Transformer temperature field analysis method and device, electronic equipment and storage medium
By constructing a transformer simulation model, the equivalent thermal conductivity coefficient calculation of the unit set is solved, and the problem of complex modeling and large calculations of the transformer temperature field simulation is improved, and the analysis speed and accuracy are improved.
Patent Information
- Application Number
- CN202510277300.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-10
- Publication Date
- 2025-07-18
AI Technical Summary
Transformer temperature field simulation problems are complicated, large calculations and slow analysis speed.
A transformer simulation model is constructed, and a set of numbers are connected to adjacent units is formed, decomposed into basic shapes, equivalent thermal conductivity coefficient is calculated, and the temperature field is obtained through secondary numbering.
It reduces the computational volume and complexity, and improves the efficiency and accuracy of transformer temperature field analysis.
Smart Images
Figure CN120337497A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of power equipment simulation, and particularly to a method, device, electronic device and storage medium for analyzing the temperature field of a transformer. Background Technique
[0002] Currently, it is a period of integrated development of energy and digital revolution. As the core hub of the energy industry, the digital transformation of the power system is very necessary. As a key digital technology, digital twin can map various original states of power equipment into a virtual information space through data acquisition, storage and simulation analysis, and realize the control and prediction of equipment states through the virtual model of physical equipment. Numerical simulation technology is the core technology for generating digital twins of physical entities. The digital twin of power equipment constructed based on temperature field simulation is the key to solving the thermal problem among the three major problems of heat, force and electromagnetism of power equipment. As the most important physical property parameter that needs to be set for temperature field simulation, when the thermal conductivity coefficient is set inconsistently with the actual situation, it will lead to a large error between the model calculation result and the actual situation. To construct an accurate digital twin, the thermal conductivity coefficient of each component of the simulation model needs to be accurately set.
[0003] Due to internal insulation requirements and other reasons, power equipment has a large number of small-sized components similar to the enameled wire insulation layer. When modeling the temperature field simulation, the modeling at small-sized components is complex, the number of mesh nodes is large, and the element density is high. In addition, the periodic distribution of small-sized components inside the power equipment makes the overall complexity of the model high, the calculation amount large, and the convergence poor. In a transformer, the windings are periodically distributed. There is an insulation layer on the enameled wire of the winding, and there is insulating paper between the enameled wires. The size of the insulation layer is extremely small. When performing refined modeling, even when the finite element coarsens the mesh, the single-phase winding can generate millions of elements, and the whole transformer will have tens of millions of elements. The calculation is complex, the operation amount is large, and the analysis speed is slow. Summary of the Invention
[0004] The main purpose of the present invention is to provide a method, device, electronic device and storage medium for analyzing the temperature field of a transformer, which can solve the problems of complex simulation modeling, large calculation amount and slow analysis speed of the transformer temperature field.
[0005] To achieve the above object, the first aspect of the present application provides a method for analyzing the temperature field of a transformer, the method comprising:
[0006] Construct a transformer simulation model, the transformer simulation model includes a plurality of units; number each unit once, and obtain unit coordinates, unit positions, unit attributes and unit parameters;
[0007] Obtain the primary numbers, unit coordinates, unit positions, unit attributes, and unit parameters of each unit, and connect adjacent units with the same unit parameters into a unit set;
[0008] Decompose the shape of the unit set into basic shapes, sort each unit in the basic shapes according to the unit positions, and calculate the equivalent thermal conductivity of each basic shape. Obtain the temperature field of each basic shape according to the calculated equivalent thermal conductivity;
[0009] Obtain the coordinates of each basic shape, perform secondary numbering according to the positions of each basic shape, calculate the equivalent thermal conductivity of the unit set, obtain the temperature field of each unit set according to the calculated equivalent thermal conductivity, and input the temperature fields of each unit set into the transformer simulation model to obtain transformer temperature field information.
[0010] Optionally, before numbering each unit for the first time, the method further includes:
[0011] Perform mesh division on the transformer simulation model into the multiple units, and each unit is a cube;
[0012] Place the transformer simulation model in a coordinate system, and correspond the actual size of the transformer simulation model to the coordinates of the coordinate system.
[0013] Optionally, the unit attributes include fluid and solid, and the unit parameters include temperature, equivalent thermal conductivity, displacement, stress, and material type.
[0014] Optionally, the material type, equivalent thermal conductivity, displacement, and stress in each unit of each unit set are the same;
[0015] The basic shapes include linear, arc, and cube.
[0016] Optionally, the calculation formula for the equivalent thermal conductivity includes:
[0017]
[0018] where K ij is the thermal conductivity matrix, Y is the volume of the unit set, and N is the shape function.
[0019] Optionally, the expression for the temperature field is:
[0020] T(x,y,z) = [S]{T} i ;
[0021] S = [S1, S2, …, S i , …, S n ;
[0022] Among them, [S] is the shape function matrix for calculating the vertex coordinates corresponding to each unit, and {T} i is the magnitude value of the characteristic temperature field of each node, and n represents the number of nodes.
[0023] Optionally, the method further includes:
[0024] Calibrate the position of the basic shape in the transformer simulation model through the secondary numbering letter, and analyze to obtain the distribution law of the basic shape.
[0025] The second aspect of the present application provides a transformer temperature field analysis device, including:
[0026] A construction module for constructing a transformer simulation model, the transformer simulation model including a plurality of units; numbering each unit once, and obtaining unit coordinates, unit positions, unit attributes, and unit parameters;
[0027] A connection module for obtaining the first numbering, unit coordinates, unit positions, unit attributes, and unit parameters of each unit, and connecting adjacent units with the same unit parameters into a unit set;
[0028] A decomposition calculation module for decomposing the shape of the unit set into basic shapes, sorting each unit in the basic shapes according to the unit position, calculating the equivalent thermal conductivity of each basic shape, and obtaining the temperature field of each basic shape according to the calculated equivalent thermal conductivity;
[0029] A temperature field calculation module for obtaining the coordinates of each basic shape, performing secondary numbering according to the positions of each basic shape, calculating the equivalent thermal conductivity of the unit set, obtaining the temperature field of each unit set according to the calculated equivalent thermal conductivity, and inputting the temperature fields of each unit set into the transformer simulation model to obtain transformer temperature field information.
[0030] Optionally, the above construction module is further used for:
[0031] Before numbering each unit once above, dividing the above transformer simulation model into the above-mentioned multiple units by mesh, and each unit is a cube;
[0032] Placing the above transformer simulation model in a coordinate system, and corresponding the actual size of the above transformer simulation model to the coordinates of the coordinate system.
[0033] Optionally, the above unit attributes include fluid and solid, and the above unit parameters include temperature, equivalent thermal conductivity, displacement, stress, and material type.
[0034] Optionally, the material type, equivalent heat conduction coefficient, displacement, and stress in each cell of each cell set are the same;
[0035] The above basic shapes include straight lines, arcs, and cubes.
[0036] Optionally, the calculation formula for the above equivalent heat conduction coefficient includes:
[0037]
[0038] where K ij is the heat conduction coefficient matrix, Y is the volume of the cell set, and N is the shape function.
[0039] Optionally, the expression for the above temperature field is:
[0040] T(x,y,z) = [S]{T} i ;
[0041] S = [S1, S2, …, S i , …, S n ;
[0042] where [S] is the shape function matrix calculated from the corresponding vertex coordinates of each cell, and {T} i is the magnitude value of the characteristic temperature field of each node, and n represents the number of nodes.
[0043] Optionally, it further includes an analysis module for calibrating the position of the basic shape in the above transformer simulation model through the above secondary numbering information and analyzing to obtain the distribution law of the above basic shape.
[0044] The third aspect of this application provides an electronic device, including a memory and a processor. When the computer program stored in the memory is executed by the processor, the processor is caused to execute the steps of the first aspect and any possible implementation manner thereof.
[0045] The fourth aspect of this application provides a computer-readable storage medium storing a computer program, which when executed by a processor causes the processor to execute each step in the method described in the first aspect.
[0046] The present application provides a method for analyzing the temperature field of a transformer. By constructing a transformer simulation model, the transformer simulation model includes a plurality of units; numbering each unit once, and obtaining unit coordinates, unit positions, unit attributes, and unit parameters; obtaining the first numbers, unit coordinates, unit positions, unit attributes, and unit parameters of each unit, and connecting adjacent units with the same unit parameters into a unit set; decomposing the shape of the unit set into basic shapes, sorting each unit in the basic shapes according to the unit positions, and calculating the equivalent thermal conductivity of each basic shape, obtaining the temperature field of each basic shape according to the calculated equivalent thermal conductivity; obtaining the coordinates of each basic shape, and performing a second numbering according to the positions of each basic shape, calculating the equivalent thermal conductivity of the unit set, obtaining the temperature field of each unit set according to the calculated equivalent thermal conductivity, and inputting the temperature fields of each unit set into the transformer simulation model to obtain transformer temperature field information; it can reduce the amount of calculation and the complexity of calculation, without calculating the temperature field of each unit, and improve the efficiency and accuracy of transformer temperature field analysis. BRIEF DESCRIPTION OF THE DRAWINGS
[0047] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0048] Among them:
[0049] Figure 1 is a schematic flow chart of a method for analyzing the temperature field of a transformer provided by an embodiment of the present application;
[0050] Figure 2 is a schematic structural diagram of a device for analyzing the temperature field of a transformer provided by an embodiment of the present application;
[0051] Figure 3 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0052] In order to enable those skilled in the art to better understand the solutions of the present application, the following will clearly and completely describe the technical solutions in the embodiments of the present application in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, rather than all embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.
[0053] The terms "first", "second", etc. in the description, claims and the above-mentioned drawings of the present application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.
[0054] Referring to "embodiment" herein means that a specific feature, structure or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The phrase appears in various places in the description and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.
[0055] Obtaining temperature field information through a transformer simulation model involved in the embodiments of the present application is a complex process, which may involve technologies such as heat conduction theory, finite element analysis (FEA), and computational fluid dynamics (CFD). Obtaining temperature field information in the transformer simulation model is of great significance for the thermal design, performance evaluation and fault diagnosis of transformers.
[0056] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.
[0057] Please refer to Figure 1 , which is a schematic flowchart of a method for analyzing the temperature field of a transformer provided by an embodiment of the present application. As Figure 1 shown, the method includes:
[0058] 101. Construct a transformer simulation model, where the above-mentioned transformer simulation model includes multiple units; number each unit once, and obtain unit coordinates, unit positions, unit attributes, and unit parameters.
[0059] The execution subject of the method in the embodiments of the present application can be a device for analyzing the temperature field of a transformer, and in practical applications, it can specifically be an electronic device.
[0060] Optionally, the above-mentioned unit attributes include fluids and solids, and the above-mentioned unit parameters include temperature, equivalent thermal conductivity, displacement, stress, and material type.
[0061] In an alternative embodiment, before numbering each unit as described above, the method further includes:
[0062] Divide the above transformer simulation model into the above-mentioned multiple units, and each unit is a cube;
[0063] Place the above transformer simulation model in a coordinate system, and correspond the actual size of the above transformer simulation model to the coordinates of the coordinate system.
[0064] 102. Obtain the primary numbers, unit coordinates, unit positions, unit attributes, and unit parameters of the above units, and connect the adjacent units with the same above unit parameters into a unit set.
[0065] In the embodiment of the present application, the units in each unit set are of the same material, and the equivalent thermal conductivity, displacement, and stress are the same, which is beneficial to analyzing the shape of the unit set.
[0066] 103. Decompose the shape of the above unit set into basic shapes, sort the units in the above basic shapes according to the above unit positions, and calculate the equivalent thermal conductivity of each basic shape. Obtain the temperature field of each basic shape according to the calculated equivalent thermal conductivity.
[0067] In the embodiment of the present application, decomposing the unit set into basic shapes to calculate the equivalent thermal conductivity of the unit set, and obtaining the temperature field of each unit set according to the calculated equivalent thermal conductivity is beneficial to reducing the amount of calculation and the computational complexity, and there is no need to calculate the temperature field of each unit.
[0068] Specifically, the expression of the equivalent thermal conductivity is
[0069]
[0070] where, K ij is the thermal conductivity matrix, Y is the volume of the unit set, and N is the shape function.
[0071] The shape function corresponding to the unit can be calculated from the vertex coordinates of the unit. Then, using the known temperatures at each point at the vertices of the unit, the temperature field inside each unit etc. can be expressed by the shape function and the temperature values at the corresponding vertices of the unit. For example, the temperature field can be expressed as:
[0072] T(x,y,z)=[S]{T} i
[0073] S=[S1,S2,…,S i ,…,S n
[0074] where, [S] is the shape function matrix calculated from the vertex coordinates corresponding to each unit, {T} i is the magnitude value of the characteristic temperature field of each node, and n represents the number of nodes.
[0075] The equivalent thermal conductivity expression can then be expressed in terms of the shape function as follows:
[0076]
[0077] For arbitrary p(y), let p(y) = 1, then the equivalent thermal conductivity expression is further expressed as:
[0078]
[0079] Introduce the B matrix and transform the above equation into:
[0080] [G]{N(y)} i ={F} i
[0081] The expressions for the total temperature stiffness matrix and the thermal load matrix are as follows:
[0082] [G]=∫ Y [B] T [K][B]dY
[0083] {F} i =∫ Y [B] T [K]dY
[0084] Where [K] is the thermal conductivity matrix, [G] is the total temperature stiffness matrix, and [F] is the thermal load matrix.
[0085] In finite element analysis, N(y) usually represents the shape function, which is an interpolation function defined inside the element and is used to interpolate the nodal values (such as temperature, displacement, etc.) of the element to any point inside the element. The role of the shape function N(y) is to represent the field variables inside the element as a linear combination of nodal values. By using the shape function, the finite element method can effectively solve complex heat conduction problems and obtain the accurate nodal temperature distribution.
[0086] In the embodiments of the present application, the shape function is also used to construct the total temperature stiffness matrix [G] and the thermal load vector {F}, and these matrices and vectors describe the thermophysical properties and thermal loads of the element.
[0087] The total temperature stiffness matrix is a core matrix in the heat conduction problem, which contains the thermophysical properties and geometric information of the system. In the finite element method, this matrix is assembled by assembling the local stiffness matrices of each element.
[0088] The thermal load matrix contains the thermal load information in the system, and these loads may be caused by external heat sources, heat flux boundary conditions, or initial temperature distributions.
[0089] The total temperature stiffness matrix and the thermal load matrix are fundamental tools in finite element analysis for simulating and analyzing heat conduction problems. Together, they form the heat balance equation. By solving this equation, the nodal temperature distribution of the system can be obtained, and then heat effects such as thermal stress and thermal deformation can be analyzed. The construction and solution of these two matrices are key steps in heat conduction analysis and are crucial for understanding and predicting the thermal behavior of the system.
[0090] The p(y) mentioned in the above steps is an arbitrary function used as a test function in the integral expression. In the finite element method, test functions are usually used to apply the weighted residual method (such as the Galerkin method), which is a technique for establishing finite element equations.
[0091] When p(y) = 1, it means that a constant function is chosen as the test function. This choice simplifies the integral expression because it eliminates the need for the derivative of the test function.
[0092] In finite element analysis, the B matrix (also known as the shape function derivative matrix or the strain-displacement matrix) is a very important matrix that plays a key role in the analysis of problems such as structural mechanics and heat conduction. The B matrix is used to convert nodal displacements (or temperature changes) into strains (or temperature gradients) within the element. For heat conduction problems, the B matrix is usually defined as a set of spatial derivatives of the shape functions. Specifically, if N i is the shape function, then the elements of the B matrix are the derivatives of the shape function with respect to the spatial coordinates.
[0093] 104. Obtain the coordinates of each basic shape, perform secondary numbering according to the positions of each basic shape, calculate the equivalent heat conduction coefficient of the above unit set, obtain the temperature field of each unit set based on the calculated equivalent heat conduction coefficient, and input the temperature fields of the above unit sets into the above transformer simulation model to obtain transformer temperature field information.
[0094] In an optional implementation, the above method further includes:
[0095] Calibrate the positions of the basic shapes in the transformer simulation model through the above secondary numbering information, and analyze to obtain the distribution law of the above basic shapes.
[0096] In the embodiments of the present application, the secondary numbering information is beneficial for calibrating the positions of the basic shapes in the transformer simulation model and observing the shapes of the basic shapes, so as to obtain the distribution law of the basic shapes; for example, the winding winding structure is formed by winding, and the iron core stacking structure is composed of the same iron core units stacked together.
[0097] Among them, the calculation of the above equivalent heat conduction coefficient and temperature field is the same as that in step 103, and will not be elaborated here.
[0098] In the embodiments of the present application, numerical methods (such as direct solvers or iterative solvers) can be used to solve algebraic equations to obtain the temperature values of each node.
[0099] Optionally, post-processing can be performed on the solution results, including visualizing the temperature distribution, calculating the hot spot temperature, evaluating the cooling effect, etc., to evaluate the thermal performance of the transformer.
[0100] Further optionally, the simulation results can be compared with experimental data or design specifications to verify the accuracy of the simulation model. Adjust the model or simulation parameters as needed to optimize the thermal design of the transformer.
[0101] In the embodiments of the present application, the unit set is decomposed into the equivalent thermal conductivity of the basic shape calculation unit set, and the temperature field of each unit set is obtained according to the calculated equivalent thermal conductivity, which is beneficial to reducing the amount of calculation and the calculation complexity, and there is no need to calculate the temperature field of each unit.
[0102] Based on the description of the foregoing method embodiments, an apparatus for analyzing the temperature field of a transformer is further provided in the embodiments of the present application.
[0103] Figure 2 It is a schematic structural diagram of an apparatus for analyzing the temperature field of a transformer provided by an embodiment of the present application.
[0104] As Figure 2 shown, the apparatus 200 for analyzing the temperature field of a transformer includes:
[0105] A construction module 210, configured to construct a transformer simulation model, where the transformer simulation model includes a plurality of units; number each unit once, and obtain unit coordinates, unit positions, unit attributes, and unit parameters;
[0106] A connection module 220, configured to obtain the first number, unit coordinates, unit positions, unit attributes, and unit parameters of each of the above units, and connect adjacent units with the same unit parameters into a unit set;
[0107] A decomposition calculation module 230, configured to decompose the shape of the unit set into basic shapes, sort each unit in the basic shapes according to the unit positions, calculate the equivalent thermal conductivity of each basic shape, and obtain the temperature field of each basic shape according to the calculated equivalent thermal conductivity;
[0108] The temperature field calculation module 240 is configured to obtain the coordinates of each basic shape, perform secondary numbering based on the positions of the basic shapes, calculate the equivalent thermal conductivity of the above unit set, obtain the temperature field of each unit set according to the calculated equivalent thermal conductivity, and input the temperature fields of the above unit sets into the above transformer simulation model to obtain transformer temperature field information.
[0109] Optionally, the above construction module 210 is further configured to:
[0110] Before the above-mentioned primary numbering of each unit, divide the above transformer simulation model into the above-mentioned multiple units by meshing, and each unit is a cube;
[0111] Place the above transformer simulation model in a coordinate system and correspond the actual size of the above transformer simulation model to the coordinates of the coordinate system.
[0112] Optionally, the above unit attributes include fluid and solid, and the above unit parameters include temperature, equivalent thermal conductivity, displacement, stress, and material type.
[0113] Optionally, the material type, equivalent thermal conductivity, displacement, and stress in the units of each unit set are the same;
[0114] The above basic shapes include straight lines, arcs, and cubes.
[0115] Optionally, the calculation formula for the above equivalent thermal conductivity includes:
[0116]
[0117] where K ij is the thermal conductivity matrix, Y is the volume of the unit set, and N is the shape function.
[0118] Optionally, the expression for the above temperature field is:
[0119] T(x,y,z) = [S]{T} i ;
[0120] S = [S1,S2,…,S i ,…,S n ;
[0121] where [S] is the shape function matrix calculated from the corresponding vertex coordinates of each unit, and {T} i is the magnitude value of the characteristic temperature field of each node, and n represents the number of nodes.
[0122] Optionally, it further includes an analysis module 250, which is configured to calibrate the positions of the basic shapes in the above transformer simulation model through the above secondary numbering information and analyze to obtain the distribution law of the above basic shapes.
[0123] In the transformer temperature field analysis device 200 in the embodiments of the present application, after dividing the transformer into independent units, the unit set is formed according to the material types, the unit set is decomposed into basic shape calculation units to calculate the equivalent thermal conductivity of the unit set, and the temperature fields of each unit set are obtained according to the calculated equivalent thermal conductivity, which is beneficial to reducing the amount of calculation, reducing the computational complexity, without calculating the temperature field of each unit, and improving the efficiency and accuracy of the transformer temperature field analysis.
[0124] It can be understood that the relevant content of each module involved in Figure 2 has been described in detail in the foregoing method embodiments, and specifically, reference can be made to the content in the method embodiments; that is Figure 2 A provided transformer temperature field analysis device 200 can execute any step in the Figure 1 shown embodiments, which will not be elaborated here.
[0125] In an embodiment of the present application, an electronic device is further proposed. Please refer to Figure 3 , Figure 3 which is a schematic structural diagram of an electronic device provided in the embodiments of the present application. As Figure 3 shown, the electronic device 300 includes a processor 301 and a memory 302. The memory 302 stores a computer program. When the computer program is executed by the processor 301, it will execute any step in the Figure 1 shown method embodiments. The electronic device 300 may further include input / output devices, etc. In a specific implementation manner, the electronic device may be a terminal device, etc.
[0126] In an embodiment, a computer-readable storage medium is further proposed. The computer-readable storage medium stores a computer program. When the computer program is executed by the processor 301, the processor 301 is caused to execute any step in the above method embodiments.
[0127] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The program can be stored in a non-volatile computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium used in the embodiments provided in the present application can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM), etc.
[0128] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.
[0129] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.
Claims
1. A method for analyzing the temperature field of a transformer, characterized in that Including: Construct a transformer simulation model, where the transformer simulation model includes multiple units; perform a first numbering on each unit, and obtain unit coordinates, unit positions, unit attributes, and unit parameters; Obtain the first numbering, unit coordinates, unit positions, unit attributes, and unit parameters of each unit, and connect adjacent units with the same unit parameters into a unit set; Decompose the shape of the unit set into basic shapes, sort each unit in the basic shapes according to the unit position, calculate the equivalent thermal conductivity of each basic shape, and obtain the temperature field of each basic shape according to the calculated equivalent thermal conductivity; Obtain the coordinates of each basic shape, perform a second numbering according to the position of each basic shape, calculate the equivalent thermal conductivity of the unit set, obtain the temperature field of each unit set according to the calculated equivalent thermal conductivity, and input the temperature fields of each unit set into the transformer simulation model to obtain transformer temperature field information.
2. The transformer temperature field analysis method according to claim 1, characterized in that Before performing the first numbering on each unit, the method further includes: Perform mesh division on the transformer simulation model into the multiple units, and each unit is a cube; Place the transformer simulation model in a coordinate system, and correspond the actual size of the transformer simulation model to the coordinates of the coordinate system.
3. The transformer temperature field analysis method according to claim 1, characterized in that, The unit attributes include fluid and solid, and the unit parameters include temperature, equivalent thermal conductivity, displacement, stress, and material type.
4. The transformer temperature field analysis method according to claim 3, wherein The material type, equivalent thermal conductivity, displacement, and stress in each unit of each unit set are the same; The basic shapes include straight line shape, arc shape, and cube.
5. The transformer temperature field analysis method according to claim 1, wherein The calculation formula of the equivalent thermal conductivity includes: where K ij is the heat conduction coefficient matrix, Y is the volume of the element set, and N is the shape function.
6. The transformer temperature field analysis method according to claim 5, characterized in that The expression of the temperature field is: T(x, y, z) = [S]{T} i ; S = [S1, S2, …, S i , …, S n ; Among them, [S] is the shape function matrix for calculating the vertex coordinates corresponding to each unit, and {T} i is the magnitude value of the characteristic temperature field of each node, and n represents the number of nodes.
7. The transformer temperature field analysis method according to claim 1, characterized in that The method further includes: Calibrate the position of the basic shape in the transformer simulation model through the second numbering information, and analyze to obtain the distribution law of the basic shape.
8. A transformer temperature field analysis device, characterized in that Including: A construction module for constructing a transformer simulation model, where the transformer simulation model includes multiple units; performing a first numbering on each unit, and obtaining unit coordinates, unit positions, unit attributes, and unit parameters; A connection module for obtaining the first numbering, unit coordinates, unit positions, unit attributes, and unit parameters of each unit, and connecting adjacent units with the same unit parameters into a unit set; A decomposition and calculation module for decomposing the shape of the unit set into basic shapes, sorting each unit in the basic shapes according to the unit position, calculating the equivalent thermal conductivity of each basic shape, and obtaining the temperature field of each basic shape according to the calculated equivalent thermal conductivity; A temperature field calculation module for obtaining the coordinates of each basic shape, performing a second numbering according to the position of each basic shape, calculating the equivalent thermal conductivity of the unit set, obtaining the temperature field of each unit set according to the calculated equivalent thermal conductivity, and inputting the temperature fields of each unit set into the transformer simulation model to obtain transformer temperature field information.
9. An electronic device, characterized in that, It includes a memory and a processor. The memory stores a computer program. When the computer program is executed by the processor, it causes the processor to execute the steps of the method according to any one of claims 1-7.
10. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by the processor, it causes the processor to execute the steps of the method according to any one of claims 1-7.