An electronic component burn-in test apparatus

Abstract

The application relates to the technical field of electronic component testing, and specifically provides an electronic component aging test equipment which comprises a supporting seat and a test workbench, the supporting seat is provided with a centrifugal rotating mechanism, and the test workbench is connected to the centrifugal rotating mechanism; a plurality of test stations are arranged on the test workbench, a plurality of connecting terminals are arranged on a single test station, the lower ends of the connecting terminals arranged on the same side are sequentially decreased in height; the lower ends of the connecting terminals of the test stations arranged on the same side and at the same height are electrically connected to a test electric column; the centrifugal rotating mechanism drives the test workbench to centrifugally rotate, so that the gravity acceleration environment in aviation flight can be simulated; the multiple connecting terminals with decreasing heights arranged on the same test station can be connected with multiple test electric columns, so that multiple-pin synchronous testing is realized; the application combines centrifugal rotating dynamic testing, multiple-pin synchronous testing and heat dissipation optimization, and the efficiency and accuracy of the electronic component aging test are significantly improved.

Description

Technical Field

[0001] This invention relates to the field of electronic component testing technology, and more specifically to an electronic component aging test equipment. Background Technology

[0002] Electronic components are the basic units that make up electronic circuits. They are usually independently packaged and have two or more leads or metal contacts. They need to be interconnected by means of soldering (such as printed circuit boards) to achieve specific functions (such as amplification, oscillation, etc.). With the development of electronic technology, the requirements for the stability and reliability of electronic components are becoming increasingly stringent, especially for products used in the aerospace industry. High-temperature electrical aging tests on electronic components can expose defects and hidden dangers in the internal electrodes of the components in advance, ensuring that the products can withstand the test of time. This is of great significance for improving the stability and reliability of products. In order to simulate the gradual aging of internal components of electronic products due to various factors (such as the effects of temperature changes and electrical stress) during long-term operation in real-world environments, and the impact on the performance and lifespan of the products, aging test equipment applies a certain amount of electrical stress to the electronic products to accelerate the aging process and evaluate the performance of the products in a short period of time.

[0003] A published Chinese patent, CN106405274B, discloses an aging test device for electronic components, comprising a carrier board and a side guide plate. Using this device, there is no need to solder the electronic components onto a PCB board for aging testing. The electronic components are simply placed in a mounting slot, and electrically connected to their two end electrodes via side conductive pins and a middle conductive plate, respectively. Then, they are connected to an external power supply for current aging testing. This patent achieves non-soldering aging testing through the carrier board, side guide plate, conductive pins, and middle conductive plate. The side conductive pins and middle conductive plate connect to the two end electrodes of the electronic component, supporting batch testing; the upper guide plate is equipped with upper conductive pins that can connect to the middle electrode, supporting voltage testing. However, the technical solution provided by this invention still has the following limitations:

[0004] 1. Electronic components used in aerospace products cannot simulate the dynamic gravitational acceleration environment during flight, resulting in deviations between test conditions and actual working conditions, which affects the authenticity of aging tests.

[0005] 2. A single test can only be performed on a single item. In actual testing, the test time for a single item is about four hours. Multi-pin components need to be operated repeatedly, which is time-consuming and inefficient. Summary of the Invention

[0006] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide an electronic component aging test equipment. By installing a centrifugal rotation mechanism on a support base, and using a drive motor to drive the centrifugal rotation mechanism to rotate the test table centrifugally, the equipment simulates the dynamic gravitational acceleration environment during flight. Furthermore, during the simulation, the gravitational acceleration conditions can be adjusted as needed by adjusting the output speed of the drive motor, improving the realism of the aging test. By setting multiple connection terminals with decreasing heights on both sides of the same test station, and allowing test electrodes to be connected to these terminals to independently control different test items, multi-pin synchronous testing is achieved, significantly improving efficiency. The decreasing height design of the connection terminals avoids interference between multiple test electrodes, optimizing the test structure layout. Moreover, a single test electrode can simultaneously connect to the lower ends of connection terminals at multiple test stations located on the same side and at the same height, enabling synchronous measurement of electronic components at multiple test stations and improving the consistency of batch electronic component testing. This addresses the problems of existing technologies that cannot simulate the impact of dynamic gravitational acceleration environment during flight on the realism of aging tests and the time-consuming and inefficient nature of single-item testing.

[0007] To achieve the above and other related objectives, the present invention provides an electronic component aging test equipment, comprising two support bases and a test worktable disposed between the two support bases;

[0008] Both of the support bases are equipped with centrifugal rotation mechanisms. The two ends of the test table are connected to the centrifugal rotation mechanisms. The centrifugal rotation mechanisms drive the test table to rotate centrifugally to simulate the gravitational acceleration environment during aircraft flight.

[0009] Both centrifugal rotating mechanisms include a rotating shaft and an eccentric wheel sleeved on the rotating shaft. The rotating shaft is mounted on a support base via a rotating connector, and the test worktable is movably connected to the eccentric wheel via a pin.

[0010] One of the support bases is equipped with a drive motor, the output end of which is connected to the shaft of the centrifugal rotating mechanism at the corresponding position; the other support base is provided with a slip ring, and the test column is rotatably connected to the test equipment through the slip ring.

[0011] The test workbench is provided with multiple test stations, and each test station is provided with multiple connection terminals. The lower ends of the multiple connection terminals located on the same side decrease in height sequentially.

[0012] Multiple test stations located on the same side and at the same height at their lower ends have a test post electrically connected to their lower end. Each test post controls one test item.

[0013] In one embodiment of the present invention, the test workbench is provided with a wiring hole at one end near the collector ring, and the wires connected to the test post are connected out through the wiring hole.

[0014] In one embodiment of the present invention, the test workbench is provided with a straight pad that extends through multiple test stations, and the packaged body of the electronic component is placed on the pad.

[0015] In one embodiment of the present invention, a U-shaped pressure plate is fitted on the upper end of the pad, and the pressure plate simultaneously presses against the upper end of multiple electronic component packaging bodies; the pad and the pressure plate are detachably connected by bolts.

[0016] In one embodiment of the present invention, both the pad and the pressure plate are made of ceramic material with thermal conductivity and insulation properties.

[0017] In one embodiment of the present invention, the upper region of the test workbench corresponding to the connection terminal is provided with a through hole, and the pins of the electronic components are inserted into the connection terminal through the through hole.

[0018] In one embodiment of the present invention, a protrusion is provided on one side of the lower end of the connecting terminal, and the protrusions on the lower ends of two adjacent connecting terminals are provided in opposite directions; the test post passes through the protrusion.

[0019] In one embodiment of the present invention, the test workbench is provided with a plurality of bosses, which are supported on the lower end of the connecting terminal.

[0020] As described above, the electronic component aging test equipment of the present invention has the following beneficial effects:

[0021] 1. This invention installs a centrifugal rotation mechanism on a support base, which is driven by a drive motor to rotate the test table centrifugally, simulating the dynamic gravitational acceleration environment during flight. During the simulation, the gravitational acceleration conditions can be adjusted as needed by adjusting the output speed of the drive motor, thus improving the realism of the aging test. The two ends of the test table are movably connected to the eccentric wheel by pins to ensure smooth rotation. At the same time, the slip ring of the slip ring rotates with the shaft, and the test signal is transmitted to the test column through wires, enabling continuous testing of electronic components in a dynamic environment.

[0022] 2. This invention sets up multiple connection terminals with decreasing heights on both sides of the same test station. The test electrodes connected to the multiple connection terminals can independently control different test items, realizing synchronous testing of multiple pins and significantly improving efficiency. The decreasing height design of the connection terminals can avoid interference between multiple test electrodes and optimize the test structure layout. Furthermore, a test electrode can be connected to the lower ends of the connection terminals of multiple test stations located on the same side and at the same height, enabling synchronous measurement of electronic components at multiple test stations and improving the consistency of batch electronic component testing.

[0023] 3. The present invention provides a straight ceramic pad and a U-shaped ceramic pressure plate on the test workbench. The straight ceramic pad and the U-shaped ceramic pressure plate can work together to fix electronic components, improving the reliability of the electronic components relative to the test workbench during dynamic testing; and the thermal conductivity and insulation properties of ceramic materials can quickly dissipate the heat of the electronic component package body, avoid temperature concentration, and improve the accuracy of test data.

[0024] 4. The present invention has protrusions with opposite directions at the lower end of the connecting terminal, and the test post passes through the protrusions, which can prevent the test post from shifting during dynamic testing; at the same time, the protrusions set inside the test workbench can support the connecting terminal, enhancing the installation stability of the connecting terminal and the test post during dynamic testing.

[0025] 5. This invention utilizes a centrifugal rotation mechanism to drive the test stage in a centrifugal rotation, accurately simulating the gravitational acceleration environment during flight. Multiple connection terminals with decreasing heights are located at the same test station, allowing for the connection of multiple test posts and enabling simultaneous multi-pin testing of a single electronic component. The design of the thermally conductive and insulating ceramic pads and pressure plates not only secures the electronic component but also provides uniform heat dissipation, preventing test distortion caused by localized overheating. The use of boss-supported connection terminals, reverse-protrusion design, and conductive slip ring design ensures the stability of the electrical connection between the test post and external test equipment and the reliability of signal transmission during dynamic rotation testing. This invention combines centrifugal rotational dynamic testing, multi-pin synchronous testing, and optimized heat dissipation, solving the core problems of existing technologies and significantly improving the efficiency and accuracy of electronic component aging tests. Attached Figure Description

[0026] Figure 1 The diagram shown is a schematic representation of the overall structure of the electronic component aging test equipment disclosed in this invention.

[0027] Figure 2 The diagram shown is a partial exploded view of the electronic component aging test equipment disclosed in this invention.

[0028] Figure 3 The diagram shown is a cross-sectional view of the electronic component aging test equipment disclosed in this invention.

[0029] Figure 4 The diagram shown is an enlarged structural schematic of the test bench in the electronic component aging test equipment disclosed in this invention.

[0030] Figure 5 Displayed as Figure 4 A schematic diagram of the cross-sectional structure.

[0031] Figure 6 The diagram shows the structure of the connection terminal and the test post in the electronic component aging test equipment disclosed in this invention.

[0032] Figure 7 Displayed as Figure 6 A schematic diagram showing the connection of electronic components after the middle connection terminal is engaged with the test post.

[0033] Figure 8 The diagram shown is a partial exploded view of the centrifugal rotation mechanism and the slip ring in the electronic component aging test equipment disclosed in this invention.

[0034] Figure 9 Displayed as Figure 8 A structural diagram from another perspective.

[0035] Component designation explanation

[0036] Support base 1; Test workbench 2; Test station 21; Through hole 22; Boss 23; Wiring hole 24; Test electrode 3; Centrifugal rotation mechanism 4; Rotating shaft 41; Eccentric wheel 42; Drive motor 5; Slip ring 6; First slip ring 61; Second slip ring 62; Pad 7; Pressure plate 8; Connecting terminal 9; Protrusion 91; T-type flange plate 10; L-shaped hole 101. Detailed Implementation

[0037] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0038] Please see Figures 1 to 9It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and to facilitate understanding. They are not intended to limit the scope of the invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, provided they do not affect the effectiveness or purpose of the invention, should fall within the scope of the disclosed technical content. Furthermore, the terms "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention's implementation.

[0039] Example 1, please refer to Figures 1-3 , Figures 8-9 This embodiment provides an aging test equipment for electronic components, including two support bases 1 and a test workbench 2 disposed between the two support bases 1. The test workbench 2 has an inner cavity. Both support bases 1 are equipped with centrifugal rotation mechanisms 4, and both ends of the test workbench 2 are connected to the centrifugal rotation mechanisms 4. Specifically, both centrifugal rotation mechanisms 4 include a rotating shaft 41 and an eccentric wheel 42 sleeved on the rotating shaft 41. The rotating shaft 41 is mounted on the support base 1 via a rotating connector, and the test workbench 2 is movably connected to the eccentric wheel 42 via a pin. One of the support bases 1 is equipped with a drive motor 5, and the output end of the drive motor 5 is connected to the rotating shaft 41 of the corresponding centrifugal rotation mechanism 4. The other support base 1 is equipped with a collector ring 6, and the test electrode 3 is rotatably connected to the test equipment through the collector ring 6. The end of the test workbench 2 near the collector ring 6 is provided with a wiring hole 24, through which the wire connected to the test electrode 3 is exited. More specifically, there are two collector rings 6. Each collector ring 6 includes at least a slip ring and a brush for rotatable contact conduction. The two collector rings 6 are a first collector ring 61 and a second collector ring 62. The first collector ring 61 is installed in the area of ​​the eccentric wheel 42 of the centrifugal rotating mechanism 4 away from the rotating shaft 41 and is sleeved on the outside of the pin. One end of the pin connecting to the test workbench 2 is provided with a T-shaped flange plate 10. The T-shaped flange plate 10 is provided with an L-shaped hole 101. The wire connected to the test electrode 3 is connected through the wiring hole 24 and then... After passing through the L-shaped hole 101, it is connected to the slip ring of the first slip ring 61; the second slip ring 62 is installed in the area where the eccentric wheel 42 connects to the rotating shaft 41 and is sleeved on the outside of the rotating shaft 41. The brush of the second slip ring 62 is electrically connected to the brush of the first slip ring 61 through the wire; the slip ring of the second slip ring 62 is installed on the rotating shaft 41. The rotating shaft 41 on which the second slip ring 62 is installed has a central hole that axially penetrates the rotating shaft 41. The slip ring of the second slip ring 62 is electrically connected to the test equipment through the central hole via the wire.

[0040] This invention utilizes a centrifugal rotation mechanism 4 mounted on a support base 1, driven by a drive motor 5 to rotate the test bench 2 centrifugally, simulating the dynamic gravitational acceleration environment during flight. Furthermore, the gravitational acceleration conditions can be adjusted as needed by changing the output speed of the drive motor 5 during the simulation, improving the realism of the aging test. The test bench 2 is movably connected to eccentric wheels 42 at both ends via pins, ensuring smooth rotation. Simultaneously, the slip ring of the collector ring 6 rotates with the rotating shaft 41, transmitting test signals from the testing equipment to the test electrode 3 via wires, enabling continuous testing of electronic components in a dynamic environment.

[0041] Please see Figures 4-7 The test workbench 2 is provided with multiple test stations 21, and each test station 21 is provided with multiple connection terminals 9. The upper ends of the multiple connection terminals 9 located on the same side are at the same horizontal line, and the lower ends decrease in height sequentially. The lower ends of the multiple test stations 21 located on the same side and at the same height are electrically connected to a test post 3, and each test post 3 corresponds to control one test item. The upper area of ​​the test workbench 2 corresponding to the connection terminals 9 is provided with through holes 22, and the pins of electronic components are inserted into the connection terminals 9 through the through holes 22. This invention provides a solution by setting multiple connection terminals 9 with decreasing heights on both sides of the same test station 21. The test electrodes 3 connected to the multiple connection terminals 9 can independently control different test items, realizing synchronous testing of multiple pins and significantly improving efficiency. The decreasing height design of the connection terminals 9 can avoid interference between multiple test electrodes 3 and optimize the test structure layout. Furthermore, a test electrode 3 can be connected to the lower end of the connection terminals 9 of multiple test stations 21 located on the same side and at the same height, enabling synchronous measurement of electronic components at multiple test stations 21 and improving the consistency of batch electronic component testing.

[0042] The lower end of the connecting terminal 9 has a protrusion 91 on one side, and the protrusions 91 on the lower ends of two adjacent connecting terminals 9 are in opposite directions; the test electrode 3 passes through the protrusion 91; the test workbench 2 has several protrusions 23, which support the lower end of the connecting terminal 9. This invention provides protrusions 91 with opposite directions at the lower end of the connecting terminal 9, and the test electrode 3 passes through the protrusions 91, which can prevent the test electrode 3 from shifting during dynamic testing; at the same time, the protrusions 23 inside the test workbench 2 can support the connecting terminal 9, enhancing the installation stability of the connecting terminal 9 and the test electrode 3 during dynamic testing.

[0043] Please see Figures 1-2The test workbench 2 is equipped with a straight-line pad 7, which extends through multiple test stations 21. The packaged bodies of electronic components are placed on the pad 7. A U-shaped pressure plate 8 is fitted to the upper end of the pad 7, pressing against the upper ends of multiple electronic component packages. The pad 7 and the pressure plate 8 are detachably connected by bolts. Both the pad 7 and the pressure plate 8 are made of ceramic material with thermal conductivity and insulation properties. The straight-line ceramic pad 7 and the U-shaped ceramic pressure plate 8 can fix the electronic components, improving the reliability of the electronic components' placement relative to the test workbench 2 during dynamic testing. Furthermore, the thermal conductivity and insulation properties of the ceramic material can quickly dissipate the heat from the electronic component packages, avoiding temperature concentration and improving the accuracy of test data.

[0044] The testing process of the present invention is as follows: 1) Multiple electronic components under test are placed sequentially on the test station 21 of the test workbench 2. The package body of the electronic component under test is placed on the ceramic pad 7, and the pins are inserted into the connection terminal 9 through the through hole 22. Since multiple connection terminals 9 located on the same side of a single test station (21) are respectively connected to different test posts 3, multiple pins of a single electronic component under test can be electrically connected to different test posts 3.

[0045] 2) Press the ceramic pressure plate 8 onto the upper end of the package body of the electronic component under test. The two ends of the ceramic pressure plate 8 are detachably connected to the ceramic pad 7 by bolts, thereby fixing the electronic component under test.

[0046] 3) The centrifugal rotating mechanism 4 is driven to rotate by the drive motor 5. The eccentric wheel 42 mounted on the rotating shaft 41 drives the test table 2 to rotate and centrifuge, dynamically testing the gravity acceleration environment of the aviation flight process.

[0047] 4) During dynamic testing, the testing equipment connects to the test posts 3 via the collector ring 6 and transmits different test signals. For example, in a certain test, the four pins of an electronic component are connected to the connection terminals 9 at different heights. The test items should correspond to three test items: voltage, current, and impedance. The testing equipment transmits voltage, current, and impedance test signals to three of the test posts 3 connected to the four pins of the electronic component via the collector ring 6, thus realizing multi-item detection simultaneously.

[0048] 5) After the test is completed, the test equipment collects and analyzes the corresponding test data; the electronic component under test can be pulled out by removing the ceramic pressure plate 8.

[0049] Example 2, based on Example 1, tests dynamic gravity acceleration simulation and component performance to verify the aging effect of centrifugal rotation mechanism 4 on electronic components under simulated airborne gravity acceleration environment.

[0050] The test conditions are as follows:

[0051] Equipment parameters: centrifugal rotating mechanism speed range 0-2000 rpm, eccentric wheel radius 50 mm, test temperature 25℃±2℃.

[0052] Components under test: aerospace-grade capacitors (rated voltage 50V, capacitance 100μF), 10 samples in total.

[0053] Test items: Capacitor value decay rate, leakage current change.

[0054] Test steps

[0055] 1) Fix the capacitor sample on the ceramic pad 7 of the test bench 2, and insert the pins into the connection terminal 9;

[0056] 2) Set the rotation speed of the centrifugal rotating mechanism 4 to 1000 rpm. This speed is used to simulate 3G acceleration and run continuously for 48 hours.

[0057] 3) Measure the capacitance value (LCR tester) and leakage current (high resistance meter) every 12 hours.

[0058] The test data is shown in the table below:

[0059]

[0060] As shown in the table above, under 3G acceleration, the capacitance decay rate increases linearly with time, while the leakage current increase remains stable. This verifies the accelerating effect of dynamic gravity environment on component aging, which meets the simulation requirements of aviation application scenarios.

[0061] Example 3, based on Example 1, verifies the efficiency of multi-pin parallel testing.

[0062] The test conditions are as follows:

[0063] Component under test: Three-pin MOSFET (model IRF540N), 20 samples in total.

[0064] Test item: On-resistance (R) DS(on) Threshold voltage (V) GS(th) ), reverse recovery time (t) rr ).

[0065] Comparison method: Traditional single-pin step-by-step testing vs. the multi-pin synchronous testing of this invention.

[0066] Traditional methods test each pin parameter sequentially, with a single test taking 3 minutes per component; the method of this invention connects three test posts simultaneously through connection terminals of different heights, with a single test taking 1 minute per component; the total test time and data consistency of the two methods are recorded.

[0067] The test data is shown in the table below:

[0068]

[0069] As shown in the table above, the method of the present invention improves the testing efficiency to three times that of the traditional method, and has better data consistency and a 40% reduction in standard deviation, which proves the effectiveness of multi-pin synchronous testing.

[0070] Example 4, based on Example 1, tests the temperature control of ceramic heat dissipation materials to verify the optimization effect of ceramic pads and pressure plates on heat dissipation of components during the test.

[0071] The test conditions are as follows:

[0072] Equipment parameters: Ceramic pad thermal conductivity 30 W / m·K, test current 5A continuous loading;

[0073] Component under test: power resistor (10Ω / 50W), 10 samples in total;

[0074] Comparison group: Metal pad group without ceramic heat dissipation design.

[0075] Test steps

[0076] 1) The two groups of samples were fixed on ceramic and metal pads respectively, and a 5A current was applied for 1 hour.

[0077] 2) Use an infrared thermal imager to record the surface temperature distribution of the components, and collect data every 10 minutes.

[0078] The test data is shown in the table below:

[0079]

[0080] As shown in the table above, the peak temperature of the ceramic pad group is 28% lower than that of the metal group, and there is no overheat protection trigger, which proves that its thermal conductivity and insulation performance effectively suppresses local temperature rise and avoids test distortion.

[0081] Based on embodiments 2-4, this invention verifies the realism of environmental simulation by correlating acceleration data with changes in component performance; multi-item parallel testing can achieve a dual improvement in efficiency and data accuracy, meeting the rapid testing needs of complex components; the ceramic material heat dissipation structure can significantly reduce temperature rise while fixing electronic components, ensuring the long-term reliability of test data.

[0082] In summary, this invention uses a centrifugal rotation mechanism 4 to drive the test stage 2 to rotate centrifugally, accurately simulating the gravitational acceleration environment during flight. Multiple connection terminals 9 with decreasing heights are set at the same test station 21, allowing multiple test posts 3 to be connected, enabling simultaneous multi-pin testing of a single electronic component. The design of the thermally conductive and insulating ceramic pad 7 and pressure plate 8 not only fixes the electronic component but also uniformly conducts heat to the outside, avoiding test distortion caused by localized overheating. The use of protrusions 23 to support the connection terminals 9, the design of the reverse protrusion 91, and the conductive design of the collector ring 6 ensures the stability of the electrical connection between the test post 3 and the external test equipment and the reliability of signal transmission during the dynamic rotation test. This invention combines centrifugal rotation dynamic testing, multi-pin synchronous testing, and heat dissipation optimization, solving the core problems of existing technologies and significantly improving the efficiency and accuracy of electronic component aging tests. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and has high industrial application value.

[0083] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. An electronic component aging test equipment, comprising two support bases (1) and a test workbench (2) disposed between the two support bases (1). Its features are: Both of the support seats (1) are equipped with centrifugal rotation mechanisms (4). The two ends of the test workbench (2) are connected to the centrifugal rotation mechanisms (4). The centrifugal rotation mechanisms (4) drive the test workbench (2) to rotate centrifugally to simulate the gravitational acceleration environment of the aviation flight process. Both centrifugal rotating mechanisms (4) include a rotating shaft (41) and an eccentric wheel (42) sleeved on the rotating shaft (41). The rotating shaft (41) is mounted on the support base (1) through a rotating connector, and the test workbench (2) is movably connected to the eccentric wheel (42) through a pin. One of the support bases (1) is equipped with a drive motor (5), and the output end of the drive motor (5) is connected to the shaft (41) of the centrifugal rotation mechanism (4) at the corresponding position. Another support base (1) is provided with a collector ring (6), and the test post (3) is rotatably connected to the test equipment through the collector ring (6); The test workbench (2) is provided with multiple test stations (21), and each test station (21) is provided with multiple connection terminals (9). The lower end heights of the multiple connection terminals (9) located on the same side decrease sequentially. The lower end of the connection terminal (9) of multiple test stations (21) located on the same side and at the same height is electrically connected to a test post (3), and a single test post (3) controls one test item.

2. The electronic component aging test equipment according to claim 1, characterized in that: The test workbench (2) has a wiring hole (24) at one end near the collector ring (6), and the wires connected to the test post (3) are connected out through the wiring hole (24).

3. The electronic component aging test equipment according to claim 1, characterized in that: The test workbench (2) is provided with a straight pad (7), which passes through multiple test stations (21) at the same time. The packaged body of the electronic component is placed on the pad (7).

4. The electronic component aging test equipment according to claim 3, characterized in that: The pad (7) is fitted with a zig-shaped pressure plate (8) at its upper end, and the pressure plate (8) presses against the upper end of multiple electronic component packaging bodies at the same time; the pad (7) and the pressure plate (8) are connected by bolts for detachment.

5. The electronic component aging test equipment according to claim 4, characterized in that: Both the pad (7) and the pressure plate (8) are made of ceramic material with thermal conductivity and insulation properties.

6. The electronic component aging test equipment according to claim 1, characterized in that: The test workbench (2) has a through hole (22) in the upper area corresponding to the connection terminal (9), and the pins of the electronic components are inserted into the connection terminal (9) through the through hole (22).

7. The electronic component aging test equipment according to claim 1, characterized in that: The lower end of the connecting terminal (9) is provided with a protrusion (91), and the protrusions (91) at the lower ends of two adjacent connecting terminals (9) are provided in opposite directions; the test post (3) passes through the protrusion (91).

8. The electronic component aging test equipment according to claim 7, characterized in that: The test workbench (2) is provided with several bosses (23), which are supported on the lower end of the connecting terminal (9).

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