Mainboard, mainboard interface and wind power conversion controller with mainboard

Abstract

The invention relates to the technical field of wind power converters, in particular to a mainboard, a mainboard interface and a wind power conversion controller with the mainboard. The core board comprises a microcontroller, and the microcontroller is fixed to one side of the bottom board and electrically connected with the bottom board; the terminal connecting assembly comprises an upper-layer connecting part and a lower-layer connecting part which are respectively arranged on the two end surfaces of the bottom plate; wherein the upper-layer connecting part is electrically connected with the core board through a main wire, comprises at least one main connecting point, and is used for transmitting a power supply and a signal to a main part of the equipment; and the lower-layer connecting part is electrically connected with the core board through a branch wire, comprises at least one branch connecting point and is used for distributing a power supply and a signal to other branch circuits or equipment. According to the invention, the bottom plate is matched with the core plate and the terminal connecting assembly, so that the reliable and stable connection effect can be maintained while external terminals with various types of interfaces are provided.

Description

Technical Field

[0001] The present invention relates to the technical field of wind power converters, and particularly to a main board, a main board interface, and a wind power conversion controller having the main board. Background Art

[0002] The wind power conversion controller is a key component in the wind power generation system, and is used to convert the electric energy generated by a doubly-fed induction generator (DFIG) into electric energy that meets the requirements of the power grid. Through functions such as electric energy conversion, voltage regulation, frequency control, maximum power point tracking, and system protection, it ensures that the wind turbine operates efficiently and stably at different wind speeds and smoothly integrates the electric energy into the power grid. As the most core electronic component of the wind power conversion controller, the performance parameters of the main board directly affect the control system of the wind power conversion controller. The main board is connected to various devices of the wind power control system through interfaces, thereby realizing functions such as electric energy conversion.

[0003] Currently, the core of the wind power conversion controller mostly adopts foreign technologies, but their costs are too high. Moreover, the existing domestic main boards and interfaces of wind power conversion controllers still have the following problems: (1) The problem of interface singularity: The interface types of the existing main boards are single, which is not convenient for setting multiple interfaces in the limited space of the main board and cannot meet the requirements of diverse application scenarios; (2) The problem of signal transmission stability: The signal sampling and transmission accuracy of the existing main boards are insufficient under high voltage, high current, and complex electrical environments; (3) The problem of interface scalability: The interface expansion ability of the existing main boards is limited and cannot flexibly adapt to the needs of different devices and systems; (4) The problem of interface compatibility: The interfaces of the existing main boards cannot be compatible with multiple types of devices (such as digital input / output boards, fan main control systems, etc.) at the same time. As a result, the existing wind power conversion controllers have insufficient flexibility in the controller interface scheme and cannot adapt to different application scenarios. Summary of the Invention

[0004] In this part, as well as in the abstract and title of the specification of the present application, some simplifications or omissions may be made to avoid obscuring the purpose of this part, the abstract, and the title, and such simplifications or omissions shall not be used to limit the scope of the present invention.

[0005] To solve the deficiencies of the existing technology, an object of the present invention is to provide a main board.

[0006] To achieve the above object, the present invention adopts the following technical solutions: A main board, comprising a base plate, which is connected to a power supply and is used to provide mechanical support and electrical connection; a core board, including a microcontroller, which is fixed on one side of the base plate and is electrically connected to the base plate; and a terminal connection component, which includes an upper connection part and a lower connection part respectively arranged on the end face of the base plate and is used to connect each external terminal; Among them, the upper connection part is electrically connected to the core board through the main wire and includes at least one main connection point for transmitting power supply and signals to the main part of the device; The lower connection part is electrically connected to the core board through the branch wire and includes at least one branch connection point for distributing the power supply and signals to other branch circuits or devices.

[0007] As a preferred solution of the main board of the present invention, wherein: both the upper connection part and the lower connection part include conductive terminals, and each conductive terminal is respectively adapted to a connection point; The connection between the conductive terminal and the bottom plate is detachable.

[0008] As a preferred solution of the main board of the present invention, wherein: the upper connection part and the lower connection part are separated by an insulating material.

[0009] The beneficial effect of a main board of the present invention: By the mutual cooperation among the bottom plate, the core board and the terminal connection assembly provided by the present invention, and by optimizing the arrangement and distribution mode of the terminals, while providing external terminals of multiple types of interfaces within a limited volume space, a reliable and stable connection effect can be maintained.

[0010] To solve the deficiencies of the prior art, another object of the present invention is to provide a main board interface.

[0011] To achieve the above object, the present invention adopts the following technical solution: A main board interface is applied to the main board and includes a communication interface, a code disk input interface, a sampling interface, and an expansion interface adapted to the external terminals of the main board; The communication interface is used for communication between the main board and the device; The code disk input interface is used for measuring the position and speed of the rotational movement of the fan; The sampling interface is used for controlling data transmission in the wind power system and includes nine-way Hall sampling interfaces and thirty-two-way AD sampling interfaces; The expansion interface includes an FT3 interface for interface expansion; Among them, the communication interface includes two CAN communication interfaces adapted to the communication terminals, one of the CAN communication interfaces communicates with the digital input / output board, and the other CAN communication interface communicates with the fan main control system.

[0012] As a preferred solution of the main board interface of the present invention, wherein: the CAN communication interface includes, A CAN controller, which is interconnected with the microcontroller of the core board through SPI or a parallel bus for data transmission; A first transceiver chip, which is electrically connected to the core board for converting the signals of the CAN controller into differential signals; and, A logic control circuit that parses and repackages the input CAN data to meet the CAN communication requirements of the output end.

[0013] As a preferred solution for the motherboard interface of the present invention, wherein: the logic control circuit includes a first power module, a CAN controller module, and a CAN bus interface module that are electrically connected to each other; The first power module includes a DC-DC converter. A sixth filter capacitor is connected in parallel to the input end of the DC-DC converter, and a seventh filter capacitor and an eighth filter capacitor are connected in parallel to the output end of the DC-DC converter; The CAN controller module includes a first voltage conversion chip that provides a working voltage for the first transceiver chip. The first voltage conversion chip has CAN_RX3_3V3 and CAN_TX3_3V3 signal lines. A first pull-up resistor and a second pull-up resistor are respectively connected to the CAN_RX3_3V3 and CAN_TX3_3V3 signal lines to pull up the signal line voltage value to the power supply voltage value; The CAN bus interface module includes a low-pass filter composed of a first filter capacitor, a second filter capacitor, and an inductor, which is used to filter out high-frequency interference signals on the CAN bus.

[0014] As a preferred solution for the motherboard interface of the present invention, wherein: the communication interface further includes an RS485 communication interface, which includes a first signal conversion circuit connected to the core board through an RS485 transceiver chip, for converting the digital signal of the core board into a differential signal for transmission, and converting the received differential signal into a digital signal.

[0015] As a preferred solution for the motherboard interface of the present invention, wherein: the first signal conversion circuit includes a second power module and an RS485 communication module that are electrically connected to each other; The second power module includes a second voltage conversion chip for converting the working voltage. A first decoupling capacitor is connected between the second voltage conversion chip and the power supply pin, and a second decoupling capacitor is connected between the second voltage conversion chip and the ground; The RS485 communication module includes a second transceiver chip, which has a receive output pin for sending the received RS485 bus signal to the microcontroller, a receive enable pin for controlling the enabling or disabling of the receive function, a drive enable pin for controlling the enabling or disabling of the send function, a send input pin for receiving the send data signal from the microcontroller, differential signal pins, and a power supply pin.

[0016] As a preferred solution of the motherboard interface of the present invention, wherein: the communication interface further includes an RS232 communication interface, which includes a second signal conversion circuit connected to the core board through an RS232 level conversion chip, and is used to convert the digital logic level of the motherboard into positive and negative voltage levels of the RS232 standard.

[0017] As a preferred solution of the motherboard interface of the present invention, wherein: the second signal conversion circuit includes a third power supply module and an RS232 communication module that are electrically connected to each other; The third power supply module includes a third voltage conversion chip for converting the working voltage. A third decoupling capacitor is connected between the third voltage conversion chip and the power supply pin, and a fourth decoupling capacitor is connected between the third voltage conversion chip and the ground; The RS232 communication module includes a third transceiver chip and a fourth transceiver chip. A third filter capacitor is connected between the power supply pin and the ground of the third transceiver chip, and a fourth filter capacitor is connected between the power supply pin and the ground of the fourth transceiver chip.

[0018] As a preferred solution of the motherboard interface of the present invention, wherein: the encoder input interface is adapted to the encoder signal terminal, and each encoder input interface is connected to the input end of an opto-isolation circuit, and the input signal is stabilized through a filtering and shaping circuit.

[0019] As a preferred solution of the motherboard interface of the present invention, wherein: the filtering and shaping circuit includes a fourth power supply module, an encoder signal input module, a signal processing module, and a signal output module that are electrically connected in sequence; The fourth power supply module provides power for the entire circuit; The encoder signal input module includes three differential signals, several groups of pull-up resistors provided between the encoder signal line and the fourth power supply module, and several groups of fifth filter capacitors connected between the fourth power supply module and the ground; The signal processing module includes an optocoupler and several groups of pull-down resistors connected between the output side of the optocoupler and the ground; The signal output module includes a connector for outputting the processed encoder signal to the core board.

[0020] As a preferred solution of the motherboard interface of the present invention, wherein: interfaces of the same type with more than one path are separately arranged on the upper connection part and the lower connection part; or / and, Multiple external terminals of interfaces of the same type are staggered and distributed on the upper connection part and the lower connection part.

[0021] Beneficial effects of a main board interface of the present invention: By the cooperation among the communication interface, input interface, sampling interface and expansion interface provided in the present invention, the problems of poor expandability and insufficient flexibility of the existing main board interface are solved; each main interface maintains the stability of signal transmission through an optimized circuit setting.

[0022] To solve the deficiencies of the existing technology, another object of the present invention is to provide a wind power converter controller.

[0023] To achieve the above object, the present invention adopts the following technical solution: A wind power converter controller includes the above-mentioned main board, and further includes, A digital input / output board, which is connected to the CAN communication interface of the main board and is used for collecting external switch states and controlling external devices; An analog input / output board, which is connected to the Hall sampling interface and AD sampling interface of the main board and is used for collecting and processing analog signals; and, A communication expansion board, which is connected to the expansion interface of the main board and provides additional communication capabilities.

[0024] As a preferred solution of the wind power converter controller of the present invention, wherein: The communication expansion board includes at least one of the following types of communication interfaces: A CAN communication interface, which is used to realize data exchange between devices; A Profibus communication interface, which is used for connection communication of multiple devices; and, An RS485 communication interface, which is used for multi-point communication; Wherein, at least two paths of RS485 communication interfaces are provided, and the two paths of RS485 communication interfaces are electrically isolated from each other and are respectively configured with different communication parameters.

[0025] Beneficial effects of a wind power converter controller of the present invention: By the cooperation among the main board, digital input / output board, analog input / output board and communication expansion board provided in the present invention, a domestic low-cost MCU is adopted to simplify the hardware design and reduce the cost of the controller, and the problems that the existing wind power converter controller usually has a high cost, insufficient flexibility and cannot adapt to different application scenarios are solved. Description of the Drawings

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0027] Figure 1 It is a three-dimensional structural schematic diagram of the main board of the present invention.

[0028] Figure 2 This is a schematic side view structure of the main board of the present invention.

[0029] Figure 3 This is a schematic composition structure diagram of the wind power converter controller of the present invention.

[0030] Figure 4 This is a schematic diagram of the external terminal distribution structure of the main board of the present invention.

[0031] Figure 5 This is a schematic circuit connection diagram at the DC-DC converter in the first power supply module of the main board interface of the present invention.

[0032] Figure 6 This is a schematic circuit connection diagram at the first voltage conversion chip in the CAN controller module of the main board interface of the present invention.

[0033] Figure 7 This is a schematic circuit connection diagram at the first transceiver chip in the CAN controller module of the main board interface of the present invention.

[0034] Figure 8 This is a schematic circuit connection diagram of the CAN bus interface module of the main board interface of the present invention.

[0035] Figure 9 This is a schematic circuit connection diagram of the first signal conversion circuit of the main board interface of the present invention.

[0036] Figure 10 This is a schematic circuit connection diagram at the filter capacitor in the second signal conversion circuit of the main board interface of the present invention.

[0037] Figure 11 This is a schematic circuit connection diagram at the third voltage conversion chip in the second signal conversion circuit of the main board interface of the present invention.

[0038] Figure 12 This is a schematic circuit connection diagram at HU1 in the second signal conversion circuit of the main board interface of the present invention.

[0039] Figure 13 This is a schematic circuit connection diagram at the third transceiver chip and the fourth transceiver chip in the second signal conversion circuit of the main board interface of the present invention.

[0040] Figure 14 This is a schematic circuit connection diagram at the optocoupler U9 in the filter and shaping circuit of the main board interface of the present invention.

[0041] Figure 15 This is a schematic circuit connection diagram at the optocoupler U10 in the filter and shaping circuit of the main board interface of the present invention.

[0042] Figure 16 This is a schematic diagram of the circuit connection at the connector M16 in the filtering and shaping circuit of the motherboard interface of the present invention.

[0043] Figure 17 This is a schematic diagram of the signal transmission among the components of the wind power converter controller of the present invention.

[0044] In the figure: 100, motherboard; 101, baseboard; 102, core board; 103, terminal connection component; 103a, upper connection part; 103b, lower connection part; 200, motherboard interface; 201, communication interface; 202, encoder input interface; 203, sampling interface; 204, expansion interface; 300, digital input / output board; 400, analog board; 500, communication expansion board; P16, communication terminal; PSD1, encoder signal terminal; U5, first transceiver chip; U59, second transceiver chip; U68, third transceiver chip; U69, fourth transceiver chip; U2, DC-DC converter; U4, first voltage conversion chip; U60, second voltage conversion chip; U62, third voltage conversion chip; C8, first filter capacitor; C10, second filter capacitor; HC8, third filter capacitor; HC7, fourth filter capacitor; C5, sixth filter capacitor; C1, seventh filter capacitor; C2, eighth filter capacitor; RCH6, first pull-up resistor; RCH7, second pull-up resistor; L1, inductor; C235, first decoupling capacitor; C236, second decoupling capacitor; C239, third decoupling capacitor; C240, fourth decoupling capacitor. Detailed implementation manners

[0045] To make the objects, features, and advantages of the present invention more obvious and understandable, the following describes the detailed implementation manners of the present invention with reference to the accompanying drawings of the specification.

[0046] In the following description, many specific details are set forth to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0047] Secondly, the so-called "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that can be included in at least one implementation manner of the present invention. The "in one embodiment" appearing in different places in this specification does not all refer to the same embodiment, nor is it a separate or alternative embodiment that excludes other embodiments.

[0048] Embodiment 1

[0049] Refer to Figures 1-4, which is the first embodiment of the present invention. This embodiment provides a main board 100 that can maintain a reliable and stable connection while providing external terminals with multiple types of interfaces. It includes: a base plate 101, a core board 102, and a terminal connection component 103. The base plate 101 provides mechanical support and electrical connection. The core board 102 includes a microcontroller. There are also several terminals on the base plate 101 connected to external interfaces, which are respectively used to implement various functions. The terminal connection component 103 is used to connect each terminal to the base plate 101.

[0050] Specifically, the base plate 101 is connected to the power supply through a power terminal. The core board 102 is fixed on one side of the base plate 101 and is electrically connected to each terminal by wires passing through the base plate 101. The terminal connection component 103 includes an upper connection part 103a and a lower connection part 103b respectively arranged on both end faces of the base plate 101. An electrical isolation design is adopted between the upper connection part 103a and the lower connection part 103b to prevent signal interference and electrical short circuits. They are connected through jumpers to achieve different connection configurations and ensure signal integrity and system stability. In addition, the upper connection part 103a and the lower connection part 103b can be respectively connected to different power supplies or signals to achieve multifunctional electrical connections.

[0051] Furthermore, the upper connection part 103a is electrically connected to the core board 102 through a main wire, including at least one main connection point, which is used to transmit power and signals to the main part of the device. The main part refers to the main circuits of core components such as a digital input / output board 300 and an analog input / output board 400. The lower connection part 103b is electrically connected to the core board 102 through a branch wire, including at least one branch connection point, which is used to distribute power or signals to other branch circuits and devices. Through the structure with the upper and lower layers offset, the number of wires and the volume of connectors can be effectively reduced, allowing the simultaneous connection of main wires and branch wires, providing greater connection flexibility. By providing multiple connection points, the connection stability and reliability can be improved, and the risk of system failure caused by single-point failures can be reduced.

[0052] Preferably, the terminal connection assembly 103 further includes an identification part and a fixing part. The identification part can use colors, symbol arrows, etc. as identifiers. The identification part is used to identify the functions and connection directions of each connection point. Standardized identification is adopted to ensure quick identification and operation in complex wiring environments, which is convenient for installation and maintenance. For example, the connection directions of the connection points are respectively represented by an "arc-shaped groove" and a "right-angle groove" at the terminal connection; the fixing part includes fixing elements such as screws or buckles, and holes and grooves can be reserved on the bottom plate 101 for installation to ensure the stability of the connection in a vibration and shock environment. It is used to fix the terminal connection assembly 103 at the installation position on the bottom plate 101. Both the upper connection part 103a and the lower connection part 103b include conductive terminals, and each conductive terminal is respectively adapted to a connection point. The connection between the conductive terminal and the bottom plate 101 is detachable, which is convenient for connection and disconnection operations as needed. The detachable design makes the terminal connection structure more convenient during maintenance and upgrade, reducing the time and cost of installation and disassembly. The conductive terminal is made of metal material to ensure good electrical conductivity and durability. The surface of the terminal is treated with gold plating or silver plating to improve the antioxidant performance and electrical conductivity.

[0053] Preferably, the upper connection part 103a and the lower connection part 103b are separated by an insulating material. The insulating material can use materials with high temperature resistance and corrosion resistance, such as PEEK material, ceramic material, etc. It has excellent mechanical properties, flame retardancy, low smoke emission, and chemical corrosion resistance while being resistant to high temperature, ensuring the insulation performance in various environments and improving safety and reliability.

[0054] Referring to Table 1-2 below, several external terminals adapted to the main board interface 200 are shown, adopting a double-layer arrangement structure.

[0055] Table 1

[0056] The above Table 1 shows the composition structure of the CAN and serial communication terminal P16. Among them, the identification part of this embodiment sets a triangular identifier at the No. 1 pin, and the direction of the triangular tip is the wiring direction.

[0057] The CAN communication terminal consists of two types of pins, namely CAN_H and CAN_L. These pins are connected to the CAN controller and transceiver chip to achieve data communication between devices. It is used for high-speed and reliable data exchange with the switch board 300, the fan main control system, etc. When working, the CAN controller converts the data into the CAN protocol format, and the CAN transceiver chip converts the data into physical layer signals (CAN_H and CAN_L) for transmission. The CAN transceiver at the receiving end converts the physical layer signal back into data for the CAN controller to process.

[0058] The RS485 communication terminal consists of two pins, namely A and B. These pins are connected to the RS485 transceiver chip. It is used for long-distance, multi-point communication scenarios, connecting multiple slave devices to achieve high-speed and stable data transmission. When working, the main board 100 microcontroller sends data to the RS485 transceiver, and the RS485 transceiver converts the digital signal into a differential signal for transmission. The RS485 transceiver at the receiving end converts the differential signal back into a digital signal for the microcontroller to process.

[0059] The RS232 communication terminal consists of two pins, namely T232 (transmit) and R232 (receive). These pins are connected to the RS232 level conversion chip. It is used for short-distance, point-to-point communication with computers, terminal devices, etc., and is also used for device debugging, data downloading, etc. When working, the main board 100 microcontroller sends data to the RS232 level conversion chip, and the level conversion chip converts the digital logic level into the positive and negative voltage levels of the RS232 standard. The RS232 level conversion chip at the receiving end converts the positive and negative voltage levels back into the digital logic level for the microcontroller to process.

[0060] Table 2

[0061] The above Table 2 shows the composition structure of the 3-way current sampling signal terminal P4. To meet the requirements, this embodiment also provides a terminal P5 with the same structure and function as P4. The signal terminal usually consists of multiple pins and is used to connect different signals (such as current, voltage, etc.). These pins are connected to the signal conditioning circuit and the AD converter, which are used to collect and process various signals, such as current, voltage, etc., and convert the signals into digital signals for the microcontroller to process. When working, the signal is input into the signal conditioning circuit through the terminal. The conditioning circuit processes the signal, such as amplification, filtering, etc. The processed signal is input into the AD converter and converted into a digital signal, and the digital signal is used for the microcontroller to further process and analyze.

[0062] Embodiment 2

[0063] Refer to Figures 1-8 , which is the second embodiment of the present invention. Different from the previous embodiment, this embodiment provides a main board interface 200 applied to the main board 100, including a communication interface 201 adapted to the external terminals of the main board 100, an input interface, a sampling interface 203, and an expansion interface 204, which improves the interface type and expansion ability. As Figure 3This is a schematic diagram of the composition structure of the wind power converter controller of the present invention. For ease of understanding, the main board interface 200 is schematically shown by a dotted line box. The digital input / output board 300, the analog input / output board 400, and the communication expansion board 500 are respectively connected to the main board 100 through the main board interface 200. The arrows connected to the main board interface 200 in the dotted line box indicate the respective specific interfaces.

[0064] Specifically, the communication interface 201 is used for communication between the main board 100 and devices. The encoder input interface 202 is used to measure the position and speed of the rotational movement of the wind turbine. The sampling interface 203 is used to control the high-precision data transmission in the wind power system, and the expansion interface 204 is used for interface expansion.

[0065] Furthermore, the CAN communication interface includes a CAN controller, a first transceiver chip U5, and a logic control circuit. The CAN controller is interconnected with the microcontroller of the core board 102 through SPI or a parallel bus for data transmission. The first transceiver chip U5 is electrically connected to the core board 102 and is used to convert the signals of the CAN controller into signals suitable for long-distance transmission to ensure the accurate transceiver and processing of CAN signals. The logic control circuit inside the CAN communication interface includes: a first power module, a CAN controller module, and a CAN bus interface module, which can parse and repackage the input CAN data to meet the CAN communication requirements of the output end. One of the two CAN communication interfaces communicates with the digital input / output board 300, and the other communicates with the main control system of the wind turbine to achieve high-speed and reliable data exchange between devices.

[0066] As Figure 5 shown, in the first power module: the function of the DC-DC converter U2 is to convert the input DC voltage (+Vin, -Vin) into a stable 5V DC output (+Vout, -Vout). This stable 5V power supply provides the working voltage for some components in the subsequent CAN communication circuit. For example, it provides power for the VDD pin of the first transceiver chip U5. In the figure, the numbers 1, 2 and 5, 7 represent the input lines (+Vin, -Vin) and the output lines (+Vout, -Vout) respectively.

[0067] In this embodiment, the seventh filter capacitor C1 and the eighth filter capacitor C2 are both 10uF / 50V, and the sixth filter capacitor C5 is 10uF / 16V. Their function is to filter out the ripples and noises in the power supply. For example, when the power supply is output from the DC-DC converter U2, the ripples may interfere with the normal transmission of the CAN communication signal. The seventh filter capacitor C1 and the sixth filter capacitor C5 are connected to the output end of the DC-DC converter U2, and can form a low-impedance path between the positive and negative poles of the power supply, enabling the high-frequency noise to return to the ground through the capacitor, thereby reducing the high-frequency interference components in the power supply and providing a cleaner power supply for the CAN communication circuit.

[0068] C3 is also a filtering capacitor, which is connected in parallel with PL1 and forms part of a π-type filtering network. It can effectively filter out high-frequency noise and ripple in the power supply output, making the output VDD_C voltage more stable and pure, providing a more stable power supply for the CAN communication circuit, and ensuring the quality and reliability of communication signals.

[0069] As an inductor, PL1 plays the role of energy storage and filtering in the circuit. When current passes through PL1, it stores energy. When the current in the circuit changes, PL1 can release or absorb energy, thus stabilizing the output current. At the same time, together with C1, C2, and C3, it constitutes a multi-stage filtering network, further reducing the ripple and noise in the power supply output, improving the quality of the power supply, and reducing interference to CAN bus communication.

[0070] As the output terminal of the DC-DC converter U2, VDD_C provides the required power supply voltage for the subsequent CAN communication interface circuit, ensuring that chips such as the CAN communication controller and transceiver can operate normally. It is the energy guarantee for the normal operation of the entire CAN communication system.

[0071] As the common reference ground of the entire DC-DC conversion circuit, GND provides a stable potential reference point for each component in the circuit, ensuring the normal operation of the circuit and the accurate transmission of signals. At the same time, through the connection with GND_CAN, the potential correlation between the power supply ground and the CAN communication ground is realized, ensuring the continuity and consistency of the entire system ground.

[0072] As the grounding terminal of the CAN communication network, GND_CAN provides a reference ground potential for the signals on the CAN bus, ensuring the stable transmission of differential signals on the CAN bus and preventing communication errors and interference caused by ground potential differences. In addition, through the connection with GND, GND_CAN connects the ground of the entire CAN communication system to the power supply ground, achieving the grounding balance of the system and improving the anti-interference ability and reliability of the system.

[0073] As Figures 6-7 shown, in the CAN controller module (taking CAN3 as an example), the first voltage conversion chip U4 converts the power supply voltage to 3.3V. Since the first transceiver chip U5 requires a 3.3V power supply to operate normally, it provides a suitable operating voltage for the first transceiver chip U5, enabling the first transceiver chip U5 to correctly receive and transmit signals; in this embodiment, the first pull-up resistor RCH6 and the second pull-up resistor RCH7 are both 4.7k. They are connected to signal lines such as CAN_RX3_3V3 and CAN_TX3_3V3 in the circuit. When the signal line is in a high-impedance state, the pull-up resistor will pull up the signal line voltage to a level close to the power supply voltage, ensuring that the signal line does not remain in an uncertain state and facilitating the stable transmission of digital signals.

[0074] CAN_RX3_3V3 and CAN_TX3_3V3 are low-level signals used for communicating with devices with 3.3V logic levels. They are respectively connected to the 3.3V power supply and grounded through the first pull-up resistor RCH6 and the second pull-up resistor RCH7. Among them, CAN_RX3_3V3 is a receiving signal used to receive data from the CAN bus, and the signal level is 3.3V. When the data on the CAN bus is transmitted to this module, after being converted by the first voltage conversion chip U4, it is provided to the subsequent 3.3V logic level circuit (such as a microcontroller, etc.) for processing in the form of a 3.3V level; CAN_TX3_3V3 is a transmitting signal used to send 3.3V level data to the CAN bus. It converts the data from a 3.3V logic level device (such as a microcontroller) through the first voltage conversion chip U4 and then sends it to the CAN bus, realizing the data sending function between the 3.3V level device and the CAN bus.

[0075] CAN_RX3_5V and CAN_TX3_5V are high-level signals used for communicating with devices with 5V logic levels. They are respectively connected to VDD_C (5V power supply). Among them, CAN_RX3_5V is a receiving signal used to receive data from the CAN bus and then provide it to the subsequent 5V logic level circuit for processing in the form of a 5V level. It converts the data on the CAN bus into a 5V level through the first voltage conversion chip U4, facilitating data interaction with 5V devices; CAN_TX3_5V is a transmitting signal used to send 5V level data to the CAN bus. It converts the data from a 5V logic level device through the first voltage conversion chip U4 and then sends it to the CAN bus, realizing the data sending function between the 5V level device and the CAN bus.

[0076] In this circuit, the first voltage conversion chip U4 plays a key role in level conversion, enabling devices with different levels (3.3V and 5V) to communicate through the CAN bus.

[0077] Furthermore, Figure 6The serial numbers 1 to 8 respectively represent different circuits, which are respectively connected to the following port pins: VDD1 is a power input port, which provides power for a part of the circuit of the voltage conversion chip; VDD2 is also a power input port, similar to VDD1, but may be different in voltage value or power supply range, and it is mainly used to supply power for the high-voltage circuit part inside the chip; VOA is an output port, which is used to output a signal voltage after voltage conversion; VIA is an input port, which receives analog signals or digital signals from the external circuit; VIB is also an input port, similar to VIA, and the signal it receives is used to implement functions such as differential input; VOB is the output port corresponding to VIB, which is used to output the processed signal; GND1 and GND2 both serve as the reference ground in the circuit, providing a low-impedance return path for the current, where GND2 is mainly used to provide a grounding reference for the high-voltage circuit part.

[0078] C9 is a decoupling capacitor, which is taken as 0.1uF in this embodiment. It is connected between the power pin (VDD) of the first transceiver chip U5 and the ground (GND_C). Its function is to provide instantaneous current requirements for the first transceiver chip U5, and reduce the impact of high-frequency noise on the chip on the power line. When the internal circuit of the first transceiver chip U5 works, if there is an instantaneous current change, C9 can quickly release the stored charge, maintain the stability of the voltage of the chip's power pin, and ensure the normal operation of the chip.

[0079] The first transceiver chip U5 has multiple functional pins. Among them, TXD (Transmit Data Pin) is used to receive the transmit data signal from the microcontroller; RXD (Receive Data Pin) sends the received CAN bus data to the microcontroller; VDD and VSS are power pins; VREF is a reference voltage pin; CANH and CANL are differential signal pins of the CAN bus. When the microcontroller wants to send data, the data enters the first transceiver chip U5 through the TXD pin. After the first transceiver chip U5 converts and modulates the signal, it sends the signal to the CAN bus through the CANH and CANL pins. On the contrary, when there is data on the CAN bus, the first transceiver chip U5 receives the signal through the CANH and CANL pins. After demodulation and conversion, the data is sent from the RXD pin to the microcontroller.

[0080] C6 and C7 are also decoupling capacitors, which are both taken as 0.1uF in this embodiment. They are respectively connected between the power pin (VDD_C) of the first transceiver chip U5 and the ground (GND_CAN), and play a similar role to C9, further stabilizing the power supply voltage of the first transceiver chip U5.

[0081] The resistors R3 and R4 are termination matching resistors. In CAN bus communication, to prevent signal reflection and standing wave phenomena, matching is required at both ends of the bus. They are connected to the CANH and CANL signal lines, providing appropriate impedance matching so that when the CAN bus signal is transmitted on the bus, the energy can be effectively absorbed, reducing signal reflection and ensuring signal integrity.

[0082] As Figure 8 shown, in the CAN bus interface module (taking CAN3 as an example), the second filter capacitor C10 (1000 pF in this embodiment), the inductor L1 (11 uH in this embodiment), and the first filter capacitor C8 (1000 pF in this embodiment) form an LC filter network, that is, a low-pass filter, which can filter out high-frequency interference signals on the CAN bus. Electromagnetic interference (EMI) may be coupled to the CAN bus signal, and this LC filter network can filter out interference signals above a certain frequency (determined by the inductor L1 and the capacitance value), thereby ensuring the quality of the CAN communication signal.

[0083] GND_CAN and GND_C are two different grounds. GND_CAN is the reference ground of the CAN bus, providing a stable reference potential for the CAN bus signal. GND_C is the analog ground or digital ground of the CAN controller circuit, used to isolate different parts of the circuit and reduce the interference of the potential difference between different grounds on the signal. By reasonable ground division and connection, signal interference caused by ground wire impedance can be avoided, ensuring the reliability of CAN communication.

[0084] The remaining structure is the same as that of Embodiment 2.

[0085] The signal transmission process of the CAN communication interface (taking CAN3 as an example): When the microcontroller needs to send data, the data is first sent to the TXD pin of the first transceiver chip U5. The first transceiver chip U5 modulates these data, converting them into differential signals suitable for transmission on the CAN bus. The modulated signals are output through the CANH and CANL pins of the first transceiver chip U5; the output signals pass through R3 and R4 (termination resistors) to ensure good transmission characteristics of the signals on the CAN bus and reduce phenomena such as reflections. Then the signals enter the LC filter network to filter out possible high-frequency interference signals; the filtered signals are output from the CAN3_H_P and CAN3_L_P pins and connected to the external CAN bus; when receiving signals, the external CAN bus signals enter from the CAN3_H_P and CAN3_L_P pins. After being filtered by the LC filter network to remove interference, the signals reach the CANH and CANL pins of the first transceiver chip U5; the first transceiver chip U5 demodulates the received signals, converting the differential signals into logic level signals suitable for the microcontroller to receive, and then sends the data to the microcontroller through the RXD pin. During the whole process, the power supply module provides stable power for each chip, and various filter capacitors, resistors and other components play an auxiliary role to ensure the integrity and reliability of the signals.

[0086] For the CAN2 part, its circuit principle is similar to that of CAN3, so the circuit drawings and descriptions of it in the present invention are omitted.

[0087] Data sending processing process of the first transceiver chip U5 of CAN: First, data input and level conversion (TXD pin) are carried out. The TXD pin of the first transceiver chip U5 of CAN receives the sending data from the microcontroller. These data usually appear in the form of logic level signals, for example, under the logic level standards of 3.3V or 5V. Assuming that the microcontroller uses 3.3V logic level, when the TXD pin of the first transceiver chip U5 receives a high level (corresponding to logic "1") or a low level (corresponding to logic "0"), this is the original data signal to be sent to the CAN bus; inside the first transceiver chip U5, these logic level signals are preliminarily processed. It will convert the signals into levels suitable for subsequent sending circuit processing according to the level conversion circuit inside the chip, such as buffering and amplifying the signals to ensure that the signals have sufficient driving ability to drive the subsequent sending circuit.

[0088] Next, signal modulation (transmission driver) is performed. The signal after level conversion enters the transmission driver inside the first transceiver chip U5. The main function of the transmission driver is to convert the logic level signal into a differential signal suitable for transmission on the CAN bus. In CAN bus communication, differential signals are usually used to improve the anti-interference ability; the differential signal of the CAN bus is generated between the CANH and CANL pins. When transmitting logic "0", the transmission driver will cause the voltage of the CANH pin to rise to a relatively high level (such as 3.3V or 5V, depending on the chip design and power supply voltage), while causing the voltage of the CANL pin to drop to a relatively low level (such as close to 0V). In this way, a relatively high voltage difference will be generated between CANH and CANL. Usually, this voltage difference may be about 2V, and the specific value varies depending on the chip and bus standard. When transmitting logic "1", the transmission driver will make the voltages of the CANH and CANL pins in a balanced state, that is, the voltage difference between them is very small, close to 0V. This encoding method of differential signals can effectively distinguish logic "0" and logic "1", and has a strong ability to suppress common-mode interference.

[0089] Finally, signal output (CANH and CANL pins) is performed. The modulated differential signal is output to the external CAN bus through the CANH and CANL pins of the first transceiver chip U5. During the output process, the signal will also be affected by some external components (such as termination matching resistors, filter capacitors, and inductors, etc.). The termination matching resistor can ensure good transmission characteristics of the signal on the bus and reduce phenomena such as reflection; the filter capacitor and inductor can filter out high-frequency interference components in the signal to ensure the signal quality of the transmitted signal.

[0090] The receiving data processing process of the first transceiver chip U5 of CAN: First, signal input (CANH and CANL pins) is performed. The differential signal from the external CAN bus enters the chip through the CANH and CANL pins of the first transceiver chip U5. These signals may be affected by various interference factors, such as electromagnetic interference, reflection on the bus, etc., so the chip will perform preliminary processing on the input signal internally. The receiving circuit inside the first transceiver chip U5 will filter and amplify the input differential signal. The filter circuit can remove some high-frequency noise components in the signal, while the amplifier circuit will amplify the signal to an appropriate amplitude so that the subsequent signal processing circuit can accurately identify the signal.

[0091] Next, signal demodulation is performed. The amplified differential signal enters the receiving comparator inside the first transceiver chip U5. The function of the receiving comparator is to convert the differential signal into a logic level signal. It compares the voltage difference between the CANH and CANL pins. If the voltage difference exceeds a certain threshold (for example, greater than 0.5V, and this threshold varies depending on the chip and bus standard), it is considered that a logic "0" is received; if the voltage difference is lower than this threshold, it is considered that a logic "1" is received.

[0092] For example, when the voltage of the CANH pin is 3.3V and the voltage of the CANL pin is 0.3V, the voltage difference between the two is 3V, which is much greater than the threshold voltage. At this time, the comparator outputs a logic "0"; when the voltages of the CANH and CANL pins are close to equal (such as around 1.5V each), and the voltage difference is less than the threshold voltage, the comparator outputs a logic "1".

[0093] Then, data output and level conversion (RXD pin) are performed. The logic level signal demodulated by the receiving comparator will be further processed. Inside the first transceiver chip U5, the signal will be level-converted according to the output level standard of the chip (such as 3.3V or 5V logic level) to ensure that the output signal can match the logic level standard of the microcontroller.

[0094] Finally, the processed received data is output through the RXD pin of the first transceiver chip U5 and sent to the microcontroller to complete the data receiving process.

[0095] Embodiment 3

[0096] Referring to Figures 1-13 , this is the third embodiment of the present invention. Different from the previous embodiment, this embodiment provides an RS485 communication interface and an RS232 communication interface.

[0097] Specifically, the communication interface 201 further includes an RS485 communication interface, which includes a first signal conversion circuit connected to the core board 102 through an RS485 transceiver chip, used to convert the digital signal of the core board 102 into a differential signal for transmission, and convert the received differential signal into a digital signal. The signal conversion and transmission are realized through a dedicated RS485 transceiver chip. The RS485 transceiver chip converts the digital signal output by the microcontroller of the main board 100 into a differential signal conforming to the RS485 standard for transmission, and at the same time converts the received RS485 differential signal into a digital signal for the microcontroller to process. It is commonly used in long-distance, multi-point communication scenarios, can connect multiple devices, and realizes high-speed and stable data transmission. It is used to connect a metering table in the wind power converter controller system.

[0098] Further, the communication interface 201 further includes an RS232 communication interface, which includes a second signal conversion circuit connected to the core board 102 through an RS232 level conversion chip, and is used to convert the digital logic level of the main board 100 into positive and negative voltage levels of the RS232 standard. It is used for short-distance, point-to-point communication with computers, terminal devices, etc., for device debugging, data downloading, etc.

[0099] Among them, as Figures 9-13 shown, the first signal conversion circuit and the second signal conversion circuit are respectively provided with a second power module and a third power module. In the second power module and the third power module, the function of the second voltage conversion chip U60 and the third voltage conversion chip U62 is to convert the power supply voltage into 3.3V to provide the operating voltage for some components in the subsequent RS485 and RS232 communication circuits. For example, it provides a suitable operating voltage for the second transceiver chip U59 (i.e., the RS485 transceiver chip) and the third transceiver chip U68, the fourth transceiver chip U69 (RS232 transceiver chip), etc., so that these chips can correctly receive and send signals; the first decoupling capacitor C235, the second decoupling capacitor C236, the third decoupling capacitor C239, and the fourth decoupling capacitor C240 are connected between the power supply pin of the chip and the ground (GND_CAN). Their function is to provide instantaneous current demand for the chip and reduce the impact of high-frequency noise on the chip on the power supply line. When the internal circuit of the chip works, if there is an instantaneous current change, the capacitor can quickly release the stored charge to maintain the stability of the voltage at the power supply pin of the chip and ensure the normal operation of the chip; C237 and C238 (both are 10uF in this embodiment) are the ninth filter capacitors, which are usually connected between the positive and negative poles of the power supply. Their function is to filter out the ripple and noise in the power supply, provide a cleaner power supply for the RS485 and RS232 communication circuits, and avoid the interference components in the power supply from affecting the signal transmission quality.

[0100] In the RS485 communication module, the second transceiver chip U59 has multiple functional pins. RO (receive output pin) is used to send the received RS485 bus signal to the microcontroller; RE (receive enable pin) is used to control the enabling or disabling of the receive function; DE (driver enable pin) is used to control the enabling or disabling of the send function; DI (send input pin) is used to receive the send data signal from the microcontroller; A and B are the differential signal pins of the RS485 bus; VCC and GND are the power supply pins.

[0101] When the microcontroller needs to send data, the data enters the second transceiver chip U59 through the DI pin. At the same time, the DE pin is pulled high (assuming high-level enables transmission). After the second transceiver chip U59 converts and modulates the signal, it is sent to the RS485 bus through pins A and B. For example, when sending logic "0", the voltage of pin A is lower than that of pin B; when sending logic "1", the voltage of pin A is higher than that of pin B.

[0102] When there is data on the RS485 bus, the data enters the second transceiver chip U59 through pins A and B. At the same time, the RE pin is pulled low. After the second transceiver chip U59 converts the received differential signal into a single-ended signal, it is sent to the microcontroller from the RO pin.

[0103] R243 (220Ω in this embodiment) is the terminal matching resistor. In RS485 bus communication, to prevent signal reflection and standing wave phenomena, matching is required at both ends of the bus. It is connected to the A and B signal lines of the RS485 bus, providing appropriate impedance matching so that when the RS485 bus signal is transmitted on the bus, the energy can be effectively absorbed, reducing signal reflection and ensuring signal integrity.

[0104] R242 and R244 (both 4.7k in this embodiment) are the third pull-up resistors. They are connected to signal lines such as RS485_TX_EN (transmission enable signal line). When the signal line is in a high-impedance state, the third pull-up resistor will pull the signal line voltage up to a level close to the power supply voltage, ensuring that the signal line does not remain in an uncertain state, which is very important for the stable transmission of digital signals.

[0105] In the RS232 communication module, the third transceiver chip U68 and the fourth transceiver chip U69 are used to convert the TTL-level signal of the microcontroller into an RS232-level signal (transmission direction), and convert the RS232-level signal into a TTL-level signal (reception direction). For example, during transmission, the low level (such as 0V) output by the microcontroller will be converted into a negative voltage of the RS232 standard (such as about -12V), and the high level (such as 3.3V or 5V) will be converted into a positive voltage of the RS232 standard (such as about +12V); during reception, the positive voltage of RS232 will be converted into a high level of TTL level, and the negative voltage will be converted into a low level of TTL level.

[0106] HC9, HC6, and HC10 are the tenth filter capacitors. In this embodiment, the tenth filter capacitor, the third filter capacitor HC8, and the fourth filter capacitor HC7 are all 10 uF. They are all connected between the power supply pins of the third transceiver chip U68 and the fourth transceiver chip U69 and the ground (GND_CAN). Their function is to filter out the ripples and noises in the power supply, provide a stable power supply for the RS232 transceiver chip, and ensure the accuracy of signal conversion.

[0107] HU1 is an isolation transformer or a signal isolator. Its function is to provide signal isolation, isolate the RS232 signal from other circuits on the main board, and prevent problems such as ground potential differences in RS232 communication from damaging the main board circuit. For example, when the RS232 communication line is connected to other devices, there may be different ground potentials. Through HU1, the current caused by the ground potential difference can be prevented from impacting the main board circuit.

[0108] The remaining structure is the same as that of Embodiment 2.

[0109] RS485 communication interface signal transmission process: When the microcontroller needs to send data, the data is first sent to the DI pin of the second transceiver chip U59. At the same time, the microcontroller enables the transmission function of the second transceiver chip U59 (pulls up the DE pin) through relevant circuits (such as R242, R244, etc.) with the RS485_TX_EN signal. The second transceiver chip U59 internally modulates the signal and converts it into a differential signal suitable for transmission on the RS485 bus. The modulated signal is output through pins A and B, and after passing through R243 (the termination matching resistor), it is connected to the external RS485 bus; when receiving a signal, the external RS485 bus signal enters the second transceiver chip U59 through pins A and B. The microcontroller enables the receiving function by controlling the RE pin (pulls down the RE pin). The second transceiver chip U59 demodulates the received signal, converts the differential signal into a logic level signal suitable for the microcontroller to receive, and then sends the data to the microcontroller through the RO pin.

[0110] RS232 communication interface signal transmission process: When the microcontroller needs to send data, the data is sent to the transmit input pins of the third transceiver chip U68 or the fourth transceiver chip U69 through the UARTDBG / TX pin. The third transceiver chip U68 or the fourth transceiver chip U69 converts the TTL level signal into an RS232 level signal and then sends it to the external RS232 communication line through the RS232_TXD1 pin. In this process, capacitors such as the third filter capacitors HC8 and HC9 play a filtering role to provide a stable power supply for the chip; when an external device sends data to the main board through the RS232 communication line, the signal enters the third transceiver chip U68 or the fourth transceiver chip U69 from the RS232_RXD1 pin. After the third transceiver chip U68 or the fourth transceiver chip U69 converts the RS232 level signal into a TTL level signal, it is sent to the microcontroller through the UARTDBG / RX pin. At the same time, HU1 plays an isolation role during the entire RS232 communication process to prevent the ground potential of the external device from interfering with or damaging the main board circuit.

[0111] Embodiment 4

[0112] Refer to Figures 1-16 , which is the fourth embodiment of the present invention. Different from the previous embodiment, this embodiment provides a code disk input interface 202 and an expansion interface 204. Specifically, the code disk input interface 202 is adapted to the code disk signal terminal PSD1, and each code disk input interface 202 is connected to the input end of an optocoupler isolation circuit, and the input signal is stabilized through a filtering and shaping circuit. The optocoupler plays an electrical isolation role, converting the external 24V code disk signal into a digital signal suitable for the main board 100 to process.

[0113] At the same time, the input signal is processed through the filtering and shaping circuit to improve the quality and stability of the signal. The code disk input interface is used in the wind power converter controller system to measure information such as the position and speed of rotational motion, and is used for motor control, position detection, etc.

[0114] Preferably, the expansion interface 204 includes 2 FT3 interfaces for interface expansion. The 2 FT3 interfaces are implemented through a specific protocol chip and interface circuit. The protocol chip is responsible for processing the encoding and decoding of the FT3 protocol, and the interface circuit ensures the transmission quality and compatibility of the signal. In the wind power converter controller system, the FT3 interface is used for data transmission in the system, with a speed of 20M, and can achieve high-precision measurement and control data exchange. And these 2 FT3 interfaces are scalable and can be connected to more external devices or modules according to needs to meet the upgrade and expansion of system functions.

[0115] The filtering and shaping circuit includes a fourth power supply module, a code disk signal input module, a signal processing module, and a signal output module. The fourth power supply module uses a 3.3V power supply to provide the working power supply for the entire filtering and shaping circuit. The signals output by the code disk require a suitable power supply to ensure the stability of their levels. The 3.3V power supply is used to supply power to components such as optocouplers (U9, U10) to ensure their normal operation.

[0116] As Figures 14-15 shown, in the code disk signal input module, SPEEDA+, SPEEDA-, SPEEDB+, SPEEDB-, SPEEDZ+, and SPEEDZ- are all signal output terminals of the code disk. The code disk usually outputs differential signals. For example, SPEEDA+ and SPEEDA- are a pair of differential signals, SPEEDB+ and SPEEDB- are another pair of differential signals, and SPEEDZ+ and SPEEDZ- are the third pair of differential signals. Differential signals can improve the anti-interference ability of the signals and are suitable for occasions with a relatively complex electromagnetic environment such as wind power converters.

[0117] R115, R118, R120, R124, R125, and R128 (all taken as 2.4K in this embodiment) are also pull-up resistors. They are connected between the code disk signal lines and the 3.3V power supply. When the code disk signal is in a high-impedance state, these pull-up resistors will pull up the signal line voltage to a level close to 3.3V to ensure that the signal line does not remain in an uncertain state and guarantee the integrity of the signal.

[0118] C31, C35 (both taken as 0.1uF in this embodiment), C32, C36 (both taken as 1uF in this embodiment), C33, C34, and C37 (taken as 101±10% in this embodiment) are all fifth filter capacitors. They are connected between the power supply and the ground to filter out the ripples and noises in the power supply, provide a stable power supply environment for the transmission of the code disk signals, and can also filter out the high-frequency interference signals on the signal lines to ensure the quality of the code disk signals.

[0119] In the signal processing module, D1, D2, D3, D4, D5, and D6 are all diodes, but some can be changed to resistors (such as D5). When working as diodes normally, they can be used for signal clamping protection to prevent the signal voltage output by the code disk from being too high or too low and damaging the subsequent circuit. When changed to a resistor (such as D5 changed to a resistor), it can play the role of current limiting and impedance matching, and adjust the amplitude and transmission characteristics of the signal.

[0120] U9 and U10 are optocouplers, and their function is to perform signal isolation and level conversion. The input side of the optocoupler receives the signals from the code disk, and the output side is connected to the subsequent control circuit. When the code disk outputs a signal, the signal passes through the light-emitting diodes (ANODE1 and CATHODE1, ANODE2 and CATHODE2) of the optocoupler to turn on the internal photosensitive transistors (VO1, VO2), thereby transmitting the signal to the output side. This isolation method can effectively prevent the interference signals on the code disk side from entering the subsequent control circuit, and at the same time, it can also convert the signal level of the code disk into a level suitable for the subsequent circuit to process.

[0121] R123, R116, R126 (all take 20K ± 0.5% in this embodiment) are pull-down resistors. They are connected between the output side of the optocoupler and the ground. When the pull-down resistors cooperate with the photosensitive transistors of the optocoupler, it can ensure that the low level of the optocoupler output signal is in a stable low level state, improving the stability of the signal.

[0122] As Figure 16 shown, in the signal output module, M16 is a connector for outputting the processed code disk signals to the subsequent control circuit (such as a microcontroller). The code disk signals (SPEED_A, SPEED_B, SPEED_C) after being isolated and processed by the optocoupler are connected to other parts of the main board through M16, so that the microcontroller can further process and analyze the code disk signals.

[0123] The remaining structure is the same as that of Embodiment 3.

[0124] The signal transmission process of the code disk input interface 202: The encoder outputs differential signals (SPEEDA+, SPEEDA-, SPEEDB+, SPEEDB-, SPEEDZ+, SPEEDZ-), which, after being preliminarily processed by pull-up resistors (such as R115) and filter capacitors (such as C31), enter the input side of the optocouplers (U9, U10); inside the optocouplers, when the light-emitting diodes on the input side receive the encoder signals, they emit light to turn on the photosensitive transistors on the output side. For example, when the SPEEDA+ signal is at a high level, the corresponding light-emitting diode conducts, the photosensitive transistor conducts, and the SPEED_A- signal on the output side is at a low level; when the SPEEDA+ signal is at a low level, the light-emitting diode is cut off, the photosensitive transistor is cut off, and under the action of the pull-down resistor (such as R123), the SPEED_A- signal is at a high level; the signals (SPEED_A-, SPEED_B-, SPEED_C-) processed by the optocouplers are output to the subsequent control circuit, such as a microcontroller, through the connector M16. The microcontroller calculates information such as the position and speed of the encoder based on these signals. At the same time, during the signal transmission process, diodes (or components after being changed to resistors) perform operations such as clamping or current limiting on the signals to ensure the integrity of the signals and the safety of the circuit.

[0125] Embodiment 5

[0126] Referring to Figures 1-16 , this is the fifth embodiment of the present invention. Different from the previous embodiment, this embodiment provides: 2 CAN communication interfaces, 1 RS485 communication interface, and 1 RS232 communication interface; 3 encoder input interfaces 202; an expansion interface 204 for interface expansion, including 2 FT3 interfaces, and the functions of each interface have been described in detail above.

[0127] In addition, the main board interface 200 in this embodiment further includes: at least one Ethernet interface for monitoring the system; 9 Hall sampling interfaces, which include Hall power output for acquisition; 32 AD sampling interfaces for Hall acquisition on this board; at least one Chopper optical port, which includes 3 receiving ends and 3 sending ends for connecting the IGBT drive board; at least three input interfaces, which are 24V inputs; at least four output interfaces, which are 220V dry contacts; at least twelve IGBT interfaces, which are divided into 2 circuits on the machine side and 2 circuits on the network side; and a board power supply that provides 15V voltage.

[0128] Referring to Table 3-5 below, several external terminals adapted to the main board interface 200 in this embodiment are shown, adopting an upper and lower layer staggered layout structure.

[0129] Table 3

[0130] Table 4

[0131] Table 5

[0132] The above Tables 3 - 5 respectively show the PWM signal wiring terminals of the A - phase, B - phase, and C - phase of the 30 - core grid - side of the wind power converter controller. The PWM signal terminals are composed of multiple pins. Among them, the even - numbered pins are arranged on the upper layer of the main board 100, and the odd - numbered pins are arranged on the lower layer of the main board 100. Similarly, the identification part of this embodiment sets a triangular identification at the No. 1 pin, and the direction of the triangular tip is the wiring direction. The multiple pins are used to output PWM signals. These pins are connected to the PWM drive circuit and the output power module, and can be used to control the switching state of power devices (such as IGBTs) to achieve precise control of loads such as motors. Among them, SO_NA, SO_NB, and SO_NC are all module faults, and FOUT_NA, FOUT_NB, and FOUT_NC are all module temperatures. During operation, the micro - controller generates PWM signals, and the PWM signals are amplified by the drive circuit to drive power devices such as IGBTs. The IGBT controls the power output of the load according to the duty cycle of the PWM signal. In addition, the PWM signal wiring terminals of the A - phase, B - phase, and C - phase on the two - machine - side of the 30 - core wind power converter controller respectively correspond to the P7, P8, and P9 terminals of the main board 100, and the P14, P17, and P19 terminals of the main board 100. The structure of the PWM signal wiring terminals is the same as the above, so it will not be described in detail. In addition, this embodiment also provides as Figure 4 In it, PP1 is a signal terminal providing 3 - way inputs and 4 - way outputs, P15 is a CAN communication terminal, P6 and P10 are both 15V power supply terminals, P3 is a 40 - core analog quantity wiring terminal, and HJ1 is a network port. They all adopt a structure of upper - layer and lower - layer misaligned arrangement, so that the main board 100 can provide multiple interfaces in a limited space, thereby solving the problem of single - interface.

[0133] The remaining structure is the same as that of Embodiment 4.

[0134] Embodiment 6

[0135] Referring to Figures 1-17 , this is the sixth embodiment of the present invention. Different from the previous embodiment, this embodiment provides a wind power converter controller, including a main board 100 and a main board interface 200, and also including a digital input / output board 300, an analog input / output board 400, and a communication expansion board 500, which solves the problem that the existing wind power converter controller has insufficient flexibility in the controller interface scheme and cannot adapt to different application scenarios.

[0136] Specifically, the digital I / O board 300 is connected to the CAN communication interface of the main board 100 and is used to collect external switch states and control external devices; the analog board 400 is connected to the Hall sampling interface and the AD sampling interface of the main board 100 and is used to collect and process analog signals; the communication expansion board 500 is connected to the expansion interface 204 of the main board 100 to provide additional communication capabilities.

[0137] Further, the digital I / O board 300 includes at least one 24V input terminal for collecting external 24V switch signals; one 220V dry contact output terminal for outputting 220V control signals; and an opto-isolation circuit for achieving electrical isolation.

[0138] Among them, the analog board 400 includes at least one 1140V AC input terminal for collecting high-voltage AC signals; one CT input terminal for collecting current signals; one 1100V DC voltage input terminal for collecting high-voltage DC signals; and one Hall sampling input terminal for collecting current signals. Preferably, the analog board 400 also includes a high-voltage voltage-dividing circuit for reducing the high voltage proportionally to a low voltage range suitable for processing; and an analog signal conditioning circuit including gain adjustment, offset calibration, and filtering.

[0139] Furthermore, the communication expansion board 500 provides additional CAN communication interfaces, Profibus communication interfaces, and RS485 communication interfaces to expand the communication capabilities of the system. The CAN communication interface is used to achieve high-speed and reliable data exchange between devices; the Profibus communication interface is used for connecting and communicating multiple devices; the RS485 communication interface is used for long-distance and multi-point communication; the CAN interface is usually connected to the main board through a dedicated CAN controller and transceiver chip, and the CAN controller is interconnected with the microcontroller of the core board through SPI or a parallel bus to achieve data transmission, and the CAN bus transceiver is responsible for converting the signals of the controller into signals suitable for long-distance transmission; the Profibus interface is connected to the main board through a dedicated Profibus controller and transceiver, and the controller is usually connected to the core board through SPI or a parallel bus to achieve data sending and receiving; the RS485 interface is connected to the main board through an RS485 transceiver chip, and the transceiver chip converts the digital signals of the main board into differential signals for transmission and converts the received differential signals into digital signals.

[0140] Among them, there are at least two RS485 communication interfaces. The two RS485 communication interfaces are electrically isolated from each other and are respectively configured with different communication parameters. The two RS485 interfaces can be connected to more devices to meet the diverse communication requirements in complex systems. When one RS485 interface fails, the other can be used as a backup to improve the reliability and stability of the system. The two RS485 interfaces can also achieve electrical isolation to avoid signal interference and improve the stability and security of signal transmission. In addition, the two RS485 interfaces can be respectively configured with different communication parameters to adapt to different application scenarios.

[0141] Preferably, the wind power converter controller in this embodiment further includes a power management module for providing stable power to the main board and its interfaces. The power management module includes an LDO voltage regulator for converting the 15V power supply into 3.3V. The wind power converter controller uses a low-cost MCU to simplify the hardware design and reduce the controller cost. The MCU supports multifunctional multiplexed pins and can be configured as SWD, USB, I2C or serial port functions. The wind power converter controller also adopts a low-power design and directly supplies power from 15V to 3.3V through the LDO to improve the power stability and reliability. In addition, the wind power converter controller also has multifunctional multiplexed pins and supports multiple interface functions such as SWD, USB, I2C and serial ports to flexibly adapt to different application scenarios.

[0142] The input signals of the digital input board 300 include 20 relay inputs 300-X1, 2 4~20mA inputs 300-X2, 5 PT100 temperature signals 300-X3, and IDC level input (15V). The output signals of the digital input board 300 include 16 relay outputs 300-Y1. Among them, the digital input board 300 is responsible for receiving and processing digital signals (relay inputs, temperature signals, etc.) and transmitting these signals to the core board 102. At the same time, it receives control signals (relay outputs) from the core board 102 to control external devices (such as circuit breakers, contactors, etc.).

[0143] The input signals of the analog board 400 include 4 channels of ±1100V DC voltage inputs 400-X1, 3 channels of grid voltage inputs 400-X2 (1-phase 1100V), 3 channels of grid current inputs 400-X3 (2-phase 1140V), 3 channels of stator voltage inputs 400-X4, 3 channels of stator current inputs 400-X5, 3 channels of filtered current inputs 400-X6, 9 channels of open-loop Hall inputs 400-X7 (±10V), and an IDC level input (15V); the output signals of the analog board 400 include 2 channels of machine-network side Hall power outputs 400-Y2 (±15V), and 4 channels of ±1100V DC voltage outputs 400-Y1. Among them, the analog board 400 is responsible for collecting and processing analog signals (such as voltage, current, temperature, etc.), and transmitting these signals to the core board. It also receives analog output signals from the core board 102 for controlling external devices (such as motors, sensors, etc.).

[0144] The input signals of the main board 100 include signal inputs 100-X1 (relay inputs, temperature signals, etc.) from the digital I / O board 300, signal inputs 100-X2 (voltage, current, temperature, etc.) from the analog board 400, signal inputs 100-X3 from the communication expansion board 500, and an IDC level input (15V); the output signals of the main board 100 include signal outputs 100-Y1, 100-Y2, and 100-Y3 from the digital I / O board 300, the analog board 400, and the communication expansion board 500. In addition, the input and output signals of the main board 100 also include 3 channels of 5M fiber optic signals Z1 for chopper, 4 three-phase full-bridge pulse signals Z2, 3 channels of encoder signals Z3 (24V), 2 channels of FT3 extended serial ports Z4, 1 channel of RS485 signal Z6, 1 channel of RS232 signal Z7, and 2 channels of Ethernet serial ports Z5 connected to the core board 102. Among them, the core board 102 is the control center of the entire system, responsible for processing signals from the digital I / O board 300 and the analog board 400, and generating output signals according to the control logic. It communicates with external devices (such as the host computer, sensors, actuators, etc.) through Profibus, Can bus, and RS485 interfaces. The core board 102 is also responsible for transmitting control signals to the digital I / O board and the analog board to achieve the control of external devices.

[0145] The input signals of the communication expansion board 500 include 1 Profibus interface, 1 Can bus interface, and 2 RS485 interfaces; the output signals of the communication expansion board 500 include 1 Profibus interface, 1 Can bus interface, and 2 RS485 interfaces. Among them, the communication expansion board 500 is used to expand the communication capabilities of the core board 102, providing additional Profibus, Can bus, and RS485 interfaces. It can be flexibly configured according to the requirements of engineering projects to meet different communication needs.

[0146] The remaining structures are the same as those in Embodiment 5.

[0147] In summary, the digital input / output board 300 and the analog input / output board 400 are responsible for collecting and processing input signals and transmitting the signals to the core board 102. The core board 102 is the control center of the entire wind power converter controller, responsible for signal processing, logic control, and communication. The communication expansion board 500 is used to expand the communication capabilities of the core board 102 to meet the requirements of different engineering projects. Through modular design, the entire control system of the wind power converter controller realizes the complete functions of signal acquisition, processing, control, and communication.

[0148] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered by the scope of the claims of the present invention.

Claims

1. A main board, characterized in that: Including, a bottom plate (101) connected to a power supply for providing mechanical support and electrical connection; a core board (102) including a microcontroller, which is fixed on one side of the bottom plate (101) and electrically connected to the bottom plate (101); and, a terminal connection assembly (103) including an upper connection part (103a) and a lower connection part (103b) respectively arranged on the end face of the bottom plate (101) for connecting each external terminal; wherein, the upper connection part (103a) is electrically connected to the core board (102) through a main wire and includes at least one main connection point for transmitting power supply and signals to the main part of the device; the lower connection part (103b) is electrically connected to the core board (102) through a branch wire and includes at least one branch connection point for distributing power supply and signals to other branch circuits or devices.

2. The motherboard according to claim 1, wherein: Both the upper connection part (103a) and the lower connection part (103b) include conductive terminals, and each conductive terminal is respectively adapted to a connection point; The connection between the conductive terminal and the bottom plate (101) is detachable.

3. The motherboard according to claim 1, characterized in that: The upper connection part (103a) and the lower connection part (103b) are separated by an insulating material.

4. A motherboard interface, applied to the motherboard according to any one of claims 1 to 3, characterized in that: Including a communication interface (201), a code disk input interface (202), a sampling interface (203) and an expansion interface (204) adapted to the external terminals of the main board (100); The communication interface (201) is used for communication between the main board (100) and the device; The code disk input interface (202) is used for measuring the position and speed of the rotational movement of the fan; The sampling interface (203) is used for controlling data transmission in the wind power system, and includes nine-way Hall sampling interfaces and thirty-two-way AD sampling interfaces; The expansion interface (204) includes an FT3 interface for interface expansion; wherein, the communication interface (201) includes two CAN communication interfaces adapted to communication terminals (P16), one of the CAN communication interfaces communicates with a digital input / output board (300), and the other CAN communication interface communicates with the main control system of the fan.

5. The motherboard interface according to claim 4, wherein: The CAN communication interface includes, a CAN controller interconnected with the microcontroller of the core board (102) through an SPI or parallel bus for realizing data transmission; a first transceiver chip (U5) electrically connected to the core board (102) for converting the signals of the CAN controller into differential signals; and, a logic control circuit for parsing and re-encapsulating the input CAN data to adapt to the CAN communication requirements of the output end.

6. The motherboard interface according to claim 5, wherein: The logic control circuit includes a first power module, a CAN controller module and a CAN bus interface module that are electrically connected to each other; The first power module includes a DC-DC converter (U2), the input end of the DC-DC converter (U2) is connected in parallel with a sixth filter capacitor (C5), and the output end of the DC-DC converter (U2) is connected in parallel with a seventh filter capacitor (C1) and an eighth filter capacitor (C2); The CAN controller module includes a first voltage conversion chip (U4) that provides the operating voltage for the first transceiver chip (U5). The first voltage conversion chip (U4) has CAN_RX3_3V3 and CAN_TX3_3V3 signal lines, and a first pull-up resistor (RCH6) and a second pull-up resistor (RCH7) are respectively connected to the CAN_RX3_3V3 and CAN_TX3_3V3 signal lines to pull up the signal line voltage value to the power supply voltage value. The CAN bus interface module includes a low-pass filter composed of a first filter capacitor (C8), a second filter capacitor (C10), and an inductor (L1) for filtering high-frequency interference signals on the CAN bus.

7. The motherboard interface according to any one of claims 4, 5, and 6, characterized in that: The communication interface (201) further includes an RS485 communication interface, which includes a first signal conversion circuit connected to the core board (102) through an RS485 transceiver chip. The first signal conversion circuit is used to convert the digital signal of the core board (102) into a differential signal for transmission and convert the received differential signal into a digital signal.

8. The motherboard interface according to claim 7, wherein: The first signal conversion circuit includes a second power supply module and an RS485 communication module that are electrically connected to each other. The second power supply module includes a second voltage conversion chip (U60) for converting the operating voltage. A first decoupling capacitor (C235) is connected between the second voltage conversion chip (U60) and the power supply pin, and a second decoupling capacitor (C236) is connected between the second voltage conversion chip (U60) and the ground. The RS485 communication module includes a second transceiver chip (U59). The second transceiver chip (U59) has a receive output pin for sending the received RS485 bus signal to the microcontroller, a receive enable pin for controlling the enabling or disabling of the receive function, a drive enable pin for controlling the enabling or disabling of the send function, a send input pin for receiving the send data signal from the microcontroller, differential signal pins, and a power supply pin.

9. The motherboard interface according to any one of claims 4, 5, and 6, characterized in that: The communication interface (201) further includes an RS232 communication interface, which includes a second signal conversion circuit connected to the core board (102) through an RS232 level conversion chip for converting the digital logic level of the main board (100) into the positive and negative voltage levels of the RS232 standard.

10. The motherboard interface according to claim 9, wherein: The second signal conversion circuit includes a third power supply module and an RS232 communication module that are electrically connected to each other. The third power supply module includes a third voltage conversion chip (U62) for converting the operating voltage. A third decoupling capacitor (C239) is connected between the third voltage conversion chip (U62) and the power supply pin, and a fourth decoupling capacitor (C240) is connected between the third voltage conversion chip (U62) and the ground. The RS232 communication module includes a third transceiver chip (U68) and a fourth transceiver chip (U69). A third filter capacitor (HC8) is connected between the power supply pin and the ground of the third transceiver chip (U68), and a fourth filter capacitor (HC7) is connected between the power supply pin and the ground of the fourth transceiver chip (U69).

11. The motherboard interface according to claim 10, wherein: The encoder input interface (202) is adapted to the encoder signal terminal (PSD1). Each encoder input interface (202) is connected to the input end of an opto-isolation circuit, and the input signal is stabilized through a filtering and shaping circuit.

12. The motherboard interface according to claim 11, wherein: The filtering and shaping circuit includes a fourth power supply module, an encoder signal input module, a signal processing module, and a signal output module that are electrically connected in sequence; The fourth power supply module supplies power to the entire circuit; The encoder signal input module includes three differential signals, several groups of pull-up resistors provided between the encoder signal line and the fourth power supply module, and several groups of fifth filter capacitors connected between the fourth power supply module and the ground; The signal processing module includes an optocoupler and several groups of pull-down resistors connected between the output side of the optocoupler and the ground; The signal output module includes a connector for outputting the processed encoder signal to the core board (102).

13. The motherboard interface according to claim 12, characterized in that: Interfaces of the same type with more than one path are separately arranged on the upper connection part (103a) and the lower connection part (103b); or / and, Multiple external terminals of interfaces of the same type are staggeredly distributed on the upper connection part (103a) and the lower connection part (103b).

14. A wind power converter controller, comprising a main board as described in any one of claims 1 to 3, characterized in that: It further includes, A digital input / output board (300) is connected to the CAN communication interface of the main board (100) and is used for collecting external switch states and controlling external devices; An analog board (400) is connected to the Hall sampling interface and the AD sampling interface of the main board (100) and is used for collecting and processing analog signals; And, A communication expansion board (500) is connected to the expansion interface (204) of the main board (100) to provide additional communication capabilities.

15. The wind power converter controller according to claim 14, wherein: The communication expansion board (500) includes at least one of the following types of communication interfaces: A CAN communication interface for realizing data exchange between devices; A Profibus communication interface for connecting and communicating multiple devices; and, An RS485 communication interface for multi-point communication; Among them, at least two RS485 communication interfaces are provided. The two RS485 communication interfaces are electrically isolated from each other and are respectively configured with different communication parameters.

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