vacuum plate is fixedly connected to the four sliders of the lifting component.
[0010] Preferably, the platform backplane group includes a bottom plate, a backplane lead screw module, a backplane component, and a pulse pressing head component. The bottom plate is fixedly connected to the surface of the carrier plate, and a backplane lead screw module is installed at the top of the bottom plate.
[0011] Preferably, multiple groups of backplane components are fixed to the sliding end of the backplane lead screw module. Pulse press head components are installed at both ends of the surface of the bottom plate, and this pulse press head component is used for pulse thermal press bonding of the lower layers of PDLC and FPC.
[0012] Preferably, the CCD group includes a camera linear module and a CCD camera. The camera linear module is fixedly connected to the surface of the frame, and the CCD camera is installed on the sliding seat of the camera linear module. This CCD camera is used for taking pictures of the positions of PDLC and FPC.
[0013] Preferably, the constant temperature press head mechanism is composed of a biaxial motion group, a constant temperature press head component, a left coil leather component, and a right coil material component. Multiple groups of constant temperature press head components are connected to the surface of the biaxial motion group. This constant temperature press head component is used for constant temperature thermal press bonding of the upper layers of PDLC and FPC in cooperation with the support of the backplane component. The left coil leather component and the right coil material component are respectively arranged at the left and right ends of the biaxial motion group.
[0014] Preferably, the biaxial motion group includes a support frame, a lifting lead screw module, and a press head lead screw module. The support frame is fixedly connected to the surface of the frame, and the left coil leather component and the right coil material component are both fixedly installed on the surface of the support frame; the lifting lead screw module is fixedly connected to the surface of the support frame, and the sliding end of the lifting lead screw module is provided with a press head lead screw module. This press head lead screw module is slidably connected to the support frame through a slide rail and slider, and the constant temperature press head component is fixedly connected to the sliding seat of the press head lead screw module.
[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: The large-size double-sided PDLC multi-electrode multi-station bonding device realizes bonding through setting a platform combination, a CCD group, and a constant temperature press head mechanism; the platform combination is used to carry PDLC and FPC, and the position is photographed by the CCD group during transportation. Then, bonding is realized through the constant temperature press head mechanism and the pulse press head component. By setting multiple groups of constant temperature press head components on the upper layer and two pulse press head components on the lower layer, the present invention realizes the synchronous bonding function of the upper and lower layers, solves the problem that the prior art needs to be flipped to realize double-sided press bonding, reduces the production cost, and the cooperation of multiple constant temperature press head components and multiple backplane components also improves the working efficiency; at the same time, the present invention can realize constant temperature thermal press bonding by using the constant temperature press head component and pulse thermal press bonding by using the pulse press head component, solves the problem that the prior art can only realize thermal press bonding through one method, and thus increases the bonding effect of the bonding device; in addition, the present invention drives the backplane component and the constant temperature press head component to move respectively through the backplane lead screw module and the press head lead screw module, realizes the automatic adjustment function at any position, solves the problem that the prior art is fixed and cannot be adjusted, and thus improves the use range of the bonding device and can realize the bonding work of multiple sizes. Description of the Drawings
[0016] Figure 1 It is a schematic diagram of the three-dimensional appearance structure of the present invention;
[0017] Figure 2 It is a schematic diagram of the internal explosion structure of the present invention;
[0018] Figure 3 It is a schematic diagram of the enlarged structure of the platform combination of the present invention;
[0019] Figure 4 It is a schematic diagram of the partial explosion structure of the platform combination of the present invention;
[0020] Figure 5 It is a schematic diagram of the explosion structure of the platform combination of the present invention;
[0021] Figure 6 It is a schematic diagram of the explosion structure of the FPC alignment platform of the present invention;
[0022] Figure 7 It is a schematic diagram of the explosion structure of the platform backplane group of the present invention;
[0023] Figure 8 It is a schematic diagram of the explosion structure of the CCD group of the present invention;
[0024] Figure 9 It is a schematic diagram of the enlarged structure of the constant temperature press head mechanism of the present invention;
[0025] Figure 10 It is a schematic diagram of the enlarged explosion structure of the constant temperature press head mechanism of the present invention.
[0026] In the figure: 1. Frame; 11. Control panel; 2. Platform combination; 21. Main pressure platform; 211. Base; 212. Carrier plate; 213. Y-axis linear module; 22. Glass alignment platform; 221. X-axis linear module; 222. Glass UVW platform; 223. Glass extension frame; 23. FPC alignment platform; 231. FPC UVW platform; 232. Lifting assembly; 233. Vacuum plate; 24. Platform backplane group; 241. Bottom plate; 242. Backplane lead screw module; 243. Backplane assembly; 244. Pulse press head assembly; 3. CCD group; 31. Camera linear module; 32. CCD camera; 4. Constant temperature press head mechanism; 41. Biaxial motion group; 411. Support frame; 412. Lifting lead screw module; 413. Press head lead screw module; 42. Constant temperature press head assembly; 43. Left coiling component; 44. Right coiling component. Detailed implementation manners
[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. In addition, the terms "first", "second", "third", "upper, lower, left, right", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. At the same time, in the description of the present invention, unless otherwise clearly specified and limited, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0028] The structure of the large-size double-sided PDLC multi-electrode multi-station bonding equipment provided by the present invention is as Figure 1 and Figure 3 shown, including a frame 1, on the surface of the frame 1 is installed a control panel 11, which is used for the control work of the entire equipment; inside the frame 1 is provided a platform combination 2, which is composed of a main pressing platform 21, a glass alignment platform 22, an FPC alignment platform 23 and a platform backplane group 24. On the surface of the main pressing platform 21 is installed the glass alignment platform 22, which is used for the transportation of PDLC; at one end of the surface of the main pressing platform 21 away from the glass alignment platform 22 is installed the FPC alignment platform 23, which is used for the transportation of FPC, and on the surface of the main pressing platform 21 is also installed the platform backplane group 24, which is used for the thermocompression bonding work of the lower layers of PDLC and FPC.
[0029] During implementation, PDLC is placed on the glass alignment platform 22, and the main pressing platform 21 drives the PDLC on the glass alignment platform 22 to feed. Then, the FPC alignment platform 23 feeds the FPC, and then the platform backplane group 24 performs the thermocompression bonding work on the lower layers of PDLC and FPC.
[0030] Furthermore, as Figure 4 and Figure 5As shown in the figure, the pressing platform 21 includes a base 211, a carrier plate 212, and a Y-axis linear module 213. The base 211 is fixedly connected inside the frame 1. The Y-axis linear module 213 is installed on the surface of the base 211, and the sliding end of the Y-axis linear module 213 is fixed with the carrier plate 212. Moreover, the carrier plate 212 is slidably connected to the base 211 through a slide rail and slider; the glass alignment platform 22 is composed of an X-axis linear module 221, a glass UVW platform 222, and a glass extension frame 223. The X-axis linear module 221 is fixedly connected to the surface of the carrier plate 212. The sliding end of the X-axis linear module 221 is fixed with the glass UVW platform 222. And the glass UVW platform 222 is slidably connected to the carrier plate 212 through a slide rail and slider. The glass extension frame 223 is installed on the surface of the glass UVW platform 222.
[0031] During implementation, place the PDLC soft film on the glass extension frame 223. Then, the Y-axis linear module 213 drives the carrier plate 212 to move, and the carrier plate 212 will drive the glass alignment platform 22 to move when it moves.
[0032] Further, as Figure 3 and Figure 6 shown, the FPC alignment platform 23 is composed of an FPC UVW platform 231, a lifting component 232, and a vacuum plate 233. The FPC UVW platform 231 is fixedly connected to the surface of the carrier plate 212. The lifting component 232 is installed at the top of the FPC UVW platform 231. Above the lifting component 232, there is a vacuum plate 233 for placing the FPC. And the bottom end of the vacuum plate 233 is fixedly connected to the four sliders of the lifting component 232. The glass extension frame 223 is used for placing the PDLC.
[0033] During implementation, then place the FPC attached with ACF conductive adhesive on the vacuum plate 233. The pressing platform 21 drives the FPC on the surface of the vacuum plate 233 to move under the CCD camera 32 for position photographing. After photographing, the FPC UVW platform 231 and the lifting component 232 cooperate to correct the FPC so that the position of the FPC is aligned with that of the PDLC soft film.
[0034] Further, as Figure 4 and Figure 7 shown, the platform backplane group 24 includes a bottom plate 241, a backplane lead screw module 242, a backplane component 243, and a pulse press head component 244. The bottom plate 241 is fixedly connected to the surface of the carrier plate 212. And the backplane lead screw module 242 is installed at the top of the bottom plate 241. The sliding end of the backplane lead screw module 242 is fixed with multiple groups of backplane components 243 for heating. Pulse press head components 244 are installed at both ends of the surface of the bottom plate 241. The pulse press head components 244 are used for pulse thermal pressing and bonding of the lower layers of the PDLC and the FPC.
[0035] During implementation, the backplane lead screw module 242 on the surface of the bottom plate 241 drives the movement of the backplane assembly 243, and the backplane assembly 243 cooperates with the pulse press head assembly 244 to perform pulse thermocompression bonding on the lower layer of the PDLC flexible film and the FPC.
[0036] Further, as Figure 2 and Figure 8 shown, CCD groups 3 for photographing the positions of the PDLC and the FPC are installed at both ends of the surface of the frame 1. The CCD group 3 includes a camera linear module 31 and a CCD camera 32. The camera linear module 31 is fixedly connected to the surface of the frame 1, and the CCD camera 32 is installed on the sliding seat of the camera linear module 31. The CCD camera 32 is used for photographing the positions of the PDLC and the FPC.
[0037] During implementation, after the PDLC flexible film on the surface of the glass extension bracket 223 moves below the CCD camera 32, the camera linear module 31 drives the CCD camera 32 to move to photograph the position of the PDLC flexible film and perform initial calibration with the position of the constant temperature press head assembly 42.
[0038] Further, as Figure 9 and Figure 10 shown, a constant temperature press head mechanism 4 is further provided inside the frame 1. The constant temperature press head mechanism 4 is used for performing thermocompression bonding on the upper layer of the PDLC and the FPC. The constant temperature press head mechanism 4 is composed of a biaxial motion group 41, a constant temperature press head assembly 42, a left coiling leather component 43, and a right coiling material component 44. Multiple groups of constant temperature press head assemblies 42 are connected to the surface of the biaxial motion group 41. The constant temperature press head assembly 42 cooperates with the support of the backplane assembly 243 to perform constant temperature thermocompression bonding on the upper layer of the PDLC and the FPC. The left coiling leather component 43 and the right coiling material component 44 are respectively arranged at the left and right ends of the biaxial motion group 41. The biaxial motion group 41 includes a support frame 411, a lifting lead screw module 412, and a press head lead screw module 413. The support frame 411 is fixedly connected to the surface of the frame 1, and the left coiling leather component 43 and the right coiling material component 44 are both fixedly connected to the surface of the support frame 411; the lifting lead screw module 412 is fixedly connected to the surface of the support frame 411, and the sliding end of the lifting lead screw module 412 is provided with the press head lead screw module 413. The press head lead screw module 413 is slidably connected to the support frame 411 through a slide rail and a slider, and the constant temperature press head assembly 42 is fixedly connected to the sliding seat of the press head lead screw module 413.
[0039] During implementation, the press head lead screw module 413 drives the constant temperature press head assembly 42 to move, and then the lifting lead screw module 412 drives the press head lead screw module 413 to move downward, so that the constant temperature press head assembly 42 performs constant temperature thermocompression bonding on the upper layer of the PDLC flexible film and the FPC.
[0040] Working principle: During use, first place the PDLC flexible film on the glass extension bracket 223. Then, the Y-axis linear module 213 drives the carrier plate 212 to move. When the carrier plate 212 moves, it will drive the glass alignment platform 22 to move, so that the PDLC flexible film on the surface of the glass extension bracket 223 moves below the CCD camera 32. At this time, the camera linear module 31 drives the CCD camera 32 to move to take a picture of the position of the PDLC flexible film, and perform an initial calibration with the position of the constant-temperature pressing head assembly 42.
[0041] Next, place the FPC with the ACF conductive adhesive attached on the vacuum plate 233. The main pressing platform 21 drives the FPC on the surface of the vacuum plate 233 to move below the CCD camera 32 for position photography. After photography, the FPC UVW platform 231 and the lifting assembly 232 cooperate to calibrate the FPC, so that the position of the FPC is aligned with that of the PDLC flexible film.
[0042] Subsequently, the constant-temperature pressing head assembly 42 is driven to move by the pressing head lead screw module 413, and then the pressing head lead screw module 413 is driven to move downward by the lifting lead screw module 412, so that the constant-temperature pressing head assembly 42 performs constant-temperature thermal pressing and bonding on the upper layers of the PDLC flexible film and the FPC. At the same time, the backplane lead screw module 242 on the surface of the bottom plate 241 drives the backplane assembly 243 to move, and the backplane assembly 243 cooperates with the pulse pressing head assembly 244 to perform pulse thermal pressing and bonding on the lower layers of the PDLC flexible film and the FPC.
[0043] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to embrace all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.
Claims
1. Large-size double-sided PDLC multi-electrode multi-station bonding equipment, including a frame (1), characterized in that: A control panel (11) is mounted on the surface of the frame (1), and this control panel (11) is used for the control work of the entire device; a platform combination (2) is arranged inside the frame (1), and this platform combination (2) is composed of a main pressing platform (21), a glass alignment platform (22), an FPC alignment platform (23) and a platform backplane group (24). A glass alignment platform (22) is mounted on the surface of the main pressing platform (21), and this glass alignment platform (22) is used for the transportation work of the PDLC; an FPC alignment platform (23) is mounted at one end of the surface of the main pressing platform (21) away from the glass alignment platform (22), and this FPC alignment platform (23) is used for the transportation work of the FPC. A platform backplane group (24) is also mounted on the surface of the main pressing platform (21), and this platform backplane group (24) is used for the thermal compression bonding work of the lower layers of the PDLC and the FPC; CCD groups (3) for photographing the positions of the PDLC and the FPC are mounted at both ends of the surface of the frame (1), and a constant temperature pressing head mechanism (4) is also arranged inside the frame (1), and this constant temperature pressing head mechanism (4) is used for the thermal compression bonding work of the upper layers of the PDLC and the FPC.
2. The large-size double-sided PDLC multi-electrode multi-station bonding device according to claim 1, wherein: The main pressing platform (21) includes a base (211), a carrier plate (212) and a Y-axis linear module (213), and the base (211) is fixedly connected inside the frame (1).
3. The large-size double-sided PDLC multi-electrode multi-station bonding device according to claim 2, characterized in that: A Y-axis linear module (213) is mounted on the surface of the base (211), and the sliding end of the Y-axis linear module (213) is fixed with a carrier plate (212), and the carrier plate (212) is slidably connected to the base (211) through a slide rail and a slider.
4. The large-size double-sided PDLC multi-electrode multi-station bonding device according to claim 1, characterized in that: The glass alignment platform (22) is composed of an X-axis linear module (221), a glass UVW platform (222) and a glass extension frame (223). The X-axis linear module (221) is fixedly connected to the surface of the carrier plate (212). The sliding end of the X-axis linear module (221) is fixed with a glass UVW platform (222), and the glass UVW platform (222) is slidably connected to the carrier plate (212) through a slide rail and a slider. A glass extension frame (223) is mounted on the surface of the glass UVW platform (222), and this glass extension frame (223) is used for the placement work of the PDLC.
5. The large-size double-sided PDLC multi-electrode multi-station bonding device according to claim 1, wherein: The FPC alignment platform (23) is composed of an FPC UVW platform (231), a lifting assembly (232) and a vacuum plate (233). The FPC UVW platform (231) is fixedly connected to the surface of the carrier plate (212). A lifting assembly (232) is mounted on the top of the FPC UVW platform (231). A vacuum plate (233) for placing the FPC is arranged above the lifting assembly (232), and the bottom end of the vacuum plate (233) is fixedly connected to the four sliders of the lifting assembly (232).
6. The large-size double-sided PDLC multi-electrode multi-station bonding device according to claim 1, wherein: The platform backplane group (24) includes a bottom plate (241), a backplane lead screw module (242), a backplane assembly (243), and a pulse press head assembly (244). The bottom plate (241) is fixedly connected to the surface of the carrier plate (212), and the backplane lead screw module (242) is installed at the top of the bottom plate (241).
7. The large-size double-sided PDLC multi-electrode multi-station bonding device according to claim 6, wherein: Multiple groups of backplane assemblies (243) are fixed to the sliding end of the backplane lead screw module (242). Pulse press head assemblies (244) are installed at both ends of the surface of the bottom plate (241). The pulse press head assemblies (244) are used for pulse thermal pressing and bonding of the lower layers of PDLC and FPC.
8. The large-size double-sided PDLC multi-electrode multi-station bonding equipment according to claim 1, wherein: The CCD group (3) includes a camera linear module (31) and a CCD camera (32). The camera linear module (31) is fixedly connected to the surface of the frame (1), and the CCD camera (32) is installed on the sliding seat of the camera linear module (31). The CCD camera (32) is used for taking pictures of the positions of PDLC and FPC.
9. The large-size double-sided PDLC multi-electrode multi-station bonding device according to claim 1, wherein: The constant temperature press head mechanism (4) is composed of a biaxial motion group (41), a constant temperature press head assembly (42), a left coiling component (43), and a right coiling component (44). Multiple groups of constant temperature press head assemblies (42) are connected to the surface of the biaxial motion group (41). The constant temperature press head assemblies (42) cooperate with the support of the backplane assembly (243) for constant temperature thermal pressing and bonding of the upper layers of PDLC and FPC. The left coiling component (43) and the right coiling component (44) are respectively arranged at the left and right ends of the biaxial motion group (41).
10. The large-size double-sided PDLC multi-electrode multi-station bonding equipment according to claim 9, wherein: The biaxial motion group (41) includes a support frame (411), a lifting lead screw module (412), and a press head lead screw module (413). The support frame (411) is fixedly connected to the surface of the frame (1), and the left coiling component (43) and the right coiling component (44) are both fixedly installed on the surface of the support frame (411). The lifting lead screw module (412) is fixedly connected to the surface of the support frame (411), and the sliding end of the lifting lead screw module (412) is provided with the press head lead screw module (413). The press head lead screw module (413) is slidably connected to the support frame (411) through a slide rail and a slider, and the constant temperature press head assembly (42) is fixedly connected to the sliding seat of the press head lead screw module (413).