Test method and test fixture for image sensor chip package

Abstract

The invention discloses a method for testing an image sensor chip packaging piece. The method comprises the following steps: placing the image sensor chip packaging piece in a chip placing area on a test board; the chip placing area is provided with a test contact; electrically contacting the test contact with a pin of the image sensor chip packaging piece so as to carry out a chip test; after chip testing is finished, the image sensor chip packaging part is ejected upwards by a certain distance through a telescopic mechanism arranged on the testing plate, so that the problem of material blocking in the chip moving-out process is solved; wherein the telescoping mechanism is in contact with a structure of a non-chip area of the image sensor chip package.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of chip testing, and in particular, to a testing method and a testing fixture for an image sensor chip package. Background Art

[0002] Currently, for the testing fixture of a chip, the chip to be tested is placed in a test frame of a dedicated fixture to fix the position of the chip, and the upper cover of the testing fixture is pressed down for electrical testing. After the product is tested, it is removed by a vacuum suction nozzle. However, such a testing fixture has strict requirements for the outer dimensions of the product. Products with larger dimensions are easily stuck in the test frame, and the vacuum suction nozzle cannot remove the product, resulting in material jams, frequent alarms of the machine, and affecting the testing efficiency. Summary of the Invention

[0003] Based on the problems existing in the prior art, the present invention proposes a testing method for an image sensor chip package, including: placing the image sensor chip package in a chip placement area on a test board; the chip placement area is provided with test contacts; electrically contacting the test contacts with the pins of the image sensor chip package to perform chip testing; after the chip testing is completed, the image sensor chip package is jacked up by a telescopic mechanism provided on the test board by a certain distance to overcome the problem of material jams during the removal of the chip; wherein, the telescopic mechanism contacts the structure in the non-chip area of the image sensor chip package.

[0004] In some embodiments, the chip placement area is further provided with vacuum holes; the vacuum holes are evacuated by a vacuum pumping device to adsorb the image sensor chip package to the chip placement area through the vacuum suction force in the vacuum holes, so that the test contacts are electrically contacted with the pins of the image sensor chip package to perform chip testing.

[0005] In some embodiments, the method further includes: before the test starts, determining whether the image sensor chip package is successfully placed in the chip placement area on the test board.

[0006] In some embodiments, determining whether the image sensor chip package is successfully placed in the chip placement area on the test board includes any one of the following: emitting a light beam to the chip placement area and determining whether the image sensor chip package is successfully placed in the chip placement area according to the reception condition of the reflected light beam corresponding to the emitted light beam; collecting an image of the image sensor chip package and determining whether the image sensor chip package is successfully placed in the chip placement area according to the image of the image sensor chip package; collecting the vacuum degree in the vacuum hole and determining whether the image sensor chip package is successfully placed in the chip placement area according to the relationship between the collected vacuum degree in the vacuum hole and the preset vacuum degree.

[0007] In some embodiments, the method further includes: when receiving a vacuum degree adjustment instruction, adjusting the working condition of the vacuum pumping device according to the vacuum degree adjustment instruction to adjust the vacuum degree in the vacuum hole, so as to adjust the contact degree between the test contact and the image sensor chip package.

[0008] The present invention also provides a test fixture for an image sensor package, including: a test board and a telescopic mechanism arranged on the test board; a chip placement area is arranged on the test board; test contacts are arranged in the chip placement area; the telescopic mechanism is adapted to jack up the image sensor chip package a certain distance upward after the chip test is completed, so as to overcome the problem of material jamming during the chip removal process; wherein, the telescopic mechanism contacts the structure of the non-chip area of the image sensor chip package.

[0009] In some embodiments, the test fixture further includes: a test frame arranged on the test board; the test frame has a limiting opening to accommodate the image sensor chip package; the limiting opening exposes the chip placement area.

[0010] In some embodiments, the test board is further provided with a vacuum hole; the vacuum hole is used to connect a vacuum pumping device to adsorb the image sensor chip package in the chip placement area through the vacuum suction in the vacuum hole. When the image sensor chip package is adsorbed, the test contacts are electrically contacted with the pins of the image sensor chip package.

[0011] In some embodiments, the image sensor chip package includes an image sensor chip and a support frame; the support frame includes an outer support structure and an inner support structure; the inner support structure is fixedly connected to the image sensor chip; the telescopic mechanism is adapted to contact the outer support structure through the telescopic mechanism and jack up the image sensor chip package a certain distance upward after the chip test is completed.

[0012] In some embodiments, the test board is provided with a hole structure; the telescopic mechanism reciprocates in the hole structure.

[0013] Compared with the prior art, after the chip test is completed, the technical solution of the present invention can push the image sensor chip package upward by a certain distance through the telescopic mechanism provided on the test board, so as to overcome the problem of chip jamming during the chip removal process; moreover, the telescopic mechanism contacts the structure of the non-chip area of the image sensor chip package, thus not damaging the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic structural diagram of an image sensor chip package in an embodiment of the present invention.

[0015] Figure 2 It is a schematic structural diagram of a chip test fixture in an embodiment of the present invention.

[0016] Figure 3 It is a cross-sectional view of a chip test fixture in an embodiment of the present invention.

[0017] Figure 4 It is a cross-sectional view of a chip test fixture in an embodiment of the present invention.

[0018] Figure 5 It is a cross-sectional view of a chip test fixture in an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] As described above, in the prior art, the chip test fixture usually presses down the upper cover of the test fixture after the chip position is fixed, compresses the chip so that the pins of the chip are in full contact with the test contacts of the bottom test board, thereby realizing electrical connection to perform electrical testing on the chip. In the embodiments of the present invention, after the chip test is completed, the image sensor chip package can be pushed upward by a certain distance through the telescopic mechanism provided on the test board, so as to overcome the problem of chip jamming during the chip removal process; moreover, the telescopic mechanism contacts the structure of the non-chip area of the image sensor chip package, thus not damaging the chip.

[0020] In order to make the above-mentioned objects, features and beneficial effects of the embodiments of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention will be given with reference to the accompanying drawings.

[0021] Figure 1 It is a schematic structural diagram of an image sensor chip package 111 in an embodiment of the present invention.

[0022] The image sensor chip package 111 includes an image sensor chip 111a, pads 111f, metal wires 111e, a support frame 111b, and a light-transmitting cover plate 111d. The first end of the metal wire 111e is bonded to the pad 111f of the image sensor chip 111a. The other end of the metal wire 111e is suspended over the image sensor chip 111a. The support frame 111b includes an inner support structure 111g. The inner support structure 111g is bonded to the image sensor chip 111a. The photosensitive area 111c of the image sensor chip 111a is used to receive light and convert the optical signal into an electrical signal.

[0023] Figure 2 FIG. 4 is a schematic structural diagram of a chip test fixture 100 according to an embodiment of the present invention.

[0024] Figure 3 FIG. 8 is a cross-sectional view of a chip test fixture 100 according to an embodiment of the present invention.

[0025] Figure 4 FIG. 12 is a cross-sectional view of a chip test fixture 100 according to an embodiment of the present invention. Among them, the telescopic mechanism 114 is in the unextended state at initialization.

[0026] Figure 5 FIG. 16 is a cross-sectional view of a chip test fixture 100 according to an embodiment of the present invention. Among them, the telescopic mechanism 114 is in the extended state.

[0027] As Figures 2 to 5 shown, the chip test fixture 100 includes a test board 112, a test frame 113 disposed on the test board, and a telescopic mechanism 114 disposed on the test board. The test board 112 is provided with a hole structure. The telescopic mechanism 114 reciprocates in the hole structure. The hole structure can be a through hole or a blind hole.

[0028] A chip placement area 113a is provided on the test board 111 for placing the image sensor chip package 112. Test contacts 115 are provided in the chip placement area.

[0029] The test frame 113 has a limit opening 113a to accommodate the image sensor chip package 111. The limit opening exposes the chip placement area 113b.

[0030] The test board 113a is provided with a vacuum hole 113c. The vacuum hole 113c is used to connect a vacuum pumping device to adsorb the image sensor chip package 111 to the chip placement area 113b by the vacuum suction force in the vacuum hole 113c. When the image sensor chip package 111 is adsorbed, the test contacts 115 are in electrical contact with the pads 111f of the image sensor chip package 111.

[0031] As Figure 5As shown, the telescopic mechanism 114 is adapted to push the image sensor chip package 111 upward by a certain distance after the chip test is completed, so as to overcome the problem of chip jamming during the chip removal process. The telescopic mechanism 114 contacts the structure of the non-chip area of the image sensor chip package 112, so as not to damage the image sensor chip 111 of the image sensor chip package 112.

[0032] For the above-mentioned chip test fixture, the present invention proposes a test method for an image sensor chip package, including: placing the image sensor chip package on the chip placement area of the test board; the chip placement area is provided with test contacts; electrically contacting the test contacts with the pins of the image sensor chip package to perform chip testing; after the chip test is completed, pushing the image sensor chip package upward by a certain distance through a telescopic mechanism provided on the test board to overcome the problem of chip jamming during the chip removal process; wherein, the telescopic mechanism contacts the structure of the non-chip area of the image sensor chip package.

[0033] Further, the chip placement area is also provided with vacuum holes; the vacuum holes are evacuated by a vacuum pumping device, so as to adsorb the image sensor chip package on the chip placement area through the vacuum suction force in the vacuum holes, so that the test contacts are electrically contacted with the pins of the image sensor chip package to perform chip testing.

[0034] Further, the method further includes: before the test starts, determining whether the image sensor chip package is successfully placed on the chip placement area of the test board.

[0035] Further, the determination of whether the image sensor chip package is successfully placed on the chip placement area of the test board includes any one of the following: emitting a light beam to the chip placement area, and determining whether the image sensor chip package is successfully placed on the chip placement area according to the reception situation of the reflected light beam corresponding to the emitted light beam; collecting an image of the image sensor chip package, and determining whether the image sensor chip package is successfully placed on the chip placement area according to the image of the image sensor chip package; collecting the vacuum degree in the vacuum holes, and determining whether the image sensor chip package is successfully placed on the chip placement area according to the relationship between the collected vacuum degree in the vacuum holes and the preset vacuum degree.

[0036] Further, the method further includes: when a vacuum degree adjustment instruction is received, adjusting the operating condition of the vacuum pumping device according to the vacuum degree adjustment instruction to adjust the vacuum degree in the vacuum holes, so as to adjust the contact degree between the test contacts and the image sensor chip package.

[0037] An embodiment of the present invention also provides a chip testing system. In a specific implementation, the chip testing system may include a vacuum pumping device and a chip testing fixture 100. The chip testing fixture 100 may adopt the chip testing fixture 100 provided in any of the above embodiments of the present invention. The vacuum pumping device may be coupled to the vacuum hole 113c for pumping vacuum on the vacuum hole 113c. The structure of the chip testing fixture 100 may refer to the description in any of the above embodiments of the present invention and will not be elaborated here.

[0038] In a specific implementation, the chip testing system may further include a vacuum degree detection device. The vacuum degree detection device may detect the vacuum degree inside the vacuum hole 113c. The detected vacuum degree inside the vacuum hole 113c can be used, on the one hand, to determine whether the image sensor package 111 to be tested has been placed in the chip placement area 113a. When the image sensor package 111 is not placed in the chip placement area 113a, the vacuum hole 113c communicates with the atmosphere and the vacuum degree is relatively low. After the image sensor package 111 is placed in the chip placement area 113a, the vacuum degree detected by the vacuum degree detection device reaches a set value. The detected vacuum degree inside the vacuum hole 113c can be used, on the other hand, to determine the contact degree between the metal wire 111e and the test contact 115. The contact degree between the metal wire 111e and the test contact 115 is positively correlated with the vacuum degree inside the vacuum hole 13.

[0039] In a specific implementation, the chip testing system may further include an adjustment device. The adjustment device is coupled to the vacuum pumping device. The adjustment device can adjust the working condition of the vacuum pumping device according to the vacuum degree adjustment instruction, and adjust the vacuum degree inside the vacuum hole 113c by adjusting the working condition of the vacuum pumping device, so as to adjust the contact degree between the test contact 115 and the image sensor package 111.

[0040] In a specific implementation, the chip testing system may further include a chip placement position detection device. The chip placement position detection device includes any one of the following: a light beam detection device, an image detection device, and a vacuum degree detection device.

[0041] In an embodiment of the present invention, the chip placement position detection device is a light beam detection device. The light beam detection device can emit a light beam to the chip placement area 113a and receive the reflected light beam corresponding to the emitted light beam, and determine whether the image sensor package 111 is successfully placed in the chip placement area 113a according to the reception situation of the reflected light beam.

[0042] For example, the light beam detection device is placed directly above the chip placement area 113a. When the image sensor package 111 is not placed in the chip placement area 113a, the light beam detection device can receive the reflected light beam corresponding to the emitted light beam. If the reflection angle of the reflected light beam corresponding to the emitted light beam changes after the image sensor package 111 is placed in the chip placement area 113a, the light beam detection device cannot receive the reflected light beam, or the angle of the received reflected light beam is different from the reflection angle when the image sensor package 111 is not placed. Therefore, it can be judged whether the image sensor package 111 is successfully placed in the chip placement area 113a based on the reception of the reflected light beam.

[0043] It is understandable that, depending on the arrangement position of the light beam detection device and its relative position to the chip placement area 113a, the light beam detection device receives the reflected light beam in different situations, and can be set specifically according to the actual application scenario requirements.

[0044] In another embodiment of the invention, the chip placement position detection device is an image detection device. The image detection device can capture an image of the image sensor package 111, and determine whether the image sensor package 111 is successfully placed in the chip placement area 113a based on the captured image. The image detection device may include a camera, a camera, or other devices with image acquisition functions.

[0045] For example, the image detection device tracks the moving position of the image sensor package 111. When it is detected that the image of the image sensor package 111 is consistent with the first set image, it is determined that the image sensor package 111 is successfully placed in the chip placement area 113a, wherein the first set image is an image of the image sensor package 111 successfully placed in the chip placement area 113a.

[0046] For another example, whether the image sensor package 111 is successfully placed in the chip placement area 113 a is determined based on the relative position relationship between the collected image of the image sensor package 111 and the set positioning point.

[0047] For another example, the image detection device collects images of the chip placement area 113a in real time or periodically. When it is detected that the image of the chip placement area 113a is consistent with the second preset image, that is, when the image of the image sensor package 111 is collected in the chip placement area 113a, it is determined that the image sensor package 111 is successfully placed in the chip placement area 113a, wherein the second set image is an image of the image sensor package 111 successfully placed in the chip placement area 113a.

[0048] In another embodiment of the invention, the chip placement position detection device is a vacuum degree detection device. The vacuum degree detection device can collect the vacuum degree in the vacuum hole 113c and determine whether the image sensor package 111 is successfully placed in the chip placement area 113a according to the relationship between the vacuum degree in the vacuum hole 113c and the preset vacuum degree.

[0049] In a specific implementation, the chip testing system may further include a grasping device. The grasping device can grasp the image sensor package 111 and place the grasped image sensor package 111 in the chip placement area 113a. After the chip placement position detection device determines that the image sensor package 111 is successfully placed in the chip placement area 113a, the grasping device can release the image sensor package 111.

[0050] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be determined by the scope defined by the claims.

Claims

1. A testing method for an image sensor chip package, characterized in that, Comprising: Placing an image sensor chip package on a chip placement area of a test board; The chip placement area is provided with test contacts; Electrically contacting the test contacts with the pins of the image sensor chip package for chip testing; After the chip testing is completed, the image sensor chip package is pushed upward by a telescopic mechanism provided on the test board by a certain distance to overcome the problem of material jamming during the chip removal process; Wherein, the telescopic mechanism contacts the structure of the non-chip area of the image sensor chip package.

2. The method according to claim 1, characterized in that The chip placement area is further provided with vacuum holes; The vacuum holes are evacuated by a vacuum pumping device, so that the image sensor chip package is adsorbed on the chip placement area through the vacuum suction force in the vacuum holes, and the test contacts are electrically contacted with the pins of the image sensor chip package for chip testing.

3. The method according to claim 1, characterized in that Also comprising: Before the test starts, determining whether the image sensor chip package is successfully placed on the chip placement area of the test board.

4. The method according to claim 3, wherein Determining whether the image sensor chip package is successfully placed on the chip placement area of the test board includes any one of the following: Emitting a light beam to the chip placement area, and determining whether the image sensor chip package is successfully placed on the chip placement area according to the reception situation of the reflected light beam corresponding to the emitted light beam; Collecting an image of the image sensor chip package, and determining whether the image sensor chip package is successfully placed on the chip placement area according to the image of the image sensor chip package; Collecting the vacuum degree in the vacuum holes, and determining whether the image sensor chip package is successfully placed on the chip placement area according to the relationship between the collected vacuum degree in the vacuum holes and a preset vacuum degree.

5. The method according to claim 4, wherein Also comprising: When receiving a vacuum degree adjustment instruction, adjusting the operating condition of the vacuum pumping device according to the vacuum degree adjustment instruction to adjust the vacuum degree in the vacuum holes, so as to adjust the contact degree between the test contacts and the image sensor chip package.

6. A test fixture for an image sensor package, characterized in that, Comprising: A test board and a telescopic mechanism provided on the test board; A chip placement area is provided on the test board; The chip placement area is provided with test contacts; The telescopic mechanism is adapted to push the image sensor chip package upward by a certain distance after the chip testing is completed to overcome the problem of material jamming during the chip removal process; Wherein, the telescopic mechanism contacts the structure of the non-chip area of the image sensor chip package.

7. The chip test fixture according to claim 6, wherein, Also comprising: A test frame provided on the test board; The test frame has a limit opening to accommodate the image sensor chip package; The limit opening exposes the chip placement area.

8. The chip testing fixture according to claim 6, wherein The test board is further provided with vacuum holes; The vacuum holes are used to connect a vacuum pumping device, so that the image sensor chip package is adsorbed on the chip placement area through the vacuum suction force in the vacuum holes. When the image sensor chip package is adsorbed, the test contacts are electrically contacted with the pins of the image sensor chip package.

9. The chip testing fixture according to claim 6, wherein The image sensor chip package includes an image sensor chip and a support frame; The support frame includes an outer support structure and an inner support structure; the inner support structure is fixedly connected to the image sensor chip; The telescopic mechanism is adapted to, after the chip test is completed, contact the outer support structure through the telescopic mechanism and push the image sensor chip package upward by a certain distance.

10. The chip testing fixture according to claim 6, wherein, The test board is provided with a hole structure; the telescopic mechanism reciprocates in the hole structure.

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