Wafer cleaning apparatus based on cleaning device and cleaning process thereof

Abstract

The application discloses a wafer cleaning device based on a cleaning device and a cleaning process, and relates to the technical field of semiconductors.The device comprises a cleaning kettle, an air flow belt surrounding the outer wall of the kettle, a supporting air pipe, a connecting air pipe, and an anti-impact barrel built-in, wherein the anti-impact barrel is provided with a multi-angle wafer cleaning assembly and a grid-shaped ventilation groove.During cleaning, the swing spray pipe with a bidirectional deflection of 30° and the fixed spray pipe work cooperatively, the annular disc rotates horizontally under the driving of the backwash force and links the bevel gear set to realize the axial rotation of the spray pipe, a dynamic vortex layer is formed to make the impact pressure decay by 70%, and the heated nitrogen gas is divided into laminar flow through the ventilation groove, and the flow rate is reduced to below 0.5 m / s.Due to the incident angle optimization, the pulse jet flow dispersion, and the flow guide grid pre-buffering mechanism, the wafer is cleaned without any dead angle in 360°, the surface micro-scratch rate is less than or equal to 0.005 / cm2, the drying uniformity deviation is less than or equal to 1.2 microns, and the energy consumption is reduced by 30%.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, in particular to a wafer cleaning device based on a cleaning device and the cleaning process. Background Art

[0002] In semiconductor manufacturing, wafer cleaning is a core process that impacts device yield. As advanced processes evolve toward sub-5nm nodes, wafer surface contamination control standards are approaching physical limits (requires residual particle size ≤ 0.1nm and density ≤ 0.001 particles / cm²). Traditional cleaning technologies face the following challenges:

[0003] 1. Existing spray cleaning equipment mostly uses a fixed nozzle array or single-axis rotary spray design. Due to the rigidity of the mechanical structure, the spray angle coverage range is narrow (the measured effective coverage angle is within ±45°), resulting in a cleaning rate of less than 85% in areas such as wafer edge grooves and the sidewalls of 3D-NAND stack structures.

[0004] 2. Although high-speed rotary spraying (>2000rpm) can enhance the penetration of the cleaning liquid through centrifugal force, the peak vertical impact pressure of the jet reaches 2.5 bar (corresponding to a wafer surface stress of 0.8 MPa), which is close to the yield strength of silicon-based materials (1.2 MPa) and can easily cause plastic deformation of nanowire structures.

[0005] 3. In the traditional hot nitrogen drying process, high-temperature nitrogen (80-120°C) is blown through a direct air duct at a flow rate of 15-20m / s to impact the wafer surface. The local airflow shear force is greater than 50Pa, which increases the risk of fracture of microstructures such as FinFET fins and GAA nanowires.

[0006] Therefore, the present invention provides a wafer cleaning device based on a cleaning device and a cleaning process to solve one or more of the above problems. Summary of the Invention

[0007] An object of the present invention is to provide a wafer cleaning device based on a cleaning device and a cleaning process thereof, so as to solve one or more problems raised in the above-mentioned background technology.

[0008] To achieve the above-mentioned purpose, the present invention provides the following technical solution: comprising: a cleaning kettle, several groups of air flow belts are arranged around the outer wall of the cleaning kettle, adjacent air flow belts are connected by supporting air pipes, two groups of supporting air pipes are connected by connecting air pipes, and the connecting air pipes are provided with air inlets, an anti-shock barrel is installed in the cleaning kettle, and a multi-angle wafer cleaning component is provided in the anti-shock barrel.

[0009] Preferably, a cleaning liquid tank is installed at the bottom of the cleaning kettle, a liquid pump is installed in the cleaning liquid tank, and the cleaning liquid tank is connected to the multi-angle wafer cleaning assembly.

[0010] Preferably, the air flow belt has a hollow structure, and the same air flow holes are opened on the two side frames of each group of air flow belts, and the supporting air pipe is connected with the air flow belt through the air flow holes. Several groups of air outlet nozzles are provided at equal intervals on the side of each group of air flow belts close to the outer wall of the cleaning kettle, and each group of air outlet nozzles extends into the cleaning kettle.

[0011] Preferably, the impact-proof barrel is installed on the bottom of the inner wall of the cleaning kettle through several groups of supporting columns. Several groups of horizontal ventilation slots and vertical ventilation slots are opened on the impact-proof barrel, and the horizontal ventilation slots and the vertical ventilation slots are arranged adjacent to each other.

[0012] Preferably, the multi-angle wafer cleaning assembly includes: an annular disk, which is installed at the bottom of the inner wall of the cleaning kettle through a protective sleeve, and the top of the protective sleeve passes through the annular disk and is rotatably connected to the annular disk. A protective cover is fixed at the top center of the annular disk, and two groups of swinging spray pipes and two groups of fixed spray pipes are provided around the outer wall of the protective cover.

[0013] Preferably, each group of swinging spray pipes is evenly provided with several groups of swinging spray heads, and the swinging spray heads on one group of swinging spray pipes are deflected 30° clockwise, and the swinging spray heads on the other group of swinging spray pipes are deflected 30° counterclockwise. Several groups of fixed spray heads are evenly provided on the fixed spray pipes, and the fixed spray heads are arranged perpendicular to the fixed spray pipes.

[0014] Preferably, the annular disk has a hollow structure, and the driving guide is movably installed in the annular disk and movably sleeved on the outer wall of the protective sleeve. A connecting pipe is installed in the protective sleeve, and the bottom of the connecting pipe is connected to the cleaning liquid tank. One end of the swinging spray pipe is movably penetrated into the protective cover and connected with the outer wall of the connecting pipe, and the other end of the swinging spray pipe is rotatably connected to the inner ring wall of the annular disk. One end of the fixed spray pipe is fixedly penetrated into the protective cover and connected with the outer wall of the connecting pipe, and the fixed spray pipe is fixedly connected to the inner ring wall.

[0015] Preferably, the driving gear and the second bevel gear are rotatably sleeved on the outer wall of the connecting tube, and the top of the driving gear is fixedly connected to the bottom of the second bevel gear, and two sets of guide gear blocks are symmetrically and movably provided in the driving guide, one end of the guide gear block is connected to the inner wall of the driving guide through a connecting spring, and a driving rack is fixedly provided on the other end of the guide gear block, and the two sets of driving racks are symmetrically arranged in the driving guide front and back, and both sets of driving racks are engaged with the driving gear.

[0016] Preferably, the outer wall of one end of the swing spray pipe extending into the protective cover is fixedly sleeved with bevel gear 1, and bevel gear 1 is meshed with bevel gear 2, and the swing spray pipe is rotatably connected to the connecting pipe.

[0017] A cleaning process for cleaning a wafer using the wafer cleaning device based on the cleaning device as described above, the cleaning process comprising:

[0018] S1: The wafer is placed in the impact-proof barrel in the cleaning kettle by a robot;

[0019] S2: Start the liquid pump in the cleaning liquid tank to draw the cleaning liquid through the connecting pipe and clean the wafer through the swinging spray pipe and the swinging spray head and the fixed spray head on the fixed spray pipe;

[0020] S3: After cleaning, the wafers are blown through a plurality of groups of air outlet nozzles provided on a plurality of groups of air flow belts to dry them.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. Coordinated coverage of bidirectional swing and fixed spray

[0023] The oscillating spray pipe forms a staggered spray angle through a 30° bidirectionally deflected oscillating spray head. Driven by the recoil force of the cleaning liquid, the annular disk rotates horizontally, so that the spray trajectory covers the periphery of the wafer. The fixed spray pipe uses a vertically set fixed spray head to perform vertical impact cleaning on the wafer surface, forming longitudinal cleaning coverage. The dynamic coordination of the two breaks through the planar limitations of traditional fixed spraying and achieves all-round coverage of three-dimensional space.

[0024] 2. Axial self-reversal mechanism driven by centrifugal force

[0025] The centrifugal force generated by the rotation of the annular disk pushes the guide gear block outward, driving the oscillating spray pipe to rotate axially to expand the spray angle. When the connecting spring is compressed to its limit, the reverse elastic force drives the swing direction to automatically reverse, forming a periodic forward and reverse rotation. This mechanism makes the spray trajectory present an alternating dynamic of spiral diffusion and contraction, eliminating the periodic blind spots of traditional rotary spraying.

[0026] 3. Dynamic coverage design with no mechanical blind spots

[0027] Compared with traditional fixed spray or single rotating spray, the bidirectional deflection angle of the oscillating spray head makes the cleaning liquid form a conical scattering surface. The composite motion trajectory of the horizontal rotation of the annular disk and the axial rotation of the spray pipe makes the cleaning liquid form a cross-covering network on the wafer surface. This design can increase the cleaning coverage rate from 85-90% of conventional equipment to more than 99.6%, especially significantly improving the cleaning efficiency of the groove structure on the edge of the wafer.

[0028] 4. Self-driven efficient cleaning and energy consumption optimization

[0029] The mechanical movement is driven solely by the recoil force of the cleaning liquid, without the need for additional motor power, reducing energy consumption by more than 30%. The dynamic balance mechanism of centrifugal force and spring force enables adaptive speed adjustment to avoid damage to the wafer surface caused by high-speed rotation. Combined with the ventilation slot structure of the impact-proof barrel, a complete protection system is formed during the cleaning and drying stages to ensure the integrity of the wafer microstructure. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a schematic diagram of the main structure of the present invention;

[0031] Figure 2 It is a schematic diagram of the cross-sectional structure of the present invention;

[0032] Figure 3 Schematic cross-sectional view of the cleaning kettle in the present invention;

[0033] Figure 4 This is a schematic diagram of the three-dimensional structure of the impact-proof barrel in the present invention;

[0034] Figure 5 This is a schematic diagram of the top view of the multi-angle wafer cleaning assembly of the present invention;

[0035] Figure 6 Schematic diagram of a partial cross-section of the structure of a multi-angle wafer cleaning assembly in the present invention;

[0036] Figure 7 It is a schematic top view of a partial structure of a multi-angle wafer cleaning assembly in the present invention;

[0037] Figure 8 It is a schematic diagram of the top view of the driving guide member in the present invention.

[0038] In the figure: 1. Cleaning kettle; 2. Air flow belt; 3. Support air pipe; 4. Connecting air pipe; 5. Air inlet; 6. Cleaning liquid tank; 7. Anti-impact barrel; 8. Multi-angle wafer cleaning component; 9. Air flow hole; 10. Air outlet nozzle; 11. Horizontal ventilation slot; 12. Vertical ventilation slot; 13. Support column; 14. Annular disk; 15. Protective sleeve; 16. Protective cover; 17. Swinging spray pipe; 18. Swinging spray head; 19. Fixed spray pipe; 20. Fixed spray head; 21. Drive guide; 22. Drive gear; 23. Bevel gear 1; 24. Connecting pipe; 25. Bevel gear 2; 26. Drive rack; 27. Guide gear block; 28. Connecting spring. DETAILED DESCRIPTION

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0040] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0041] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc., should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0042] Example 1

[0043] See also Figure 1-Figure 2 The present invention provides a technical solution, including: a cleaning kettle 1, several groups of air flow belts 2 are arranged around the outer wall of the cleaning kettle 1, adjacent air flow belts 2 are connected by supporting air pipes 3, two groups of supporting air pipes 3 are connected by connecting air pipes 4, and the connecting air pipes 4 are provided with an air inlet 5, an anti-impact barrel 7 is installed in the cleaning kettle 1, and a multi-angle wafer cleaning component 8 is provided in the anti-impact barrel 7.

[0044] Preferably, a cleaning liquid tank 6 is installed at the bottom of the cleaning kettle 1 , a liquid pump is installed in the cleaning liquid tank 6 , and the cleaning liquid tank 6 is connected to the multi-angle wafer cleaning assembly 8 .

[0045] The working principle and beneficial effects of the above technical solution are as follows: the present invention realizes the integrated operation of wafer cleaning and drying through the nested structural design of the cleaning kettle 1 and the impact-proof barrel 7. The multi-angle wafer cleaning component 8 is driven by the liquid pump of the cleaning liquid tank 6 to transport the cleaning liquid to the swing spray pipe 17 and the fixed spray pipe 19 through the connecting pipe 24. The swing spray head 18 with a 30° bidirectional deflection forms a dynamic fan-shaped spray surface, which cooperates with the vertical impact fixed spray head 20 to cover the wafer surface and edge groove; after cleaning is completed, the air flow belt 2 introduces heated nitrogen through the supporting air pipe 3 and the connecting air pipe 4, and the high-speed airflow is multi-stage divided and buffered through the horizontal ventilation slots 11 and the vertical ventilation slots 12 of the impact-proof barrel 7, and converted into low-speed laminar flow to evenly dry the wafers.

[0046] Its innovation lies in:

[0047] 1. Dual-mode function of the impact-proof barrel: It serves as a wafer positioning carrier during the cleaning phase, and reduces the airflow speed from 15m / s to below 0.5m / s during the drying phase through the horizontal ventilation slots 11 and the vertical ventilation slots 12 to avoid microstructure damage;

[0048] 2. Dynamic-static composite cleaning: The recoil force of the oscillating spray head 18 drives the annular disk 14 to rotate horizontally, synchronously linking bevel gear 1 23 and bevel gear 2 25 to achieve ±30° adaptive adjustment of the spray angle, improving the coverage efficiency by 42% compared with traditional single-axis spraying.

[0049] 3. Energy consumption optimization design: The heating wire embedded in the air flow belt 2 directly heats the nitrogen in a contact manner, with a heat conversion efficiency of 92%, which saves 28% energy compared to external heaters;

[0050] 4. Through modular collaborative control, the solution can achieve a wafer surface particle removal rate (PUR) of 99.3%, and a drying uniformity deviation of ≤1.2μm, meeting the 5nm process wafer cleaning requirements.

[0051] To sum up, the present invention achieves 360-degree cleaning of the wafer without dead angles through the innovative design of the multi-angle wafer cleaning component 8: a swinging spray pipe 17 with a bidirectional deflection of 30° and a vertically fixed spray pipe 19 are used to work together. Driven by the recoil force of the cleaning liquid, the annular disk 14 rotates horizontally to drive the bevel gear 1 23 and the bevel gear 2 25 to rotate synchronously, so that the swinging spray head 18 rotates axially synchronously. Combined with the centrifugal force and the reverse reset mechanism of the spring 28, a spiral diffusion-contraction dynamic spray trajectory is formed, breaking through the traditional spray coverage blind spot, and the cleaning coverage rate is increased to more than 99.6%; at the same time, the motor-free self-drive structure reduces energy consumption by 30%, and combined with the buffer ventilation design of the impact-proof barrel 7, the microstructure integrity of the wafer surface is guaranteed while efficient cleaning.

[0052] Example 2

[0053] Based on Example 1, please refer to Figure 1-Figure 4 The air flow belt 2 has a hollow structure. The same air flow holes 9 are opened on the two side frames of each group of air flow belts 2, and the supporting air pipe 3 is connected with the air flow belt 2 through the air flow holes 9. A number of groups of air outlet nozzles 10 are evenly spaced on the side of each group of air flow belts 2 close to the outer wall of the cleaning kettle 1, and each group of air outlet nozzles 10 extends into the cleaning kettle 1.

[0054] Preferably, the impact-proof barrel 7 is installed on the bottom of the inner wall of the cleaning kettle 1 through several groups of support columns 13. Several groups of horizontal ventilation slots 11 and vertical ventilation slots 12 are opened on the impact-proof barrel 7, and the horizontal ventilation slots 11 and the vertical ventilation slots 12 are arranged adjacent to each other.

[0055] Preferably, a heating wire is provided in the air flow belt 2 .

[0056] The working principle and beneficial effects of the above technical solution are as follows: after cleaning is completed, the nitrogen bottle is connected to the air inlet 5 through a hose, and then the nitrogen bottle is opened to transport the nitrogen along the connecting air pipe 4 through the supporting air pipe 3 to each air flow belt 2. The nitrogen is heated by the heating wire in the air flow belt 2 and then sprayed out through several groups of air outlet nozzles 10. In order to prevent the high-temperature nitrogen from directly blowing on the wafer and damaging the wafer surface, the wafer is isolated from the air outlet nozzle 10 by setting an impact-proof barrel 7, and several groups of horizontal ventilation grooves 11 and vertical ventilation grooves 12 are opened on the impact-proof barrel 7. The high-temperature nitrogen will be divided by the horizontal ventilation grooves 11 and the vertical ventilation grooves 12 to reduce the impact force of the nitrogen, so that the hot nitrogen slowly contacts the wafer to dry it.

[0057] Among them, the horizontal ventilation slots 11 and the vertical ventilation slots 12 adopt an adjacent and cross-grid layout. Figure 4 , achieving efficient buffering and uniform drying through the following mechanisms:

[0058] 1. Multi-stage airflow segmentation and kinetic energy attenuation:

[0059] After high-speed nitrogen gas is injected into the impact-resistant barrel 7 through the outlet nozzle 10 at an initial velocity of 15-20 m / s, it is first divided into parallel laminar flows by the horizontal ventilation slots 11. Vertical ventilation slots 12 then divide the laminar flows a second time, forming micron-scale vortex clusters. Experimental data shows that this structure can reduce the airflow velocity to below 0.5 m / s by 97%, and reduce the kinetic energy to 0.1% of the initial value, effectively preventing shear damage to the nanoscale structures on the wafer surface.

[0060] 2. Turbulent-laminar conversion and thermal field homogenization:

[0061] The design's dimensional difference of 0.5-1mm in transverse groove width and 2-3mm in vertical groove depth suppresses turbulence through the boundary layer effect, reducing the Reynolds number from an initial turbulent flow of >5000 to laminar flow of <100. Furthermore, the maze-like path formed by the intersecting grooves extends the nitrogen residence time from 0.2s to 1.5s, allowing the 80-100°C heat from the heating filament to be fully transferred to the nitrogen, optimizing the standard deviation of the wafer surface temperature distribution from ±3°C to ±0.5°C.

[0062] 3. Direction randomization and impact force dispersion:

[0063] The 60°-90° angle between the horizontal and vertical slots forces the airflow to undergo multiple 90° deflections. This dissipates momentum, dispersing the concentrated impact force into multiple micro-loads, reducing the single-point pressure from 50 Pa to 0.3 Pa. Combined with the cylindrical structure of the impact-resistant barrel 7, this achieves uniform force distribution around the wafer circumference at 360°, reducing the surface dry residue variation rate (DVR) from 8% in conventional designs to 0.7%.

[0064] 4. Innovative Value: Compared with traditional straight-through air ducts, this design converts the impact energy of airflow into heat energy and micro-vibration energy through the principle of bionic honeycomb structure. While ensuring drying efficiency and drying time ≤120s, it reduces the wafer surface defect rate (DSR) to 0.02 / wafer SEM detection standard, meeting the requirements of non-destructive processing of ultra-thin stacked 3D NAND wafers.

[0065] Example 3

[0066] Based on any one of Examples 1-2, please refer to Figure 5-Figure 8 The multi-angle wafer cleaning assembly 8 includes: an annular disk 14, which is installed at the bottom of the inner wall of the cleaning kettle 1 through a protective sleeve 15, and the top of the protective sleeve 15 passes through the annular disk 14 and is rotatably connected to the annular disk 14. A protective cover 16 is fixed at the top center of the annular disk 14, and two groups of swinging spray pipes 17 and two groups of fixed spray pipes 19 are provided around the outer wall of the protective cover 16.

[0067] Preferably, each group of swinging spray pipes 17 is evenly provided with several groups of swinging spray heads 18, and the swinging spray heads 18 on one group of swinging spray pipes 17 are deflected 30° clockwise, and the swinging spray heads 18 on the other group of swinging spray pipes 17 are deflected 30° counterclockwise, and several groups of fixed spray heads 20 are evenly provided on the fixed spray pipes 19, and the fixed spray heads 20 are arranged perpendicular to the fixed spray pipes 19.

[0068] Preferably, the annular disk 14 has a hollow structure, and the driving guide 21 is movably installed in the annular disk 14 and movably sleeved on the outer wall of the protective sleeve 15. A connecting pipe 24 is installed in the protective sleeve 15, and the bottom of the connecting pipe 24 is connected to the cleaning liquid tank 6. One end of the swinging spray pipe 17 movably passes through the protective cover 16 and is connected to the outer wall of the connecting pipe 24. The other end of the swinging spray pipe 17 is rotatably connected to the inner ring wall of the annular disk 14. One end of the fixed spray pipe 19 is fixedly passed through the protective cover 16 and is connected to the outer wall of the connecting pipe 24. The other end of the fixed spray pipe 19 is fixedly connected to the inner ring wall of the annular disk 14.

[0069] Preferably, the driving gear 22 and the bevel gear 2 25 are rotatably sleeved on the outer wall of the connecting pipe 24, and the top of the driving gear 22 is fixedly connected to the bottom of the bevel gear 25. Two groups of guide gear blocks 27 are symmetrically and movably provided in the driving guide 21. One end of the guide gear block 27 is connected to the inner wall of the driving guide 21 through a connecting spring 28, and a driving rack 26 is fixedly provided at the other end of the guide gear block 27. The two groups of driving racks 26 are symmetrically arranged in the driving guide 21 front and back, and both groups of driving racks 26 are engaged with the driving gear 22.

[0070] Preferably, the outer wall of one end of the swing spray pipe 17 extending into the protective cover 16 is fixedly sleeved with a bevel gear 1 23 , and the bevel gear 1 23 is engaged with the bevel gear 2 25 , and the swing spray pipe 17 is rotatably connected to the connecting pipe 24 .

[0071] The working principle and beneficial effects of the above technical solution are as follows: during cleaning, the cleaning liquid is extracted through the connecting pipe 24 by starting the liquid pump in the cleaning liquid tank 6, and then the cleaning liquid is transported to the swinging spray pipe 17 and the fixed spray pipe 19, wherein a part of the cleaning liquid is sprayed vertically on the wafer through the fixed spray head 20 and cleaned, and the other part of the cleaning liquid is sprayed through the swinging spray head 18. At this time, since the several groups of swinging spray heads 18 on the two groups of swinging spray pipes 17 are deflected 30 degrees in opposite directions, when the cleaning liquid is sprayed through the swinging spray head 18, the cleaning liquid will have a recoil force on the swinging spray head 18, thereby driving the annular disk 14 to surround the protective sleeve 1 5 rotates. At this time, the guide gear block 27 in the driving guide member 21 is extended by the centrifugal force when the driving annular disk 14 rotates, and the inner wall of the driving guide member 21 slides outward, thereby compressing the connecting spring 28. At the same time, the driving rack 26 moves under the drive of the driving guide member 21, thereby rotating the driving gear 22. The driving gear 22 rotates while driving the bevel gear 25. The bevel gear 25 rotates while driving the two sets of bevel gears 1 23. As a result, the two sets of swing spray pipes 17 rotate axially while the annular disk 14 rotates horizontally, thereby expanding the cleaning range and achieving a 360-degree cleaning effect without dead angles.

[0072] Among them, when the connecting spring 28 is compressed to the limit, the reaction force of the connecting spring 28 is greater than the centrifugal force, thereby pushing the guide gear block 27 to slide in the opposite direction, thereby pushing the driving gear 22 to rotate in the opposite direction through the driving rack 26, and then making the axial rotation directions of the two sets of swinging spray pipes 17 rotate in opposite directions, further improving the cleaning effect.

[0073] The present invention achieves 360-degree cleaning without dead angles while avoiding damage to the wafer surface through the coordinated protection design of the multi-angle wafer cleaning component 8. The oscillating spray head 18 oscillates back and forth at a steering angle of 30° to generate tangential fluid shear force. Combined with the horizontal rotation of the annular disk 14 and the axial rotation driven by bevel gear 1 23 and bevel gear 2 25, a dynamic vortex layer is generated on the wafer surface, attenuating the impact pressure by 70%. The centrifugal-reset cycle connected to the spring 28 discretizes the jet into a 50-200ms pulse sequence, utilizing the cavitation effect to improve cleaning efficiency and control the transient pressure action time to less than 10ms. The horizontal ventilation slots 11 and vertical ventilation slots 12 of the impact-proof barrel 7 act as guide grids to trigger the Karman vortex street, reducing the flow velocity at the wafer edge to 0.9m / s (a 70% reduction), ultimately achieving a cleaning coverage rate ≥99.6% and a micro-scratch incidence rate ≤0.005 / cm².

[0074] Example 4

[0075] The present invention also provides a cleaning process for cleaning a wafer using the wafer cleaning device based on the cleaning device as described above, the cleaning process comprising:

[0076] S1: Wafer positioning: The wafer is placed vertically into the impact-proof barrel 7 in the cleaning vessel 1 by a robot, with the central axis of the wafer coinciding with the axis of the protective cover 16, and the distance between the edge of the wafer and the inner wall of the impact-proof barrel 7 is 2-3 mm;

[0077] S2: Dynamic cleaning: The liquid pump in the cleaning liquid tank 6 is started to deliver the cleaning liquid through the connecting pipe 24 to the swinging spray pipe 17 and the fixed spray pipe 19 at a pressure of 0.5-1.2 MPa. The swinging spray head 18 reciprocates at a steering angle of 30° to spray the cleaning liquid. The recoil force drives the annular disk 14 to rotate horizontally at 5-20 rpm.

[0078] The centrifugal force generated by the rotation of the annular disk 14 compresses the connecting spring 28, drives the guide gear block 27 outward and drives the driving gear 22 and the bevel gear 2 25 to rotate, and the bevel gear 1 23 is linked to make the swinging spray pipe 17 rotate axially at an angle of ±30°;

[0079] The fixed spray head 20 sprays the cleaning liquid in a vertical direction, forming a composite coverage with the swing spray;

[0080] S3: Pulse control. When the connecting spring 28 is compressed to its limit, the spring's restoring force pushes the guide gear block 27 to slide in the opposite direction, causing the axial rotation direction of the swing spray pipe 17 to periodically reverse, generating a pulse jet with a pulse width of 50-200ms.

[0081] S4: Laminar drying. After cleaning, 80-100°C nitrogen is input from the air inlet 5 at a flow rate of 10-15L / min, and distributed to the air flow belt 2 through the connecting air pipe 4 and the supporting air pipe 3. The heated nitrogen is sprayed into the impact-proof barrel 7 through the air outlet nozzle 10, and is divided into laminar flow below 0.5m / s through the horizontal ventilation slot 11 and the vertical ventilation slot 12 to evenly dry the wafer surface. The drying time is controlled at 90-120s.

[0082] The working principle and beneficial effects of the above technical solution are as follows: This embodiment provides a high-precision wafer cleaning process, in which a 300mm wafer is precisely placed into the impact-proof barrel 7 with an edge spacing of 2.5±0.5mm by a robot, and the liquid pump of the cleaning liquid tank 6 is started to drive the ammonia-hydrogen peroxide mixture at a pressure of 0.8MPa through the connecting pipe 24 to the swing spray pipe 17 and the fixed spray pipe 19, wherein the 30° bidirectional deflection swing spray head 18 drives the annular disk 14 to rotate horizontally at 15rpm under the action of the recoil force, and the centrifugal force triggers the connecting spring A 28-second compression-reset cycle operates at a 4Hz frequency, interlocking bevel gears 1 (23) and 2 (25) to cause the spray pipe to rotate axially by ±30°, forming a spirally interwoven pulse jet with a pulse width of 120ms, reducing the local impact pressure from 2.1 bar to 0.7 bar. After cleaning, 95°C nitrogen gas flows at a rate of 12 L / min through transverse ventilation slots 11 and vertical ventilation slots 12, splitting it into a 0.4 m / s laminar flow. Combined with the 93% thermal efficiency of the heating filaments within airflow zone 2, this achieves a wafer surface temperature standard deviation of ≤0.3°C and a drying uniformity deviation of ≤0.8μm. This process utilizes dynamic jet attenuation, synergistic conversion of thermal energy to kinetic energy, and a self-driven energy-saving mechanism to reduce the surface micro-scratch rate to 0.003 / cm² while maintaining a cleaning coverage of ≥99.8%. This reduces overall energy consumption by 42% compared to conventional processes, meeting the atomic-level cleaning requirements of 3nm GAA wafers.

[0083] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. Wafer cleaning device based on cleaning device, It is characterized by: The cleaning kettle (1) comprises a plurality of groups of air flow belts (2) arranged around the outer wall of the cleaning kettle (1), adjacent air flow belts (2) are connected via supporting air pipes (3), two groups of supporting air pipes (3) are connected via connecting air pipes (4), and the connecting air pipes (4) are provided with air inlets (5), an anti-shock barrel (7) is installed in the cleaning kettle (1), and a multi-angle wafer cleaning component (8) is provided in the anti-shock barrel (7); The multi-angle wafer cleaning assembly (8) comprises: an annular disk (14), the annular disk (14) is installed on the bottom of the inner wall of the cleaning kettle (1) through a protective sleeve (15), and the top of the protective sleeve (15) passes through the annular disk (14) and is rotatably connected to the annular disk (14), a protective cover (16) is fixedly provided at the top center of the annular disk (14), and two groups of swinging spray pipes (17) and two groups of fixed spray pipes (19) are provided around the outer wall of the protective cover (16); A plurality of groups of swinging spray heads (18) are evenly provided on each group of swinging spray pipes (17), and the swinging spray heads (18) on one group of swinging spray pipes (17) are deflected 30° clockwise, and the swinging spray heads (18) on the other group of swinging spray pipes (17) are deflected 30° counterclockwise, and a plurality of groups of fixed spray heads (20) are evenly provided on the fixed spray pipes (19), and the fixed spray heads (20) are arranged perpendicular to the fixed spray pipes (19); The annular disk (14) has a hollow structure, and the driving guide (21) is movably installed in the annular disk (14) and movably sleeved on the outer wall of the protective sleeve (15). A connecting pipe (24) is installed in the protective sleeve (15), and the bottom of the connecting pipe (24) is connected to the cleaning liquid tank (6). One end of the swing spray pipe (17) is movably penetrated into the protective cover (16) and is connected to the outer wall of the connecting pipe (24). The other end of the swing spray pipe (17) is rotatably connected to the inner ring wall of the annular disk (14). One end of the fixed spray pipe (19) is fixedly penetrated into the protective cover (16) and is connected to the outer wall of the connecting pipe (24). The other end of the fixed spray pipe (19) is fixedly connected to the inner ring wall of the annular disk (14); The driving gear (22) and the second bevel gear (25) are rotatably sleeved on the outer wall of the connecting pipe (24), and the top of the driving gear (22) is fixedly connected to the bottom of the second bevel gear (25). Two sets of guide gear blocks (27) are symmetrically arranged in the driving guide (21). One end of the guide gear block (27) is connected to the inner wall of the driving guide (21) through a connecting spring (28). The other end of the guide gear block (27) is fixedly provided with a driving rack (26). The two sets of driving racks (26) are symmetrically arranged in the driving guide (21) in front and back, and the two sets of driving racks (26) are meshed with the driving gear (22). The outer wall of one end of the swing spray pipe (17) extending into the protective cover (16) is fixedly sleeved with a bevel gear 1 (23), and the bevel gear 1 (23) is meshed with the bevel gear 2 (25), and the swing spray pipe (17) is rotatably connected to the connecting pipe (24).

2. The wafer cleaning device based on the cleaning device according to claim 1, characterized in that: A cleaning liquid tank (6) is installed at the bottom of the cleaning kettle (1), a liquid pump is installed in the cleaning liquid tank (6), and the cleaning liquid tank (6) is connected to the multi-angle wafer cleaning component (8).

3. The wafer cleaning device based on the cleaning device according to claim 1, characterized in that: The air flow belt (2) has a hollow structure and a heating wire is provided in the air flow belt (2). The same air flow holes (9) are provided on the two side frames of each group of air flow belts (2), and the supporting air pipe (3) is connected to the air flow belt (2) through the air flow holes (9). A plurality of groups of air outlet nozzles (10) are provided at equal intervals on one side of each group of air flow belts (2) close to the outer wall of the cleaning kettle (1), and each group of air outlet nozzles (10) extends into the cleaning kettle (1).

4. The wafer cleaning device based on the cleaning device according to claim 1, characterized in that: The impact-proof barrel (7) is mounted on the bottom of the inner wall of the cleaning kettle (1) via a plurality of groups of supporting columns (13). The impact-proof barrel (7) is provided with a plurality of groups of transverse ventilation slots (11) and vertical ventilation slots (12), and the transverse ventilation slots (11) and the vertical ventilation slots (12) are arranged adjacent to each other.

5. A cleaning process for cleaning a wafer using a wafer cleaning device based on a cleaning device as described in any one of claims 1 to 4, characterized in that: The cleaning process includes: S1: Wafer positioning: the wafer is placed vertically into the impact-proof barrel (7) in the cleaning kettle (1) by a robot, with the central axis of the wafer coinciding with the axis of the protective cover (16), and the distance between the edge of the wafer and the inner wall of the impact-proof barrel (7) is 2-3 mm; S2: Dynamic cleaning, start the liquid pump in the cleaning liquid tank (6), and transport the cleaning liquid through the connecting pipe (24) to the swing spray pipe (17) and the fixed spray pipe (19) at a pressure of 0.5-1.2 MPa, wherein: The oscillating spray head (18) oscillates back and forth at a turning angle of 30° to spray the cleaning liquid, and the recoil force drives the annular disk (14) to rotate horizontally at 5-20 rpm; The centrifugal force generated by the rotation of the annular disk (14) compresses the connecting spring (28), drives the guide gear block (27) to move outward and drives the driving gear (22) and the bevel gear 2 (25) to rotate, and the bevel gear 1 (23) is linked to make the swing spray pipe (17) rotate axially at an angle of ±30°; The fixed spray head (20) sprays the cleaning liquid in a vertical direction, forming a composite coverage with the swing spray; S3: Pulse control. When the connecting spring (28) is compressed to the limit, the spring reset force pushes the guide gear block (27) to slide in the opposite direction, causing the axial rotation direction of the swing spray pipe (17) to periodically reverse, generating a pulse jet with a pulse width of 50-200ms; S4: Laminar drying. After cleaning, 80-100°C nitrogen is input from the air inlet (5) at a flow rate of 10-15L / min, and distributed to the air flow belt (2) through the connecting air pipe (4) and the supporting air pipe (3). The heated nitrogen is sprayed into the impact-proof barrel (7) through the air outlet nozzle (10), and is divided into laminar flows below 0.5m / s through the horizontal ventilation slots (11) and the vertical ventilation slots (12), and the wafer surface is evenly dried. The drying time is controlled at 90-120s.

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