A device for plating nickel on the surface of diamond micro-powder based on semiconductor wafer production

Abstract

The application relates to the technical field of diamond micro-powder processing, and discloses a nickel plating device for the surface of diamond micro-powder based on semiconductor wafer production, which comprises a reaction tank, an adjustable turbulence mechanism and an adjustable stirring mechanism, further comprises a top cover which is screw-mounted on the top of the reaction tank, the top of the top cover is fixedly installed with an adjusting mechanism, and the bottom of the top cover is fixedly installed with a mixer; the adjustable turbulence mechanism is composed of two mounting frames, a rotating ring and four angle adjusting assemblies; the technical scheme of the application synchronously drives the adjustable turbulence mechanism and the adjustable stirring mechanism through the adjusting mechanism, synchronously adjusts the adjusting paddle angle in the adjustable stirring mechanism and the turbulence plate angle in the adjustable turbulence mechanism according to the requirements of different nickel plating stages, forms a multi-dimensional circulating flow field through cooperation of the paddle angle and the turbulence plate angle, meets the nickel plating requirements of different stages, and ensures the dispersibility and plating layer uniformity of the diamond micro-powder.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of diamond powder processing, and in particular to a device for plating nickel on the surface of diamond powder based on semiconductor wafer production. BACKGROUND

[0002] In the precision machining process of semiconductor wafer production, diamond powder is widely used in the grinding and polishing steps of wafers as a high-efficiency and excellent-performance abrasive; the diamond powder is a key material for realizing high-precision machining due to its high hardness and good cutting performance; plating nickel on the surface of the diamond powder can significantly improve the wear resistance and corrosion resistance of the diamond powder and effectively improve the adsorption and dispersion performance of the diamond powder, so that the diamond powder exhibits better stability and efficiency in the grinding and polishing process.

[0003] A device for electroless plating nickel on the surface of diamond powder with the publication number CN107761080A has solved the technical defects that the stirring speed of plating solution and powder in the reaction barrel is difficult to meet the dispersion requirements, and diamond particles are easily accumulated under the stirring blade to cause adhesion and affect the quality of wire saws. In the process of realizing the present application, the inventors have found that at least the following problems exist in the prior art:

[0004] The existing device for plating nickel on the surface of diamond powder based on semiconductor wafer production cannot dynamically adjust the shear force and shear field distribution according to the nickel plating requirements of diamond powder in the process of plating and stirring the diamond powder. Since a low shear force environment is required for the nucleation stage of the surface of the diamond powder and a high shear force environment is required after the nucleation stage, the existing nickel plating device can only provide fixed shear stress and flow paths. The fixed shear stress and flow paths result in that, in the nucleation stage of the surface of the diamond powder, too high shear force can cause the diamond powder to collide violently and cause uncombined particles to fall off, causing plating defects, and too low shear force cannot effectively disturb the plating solution, which can cause the diamond powder to aggregate due to too low flow rate, resulting in uneven plating layer thickness and nodulation phenomenon, and cannot meet the requirements of shear stress and flow field intensity in different stages of the nickel plating process, thereby causing the problems of insufficient plating layer quality and uniformity.

[0005] Therefore, the above technical problems need to be solved. SUMMARY

[0006] In order to overcome the deficiencies of the prior art, the present application provides a device for plating nickel on the surface of diamond powder based on semiconductor wafer production, so as to solve the problem that the shear force and shear field distribution cannot be dynamically adjusted according to the nickel plating requirements of diamond powder, and the single stirring paddle shear force intensity and shear field result in uneven plating layer thickness and nodulation phenomenon, affecting the uniformity of the nickel plating of diamond powder.

[0007] In order to solve the above technical problems, the basic technical scheme of the present application is that:

[0008] The application discloses a nickel plating device for diamond micro-powder surface based on semiconductor wafer production, which comprises a reaction tank, an adjustable turbulence mechanism and an adjustable stirring mechanism, and further comprises a top cover which is screw-mounted on the top of the reaction tank, an adjusting mechanism which is fixedly mounted on the top of the top cover, and a mixer which is fixedly mounted on the bottom of the top cover; the adjustable turbulence mechanism is composed of two mounting frames, a rotating ring and four angle adjusting assemblies, the four angle adjusting assemblies are distributed in a ring shape at the outer side of the top of the rotating ring at equal intervals, the outer side of the rotating ring is in transmission connection with the four angle adjusting assemblies through linkage sliding blocks, the adjustable stirring mechanism is rotatably mounted in the mixer, and the top end of the adjustable stirring mechanism is in transmission connection with the adjusting mechanism; the adjustable turbulence mechanism and the adjustable stirring mechanism are synchronously driven through the adjusting mechanism, the flow mode and the shear force field distribution of fluid are dynamically adjusted through the adjustable stirring mechanism, the turbulence angle is adjusted through the adjustable turbulence mechanism, the flow path and the speed of plating solution are changed, and a multi-dimensional circulating flow field can be formed through cooperation of the adjustable turbulence mechanism and the adjustable stirring mechanism.

[0009] Preferably, the adjustable stirring mechanism is composed of a driven bevel gear, a transmission rod, an adjusting rod, an adjustable angle stirring paddle and a shaft sleeve, the driven bevel gear is fixedly mounted at the top end of the transmission rod, the shaft sleeve is fixedly mounted at the bottom end of the transmission rod, the adjusting rod is movably mounted in the transmission rod, a spline rod is fixedly mounted at the top of the outer side of the adjusting rod, a spline groove is formed in the interior of the driven bevel gear and corresponds to the spline rod, the adjusting rod is in snap pin connection with the spline groove in the interior of the driven bevel gear through the spline rod, the driven bevel gear can drive the adjusting rod to synchronously rotate, and meanwhile, the adjusting rod can be movably arranged in the transmission rod, an axle support is fixedly mounted at the bottom end of the adjusting rod, the bottom end of the adjusting rod is movably connected with the adjustable angle stirring paddle through the axle support, the adjusting rod can adjust the angle of the adjustable angle stirring paddle through the axle support, the adjustable angle stirring paddle is composed of a universal shaft, a mounting shaft seat and a paddle blade, the top of the universal shaft is rotatably connected with the bottom of the mounting shaft seat, and the paddle blade is fixedly mounted on one side of the mounting shaft seat.

[0010] Preferably, a limiting roller is rotatably mounted in each of the two mounting frames, the two mounting frames are movably arranged at the two sides of the rotating ring through the limiting rollers, and the two mounting frames are fixedly mounted at the two sides of the outer wall of the adjustable turbulence mechanism, respectively, one side of the interior of one of the mounting frames is rotatably mounted with a second gear, and the outer side of the rotating ring is fixedly mounted with a second rack, and the second rack is in meshing connection with the second gear.

[0011] Preferably, the angle adjusting assembly is composed of a sliding groove, a rotating shaft and a turbulence plate, one end of the rotating shaft is fixedly mounted with the sliding groove, the other end of the rotating shaft is fixedly mounted with the turbulence plate, and one end of the rotating shaft extends into the interior of the mixer and is movably connected with the inner wall of the mixer.

[0012] Preferably, the adjusting mechanism is composed of a sliding groove frame, a first gear, an extension frame, a servo motor, a first bevel gear and a second bevel gear, wherein sliding grooves are formed on the front and back of the sliding groove frame, sliding rods corresponding to the sliding grooves are fixedly installed on the front and back of the extension frame, the sliding rods extend into the sliding grooves and are movably connected, the extension frame is movably installed in the sliding groove frame through the cooperation of the sliding rods and the sliding grooves, the bottom of the extension frame extends into the inside of the top cover, the bottom of the extension frame is connected with the top end of the adjusting rod through a rotating shaft, a first rack is fixedly installed on the inner wall of one side of the extension frame, a first gear is rotatably installed in the inside of the sliding groove frame through a shaft rod, the first gear is movably connected with the first rack, the servo motor is fixedly installed on one side of the sliding groove frame, the output end of the servo motor is fixedly connected with one side of the first gear through a shaft rod, the first bevel gear is fixedly connected with the other side of the first gear through a shaft rod, the first bevel gear is movably connected with the second bevel gear, and the bottom of the second bevel gear is drivingly connected with the second gear through a shaft rod.

[0013] Preferably, a driving motor is fixedly installed on one side in the inside of the top cover, a driving bevel gear is fixedly installed on the output end of the driving motor through a shaft rod, the driving bevel gear is movably connected with a driven bevel gear, the bottom of the top cover extends into the inside of the reaction tank, and an annular spraying mechanism is fixedly installed on the bottom of the top cover.

[0014] The application has the following beneficial effects:

[0015] The technical scheme of the application can synchronize driving of the adjustable turbulence mechanism and the adjustable stirring mechanism through the adjusting mechanism, can synchronously adjust the adjusting blade angle of the adjustable stirring mechanism and the turbulence plate angle of the adjustable turbulence mechanism according to the requirements of different nickel plating stages, can form a multi-dimensional circulating flow field through cooperation of the blade angle and the turbulence plate angle, can meet the nickel plating requirements of different stages, and can ensure dispersivity of the diamond micro powder and uniformity of the plated layer.

[0016] Specifically, the adjustable angle stirring paddle of the adjustable stirring mechanism can change the blade angle according to the requirements of different nickel plating stages, can generate different axial and radial flows, can dynamically adjust shear stress and shear force distribution, can provide a low shear force environment for the device in the nucleation initial stage of the diamond micro powder to avoid loss caused by particle collision, can increase the shear force after the nucleation stage to make particle suspension and dispersion more uniform, can improve uniformity and quality of the final plated layer, can make the device meet the shear stress and shear force distribution requirements of different nickel plating stages, can ensure efficient diffusion of nickel ions in the plating solution and uniform dispersion of the micro powder, can reduce violent collision and particle shedding of the diamond micro powder caused by excessively high shear force in the nickel plating nucleation stage, and can also avoid micro powder aggregation and plated layer unevenness caused by excessively low shear force after nucleation

[0017] The flow direction of the fluid is adjusted by adjusting four reversible spoiler plates in the adjustable spoiler mechanism, the laminar flow state is broken, the cross mixing is formed, the uniform circulation of the fluid in the reaction tank is promoted, the aggregation and caking of the diamond micro powder are reduced, and thus the mixing efficiency of the plating solution and the diamond micro powder is improved.

[0018] According to the needs of the nickel plating stage, the device utilizes the synergistic effect of the adjustable spoiler mechanism and the adjustable stirring mechanism to dynamically adjust the flow path, shear force distribution and intensity of the fluid, forms a multi-dimensional circulating flow field, improves the diffusion efficiency of nickel ions in the plating solution and the uniformity of particle suspension, ensures that each stage is under the most suitable conditions for nickel plating, and thus improves the uniformity of the nickel plating on the surface of the diamond micro powder and the dense plating layer effect. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure in the application;

[0020] Figure 2 It is a schematic diagram of the internal structure of the reaction tank in the application;

[0021] Figure 3 It is a schematic diagram of the internal structure of the mixer in the application;

[0022] Figure 4 It is a schematic diagram of the water flow direction of the adjustable angle stirring paddle in the application;

[0023] Figure 5 It is a schematic diagram of the internal structure of the top cover in the application;

[0024] Figure 6 It is a schematic diagram of the transmission connection between the adjusting mechanism and the adjustable spoiler mechanism and the adjustable stirring mechanism in the application;

[0025] Figure 7 It is a schematic diagram of the internal structure of the adjusting mechanism in the application;

[0026] Figure 8 It is a schematic diagram of the structure of the adjustable spoiler mechanism in the application;

[0027] Figure 9 It is a schematic diagram of the structure of the mounting bracket in the application;

[0028] Figure 10 It is a schematic diagram of the internal structure of the adjustable stirring mechanism in the application;

[0029] Figure 11 It is a schematic diagram of the internal structure of the adjustable stirring mechanism in the application;

[0030] Figure 12 It is a schematic diagram of the adjustable angle blade structure in the application;

[0031] Figure 13 Fig. 1 is a schematic view of the universal shaft structure in the present application.

[0032] Mark explanation:

[0033] 1, reaction tank; 2, top cover; 201, driving motor; 202, driving bevel gear; 203, annular spraying mechanism; 3, adjusting mechanism; 301, sliding groove frame; 302, first gear; 303, telescopic frame; 304, first rack; 305, servo motor; 306, first bevel gear; 307, second bevel gear; 4, mixer; 5, adjustable turbulence mechanism; 501, mounting frame; 5011, limit roller; 502, rotating ring; 5021, second rack; 503, sliding groove; 504, rotating shaft; 505, turbulence plate; 506, second gear; 6, adjustable stirring mechanism; 601, driven bevel gear; 602, transmission rod; 603, adjusting rod; 604, adjustable angle stirring paddle; 6041, universal shaft; 6042, mounting shaft seat; 6043, paddle; 605, shaft sleeve. DETAILED DESCRIPTION

[0034] The specific embodiments of the present application will be described below with reference to the accompanying drawings. Figure 1 to the accompanying drawings Figure 13 The technical solutions in the embodiments of the present application are described clearly and completely, obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the present application.

[0035] A kind of nickel plating device on the surface of diamond micro powder based on semiconductor wafer production, including reaction tank 1, adjustable turbulence mechanism 5 and adjustable stirring mechanism 6, it also includes top cover 2 of screw installation in the top of reaction tank 1, adjusting mechanism 3 is fixedly installed in the top of top cover 2, and mixer 4 is fixedly installed in the bottom of top cover 2;Adjustable turbulence mechanism 5 is composed of two mounting frames 501, rotating ring 502 and four angle adjusting assemblies, four angle adjusting assemblies are distributed in annular equidistant on the outside of the top of rotating ring 502, and the outside of rotating ring 502 is transmissionally connected with four angle adjusting assemblies by linkage sliding block;Adjustable stirring mechanism 6 is rotatably installed in the inside of mixer 4, and the top end of adjustable stirring mechanism 6 is transmissionally connected with adjusting mechanism 3;Adjusting mechanism 3 synchronously drives adjustable turbulence mechanism 5 and adjustable stirring mechanism 6, dynamically adjusts the flow mode and shear force field distribution of fluid by adjustable stirring mechanism 6, adjusts turbulence angle by adjustable turbulence mechanism 5, changes the flow path and speed of plating solution, and by the cooperation of adjustable turbulence mechanism 5 and adjustable stirring mechanism 6, multi-dimensional circulating flow field can be formed;

[0036] It should be noted that the bottom of the reaction tank 1 is provided with a collection valve, which is convenient for collecting the micropowder plated with nickel in the reaction tank 1, and a plating solution circulating mechanism is installed on the outside of the collection valve through a mounting cover. The plating solution circulating mechanism realizes the circulation of the plating solution in the reaction tank 1. The flow pattern and shear force of the fluid are dynamically adjusted by adjusting the angle of the adjustable angle stirring paddle 604 in the adjustable stirring mechanism 6, so that the adjustable angle stirring paddle 604 dynamically adjusts the size of the shear force and the shear force field distribution according to the needs of the diamond micro-nickel plating stage. Specifically, the size of the shear force can be flexibly controlled by adjusting the angle of the paddle 6043 in the adjustable angle stirring paddle 604. A larger angle produces stronger axial flow, while a smaller angle produces more radial flow, dynamically changes the shear force distribution, and changes the action area and intensity distribution of the shear force. A larger angle of the paddle 6043 increases the relative motion between the fluid and the paddle 6043, thereby generating higher shear stress and intensifying fluid shear action to form turbulent flow enhancement, which can accelerate the migration of nickel ions to the surface of the diamond micropowder and shorten the plating layer formation time.

[0037] The adjustable turbulence mechanism 5 driven by the rotating ring 502 drives the four angle adjusting assemblies to flip synchronously. The flipped four angle adjusting assemblies change the angle of the turbulence plate 505 in the angle adjusting assembly, force the fluid to change the original flow direction by adjusting the angle of the turbulence plate 505, achieve the purpose of adjusting the turbulence angle, and the turbulence plate 505 can enhance the axial circulation of the fluid to form a cross-mixed stirring effect. The cross-mixed stirring method helps to break the laminar flow state in the fluid, promotes the formation of turbulent flow, and improves the mixing efficiency. By adjusting the angle of the turbulence plate 505, the turning angle and range of the fluid can be accurately controlled, thereby optimizing the circulation path of the fluid in the barrel, ensuring uniform distribution of the fluid in the barrel, reducing the stirring dead angle, and further improving the mixing effect. By adjusting the angle of the turbulence plate 505, the diamond micro-nickel plating stirring process at different stages can be adapted.

[0038] The adjustable turbulence mechanism 5 and the adjustable stirring mechanism 6 cooperate to dynamically adjust the flow path, shear force distribution and intensity of the fluid, forming a multi-dimensional circulating flow field.

[0039] As Figures 10 to 13As shown, the adjustable stirring mechanism 6 is composed of a driven bevel gear 601, a transmission rod 602, an adjusting rod 603, an adjustable angle stirring paddle 604 and a shaft sleeve 605, wherein the driven bevel gear 601 is fixedly installed at the top end of the transmission rod 602, the shaft sleeve 605 is fixedly installed at the bottom end of the transmission rod 602, the adjusting rod 603 is movably installed inside the transmission rod 602, the top of the outer side of the adjusting rod 603 is fixedly installed with a spline shaft, a spline groove corresponding to the spline shaft is formed in the inside of the driven bevel gear 601, the adjusting rod 603 is connected with the spline groove in the inside of the driven bevel gear 601 through the spline shaft, so that the driven bevel gear 601 can drive the adjusting rod 603 to rotate synchronously, and meanwhile the adjusting rod 603 can move in and out of the transmission rod 602 without being affected, the bottom end of the adjusting rod 603 is fixedly installed with an axle bracket, the bottom end of the adjusting rod 603 is movably connected with the adjustable angle stirring paddle 604 through the axle bracket, the adjusting rod 603 moving in and out can adjust the angle of the adjustable angle stirring paddle 604 through the axle bracket, wherein the adjustable angle stirring paddle 604 is composed of a universal shaft 6041, an installation shaft seat 6042 and a paddle blade 6043, the top of the universal shaft 6041 is rotatably connected with the bottom of the installation shaft seat 6042, and the paddle blade 6043 is fixedly installed on one side of the installation shaft seat 6042.

[0040] It should be noted that the installation shaft seat 6042 is movably connected with the shaft sleeve 605 through an axle bolt, the adjusting rod 603 is driven to move in and out by the adjusting mechanism 3, the adjusting rod 603 moving in and out drives the adjustable angle stirring paddle 604 to adjust the angle through the axle bracket, and specifically the adjusting rod 603 moving in and out drives the universal shaft 6041 through the axle bracket, the universal shaft 6041 drives the paddle blade 6043 to overturn and adjust the angle through the installation shaft seat 6042 movably installed on the shaft sleeve 605.

[0041] The transmission rod 602 transmits power from the driven bevel gear 601 to the adjusting rod 603 and allows the adjusting rod 603 to freely move in and out inside it, the adjusting rod 603 is realized synchronous rotation through the spline shaft and the spline groove in the inside of the driven bevel gear 601, while ensuring that its telescopic function is not affected; the rotating driven bevel gear 601 drives the transmission rod 602 to rotate, realizes synchronous rotation of the transmission rod 602 and the adjusting rod 603, and drives the adjustable angle stirring paddle 604 to rotate to stir the plating solution, the plating solution forms a radial gradient flow under the action of the centrifugal force of stirring, the micropowder moves outward under the action of the centrifugal force, and at the same time the shear force generated by the internal circulation of the plating solution destroys the agglomerated structure and forces the micropowder particles to uniformly disperse in the plating solution.

[0042] As Figures 8 to 9As shown, the inside of the two mounting racks 501 is rotatably installed with a limiting roller 5011, the two mounting racks 501 are movably installed on the two sides of the rotating ring 502 through the limiting roller 5011, and the two mounting racks 501 are fixedly installed on the two sides of the outer wall of the adjustable spoiler mechanism 5, one side of the inside of one of the mounting racks 501 is rotatably installed with a second gear 506, the outside of the rotating ring 502 is fixedly installed with a second rack 5021, and the second rack 5021 is in meshing connection with the second gear 506.

[0043] It should be noted that the mounting rack 501 limits the rotating position of the rotating ring 502 through the limiting roller 5011, and makes the rotating ring 502 rotate flexibly, the rotating second gear 506 drives the rotating ring 502 to rotate through the second rack 5021, and the rotating rotating ring 502 drives the four angle adjusting assemblies to flip synchronously through the linkage sliding block.

[0044] As shown in Figure 5 , Figure 8 , the angle adjusting assembly is composed of a sliding groove piece 503, a rotating shaft rod 504 and a spoiler plate 505, one end of the rotating shaft rod 504 is fixedly installed with the sliding groove piece 503, the other end of the rotating shaft rod 504 is fixedly installed with the spoiler plate 505, one end of the rotating shaft rod 504 extends to the inside of the mixer 4 and is movably connected with the inner wall of the mixer 4.

[0045] It should be noted that the rotating rotating ring 502 drives the rotating shaft rod 504 to rotate through the linkage sliding block and the sliding groove piece 503, the rotating rotating shaft rod 504 drives the spoiler plate 505 to adjust the angle, dynamically adapts the stirring intensity and the fluid mode, changes the flow mode and speed distribution of the plating solution in the reaction cavity by adjusting the angle of the spoiler plate 505, makes the fluid more uniform, reduces the dead zone, and improves the mixing effect of the plating solution.

[0046] As shown in Figures 6 to 7As shown, the adjusting mechanism 3 is composed of a sliding groove frame 301, a first gear 302, an extension frame 303, a servo motor 305, a first bevel gear 306 and a second bevel gear 307, wherein the front and back sides of the sliding groove frame 301 are provided with sliding grooves, the front and back sides of the extension frame 303 are fixedly installed with sliding rods corresponding to the sliding grooves, the sliding rods extend into the sliding grooves and are movably connected, the extension frame 303 is movably installed in the sliding groove frame 301 through the cooperation of the sliding rods and the sliding grooves, the bottom of the extension frame 303 extends into the inside of the top cover 2, the bottom of the extension frame 303 is connected with the top end of the adjusting rod 603 through a rotating shaft, the inner wall of one side of the extension frame 303 is fixedly installed with a first rack 304, the first gear 302 is rotatably installed in the inside of the sliding groove frame 301 through a shaft rod, the first gear 302 is in meshing connection with the first rack 304, the servo motor 305 is fixedly installed on one side of the sliding groove frame 301, the output end of the servo motor 305 is fixedly connected with one side of the first gear 302 through a shaft rod, the first bevel gear 306 is fixedly connected with the other side of the first gear 302 through a shaft rod, the first bevel gear 306 is in meshing connection with the second bevel gear 307, and the bottom of the second bevel gear 307 is in driving connection with the second gear 506 through a shaft rod;

[0047] It should be noted that the servo motor 305 is powered to drive the first gear 302 to rotate through the shaft rod, the rotating first gear 302 drives the extension frame 303 to move up and down through the meshing first rack 304, the extension frame 303 drives the adjustable angle stirring paddle 604 to adjust the angle through the adjusting rod 603, so as to adjust the shearing degree and the shearing field distribution; at the same time, the rotating first gear 302 drives the first bevel gear 306 to rotate through the shaft rod, the rotating first bevel gear 306 drives the meshing second bevel gear 307 to rotate, and the rotating second bevel gear 307 drives the second gear 506 to rotate through the shaft rod, so as to adjust the spoiler angle.

[0048] As shown in Figure 5 the inside of the top cover 2 is fixedly installed with a driving motor 201, the output end of the driving motor 201 is fixedly installed with a driving bevel gear 202 through a shaft rod, the driving bevel gear 202 is in meshing connection with a driven bevel gear 601, the bottom of the top cover 2 extends into the inside of the reaction tank 1, and the bottom of the top cover 2 is fixedly installed with an annular spraying mechanism 203;

[0049] It should be noted that the driving motor 201 is powered to rotate the driving bevel gear 202 through the shaft, the driving bevel gear 202 drives the transmission rod 602 to rotate through the meshing connection of the driven bevel gear 601, and the driven bevel gear 601 rotates to drive the adjusting rod 603 to rotate synchronously through the internal spline groove and the spline rod outside the adjusting rod 603, so that the transmission rod 602 and the adjusting rod 603 drive the adjustable angle stirring paddle 604 to rotate to stir the plating solution; the annular spraying mechanism 203 uniformly distributes the plating solution to the inside of the reaction tank 1, and maintains the stability of the composition of the plating solution in the reaction tank 1.

[0050] According to the explanations and teachings of the above description, those skilled in the art of the present application can also make changes and modifications to the above embodiments. Therefore, the present application is not limited to the specific embodiments disclosed and described above, and some modifications and changes of the present application should fall within the protection scope of the claims of the present application. In addition, although some specific terms are used in the present specification, these terms are only for convenience of explanation and do not constitute any limitation on the present application.

Claims

1. A device for nickel plating on diamond micropowder based on semiconductor wafer production, comprising a reaction vessel (1), an adjustable turbulence mechanism (5), and an adjustable stirring mechanism (6), characterized in that, It also includes a top cover (2) threaded onto the top of the reaction vessel (1), an adjustment mechanism (3) fixedly mounted on the top of the top cover (2), and a mixer (4) fixedly mounted on the bottom of the top cover (2); the adjustable turbulence mechanism (5) consists of two mounting brackets (501), a rotating ring (502), and four angle adjustment components. The four angle adjustment components are distributed in a ring at equal intervals on the outer side of the top of the rotating ring (502), and the outer side of the rotating ring (502) is connected to the four angle adjustment components through a linkage slider; the adjustable The stirring mechanism (6) is rotatably installed inside the mixer (4), and the top of the adjustable stirring mechanism (6) is connected to the adjustment mechanism (3) in a transmission manner; the adjustable turbulence mechanism (5) and the adjustable stirring mechanism (6) are synchronously driven by the adjustment mechanism (3), the flow pattern and shear force field distribution of the fluid are dynamically adjusted by the adjustable stirring mechanism (6), the turbulence angle is adjusted by the adjustable turbulence mechanism (5), the flow path and speed of the plating solution are changed, and a multi-dimensional circulating flow field can be formed by the cooperation of the adjustable turbulence mechanism (5) and the adjustable stirring mechanism (6); The adjustable stirring mechanism (6) consists of a driven bevel gear (601), a transmission rod (602), an adjusting rod (603), an adjustable angle stirring paddle (604), and a shaft sleeve (605). The driven bevel gear (601) is fixedly installed at the top of the transmission rod (602), the shaft sleeve (605) is fixedly installed at the bottom of the transmission rod (602), and the adjusting rod (603) is movably installed inside the transmission rod (602). A spline rod is fixedly installed on the top of the outer side of the adjusting rod (603). A spline groove corresponding to the spline rod is opened inside the driven bevel gear (601). The adjusting rod (603) is connected to the spline groove inside the driven bevel gear (601) via a locking pin, facilitating the connection between the driven bevel gear (601) and the spline rod. 1) Drive the adjusting rod (603) to rotate synchronously without affecting the telescopic movement of the adjusting rod (603) inside the transmission rod (602). The bottom end of the adjusting rod (603) is fixedly installed with a shaft bracket. The bottom end of the adjusting rod (603) is movably connected to the adjustable angle stirring paddle (604) through the shaft bracket. The telescopically moving adjusting rod (603) adjusts the angle of the adjustable angle stirring paddle (604) through the shaft bracket. The adjustable angle stirring paddle (604) is composed of a universal shaft (6041), a mounting shaft seat (6042), and a blade (6043). The top of the universal shaft (6041) is rotatably connected to the bottom of the mounting shaft seat (6042), and the blade (6043) is fixedly installed on one side of the mounting shaft seat (6042).

2. The device for nickel plating on the surface of diamond micropowder based on semiconductor wafer production according to claim 1, characterized in that: Both mounting brackets (501) have rotatably mounted limiting rollers (5011) inside. The two mounting brackets (501) are movably mounted on both sides of the rotating ring (502) via the limiting rollers (5011). The two mounting brackets (501) are respectively fixedly mounted on both sides of the outer wall of the adjustable turbulence mechanism (5). A second gear (506) is rotatably mounted on one side inside one of the mounting brackets (501). A second rack (5021) is fixedly mounted on the outer side of the rotating ring (502). The second rack (5021) meshes with the second gear (506).

3. The device for nickel plating on the surface of diamond micropowder based on semiconductor wafer production according to claim 1, characterized in that: The angle adjustment assembly consists of a slide rail (503), a rotating shaft (504), and a spoiler (505). The slide rail (503) is fixedly installed at one end of the rotating shaft (504), and the spoiler (505) is fixedly installed at the other end of the rotating shaft (504). One end of the rotating shaft (504) extends into the interior of the mixer (4) and is movably connected to the inner wall of the mixer (4).

4. The device for nickel plating on the surface of diamond micropowder based on semiconductor wafer production according to claim 3, characterized in that: The adjustment mechanism (3) consists of a slide frame (301), a first gear (302), a telescopic frame (303), a servo motor (305), a first bevel gear (306), and a second bevel gear (307). The slide frame (301) has slide grooves on its front and rear sides. The telescopic frame (303) has slide rods fixedly installed on its front and rear sides corresponding to the slide grooves, extending into the slide grooves and movably connected. The telescopic frame (303) is movably installed inside the slide frame (301) through the cooperation of the slide rods and the slide grooves. The bottom of the telescopic frame (303) extends into the interior of the top cover (2), and the bottom of the telescopic frame (303) is connected to the top of the adjustment rod (603) via a rotating shaft. 3) A first rack (304) is fixedly installed on the inner wall of one side. A first gear (302) is rotatably installed inside the slide frame (301) via a shaft. The first gear (302) meshes with the first rack (304). A servo motor (305) is fixedly installed on one side of the slide frame (301). The output end of the servo motor (305) is fixedly connected to one side of the first gear (302) via a shaft. A first bevel gear (306) is fixedly connected to the other side of the first gear (302) via a shaft. The first bevel gear (306) meshes with the second bevel gear (307). The bottom of the second bevel gear (307) is connected to the second gear (506) via a shaft.

5. The device for nickel plating on the surface of diamond micropowder based on semiconductor wafer production according to claim 1, characterized in that: A drive motor (201) is fixedly installed on one side inside the top cover (2). The output end of the drive motor (201) is fixedly installed with a drive bevel gear (202) via a shaft. The drive bevel gear (202) meshes with the driven bevel gear (601). The bottom of the top cover (2) extends into the interior of the reaction tank (1), and an annular spray mechanism (203) is fixedly installed at the bottom of the top cover (2).

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