Integrated transmitter with heat dissipation structure

Abstract

The present invention discloses an integrated transmitter with a heat dissipation structure, which relates to the technical field of transmitters and includes a base, a temperature sensitive element, a heat dissipation connector and a pressure sensitive element. The heat dissipation connector includes a center piece, and the outer peripheral wall of the center piece is provided with at least three heat sinks spaced along its height direction. The lower end of the center piece is connected to a mounting portion, and connection holes pass through the center piece and the mounting portion in sequence from top to bottom, and the mounting portion is fixedly connected to the base. By providing the heat dissipation connector, the temperature sensitive element, the pressure sensitive element, the heat dissipation connector and the base are integrated into one. Only one set of transmitter cables needs to be provided, which reduces the construction difficulty and facilitates installation. The medium enters through the pressure inlet hole and contacts the probe of the pressure sensitive element. The heat dissipation connector absorbs the temperature of the medium and dissipates heat through the heat sink, so that the temperature is reduced to a range that the pressure sensitive element can withstand, thereby avoiding damage to the pressure sensitive element by the high-temperature medium and improving the service life of the transmitter.

Description

Technical Field

[0001] The present invention relates to the technical field of transmitters, and in particular to an integrated transmitter with a heat dissipation structure. Background Art

[0002] Transmitters evolved from sensors. Any sensor that can output a standard signal is called a transmitter. Currently, in the fields of petroleum, chemical industry, power plants, urban water supply, hydrological exploration, etc., when measuring temperature and pressure, especially when measuring medium temperature, the medium temperature is often too high, damaging the pressure sensitive components. In addition, in situations where high pressure (liquid level) and high temperature are measured and precisely controlled, customers need to purchase two separate temperature and pressure transmitters for installation and measurement of real-time pressure and temperature data. This installation is cumbersome and requires laying two sets of transmitter cables on site, which is difficult to construct and requires very high maintenance costs. Furthermore, the transmitters on the market that can measure both temperature and pressure simultaneously have low temperature measurement accuracy and a small pressure measurement range due to structural limitations. The overall product size is also large, resulting in poor measurement results.

[0003] In view of this, the present invention is proposed to solve the above technical problems. Summary of the Invention

[0004] The present invention aims to provide an integrated transmitter with a heat dissipation structure to solve the technical problems in the prior art of low temperature tolerance of the transmitter to the measured medium and insufficient integration of the transmitter.

[0005] The object of the present invention is to provide an integrated transmitter with a heat dissipation structure, comprising:

[0006] The base is fixed on the container of the measured medium, and a through pressure-inducing hole is opened in the center of the base along its height direction;

[0007] a temperature sensitive element, which is arranged at the bottom of the base;

[0008] A heat dissipation connector has a connection hole at its center, the heat dissipation connector is mounted on the base, and the connection hole is connected to the pressure-inducing hole;

[0009] The heat dissipation connector includes a center piece, an outer peripheral wall of the center piece is provided with at least three heat dissipation fins spaced apart along its height direction, a mounting portion is connected to the lower end of the center piece, connection holes pass through the center piece and the mounting portion in sequence from top to bottom, and the mounting portion is fixedly connected to the base;

[0010] a pressure sensitive element, which is disposed on the center piece and communicated with the connecting hole;

[0011] A common cooling cavity is formed inside the center piece and the plurality of heat sinks;

[0012] The cooling chamber is respectively connected with a liquid inlet pipe and a liquid outlet pipe;

[0013] A liquid storage tank is provided above the heat sink, the liquid storage tank is connected to a circulation pump, and the liquid outlet of the circulation pump is connected to the liquid inlet pipe;

[0014] A condenser is provided on one side of the liquid storage tank, the liquid outlet end of the condenser is connected to the liquid storage tank, and the end of the liquid outlet pipe facing away from the heat sink is connected to the liquid inlet end of the condenser;

[0015] Two sealing rubber rings are provided at the lower end of the pressure sensitive element, and the two sealing rubber rings are respectively sealed and connected to the two ends of the connection hole;

[0016] Two through holes are provided on the center piece along its height direction, one through hole is used for the insulating high temperature resistant wire to pass through, and the other through hole is used for filling glue into the sealed cavity.

[0017] Furthermore, a first threaded hole communicating with the pressure-inducing hole is provided on the base, a peripheral wall of the mounting portion has an external thread matching the first threaded hole, and the mounting portion is screwed into the first threaded hole.

[0018] Furthermore, the upper end of the connecting hole in the center of the center piece is an internal threaded hole, and a threaded pressure connector is provided in the internal threaded hole. The pressure connector has a cavity that matches the pressure sensitive element. The pressure sensitive element is located in the cavity, and the lower end of the pressure sensitive element passes through the cavity.

[0019] Furthermore, an internal thread is provided on the inner side wall of the upper end of the cavity, a locking ring is screwed onto the internal thread, a clamping rod is provided at the bottom of the locking ring, and the clamping rod is detachably connected to the pressure sensitive element.

[0020] Furthermore, a signal amplifier is provided at the upper end of the locking ring, and the signal amplifier is electrically connected to the temperature sensitive element through an insulated high-temperature resistant wire.

[0021] Furthermore, a connection groove is opened in the base, the insulated high-temperature resistant wire is located in the connection groove, and the connection groove is filled with magnesium powder and thermal grease.

[0022] Furthermore, a bottom edge is provided at the bottom of the lowermost heat sink, and the bottom edge is sealed to the upper end of the base to form a sealed cavity, and the sealed cavity is sealed by glue filling.

[0023] By adopting the above technical solution, the present invention has the following beneficial effects:

[0024] 1. Through the provision of heat dissipation connectors, the temperature sensitive element, pressure sensitive element, heat dissipation connector and base are integrated into one, reducing the volume of the overall transmitter. In addition, the temperature sensitive element and the pressure sensitive element are both integrated on the base, and only one set of transmitter cables needs to be set, which reduces the construction difficulty and facilitates installation.

[0025] 2. Since the probe rod is in direct contact with the medium, the temperature sensitive element is as close to the medium as possible, avoiding heat loss during the medium temperature transfer process, thereby improving the measurement accuracy of the medium temperature.

[0026] 3. The medium enters through the pressure-introducing hole and contacts the probe of the pressure-sensitive element to measure the pressure. The heat dissipation connector absorbs the temperature of the medium and dissipates heat through the heat sink, reducing the temperature of the medium to within the range that the pressure-sensitive element can withstand. This improves the pressure resistance of the pressure-sensitive element, avoids damage to the pressure-sensitive element by high-temperature media, and increases the service life of the transmitter. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are part of this application and are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention, but do not constitute an undue limitation of the present invention. Obviously, the drawings described below are only some embodiments. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without inventive effort. In the accompanying drawings:

[0028] Figure 1 A schematic structural diagram of an integrated transmitter with a heat dissipation structure provided in an embodiment of the present application;

[0029] Figure 2 for Figure 1 A partial structural cross-sectional view of the integrated transmitter with heat dissipation structure provided;

[0030] Figure 3 A schematic structural diagram of a heat dissipation connector of an integrated transmitter with a heat dissipation structure provided in an embodiment of the present application;

[0031] Figure 4 for Figure 3 A structural diagram from another perspective.

[0032] Figure numerals: 1. temperature sensitive element; 2. insulated high-temperature resistant wire; 3. base; 4. sealing rubber ring; 5. heat dissipation connector; 6. pressure connector; 7. pressure sensitive element; 8. locking ring; 9. signal amplifier; 10. housing; 11. liquid inlet pipe; 12. liquid outlet pipe; 13. liquid storage tank; 14. condenser; 15. circulating pump; 51. center piece; 52. heat sink; 53. mounting portion; 54. through hole; 55. internal threaded hole; 56. bottom edge.

[0033] It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but rather to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0034] The specific embodiments of the present invention will be further described in detail with reference to the accompanying drawings.

[0035] See also Figures 1 to 4 As shown, an embodiment of the present application provides an integrated transmitter with a heat dissipation structure, including: a base 3, a temperature sensitive element 1, a heat dissipation connector 5 and a pressure sensitive element 7. The base 3 is fixed to the container of the measured medium by an external thread at the lower end, and is sealed with the container of the measured medium by a sealing gasket, and is sealed with the container of the measured medium by an ED sealing ring. A through pressure-inducing hole is opened in the center of the base 3 along its height direction, the temperature sensitive element 1 is arranged at the bottom of the base 3, a connecting hole is opened in the center of the heat dissipation connector 5, the heat dissipation connector 5 is installed on the base 3, and the connecting hole is connected to the pressure-inducing hole, wherein the heat dissipation connector 5 includes a center piece 51, and the outer peripheral wall of the center piece 51 is provided with at least three heat dissipation fins 52 at intervals along its height direction, the lower end of the center piece 51 is connected to a mounting portion 53, the connecting holes pass through the center piece 51 and the mounting portion 53 from top to bottom, the mounting portion 53 is fixedly connected to the base 3 by threads, and the pressure sensitive element 7 is arranged on the center piece. 51, and is connected with the connecting hole; the center piece 51 and multiple heat sinks 52 are provided with the same cooling cavity, and the cooling cavity is respectively connected with the liquid inlet pipe 11 and the liquid outlet pipe 12. A liquid storage tank 13 is provided above the heat sink 52, and the liquid storage tank 13 is fixedly provided on the shell 10. The liquid storage tank 13 is filled with coolant, and the liquid storage tank 13 is connected with a circulation pump 15. The liquid outlet of the circulation pump 15 is connected with the liquid inlet pipe 11, and a condenser 14 is provided on one side of the liquid storage tank 13. The liquid outlet end of the condenser 14 is connected with the liquid storage tank 13, and the end of the liquid outlet pipe 12 facing away from the heat sink 52 is connected with the liquid inlet end of the condenser 14; two sealing rubber rings 4 are provided at the lower end of the pressure sensitive element 7, and the two sealing rubber rings 4 are respectively sealed with the two ends of the connecting hole to achieve high-pressure sealing of the medium; two through holes 54 are provided on the center piece 51 along its height direction, one through hole 54 is used for the insulated high-temperature resistant wire 2 to pass through, and the other through hole 54 is used for filling glue into the sealed cavity.

[0036] It should be noted that a shell 10 is also welded to the heat sink 52 at the top, thereby sealing the heat dissipation connector 5 from the outside; there is a probe rod at the bottom of the base 3, and the probe rod is assembled at the bottom of the base 3 through threads. After the temperature sensitive element 1 is installed in the probe rod, the probe rod and the base 3 are welded to reduce the overall processing difficulty, and the temperature sensitive element 1 is installed in the probe rod; the medium enters the pressure sensitive element 7 through the pressure-introducing hole at the bottom of the base 3. When the measured medium is above 85°C and the pressure is greater than 10MPa, the traditional structure cannot accurately measure the medium parameters with one transmitter at the same time; the mounting portion 53 is fixedly connected to the base 3 by threads. According to the temperature of the medium, the heat dissipation connector 5 with different numbers of heat sinks 52 is selected, which greatly reduces the production preparation and assembly costs of the product. When the heat sink 52 is quickly dissipating heat, the coolant in the liquid storage tank 13 is output through the provided circulation pump 15 and enters the cooling chamber through the liquid inlet pipe 11. After the coolant circulates in the cooling chamber, it enters the condenser 14 through the liquid outlet pipe 12 to cool the coolant. The cooled coolant flows back into the liquid storage tank 13 for circulation.

[0037] In the above scheme, the heat dissipation connector 5 is provided, so that the temperature sensitive element 1, the pressure sensitive element 7, the heat dissipation connector 5 and the base 3 are integrated into one, thereby reducing the volume of the overall transmitter, and the temperature sensitive element 1 and the pressure sensitive element 7 are both integrated on the base 3, and only one set of transmitter cables needs to be provided, which reduces the construction difficulty and facilitates installation. Since the probe rod is in direct contact with the medium, the temperature sensitive element 1 is as close to the medium as possible, avoiding heat loss during the transfer process of the medium temperature, thereby improving the measurement accuracy of the medium temperature. The medium enters through the pressure inlet hole and contacts the probe of the pressure sensitive element 7 to perform pressure measurement. The heat dissipation connector 5 absorbs the temperature of the medium and dissipates heat through the heat sink 52, thereby reducing the temperature of the medium and making it fall within the range that the pressure sensitive element 7 can withstand, thereby improving the pressure resistance of the pressure sensitive element 7, avoiding damage to the pressure sensitive element 7 by the high-temperature medium, and improving the service life of the transmitter.

[0038] In some possible implementation schemes, a first threaded hole connected to the pressure-inducing hole is provided on the base 3, and the peripheral wall of the mounting portion 53 has an external thread that matches the first threaded hole. The mounting portion 53 is screwed into the first threaded hole, thereby facilitating the replacement of the heat dissipation connector 5.

[0039] In some possible implementations, see Figure 2 and Figure 3 As shown, the upper end of the connecting hole in the center of the center piece 51 is an internal threaded hole 55, and a threaded pressure connector 6 is provided in the internal threaded hole 55. The pressure connector 6 has a cavity that matches the pressure sensitive element 7. The pressure sensitive element 7 is located in the cavity, and the lower end of the pressure sensitive element 7 passes through the cavity.

[0040] In some possible implementations, see Figure 2 As shown, the inner side wall of the upper end of the cavity is provided with an internal thread, a locking ring 8 is screwed on the internal thread, a pressing rod is provided at the bottom of the locking ring 8, and the pressing rod is detachably connected to the pressure sensitive element 7.

[0041] In the above scheme, when sealing the pressure sensitive element 7, the pressure sensitive element 7 is first placed in the pressure connector 6, and then the locking ring 8 is installed on the pressure connector 6. The locking ring 8 is rotated so that the pressing rod presses and seals the pressure sensitive element 7 in the pressure connector 6.

[0042] In some possible implementations, see Figure 2 As shown, a signal amplifier 9 is provided at the upper end of the locking ring 8. The signal amplifier 9 is electrically connected to the temperature sensitive element 1 through an insulated high-temperature resistant wire 2. An insulating sleeve is provided on the locking ring 8. The signal amplifier 9 is installed in the insulating sleeve. The insulating sleeve is filled with epoxy resin. The poured epoxy resin completely immerses the signal amplifier 9 in the epoxy resin, isolating oxygen and moisture, thereby extending the service life of the transmitter. The output signal of the pressure sensitive element 7 is transmitted to the signal amplifier 9 through a silicone wire, and after being processed by the signal amplifier 9, it is output by the waterproof gas guide cable at the tail of the transmitter.

[0043] In the above scheme, the temperature of the measured medium is transmitted to the temperature sensitive element 1 through the probe rod at the bottom of the base 3, and the output signal of the temperature sensitive element 1 is transmitted to the signal amplifier 9 through the probe rod. After processing by the signal amplifier 9, the signal is output by the waterproof gas guide cable at the tail of the transmitter.

[0044] In some possible implementations, see Figure 2 As shown, a connection groove is provided in the base 3, the insulated high-temperature resistant wire 2 is located in the connection groove, and the connection groove is filled with magnesium powder and thermal conductive silicone grease to ensure effective transfer of the medium temperature.

[0045] In some possible implementations, see Figure 2 and Figure 4 As shown, a bottom edge 56 is provided at the bottom of the lowermost heat sink 52, and the bottom edge 56 is sealed to the upper end of the base 3 to form a sealed cavity. The sealed cavity is sealed with glue, and the sealed cavity is sealed with glue to prevent high-temperature medium from entering the housing 10, thereby reducing the measurement of the pressure of the medium.

[0046] In some possible implementations, see Figure 2 As shown, an O-ring is provided on the outer circumferential wall of the pressure sensitive element 7 , and the O-ring is used to seal the pressure sensitive element 7 and the pressure connecting piece 6 .

[0047] In some possible implementation schemes, if the temperature of the measured medium is lower than 85°C, the heat dissipation connector 5 does not need to be installed during the assembly stage of the product, and the pressure connector 6 can be directly assembled to the base 3. The outer shell 10 is directly welded to the outer edge of the base 3 to achieve sealing with the outside world.

[0048] This specific embodiment is merely an explanation of the invention and is not a limitation of the invention. After reading this specification, those skilled in the art may make non-creative modifications to this embodiment as needed. However, as long as they are within the scope of protection of the invention, they are protected by patent law.

Claims

1. An integrated transmitter with a heat dissipation structure, characterized in that: include: A base (3) is fixed on a container of a measured medium, and a through pressure-inducing hole is provided at the center of the base (3) along its height direction; A temperature sensitive element (1) is arranged at the bottom of the base (3); A heat dissipation connector (5) having a connection hole at its center, the heat dissipation connector (5) being mounted on the base (3), the connection hole being in communication with the pressure-inducing hole; The heat dissipation connector (5) comprises a center piece (51), an outer peripheral wall of the center piece (51) is provided with at least three heat dissipation fins (52) spaced apart along its height direction, a mounting portion (53) is connected to the lower end of the center piece (51), the connection holes pass through the center piece (51) and the mounting portion (53) in sequence from top to bottom, and the mounting portion (53) is fixedly connected to the base (3); a pressure sensitive element (7), which is disposed on the center piece (51) and communicates with the connecting hole; The central piece (51) and the plurality of heat sinks (52) define a common cooling cavity; The cooling chamber is respectively connected to a liquid inlet pipe (11) and a liquid outlet pipe (12); A liquid storage tank (13) is provided above the heat sink (52), the liquid storage tank (13) is connected to a circulation pump (15), and the liquid outlet of the circulation pump (15) is connected to the liquid inlet pipe (11); A condenser (14) is provided on one side of the liquid storage tank (13), a liquid outlet end of the condenser (14) is connected to the liquid storage tank (13), and an end of the liquid outlet pipe (12) facing away from the heat sink (52) is connected to a liquid inlet end of the condenser (14); The lower end of the pressure sensitive element (7) is sleeved with two sealing rubber rings (4), and the two sealing rubber rings (4) are respectively sealed and connected to the two ends of the connecting hole; Two through holes (54) are provided on the center piece (51) along its height direction. One through hole (54) is used for the insulating high-temperature resistant wire (2) to pass through, and the other through hole (54) is used for filling glue into the sealed cavity.

2. The integrated transmitter with heat dissipation structure according to claim 1, characterized in that: The base (3) is provided with a first threaded hole connected to the pressure-inducing hole, the peripheral wall of the mounting portion (53) has an external thread that matches the first threaded hole, and the mounting portion (53) is screwed into the first threaded hole.

3. The integrated transmitter with heat dissipation structure according to claim 2, characterized in that: The upper end of the connection hole in the center of the center piece (51) is an internal threaded hole (55), and a threaded pressure connector (6) is provided in the internal threaded hole (55). The pressure connector (6) has a cavity that matches the pressure sensitive element (7). The pressure sensitive element (7) is located in the cavity, and the lower end of the pressure sensitive element (7) passes through the cavity.

4. The integrated transmitter with heat dissipation structure according to claim 3, characterized in that: An internal thread is provided on the inner side wall of the upper end of the cavity, a locking ring (8) is screwed onto the internal thread, a pressing rod is provided at the bottom of the locking ring (8), and the pressing rod is detachably connected to the pressure sensitive element (7).

5. The integrated transmitter with heat dissipation structure according to claim 4, characterized in that: A signal amplifier (9) is provided at the upper end of the locking ring (8), and the signal amplifier (9) is electrically connected to the temperature sensitive element (1) via an insulated high-temperature resistant wire (2).

6. The integrated transmitter with heat dissipation structure according to claim 5, characterized in that: A connection groove is provided in the base (3), the insulated high-temperature resistant wire (2) is located in the connection groove, and the connection groove is filled with magnesium powder and thermal conductive silicone grease.

7. The integrated transmitter with heat dissipation structure according to claim 6, characterized in that: The bottom of the heat sink (52) at the lowest end is provided with a bottom edge (56), and the bottom edge (56) is sealed to the upper end of the base (3) to form a sealed cavity, and the sealed cavity is sealed with glue.

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