High-precision dispensing equipment for semiconductor chip packaging

Abstract

The invention relates to the technical field of dispensing equipment, in particular to high-precision dispensing equipment for semiconductor chip packaging, which comprises a dispensing machine, a substrate positioning assembly is arranged in the dispensing machine, a substrate is positioned through the substrate positioning assembly in the dispensing process, a movable dispensing mechanism is mounted in the dispensing machine, and the movable dispensing mechanism is connected with the substrate positioning assembly. A semiconductor chip is packaged through a movable type dispensing mechanism, a dispensing pressing mechanism is further installed in a dispensing machine, when the semiconductor chip is packaged, a substrate is positioned on a dispensing bearing platform through a substrate limiting frame, and the chip is inserted between two chip positioning frames, so that the chip is naturally positioned at a packaging point position; the positioning operation of workers is not needed, convenience and rapidness are achieved, then the electric telescopic rod is started to drive the pressing carrying disc to move downwards to press the semiconductor chip, pressing of the semiconductor chip is achieved, and the phenomenon of displacement of the semiconductor chip in the packaging process can be avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of dispensing equipment, and particularly to a high-precision dispensing equipment for semiconductor chip packaging. Background Technique

[0002] In integrated circuit manufacturing, packaging a semiconductor chip on a substrate through a dispensing equipment is a crucial step. Packaging the semiconductor chip with glue can not only fix the semiconductor chip on the substrate, but also the glue has good electrical insulation performance, which can prevent short circuits between chip pins. When performing packaging, it is necessary to use the dispensing equipment to apply the glue around the semiconductor chip to complete the packaging. However, the existing dispensing equipment cannot fix the semiconductor chip well during the packaging process of the semiconductor chip. During the packaging process, the glue is gradually applied around the semiconductor chip, so the position of the semiconductor chip may change slightly under the impact of the glue, which is difficult to detect with the naked eye, and then the semiconductor chip cannot be accurately packaged at the packaging position, affecting the packaging effect. Moreover, when packaging the semiconductor chip, it is necessary for the staff to position the semiconductor chip, which is more troublesome in operation, cannot achieve rapid positioning, and there will also be human errors resulting in inaccurate chip positioning. Summary of the Invention

[0003] The purpose of the present invention is to provide a high-precision dispensing equipment for semiconductor chip packaging to solve the problems raised in the above background technique.

[0004] To achieve the above purpose, the present invention provides the following technical solutions: A high-precision dispensing equipment for semiconductor chip packaging, including a dispenser. A substrate positioning component is arranged inside the dispenser, and the substrate is positioned through the substrate positioning component during the dispensing process; A mobile dispensing mechanism is installed inside the dispenser, and the semiconductor chip is packaged through the mobile dispensing mechanism. Moreover, a dispensing pressing mechanism is also installed inside the dispenser; The dispensing pressing mechanism presses and fixes the semiconductor chip to ensure its stability during the packaging process; A chip positioning component is arranged on the substrate positioning component, and the semiconductor chip is positioned through the chip positioning component so that it is accurately at the packaging position; The chip positioning component is driven by the dispensing pressing mechanism, and the chip positioning component is also connected to a reset component. The reset component can limit the chip positioning component, and the reset component is also driven by the dispensing pressing mechanism.

[0005] Preferably, the substrate positioning component is a dispensing table, and a substrate limiting frame is fixedly arranged on the dispensing table to position the substrate through the substrate limiting frame.

[0006] Preferably, the mobile dispensing mechanism includes a motor and a bearing ring plate, and a gear is installed on the motor; The gear drives the bearing ring plate to rotate, and when the bearing ring plate rotates, the dispensing operation around the semiconductor chip is realized.

[0007] Preferably, the dispensing pressing mechanism includes an electric telescopic rod and a supporting carrier plate, and the electric telescopic rod drives the supporting carrier plate to move downward to press the semiconductor chip.

[0008] Preferably, the chip positioning component includes a moving carrier plate and a driving carrier block. The moving carrier plates are symmetrically installed on both sides of the dispensing base to position the semiconductor chip.

[0009] Preferably, the moving carrier plate is connected with a driving carrier block, and the driving carrier block moves through the supporting carrier plate, thereby realizing the movement of the moving carrier plate.

[0010] Preferably, the reset component includes a movable strip plate, a rotating connecting column and a reset carrier plate. When the driving carrier block moves downward, it is limited by the movable strip plate, thereby realizing the fixation of the moving carrier plate.

[0011] Preferably, the upper end of the movable strip plate is connected with a rotating connecting column, and when the rotating connecting column rotates, it drives the movable strip plate to move.

[0012] Preferably, the movable strip plate limits and releases the driving carrier block by moving.

[0013] Preferably, the rotating connecting column is further connected with a reset carrier plate, and the reset carrier plate moves upward by the push of the supporting carrier plate.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows: The structure of the present invention is reasonably arranged and has strong functionality, and has the following advantages: 1. When packaging a semiconductor chip, the substrate is positioned on the dispensing base through the substrate limiting frame, and the chip is inserted between two chip positioning frames to be naturally positioned at the packaging position. There is no need for workers to perform positioning operations, which is very convenient and fast. Then, the electric telescopic rod is started to drive the pressing carrier plate to move downward and press on the semiconductor chip to realize the pressing of the semiconductor chip, so as to avoid the displacement of the semiconductor chip during the packaging process, and enable the semiconductor chip to be accurately packaged at the packaging position.

[0015] 2. When the electric telescopic rod drives the support carrier plate to move downward, under the action of the downward pushing block, the driving carrier block will also be pushed to move downward. As the driving carrier block moves downward, it will push the moving bearing plate to move. Under the movement of the moving bearing plate, the chip positioning frame will be driven to move away from each other and separate from the semiconductor chip. In this way, when dispensing glue, the chip positioning frame can be avoided from obstructing the dispensing glue.

[0016] 3. After the dispensing is completed, the electric telescopic rod drives the support carrier plate to move upward. As the support carrier plate moves upward, when the pressing carrier plate separates from the semiconductor chip, the substrate encapsulated with the semiconductor chip can be removed. Then, as the pressing carrier plate continues to move upward, it will push the reset carrier plate to move upward. As the reset carrier plate moves upward, it will drive the rotating connecting column to rotate, and then drive the movable strip plate to move, so that the inclined plane clamping strip no longer plays a limiting role on the driving carrier block. In this way, under the action of the reset spring, the moving bearing plate can be driven to reset, so that the two chip positioning frames are closed together again, facilitating the encapsulation work of the next semiconductor chip. Description of the Drawings

[0017] Figure 1 It is a schematic diagram of the first perspective of the assembly of the dispensing machine.

[0018] Figure 2 It is Figure 1 The enlarged schematic diagram of part A in

[0019] Figure 3 It is Figure 1 The enlarged schematic diagram of part B in

[0020] Figure 4 It is a schematic diagram of the second perspective of the assembly of the dispensing machine.

[0021] Figure 5 It is Figure 4 The enlarged schematic diagram of part C in

[0022] Figure 6 It is a schematic diagram of the first perspective structure of the dispensing machine.

[0023] Figure 7 It is a schematic diagram of the second perspective structure of the dispensing machine.

[0024] Figure 8 It is a schematic diagram of the assembly of the support carrier plate.

[0025] Figure 9 It is a matching schematic diagram of the moving bearing plate.

[0026] Figure 10 It is a connection schematic diagram of the movable strip plate and the reset carrier plate.

[0027] Figure 11 It is a schematic diagram of the structure of the reset carrier plate.

[0028] In the figure: 1, dispensing machine; 11, dispensing base; 12, substrate limiting frame; 13, mounting support rod; 14, mounting support block; 15, limiting support column; 16, electric telescopic rod; 17, support limiting column; 18, mounting carrier ring; 181, support carrier ring; 19, assembly support plate; 191, mounting support hole; 2, support carrier plate; 21, bearing mounting column; 22, moving insertion cavity; 23, pressing carrier column; 24, pressing carrier plate; 25, pressing soft pad; 26, connecting spring; 27, bearing plate strip; 28, limiting guide hole; 29, mating support rod; 291, downward pushing block; 3, motor; 31, gear; 4, bearing ring plate; 41, toothed ring; 42, first bearing; 43, glue storage box; 44, dispensing tube; 5, moving bearing plate; 51, moving support hole; 52, return spring; 53, support carrier strip; 54, chip positioning frame; 55, connecting and mating rod; 6, driving carrier block; 61, limiting through hole; 62, connecting carrier strip; 63, pushing strip block; 7, movable strip plate; 71, support through hole; 72, inclined surface clamping strip; 73, upward pushing support plate; 74, connecting support column; 75, limiting top block; 76, movable connecting block; 77, movable mating hole; 8, rotating connecting column; 81, second bearing; 82, rotating connecting strip; 9, return carrier plate; 91, limiting through hole; 92, bearing block; 93, moving guide column; 94, moving connecting plate; 95, mating carrier column; 96, mating cavity. Detailed implementation manners

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] The present invention provides a technical solution: As Figure 1 and Figure 4 shown, a high-precision dispensing device for semiconductor chip packaging includes a dispensing machine 1. A substrate positioning component is arranged inside the dispensing machine 1. During the dispensing process, the substrate is positioned by the substrate positioning component. A mobile dispensing mechanism is installed inside the dispensing machine 1. The semiconductor chip is packaged by the mobile dispensing mechanism. And a dispensing pressing mechanism is also installed inside the dispensing machine 1. The dispensing pressing mechanism presses and fixes the semiconductor chip to ensure its stability during the packaging process; a chip positioning component is arranged on the substrate positioning component. The semiconductor chip is positioned by the chip positioning component so that it is accurately at the packaging position. The chip positioning component is driven by the dispensing pressing mechanism. And the chip positioning component is also connected with a reset component. The reset component can limit the chip positioning component. And the reset component is also driven by the dispensing pressing mechanism.

[0031] As Figure 6 shown, the substrate positioning component is the dispensing platform 11. A substrate limiting frame 12 is fixedly arranged on the dispensing platform 11. The substrate is positioned by the substrate limiting frame 12. Installation support rods 13 are symmetrically and fixedly arranged on both sides of the dispensing platform 11. Installation support blocks 14 are fixedly arranged on the installation support rods 13. Limiting support columns 15 are fixedly arranged on the installation support blocks 14.

[0032] As Figure 6 and Figure 7 shown, a support limiting column 17 is fixedly arranged on the inner top surface of the dispenser 1. An installation carrier ring 18 is fixedly arranged at the lower end of the support limiting column 17. A support carrier ring 181 is fixedly arranged on the installation carrier ring 18. Assembly support plates 19 are symmetrically and fixedly arranged on the inner top surface of the dispenser 1. Installation support holes 191 are formed in the assembly support plates 19.

[0033] As Figure 1 and Figure 2 shown, the mobile dispensing mechanism includes a motor 3 and a bearing ring plate 4. A gear 31 is installed on the motor 3. The gear 31 drives the bearing ring plate 4 to rotate. When the bearing ring plate 4 rotates, the dispensing operation around the semiconductor chip is realized. The motor 3 is fixedly installed on the inner top surface of the dispenser 1. A toothed ring 41 is fixedly arranged on the bearing ring plate 4. The toothed ring 41 meshes with the gear 31. A first bearing 42 is fitted inside the bearing ring plate 4. The first bearing 42 is sleeved on the installation carrier ring 18. The support carrier ring 181 plays a supporting role for the bearing ring plate 4. A glue storage box 43 is fixedly installed at the lower end of the bearing ring plate 4. A dispensing tube 44 is fixedly arranged on the glue storage box 43.

[0034] As Figure 2 and Figure 8As shown, the dispensing and pressing mechanism includes an electric telescopic rod 16 and a support carrier 2. The electric telescopic rod 16 drives the support carrier 2 to move downward to press the semiconductor chip. The electric telescopic rod 16 is also fixedly installed on the inner top surface of the dispenser 1, and the electric telescopic rod 16 is fixedly connected to the support carrier 2. A bearing mounting column 21 is fixedly provided at the lower end of the support carrier 2. A moving insertion cavity 22 is provided on the bearing mounting column 21. A pressing carrier column 23 is inserted into the moving insertion cavity 22. A pressing carrier plate 24 is fixedly provided at the lower end of the pressing carrier column 23. A pressing soft pad 25 is provided on the lower end surface of the pressing carrier plate 24. A connecting spring 26 is sleeved on the pressing carrier column 23, and both ends of the connecting spring 26 are respectively fixed on the pressing carrier plate 24 and the lower end surface of the bearing mounting column 21. The pressing carrier plate 24 presses and fixes the semiconductor chip, and when pressing, the pressing soft pad 25 is in contact with the semiconductor chip. The pressing soft pad 25 is a rubber pad. Bearing strips 27 are symmetrically and fixedly provided on both sides of the support carrier 2. Limiting guide holes 28 are provided on the bearing strips 27. Support limiting columns 17 are inserted into the limiting guide holes 28. A cooperating support rod 29 is also fixedly provided on the bearing strip 27. A lower pushing block 291 is fixedly provided at the lower end of the cooperating support rod 29.

[0035] As Figure 1 , Figure 3 and Figure 9 shown, the chip positioning component includes a moving carrier plate 5 and a driving carrier block 6. The moving carrier plate 5 is symmetrically installed on both sides of the dispensing table 11 to position the semiconductor chip. The moving carrier plate 5 is connected to the driving carrier block 6. The driving carrier block 6 moves through the support carrier 2, thereby realizing the movement of the moving carrier plate 5. A moving bearing hole 51 is provided on the moving carrier plate 5. An installation bearing rod 13 is inserted into the moving bearing hole 51. A return spring 52 is sleeved on the installation bearing rod 13, and both ends of the return spring 52 are respectively fixed on the moving carrier plate 5 and the dispensing table 11. A support strip 53 is fixedly provided at the upper end of the moving carrier plate 5. A chip positioning frame 54 is fixedly provided on the support strip 53. When positioning the semiconductor chip, the two chip positioning frames 54 are closed together. A connecting cooperation rod 55 is hinged on the moving carrier plate 5. The upper end of the connecting cooperation rod 55 is hinged to the driving carrier block 6. A limiting through hole 61 is provided on the driving carrier block 6. A limiting bearing column 15 is inserted into the limiting through hole 61. Connecting strips 62 are symmetrically and fixedly provided on the driving carrier block 6. The connecting strips 62 are hinged to the upper end of the connecting cooperation rod 55. A pushing strip block 63 is fixedly provided on the connecting strip 62.

[0036] As Figure 4 , Figure 5 , Figure 10 and Figure 11As shown, the reset assembly includes a movable strip plate 7, a rotary connecting column 8, and a reset carrier plate 9. When the driving carrier block 6 moves downward, it is limited by the movable strip plate 7, thereby fixing the movable bearing plate 5. The upper end of the movable strip plate 7 is connected to the rotary connecting column 8. When the rotary connecting column 8 rotates, it drives the movable strip plate 7 to move. The movable strip plate 7 limits and releases the driving carrier block 6 through movement. The rotary connecting column 8 is also connected to the reset carrier plate 9. The reset carrier plate 9 moves upward under the push of the support carrier plate 2. There are two movable strip plates 7, symmetrically installed on both sides of the dispensing platform 11. The lower end of the movable strip plate 7 is provided with a support through hole 71. An installation support rod 13 is inserted into the support through hole 71. And inclined surface clamping strips 72 are symmetrically and fixedly arranged on the movable strip plate 7. The driving carrier block 6 is limited by the inclined surface clamping strips 72. The upper end of the movable strip plate 7 is also fixedly provided with an upper supporting plate 73. A connecting support column 74 is fixedly arranged on the upper supporting plate 73. A limiting top block 75 is fixedly arranged at the upper end of the connecting support column 74. And a movable connecting block 76 is sleeved on the connecting support column 74. A movable matching hole 77 is opened on the movable connecting block 76. The movable matching hole 77 cooperates with the connecting support column 74. And the movable connecting block 76 can move up and down along the connecting support column 74.

[0037] A second bearing 81 is sleeved on the rotary connecting column 8. The second bearing 81 is installed in the installation bearing hole 191. Rotary connecting strips 82 are symmetrically and fixedly arranged on the rotary connecting column 8. One side of the rotary connecting strip 82 is hinged to the movable connecting block 76. The other side of the rotary connecting strip 82 is connected to the reset carrier plate 9. A limiting through hole 91 is opened on the reset carrier plate 9. A support limiting column 17 is inserted into the limiting through hole 91. And bearing blocks 92 are symmetrically and fixedly arranged on the reset carrier plate 9. A movable guide post 93 is fixedly arranged on the bearing block 92. A movable connecting plate 94 is installed on the movable guide post 93. The movable connecting plate 94 is hinged to one side of the rotary connecting strip 82 on the rotary connecting column 8. And cooperating carrier columns 95 are symmetrically and fixedly arranged on the movable connecting plate 94. A cooperating cavity 96 is opened on the cooperating carrier column 95. The cooperating cavity 96 cooperates with the movable guide post 93.

[0038] When the support carrier plate 2 does not move downward, the bearing plate strip 27 is in contact with the reset carrier plate 9. Under the support of the bearing plate strip 27, the reset carrier plate 9 cannot move downward under its own gravity. When packaging a semiconductor chip, the substrate is inserted into the substrate limit frame 12, and the substrate is positioned by the substrate limit frame 12. At this time, the two chip positioning frames 54 are closed together. The semiconductor chip is placed into the closed space formed by the two chip positioning frames 54 from the upper side of the chip positioning frames 54, so that it accurately falls to the packaging point position on the substrate. At the same time, the chip positioning frame 54 can position the chip, eliminating the need for workers to adjust and position the chip, facilitating the work of the workers. After placing the semiconductor chip, the electric telescopic rod 16 is activated to drive the support carrier plate 2 to move downward. As the support carrier plate 2 moves downward, the reset carrier plate 9 will move downward under its own gravity, and then drive the rotating link 82 hinged to the moving connecting plate 94 to rotate downward. At the same time, relative movement occurs between the moving connecting plate 94 and the reset carrier plate 9 to adapt to the rotation of the rotating connecting column 8. At the same time, it will also drive the rotating link 82 hinged to the movable connecting block 76 on the rotating connecting column 8 to rotate upward, thus driving the movable connecting block 76 to move upward. As the movable connecting block 76 moves upward, it will also drive the movable strip 7 to move towards the dispensing platform 11. In this way, when the driving carrier block 6 moves downward, the pushing strip block 63 will contact the inclined surface clamping strip 72. As the support carrier plate 2 moves downward, the pressing carrier plate 24 will press on the semiconductor chip. In this way, the semiconductor chip can be pressed and fixed under the action of the pressing carrier plate 24. At the same time, as the support carrier plate 2 continues to move downward, the lower pushing block 291 will contact the driving carrier block 6. In this way, the driving carrier block 6 will be driven to move downward under the action of the lower pushing block 291. As the driving carrier block 6 moves downward, under the action of the connecting and cooperating rod 55, the moving bearing plate 5 will be driven to move away from the dispensing platform 11, thereby driving the chip positioning frame 54 to move, so that the two chip positioning frames 54 are no longer closed together and move away from the semiconductor chip. At this time, the semiconductor chip is in a fixed state under the action of the pressing carrier plate 24. The movement of the chip positioning frame 54 can prevent obstacles to the dispensing operation around the semiconductor chip during the packaging of the semiconductor chip. When the driving carrier block 6 moves downward, the cooperation between the pushing strip block 63 and the inclined surface of the inclined surface clamping strip 72 will push the movable strip 7 to move away from the dispensing platform 11. In this way, the reset carrier plate 9 will be driven to move upward through the rotation of the rotating connecting column 8 until the pushing strip block 63 passes over the inclined surface clamping strip 72. The movable strip 7 loses its restriction, and the reset carrier plate 9 moves downward under its own gravity, and then can drive the rotating connecting column 8 to flip, driving the movable strip 7 to move towards the dispensing platform 11, so that the inclined surface clamping strip 72 is also on the pushing strip block 63 on the driving carrier block 6, realizing the limit of the driving carrier block 6 so that it cannot move upward.Furthermore, it can play a role in fixing the movable bearing plate 5, enabling the chip positioning frame 54 to be in a stable separated state. At this time, the encapsulation operation of the semiconductor chip can be carried out, that is, start the motor 3 to drive the gear 31 to rotate. Then, under the action of the gear 31, drive the bearing ring plate 4 to rotate. Driving the glue storage box 43 to rotate can perform dotting operation on the circumference of the semiconductor chip. After the encapsulation is completed, start the electric telescopic rod 16 to drive the support carrier plate 2 to move upward. As the support carrier plate 2 moves upward, it will drive the pressing carrier plate 24 to separate from the semiconductor chip. At this time, the substrate encapsulated with the semiconductor chip can be removed from the dotting base 11. Then, as the support carrier plate 2 continues to move upward, the bearing plate strip 27 will contact the reset carrier plate 9, and then can push the reset carrier plate 9 to move upward. In this way, as the reset carrier plate 9 moves upward, it will drive the rotary connecting column 8 to rotate, and then drive the movable strip plate 7 to move away from the dotting base 11. In this way, the inclined plane clamping strip 72 can be separated from the pushing strip block 63, releasing the restriction on the driving carrier block 6, and then the movable bearing plate 5 loses the restriction. Under the action of the reset spring 52, the movable bearing plate 5 is reset, and the two chip positioning frames 54 are closed together again, preparing for the next encapsulation.

[0039] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision dispensing device for semiconductor chip packaging, including a dispenser, characterized in that: The inside of the dispensing machine is provided with a substrate positioning component, and the substrate is positioned by the substrate positioning component during the dispensing process; A mobile dispensing mechanism is installed inside the dispensing machine, and the semiconductor chip is encapsulated by the mobile dispensing mechanism. Moreover, a dispensing pressing mechanism is also installed inside the dispensing machine; The dispensing pressing mechanism presses and fixes the semiconductor chip to ensure its stability during the encapsulation process; A chip positioning component is arranged on the substrate positioning component, and the semiconductor chip is positioned by the chip positioning component so that it is accurately at the encapsulation point position; The chip positioning component is driven by the dispensing pressing mechanism, and the chip positioning component is also connected with a reset component. The reset component can limit the chip positioning component, and the reset component is also driven by the dispensing pressing mechanism.

2. The high-precision dispensing device for semiconductor chip packaging according to claim 1, wherein: The substrate positioning component is a dispensing table, and a substrate limiting frame is fixedly arranged on the dispensing table, and the substrate is positioned by the substrate limiting frame.

3. A high-precision dispensing device for semiconductor chip packaging according to claim 2, characterized in that: The mobile dispensing mechanism includes a motor and a bearing ring plate, and a gear is installed on the motor; The gear drives the bearing ring plate to rotate, and the dispensing operation around the semiconductor chip is realized when the bearing ring plate rotates.

4. A high-precision dispensing device for semiconductor chip packaging according to claim 3, characterized in that: The dispensing pressing mechanism includes an electric telescopic rod and a support carrier plate, and the electric telescopic rod drives the support carrier plate to move downward to press the semiconductor chip.

5. The high-precision dispensing device for semiconductor chip packaging according to claim 4, characterized in that: The chip positioning component includes a moving carrier plate and a driving carrier block. The moving carrier plates are symmetrically installed on both sides of the dispensing table to position the semiconductor chip.

6. The high-precision dispensing device for semiconductor chip packaging according to claim 5, characterized in that: The moving carrier plate is connected with a driving carrier block, and the driving carrier block moves through the support carrier plate, thereby realizing the movement of the moving carrier plate.

7. A high-precision dispensing device for semiconductor chip packaging according to claim 6, characterized in that: The reset component includes a movable strip plate, a rotary connecting column and a reset carrier plate. When the driving carrier block moves downward, it is limited by the movable strip plate, thereby realizing the fixation of the moving carrier plate.

8. A high-precision dispensing device for semiconductor chip packaging according to claim 7, characterized in that: The upper end of the movable strip plate is connected with a rotary connecting column, and the movable strip plate moves when the rotary connecting column rotates.

9. A high-precision dispensing device for semiconductor chip packaging according to claim 8, characterized in that: The movable strip plate limits and releases the driving carrier block by moving.

10. A high-precision dispensing device for semiconductor chip packaging according to claim 9, characterized in that: The rotary connecting column is also connected with a reset carrier plate, and the reset carrier plate moves upward by the push of the support carrier plate.

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