Semiconductor chip test seat and test method thereof

Abstract

The invention relates to the technical field of chip testing, in particular to a semiconductor chip testing seat which comprises a base, guide columns are vertically and fixedly connected to the four corners of the upper end face of the base, a top seat is fixedly connected to the tops of the guide columns, a lifting plate is arranged between the base and the top seat, and the guide columns penetrate through the lifting plate and are movably connected with the lifting plate. A movable groove is formed in the lifting plate, a test seat is movably connected into the movable groove, electric push rods are symmetrically arranged at the positions, located on the two sides of the test seat, of the bottom of the lifting plate, the bottoms of the electric push rods are fixed to the upper end face of the base, and the top output ends of the electric push rods are fixedly connected with the lifting plate through screws; the lifting plate is formed by connecting and fixing two groups of plate bodies with the same structure through screws; according to the invention, the turnover test seat is designed, and through the two test grooves with different sizes on the test seat, the test work of chips with different sizes can be realized, so that the test work of the chips with different sizes by a user is satisfied, the test seat does not need to be replaced, and the use efficiency of the device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and particularly relates to a semiconductor chip test socket and a test method thereof. Background Art

[0002] In the research and development and large-scale production processes of semiconductor chips, various performances of the chips need to be tested. The chip test socket is a key component in the test device. The function of the test socket is to position and clamp the chip and transmit electronic signals and current between the circuit boards. The quality of its function directly affects the reliability and accuracy of chip testing. With the increasing operating speed of chips and the reduction of the size of electronic products, the requirements for the performance of the test socket are also increasing day by day;

[0003] The utility model with the publication number of CN216485152U specifically discloses a semiconductor chip test socket, which includes a base, a support rod, a test bench and two groups of threaded pipes. The tops of the two groups of threaded rods are respectively connected to the left and right sides of the bottom end of the placement plate; it also includes an exhaust fan, a temperature sensor and multiple groups of electric heating rods. The covering plate is connected to the placement plate through a spring. A through groove is arranged in the covering plate, and its opening and closing are controlled by a movable door. The exhaust fan and multiple groups of electric heating rods are both arranged in the through groove, and the exhaust fan and multiple groups of electric heating rods are located on both sides of the through groove; a metal coating covers the inner wall of the pin holes on the test socket. By using this chip test socket, the gap between the outer diameter of the needle body of the spring probe and the pin holes can be eliminated, so the possibility of misalignment between the needle tip of the spring probe and the chip pins is greatly reduced;

[0004] Although this device can quickly increase the chip temperature through the heating device during use and make the chip heat evenly through the metal plate; and can lower the chip temperature through the electric fan and the electric door, but in the specific use process, there are several test pins distributed in the test socket used to test the chip. Once such pins are accidentally touched by an object or irregularly squeezed by force during subsequent use, the pins are extremely easy to deform and be damaged, and it is impossible to form contact between the pin and the chip contact point during subsequent use, and thus the normal test work of the chip cannot be realized. Summary of the Invention

[0005] The purpose of the present invention is to provide a semiconductor chip test socket and a test method thereof. By designing a test socket that can be flipped, through two test slots with different sizes on the test socket, the test work of chips with different sizes can be realized, so as to meet the test work of chips with different sizes for users without replacing the test socket, and improve the use efficiency of the device, so as to solve the problems raised in the above background art.

[0006] To achieve the above object, the present invention provides the following technical solution: A semiconductor chip test socket, including a base, at the four corners of the upper end surface of the base, guide columns are vertically and fixedly connected. The top of the guide column is fixedly connected with a top seat. A lifting plate is arranged between the base and the top seat, and the guide column penetrates through the lifting plate and is movably connected with the lifting plate. An activity groove is opened inside the lifting plate, and a test socket is movably connected inside the activity groove. At both sides of the test socket at the bottom of the lifting plate, electric push rods are symmetrically arranged, and the bottom of the electric push rod is fixedly connected with the upper end surface of the base. The top output end of the electric push rod is fixedly connected with the lifting plate by screws. The lifting plate is fixedly connected by screwing two plate bodies with the same structure;

[0007] Both the upper end surface and the lower end surface of the test socket are provided with test grooves. The sizes of the two test grooves are different. Probes are evenly distributed and fixed in the two test grooves, and cable interfaces connected to the probes are opened at the positions on one side of the test grooves on the upper end surface and the lower end surface of the test socket. A protection structure is arranged in the test groove.

[0008] Preferably, a pressing head is fixedly connected to the lower end surface of the top seat by screws, and the pressing head is designed in a convex shape and matches the test groove.

[0009] Preferably, a protection plate is movably connected in the test groove, and extension holes are opened through the surface of the protection plate corresponding to the probes. Sliders are symmetrically fixed on both sides of the protection plate, and sliding grooves are opened on the inner wall of the test groove. The sliders are displaced inside the sliding grooves and are slidably connected with the sliding grooves.

[0010] Preferably, a spring is fixedly connected between the slider and the sliding groove. Rotating shafts are symmetrically fixed on both sides of the test socket and penetrate through the inner wall of the activity groove and are rotatably connected with the activity groove.

[0011] Preferably, an electromagnet is embedded at the position corresponding to the rotating shaft on the inner wall of the activity groove, and the rotating shaft is made of magnetic metal material.

[0012] Preferably, dust exhaust slot openings communicating with the inside of the test socket are opened on both sides of the test socket, and the dust exhaust operation is located between the test groove and the protection plate and corresponds to the root of the probe.

[0013] Preferably, buffer rubber rings are embedded at the positions around the openings of the test grooves on the upper end surface and the lower end surface of the test socket, and the inside of the buffer rubber ring is a vacuum structure and is made of hard rubber.

[0014] Preferably, an air duct is opened inside the test socket, one end of the air duct is connected to the hollow structure inside the buffer rubber ring, and the other end is opened between the protection plate and the bottom of the test groove.

[0015] A testing method for a semiconductor chip test socket, comprising the following steps:

[0016] S1. According to the size of the chip to be tested, select the corresponding test slot on the test socket, and flip the test socket by 180 degrees so that the test slot on the test socket with the corresponding size has an upward opening and corresponds to the convex-shaped extrusion head at the lower end face of the top seat;

[0017] S2. The user places the chip to be tested in the test slot, the bottom of the chip contacts the protection plate, and the bottom contacts of the chip do not contact the probes in the test slot under the block of the protection plate;

[0018] S3. The user controls the electric push rod to drive the lifting plate to move upward through a controller externally connected to the electric push rod. The lifting plate further stably carries the test socket and the chip in the test slot in the test socket upward through the guide posts until the top of the chip contacts the bottom of the extrusion head. Subsequently, the chip continues to move upward. Under the extrusion of the extrusion head, the chip relatively squeezes the protection plate downward and moves in the test slot of the test socket. At this time, the probes in the test slot relatively move upward and contact and connect with the contact points at the bottom of the chip through the extension holes. Subsequently, the outside tests the chip through the cable connected to the cable interface to test whether the chip operates normally. Secondly, a heating plate is built into the extrusion head, and the extrusion head is heated by the heating plate, and the extrusion head conducts heat to heat the chip, so as to record and test the operation data of the chip under high-temperature conditions;

[0019] S4. During the test, the electromagnet conducts electricity and operates, and the magnetic force generated by the electromagnet magnetically attracts the rotating shaft to keep the test socket in the movable slot horizontal and stable. Secondly, the magnetic force penetrates the test socket and acts on the chip, and the operation of the chip in the magnetic field environment can be tested;

[0020] S5. Before the extrusion head contacts the chip, it first contacts the buffer rubber ring around the opening of the test slot at the top of the test socket. Through the elastic deformation of the buffer rubber ring, the impact force of the upward movement of the lifting plate and the extrusion head is buffered, avoiding the chip from being damaged by instant contact with the extrusion head. Secondly, during the process of the buffer rubber ring being squeezed by the extrusion head, the gas in the internal hollow structure will be transported to the test slot through the air duct to blow the test slot. The gas is discharged through the dust discharge slot and the gap of the movable slot, so as to realize the blowing and cleaning of the dust in the test slot and avoid the accumulation of dust affecting the test effect. There are air holes on the surface of the buffer rubber ring, and the air holes and the air duct are provided with one-way valves to maintain the gas flow direction.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] 1. In this application, by designing a test socket that can be flipped, through two test slots with different sizes on the test socket, the testing work of chips with different sizes can be realized, so as to meet the user's testing work of chips with different sizes, without replacing the test socket, and improve the use efficiency of the device;

[0023] 2. During the chip testing process of this application, it can achieve the protection of the contact buffer between the chip and the extrusion head and the protection of the probes in the test socket, avoid the damage caused by accidental contact of the probes, and thus delay the service life of the device and the yield rate of the chips.

[0024] 3. This application can achieve the test work of the normal operation of the chip, the high-temperature environment of the chip, and the anti-magnetism of the chip, and improve the diversity of chip testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0026] Figure 1 It is the overall structure view of the present invention;

[0027] Figure 2 It is the front sectional view of the lifting plate of the present invention;

[0028] Figure 3 It is the structure view of the test socket of the present invention;

[0029] Figure 4 It is the structure view of the test socket and the protection plate of the present invention;

[0030] Figure 5 It is of the present invention Figure 2 The enlarged view of part A.

[0031] Explanation of the reference numerals in the drawings:

[0032] 1. Base; 2. Guide post; 3. Lifting plate; 31. Movable groove; 32. Electromagnet; 4. Top seat; 5. Electric push rod; 6. Test socket; 61. Rotating shaft; 62. Buffer rubber ring; 63. Dust discharge slot; 64. Protection plate; 65. Extension hole; 66. Slide groove; 67. Probe; 68. Slide block; 69. Spring; 7. Extrusion head; 8. Air duct. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0034] Please refer to Figures 1 to 5 , the present invention provides a technical solution:

[0035] A semiconductor chip test socket 6, comprising a base 1, four corners of the upper end face of the base 1 are vertically and fixedly connected with guide posts 2, the top of the guide posts 2 is fixedly connected with a top seat 4, a lifting plate 3 is arranged between the base 1 and the top seat 4, and the guide posts 2 penetrate through the lifting plate 3 and are movably connected with the lifting plate 3. An activity groove 31 is opened inside the lifting plate 3, a test socket 6 is movably connected inside the activity groove 31, electric push rods 5 are symmetrically arranged on both sides of the test socket 6 at the bottom of the lifting plate 3, and the bottom of the electric push rods 5 is fixedly connected with the upper end face of the base 1. The top output end of the electric push rod 5 is fixedly connected with the lifting plate 3 by screws. The lifting plate 3 is fixedly connected by screwing two identical plate bodies;

[0036] Test grooves are opened on both the upper end face and the lower end face of the test socket 6. The sizes of the two test grooves are different. Probes 67 are evenly distributed and fixed in the two test grooves. Cable interfaces connected to the probes 67 are opened at positions on both the upper end face and the lower end face of the test socket 6 on one side of the test groove. A protection structure is arranged in the test groove.

[0037] Specifically, a pressing head 7 is fixedly connected to the lower end face of the top seat 4 by screws, and the pressing head 7 is designed in a convex shape and matches the test groove.

[0038] Specifically, a protection plate 64 is movably connected in the test groove, and extension holes 65 are opened at positions corresponding to the probes 67 on the surface of the protection plate 64. Sliders 68 are symmetrically fixed on both sides of the protection plate 64. Slide grooves 66 are opened on the inner wall of the test groove. The sliders 68 are displaced inside the slide grooves 66, and the sliders 68 are slidably connected with the slide grooves 66.

[0039] Specifically, a spring 69 is fixedly connected between the slider 68 and the slide groove 66. Rotating shafts 61 are symmetrically fixed on both sides of the test socket 6, and the rotating shafts 61 penetrate through the inner wall of the activity groove 31 and are rotatably connected with the activity groove 31.

[0040] Specifically, electromagnets 32 are embedded at positions corresponding to the rotating shafts 61 on the inner wall of the activity groove 31, and the rotating shafts 61 are made of magnetic metal material.

[0041] Specifically, dust exhaust slots 63 communicating with the inside of the test socket 6 are opened on both sides of the test socket 6. The dust exhaust operation is located between the test groove and the protection plate 64 and corresponds to the roots of the probes 67.

[0042] Specifically, buffer rubber rings 62 are embedded and connected to the positions around the opening of the test slot on the upper and lower end faces of the test base 6, and the interior of the buffer rubber rings 62 is a vacuum structure, and the buffer rubber rings 62 are made of hard rubber.

[0043] Specifically, an air channel 8 is opened in the test base 6, and one end of the air channel 8 is connected to the hollow structure inside the replacement rubber ring, and the other end of the opening is located between the protective plate 64 and the bottom of the test slot.

[0044] A testing method for a semiconductor chip test base 6 includes the following steps:

[0045] S1. According to the size of the chip to be tested, select the corresponding test slot on the test base 6, and flip the test base 6 by 180 degrees so that the opening of the test slot on the test base 6 with the corresponding size faces upward and corresponds to the convex-shaped extrusion head 7 on the lower end face of the top base 4;

[0046] S2. The user places the chip to be tested in the test slot, the bottom of the chip contacts the protective plate 64, and the bottom electrical contacts of the chip do not contact the probes 67 in the test slot under the blockage of the protective plate 64;

[0047] S3. The user controls the electric push rod 5 to drive the lifting plate 3 to move upward through an external controller connected to the electric push rod 5. The lifting plate 3 further stably carries the test base 6 and the chip in the test slot in the test base 6 upward through the guide posts 2 until the top of the chip contacts the bottom of the extrusion head 7. Subsequently, the chip continues to move upward. Under the extrusion of the extrusion head 7, the chip relatively squeezes the protective plate 64 downward in the test slot of the test base 6. At this time, the probes 67 in the test slot move upward relatively and contact and connect with the contact points at the bottom of the chip through the extension holes 65. Subsequently, the outside tests the chip through the cable connected to the cable interface to test whether the chip operates normally. Secondly, a heating plate is built into the extrusion head 7, and the extrusion head 7 is heated by the heating plate, and the extrusion head 7 conducts heat to heat the chip, so as to record and test the operating data of the chip under high temperature conditions;

[0048] S4. During the test, the electromagnet 32 conducts electricity and operates, and the electromagnet 32 generates magnetic force to magnetically attract the rotating shaft 61 to keep the test base 6 in the movable slot 31 horizontal and stable. Secondly, the magnetic force penetrates the test base 6 and acts on the chip, and the operation of the chip in a magnetic field environment can be tested;

[0049] S5. Before the extrusion head 7 contacts the chip, it first contacts the buffer rubber ring 62 around the opening of the test slot at the top of the test socket 6. Through the elastic deformation of the buffer rubber ring 62, the impact force of the lifting plate 3 moving upward and colliding with the extrusion head 7 is buffered, avoiding the chip being damaged by extrusion due to the instantaneous contact between the chip and the extrusion head 7. Secondly, during the process of the buffer rubber ring 62 being extruded by the extrusion head 7, the gas in the internal hollow structure will be transported to the test slot through the air duct 8 to blow the test slot. The gas is discharged through the gap between the dust discharge slot 63 and the movable slot 31, thereby realizing the blowing and cleaning of the dust in the test slot and avoiding the accumulation of dust affecting the test effect. The surface of the buffer rubber ring 62 is provided with air holes, and the air holes and the one-way valve in the air duct 8 maintain the gas flow direction.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor chip test socket, comprising a base (1), characterized in that: At the four corners of the upper end face of the base (1), guide columns (2) are vertically and fixedly connected. The top of the guide column (2) is fixedly connected with a top seat (4). A lifting plate (3) is arranged between the base (1) and the top seat (4), and the guide column (2) passes through the lifting plate (3) and is movably connected with the lifting plate (3). An activity groove (31) is formed inside the lifting plate (3). A test seat (6) is movably connected inside the activity groove (31). Electric push rods (5) are symmetrically arranged on both sides of the test seat (6) at the bottom of the lifting plate (3), and the bottom of the electric push rod (5) is fixed to the upper end face of the base (1). The top output end of the electric push rod (5) is fixedly connected to the lifting plate (3) by screws. The lifting plate (3) is fixedly connected by screws with two identical plate bodies; Test grooves are formed on both the upper end face and the lower end face of the test seat (6). The sizes of the two test grooves are different. Probes (67) are evenly distributed and fixed in the two test grooves. Cable interfaces connected to the probes (67) are formed at positions on one side of the test grooves on the upper end face and the lower end face of the test seat (6). A protection structure is arranged in the test grooves.

2. The semiconductor chip test socket according to claim 1, characterized in that: A pressing head (7) is fixedly connected to the lower end face of the top seat (4) by screws, and the pressing head (7) is designed in a convex shape and matches the test groove.

3. The semiconductor chip test socket according to claim 2, wherein: A protection plate (64) is movably connected in the test groove. Extension holes (65) are formed through the surface of the protection plate (64) at positions corresponding to the probes (67). Sliders (68) are symmetrically fixed on both sides of the protection plate (64). Sliding grooves (66) are formed on the inner wall of the test groove. The sliders (68) are displaced inside the sliding grooves (66), and the sliders (68) are slidably connected with the sliding grooves (66).

4. The semiconductor chip test socket according to claim 3, characterized in that: A spring (69) is fixedly connected between the slider (68) and the sliding groove (66). Rotating shafts (61) are symmetrically fixed on both sides of the test seat (6), and the rotating shafts (61) penetrate through the inner wall of the activity groove (31) and are rotatably connected with the activity groove (31).

5. A semiconductor chip test socket according to claim 4, characterized in that: Electromagnets (32) are embedded at positions corresponding to the rotating shafts (61) on the inner wall of the activity groove (31), and the rotating shafts (61) are made of magnetic metal materials.

6. The semiconductor chip test socket according to claim 5, wherein: Dust discharge slots (63) communicating with the inside of the test seat (6) are formed on both sides of the test seat (6). The dust discharge operation is located between the test groove and the protection plate (64) and corresponds to the roots of the probes (67).

7. A semiconductor chip test socket according to claim 6, characterized in that: Buffer rubber rings (62) are embedded at positions around the openings of the test grooves on the upper end face and the lower end face of the test seat (6). The inside of the buffer rubber rings (62) is a vacuum structure, and the buffer rubber rings (62) are made of hard rubber.

8. A semiconductor chip test socket according to claim 7, characterized in that: An air duct (8) is formed inside the test seat (6). One end of the air duct (8) is connected to the hollow structure inside the replacement rubber ring, and the other end opens between the protection plate (64) and the bottom of the test groove.

9. A test method for a semiconductor chip according to any one of claims 1-8, characterized in that: Including the following steps: S1. According to the size of the chip to be tested, select the corresponding test slot on the test socket (6), and flip the test socket (6) by 180 degrees so that the test slot on the test socket (6) with the corresponding size has an upward opening and corresponds to the convex-shaped extrusion head (7) on the lower end face of the top socket (4); S2. The user places the chip to be tested in the test slot, and the bottom of the chip contacts the protection plate (64). The contacts at the bottom of the chip do not contact the probes (67) in the test slot under the blockage of the protection plate (64); S3. The user controls the electric push rod (5) to drive the lifting plate (3) to move upward through a controller externally connected to the electric push rod (5). The lifting plate (3) further stably carries the test socket (6) and the chip in the test slot in the test socket (6) upward through the guide posts (2) until the top of the chip contacts the bottom of the extrusion head (7). Subsequently, the chip continues to move upward. Under the extrusion of the extrusion head (7), the chip relatively squeezes the protection plate (64) downward and moves in the test slot of the test socket (6). At this time, the probes (67) in the test slot move relatively upward and contact and connect with the contact points at the bottom of the chip through the extension holes (65). Subsequently, the outside tests the chip through the cable connected to the cable interface to test whether the chip operates normally. Secondly, a heating plate is built into the extrusion head (7), and the extrusion head (7) is heated by the heating plate, and the extrusion head (7) conducts heat to heat the chip, so as to record and test the operation data of the chip under high-temperature conditions; S4. During the test, the electromagnet (32) conducts electricity and operates. The magnetic force generated by the electromagnet (32) magnetically attracts the rotating shaft (61) to keep the test socket (6) in the movable slot (31) horizontal and stable. Secondly, the magnetic force penetrates the test socket (6) and acts on the chip to test whether the chip operates well in a magnetic field environment; S5. Before the extrusion head (7) contacts the chip, it first contacts the buffer rubber ring (62) around the opening of the top test slot of the test socket (6). Through the elastic deformation of the buffer rubber ring (62), the impact force of the upward movement of the lifting plate (3) and the extrusion head (7) is buffered to avoid damage to the chip caused by the instantaneous contact between the chip and the extrusion head (7). Secondly, during the process of the buffer rubber ring (62) being squeezed by the extrusion head (7), the gas in the internal hollow structure will be transported to the test slot through the air duct (8) to blow the test slot. The gas is discharged through the dust discharge slot (63) and the gap of the movable slot (31), so as to realize the blowing and cleaning of the dust in the test slot and avoid the accumulation of dust affecting the test effect. The surface of the buffer rubber ring (62) is provided with air holes, and the air holes and the air duct (8) are internally provided with one-way valves to maintain the gas flow direction.

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