Novel substrate design method and substrate structure
By etching the designated area accurately in the etching process on the substrate, the problems of high cost and insufficient reliability are solved, and the cost and reliability are reduced while ensuring the standard of automotive specifications G0.
Patent Information
- Application Number
- CN202510482330.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-17
- Publication Date
- 2025-07-18
AI Technical Summary
In the prior art, the NPL process is expensive and cannot meet the reliability requirements of the G0 standard of the automotive specifications. There is a risk of leakage, short circuit and signal interference in the electroplating wire process, which limits the application of substrates in cost-sensitive markets.
Perform an accurate etch back process on the substrate, etching a certain width from the cutting path to the edge of the package to avoid exposure of the plating wires and ensuring that the substrate does not cut off the plating wires during cutting.
It effectively reduces the cost of substrate manufacturing, eliminates the risks of leakage, short circuit and signal interference, ensures the stable operation of the substrate in complex environments, meets the G0 standards of the automotive specifications, and improves product quality and life.
Smart Images
Figure CN120341180A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of substrate design, and in particular relates to a novel substrate design method and substrate structure. Background Art
[0002] In the current electronic equipment manufacturing field, the design and manufacturing process of the substrate, as the supporting basis of various electronic components, has a crucial impact on the performance, reliability and cost of the product. Especially in application scenarios such as automotive electronics that have extremely high reliability requirements, meeting automotive-grade standards has become a key consideration in substrate design.
[0003] At present, if customers require products to meet the G0 automotive standard, they usually choose the NPL (lead-free electroplating layer, Non-PlatedLead) process. This process can better meet the strict requirements of G0 automotive standards for product reliability, and performs well in terms of signal transmission stability, anti-interference ability, and long-term stability. However, the NPL process has a significant disadvantage, that is, its manufacturing cost is high. This makes the substrate using the NPL process lack price advantages in market competition, especially in the cost-sensitive mid- and low-end product market, which limits the large-scale application and market promotion of the product.
[0004] On the other hand, although the traditional process with electroplating wires has relatively low costs, it has serious reliability risks. In the process of cutting the product into individual pieces, the electroplating wires will be exposed on the edge of the package. The exposure of the electroplating wires can easily cause leakage, resulting in abnormal current conduction between electronic components, affecting the normal operation of the equipment; it may also cause short circuit problems, causing circuit system failures and even damage electronic components; at the same time, the exposed electroplating wires will also interfere with the surrounding signal transmission, reducing the quality and stability of the signal, and cannot meet the strict standards of automotive regulations G0 for product reliability.
[0005] With the growing demand for substrates in automotive electronics, industrial control and other fields, how to reduce the manufacturing cost of substrates while ensuring that product reliability meets automotive G0 standards has become a key issue that needs to be urgently addressed in the industry. Summary of the invention
[0006] In view of the above situation, in order to overcome the defects of the prior art, the present invention performs a precise back etching process on specific areas of the substrate. While meeting the strict requirements of the automotive standard G0 for product reliability, it effectively reduces the manufacturing cost of the substrate and solves the problems of high cost of the traditional NPL process and insufficient reliability of the electroplating line process.
[0007] In order to achieve the above object, the following technical solution is adopted: The present invention provides a novel substrate design method, comprising the following steps:
[0008] Determine an area with a certain width from the scribe line to the inside of the edge of a single package on the substrate; perform an etch-back process on the determined area, and the etch-back process is to etch the copper in the specified area.
[0009] Further, the certain width from the edge of the single package to the inside is: 100 - 150 microns; the certain width from the edge of the single package to the inside is the distance between the edge of the single package and the left solid line.
[0010] Further, the width of the etched area is the sum of the certain width from the edge of a single package to the inside, the width of the scribe line, and the certain width from the edge of an adjacent single package to the inside; the width of the scribe line is the width of the scribe line, and the certain width from the edge of an adjacent single package to the inside is the distance between the edge of the adjacent single package and the right solid line.
[0011] Further, the certain width from the edge of the single package to the inside is 100 microns, the width of the scribe line is 250 microns, and the certain width from the edge of the adjacent single package to the inside is 100 microns, and the sum of the widths is 450 microns.
[0012] Further, the certain width from the edge of the single package to the inside is 150 microns, the width of the scribe line is 250 microns, and the certain width from the edge of the adjacent single package to the inside is 150 microns, and the sum of the widths is 550 microns.
[0013] Further, the substrate includes two circuit layers, namely the L1 first circuit layer and the L2 second circuit layer, and the etched area is located in the L1 first circuit layer and the L2 second circuit layer.
[0014] Further, the substrate includes two circuit layers, namely the L1 first circuit layer and the L2 second circuit layer; an etch-back treatment is performed in the area from the scribe line to 100 - 150 microns inside the package edge, and the etch-back treatment is to etch the copper in the specified area; the width of the etched area is the sum of the certain width from a single package to the inside, the width of the scribe line, and the certain width from the inside of an adjacent single package.
[0015] Further, when the substrate structure is singulated into single chips, the plating line will not be cut, avoiding copper leakage.
[0016] The beneficial effects of the present invention are as follows: Through precise regional etching treatment, while ensuring the performance of the substrate, the material and process costs in the manufacturing process are effectively reduced. Compared with the traditional electroplating line process, the substrate design method and structure of the present invention avoid the problem of electroplating line exposure when the product is cut into single pieces, eliminating risks such as leakage, short circuit, and signal interference caused by electroplating line exposure, ensuring the stable operation of electronic components in complex working environments, fully meeting the strict requirements of vehicle specification G0 for product reliability, and improving the quality and service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the first circuit layer of the structure of a new substrate structure of the present invention;
[0018] Figure 2 It is a schematic diagram of the second circuit layer of the structure of a new substrate structure of the present invention.
[0019] Legend description: A, left solid line; B, right solid line; 1, cutting channel; 2, edge of a single package; 3, edge of adjacent single packages.
[0020] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, and do not constitute a limitation to the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of protection of the present invention.
[0022] Unless otherwise defined, all professional and scientific terms used herein have the same meaning as those familiar to those skilled in the art. In addition, any methods and materials similar or equivalent to the described content can be applied to the present invention. The preferred implementation methods and materials described herein are only for demonstration purposes, but do not limit the content of this application.
[0023] The experimental methods in the following embodiments are all conventional methods unless otherwise specified. The test materials used in the following embodiments are all obtained from commercial channels unless otherwise specified.
[0024] Embodiment 1:
[0025] A new substrate design method:
[0026] It includes the following steps: determining an area with a certain width inward from the scribe line to the edge of a single package on a substrate; performing an etch-back process on the determined area, and the etch-back process is to etch the copper in the specified area.
[0027] The certain width inward from the edge of the single package is: 100 - 150 microns; the certain width inward from the edge of the single package is the distance between the edge 2 of the single package and the left solid line A.
[0028] The width of the etched area is the sum of the certain width inward from the edge of a single package, the width of the scribe line, and the certain width inward from the edge of an adjacent single package; the width of the scribe line is the width of scribe line 1, and the certain width inward from the edge of an adjacent single package is the distance between the edge 3 of the adjacent single package and the right solid line B, which fully considers the actual requirements when the substrate is cut into single products, ensures that no damage is caused to the surrounding circuit structure during the cutting process, can optimize the overall layout of the substrate, and improve the space utilization rate of the substrate.
[0029] The certain width inward from the edge of the single package is 100 microns, the width of the scribe line is 250 microns, and the certain width inward from the edge of the adjacent single package is 100 microns, and the sum of the widths is 450 microns. Using this width combination can reduce the material cost of the substrate and the process complexity during the production process while meeting the product performance.
[0030] In this embodiment, the certain width inward from the edge of the single package is 150 microns, the width of the scribe line is 250 microns, and the certain width inward from the edge of the adjacent single package is 150 microns, and the sum of the widths is 550 microns. Appropriately increasing the inward width can provide a more sufficient safety margin to ensure that the product can still operate normally in extreme environments.
[0031] In actual application scenarios, through a large number of experiments and data analysis, when the width is within this range, it can reduce production costs and improve production efficiency while ensuring product performance. For example, in the substrate design of high-frequency communication products, using a width setting of 120 microns can meet the stability requirements of signal transmission, and can also reduce the consumption of etching solution and etching time in the etch-back process, thereby improving the overall production efficiency.
[0032] The substrate includes two circuit layers, namely L1 the first circuit layer (shown Figure 1 ) and L2 the second circuit layer (shown Figure 2 ), and the etched area is located in L1 the first circuit layer (shown Figure 1 ) and L2 the second circuit layer (shown Figure 2 ).
[0033] The substrate includes two circuit layers, namely the L1 first circuit layer (shown Figure 1 ) and the L2 second circuit layer (shown Figure 2 ); it can achieve a more complex circuit layout within a limited substrate space, improve the integration of the substrate, and perform etching treatment on the two circuit layers simultaneously, which can ensure the consistency and stability of the entire substrate structure in terms of electrical and mechanical properties.
[0034] Etching-back treatment is carried out in the area from the scribe line to 100 - 150 microns inward from the edge of the package body. The etching-back treatment is to etch the copper in the specified area;
[0035] The width of the etching area is the sum of a certain width inward from a single package body, the width of the scribe line, and a certain width inward from the adjacent single package body.
[0036] When cutting a single product from the substrate structure, the electroplating line will not be cut, avoiding copper leakage. In the traditional substrate design and cutting process, the problem of copper leakage often occurs due to accidental cutting, which not only affects the electrical performance of the product but also may cause the product to be scrapped directly. Through the determination of the area and the design of the etching-back process, the electroplating line is avoided, fundamentally eliminating the occurrence of copper leakage, and greatly improving the yield rate of the product.
[0037] The substrate body with two circuit layers, the two circuit layers are the L1 first circuit layer (shown Figure 1 ) and the L2 second circuit layer (shown Figure 2 ); etching-back treatment is carried out in the area from the scribe line to 100 microns inward from the package edge. The etching-back treatment is to etch the copper in the specified area; the width of the etching area is the sum of a certain width inward from a single package body, the width of the scribe line, and a certain width inward from the adjacent single package body, which helps technicians understand the structure of the substrate and the specific position and method of the etching-back treatment more clearly, providing an accurate guiding basis for actual production operations.
[0038] For the substrate body with multiple circuit layers, the etching area includes the specified areas of the first layer and the bottom layer.
[0039] When cutting a single product from the substrate structure, the electroplating line will not be cut, avoiding copper leakage. It can not only enable product developers to more intuitively recognize the reliability in ensuring product quality, but also provide a solid technical guarantee for the large-scale production of subsequent products.
[0040] The substrate structure can meet the requirements of automotive grade G0. The requirements of automotive grade G0 have extremely strict standards for the reliability, stability, and safety of automotive electronic devices. It can maintain good electrical and mechanical properties in complex automotive operating environments such as high temperature, high humidity, and strong electromagnetic interference, ensuring the stable operation of the automotive electronic system and providing reliable electronic support for the safe driving of the vehicle. For example, in the application of the substrate in the automotive engine control system, this substrate structure can resist the high temperature and strong electromagnetic interference generated during engine operation, ensuring the accurate transmission and processing of control signals.
[0041] Through precise regional etching treatment, the present invention effectively reduces the material and process costs during the manufacturing process while ensuring the substrate performance. Compared with the traditional electroplating line process, the substrate design method and structure of the present invention avoid the problem of electroplating line exposure when cutting single products, eliminating risks such as leakage, short circuit, and signal interference caused by electroplating line exposure, ensuring the stable operation of electronic components in complex working environments, fully meeting the strict requirements of automotive grade G0 for product reliability, and improving the quality and service life of the product.
[0042] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
[0043] The above description of the present invention and its implementation manners is not restrictive. What is shown in the drawings is only one of the implementation manners of the present invention, and the actual application is not limited thereto. Generally speaking, if those of ordinary skill in the art are inspired by it and design similar ways and embodiments without creative efforts without departing from the purpose of the present invention, they should all fall within the protection scope of the present invention.
Claims
1. A novel substrate design method, characterized in that: Including the following steps: Determine an area with a certain width inward from the scribe line to the edge of a single package on the substrate; Perform an etch-back process on the determined area, and the etch-back process is to etch the copper in the specified area.
2. A novel substrate design method, characterized in that: The certain width inward from the edge of the single package is: 100 - 150 microns; the certain width inward from the edge of the single package is the distance between the edge of the single package (2) and the left solid line (A).
3. The novel substrate design method according to claim 1, wherein: The width of the etched area is the sum of the certain width inward from the edge of the single package, the width of the scribe line, and the certain width inward from the edge of the adjacent single package; the width of the scribe line is the width of the scribe line (1), and the certain width inward from the edge of the adjacent single package is the distance between the edge of the adjacent single package (3) and the right solid line (B).
4. The novel substrate design method according to claim 3, characterized in that: The certain width inward from the edge of the single package is 100 microns, the width of the scribe line is 250 microns, and the certain width inward from the edge of the adjacent single package is 100 microns, and the sum of the widths is 450 microns.
5. The novel substrate design method according to claim 3, characterized in that: The certain width inward from the edge of the single package is 150 microns, the width of the scribe line is 250 microns, and the certain width inward from the edge of the adjacent single package is 150 microns, and the sum of the widths is 550 microns.
6. The novel substrate design method according to claim 1, characterized in that: The substrate includes two circuit layers, namely the L1 first circuit layer and the L2 second circuit layer, and the etched area is located in the L1 first circuit layer and the L2 second circuit layer.
7. A substrate structure obtained by the novel substrate design method according to any one of claims 1-6, characterized in that: The substrate includes two circuit layers, namely the L1 first circuit layer and the L2 second circuit layer; An etch-back treatment is performed in the area 100 - 150 microns inward from the scribe line to the edge of the package, and the etch-back treatment is to etch the copper in the specified area; The width of the etched area is the sum of the certain width inward from a single package, the width of the scribe line, and the certain width inward from the adjacent single package.
8. The substrate structure according to claim 7, characterized in that: When the substrate structure is singulated into single chips, the plating line will not be cut, avoiding copper leakage.