Cooling devices and electronic equipment

Abstract

The present application discloses a cooling device and an electronic device, which relate to the field of heat dissipation technology, and include a radiator having a first flow channel and a second flow channel separated from each other, wherein the first flow channel is part of an inner circulation flow channel, and the inner circulation flow channel is used for circulating a first cooling medium to perform liquid cooling and heat dissipation on a heating module of the electronic device. The second flow channel is part of an outer circulation flow channel, and the outer circulation flow channel is used for circulating a second cooling medium to carry out heat dissipation out of the electronic device. The radiator is used to perform heat exchange between the first cooling medium in the first flow channel and the second cooling medium in the second flow channel. In this way, the heat generated by the heating module can be transferred to the second cooling medium at the radiator through two paths, the first cooling medium and the air in the electronic device, and can be carried out of the electronic device for heat dissipation through the second cooling medium, thereby solving the technical problem of low utilization of the cooling capacity of the cooling medium supplied to the electronic device and facilitating efficient and low-energy heat dissipation.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to cooling devices and electronic equipment. Background Art

[0002] As the performance of electronic devices continues to improve, the heat generated by them during operation is increasing. Liquid cooling has the advantages of high heat dissipation efficiency and can be used to dissipate heat from electronic devices that generate a lot of heat.

[0003] However, in the related art, the utilization rate of the cooling capacity of the cooling medium supplied to the electronic equipment is low, resulting in low efficiency in heat dissipation of the electronic equipment and high energy consumption. Summary of the Invention

[0004] The present application provides a cooling device and an electronic device to at least solve the problem in the related art of low utilization rate of the cooling capacity of the cooling medium supplied to the electronic device.

[0005] The present application provides a cooling device comprising a radiator. The radiator has a first flow channel and a second flow channel separated from each other. The first flow channel is part of a first internal circulation flow channel and is used to circulate a first cooling medium. The second flow channel is part of an external circulation flow channel and is used to circulate a second cooling medium. The radiator is used to exchange heat between the first cooling medium in the first flow channel and the second cooling medium in the second flow channel.

[0006] The present application also provides an electronic device comprising a chassis and a cooling device according to any of the above embodiments. The chassis has a mounting cavity, the cooling device is disposed within the mounting cavity, and the first flow channel of the cooling device is part of a first internal circulation flow channel located within the mounting cavity. The second flow channel of the cooling device is configured to form an external circulation flow channel with a cold source device located outside the chassis.

[0007] According to the present application, since the radiator has a first flow channel and a second flow channel separated from each other, the first flow channel is a portion of the first internal circulation flow channel located in the installation cavity and used for liquid cooling and heat dissipation of the heat generating module in the installation cavity, and the second flow channel is a portion of the external circulation flow channel used for bringing the heat in the installation cavity to the cold source device outside the chassis for heat dissipation. Part of the heat generated by the heat generating module in the installation cavity can be transferred to the second cooling medium circulating in the external circulation flow channel at the radiator through the first cooling medium circulating in the first internal circulation flow channel, and part of the heat generated by the heat generating module in the installation cavity can be transferred to the second cooling medium circulating in the external circulation flow channel at the radiator through the air in the installation cavity. The second cooling medium can bring the heat absorbed from the first cooling medium and the air outside the radiator out of the chassis for heat dissipation. At this time, the heat generated by the heat generating module is transferred to the second cooling medium through two paths, the first cooling medium and the air in the installation cavity, and the heat dissipation efficiency of the heat generated by the heat generating module is high. In addition, the heat absorbed by the first cooling medium and the heat absorbed by the air in the installation cavity are transferred to the second cooling medium at the cold row and carried out of the chassis by the second cooling medium for heat dissipation, so that the utilization rate of the cold capacity of the second cooling medium supplied to the electronic equipment is high, which is conducive to achieving efficient and low-energy heat dissipation of the electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0009] Figure 1 A schematic diagram of a connection between an electronic device and a cold source device provided in an embodiment of the present application;

[0010] Figure 2 An exploded diagram of an electronic device provided in an embodiment of the present application;

[0011] Figure 3 A cross-sectional view of a radiator provided in an embodiment of the present application;

[0012] Figure 4 A cross-sectional view of another radiator provided in an embodiment of the present application;

[0013] Figure 5 A schematic diagram of the connection of an external circulation channel provided in an embodiment of the present application;

[0014] Figure 6 A schematic diagram of the connection of a first internal circulation channel provided in an embodiment of the present application;

[0015] Figure 7A schematic diagram of another connection of the first inner circulation channel provided in an embodiment of the present application;

[0016] Figure 8 An exploded schematic diagram of a chassis provided in an embodiment of the present application;

[0017] Figure 9 A top view of another electronic device provided in an embodiment of the present application;

[0018] Figure 10 for Figure 9 The aa-plane cross-sectional view in FIG;

[0019] Figure 11 A schematic diagram of an air duct partition plate provided in an embodiment of the present application;

[0020] Figure 12 A schematic diagram of an air guide structure provided in an embodiment of the present application.

[0021] The above drawings include the following reference numerals:

[0022] 10. Electronic equipment; 20. Cold source equipment;

[0023] 100, chassis; 110, top panel; 120, bottom panel; 130, front panel; 140, rear panel; 150, left panel; 160, right panel; 170, screws; 180, sealing ring;

[0024] 200. Cooling device;

[0025] 210, radiator; 211, flow channel structure; 2111, first interface; 2112, second interface; 2113, third interface; 2114, fourth interface; 212, fin structure;

[0026] 220, cold plate assembly; 221, first cold plate; 222, second cold plate; 223, first bypass pipe; 224, first flow control valve; 225, fourth cold plate; 226, fifth cold plate; 227, third flow control valve;

[0027] 230, driving pump;

[0028] 300, heating module;

[0029] 400, fan;

[0030] 510, air duct partition plate; 511, first avoidance opening; 512, second avoidance opening; 520, air guide structure; 521, third avoidance opening;

[0031] 610, first external connector; 620, second external connector; 630, first connecting pipe; 640, second connecting pipe;

[0032] R1, first flow channel; R2, second flow channel;

[0033] S, installation cavity; S1, first space; S2, second space; S3, third space; S4, fourth space;

[0034] x, first direction; y, second direction; z, third direction. DETAILED DESCRIPTION

[0035] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0036] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0037] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0038] The present invention provides an electronic device, including but not limited to a computing device, a storage device, a switching device, a power supply device, etc. The computing device may be a server, and the present invention is described using the server as an example.

[0039] Figure 1 A schematic diagram of the connection between an electronic device and a cold source device provided in an embodiment of the present application. In the figure, the x direction is the first direction, the y direction is the second direction, and the z direction is the third direction. The first direction is the front-to-back direction, the second direction is the left-to-right direction, and the third direction is the up-down direction. Exemplarily, one of the first and second directions is the length direction of the electronic device, the other of the first and second directions is the width direction of the electronic device, and the third direction is the thickness direction of the electronic device. The embodiment of the present application is described by taking the first direction as the length direction of the electronic device, the second direction as the width direction of the electronic device, and the third direction as the thickness direction of the electronic device as an example.

[0040] like Figure 1 As shown, the electronic device 10 includes a chassis 100, and the chassis 100 is provided with a first external connector 610 and a second external connector 620. The first external connector 610 is used to communicate with the outlet of the cold source device 20 located outside the chassis 100, and the second external connector 620 is used to communicate with the inlet of the cold source device 20. The cooling medium provided by the cold source device 20 can flow into the chassis 100 through the first external connector 610. After the cooling medium provided by the cold source device 20 flows into the chassis 100, it can absorb the heat in the chassis 100, and then flow out of the chassis 100 through the second external connector 620 and flow back to the cold source device 20 for heat dissipation.

[0041] Exemplarily, the cold source device 20 is a device independent of the electronic device 10 .

[0042] Exemplarily, the cold source device 20 may be a cooling distribution unit (CDU).

[0043] Figure 2 This is a schematic diagram of an explosion of an electronic device provided in an embodiment of the present application.

[0044] like Figure 2 As shown, the electronic device 10 further includes a cooling device 200 and a heating module 300 . The chassis 100 has an installation cavity S in which the cooling device 200 and the heating module 300 are disposed.

[0045] The heat generating module 300 generates heat when in operation. Part of the heat generated by the heat generating module 300 is dissipated into the air in the installation cavity S.

[0046] The cooling device 200 includes a cold row 210, which is arranged in the installation cavity S. The cold row 210 is connected to the first external connector 610 and the second external connector 620. The cooling medium provided by the cold source device 20 can flow into the cold row 210. The cold row 210 can be used to allow the air outside the cold row 210 to exchange heat with the cooling medium inside the cold row 210 to achieve heat dissipation of the air in the installation cavity S. In other words, the cold row 210 can be used to dissipate heat from the air in the installation cavity S, and then the heat generation module 300 can be dissipated through the air in the installation cavity S.

[0047] For example, the radiator 210 is made of a material with good thermal conductivity, such as copper, aluminum, or other metal materials, so that the cooling medium in the radiator 210 and the air outside the radiator 210 can exchange heat efficiently.

[0048] Exemplarily, the chassis 100 includes a top panel 110, a bottom panel 120, a front panel 130, a rear panel 140, a left side panel 150, and a right side panel 160. The top panel 110 and the bottom panel 120 are respectively located at the upper and lower sides of the chassis 100, the front panel 130 and the rear panel 140 are respectively located at the front and rear sides of the chassis 100, the left side panel 150 and the right side panel 160 are respectively located at the left and right sides of the chassis 100, and the top panel 110, the bottom panel 120, the front panel 130, the rear panel 140, the left side panel 150, and the right side panel 160 are respectively arranged to form an installation cavity S. The top panel 110 forms a top wall of the installation cavity S, the bottom panel 120 forms a bottom wall of the installation cavity S, the front panel 130 forms a front wall of the installation cavity S, the rear panel 140 forms a rear wall of the installation cavity S, the left side panel 150 forms a left wall of the installation cavity S, and the right side panel 160 forms a right wall of the installation cavity S.

[0049] Specifically, the front end of the top panel 110 is connected to the upper end of the front panel 130, the rear end of the top panel 110 is connected to the upper end of the rear panel 140, the left end of the top panel 110 is connected to the upper end of the left side panel 150, and the right end of the top panel 110 is connected to the upper end of the right side panel 160. The front end of the bottom panel 120 is connected to the lower end of the front panel 130, the rear end of the bottom panel 120 is connected to the lower end of the rear panel 140, the left end of the bottom panel 120 is connected to the lower end of the left side panel 150, and the right end of the bottom panel 120 is connected to the lower end of the right side panel 160. The left end of the front panel 130 is connected to the front end of the left side panel 150, and the right end of the front panel 130 is connected to the front end of the right side panel 160. The left end of the rear panel 140 is connected to the rear end of the left side panel 150, and the right end of the rear panel 140 is connected to the rear end of the right side panel 160.

[0050] In some examples, the top plate 110, bottom plate 120, front panel 130, rear panel 140, left side panel 150 and right side panel 160 can all be flat plates, the top plate 110 and the bottom plate 120 are opposite to each other up and down, the front panel 130 and the rear panel 140 are opposite to each other front and back, and the left side panel 150 and the right side panel 160 are opposite to each other left and right.

[0051] In other examples, at least one of the top plate 110 , the bottom plate 120 , the front panel 130 , the rear panel 140 , the left side plate 150 , and the right side plate 160 may be a bent plate.

[0052] Exemplarily, the heating module 300 may include a circuit board and a heating device mounted on the circuit board. One or more heating devices may be mounted on the circuit board. Any heating device may include, but is not limited to, a central processing unit (CPU), a graphics processing unit (GPU), and the like.

[0053] Figure 3 This is a cross-sectional view of a radiator provided in an embodiment of the present application. Figure 3 The cross section in is a cross section perpendicular to the second direction.

[0054] like Figure 3 As shown, the radiator 210 has a first flow channel R1 and a second flow channel R2 separated from each other. The first flow channel R1 is part of the first internal circulation flow channel, which is used for circulating the first cooling medium. The first internal circulation flow channel is a circulation flow channel located in the installation cavity S, that is, the first flow channel R1 is part of the first internal circulation flow channel located in the installation cavity S. The first internal circulation flow channel is used to liquid-cool the heat generating module 300, that is, part of the heat generated by the heat generating module 300 is absorbed and carried away by the first cooling medium circulating in the first internal circulation flow channel.

[0055] The second flow channel R2 is part of the outer circulation flow channel, and the outer circulation flow channel is used to circulate the second cooling medium. Specifically, the second flow channel R2 is used to form an outer circulation flow channel with the cold source device 20 located outside the chassis 100. In other words, the outer circulation flow channel is a circulation flow channel that is partially located outside the chassis 100 and where the cold source device 20 is located, and the cooling medium provided by the cold source device 20 is the second cooling medium. The outer circulation flow channel is used to bring the heat in the installation cavity S to the cold source device 20 outside the chassis 100 for heat dissipation. In other words, the heat in the installation cavity S can be brought to the cold source device 20 by the second cooling medium circulating in the outer circulation flow channel for heat dissipation.

[0056] The radiator 210 is used to exchange heat between the first cooling medium in the first channel R1 and the second cooling medium in the second channel R2, so that the heat absorbed by the first cooling medium can be transferred to the second cooling medium at the radiator 210 and carried out of the chassis 100 for heat dissipation through the second cooling medium.

[0057] The radiator 210 is also used to exchange heat between the air outside the radiator 210 and the second cooling medium in the second flow channel R2, so that the heat absorbed by the air outside the radiator 210 can be transferred to the second cooling medium at the radiator 210 and carried out of the chassis 100 for heat dissipation through the second cooling medium.

[0058] In this way, part of the heat generated by the heating module 300 in the installation cavity S can be transferred at the cold row 210 to the second cooling medium circulating in the outer circulation channel via the first cooling medium circulating in the first inner circulation channel. Part of the heat generated by the heating module 300 in the installation cavity S can be transferred at the cold row 210 to the second cooling medium circulating in the outer circulation channel via the air in the installation cavity S. The second cooling medium can remove the heat absorbed from the first cooling medium and the air outside the cold row 210 out of the chassis 100 for dissipation. In this case, the heat generated by the heating module 300 is transferred to the second cooling medium via two paths, the first cooling medium and the air in the installation cavity S, resulting in a high efficiency in dissipating the heat generated by the heating module 300. The heat absorbed by the first cooling medium and the heat absorbed by the air in the installation cavity S are both transferred to the second cooling medium at the cold row 210 and removed from the chassis 100 by the second cooling medium for dissipation. This results in a high utilization rate of the cooling capacity of the second cooling medium supplied to the electronic device 10, thereby facilitating efficient and low-energy heat dissipation of the electronic device 10.

[0059] Exemplarily, the temperature of the second cooling medium in the second flow channel R2 is lower than the temperature of the first cooling medium in the first flow channel R1.

[0060] Exemplarily, the temperature of the second cooling medium in the second flow channel R2 is lower than the temperature of the air in the installation cavity S.

[0061] Illustratively, the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2 perform heat exchange through the portion of the cold row 210 that separates the first flow channel R1 from the second flow channel R2.

[0062] In some examples, the first cooling medium may be a single-phase cooling medium, such as cooling water, cooling oil, etc.

[0063] In some examples, the first cooling medium may be a two-phase cooling medium, such as a fluorinated liquid.

[0064] In some examples, the second cooling medium may be a single-phase cooling medium, such as cooling water, cooling oil, etc.

[0065] In some examples, the second cooling medium may be a two-phase cooling medium, such as a fluorinated liquid.

[0066] like Figure 2 As shown, in some possible implementations, the electronic device 10 further includes a fan 400 , which is disposed in the installation cavity S. The fan 400 is configured to drive air at the heating module 300 to flow toward the cold row 210 of the cooling device 200 .

[0067] In this way, the efficiency of the heat generating module 300 in transferring heat to the second cooling medium through the air in the installation cavity S is improved, thereby improving the heat dissipation efficiency of the heat generating module 300 .

[0068] For example, the electronic device 10 may include a plurality of fans 400 arranged along the extension direction of the cold row 210 .

[0069] In some possible embodiments, the cooling device 200 further includes a cold plate assembly 220, which is disposed in the installation cavity S. The cold plate assembly 220 contacts the heating module 300, and the cold plate assembly 220 is connected to the first flow channel R1. The first flow channel R1 and the cold plate assembly 220 are used to form a first internal circulation flow channel.

[0070] In this way, by making the cold plate assembly 220 contact the heating module 300, the heat generated by the heating module 300 can be more efficiently transferred to the first cooling medium in the cold plate assembly 220, so that the heating module 300 can be more efficiently liquid-cooled and dissipated through the first internal circulation channel.

[0071] For example, the cold plate assembly 220 may be in contact with a side of the heat generating device facing away from the circuit board.

[0072] like Figure 3 As shown, in some possible embodiments, the radiator 210 includes a flow channel structure 211 and a fin structure 212. The flow channel structure 211 has a first flow channel R1 and a second flow channel R2, and the fin structure 212 is provided on the outer surface of the flow channel structure 211. The flow channel structure 211 is used to exchange heat between the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2.

[0073] Thus, by providing the fin structure 212, the heat exchange surface between the radiator 210 and the air outside the radiator 210 can be increased, which helps to improve the heat exchange efficiency between the air outside the radiator 210 and the second cooling medium in the second flow channel R2, thereby improving the heat dissipation efficiency of the heating module 300. In addition, the first flow channel R1 and the second flow channel R2 are both provided in the flow channel structure portion 211. The heat conduction path between the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2 is relatively short, making the heat exchange between the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2 more efficient.

[0074] Illustratively, the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2 perform heat exchange through the portion of the flow channel structure 211 that is used to separate the first flow channel R1 and the second flow channel R2.

[0075] Exemplarily, the flow channel structure 211 and the fin structure 212 are both made of materials with good thermal conductivity, such as copper, aluminum, or other metal materials.

[0076] For example, the fin structure 212 and the flow channel structure portion 211 may be an integrated structure.

[0077] Exemplarily, the fin structure 212 and the first flow channel R1 are located on different sides of the second flow channel R2. This shortens the heat conduction path between the fin structure 212 and the second cooling medium in the second flow channel R2. Furthermore, the first cooling medium in the first flow channel R1 interferes less with the heat conduction between the fin structure 212 and the second cooling medium in the second flow channel R2. This increases the efficiency of heat transfer from the air in the mounting cavity S to the second cooling medium in the second flow channel R2 via the fin structure 212. Furthermore, the heat conduction between the fin structure 212 and the second cooling medium is less likely to affect the heat conduction between the first cooling medium and the second cooling medium.

[0078] In some examples, the fin structure 212 and the first flow channel R1 are respectively located on two adjacent sides of the second flow channel R2. For example, the fin structure 212 is located below the second flow channel R2, and the first flow channel R1 and the second flow channel R2 are arranged side by side in front and back.

[0079] In some examples, the fin structure 212 and the first flow channel R1 may be located on opposite sides of the second flow channel R2 .

[0080] Figure 4 This is a cross-sectional view of another radiator provided in an embodiment of the present application. Figure 4 The cross section in is a cross section perpendicular to the first direction.

[0081] like Figure 4As shown, in some possible embodiments, the flow channel structure portion 211 extends in the left-right direction, the first flow channel R1 and the second flow channel R2 are arranged side by side, and the fin structure 212 is provided on the side of the second flow channel R2 away from the first flow channel R1.

[0082] In this way, while the heat in the air in the installation cavity S is transferred to the second cooling medium in the second flow channel R2 through the fin structure 212 at a high efficiency, and the heat conduction between the fin structure 212 and the second cooling medium is unlikely to affect the heat conduction between the first cooling medium and the second cooling medium, by arranging the first flow channel R1 and the second flow channel R2 side by side vertically, the heat exchange efficiency between the first cooling medium in the first flow channel R1 and the second cooling medium in the second flow channel R2 can be high, which is conducive to improving the efficiency of heat dissipation of the heat generating module 300 through the first cooling medium. In addition, by arranging the first flow channel R1 and the second flow channel R2 side by side vertically, it is convenient for the first flow channel R1 and the second flow channel R2 to be connected to the first internal circulation flow channel and the external circulation flow channel respectively, making it easier to connect the radiator 210 to other components.

[0083] Illustratively, the fin structure 212 includes a plurality of fins arranged side by side in the left-right direction.

[0084] When the electronic device 10 includes a plurality of fans 400 , the plurality of fans 400 may be arranged in a row along the left-right direction.

[0085] For example, the first flow channel R1 is located above the second flow channel R2, and the fin structure 212 is located below the second flow channel R2. At this time, the heat in the first cooling medium in the first flow channel R1 is transferred from top to bottom to the second cooling medium in the second flow channel R2, and the heat in the air in the installation cavity S is transferred from bottom to top to the second cooling medium in the second flow channel R2 through the fin structure 212.

[0086] Exemplarily, the fin structure 212 and the fan 400 are opposite to each other front and back, and the fan 400 is used to blow or suck air toward the fin structure 212, thereby driving the flow of air at the fin structure 212, so as to facilitate the heat in the air in the installation cavity S to be transferred to the second cooling medium in the second flow channel R2 through the fin structure 212.

[0087] The air at the heating module 300 flows toward the fin structure 212 driven by the fan 400. Along the flow direction of the air in the installation cavity S, the air between the heating module 300 and the fin structure 212 is hot air. After the air dissipates heat to the fin structure 212 at the fin structure 212, the temperature drops, so that the air after passing through the fin structure 212 becomes cold air.

[0088] Exemplarily, the flow channel structure portion 211 has a first interface 2111 and a second interface 2112 connected to the first flow channel R1, the first interface 2111 and the second interface 2112 are respectively located at the two ends of the first flow channel R1, the first flow channel R1 is connected to the outlet of the cold plate assembly 220 through the first interface 2111, and the first flow channel R1 is connected to the inlet of the cold plate assembly 220 through the second interface 2112. The first interface 2111 is the inlet of the first flow channel R1, and the second interface 2112 is the outlet of the first flow channel R1.

[0089] Illustratively, the first interface 2111 and the second interface 2112 are both located on the rear side of the flow channel structure 211 .

[0090] Exemplarily, the flow channel structure portion 211 has a third interface 2113 and a fourth interface 2114 connected to the second flow channel R2. The third interface 2113 and the fourth interface 2114 are respectively located at the two ends of the second flow channel R2. The second flow channel R2 is connected to the first external connector 610 through the third interface 2113, and the second flow channel R2 is connected to the second external connector 620 through the fourth interface 2114. The third interface 2113 is the inlet of the second flow channel R2, and the fourth interface 2114 is the outlet of the second flow channel R2.

[0091] Illustratively, the third interface 2113 and the fourth interface 2114 are both located on the rear side of the flow channel structure 211 .

[0092] In some possible implementations, the first flow channel R1 and the second flow channel R2 are both straight flow channels.

[0093] In this way, the first flow channel R1 and the second flow channel R2 can be formed more easily.

[0094] Illustratively, both the first flow channel R1 and the second flow channel R2 extend in the left-right direction.

[0095] In some possible implementations, at least one of the first flow channel R1 and the second flow channel R2 is a curved flow channel.

[0096] Thus, when the first flow channel R1 is a curved flow channel, the heat exchange surface between the first cooling medium in the first flow channel R1 and the flow channel wall of the first flow channel R1 is larger, and the flow path of the first cooling medium in the first flow channel R1 is longer, which facilitates sufficient heat exchange between the first cooling medium and the radiator 210, resulting in a higher utilization rate of the cooling capacity. When the second flow channel R2 is a curved flow channel, the heat exchange surface between the second cooling medium in the second flow channel R2 and the flow channel wall of the second flow channel R2 is larger, and the flow path of the second cooling medium in the second flow channel R2 is longer, which facilitates sufficient heat exchange between the second cooling medium and the radiator 210, resulting in a higher utilization rate of the cooling capacity.

[0097] For example, at least one of the first flow channel R1 and the second flow channel R2 may be a wavy flow channel or a spiral flow channel.

[0098] In some examples, the flow channel structure 211 may further include a third flow channel, which is part of the second internal circulation flow channel. The second internal circulation flow channel is used to circulate a third cooling medium. In other words, the third flow channel is part of the second internal circulation flow channel located within the installation cavity S. Some of the heat within the installation cavity S can be absorbed and removed by the third cooling medium circulating in the second internal circulation flow channel.

[0099] The flow channel structure portion 211 is also used to allow the third cooling medium in the third flow channel to exchange heat with the second cooling medium in the second flow channel R2, so that the heat absorbed by the third cooling medium can be transferred to the second cooling medium at the cold row 210 and carried out of the chassis 100 by the second cooling medium for heat dissipation.

[0100] The first flow channel R1 , the third flow channel and the fin structure 212 are respectively located on different sides of the second flow channel R2 .

[0101] This facilitates the formation of multiple internal circulation channels within the installation cavity S for heat dissipation, thereby further improving heat dissipation efficiency and the utilization rate of the cooling capacity of the second cooling medium. In addition, the first flow channel R1, the third flow channel, and the fin structure 212 are respectively located on different sides of the second flow channel R2. The heat exchange between the second cooling medium in the second flow channel R2 and the first cooling medium, the third cooling medium, and the fin structure 212 is not easily affected by each other. This results in a high heat exchange efficiency between the first cooling medium, the third cooling medium, and the air within the installation cavity S and the second cooling medium, thereby improving the heat dissipation efficiency of the second cooling medium.

[0102] In some examples where the first flow channel R1 and the second flow channel R2 are arranged side by side vertically, and the fin structure 212 is located on the side of the second flow channel R2 away from the first flow channel R1, the third flow channel and the second flow channel R2 are arranged side by side front to back. This can increase the heat exchange efficiency between the third cooling medium in the third flow channel and the second cooling medium in the second flow channel R2, thereby improving the efficiency of heat dissipation through the third cooling medium. In addition, it also facilitates the connection of the first flow channel R1, the second flow channel R2, and the third flow channel to the first internal circulation flow channel, the external circulation flow channel, and the second internal circulation flow channel, respectively, making it easier to connect the radiator 210 to other components.

[0103] In the example where the flow channel structure portion 211 has a third flow channel, the cooling device 200 may further include a liquid cooling component, which is disposed in the installation cavity S. The liquid cooling component is connected to the third flow channel, and the third flow channel and the liquid cooling component are used to form a second internal circulation flow channel. The third cooling medium in the liquid cooling component is used to absorb heat in the installation cavity S through the liquid cooling component and bring the absorbed heat to the cold row 210 to transfer it to the second cooling medium.

[0104] Figure 5 This is a schematic diagram of the connection of an external circulation channel provided in an embodiment of the present application. In the figure, the direction pointed by the solid arrow is the flow direction of the second cooling medium.

[0105] like Figure 5 As shown, the inlet of the second flow channel R2 is connected to the first external connector 610 via the first connecting pipe 630, and the outlet of the second flow channel R2 is connected to the second external connector 620 via the second connecting pipe 640. In other words, one end of the first connecting pipe 630 is connected to the first external connector 610, the other end of the first connecting pipe 630 is connected to the third interface 2113, one end of the second connecting pipe 640 is connected to the second external connector 620, and the other end of the second connecting pipe 640 is connected to the fourth interface 2114. In this way, by providing the first connecting pipe 630 and the second connecting pipe 640, the connection between the second flow channel R2 and the first external connector 610 and the second external connector 620 is facilitated, making the layout of the radiator 210 more flexible.

[0106] Illustratively, the first external connector 610 and the second external connector 620 are both quick-seal connectors.

[0107] For example, the second cooling medium may circulate in the external circulation path driven by the cold source device 20 .

[0108] Figure 6 This is a schematic diagram of a connection of a first internal circulation channel provided in an embodiment of the present application. In the figure, the direction pointed by the dotted line joint is the flow direction of the first cooling medium.

[0109] like Figure 6 As shown, in some possible embodiments, the cooling device 200 further includes a driving pump 230 , which is disposed in the installation cavity S. The driving pump 230 is connected in series with the cold plate assembly 220 and the first flow channel R1 , and is configured to drive the first cooling medium to circulate in the first inner circulation channel.

[0110] In this way, the first cooling medium can circulate in the first inner circulation channel, so that part of the heat generated by the heating module 300 can be brought to the cold radiator 210 through the first cooling medium and transferred to the second cooling medium for heat dissipation.

[0111] In some possible implementations, the driving pump 230 is connected in series between the outlet of the first flow channel R1 and the inlet of the cold plate assembly 220 .

[0112] In this way, the temperature of the first cooling medium at the driving pump 230 is low, making it less likely for the first cooling medium to leak at the driving pump 230. In addition, the driving efficiency of the driving pump 230 for the first cooling medium is also high.

[0113] In some examples where the first cooling medium is a two-phase cooling medium, the cooling device 200 may not include the driving pump 230 , and the first cooling medium may circulate in the first inner circulation channel due to the pressure difference generated by its own phase change.

[0114] like Figure 6 As shown, in some possible embodiments, the cold plate assembly 220 includes a first cold plate 221, a second cold plate 222, a first bypass pipe 223, and a first flow control valve 224. The first cold plate 221 and the second cold plate 222 are connected in series, with the first cold plate 221 located between the inlet of the second cold plate 222 and the outlet of the first flow channel R1. The first bypass pipe 223 is connected in parallel with the first cold plate 221, and the first flow control valve 224 is disposed in the first bypass pipe 223. The first flow control valve 224 is used to adjust the flow rate of the first cooling medium flowing through the first bypass pipe 223.

[0115] In this way, when the cold plate assembly 220 includes a first cold plate 221 and a second cold plate 222 connected in series, the first bypass pipe 223 and the first flow regulating valve 224 can be used to distribute the cold energy between the first cold plate 221 and the second cold plate 222, so as to balance the temperature of the first cold plate 221 and the temperature of the second cold plate 222.

[0116] For example, the first bypass pipe 223 allows a portion of the first cooling medium flowing out of the outlet of the first flow channel R1 to flow directly into the second cold plate 222 through the first bypass pipe 223 without passing through the first cold plate 221. The first flow regulating valve 224 can distribute the first cooling medium flowing through the first bypass pipe 223 and the first cold plate 221.

[0117] For example, the first cold plate 221 and the second cold plate 222 may be in contact with different heat-generating components, respectively.

[0118] In some possible embodiments, the cold plate assembly 220 further includes a third cold plate, a second bypass pipe, and a second flow control valve. The third cold plate is connected in series between the first cold plate 221 and the second cold plate 222. The outlet of the first cold plate 221 is connected to the inlet of the second cold plate 222 via the third cold plate and the second bypass pipe. The second bypass pipe is connected in parallel with the third cold plate. The second flow control valve is used to adjust the flow of the first cooling medium flowing through the second bypass pipe.

[0119] In this way, when the cold plate assembly 220 includes a first cold plate 221, a second cold plate 222 and a third cold plate connected in series, it is convenient to distribute the cold energy among the first cold plate 221, the second cold plate 222 and the third cold plate, so as to balance the temperature of the first cold plate 221, the temperature of the second cold plate 222 and the temperature of the third cold plate.

[0120] When the cold plate assembly 220 includes more cold plates connected in series, the arrangement may refer to the above scheme of connecting the first cold plate 221 , the second cold plate 222 and the third cold plate in series.

[0121] Figure 7 A schematic diagram of another connection of the first internal circulation channel provided in an embodiment of the present application.

[0122] like Figure 7 As shown, in some possible embodiments, the cold plate assembly 220 includes a fourth cold plate 225, a fifth cold plate 226, and a third flow control valve 227. The fourth cold plate 225 and the third flow control valve 227 are connected in series. The fourth cold plate 225 and the third flow control valve 227 are connected in parallel with the fifth cold plate 226. The third flow control valve 227 is used to adjust the flow of the first cooling medium flowing through the fourth cold plate 225.

[0123] In this way, when the cold plate assembly 220 includes a fourth cold plate 225 and a fifth cold plate 226 connected in parallel, the third flow regulating valve 227 can be used to distribute the cooling capacity between the fourth cold plate 225 and the fifth cold plate 226, so as to balance the temperature of the fourth cold plate 225 and the temperature of the fifth cold plate 226.

[0124] In some possible embodiments, the cold plate assembly 220 further includes a sixth cold plate and a fourth flow control valve, wherein the sixth cold plate and the fourth flow control valve are connected in series. The fourth cold plate 225 and the third flow control valve 227 are connected in series, and the sixth cold plate and the fourth flow control valve are connected in series, and are connected in parallel with the fifth cold plate 226. The fourth flow control valve is used to adjust the flow of the first cooling medium through the sixth cold plate.

[0125] In this way, when the cold plate assembly 220 includes a fourth cold plate 225, a fifth cold plate 226 and a sixth cold plate connected in parallel, it is convenient to distribute the cold energy among the fourth cold plate 225, the fifth cold plate 226 and the sixth cold plate, so as to balance the temperature of the fourth cold plate 225, the temperature of the fifth cold plate 226 and the temperature of the sixth cold plate.

[0126] When the cold plate assembly 220 includes more cold plates connected in parallel, the arrangement may refer to the above scheme of connecting the fourth cold plate 225 , the fifth cold plate 226 and the sixth cold plate in parallel.

[0127] In some possible implementations, a liquid leakage detection device is provided on the cold row 210 and the cold plate assembly 220 , and the liquid leakage detection device is used to detect whether there is liquid leakage at the cold plate assembly 220 and the cold row 210 .

[0128] In this way, it is convenient to promptly discover the leakage of the radiator 210 and the cold plate assembly 220 so as to promptly handle the leakage.

[0129] Exemplarily, the cold row 210 , the cold plate assembly 220 , and the connection between the cold row 210 and the cold plate assembly 220 are provided with a liquid leakage detection device.

[0130] Exemplarily, the liquid leakage detection device may include a liquid leakage sensing wire, which is wound around the cold radiator 210 and the cold plate assembly 220 .

[0131] Exemplarily, electronic device 10 further includes a detection circuit, a controller, and a complex programmable logic device (CPLD). The leakage sensing line is electrically connected to the detection circuit, which is electrically connected to the CPLD, which is electrically connected to the controller. The CPLD can be used to implement functions such as signal debouncing and noise filtering. The controller can use a polling mechanism to receive signals transmitted by the CPLD.

[0132] When leakage occurs in the radiator 210 or the cold plate assembly 220, the leakage will cause the leakage sensing line to short-circuit. After the detection circuit detects the short-circuit of the leakage sensing line, an alarm signal is generated. After the complex editable logic device recognizes the alarm signal, the alarm signal is transmitted to the controller, and the controller is used to generate corresponding control instructions based on the alarm signal.

[0133] For example, the control instruction can be used to control the display interface to display the alarm information and report it to the operation and maintenance personnel in a timely manner.

[0134] Exemplarily, the control instruction may be used to control the electronic device 10 to be powered off, so as to protect the electronic device 10. For example, the control instruction may be used to control the electronic device 10 to be powered off.

[0135] Exemplarily, the controller may be a baseboard management controller (BMC).

[0136] In some possible embodiments, the installation cavity S is a non-enclosed chamber, and the chassis 100 has an air inlet and an air outlet connected to the installation cavity S. The fan 400 is used to drive air from the air inlet into the installation cavity S, and then flow through the heating module 300 and the radiator 210 in sequence, and then out of the air outlet. For example, the heating module 300 is located between the air inlet and the radiator 210, and the radiator 210 is located between the heating module 300 and the air outlet. The fan 400 can be located at the air inlet or the air outlet.

[0137] In some other possible implementations, the installation cavity S is a closed cavity, and the fan 400 is used to drive the air in the installation cavity S to circulate.

[0138] In this way, the impact of the environment outside the chassis 100 on the heat dissipation within the installation cavity S can be reduced, and it is less likely that heat outside the chassis 100 will flow back into the installation cavity S and affect the heat dissipation within the installation cavity S. The stability and reliability of the heat dissipation of the electronic device 10 are improved. In addition, the circulation of air within the installation cavity S facilitates the flow of hot air from the heating module 300 to the cold row 210 for heat dissipation, which improves the heat dissipation efficiency of the air within the installation cavity S and makes the arrangement of the fan 400, the heating module 300, and the cold row 210 more flexible.

[0139] Figure 8 An exploded schematic diagram of a chassis provided in an embodiment of the present application.

[0140] like Figure 8 As shown, exemplarily, the chassis 100 includes a bottom shell, which includes a bottom plate 120, a front panel 130, a rear panel 140, a left side panel 150 and a right side panel 160. The bottom plate 120, the front panel 130, the rear panel 140, the left side panel 150 and the right side panel 160 are an integrated structure. The top plate 110 covers the upper ends of the front panel 130, the rear panel 140, the left side panel 150 and the right side panel 160. A sealing ring 180 is provided between the top plate 110 and the front panel 130, the rear panel 140, the left side panel 150 and the right side panel 160. The top plate 110 is detachably connected to the front panel 130, the rear panel 140, the left side panel 150 and the right side panel 160 by screws 170. The sealing ring 180 is used to seal the connection between the top plate 110 and the front panel 130, the rear panel 140, the left side panel 150 and the right side panel 160 so as to form a closed installation cavity S.

[0141] For example, the components in the installation cavity S can be maintained by removing the top plate 110 .

[0142] Figure 9 A top view of another electronic device provided in an embodiment of the present application is shown. Figure 10 for Figure 9 The aa section view in .

[0143] like Figure 9 、 Figure 10 As shown, in some possible embodiments, an air duct dividing plate 510 is provided in the installation cavity S, and the top wall and the bottom wall of the installation cavity S are respectively located on both sides of the thickness direction of the air duct dividing plate 510. Exemplarily, the third direction is the thickness direction of the air duct dividing plate 510.

[0144] The installation cavity S includes a first space S1 located above the air duct dividing plate 510, a second space S2 located below the air duct dividing plate 510, a third space S3 located in front of the air duct dividing plate 510, and a fourth space S4 located behind the air duct dividing plate 510. In other words, the first space S1 is formed between the upper side of the air duct dividing plate 510 and the top wall of the installation cavity S, the second space S2 is formed between the lower side of the air duct dividing plate 510 and the bottom wall of the installation cavity S, the third space S3 is formed between the front end of the air duct dividing plate 510 and the front wall of the installation cavity S, and the fourth space S4 is formed between the rear end of the air duct dividing plate 510 and the rear wall of the installation cavity S.

[0145] The first space S1, the third space S3, the second space S2, and the fourth space S4 are connected end to end in sequence to form a circulating air duct. That is, the front end of the first space S1 is connected to the upper portion of the third space S3, the front end of the second space S2 is connected to the lower portion of the third space S3, the rear end of the first space S1 is connected to the upper portion of the fourth space S4, and the rear end of the second space S2 is connected to the lower portion of the fourth space S4.

[0146] The heating module 300 , the cold plate assembly 220 , the radiator 210 and the fan 400 are all arranged in the circulating air duct. The fan 400 is used to drive the air in the circulating air duct to circulate.

[0147] In this way, it is easy to realize the circulation flow of air in the installation cavity S. The air flow in the installation cavity S is more orderly, which is convenient for more efficient heat exchange with the cold row 210, so that the efficiency of heat dissipation of the air in the installation cavity S is higher.

[0148] In some possible implementations, the cold plate assembly 220 and the heating module 300 are disposed in the first space S1 , so that maintenance of the cold plate assembly 220 and the heating module 300 is more convenient.

[0149] Illustratively, the driving pump 230 is disposed in the first space S1 .

[0150] In some examples where the cold plate assembly 220 includes the first flow regulating valve 224 , a manual knob is provided on the top plate 110 , and the manual knob is in transmission connection with the first flow regulating valve 224 , and the manual knob is used to control the first flow regulating valve 224 .

[0151] In some possible implementations, the fan 400 and the radiator 210 are disposed in the third space S3 , and the radiator 210 is disposed between the fan 400 and the heating module 300 .

[0152] Thus, arranging the radiator 210 in the third space S3, which is higher, facilitates the placement of the radiator 210. The radiator 210 can be partially located above and partially below the air duct dividing plate 510. This facilitates the connection between the radiator 210 and the cold plate assembly 220, and facilitates sufficient heat exchange between the radiator 210 and the air flowing in the circulating air duct. Furthermore, the radiator 210 is located between the fan 400 and the heating module 300, which facilitates driving more air through the radiator 210 and facilitating sufficient heat exchange between the radiator 210 and the air flowing in the circulating air duct.

[0153] After the air in the first space S1 absorbs the heat generated by the heating module 300, the temperature rises. The fan 400 can drive the hot air in the first space S1 to flow forward. The air in the first space S1 flows forward to the third space S3, then turns downward, and then flows backward and passes through the cold row 210. After the hot air dissipates heat at the cold row 210, the temperature drops. That is, after the cold row 210 absorbs the heat in the hot air, the hot air is turned into cold air, and then flows backward into the second space S2. The air in the second space S2 flows backward to the fourth space S4, then turns upward, and then flows forward and flows into the first space S1. The cold air flowing into the first space S1 can be used to absorb the heat of the heating module 300 to dissipate heat from the heating module 300.

[0154] Illustratively, the cold row 210 is located behind the fan 400 , and the air duct dividing plate 510 , the heating module 300 and the cold plate assembly 220 are all located behind the cold row 210 .

[0155] Exemplarily, the fan 400 is an axial flow fan, and there is a spacing space between the front end of the fan 400 and the front wall of the installation cavity S for air to flow through. That is, the fan 400 and the front panel 130 are spaced apart from each other in front and back. The fan 400 can drive the air from the first space S1 to flow to the front of the fan 400 and turn downward in front of the fan 400.

[0156] In some examples, the first flow channel R1 and the cold plate assembly 220 are located on the same side of the duct dividing plate 510 in the thickness direction to facilitate connection between the first flow channel R1 and the cold plate assembly 220 .

[0157] In some examples where the cold plate assembly 220 and the heating module 300 are arranged in the first space S1, the first flow channel R1 is located above the air duct partition plate 510, so that the maintenance of the cold plate assembly 220 and the heating module 300 is more convenient while facilitating the connection between the first flow channel R1 and the cold plate assembly 220.

[0158] Exemplarily, the first interface 2111 and the second interface 2112 are both located above the air duct dividing plate 510 .

[0159] In some examples, the fan 400 and the fin structure 212 are located on the same side of the duct dividing plate 510 in the thickness direction.

[0160] In some examples where the cold plate assembly 220 and the heat generating module 300 are disposed in the first space S1, the fin structure 212 is located below the air duct dividing plate 510. This facilitates the placement of a larger fin structure 212, thereby improving the efficiency of heat dissipation for the air within the installation cavity S. When the fin structure 212 is located below the air duct dividing plate 510, the fan 400 is also located below the air duct dividing plate 510, resulting in a higher wind pressure at the fin structure 212, which facilitates the circulation of air within the circulating air duct.

[0161] In some possible embodiments, the first external connector 610 and the second external connector 620 are disposed on the rear wall of the installation cavity S, that is, the first external connector 610 and the second external connector 620 are disposed on the rear panel 140. At least a portion of the second flow channel R2 is located above the air duct partition plate 510, so that the fin structure 212 has a larger size and the heat exchange efficiency between the air in the installation cavity S and the fin structure 212 is higher. A portion of the first connecting pipe 630 and a portion of the second connecting pipe 640 are located below the air duct partition plate 510. The first connecting pipe 630 and the second connecting pipe 640 are disposed in the second space S2, so that the routing of the first connecting pipe 630 and the second connecting pipe 640 has a minimal impact on the arrangement of the cold plate assembly 220 and the heating module 300. In addition, if the first connecting pipe 630 and the second connecting pipe 640 leak, it is less likely to cause a short circuit in the heating module 300.

[0162] Illustratively, at least a portion of the third interface 2113 and at least a portion of the fourth interface 2114 are located above the air duct dividing plate 510 .

[0163] Figure 11 A schematic diagram of an air duct partition plate provided in an embodiment of the present application.

[0164] like Figure 11 As shown, the front end of the air duct dividing plate 510 has a first avoidance opening 511 and a second avoidance opening 512. The first avoidance opening 511 and the second avoidance opening 512 both pass through both sides of the air duct dividing plate 510 in the thickness direction. The first connecting pipe 630 is provided through the first avoidance opening 511, and the second connecting pipe 640 is provided through the second avoidance opening 512.

[0165] This facilitates routing the first connecting tube 630 and the second connecting tube 640 through the second space S2, thereby reducing the impact of the first connecting tube 630 and the second connecting tube 640 on the layout of the cold plate assembly 220 and the heating module 300, and reducing the risk of leakage from the first connecting tube 630 and the second connecting tube 640 causing a short circuit in the heating module 300. Furthermore, the gap between the front end of the duct partition plate 510 and the radiator 210 can be made smaller, so that the amount of air flowing out of the first space S1 and flowing into the second space S2 through the gap between the front end of the duct partition plate 510 and the radiator 210 is small. This facilitates a large amount of air to turn downward through the front of the radiator 210 and below the duct partition plate 510, resulting in a large amount of air flowing through the radiator 210, which is beneficial for efficient heat dissipation of the air in the installation cavity S.

[0166] Illustratively, the first avoidance opening 511 passes through the left end of the air duct dividing plate 510 , and the second avoidance opening 512 passes through the right end of the air duct dividing plate 510 .

[0167] For example, the left end of the duct dividing plate 510 is fixedly connected to the left side plate 150, and the right end of the duct dividing plate 510 is fixedly connected to the right side plate 160, so that it is easier to fix the duct dividing plate 510 to the chassis 100. In addition, there is no need to set a bracket or other connecting structure above or below the duct dividing plate 510 to fix the duct dividing plate 510 to the chassis 100, and it is not easy for the bracket to be set in the circulating air duct to affect the air circulation flow in the circulating air duct.

[0168] Illustratively, a left-side flange structure is formed at the left end of the duct dividing plate 510, and a right-side flange structure is formed at the right end of the duct dividing plate 510. The left end of the duct dividing plate 510 is fixedly connected to the left side plate 150 via the left-side flange structure, and the right end of the duct dividing plate 510 is fixedly connected to the right side plate 160 via the right-side flange structure, so as to achieve a fixed connection between the duct dividing plate 510 and the left side plate 150 and the right side plate 160, and the stability after connection is better.

[0169] For example, the left flange structure can be fixedly connected to the left side plate 150 by fastener connection, snap connection, etc.

[0170] For example, the right flange structure can be fixedly connected to the right side plate 160 by fastener connection, snap connection, etc.

[0171] Illustratively, the heating module 300 may be fixed on the upper surface of the air duct dividing plate 510 , and the heating module 300 may be supported by the air duct dividing plate 510 .

[0172] like Figure 10As shown, in some possible embodiments, the fourth space S4 is provided with an air guide structure 520. The air guide structure 520 is used to guide the air from the first space S1 to the second space S2, or to guide the air from the second space S2 to the first space S1.

[0173] In this way, the air in the circulating air duct can circulate more smoothly, which is conducive to allowing the air in the circulating air duct to take away the heat from the heating module 300 and transfer the heat to the second cooling medium through the cold row 210 for heat dissipation.

[0174] For example, the air guide structure 520 may be a block-shaped structure extending from the left end of the installation cavity S to the right end of the installation cavity S.

[0175] Illustratively, the side surface of the air guide structure 520 facing forward is an arc surface that is concave backward, so as to smoothly guide the air from the first space S1 to the second space S2, or guide the air from the second space S2 to the first space S1.

[0176] Figure 12 A schematic diagram of an air guide structure provided in an embodiment of the present application.

[0177] like Figure 12 As shown, the air guide structure 520 has a third avoidance opening 521, and the third avoidance opening 521 runs through the front and rear sides of the air guide structure 520. Figure 10 As shown, the first connecting pipe 630 and the second connecting pipe 640 are passed through the third avoidance opening 521. In this way, the air circulation in the circulating air duct is smoother and the second flow channel R2 is connected to the first external connector 610 and the second external connector 620.

[0178] Exemplarily, the third avoidance opening 521 is located at the left end or the right end of the wind guide structure 520 , so that the third avoidance opening 521 has less influence on the wind guide.

[0179] Exemplarily, the third avoidance opening 521 is located below the air duct dividing plate 510 so that the third avoidance opening 521 has less influence on the air guiding.

[0180] The cooling device and electronic device provided by the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A cooling device (200), characterized in that: including cold row (210); The cold row (210) has a first flow channel (R1) and a second flow channel (R2) separated from each other; The first flow channel (R1) is part of a first internal circulation flow channel, and the first internal circulation flow channel is used for circulating a first cooling medium; The second flow channel (R2) is part of the external circulation flow channel, and the external circulation flow channel is used for circulating the second cooling medium; The radiator (210) comprises a flow channel structure portion (211) and a fin structure (212), the flow channel structure portion (211) having the first flow channel (R1) and the second flow channel (R2), and the fin structure (212) is provided on the outer surface of the flow channel structure portion (211); The temperature of the second cooling medium in the second flow channel (R2) is lower than the temperature of the first cooling medium in the first flow channel (R1); The flow channel structure (211) is used to enable the first cooling medium in the first flow channel (R1) to perform heat exchange with the second cooling medium in the second flow channel (R2); The first cooling medium is a two-phase cooling medium that can circulate in the first internal circulation channel through the pressure difference generated by its own phase change; The flow channel structure (211) further comprises a third flow channel; the third flow channel is part of the second internal circulation flow channel, and the second internal circulation flow channel is used for circulating a third cooling medium; The flow channel structure (211) is also used to enable the third cooling medium in the third flow channel to perform heat exchange with the second cooling medium in the second flow channel (R2); The first flow channel (R1), the third flow channel and the fin structure (212) are respectively located on different sides of the second flow channel (R2).

2. The cooling device (200) according to claim 1, characterized in that The flow channel structure (211) extends in the left-right direction, the first flow channel (R1) and the second flow channel (R2) are arranged side by side vertically, and the fin structure (212) is provided on a side of the second flow channel (R2) away from the first flow channel (R1).

3. The cooling device (200) according to claim 2, characterized in that The third flow channel and the second flow channel (R2) are arranged side by side in front and back.

4. The cooling device (200) according to claim 1, characterized in that The first flow channel (R1) and the second flow channel (R2) are both straight flow channels.

5. The cooling device (200) according to claim 1, characterized in that At least one of the first flow channel (R1) and the second flow channel (R2) is a bent flow channel.

6. The cooling device (200) according to any one of claims 1 to 5, characterized in that: It also includes a cold plate assembly (220), the cold plate assembly (220) being in communication with the first flow channel (R1), and the first flow channel (R1) and the cold plate assembly (220) being used to form the first internal circulation flow channel.

7. The cooling device (200) according to claim 6, characterized in that The cold plate assembly (220) comprises a first cold plate (221), a second cold plate (222), a first bypass pipe (223), and a first flow regulating valve (224); The first cold plate (221) and the second cold plate (222) are connected in series, and the first cold plate (221) is located between the inlet of the second cold plate (222) and the outlet of the first flow channel (R1); The first bypass pipe (223) is connected in parallel to the first cold plate (221), and the first flow regulating valve (224) is provided on the first bypass pipe (223). The first flow regulating valve (224) is used to regulate the flow of the first cooling medium flowing through the first bypass pipe (223).

8. The cooling device (200) according to claim 7, characterized in that Also includes a third cold plate, a second bypass pipe and a second flow regulating valve; The third cold plate is connected in series between the first cold plate (221) and the second cold plate (222), the outlet of the first cold plate (221) is connected to the inlet of the second cold plate (222) through the third cold plate and the second bypass pipe, the second bypass pipe is connected in parallel with the third cold plate, and the second flow regulating valve is used to regulate the flow of the first cooling medium flowing through the second bypass pipe.

9. The cooling device (200) according to claim 6, characterized in that The cold plate assembly (220) comprises a fourth cold plate (225), a fifth cold plate (226), and a third flow regulating valve (227); The fourth cold plate (225) is connected in series with the third flow regulating valve (227); The fourth cold plate (225) and the third flow regulating valve (227) are connected in series and are connected in parallel to the fifth cold plate (226); The third flow regulating valve (227) is used to regulate the flow of the first cooling medium flowing through the fourth cold plate (225).

10. The cooling device (200) according to claim 6, characterized in that Also included is a drive pump (230); The driving pump (230) is connected in series with the cold plate assembly (220) and the first flow channel (R1), and the driving pump (230) is used to drive the first cooling medium to circulate in the first internal circulation flow channel.

11. The cooling device (200) according to claim 10, characterized in that The driving pump (230) is connected in series between the outlet of the first flow channel (R1) and the inlet of the cold plate assembly (220).

12. An electronic device (10), characterized in that Comprising a chassis (100) and a cooling device (200) according to any one of claims 1 to 11; The chassis (100) has an installation cavity (S), the cooling device (200) is arranged in the installation cavity (S), and the first flow channel (R1) of the cooling device (200) is part of a first internal circulation flow channel located in the installation cavity (S); The second flow channel (R2) of the cooling device (200) is used to form an external circulation flow channel with a cold source device (20) located outside the chassis (100).

13. The electronic device (10) according to claim 12, characterized in that Also includes a heating module (300); The heating module (300) is arranged in the installation cavity (S), and the cold plate assembly (220) of the cooling device (200) is in contact with the heating module (300).

14. The electronic device (10) according to claim 13, characterized in that Also included is a fan (400); The fan (400) is disposed in the installation cavity (S), and the fan (400) is used to drive the air at the heating module (300) to flow toward the cooling row (210) of the cooling device (200).

15. The electronic device (10) according to claim 14, characterized in that The installation cavity (S) is a closed cavity; An air duct partition plate (510) is provided in the installation cavity (S), and the top wall of the installation cavity (S) and the bottom wall of the installation cavity (S) are respectively located on both sides of the air duct partition plate (510) in the thickness direction; The installation cavity (S) comprises a first space (S1) located above the air duct partition plate (510), a second space (S2) located below the air duct partition plate (510), a third space (S3) located in front of the air duct partition plate (510), and a fourth space (S4) located behind the air duct partition plate (510); The first space (S1), the third space (S3), the second space (S2) and the fourth space (S4) are connected end to end in sequence to form a circulating air duct; The heating module (300), the cold plate assembly (220), the cold row (210) and the fan (400) are all arranged in the circulating air duct, and the fan (400) is used to drive the air in the circulating air duct to circulate.

16. The electronic device (10) according to claim 15, characterized in that The cold plate assembly (220) and the heating module (300) are arranged in the first space (S1), the fan (400) and the radiator (210) are arranged in the third space (S3), and the radiator (210) is arranged between the fan (400) and the heating module (300).

17. The electronic device (10) according to claim 16, characterized in that The first flow channel (R1) is located above the air channel dividing plate (510).

18. The electronic device (10) according to claim 16, characterized in that The chassis (100) is provided with a first external connector (610) and a second external connector (620), and the first external connector (610) and the second external connector (620) are provided on the rear wall of the installation cavity (S); At least a portion of the second flow channel (R2) is located above the air duct partition plate (510); the inlet of the second flow channel (R2) is connected to the first external connector (610) via a first connecting pipe (630); the outlet of the second flow channel (R2) is connected to the second external connector (620) via a second connecting pipe (640); the first external connector (610) is used to connect to the outlet of the cold source device (20); and the second external connector (620) is used to connect to the inlet of the cold source device (20); A portion of the first connecting pipe (630) and a portion of the second connecting pipe (640) are located below the air duct partition plate (510); The front end of the air duct partition plate (510) has a first avoidance opening (511) and a second avoidance opening (512); the first connecting pipe (630) is provided through the first avoidance opening (511) and the second space (S2); and the second connecting pipe (640) is provided through the second avoidance opening (512) and the second space (S2).

19. The electronic device (10) according to claim 18, characterized in that The fourth space (S4) is provided with an air guide structure (520); The air guide structure (520) is used to guide the air from the first space (S1) to the second space (S2), or to guide the air from the second space (S2) to the first space (S1); The air guide structural member (520) has a third avoidance opening (521), and the first connecting pipe (630) and the second connecting pipe (640) are arranged through the third avoidance opening (521).

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