A flexible circuit board preparation process capable of dynamic thermal management

Abstract

The present invention relates to the field of FPC technology, and in particular to a process for preparing a flexible circuit board capable of dynamic thermal management, comprising the following steps: providing a substrate and a conductive layer; preparing a metal heat dissipation layer and coating the metal heat dissipation layer with an insulating layer; forming a heat dissipation structure at the bottom of the conductive layer; sequentially stacking the substrate, the metal heat dissipation layer, and the conductive layer, and pressing them together so that the insulating layer and the heat dissipation structure are pressed against each other; wherein the metal heat dissipation layer has a plurality of heat dissipation grooves. The present invention achieves dynamic thermal management by providing a metal heat dissipation layer between the substrate and the conductive layer, forming a heat spreader structure with the metal heat dissipation layer and the conductive layer, and utilizing the heat spreader and the medium therein to achieve efficient heat dissipation, thereby allowing the electronic components on the conductive layer to operate within a normal operating temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of FPCs, and in particular to a process for preparing a flexible circuit board capable of dynamic thermal management. Background Art

[0002] One of the core components of integrated circuits is the printed circuit board (PCB). This PCB generally determines factors such as the application scenarios and integration level of an integrated circuit. Within this field, flexible printed circuit boards (FPCs) are currently a common type of printed circuit board. Their high wiring density, light weight, thinness, and excellent flexibility make them suitable for a wide range of applications. Heat dissipation in FPCs is a key consideration in ensuring their full performance. Currently, a variety of FPC heat dissipation solutions exist, covering various aspects, including materials and structures.

[0003] However, there is still room for improvement in the heat dissipation technology of flexible circuit boards. Summary of the Invention

[0004] In order to solve the problems in the prior art, the present invention provides a flexible circuit board preparation process capable of dynamic thermal management, which can make the flexible circuit board itself have a strong heat dissipation effect, so that the flexible circuit board will not be damaged or overloaded due to heat accumulation.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] The present invention provides a process for preparing a flexible circuit board capable of dynamic thermal management, comprising the following steps:

[0007] providing a substrate and a conductive layer;

[0008] preparing a metal heat dissipation layer and coating the metal heat dissipation layer with an insulating layer;

[0009] forming a heat dissipation structure at the bottom of the conductive layer;

[0010] The substrate, the metal heat dissipation layer and the conductive layer are stacked in sequence and pressed together, and the insulating layer is pressed together so as to contact the heat dissipation structure;

[0011] The metal heat dissipation layer has a plurality of heat dissipation slots.

[0012] Furthermore, the preparation of the metal heat dissipation layer includes:

[0013] A1. Provide metal sheets;

[0014] A2. The metal sheet is sequentially coated, exposed, and developed to form a first protective layer;

[0015] A3. The metal sheet is etched so that the position of the metal sheet not covered by the protective layer is corroded to form a plurality of inverted trapezoidal grooves;

[0016] A4. Fill the inverted trapezoidal groove, transforming it into a heat sink with a depth-to-width ratio greater than 1.

[0017] A5. Cleaning metal sheets.

[0018] Furthermore, step A4 specifically includes:

[0019] A41. Clean the first protective layer on the surface of the metal sheet;

[0020] A42. The metal sheet is sequentially coated, exposed, and developed to form a second protective layer; wherein the second protective layer only covers the bottom of the inverted trapezoidal groove;

[0021] A43. Filling the metal sheet so that a filling structure is formed at a position of the metal sheet not covered by the second protective layer;

[0022] A44. Clean the metal sheet to remove the second protective layer on the metal sheet surface;

[0023] The thickness of the second protective layer is not less than the height of the second protective layer.

[0024] Furthermore, in step A43, the metal plate is filled by electroplating or electrodeposition, and the material of the filling structure is the same as that of the metal substrate.

[0025] Furthermore, the heat dissipation structure formed at the bottom of the conductive layer specifically includes:

[0026] B1. The bottom of the conductive layer is sequentially coated, exposed, and developed to form a third protective layer;

[0027] B2. Electrodeposition is performed on the bottom of the conductive layer to form a plurality of protrusions, which constitute a heat dissipation structure; the plurality of protrusions correspond one to one with the plurality of heat dissipation grooves;

[0028] B3. Clean the conductive layer to remove the third protective layer.

[0029] Furthermore, step B2 specifically includes:

[0030] B21. Obtain the depth of the heat sink and calculate the aspect ratio.

[0031] B22. Subtract the desired depth from the desired depth.

[0032] B23. Control the electrodeposition time according to the desired depth value.

[0033] Furthermore, the step of sequentially stacking the substrate, the metal heat dissipation layer, and the conductive layer specifically includes:

[0034] C1. Place the cleaned substrate in the pre-stacking machine, then position the metal heat sink layer on the substrate with the heat sink facing upward.

[0035] C2. The conductive layer is adjusted to a posture with the heat dissipation structure facing downward, and then aligned with the metal heat dissipation layer, and pre-stacked on the substrate after alignment;

[0036] C3. Transferring the pre-stacked structure formed by the substrate, the metal heat dissipation layer, and the conductive layer to a hot pressing device for hot pressing.

[0037] Furthermore, a pre-stacking machine for performing steps C1-C3 is provided. The pre-stacking machine includes a machine body, a conveying mechanism, a first loading mechanism, a second loading mechanism, and a third loading mechanism, all of which are disposed on the machine body. The conveying mechanism has a carrier. The first loading mechanism is used to place a substrate on the carrier. The second loading mechanism is used to place a metal heat dissipation layer on the substrate in the carrier. The third loading mechanism is used to place a conductive layer on the metal heat dissipation layer in the carrier.

[0038] The third feeding mechanism includes a posture identifier, a negative pressure gripper, and a feeding robot. The posture identifier is connected to the feeding robot signal. The negative pressure gripper is used to absorb the conductive layer. The feeding robot's actions include:

[0039] The relative posture of the conductive layer inside the negative pressure gripper and the negative pressure gripper is obtained by using a posture identifier;

[0040] Pick up the negative pressure gripper and move it to the top of the carrier;

[0041] According to the above relative posture of the negative pressure, the negative pressure gripper is controlled to rotate horizontally so that the conductive layer is adjusted to a desired posture;

[0042] The negative pressure fixture is controlled to descend until it contacts the carrier, so that the conductive layer is stacked on the metal heat dissipation layer in the carrier.

[0043] Furthermore, the carrier includes a main body, a centering mechanism and several holding modules. The main body is provided with a receiving groove. The centering mechanism is arranged in the receiving groove and is used to center the substrate in the receiving groove; the holding module includes a holding driving part, a lifting seat, a holding part and an elastic part. The holding driving part is used to drive the lifting seat to rise and fall. The holding part is movably arranged on the lifting seat. The elastic part is arranged between the lifting seat and the holding part.

[0044] Furthermore, the holding drive member includes a linear drive, a clutch, a first transmission structure and a second transmission structure, and the linear drive drives and connects the first transmission structure and the second transmission structure respectively through the clutch;

[0045] When the clutch is in the first state, the linear drive drives the lifting seat to rotate horizontally through the first transmission structure; when the clutch is in the second state, the linear drive drives the lifting seat to move up and down through the second transmission structure.

[0046] Beneficial effects of the present invention: The present invention arranges a metal heat dissipation layer between the substrate and the conductive layer, utilizes the metal heat dissipation layer and the conductive layer to form a heat spreader structure, utilizes the heat spreader and the medium inside it to achieve efficient heat dissipation, thereby allowing the electronic components on the conductive layer to operate within the normal operating temperature, thereby realizing dynamic thermal management. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 Schematic diagram of the preparation process of the metal heat dissipation layer of the present invention.

[0048] Figure 2 Schematic diagram of the preparation process of the conductive layer of the present invention.

[0049] Figure 3 It is a schematic diagram of the process of the present invention.

[0050] Figure 4 Schematic diagram of the pre-stacking equipment used in the present invention.

[0051] Figure 5 Schematic diagram of the pressing die set of the present invention.

[0052] Figure numerals: 1—substrate, 2—metal heat dissipation layer, 3—conductive layer, 4—insulating layer, 5—pre-stacker, 21—heat dissipation groove, 22—inverted trapezoidal groove, 23—first protective layer, 24—second protective layer, 25—filling structure, 31—protrusion, 32—third protective layer, 51—machine body, 52—transmission mechanism, 53—first loading mechanism, 54—second loading mechanism, 55—third loading mechanism, 56—carrier, 551—gesture identifier, 552—negative pressure gripper, 553—loading robot, 561—main body, 562—centering mechanism, 563—pressing module, 564—receiving groove, 5631—pressing driving member, 5632—lifting seat, 5633—pressing member, 5634—elastic member, 5635

[0053] —Linear drive, 5636—clutch, 5637—first transmission structure, 5638—second transmission structure. DETAILED DESCRIPTION

[0054] In order to facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the embodiments and the accompanying drawings. The contents mentioned in the embodiments are not intended to limit the present invention. The present invention will be described in detail below with reference to the accompanying drawings.

[0055] Combine Figures 1 to 5As shown, the present invention provides a process for preparing a flexible circuit board capable of dynamic thermal management, comprising the following steps:

[0056] Providing a substrate 1 and a conductive layer 3;

[0057] Prepare a metal heat dissipation layer 2, and coat the metal heat dissipation layer 2 with an insulating layer 4;

[0058] A heat dissipation structure is formed at the bottom of the conductive layer 3;

[0059] The substrate 1, the metal heat dissipation layer 2 and the conductive layer 3 are stacked in sequence and pressed together, and the insulating layer 4 is pressed against the heat dissipation structure;

[0060] The metal heat dissipation layer 2 has a plurality of heat dissipation slots 21 .

[0061] Specifically, the present invention forms a heat spreader structure through the metal heat dissipation layer 2 and the conductive layer 3, so that heat can be quickly dissipated to the outside by the heat spreader structure, thereby achieving the advantage of good heat dissipation effect.

[0062] The substrate 1 described in this embodiment is a conventional flexible substrate 1, the conductive layer 3 is preferably copper foil or aluminum foil, and the metal heat dissipation layer 2 is a plate-like structure supported by copper or aluminum. When the metal heat dissipation layer 2 and the conductive layer 3 are pressed together, the presence of the insulating layer 4 prevents electrical conduction between them, effectively preventing short circuits.

[0063] It should be noted that the heat dissipation groove 21 on the surface of the metal heat dissipation layer 2 of the present invention is arranged opposite to the conductive layer 3 without any hollow position, which ensures that the heat dissipation groove 21 is in a sealed state under the cover of the conductive layer 3, which is beneficial to prevent the loss of the medium.

[0064] In this embodiment, the preparation of the metal heat dissipation layer 2 includes:

[0065] A1. Provide metal sheets;

[0066] A2. The metal sheet is sequentially coated, exposed, and developed to form a first protective layer 23;

[0067] A3. The metal sheet is etched so that the position of the metal sheet not covered by the protective layer is corroded to form a plurality of inverted trapezoidal grooves 22;

[0068] A4. Fill the inverted trapezoidal groove 22 so that the inverted trapezoidal groove 22 becomes a heat dissipation groove 21 having a depth-to-width ratio greater than 1;

[0069] A5. Cleaning metal sheets.

[0070] The inverted trapezoidal groove 22 described in this embodiment is formed because the wet etching process not only progresses toward the bottom but also toward the sides. The present invention utilizes the bottom edge of the inverted trapezoidal groove 22 as the required width of the heat dissipation groove 21, and fills the inverted trapezoidal groove 22 to form the required heat dissipation groove 21. This ensures that the width of the heat dissipation groove 21 meets the requirements, and the filling process also achieves an aspect ratio greater than 1, which effectively ensures the heat dissipation effect of the present invention.

[0071] In this embodiment, step A4 specifically includes:

[0072] A41. Cleaning the first protective layer 23 on the surface of the metal sheet;

[0073] A42. The metal sheet is sequentially coated, exposed, and developed to form a second protective layer 24; wherein the second protective layer 24 only covers the bottom of the inverted trapezoidal groove 22;

[0074] A43. The metal sheet is filled so that a filling structure 25 is formed at a position of the metal sheet not covered by the second protective layer 24;

[0075] A44. Cleaning the metal sheet to remove the second protective layer 24 on the surface of the metal sheet;

[0076] The thickness of the second protective layer 24 is not less than the height of the second protective layer 24 .

[0077] That is, after etching the inverted trapezoidal groove 22, a second protective layer 24 is formed by secondary exposure and development, and the second protective layer 24 only covers the bottom of the inverted trapezoidal groove 22. Therefore, when the filling process is performed, the filling structure 25 will only fill the position not covered by the second protective layer 24, thereby achieving the effect of controlling the filling position, so as to ensure that the inverted trapezoidal groove 22 under the filling structure 25 can be reliably transformed into the required heat dissipation groove 21 structure.

[0078] Specifically, in step A43 , the metal plate is filled by electroplating or electrodeposition, and the material of the filling structure 25 is the same as that of the metal substrate 1 .

[0079] In actual use, it is preferred to use electrodeposition for filling treatment, that is, under the action of the second protective layer 24, the filling structure 25 is filled with the space on both sides of the inverted trapezoidal groove 22 that exceeds the bottom side length by electrodeposition, so that the inverted trapezoidal groove 22 forms the required rectangular groove structure.

[0080] In this embodiment, the heat dissipation structure formed at the bottom of the conductive layer 3 specifically includes:

[0081] B1. The bottom of the conductive layer 3 is sequentially coated, exposed, and developed to form a third protective layer 32;

[0082] B2. Electrodeposition is performed on the bottom of the conductive layer 3 to form a plurality of protrusions 31, which constitute a heat dissipation structure; the plurality of protrusions 31 correspond one-to-one with the plurality of heat dissipation grooves 21;

[0083] B3. Clean the conductive layer 3 to remove the third protective layer 32.

[0084] Since the heat dissipation groove 21 formed on the metal heat dissipation layer 2 has a larger aspect ratio, the present invention also provides a protrusion 31 on the bottom of the copper foil in order to improve the final aspect ratio of the heat dissipation groove 21. When the protrusion 31 is pressed, it just corresponds to the heat dissipation groove 21 one by one and presses it. The total height of the sealed heat dissipation groove 21 is increased by the protrusion 31, thereby cleverly achieving the effect of improving the aspect ratio of the heat dissipation groove 21.

[0085] When the third protective layer 32 is formed, it only needs to cover the position that the heat dissipation groove 21 will face, and the other positions are exposed to the outside world, so that metal materials are deposited in the other positions during the electroplating process, thereby increasing the overall thickness of the bottom of the conductive layer 3 and ensuring the uniformity of the thickness during pressing.

[0086] In this embodiment, step B2 specifically includes:

[0087] B21 obtains the depth of the heat sink 21 and calculates the aspect ratio;

[0088] B22. Subtract the depth of the heat sink 21 from the preset depth to calculate the desired depth value;

[0089] B23. Control the electrodeposition time according to the desired depth value.

[0090] The aspect ratio of the present invention is generally a desired value. However, different products require different aspect ratios, and the depth of the heat dissipation groove 21 is affected by the thickness of the conductive layer 3. Therefore, based on this phenomenon, the present invention uses electrodeposition to solve this problem. Specifically, the thickness of the protrusion 31 is controlled by the electrodeposition time, thereby adjusting the aspect ratio of the heat dissipation groove 21.

[0091] In order to ensure easy cleaning later, the thickness of the third protective layer 32 should be adapted to the thickness of the protrusion 31, that is, the thickness of the third protective layer 32 should not be less than the thickness of the protrusion 31, so that after a sufficient time of electroplating, the third protective layer 32 will not be covered by the structure formed by electroplating, so as to facilitate subsequent cleaning.

[0092] It should be noted that the first protective layer 23 , the second protective layer 24 and the third protective layer 32 described in this embodiment are all made of conventional materials in the art and will not be further described here.

[0093] In this embodiment, the substrate 1, the metal heat dissipation layer 2, and the conductive layer 3 are sequentially stacked, specifically including:

[0094] C1. The cleaned substrate 1 is placed in the pre-stacking machine 5, and then the metal heat dissipation layer 2 is positioned on the substrate 1 with the heat dissipation groove 21 facing upward;

[0095] C2. The conductive layer 3 is adjusted to a posture with the heat dissipation structure facing downward, and then aligned with the metal heat dissipation layer 2, and pre-stacked on the substrate 1 after alignment;

[0096] C3. The pre-stacked structure formed by the substrate 1, the metal heat dissipation layer 2 and the conductive layer 3 is transferred to a hot pressing device for hot pressing.

[0097] The present invention utilizes a high-precision pre-stacking process, where the substrate 1, metal heat sink layer 2, and conductive layer 3 are sequentially processed and pre-stacking to form a pre-stacked structure. The pre-stacking process then proceeds to a laminating device for compression molding. During pre-stacking, since the conductive layer 3 is preferably placed with the protrusions 31 facing upward after electrodeposition, the conductive layer 3 must be flipped over to align the protrusions 31 with the heat sink 21 for pre-stacking.

[0098] This embodiment also provides a pre-stacking machine 5 for performing steps C1-C3. The pre-stacking machine 5 includes a body 51, a transmission mechanism 52, a first loading mechanism 53, a second loading mechanism 54 and a third loading mechanism 55, all of which are arranged on the body 51. The transmission mechanism 52 has a carrier 56. The first loading mechanism 53 is used to place the substrate 1 on the carrier 56. The second loading mechanism 54 is used to place the metal heat dissipation layer 2 on the substrate 1 in the carrier 56. The third loading mechanism 55 is used to place the conductive layer 3 on the metal heat dissipation layer 2 in the carrier 56.

[0099] Specifically, the third feeding mechanism 55 includes a posture identifier 551, a negative pressure gripper 552, and a feeding robot 553. The posture identifier 551 is connected to the feeding robot 553 by signal. The negative pressure gripper 552 is used to absorb the conductive layer 3. The actions of the feeding robot 553 include:

[0100] The relative posture of the conductive layer 3 inside the negative pressure suction fixture 552 and the negative pressure suction fixture 552 is obtained by using the posture identifier 551;

[0101] Pick up the negative pressure gripper 552 and move the negative pressure gripper 552 to directly above the carrier 56;

[0102] According to the above relative posture of the negative pressure, the negative pressure gripper 552 is controlled to rotate horizontally so that the conductive layer 3 is adjusted to a desired posture;

[0103] The negative pressure fixture 552 is controlled to descend until it contacts the carrier 56 , so that the conductive layer 3 is stacked on the metal heat dissipation layer 2 in the carrier 56 .

[0104] That is, during pre-stacking, since the conductive layer 3 has not yet been welded with electronic components, it can be fixed by adsorption by the negative pressure fixture 552. Since the relative posture of the conductive layer 3 on the carrier 56 may be different, before pre-stacking, it is also necessary to use a posture identifier 551, which is preferably an industrial camera or other commonly used visual module, to identify the posture of the conductive layer 3 relative to the negative pressure fixture 552. Only in this way can the loading robot 553 turn the negative pressure fixture 552 over and adjust it to a suitable posture to ensure that the conductive layer 3 and the metal heat dissipation layer 2 can be accurately aligned to complete pre-stacking.

[0105] The structures of the first loading mechanism 53 and the second loading mechanism 54 are substantially the same as the third loading mechanism 55 , and both perform posture adjustment after visual recognition to ensure that the substrate 1 / metal heat dissipation layer 2 placed in the carrier 56 is in the right posture.

[0106] Specifically, the carrier 56 includes a main body 561, a centering mechanism 562 and a plurality of holding modules 563. The main body 561 is provided with a receiving groove 564. The centering mechanism 562 is arranged in the receiving groove 564 and is used to center the substrate 1 in the receiving groove 564. The holding module 563 includes a holding driving member 5631, a lifting seat 5632, a holding member 5633 and an elastic member 5634. The holding driving member 5631 is used to drive the lifting seat 5632 to rise and fall. The holding member 5633 is movably arranged on the lifting seat 5632. The elastic member 5634 is arranged between the lifting seat 5632 and the holding member 5633.

[0107] In carrier 56, since the orientation of substrate 1, metal heat sink layer 2, and conductive layer 3 is correct, centering mechanism 562 serves only to center substrate 1, metal heat sink layer 2, and conductive layer 3. This allows first, second, and third loading mechanisms 53, 54, and 55 to load materials without requiring high-precision positioning, improving efficiency and reducing costs. Furthermore, holding module 563 is used to hold components within carrier 56 to prevent them from moving during transport.

[0108] Specifically, the pressing drive member 5631 includes a linear drive 5635, a clutch 5636, a first transmission structure 5637 and a second transmission structure 5638. The linear drive 5635 drives and connects the first transmission structure 5637 and the second transmission structure 5638 through the clutch 5636.

[0109] When the clutch 5636 is in the first state, the linear driver 5635 drives the lifting seat 5632 to rotate horizontally through the first transmission structure 5637; when the clutch 5636 is in the second state, the linear driver 5635 drives the lifting seat 5632 to move up and down through the second transmission structure 5638.

[0110] The clutch 5636 is a conventional method, such as a magnetic powder clutch 5636, while the linear drive 5635 preferably includes a motor and a reducer. For example, the reducer has two output ends, each of which is provided with a magnetic powder clutch 5636. One magnetic powder clutch 5636 is connected to the lifting base 5632 via a gear module, while the other magnetic powder clutch 5636 is connected to the lifting base 5632 via a screw module, thereby achieving a transmission effect.

[0111] Of course, other clutch 5636 structures can also achieve the effects of the present invention, or a swing cylinder can also be used. Since the present invention is driven by a motor, the accuracy and force control are greater than those of a swing cylinder, but the corresponding structural complexity and cost are also greater than those of a swing cylinder, so the choice can be made according to actual needs.

[0112] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention is disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technology of the present invention are all within the scope of the technical solution of the present invention without departing from the content of the technical solution of the present invention.

Claims

1. A process for preparing a flexible circuit board capable of dynamic thermal management, characterized in that: The following steps are involved: providing a substrate and a conductive layer; preparing a metal heat dissipation layer and coating the metal heat dissipation layer with an insulating layer; forming a heat dissipation structure at the bottom of the conductive layer; The substrate, the metal heat dissipation layer and the conductive layer are stacked in sequence and pressed together, and the insulating layer is pressed together so as to contact the heat dissipation structure; Wherein, the metal heat dissipation layer has a plurality of heat dissipation slots; The preparation of the metal heat dissipation layer comprises: A1. Provide metal sheets; A2. The metal sheet is sequentially coated, exposed, and developed to form a first protective layer; A3. The metal sheet is etched so that the position of the metal sheet not covered by the protective layer is corroded to form a plurality of inverted trapezoidal grooves; A4. Fill the inverted trapezoidal groove, transforming it into a heat sink with a depth-to-width ratio greater than 1. A5. Cleaning metal sheets; Step A4 specifically includes: A41. Clean the first protective layer on the surface of the metal sheet; A42. The metal sheet is sequentially coated, exposed, and developed to form a second protective layer; wherein the second protective layer only covers the bottom of the inverted trapezoidal groove; A43. Filling the metal sheet so that a filling structure is formed at a position of the metal sheet not covered by the second protective layer; A44. Clean the metal sheet to remove the second protective layer on the metal sheet surface; wherein the thickness of the second protective layer is not less than the height of the second protective layer; In step A43, the metal plate is filled by electrodeposition, and the material of the filling structure is the same as that of the metal substrate; The heat dissipation structure formed at the bottom of the conductive layer specifically includes: B1. The bottom of the conductive layer is sequentially coated, exposed, and developed to form a third protective layer; B2. Electrodepositing the bottom of the conductive layer to form a plurality of protrusions, which constitute a heat dissipation structure; B3. Clean the conductive layer to remove the third protective layer; Step B2 specifically includes: B21. Obtain the depth of the heat sink and calculate the aspect ratio. B22. Subtract the desired depth from the desired depth. B23. Control the electrodeposition time according to the desired depth value.

2. The process for preparing a flexible circuit board capable of dynamic thermal management according to claim 1, wherein: The step of sequentially stacking the substrate, the metal heat dissipation layer, and the conductive layer specifically includes: C1. Place the cleaned substrate in the pre-stacking machine, then position the metal heat sink layer on the substrate with the heat sink facing upward. C2. The conductive layer is adjusted to a posture with the heat dissipation structure facing downward, and then aligned with the metal heat dissipation layer, and pre-stacked on the substrate after alignment; C3. Transferring the pre-stacked structure formed by the substrate, the metal heat dissipation layer, and the conductive layer to a hot pressing device for hot pressing.

3. The process for preparing a flexible circuit board capable of dynamic thermal management according to claim 2, characterized in that: A pre-stacking machine for performing steps C1-C3 is provided. The pre-stacking machine includes a machine body, a conveying mechanism, a first loading mechanism, a second loading mechanism, and a third loading mechanism, all of which are disposed on the machine body. The conveying mechanism has a carrier. The first loading mechanism is used to place a substrate on the carrier. The second loading mechanism is used to place a metal heat dissipation layer on the substrate in the carrier. The third loading mechanism is used to place a conductive layer on the metal heat dissipation layer in the carrier. The third feeding mechanism includes a posture identifier, a negative pressure gripper, and a feeding robot. The posture identifier is connected to the feeding robot signal. The negative pressure gripper is used to absorb the conductive layer. The feeding robot's actions include: The relative posture of the conductive layer inside the negative pressure gripper and the negative pressure gripper is obtained by using a posture identifier; Pick up the negative pressure gripper and move it to the top of the carrier; According to the above relative posture of the negative pressure, the negative pressure gripper is controlled to rotate horizontally so that the conductive layer is adjusted to a desired posture; The negative pressure fixture is controlled to descend until it contacts the carrier, so that the conductive layer is stacked on the metal heat dissipation layer in the carrier.

4. The process for preparing a flexible circuit board capable of dynamic thermal management according to claim 3, characterized in that: The carrier includes a main body, a centering mechanism and several holding modules. The main body is provided with a receiving groove. The centering mechanism is arranged in the receiving groove and is used to center the substrate in the receiving groove. The holding module includes a holding driving part, a lifting seat, a holding part and an elastic part. The holding driving part is used to drive the lifting seat to rise and fall. The holding part is movably arranged on the lifting seat. The elastic part is arranged between the lifting seat and the holding part.

5. The process for preparing a flexible circuit board capable of dynamic thermal management according to claim 4, characterized in that: The holding drive member includes a linear drive, a clutch, a first transmission structure and a second transmission structure, and the linear drive drives and connects the first transmission structure and the second transmission structure respectively through the clutch; When the clutch is in the first state, the linear drive drives the lifting seat to rotate horizontally through the first transmission structure; When the clutch is in the second state, the linear drive drives the lifting seat to move up and down through the second transmission structure.

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