Pressure positioning method, pressure acquisition device and pressure positioning equipment

Abstract

The invention relates to the technical field of detection equipment, and discloses a pressure positioning method, a pressure acquisition device and pressure positioning equipment, the method is applied to the pressure positioning equipment provided with the pressure acquisition device, and the pressure acquisition device comprises two detection elements arranged at an interval. Wherein a contact surface is formed on one side, opposite to the other detection element, of one detection element, the contact surface deforms towards the direction of the other detection element under the action of pressure, and one detection element is used for emitting a magnetic field to the other detection element; the method comprises: determining a current magnetic field distribution condition according to a magnetic field; and positioning the pressure based on the current magnetic field distribution condition to obtain a current positioning result of the pressure. The acquired magnetic field is acquired, the current magnetic field distribution condition is determined according to the magnetic field, and the pressure is positioned based on the current magnetic field distribution condition, so that the current positioning result of the pressure is acquired, and the pressure positioning function is realized.

Description

Technical Field

[0001] The present application relates to the technical field of detection devices, and in particular, to a pressure positioning method, a pressure acquisition device, and a pressure positioning device. Background Technique

[0002] With the development of technology, intelligent glasses (such as augmented reality (AR) glasses, virtual reality (VR) glasses, etc.) have gradually become more and more popular. Due to the large differences in facial features among different users, in order to ensure the wearing comfort of intelligent glasses, the clamping force of intelligent glasses (that is, the pressure exerted by the temple of the intelligent glasses on the wearer's head) is generally tested during the design.

[0003] However, when testing the clamping force of intelligent glasses, a force sensor is generally set at the position where the temple of the intelligent glasses contacts the artificial head model. As long as the force sensor detects pressure (that is, the above-mentioned clamping force) on the detection surface, it can be determined that there is pressure in this area. However, this method cannot accurately locate the specific position of the pressure, so the temple structure of the intelligent glasses cannot be designed well. Therefore, how to locate the pressure during the test is an urgent problem to be solved. Summary of the Invention

[0004] The main purpose of the present application is to provide a pressure positioning method, a pressure acquisition device, and a pressure positioning device, aiming to solve the technical problem of how to locate the pressure during the test in the prior art.

[0005] To achieve the above object, an embodiment of the present application provides a pressure positioning method, which is applied to a pressure positioning device provided with a pressure acquisition device. The pressure acquisition device includes two detection elements arranged at intervals. A contact surface is formed on one side of one detection element facing away from the other detection element. The contact surface deforms in the direction of the other detection element under the action of pressure. One detection element is used to emit a magnetic field to the other detection element;

[0006] The method includes:

[0007] Determine the current magnetic field distribution according to the magnetic field;

[0008] Based on the current magnetic field distribution, locate the pressure to obtain the current positioning result of the pressure.

[0009] In an embodiment, the detection element includes a first detection element and a second detection element. The first detection element is a magnetic part, and the second detection element includes a Hall sensor, and the Hall sensor is used to collect the magnetic field emitted by the magnetic part.

[0010] In one embodiment, the number of the Hall sensors is multiple, and the multiple Hall sensors are arranged at uniform intervals.

[0011] In one embodiment, the second detection element further includes a substrate, one side of the Hall sensor facing away from the magnetic member is arranged on the substrate, and the substrate is made of a soft material; and / or

[0012] The magnetic member is made of a soft material.

[0013] In one embodiment, the step of positioning the pressure based on the current magnetic field distribution to obtain the current positioning result of the pressure includes:

[0014] Determining the current magnetic field intensity of the magnetic field in each dimension based on the current magnetic field distribution;

[0015] Positioning the pressure according to the current magnetic field intensity in each dimension through a preset pressure positioning model to obtain the current positioning result of the pressure;

[0016] Wherein, the preset pressure positioning model is obtained through model training by using sample positioning results and sample magnetic field intensities in each dimension.

[0017] In one embodiment, after the step of obtaining the current positioning result of the pressure, the method further includes:

[0018] Determining the current pressure value at the current positioning result according to the current magnetic field distribution;

[0019] Drawing a pressure distribution map based on the current pressure value and the current positioning result.

[0020] In one embodiment, the step of determining the current pressure value at the current positioning result according to the current magnetic field distribution includes:

[0021] Determining the current magnetic field intensity of the magnetic field in each dimension based on the current magnetic field distribution;

[0022] Obtaining the magnitude of the magnetic field intensity vector according to the current magnetic field intensity in each dimension, and determining the displacement amount at the current positioning result according to the magnitude of the magnetic field intensity vector according to a preset displacement relationship;

[0023] Determining the current pressure value at the current positioning result based on the displacement amount.

[0024] In one embodiment, the step of drawing a pressure distribution map based on the current pressure value and the current positioning result includes:

[0025] Determine the current pressure existence area based on the current positioning result, and perform grid division on the current pressure existence area;

[0026] Obtain the elastic modulus and Poisson's ratio of the detection element that receives the magnetic field, and perform finite element analysis based on the grid division result, the current pressure value, the elastic modulus, and the Poisson's ratio to obtain the node pressure values of each target node;

[0027] Perform interpolation processing on the node pressure values of each target node, and draw a pressure distribution map based on the interpolation result.

[0028] In addition, to achieve the above object, an embodiment of the present application further provides a pressure acquisition device. The pressure acquisition device includes two detection elements arranged at intervals. A contact surface is formed on one side of one detection element facing away from the other detection element. The contact surface deforms in the direction of the other detection element under the action of pressure. One detection element is used to emit a magnetic field to the other detection element.

[0029] In addition, to achieve the above object, an embodiment of the present application further provides a pressure positioning device, which includes:

[0030] An artificial head model;

[0031] The pressure acquisition device as described above, and the pressure acquisition device is arranged on the artificial head model;

[0032] A processor, the processor is electrically connected to the pressure acquisition device, and the processor is used to execute the steps of the pressure positioning method as described above.

[0033] An embodiment of the present application provides a pressure positioning method, a pressure acquisition device, and a pressure positioning device. The method is applied to a pressure positioning device provided with a pressure acquisition device. The pressure acquisition device includes two detection elements arranged at intervals. A contact surface is formed on one side of one detection element facing away from the other detection element. The contact surface deforms in the direction of the other detection element under the action of pressure. One detection element is used to emit a magnetic field to the other detection element. The method includes: determining the current magnetic field distribution according to the magnetic field; positioning the pressure based on the current magnetic field distribution to obtain the current positioning result of the pressure.

[0034] Since the pressure acquisition device in this application includes two detection elements arranged at intervals, one detection element can emit a magnetic field to the other detection element, the other detection element can collect this magnetic field, and a contact surface is formed on one detection element. Under the action of pressure, the contact surface can generate a deformation towards the direction of the other detection element. The deformations generated by the pressures at different positions on the contact surface are different, and the current magnetic field distribution is also different under different deformations. Therefore, in actual use, this application can acquire the collected magnetic field, determine the current magnetic field distribution based on this magnetic field, and locate the pressure based on the current magnetic field distribution, so as to obtain the current positioning result of the pressure and realize the positioning function of the pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings herein are incorporated into the specification and form a part of this specification, showing embodiments consistent with this application, and are used together with the specification to explain the principles of this application.

[0036] To more clearly illustrate the technical solutions in the embodiments of this application or in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0037] Figure 1 Schematic diagram of the positions of the force sensors on a traditional artificial head model;

[0038] Figure 2 Schematic flowchart of the first embodiment of the pressure positioning method of this application;

[0039] Figure 3 Schematic diagram of the structure of the pressure acquisition device in the first embodiment of the pressure positioning method of this application;

[0040] Figure 4 Schematic flowchart of the second embodiment of the pressure positioning method of this application;

[0041] Figure 5 Schematic flowchart of the third embodiment of the pressure positioning method of this application;

[0042] Figure 6 Schematic flowchart of obtaining the current pressure value in the third embodiment of the pressure positioning method of this application;

[0043] Figure 7 Schematic flowchart of drawing the pressure distribution diagram in the third embodiment of the pressure positioning method of this application;

[0044] Figure 8 Schematic diagram of grid division in the third embodiment of the pressure positioning method of this application;

[0045] Figure 9 This is a schematic diagram of specific division in the third embodiment of the pressure positioning method of this application;

[0046] Figure 10 This is a schematic flowchart of interpolation processing in the third embodiment of the pressure positioning method of this application.

[0047] The realization, functional features, and advantages of this application will be further described in conjunction with embodiments with reference to the accompanying drawings. Specific embodiments

[0048] It should be understood that the specific embodiments described herein are only used to explain the technical solution of this application and are not used to limit this application.

[0049] It should be noted that with the development of technology, smart glasses (such as augmented reality (AR) glasses, virtual reality (VR) glasses, etc.) are becoming increasingly popular. Due to the large differences in facial features among different users, in order to ensure the wearing comfort of smart glasses, the clamping force of smart glasses (i.e., the pressure exerted by the temple of smart glasses on the wearer's head) is generally tested during design.

[0050] However, when testing the clamping force of smart glasses, force sensors are generally set at the positions where the temple of smart glasses contacts the artificial head model. Refer to Figure 1 , Figure 1 This is a schematic diagram of the position of the force sensor on the traditional artificial head model. As Figure 1 shown, a detection area can be set above the ear of the artificial head model. This detection area can be the area where the temple of the smart glasses contacts the artificial head model after the smart glasses are worn on the artificial head model. In order to measure the clamping force, force sensors are generally set in the detection area. As long as the force sensor detects pressure (i.e., the above-mentioned clamping force) on the detection surface, it can be determined that there is pressure in this area. However, this method cannot accurately locate the specific position of the pressure, so it is impossible to design the temple structure of smart glasses well. Therefore, how to locate the pressure during testing is an urgent problem to be solved.

[0051] Therefore, to solve the above-mentioned deficiencies, this embodiment provides a pressure positioning method, which is applied to a pressure positioning device equipped with a pressure acquisition device. The pressure acquisition device in this embodiment includes two detection elements arranged at intervals. One detection element can emit a magnetic field to the other detection element, and the other detection element can collect the magnetic field. A contact surface is formed on one detection element, and the contact surface can generate deformation in the direction of the other detection element under the action of pressure. Since the deformations generated by the pressures at different positions on the contact surface are different, and the current magnetic field distribution is also different under different deformations, in actual use, this embodiment can obtain the collected magnetic field, determine the current magnetic field distribution according to the magnetic field, and position the pressure based on the current magnetic field distribution, so as to obtain the current positioning result of the pressure and realize the positioning function of the pressure.

[0052] For the sake of easy understanding, the following specifically introduces the pressure positioning method provided by the embodiment of the present application in conjunction with Figures 2 to 7 the following content.

[0053] Referring to Figure 2 , Figure 2 which is a schematic flowchart of the first embodiment of the pressure positioning method of the present application. The first embodiment of the pressure positioning method of the present application is proposed. As shown in Figure 2 , in this embodiment, the specific method includes:

[0054] Step S10: Determine the current magnetic field distribution according to the magnetic field.

[0055] It can be understood that the method of this embodiment can be applied to a pressure positioning device equipped with a pressure acquisition device. The pressure positioning device can be any electronic device with data processing, program running, and pressure positioning method functions. For example, as an implementation method, the above-mentioned pressure positioning device can include an artificial head model, the above-mentioned pressure acquisition device, and a processor device. Similarly, a detection area can be set on the artificial head model, which can be the same as the position of the traditional detection area. This embodiment will not elaborate on this. And the above-mentioned pressure acquisition device can be arranged in the detection area. The processor can be electrically connected to the pressure acquisition device and execute the steps of the pressure positioning method in this embodiment. Therefore, the execution subject of the method of this embodiment and the following embodiments can be the above-mentioned processor. And the above-mentioned processor can be arranged inside the artificial head model through a printed circuit board (PCB). Of course, it can also be arranged in other positions. This embodiment does not limit this.

[0056] As a setting method, in this embodiment, the detection area of the artificial head model can be grooved, and the above-mentioned pressure acquisition device can be arranged in the groove, and the contact surface can be aligned with the surface of the artificial head model.

[0057] It should be emphasized that referring toFigure 3 , Figure 3 is a schematic structural diagram of a pressure acquisition device in the first embodiment of the pressure positioning method of the present application. As shown in Figure 3 , in this embodiment, the pressure acquisition device includes two detection elements arranged at intervals. A contact surface is formed on one side of one detection element facing away from the other detection element. Under the action of pressure, the contact surface generates a deformation in the direction of the other detection element. One detection element is used to emit a magnetic field to the other detection element.

[0058] It should be noted that in this embodiment, the pressure acquisition device may include two detection elements arranged at intervals. For the convenience of subsequent description, they are respectively denoted as the first detection element and the second detection element. A contact surface is formed on one side of any one detection element facing away from the other detection element. As shown in Figure 3 , in this embodiment, a contact surface may be formed on the side of the first detection element facing away from the second detection element. And when the contact surface is subjected to pressure, a deformation towards the other detection element may be generated, that is, Figure 3 if the contact surface of the first detection element is subjected to pressure, a deformation towards the second detection element may be generated.

[0059] As another implementation, if a contact surface is formed on the side of the second detection element facing away from the first detection element, when the contact surface is subjected to pressure, the second detection element may generate a deformation towards the first detection element.

[0060] It should also be noted that in this embodiment, one detection element can be used to generate and emit a magnetic field to the other detection element, and the other detection element can be used to collect this magnetic field. As shown in Figure 3 , in this embodiment, the first detection element can be used to emit a magnetic field to the second detection element (that is, Figure 3 N and S in ), and the second detection element can collect the magnetic field emitted by the first detection element. Similarly, as another implementation, the second detection element can also be used to emit a magnetic field to the first detection element, and the first detection element then collects the magnetic field emitted by the second detection element. For the convenience of subsequent understanding, the former is used for description in this embodiment.

[0061] It can be understood that in this embodiment, the above pressure acquisition device can be arranged in the detection area of the artificial head model, and the contact surface can be oriented away from the artificial head model. Then, when the artificial head model wears smart glasses, the temple of the smart glasses can contact the contact surface to generate pressure, so that the first detection element can generate a deformation towards the second detection element.

[0062] It should be understood that if the second detection element is used to collect the magnetic field in this embodiment, then the detection element for receiving the magnetic field can be Figure 3The second detection element therein, and then the processor can be electrically connected to the second detection element to obtain the magnetic field. Similarly, if the first detection element is used to collect the magnetic field, the detection element for receiving the magnetic field can be the first detection element, and then the processor can be electrically connected to the first detection element to obtain the magnetic field. Since the second detection element is used to collect the magnetic field in this embodiment for illustration, the processor in this embodiment can be electrically connected to the second detection element.

[0063] It should also be understood that the above current magnetic field distribution can be the magnetic field distribution at the position of the detection element for collecting the magnetic field in the magnetic field emitted by the detection element for emitting the magnetic field, that is, the direction and strength of the magnetic field at this position.

[0064] In actual use, the processor in this embodiment can obtain the magnetic field emitted by the first detection element through the second detection element, and determine the current magnetic field distribution of the magnetic field at the current position of the second detection element according to the magnetic field.

[0065] Step S20: Locate the pressure based on the current magnetic field distribution to obtain the current positioning result of the pressure.

[0066] As Figure 3 shown, since the deformations generated by the pressures at different positions on the contact surface are different, the relative distances between the two detection elements under different deformations are different, and thus the current magnetic field distributions are also different. Therefore, different magnetic field distributions can correspond to the pressures at different positions, and a preset distribution mapping relationship table between different magnetic field distributions and the pressures at different positions can be constructed. In actual use, the preset distribution mapping relationship table can be queried according to the current magnetic field distribution to locate the pressure contacted by the contact surface, so as to obtain the current positioning result of the pressure.

[0067] It should be emphasized that in order to ensure that the first detection element generates a deformation towards the second detection element, that is, the position where the first detection element is arranged in this embodiment can be on the surface of the detection area of the artificial head model, and the second detection element can be arranged inside the artificial head model and the position is fixed. Then, when there is pressure on the contact surface of the first detection element, a deformation towards the second detection element can be generated, and since the position of the second detection element remains fixed, the relative distance between the second detection element and the first detection element can change.

[0068] Furthermore, in order to enable one detection element to generate a magnetic field and the other detection element to collect the magnetic field, continue as Figure 3As shown, in this embodiment, the detection element includes a first detection element and a second detection element. The first detection element is a magnetic member, and the second detection element includes a Hall sensor, which is used to collect the magnetic field emitted by the magnetic member.

[0069] It should be noted that in this embodiment, the detection element that generates the magnetic field can be denoted as the first detection element, and the detection element that collects the magnetic field can be denoted as the second detection element, that is Figure 3 As shown. In this embodiment, the first detection element can be any magnetic member for generating a magnetic field, such as a magnet, etc. The second detection element can be any element for collecting the magnetic field, such as the above-mentioned Hall sensor, etc., and this embodiment does not limit this.

[0070] In actual use, in this embodiment, the first detection element can include the above magnetic member, through which a magnetic field can be emitted to the second detection element. The second detection element can include the above Hall sensor, through which the magnetic field emitted by the magnetic member can be collected.

[0071] Furthermore, in order to enable pressure positioning in the entire detection area, continue as Figure 3 shown. In this embodiment, the number of Hall sensors is multiple, and the multiple Hall sensors are evenly spaced.

[0072] It can be understood that multiple Hall sensors can be provided in this embodiment and are evenly spaced. The specific distance between two adjacent Hall sensors can be set according to the actual situation, and this embodiment does not limit this.

[0073] It should be emphasized that the arrangement of the Hall sensors in this embodiment can be in an array form. Of course, it can also be in other arrangement forms, such as arranged in sequence along the length direction of the first detection element, etc. It can be specifically set according to the actual detection requirements, and this embodiment does not limit this.

[0074] Furthermore, in order to enable the detection element with a contact surface to generate a more obvious deformation under the action of pressure, in this embodiment, the second detection element further includes a substrate, and the side of the Hall sensor facing away from the magnetic member is provided on the substrate, and the substrate is a soft material; and / or

[0075] The magnetic member is a soft material.

[0076] Continue as Figure 3 shown. If the contact surface is provided on the first detection element in this embodiment, the magnetic member in the first detection element can be in the form of a soft material, such as silica gel, etc. In order to make the magnetic member magnetic, a magnetic material can be added to the silica gel.

[0077] Exemplarily, since silicone rubber is formed by mixing two liquids of liquid silicone rubber in a specific-shaped mold and undergoing vulcanization. Therefore, in this embodiment, magnetic materials such as neodymium iron boron magnetic powder can be added before the silicone rubber is molded, and after magnetization, the above-mentioned magnetic parts are formed, so that good deformation can be generated and magnetism can be possessed to generate a magnetic field.

[0078] For the second detection element, a substrate can be provided to carry the above-mentioned Hall sensor, that is, the substrate is arranged on the side of the Hall sensor facing away from the magnetic part. The substrate can be a hard material such as a material that is not easily deformed, such as plastic (or directly use the above-mentioned PCB board provided with a processor), etc., so as to ensure the stability of the distance between the Hall sensor and the first detection element.

[0079] As another implementation manner, if the contact surface is arranged on the second detection element in this embodiment, in order to make the second sensor deform when the contact surface touches the pressure, the substrate in the second detection element can be set as a soft material, such as the above-mentioned silicone rubber, etc., and the Hall sensor can be arranged on the soft material.

[0080] For the first detection element at this time, a hard material can be used, such as the method of adding magnetic materials when forming plastic, etc., so as to ensure the stability of the distance between the Hall sensor and the first detection element.

[0081] In this embodiment Figure 3 Then, the first detection element is silicone rubber added with magnetic materials, and in the second detection element, the PCB board provided with a processor can be used as the above-mentioned substrate, and a Hall sensor is arranged on the substrate. Furthermore, the side of the silicone rubber facing away from the Hall sensor is the contact surface and faces the outside of the artificial head model. In actual use, when the temple touches the contact surface, the silicone rubber can deform in the direction of the Hall sensor, and the Hall sensor collects the magnetic field and transmits it to the processor to complete the positioning of the pressure.

[0082] The pressure acquisition device in this embodiment includes two detection elements arranged at intervals. One detection element can emit a magnetic field to the other detection element, and the other detection element can collect the magnetic field. A contact surface is formed on one detection element, and the contact surface can generate deformation in the direction of the other detection element under the action of pressure. Since the deformations generated by the pressures at different positions on the contact surface are different, and the current magnetic field distribution is also different under different deformations, therefore, in actual use, this embodiment can acquire the collected magnetic field, determine the current magnetic field distribution according to the magnetic field, and position the pressure based on the current magnetic field distribution, so as to obtain the current positioning result of the pressure and realize the positioning function of the pressure.

[0083] Refer to Figure 4 , Figure 4It is a schematic flowchart of the second embodiment of the pressure positioning method of this application. Based on the above first embodiment, the second embodiment of the pressure positioning method of this application is proposed.

[0084] Considering that if the method of using a preset distribution mapping relationship table is adopted to determine the corresponding current positioning result according to the current magnetic field distribution, the accuracy may be relatively low. Therefore, as Figure 4 shown, in this embodiment, the step of positioning the pressure based on the current magnetic field distribution to obtain the current positioning result of the pressure includes:

[0085] Step S21: Determine the current magnetic field intensity of the magnetic field in each dimension based on the current magnetic field distribution.

[0086] It should be noted that the Hall sensors in this embodiment can adopt three-dimensional Hall sensors, that is, sensors that can measure the magnetic field intensities in the X, Y, and Z directions simultaneously. Furthermore, in actual use, the processor can determine the current magnetic field intensities of each Hall sensor in the X, Y, and Z dimensions respectively according to the current magnetic field distribution corresponding to the position of each Hall sensor.

[0087] Step S22: Position the pressure according to the current magnetic field intensity in each dimension through a preset pressure positioning model to obtain the current positioning result of the pressure.

[0088] It can be understood that the above preset pressure positioning model is obtained through model training with sample positioning results and sample magnetic field intensities in each dimension. That is, in this embodiment, the initial pressure positioning model can be trained in advance with sample positioning results and sample magnetic field intensities in each dimension to obtain the above preset pressure positioning model. Furthermore, in actual use, the obtained magnetic field intensities in each dimension can be input into the preset pressure positioning model, and the corresponding current positioning result can be obtained.

[0089] It can also be understood that the above initial pressure positioning model can be any model with a learning function. For example, a convolutional neural network model, etc. At the same time, since there is a linear relationship between different positioning results and the sample magnetic field intensities in each dimension, the above initial pressure positioning model can also be any linear model. This embodiment does not limit this.

[0090] During training, the processor can first obtain the sample magnetic field intensities in each dimension and obtain the corresponding sample positioning results. To ensure accuracy, preprocessing operations can be performed on the obtained sample magnetic field intensities. The preprocessing operations can include but are not limited to data cleaning, removing outliers, filling in missing values, and normalization processing, etc. Then, the sample positioning results and the preprocessed sample magnetic field intensities in each dimension are input into the initial pressure positioning model for training, so as to obtain the above preset pressure positioning model.

[0091] It should be emphasized that if the initial pressure positioning model used is a convolutional neural network model, forward propagation and backward propagation can be performed during training to update the model parameters. Specifically, the convolutional neural network structure can be set according to the actual situation. If the initial pressure positioning model used is a linear model, linear regression methods such as the least squares method can be used for training during training. Of course, other regression methods can also be adopted, and this embodiment does not limit this.

[0092] In this embodiment, the current magnetic field intensity collected by each Hall sensor in each dimension can be determined according to the current magnetic field distribution situation first, and then each current magnetic field intensity is input into the preset pressure positioning model, so as to obtain the current positioning result of the pressure. Compared with the method of directly using the preset distribution mapping relationship table, the method of using the preset pressure positioning model can improve the accuracy of the positioning result.

[0093] Refer to Figure 5 , Figure 5 which is a schematic flowchart of the third embodiment of the pressure positioning method of the present application. Based on the above embodiments, the third embodiment of the pressure positioning method of the present application is proposed.

[0094] Considering that the pressure positioning device in this embodiment can generally be applied to the scenario of designing smart glasses, that is, the structure of the smart glasses can be adjusted according to the measurement results of the pressure positioning device. Therefore, in order to facilitate the user to view the pressure (i.e., clamping force) distribution exerted by the temple when the smart glasses are worn on the artificial head model, as Figure 5 shown, in this embodiment, after the step of obtaining the current positioning result of the pressure, the following further includes:

[0095] Step S30: Determine the current pressure value at the current positioning result according to the current magnetic field distribution situation.

[0096] It should be noted that since the deformation degree of the first detection element is different when the pressure borne by the contact surface is different, the relative distance between the first detection element and the second detection element is also different, and the magnetic field collected by the second detection element is also different accordingly. Therefore, based on this, the above processor in this embodiment can also determine the current pressure value at the current positioning result according to the current magnetic field distribution situation.

[0097] Specifically, in order to obtain the current pressure value at the current positioning result, refer to Figure 6 , Figure 6 which is a schematic flowchart of obtaining the current pressure value in the third embodiment of the pressure positioning method of the present application. As Figure 6 shown, the above step S30 includes:

[0098] Step S31: Determine the current magnetic field intensity of the magnetic field in each dimension based on the current magnetic field distribution situation;

[0099] Step S32: Obtain the magnetic field intensity vector modulus value based on the current magnetic field intensity in each dimension, and determine the displacement amount at the current positioning result according to the magnetic field intensity vector modulus value according to a preset displacement relation formula.

[0100] It can be understood that the above magnetic field intensity vector modulus value can be the vector value corresponding to the current magnetic field in each dimension. The above preset displacement relation formula can be the corresponding relation formula between the magnetic field intensity vector modulus value and the displacement amount. The above displacement amount can be the distance that the current positioning result of the detection element emitting the magnetic field moves towards the detection element collecting the magnetic field under the action of pressure, that is, the distance that the current positioning result with pressure on the first detection element moves towards the second detection element.

[0101] It should be emphasized that since there is a certain linear relationship between different displacement amounts and the magnetic field intensity vector modulus value, the above preset displacement relation formula can be obtained in advance through methods such as modeling, and this embodiment does not limit this.

[0102] In actual use, the processor can determine the current magnetic field intensity of each Hall sensor in the three dimensions of X, Y, and Z respectively according to the current magnetic field distribution corresponding to the position of each Hall sensor. Then, obtain the magnetic field intensity vector modulus value based on the current magnetic field intensity in each dimension. Exemplarily, for example, record the current magnetic field intensity of a certain Hall sensor collected in the X dimension as H X , record the current magnetic field intensity in the Y dimension as H Y , record the current magnetic field intensity in the Z dimension as H Z , then the corresponding magnetic field intensity vector is recorded as H,

[0103] After obtaining the magnetic field intensity vector value, substitute this magnetic field intensity vector value into the above preset displacement relation formula to obtain the displacement amount at the current positioning result.

[0104] Step S33: Determine the current pressure value at the current positioning result based on the displacement amount.

[0105] It should be understood that since there is also a certain corresponding relationship between the displacement amount and the pressure value, in this embodiment, a preset displacement mapping relation table can be constructed in advance according to the displacement amounts corresponding to each pressure value. In actual use, the current pressure value at the current positioning result can be obtained by querying the preset mapping relation table based on this displacement amount. Of course, it can also be obtained through methods such as a convolutional neural network model or a linear regression model, etc., and this embodiment will not elaborate on this.

[0106] Step S40: Draw a pressure distribution map based on the current pressure value and the current positioning result.

[0107] After obtaining the current pressure value corresponding to each current positioning result, the pressure distribution diagram on the contact surface can be drawn according to the corresponding current pressure value. Specifically, different current pressure value magnitudes can be represented by different colors, facilitating the user's observation.

[0108] Furthermore, considering that the Hall sensors in this embodiment are arranged at uniform intervals, the current pressure value determined at the above-mentioned current positioning result can only determine the average pressure value of the entire area within the pressure existence region as the current pressure value. In order to obtain a more specific current pressure value distribution within this region and thus improve the accuracy of the pressure distribution diagram, refer to Figure 7 , Figure 7 which is the schematic flowchart of drawing the pressure distribution diagram in the third embodiment of the pressure positioning method of the present application. As Figure 7 shown, in this embodiment, the step of drawing the pressure distribution diagram based on the current pressure value and the current positioning result includes:

[0109] Step S41: Determine the current pressure existence region based on the current positioning result, and perform grid division on the current pressure existence region.

[0110] It should be noted that the above-mentioned current pressure existence region can be the corresponding region where pressure exists on the contact surface. Since the current positioning result in this embodiment is the region where pressure is applied, the region where the pressure applied to the contact surface is located can be directly determined according to the current positioning result as the above-mentioned current pressure existence region. After determining the current pressure existence region, grid division can be performed on this current pressure existence region. For the sake of easy understanding, refer to Figure 8, Figure 8 which is the schematic diagram of grid division in the third embodiment of the pressure positioning method of the present application. As Figure 8 shown, in this embodiment, grid division can be performed on this current pressure existence region.

[0111] It should be emphasized that since the Hall sensors in this embodiment are arranged in an array, when performing grid division in this embodiment, each Hall sensor located within the current pressure existence region can be divided into the vertices of the grid. Refer to Figure 9 , Figure 9 which is the specific division schematic diagram in the third embodiment of the pressure positioning method of the present application. As Figure 9 shown, if there are four Hall sensors within the current pressure existence region, denoted as A1 to A4 respectively, then A1 to A4 can be divided into the vertices of the grid respectively when dividing the grid.

[0112] Step S42: Obtain the elastic modulus and Poisson's ratio of the detection element that receives the magnetic field, and perform finite element analysis based on the mesh division result, the current pressure value, the elastic modulus, and the Poisson's ratio to obtain the node pressure values of each target node.

[0113] After mesh division, the elastic modulus and Poisson's ratio of the detection element that receives the magnetic field can be obtained, that is, the elastic modulus and Poisson's ratio of the above-mentioned first detection element, and both the elastic modulus and Poisson's ratio can be obtained through pre-measurement. Then, use the preset finite element analysis software to perform finite element analysis based on the mesh division result, the current pressure value, the elastic modulus, and the Poisson's ratio, so as to obtain the node pressure values on the target nodes.

[0114] It should be noted that the above-mentioned preset finite element analysis software can be selected according to the actual situation, and this embodiment does not limit it. The above-mentioned target nodes can be the vertices of the mesh. Furthermore, after finite element analysis, the pressure values of the vertices on each mesh can be obtained as the node pressure values of the above-mentioned target nodes, that is, the node pressure values corresponding to the positions corresponding to A1 to A4 on the first detection element are obtained respectively.

[0115] Step S43: Perform interpolation processing on the node pressure values of each target node, and draw a pressure distribution diagram based on the interpolation result.

[0116] Since there is still a certain distance between nodes, for example, there is a certain distance between A1 and A2. Therefore, after obtaining the node pressure values of the target nodes, interpolation processing can be performed according to the coordinates of each adjacent target node and the corresponding node pressure values, and a pressure distribution diagram can be drawn based on the interpolation result. Refer to Figure 10 , Figure 10 This is a schematic flowchart of the interpolation process in the third embodiment of the pressure positioning method of the present application. As Figure 10 shown, specifically, the steps of performing interpolation processing on the node pressure values of each target node and drawing a pressure distribution diagram based on the interpolation result include:

[0117] Step S431: Obtain the node coordinates of adjacent target nodes, and determine the node coordinates of the intermediate nodes between the adjacent target nodes according to the node coordinates of the target nodes.

[0118] It can be understood that the above-mentioned intermediate nodes can be the nodes at the middle positions between adjacent target nodes.

[0119] In actual use, the above-mentioned processor can perform interpolation processing on two adjacent target nodes, that is, first determine the node coordinates of the intermediate nodes according to the node coordinates of the adjacent target nodes. Continue as Figure 9As shown, for example, between A1 and A2, the node coordinates of the target node corresponding to A1 are denoted as (x1, y1), and the node coordinates of the target node corresponding to A2 are (x2, y1). This is because A1 and A2 are on the same horizontal coordinate, so they are both y1. The node pressure value of the target node corresponding to A1 is P1, and the node pressure value of the target node corresponding to A2 is P2.

[0120] Furthermore, when performing interpolation, if an intermediate node B1 is defined between A1 and A2, the node coordinates of the intermediate node B1 can be obtained first according to the node coordinates (x1, y1) of the target node corresponding to A1 and the node coordinates (x2, y1) of the target node corresponding to A2, that is, the node coordinates of the intermediate node B1 are ((x2 - x1) / 2, y1).

[0121] Step S432: Obtain an interpolation coefficient based on the node coordinates of the intermediate node and the node coordinates of the adjacent target nodes.

[0122] It should be understood that the above interpolation coefficient can be the coefficient during interpolation. After obtaining the node coordinates ((x2 - x1) / 2, y1) of the intermediate node B1, the interpolation coefficient can be obtained according to the node coordinates ((x2 - x1) / 2, y1) of the intermediate node B1, the node coordinates (x1, y1) of the target node corresponding to A1, and the node coordinates (x2, y1) of the target node corresponding to A2, that is, the interpolation coefficient is (((x2 - x1) / 2) - x1) / (x2 - x1).

[0123] It should be emphasized that the above calculation process of the interpolation coefficient is based on the fact that the target node corresponding to A1 and the target node corresponding to A2 are on the same x-axis. If they are on the same y-axis (such as A1 and A3), it is similar, and this embodiment will not elaborate on it.

[0124] Step S433: Obtain the node pressure values of the adjacent target nodes, and determine the node pressure value of the intermediate node according to the interpolation coefficient and the node pressure values of the adjacent target nodes;

[0125] After obtaining the interpolation coefficient, the node pressure value of the target node corresponding to A1 can be obtained as P1 and the node pressure value of the target node corresponding to A2 can be obtained as P2. Then, according to the interpolation coefficient (((x2 - x1) / 2) - x1) / (x2 - x1), the node pressure value of the target node corresponding to A1 as P1, and the node pressure value of the target node corresponding to A2 as P2, the node pressure value of the intermediate node B1 can be obtained.

[0126] Specifically, the node pressure value of the intermediate node B1 = P1 + (((x2 - x1) / 2) - x1) / (x2 - x1) × (P2 - P1).

[0127] Exemplarily, if the node coordinates of the target node corresponding to A1 are (10, 10), the node pressure value P1 of the target node corresponding to A1 = 0.89N, the node coordinates of the target node corresponding to A2 are (20, 10), and the node pressure value P1 of the target node corresponding to A2 = 0.98N, then the interpolation coefficient obtained according to the above process is ((20 - 10) / 2 - 10) / (20 - 10) = 0.5, and the node pressure value of the intermediate node B1 = 0.89 + 0.5×(0.98 - 0.89) = 0.935N.

[0128] Step S434: Interpolate the node pressure values of the adjacent target nodes according to the node pressure value of the intermediate node, and draw a pressure distribution map based on the interpolation result.

[0129] After obtaining the node pressure value of the intermediate node, it can be used as the node pressure value in the middle part of the node pressure values of the adjacent target nodes, and the interpolation process of the adjacent node pressure values is completed. Similarly, the interpolation process of the node pressure values of all adjacent nodes is performed in the same way as above, that is, the same method as above is used to respectively determine Figure 9 the node pressure value of the intermediate node B2 between the target node corresponding to A3 and the target node corresponding to A4, the node pressure value of the intermediate node B3 between the target node corresponding to A1 and the target node corresponding to A3, the node pressure value of the intermediate node B4 between the target node corresponding to A2 and the target node corresponding to A4, and the node pressure value of the intermediate node B5 between the target node corresponding to A1 and the target node corresponding to A4. Finally, a pressure distribution map can be drawn based on the interpolation result.

[0130] In addition, to achieve the above object, an embodiment of the present application also proposes a pressure acquisition device, where the pressure acquisition device includes two detection elements arranged at intervals, and a contact surface is formed on one side of one of the detection elements facing away from the other detection element. The contact surface deforms in the direction of the other detection element under the action of pressure, and one detection element is used to emit a magnetic field to the other detection element.

[0131] As an implementation manner, the detection element includes a first detection element and a second detection element. The first detection element is a magnetic part, and the second detection element includes a Hall sensor, and the Hall sensor is used to collect the magnetic field emitted by the magnetic part.

[0132] As an implementation manner, the number of Hall sensors is multiple, and the multiple Hall sensors are evenly arranged at intervals.

[0133] As an implementation manner, the second detection element further includes a substrate, the Hall sensor is arranged on the substrate on the side facing away from the magnetic part, and the substrate is made of a soft material; and / or

[0134] The magnetic member is made of a soft material.

[0135] It should be noted that for other embodiments or specific implementation manners of the pressure acquisition device described in this application, reference may be made to the above method embodiments, which will not be elaborated here.

[0136] In addition, to achieve the above object, an embodiment of this application further provides a pressure positioning device. In this embodiment, the pressure positioning device includes:

[0137] An artificial head model;

[0138] The pressure acquisition device as described above, and the pressure acquisition device is disposed on the artificial head model;

[0139] A processor, the processor is electrically connected to the pressure acquisition device, and the processor is configured to execute the steps of the pressure positioning method as described above.

[0140] It should be noted that for other embodiments or specific implementation manners of the pressure positioning device described in this application, reference may be made to the above method embodiments, which will not be elaborated here.

[0141] It should be noted that in this text, the term "comprising", "including" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or system including a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or system. Without further limitation, an element defined by the phrase "including a..." does not exclude the existence of additional identical elements in the process, method, article or system including that element.

[0142] The serial numbers of the above embodiments of this application are only for description and do not represent the superiority or inferiority of the embodiments.

[0143] Through the description of the above embodiments, those skilled in the art can clearly understand that the above embodiment methods can be implemented by means of software plus a necessary general hardware platform. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation manner. Based on such an understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. The computer software product is stored in a storage medium (such as a Read Only Memory image (ROM) / Random Access Memory (RAM), magnetic disk, optical disk), and includes several instructions for causing a terminal device (which may be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in the various embodiments of this application.

[0144] The above are only the preferred embodiments of the present application, and do not limit the patent scope of the present application accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present application.

Claims

1. A pressure positioning method, characterized in that, The method is applied to a pressure positioning device provided with a pressure acquisition device. The pressure acquisition device includes two detection elements arranged at an interval. A contact surface is formed on one side of one detection element facing away from the other detection element. Under the action of pressure, the contact surface generates a deformation in the direction of the other detection element. One detection element is used to emit a magnetic field to the other detection element; The method includes: Determining the current magnetic field distribution according to the magnetic field; Positioning the pressure based on the current magnetic field distribution to obtain the current positioning result of the pressure.

2. The pressure positioning method according to claim 1, characterized in that, The detection element includes a first detection element and a second detection element. The first detection element is a magnetic part. The second detection element includes a Hall sensor, and the Hall sensor is used to collect the magnetic field emitted by the magnetic part.

3. The pressure positioning method according to claim 2, wherein The number of the Hall sensors is multiple, and the multiple Hall sensors are evenly arranged at intervals.

4. The pressure positioning method according to claim 2, characterized in that The second detection element further includes a substrate. The side of the Hall sensor facing away from the magnetic part is arranged on the substrate, and the substrate is made of a soft material; and / or The magnetic part is made of a soft material.

5. The pressure positioning method according to claim 1, wherein The step of positioning the pressure based on the current magnetic field distribution to obtain the current positioning result of the pressure includes: Determining the current magnetic field intensity of the magnetic field in each dimension based on the current magnetic field distribution; Positioning the pressure according to the current magnetic field intensity in each dimension through a preset pressure positioning model to obtain the current positioning result of the pressure; Wherein, the preset pressure positioning model is obtained through model training with sample positioning results and sample magnetic field intensities in each dimension.

6. The pressure positioning method according to claim 1, characterized in that, After the step of obtaining the current positioning result of the pressure, it further includes: Determining the current pressure value at the current positioning result according to the current magnetic field distribution; Drawing a pressure distribution diagram based on the current pressure value and the current positioning result.

7. The pressure positioning method according to claim 6, wherein The step of determining the current pressure value at the current positioning result according to the current magnetic field distribution includes: Determining the current magnetic field intensity of the magnetic field in each dimension based on the current magnetic field distribution; Obtaining the magnetic field intensity vector modulus value according to the current magnetic field intensity in each dimension, and determining the displacement amount at the current positioning result according to the magnetic field intensity vector modulus value according to a preset displacement relation; Determining the current pressure value at the current positioning result based on the displacement amount.

8. The pressure positioning method according to claim 6, wherein, The step of drawing a pressure distribution diagram based on the current pressure value and the current positioning result includes: Determining the current pressure existence area based on the current positioning result and performing grid division on the current pressure existence area; Obtaining the elastic modulus and Poisson's ratio of the detection element receiving the magnetic field, and performing finite element analysis according to the grid division result, the current pressure value, the elastic modulus and the Poisson's ratio to obtain the node pressure values of each target node; Performing interpolation processing on the node pressure values of each target node and drawing a pressure distribution diagram based on the interpolation result.

9. A pressure acquisition device, characterized in that, The pressure acquisition device includes two detection elements arranged at intervals, and a contact surface is formed on one side of one of the detection elements facing away from the other detection element. The contact surface deforms in the direction of the other detection element under the action of pressure, and one of the detection elements is used to emit a magnetic field to the other detection element.

10. A pressure positioning device, characterized in that, The pressure positioning device includes: An artificial head model; The pressure acquisition device as claimed in claim 9, and the pressure acquisition device is provided on the artificial head model; A processor, the processor is electrically connected to the pressure acquisition device, and the processor is configured to execute the steps of the pressure positioning method as claimed in any one of claims 1 to 8.

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