Testing method, device, equipment and storage medium for collaborative collection of material deformation

Abstract

The present application discloses a testing method, apparatus, device, and storage medium for collaborative acquisition of material deformation, relating to the field of material testing technology, including: performing EBSD calibration on the sample surface of a test sample; preparing speckle on the sample surface and performing in-situ loading for DIC measurement; removing speckle from the target test sample, and returning to the step of performing EBSD calibration based on the test sample after speckle removal until the in-situ loading of the target test sample reaches a preset loading target; and determining EBSD test results and DIC test results based on the obtained measurement results of the internal grain orientation information and material strain information of each test sample. The present application eliminates the need to consider the influence of DIC on EBSD calibration, overcomes the limitation of the electron beam on the speckle particle size or the DIC observation area size in EBSD calibration, and improves the testing efficiency of collaborative acquisition of material deformation.

Description

Technical Field

[0001] The present application relates to the field of material testing technology, and in particular to a testing method, device, equipment and storage medium for collaborative collection of material deformation. Background Art

[0002] In recent years, research on the microscopic deformation coordination behavior of metal materials has become increasingly in-depth. Accurately characterizing the strain distribution and orientation rotation within metal grains at different scales has become a research hotspot. Furthermore, since it is often necessary to analyze the quantitative relationship between microscopic local strain and grain rotation, strain calculation methods and orientation measurement methods must be able to be performed simultaneously or alternately without significant interference. Currently, non-contact digital image correlation (DIC) technology is one of the best methods for measuring strain distribution evolution, while the main method for calibrating material micro-area orientation is electron backscatter diffraction (EBSD).

[0003] The principle of DIC is to divide the region of interest in the image before deformation into a grid and treat each sub-region as a rigid motion. Then, for each sub-region, a certain search method is used to perform correlation calculations according to a pre-defined correlation function, and the region with the maximum mutual correlation coefficient with the sub-region is found in the deformed image, that is, the position of the sub-region after deformation, and the displacement of the sub-region is obtained. By calculating all sub-regions, the deformation information of the entire field can be obtained. In order to more clearly identify the sub-regions before and after deformation, it is usually necessary to pre-fabricate a high-contrast speckle pattern on the surface of the specimen. For example, a layer of white primer is first sprayed on the surface of the sample, and then a layer of black speckle paint is sprayed after it dries to form a randomly distributed white background with black spots. By calculating the grayscale feature values ​​of the patterns of each sub-region before and after deformation, the position information of each sub-region before and after deformation is identified, and the local strain is calculated.

[0004] In practical applications, various speckle pattern generation methods are used. The principle of EBSD technology is that when an incident electron beam scatters in a crystalline sample, scattered electron waves are emitted in all directions within the crystal. Therefore, EBSD calibration requires a fresh and uncontaminated sample surface. Even if a marker is required, it must be relatively transparent to the electron beam. Consequently, several specialized speckle pattern generation methods have been developed, such as gold film modification to pre-form randomly distributed nanoscale gold particles on the sample surface (the electron beam can bypass nanoscale particles), micro-electrolytic etching to etch nanoscale pits on the sample surface (the pit diameter is much smaller than the electron beam diameter and does not significantly affect the diffraction signal), and direct deposition of a layer of nanoscale silica spheres on the sample surface to minimize interference with EBSD calibration. However, since the scale of gold particles, silica particles or corrosion pits needs to be controlled below tens of nanometers, this strictly limits the area range of a single DIC observation to within 10×10μm (usually requiring more than 1500 times for observation). If a larger area (such as 500×500μm) is to be observed, it is necessary to photograph each sub-area in blocks and then stitch them together, resulting in a huge workload (for example, stitching 10×10μm into 500×500μm requires at least 2500 sub-area images).

[0005] At the same time, with the development of science and technology, EBSD calibration technology has also been greatly improved, with calibration rates reaching 1000 points / second and a single calibration range of 1000×2000μm (optionally observed at 50x magnification). Therefore, when DIC and EBSD are observed simultaneously, the observation range of EBSD is much greater than that of DIC due to the requirement for pre-fabricated speckle patterns that do not interfere with the electron beam. This limits the size range of the speckle pattern and the single observation range of DIC. Summary of the Invention

[0006] The main purpose of this application is to provide a testing method for coordinated acquisition of material deformation, aiming to solve the technical problem of how to remove the limitation of the electron beam on the size of speckle particles or the size of the DIC observation area in EBSD calibration.

[0007] To achieve the above objectives, the present application proposes a testing method for collaborative collection of material deformation, which includes:

[0008] Perform electron backscatter diffraction (EBSD) calibration on the sample surface to obtain the measurement results of the internal grain orientation information of the sample;

[0009] Prepare speckles on the sample surface to obtain a target sample to be tested;

[0010] In-situ loading is performed on the target sample to perform a digital image correlation (DIC) measurement to obtain a measurement result of the material strain information of the sample;

[0011] Cleaning the speckle on the target sample to be tested, and returning to the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the target sample to be tested based on the sample to be tested after the speckle cleaning, until the target sample to be tested is in-situ loaded to reach a preset loading target;

[0012] The EBSD test results of the samples to be tested are determined based on the obtained measurement results of the internal grain orientation information of each sample to be tested, and the DIC test results of the samples to be tested are determined based on the obtained measurement results of the material strain information of each sample to be tested.

[0013] In one embodiment, the step of in-situ loading the target sample to be tested for digital image correlation (DIC) measurement includes:

[0014] Taking a sample morphology image of the target sample before deformation;

[0015] Applying stress to the target sample to be tested based on a preset in-situ loading task;

[0016] After the target sample to be tested reaches the deformation amount specified by the in-situ loading task, photographing the sample morphology after deformation of the target sample to be tested;

[0017] Digital image correlation (DIC) measurement is performed based on the sample morphology image before deformation and the sample morphology image after deformation.

[0018] In one embodiment, the step of determining the DIC test results of the samples to be tested based on the obtained measurement results of the material strain information of each sample to be tested includes:

[0019] For any obtained measurement result of the material strain information of the sample to be tested, image coincidence processing is performed based on the pre-deformation sample topography corresponding to the measurement result of the material strain information of the sample to be tested and the post-deformation sample topography corresponding to the measurement result of the material strain information of the sample to be tested in the previous time sequence of the target time sequence, to obtain the positional relationship between the speckle and the sample to be tested in the target time sequence and the previous time sequence, wherein the target time sequence is the time sequence of obtaining the measurement result of the material strain information of the sample to be tested;

[0020] Accumulating the measurement result of the material strain information of the sample to be tested with the measurement result of the material strain information of the sample to be tested obtained in the previous time sequence based on the positional relationship to obtain a candidate measurement result of the sample to be tested in the current time sequence, and updating the measurement result of the material strain information of the sample to be tested based on the candidate measurement result;

[0021] After sequentially traversing the measurement results of the material strain information of each sample to be tested, the measurement results of the material strain information of the sample to be tested that have been updated multiple times are used as the DIC test results of the sample to be tested.

[0022] In one embodiment, before the step of removing the speckles on the target sample to be tested, the step further includes: placing the target sample to be tested on a preset positioning fixture, and taking a positioning picture of the target sample to be tested, wherein the positioning picture includes the target sample to be tested and the positioning fixture;

[0023] The step of determining the DIC test results of the samples to be tested based on the obtained measurement results of the material strain information of each sample to be tested includes:

[0024] For any obtained measurement result of the material strain information of the sample to be tested, position correlation is performed between the positioning picture corresponding to the measurement result of the material strain information of the sample to be tested and the positioning picture corresponding to the measurement result of the material strain information of the sample to be tested in the previous time sequence of the target time sequence, to obtain the positional relationship between the speckle and the sample to be tested in the target time sequence and the previous time sequence, wherein the target time sequence is the time sequence in which the measurement result of the material strain information of the sample to be tested is obtained;

[0025] Accumulating the measurement result of the material strain information of the sample to be tested with the measurement result of the material strain information of the sample to be tested obtained in the previous time sequence based on the positional relationship to obtain a candidate measurement result of the sample to be tested in the current time sequence, and updating the measurement result of the material strain information of the sample to be tested based on the candidate measurement result;

[0026] After sequentially traversing the measurement results of the material strain information of each sample to be tested, the measurement results of the material strain information of the sample to be tested that have been updated multiple times are used as the DIC test results of the sample to be tested.

[0027] In one embodiment, the speckle pattern on the target sample to be tested includes multiple sets of speckles with different particle sizes, and each set of speckles is sequentially prepared on the sample surface of the target sample based on particle sizes from small to large.

[0028] The step of in-situ loading the target sample to be tested for digital image correlation (DIC) measurement includes:

[0029] Taking pictures of the sample morphology before deformation at different scales for the target sample to be tested, wherein the scale of the pictures corresponds to the particle size of the speckle;

[0030] Applying stress to the target sample to be tested based on a preset in-situ loading task;

[0031] After the target sample to be tested reaches the deformation amount specified by the in-situ loading task, taking deformed sample morphology images of the target sample to be tested at different scales;

[0032] Digital image correlation (DIC) measurement is performed based on the sample topography before deformation and the sample topography after deformation at any scale to obtain measurement results of the strain information of the sample material to be measured at multiple scales.

[0033] In one embodiment, the step of preparing speckles on the sample surface to obtain a target sample to be tested includes:

[0034] Spraying a preset speckle suspension or depositing atomized speckle particles on the surface of the sample to obtain a candidate sample to be tested, wherein the material of the speckle particles on the candidate sample to be tested is an inert material;

[0035] The candidate sample to be tested is heated to obtain a target sample to be tested.

[0036] In one embodiment, the step of removing speckles on the target sample includes:

[0037] The speckles on the target sample to be tested are removed by a preset cleaning agent, ultrasonic treatment, or compressed air to obtain a sample to be tested after the speckles have been removed.

[0038] In addition, to achieve the above-mentioned purpose, the present application also proposes a testing device for collaborative collection of material deformation, the testing device for collaborative collection of material deformation comprising:

[0039] EBSD calibration module, used to perform electron backscatter diffraction EBSD calibration on the sample surface to obtain the measurement results of the internal grain orientation information of the sample to be tested;

[0040] A speckle preparation module is used to prepare speckles on the sample surface to obtain a target sample to be tested;

[0041] A DIC measurement module is used to load the target sample in situ to perform digital image correlation (DIC) measurement to obtain a measurement result of the material strain information of the sample;

[0042] a speckle removal module, configured to remove speckles on the target sample to be tested, and return to the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the target sample to be tested based on the sample to be tested after speckle removal, until the in-situ loading of the target sample to be tested reaches a preset loading target;

[0043] The result calculation module is used to determine the EBSD test results of the samples to be tested based on the measurement results of the internal grain orientation information of each sample to be tested, and to determine the DIC test results of the samples to be tested based on the measurement results of the material strain information of each sample to be tested.

[0044] In addition, to achieve the above-mentioned purpose, the present application also proposes an electronic device, which includes: a memory, a processor, and a computer program stored on the memory and runnable on the processor, wherein the computer program is configured to implement the steps of the test method for collaborative collection of material deformation as described above.

[0045] In addition, to achieve the above-mentioned purpose, the present application also proposes a storage medium, which is a computer-readable storage medium. A computer program is stored on the storage medium. When the computer program is executed by the processor, the steps of the test method for collaborative collection of material deformation as described above are implemented.

[0046] One or more technical solutions proposed in this application have at least the following technical effects:

[0047] The present application first performs electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested to obtain the measurement result of the grain orientation information inside the sample to be tested, so as to perform EBSD calibration before performing DIC measurement, without considering the influence of speckle during DIC measurement on the EBSD calibration quality; then, speckle is prepared on the sample surface to obtain a target sample to be tested, and the target sample to be tested is in-situ loaded to perform digital image correlation (DIC) measurement to obtain the measurement result of the material strain information of the sample to be tested, thereby significantly reducing the electron beam-based correlation limitation on the preparation of speckle during the DIC measurement process; then, the speckle on the target sample to be tested is cleared, and based on the sample to be tested after the speckle is cleared, the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested is performed again until the in-situ loading of the target sample to be tested reaches a preset loading target, thereby eliminating the interference of speckle on the EBSD calibration, ensuring the accuracy and reliability of the EBSD calibration, and enabling EBSD calibration and DIC to be performed alternately multiple times on the same sample. Determination is performed to achieve continuous tracking and measurement of the grain orientation and strain information of the material at different deformation stages; finally, the EBSD test results of the sample to be tested are determined based on the measurement results of the internal grain orientation information of each sample to be tested, and the DIC test results of the sample to be tested are determined based on the measurement results of the material strain information of each sample to be tested. Through the integration and analysis of multiple measurement data, the microstructural changes and strain distribution of the material at different loading stages can be more comprehensively and accurately reflected.

[0048] In summary, this application first performs EBSD calibration on the sample to be tested. After calibration, DIC speckle patterns are prefabricated for in-situ loading, and DIC strain measurement is performed simultaneously. The prefabricated speckle patterns are then completely cleaned to restore the fresh surface, and EBSD calibration after deformation is performed. This cycle is repeated until all tests are completed. Because the speckle is completely removed after the DIC test, it has no impact on subsequent EBSD calibration. There is no need to consider the impact of DIC on the quality of EBSD calibration, so speckle materials of various particle sizes can be selected. This breaks through the limitations of the electron beam on speckle particle size or the size of the DIC observation area in EBSD calibration, thereby improving the test efficiency of collaborative acquisition of material deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0050] Figure 1 A flow chart of Example 1 of the test method for collaborative collection of material deformation provided in this application;

[0051] Figure 2 A schematic diagram of a simplified flow chart of a testing method for collaborative collection of material deformation provided in Example 1 of the present application;

[0052] Figure 3 Schematic diagram of a strain accumulation scenario of the testing method for collaborative collection of material deformation provided in Example 1 of the present application;

[0053] Figure 4 A schematic diagram of sample state changes in the material deformation collaborative collection test method provided in Example 1 of the present application;

[0054] Figure 5 A flow chart of Example 2 of the test method for collaborative collection of material deformation provided in this application;

[0055] Figure 6 A schematic diagram of speckle particle size for the testing method for collaborative acquisition of material deformation provided in Example 2 of the present application;

[0056] Figure 7 A schematic diagram of a simplified flow chart of a testing method for collaborative collection of material deformation provided in Example 2 of the present application;

[0057] Figure 8 This is a schematic diagram of the module structure of the testing device for collaborative collection of material deformation in an embodiment of the present application;

[0058] Figure 9 This is a schematic diagram of the device structure of the hardware operating environment involved in the test method for collaborative collection of material deformation in the embodiment of the present application. DETAILED DESCRIPTION

[0059] It should be understood that the specific embodiments described herein are merely for explaining the technical solutions of the present application and are not intended to limit the present application. In order to better understand the technical solutions of the present application, the following detailed description will be given in conjunction with the accompanying drawings and specific implementation methods.

[0060] The main solution of the embodiment of the present application is: performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested to obtain measurement results of grain orientation information inside the sample to be tested; preparing speckle on the sample surface to obtain a target sample to be tested; performing in-situ loading on the target sample to be tested to perform digital image correlation (DIC) measurement to obtain measurement results of material strain information of the sample to be tested; removing the speckle on the target sample to be tested, and returning to the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested based on the sample to be tested after the speckle is removed, until the in-situ loading of the target sample to be tested reaches a preset loading target; determining the EBSD test results of the sample to be tested based on the obtained measurement results of the grain orientation information inside each sample to be tested, and determining the DIC test results of the sample to be tested based on the obtained measurement results of the material strain information of each sample to be tested.

[0061] Since the current strict limitation of a single DIC observation is to within 10 × 10 μm, observing a larger area requires capturing each sub-area in blocks and then stitching them together, resulting in a massive workload. Simultaneously, with technological advancements, EBSD calibration technology has also significantly improved, with calibration rates reaching 1000 points per second and a single calibration range of 1000 × 2000 μm. Therefore, when performing simultaneous DIC and EBSD observations, the observation range of EBSD is much greater than that of DIC due to the necessity of using prefabricated speckle patterns that do not interfere with the electron beam. This limits both the size range of the speckle pattern and the single-shot observation range of DIC.

[0062] This application provides a solution that first performs EBSD calibration on the sample to be tested. After calibration, DIC speckle patterns are prefabricated for in-situ loading and simultaneous DIC strain measurement. The prefabricated speckle patterns are then completely cleaned to restore the fresh surface, and EBSD calibration after deformation is performed. This cycle is repeated until all tests are completed. Because the speckle is completely removed after the DIC test, it has no impact on subsequent EBSD calibration. There is no need to consider the impact of DIC on the quality of EBSD calibration, allowing the use of speckle materials of various particle sizes. This overcomes the limitations of the electron beam on speckle particle size or the size of the DIC observation area in EBSD calibration, thereby improving the testing efficiency of collaborative acquisition of material deformation.

[0063] It should be noted that the execution subject of this embodiment can be a computing service device with data processing, network communication, and program execution functions, such as a tablet computer, personal computer, mobile phone, etc., or an electronic device capable of performing the above functions. The following uses electronic devices as an example to illustrate this embodiment and the following embodiments.

[0064] Based on this, the embodiment of the present application provides a testing method for collaborative collection of material deformation, referring to Figure 1 , Figure 1 This is a flow chart of the first embodiment of the testing method for collaborative collection of material deformation in this application.

[0065] In this embodiment, the material deformation collaborative collection testing method includes steps S10 to S50:

[0066] Step S10, performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested to obtain the measurement result of the grain orientation information inside the sample to be tested;

[0067] It should be noted that the measurement results of the grain orientation information inside the sample to be tested refer to the detailed data on the crystallographic orientation of each grain inside the sample to be tested obtained through EBSD calibration, including parameters such as the azimuth and inclination of the grains, which can reflect the microstructure and crystallographic characteristics of the material, and can be used to analyze the texture, grain boundary characteristics, etc. of the material, providing basic information for studying the mechanical properties and deformation behavior of the material.

[0068] It is understandable that, in the existing material deformation collaborative collection test process, EBSD calibration requires that the sample surface be fresh and uncontaminated. Therefore, the electron beam in the EBSD calibration will impose corresponding restrictions on the speckle particle size or the DIC observation area size during the DIC measurement process. Otherwise, the pre-prepared speckle will affect the EBSD calibration quality. Therefore, step S10 is performed. By performing EBSD calibration before the DIC measurement, the problem of EBSD calibration having to deal with the presence of speckle in the sample to be measured can be avoided. That is, the influence of speckle during DIC measurement on the EBSD calibration quality can be avoided, and the accuracy and reliability of the initial EBSD calibration can be ensured, thereby preferentially obtaining the initial orientation information of the grains inside the sample to be measured, providing basic data for subsequent research on the changes in grain orientation during material micro-deformation and its relationship with strain.

[0069] For example, the metal material sample to be tested is first prepared to a size and shape suitable for EBSD testing. This typically requires mechanical polishing, electrolytic polishing, vibration polishing, or argon ion polishing to obtain a fresh, residual stress-free surface. This ensures that the electron beam can clearly interact with the atomic planes within the crystal and produce a high-quality diffraction pattern. The sample is then mounted on the stage of a scanning electron microscope (SEM), and an EBSD detector is aligned with the sample surface. In the SEM, a scanning electron beam illuminates the sample surface, stimulating electron backscattered diffraction signals. These signals are received by the EBSD detector and converted into diffraction pattern images. The collected diffraction pattern images are analyzed using specialized EBSD analysis software to identify the grain orientation information corresponding to each diffraction pattern. Ultimately, an orientation distribution map of the grains within the sample to be tested is obtained, completing the EBSD calibration process and obtaining the measurement results of the grain orientation information within the sample to be tested.

[0070] Step S20, preparing speckles on the sample surface to obtain a target sample to be tested;

[0071] It should be noted that the target sample to be tested refers to the sample after speckle pattern is prepared on the surface of the original sample to be tested. Before speckle pattern preparation, the sample meets the requirements of fresh and uncontaminated sample surface for EBSD calibration, and after speckle pattern preparation, it also has the speckle pattern required for DIC measurement.

[0072] It is understandable that because DIC technology requires a high-contrast speckle pattern on the sample surface to identify sub-regions before and after deformation and accurately calculate local strain, performing step S20 can overcome the limitations of traditional methods in finding markers that both meet the DIC speckle requirements and do not significantly interfere with EBSD calibration. This reduces the stringent requirements for speckle material and size. For example, there is no need to strictly limit the speckle particles to a size of less than tens of nanometers. By preparing suitable speckles, the DIC technology can be successfully applied to measure strain information of the sample material under test, providing data support for further analysis of the material's deformation behavior.

[0073] For example, using spray-coated speckle patterns as an example, a suitable inert material, such as aluminum oxide, is first selected as speckle particles and prepared into a particle suspension within a certain size range, for example, between 1 and 10 microns. This speckle suspension is then evenly sprayed onto the surface of an EBSD-calibrated sample using a spray gun. During spraying, parameters such as spray gun pressure, distance, and spraying time are controlled to ensure that the speckle particles form a randomly distributed, high-contrast speckle pattern on the sample surface. After spraying, the sample is dried in a drying oven to firmly adhere the speckle particles to the sample surface, thereby obtaining the target sample to be measured. It is important to ensure that the distribution of the speckle particles is sufficiently random and the density is moderate during the spraying process, so that changes in the speckle pattern can be accurately identified and tracked in subsequent DIC measurements.

[0074] In a feasible implementation, step S20 may include steps S21 and S22:

[0075] Step S21, spraying a preset speckle suspension or depositing atomized speckle particles on the surface of the sample to obtain a candidate sample to be tested, wherein the material of the speckle particles on the candidate sample to be tested is an inert material;

[0076] It should be noted that the preset speckle suspension can be a single-layer graphene sheet suspension or other speckle suspensions such as an aluminum oxide suspension; the candidate test sample refers to the sample that has been sprayed with the preset speckle suspension or deposited with atomized speckle particles on the surface of the original test sample, but has not yet been heated. At this point, the sample surface has a speckle pattern, but because the speckle particles are not yet firmly bonded to the sample surface, it cannot be directly used for in-situ loading and testing. Further heating treatment is required to obtain the target test sample.

[0077] It is understandable that DIC technology requires a high-contrast speckle pattern on the sample surface to identify sub-regions before and after deformation, thereby accurately calculating local strain. Inert materials are selected as speckle particles to prevent chemical reactions between the speckle particles and the sample surface or interference with subsequent EBSD calibration. Therefore, step S21 is performed by spraying a preset speckle suspension made of an inert material or depositing atomized speckle particles on the sample surface. This avoids the problem of speckle particles interacting with the sample surface and affecting the EBSD calibration signal in traditional methods. It also avoids the situation where the speckle pattern falls off or deforms during the loading process due to inappropriate speckle material, which could affect the accuracy of DIC measurements. This allows for the rapid and convenient preparation of speckle patterns that meet the requirements of DIC measurements. Furthermore, the use of inert materials ensures the good stability and reliability of the speckle particles during subsequent loading and testing processes, providing a good foundation for subsequent DIC measurements and EBSD calibration.

[0078] Step S22: heating the candidate sample to be tested to obtain a target sample to be tested.

[0079] It is understandable that the sprayed speckle particles need to be further fixed to the sample surface to ensure that the speckle pattern does not shift or fall off during the subsequent in-situ loading and testing process, thereby ensuring the accuracy of DIC measurement. At the same time, the speckle particles often tend to agglomerate on the sample surface, thereby affecting the quality of the speckle particles. Therefore, step S22 is performed to accelerate the volatilization of the solvent through auxiliary heating. This avoids the problem of speckle particles shifting or falling off due to loose bonding during the loading process, resulting in inaccurate DIC measurement data or the inability to perform effective analysis. It also reduces the agglomeration tendency of the speckle particles, thereby forming a stable and clear speckle pattern, meeting the requirements of DIC measurement, and not affecting the subsequent EBSD calibration. This ensures the smooth progress of the entire testing process and improves the reliability and accuracy of the test results.

[0080] In this embodiment, a preset speckle suspension is sprayed on the sample surface or atomized speckle particles are deposited. Inert materials are selected as speckle particles, and the candidate sample is subsequently heated. This technical approach avoids the problems of traditional methods such as the difficulty in preparing high-quality speckle patterns and the interference of speckle on subsequent EBSD calibration. At the same time, the defects of weak bonding of speckle particles to the sample surface and the tendency of speckle particles to agglomerate are addressed, thereby forming a high-contrast, uniformly distributed, and stable speckle pattern on the sample surface. This ensures that the speckle does not fall off or shift during subsequent testing, providing a reliable basis for DIC measurement, while not affecting the accuracy of EBSD calibration, thereby improving the reliability of test results.

[0081] Step S30, in-situ loading the target sample to be tested to perform digital image correlation (DIC) measurement to obtain a measurement result of the material strain information of the sample to be tested;

[0082] It should be noted that in-situ loading refers to the application of an external load to the sample during the test, causing it to deform, while simultaneously monitoring and collecting sample response information, such as strain and displacement, in real time during the loading process. Under this testing method, real-time changes in the material during the stress process can be observed, which helps to gain a deeper understanding of the material's deformation mechanism and mechanical behavior. The measurement results of the material strain information of the test sample refer to the strain distribution of each point inside the material of the test sample during the loading process obtained by DIC measurement, including parameters such as linear strain and shear strain. It can reflect the degree of deformation and distribution of the material under stress, and can be used to analyze the stress-strain relationship and local deformation behavior of the material.

[0083] It is understandable that in order to study the microscopic deformation coordination behavior of the material during the actual stress process, it is necessary to monitor the strain distribution of the material in real time during the loading process. Therefore, step S30 is performed to achieve real-time and dynamic acquisition of the strain distribution information inside the material during the loading process, which provides a powerful means for studying the microscopic deformation mechanism of the material.

[0084] For example, a target sample to be tested, with pre-prepared speckle patterns, is mounted on an in-situ loading device, such as a specialized in-situ stretching table, to ensure that the sample is stably subjected to external loads during the loading process. Simultaneously, an image acquisition device, such as a high-speed camera or CCD camera, captures the speckle pattern on the sample surface in real time, recording the sample's initial topography before loading. Then, according to a preset loading procedure, a tensile, compressive, or bending load is applied to the sample at a specific strain rate or stress increment, causing the sample to deform. During the loading process, the image acquisition device captures images of the sample's current topography at regular intervals or deformation intervals. These pre- and post-deformation image sequences are input into DIC analysis software. Based on a preset correlation function and search algorithm, the software calculates the displacement and strain distribution of each speckle region on the sample surface during the deformation process. Ultimately, the strain information of the sample material under test at different loading stages is obtained, including strain distribution diagrams, strain-deformation curves, and other data.

[0085] In a feasible embodiment, the step of in-situ loading the target sample to be tested for digital image correlation (DIC) measurement in step S30 may include steps A31 to A34:

[0086] Step A31, photographing the sample morphology before deformation of the target sample to be tested;

[0087] It should be noted that the sample topography before deformation refers to the sample surface image before in-situ loading of the target sample to be tested, which records the initial position and morphology of the speckle pattern and is the reference image for DIC measurement.

[0088] It is understandable that since DIC technology requires comparing images before and after deformation to calculate strain, and the sample topography before deformation is the basic data for subsequent analysis, performing step A31 can avoid the problem of being unable to accurately calculate the strain distribution after deformation due to the lack of initial state images. By recording the initial state of the sample, a benchmark is provided for subsequent strain calculations, ensuring the accuracy of the measurement results.

[0089] Step A32: applying stress to the target sample to be tested based on a preset in-situ loading task;

[0090] It should be noted that in-situ loading tasks refer to plans or procedures for applying specific stresses to samples during the test, including loading methods (such as tension, compression), loading rates, and target deformations, etc., aiming to simulate the actual use conditions of the material.

[0091] It is understandable that since it is necessary to simulate the stress conditions of the material in actual use in order to study its deformation behavior under different stress conditions, step A32 is performed to achieve precise control of the loading of the sample, simulate the actual working conditions, and obtain the deformation response of the material under different stresses.

[0092] Step A33, after the target sample to be tested reaches the deformation amount specified by the in-situ loading task, photographing the sample morphology after deformation of the target sample to be tested;

[0093] It should be noted that the sample morphology image after deformation refers to the sample surface image after the target sample reaches the specified deformation amount of the in-situ loading task. It records the position and morphological changes of the speckle pattern after deformation and is compared with the image before deformation to calculate the strain.

[0094] It can be understood that since it is necessary to obtain the state of the sample under a specific deformation amount for comparison with the initial state to calculate the strain, step A33 is performed to avoid overload causing sample damage or excessive deformation, which affects the validity of the data, thereby accurately capturing the state of the sample after the expected deformation and providing accurate comparison data for strain calculation.

[0095] Step A34: performing digital image correlation (DIC) measurement based on the sample topography image before deformation and the sample topography image after deformation.

[0096] It is understandable that since DIC technology calculates displacement and strain by comparing images before and after deformation, and these two images are the basis of the calculation, performing step A34 can achieve full-field strain measurement, provide detailed strain distribution information, and help understand the deformation mechanism of the sample material.

[0097] For example, the sample topography images before and after deformation are captured and stored at high resolution, ensuring that the image lighting conditions, camera position, and parameters remain consistent in both captures. The captured images are then grayscaled to remove the interference of color information and highlight the grayscale features of the speckle pattern. Next, the region of interest is gridded on the sample topography before deformation, with each grid subregion considered an independent analysis unit. The subregion size is typically between 30×30 and 100×100 pixels, depending on the speckle particle size and the required measurement accuracy. For each subregion, a speckle pattern with high contrast and uniqueness is selected as the template region. In the sample topography after deformation, a search is performed within a certain range, centered on the template region, and a predefined correlation function (such as the normalized cross-correlation function) is used to calculate the similarity between the template region and the subregion within the search region. By using iterative search algorithms (such as multi-resolution search and pyramid search algorithms), the search range is gradually narrowed, improving search efficiency and accuracy. The corresponding subregion with the maximum correlation coefficient with the template region is found, and the position of this subregion after deformation is determined. The displacement vector of each subregion is recorded, that is, the change in position of the subregion center after deformation relative to the subregion center before deformation. Finally, using the displacement-strain relationship formula, the strain components at each location of the sample during deformation are calculated based on the displacement field, including plane strain (ε_x, ε_y) and shear strain (γ_xy). Visualizations such as strain distribution cloud maps and displacement vector maps are generated to intuitively display the sample deformation during loading and provide detailed data for subsequent analysis.

[0098] In this embodiment, by capturing the sample topography before and after deformation and applying stress in combination with a preset in-situ loading task, digital image correlation (DIC) measurement technology is used to avoid the problems of large measurement errors caused by sensor contact, easy interference with the deformation process, and inability to obtain full-field strain information in traditional strain measurement methods. This achieves accurate, full-field, non-contact measurement of the strain distribution of the material during the stress deformation process, thereby dynamically tracking the microscopic deformation behavior of the material.

[0099] Step S40, clearing the speckle on the target sample to be tested, and returning to the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the target sample to be tested based on the sample to be tested after the speckle is cleared, until the target sample to be tested is loaded in situ to a preset loading target;

[0100] It should be noted that a preset loading target refers to a target load level or deformation value set before testing based on the research objectives and material properties. Loading and testing are stopped when this target value is reached. The preset loading target can be a specific stress level, strain level, or deformation, used to control the testing process and obtain information about the material's performance at a specific deformation level.

[0101] It is understandable that after completing a DIC measurement, the speckle on the sample surface will interfere with subsequent EBSD calibration, affecting the accuracy and reliability of the EBSD calibration. In order to continue the EBSD calibration, the speckle needs to be removed to restore the fresh surface of the sample. Therefore, step S40 is performed to eliminate the interference of the speckle on the EBSD calibration, ensuring the quality and accuracy of the EBSD calibration. This allows EBSD calibration and DIC measurement to be performed alternately on the same sample multiple times, achieving continuous tracking and measurement of the grain orientation and strain information of the material at different deformation stages, enabling a more comprehensive understanding of the microstructural evolution and deformation behavior of the material, and providing richer and more accurate information for studying the mechanical properties of the material and optimizing the material preparation process.

[0102] For example, after completing an in-situ loading and DIC measurement, the speckle pattern on the sample surface needs to be removed for subsequent EBSD calibration. For example, the target sample can be immersed in a specific organic solvent, such as acetone or alcohol, which can dissolve the adhesive between the speckle particles and the sample surface or loosen the speckle particles. After soaking for a certain period of time, the sample is cleaned using an ultrasonic cleaning device. The ultrasonic vibration helps to completely remove any remaining speckle particles on the sample surface. After cleaning, the sample surface is rinsed with deionized water and then dried. At this point, the sample surface is restored to a near-initial state. The sample can then be mounted on the SEM stage again and the EBSD calibration process repeated. This allows the grain orientation information within the deformed sample to be re-measured, providing data support for subsequent analysis. Alternatively, the preset loading target can be a specific strain level, such as a tensile strain of 5%, or a specific macroscopic deformation phenomenon, such as significant yielding or necking. During the in-situ loading process, the deformation of the sample is monitored in real time, and the loading operation is stopped immediately when the preset loading target is reached.

[0103] In a feasible implementation manner, the step of removing speckles on the target sample to be tested in step S40 may include step S41:

[0104] Step S41 : cleaning the speckles on the target sample to be tested by using a preset cleaning agent, ultrasonic treatment, or compressed air to obtain a sample to be tested after the speckles have been cleaned.

[0105] It is understandable that after completing the DIC measurement, the speckle pattern on the sample surface will affect the accuracy and reliability of the subsequent EBSD calibration, and therefore must be removed. However, common removal methods may have additional effects on the sample surface. Therefore, performing step S41 can avoid the problem that the sample with speckle may generate additional scattering signals or block the diffraction signal of the crystal under electron beam irradiation, resulting in inaccurate or incomplete diffraction patterns received by the EBSD detector, affecting the measurement accuracy of grain orientation information, and damage to the sample surface caused by inappropriate removal methods. After removing the speckle, the sample surface is restored to a state close to its initial state, ensuring that the sample surface is in a state without speckle interference before each EBSD calibration. This allows EBSD calibration and DIC measurement to be performed alternately multiple times on the same sample, realizing continuous tracking and measurement of the material at different deformation stages, thereby comprehensively understanding the microscopic deformation behavior and structural evolution process of the material.

[0106] Step S50 , determining the EBSD test results of the samples to be tested based on the obtained measurement results of the internal grain orientation information of each sample to be tested, and determining the DIC test results of the samples to be tested based on the obtained measurement results of the material strain information of each sample to be tested.

[0107] It should be noted that the EBSD test results of the sample to be tested refer to the measurement results of the internal grain orientation information of the sample to be tested obtained by integrating multiple EBSD calibrations. After analysis and processing, the final results on the sample's microstructure, texture, grain boundary characteristics, etc. are obtained, which can comprehensively reflect the crystallographic characteristics and microstructural changes of the material at different deformation stages; the DIC test results of the sample to be tested refer to the measurement results of the material strain information of the sample to be tested obtained by integrating multiple DIC measurements. After accumulation, updating and analysis, the final results on the strain distribution and deformation behavior of the sample during loading are obtained. They can be used to evaluate the mechanical properties of the material, analyze local strain concentration phenomena, etc.

[0108] It is understandable that when the in-situ loading reaches the preset loading target, it indicates that the test of the material under the designed deformation degree has been completed. At this time, it is necessary to integrate and analyze the data obtained during the entire test process to obtain the final test results. Therefore, performing step S50 can avoid unnecessary repeated testing and data accumulation, reduce the testing workload and time cost, and improve the testing efficiency. At the same time, through the integration and analysis of multiple measurement data, it can more comprehensively and accurately reflect the microstructural changes and strain distribution of the material at different loading stages, providing a more reliable basis for evaluating the performance and quality of the material and guiding the application and improvement of the material.

[0109] For example, data obtained from multiple previous EBSD calibrations and DIC measurements are collected. To determine the EBSD test results, the measurement results of the grain orientation information obtained at different deformation stages are integrated, and the evolution of the grain orientation during the loading process is analyzed, such as observing the rotation angle of the grains, the orientation aggregation or dispersion, and other phenomena, and drawing the evolution map of the grain orientation distribution, thereby determining the EBSD test results of the sample to be tested. To determine the DIC test results, the strain information measurement results of each loading stage are accumulated and analyzed according to the time sequence or deformation amount, and the strain distribution evolution curve or image sequence is generated. The maximum strain, average strain, and distribution of strain concentration areas of the material in different regions are statistically calculated, and finally the DIC test results of the sample to be tested are obtained, providing a basis for a comprehensive evaluation of the material's microscopic deformation behavior and mechanical properties.

[0110] In a feasible embodiment, the step of determining the DIC test results of the samples to be tested based on the obtained measurement results of the material strain information of each sample to be tested in step S50 may include steps A51 to A53:

[0111] Step A51: For any obtained measurement result of the material strain information of the sample to be tested, image superposition processing is performed based on the pre-deformation sample topography corresponding to the measurement result of the material strain information of the sample to be tested and the post-deformation sample topography corresponding to the measurement result of the material strain information of the sample to be tested in the previous time sequence of the target time sequence, to obtain the positional relationship between the speckle and the sample to be tested in the target time sequence and the previous time sequence, wherein the target time sequence is the time sequence in which the measurement result of the material strain information of the sample to be tested is obtained;

[0112] It should be noted that the positional relationship between the speckle pattern and the sample under test in the target time series and the previous time series refers to the displacement and deformation of the speckle pattern relative to the sample surface during the corresponding loading step and the previous step. This positional relationship reflects the local deformation of the material during loading and is the basic data for calculating strain.

[0113] It is understandable that in order to accurately integrate and compare strain information from different time series, it is necessary to clarify the displacement of the speckle on the sample surface. This requires determining the positional relationship of the speckle in different time series. Therefore, performing step A51 can avoid strain information matching errors caused by changes in the speckle position and prevent deviations in the data accumulation process, thereby achieving precise tracking of the speckle position, ensuring accurate correspondence of strain information, and providing a reliable basis for subsequent strain accumulation and data integration.

[0114] For example, a pre-deformation sample topography image corresponding to the current strain information measurement result of the sample under test is retrieved from a storage device. This image, acquired when no stress is applied, contains the initial position and morphological information of the speckle pattern. Simultaneously, a post-deformation sample topography image corresponding to the strain information measurement result of the sample under test obtained in the previous time sequence (i.e., the previous loading step) is acquired. This image reflects the positional change of the speckle after the sample was loaded in the previous time sequence. The two images are then overlaid using image processing software (such as MATLAB or specialized DIC analysis software). Feature matching algorithms (such as scale-invariant feature transform (SIFT) or oriented FAST and rotated BRIEF (ORB)) are used to identify speckle feature points in the two images and calculate the displacement vector between them. This allows the positional relationship of the speckle relative to the sample under test in the current and previous time sequences to be determined, i.e., the displacement and deformation of the speckle on the sample surface. For example, when analyzing the strain of a metal material during stretching, by comparing the initial morphology image with the image after the previous time series deformation, the displacement of each characteristic point in the speckle pattern after loading is calculated, and the specific position change of the speckle as the sample deforms is clarified, providing an accurate position correspondence for subsequent strain accumulation.

[0115] Step A52: Based on the positional relationship, the measurement result of the material strain information of the sample to be tested is accumulated with the measurement result of the material strain information of the sample to be tested obtained in the previous time sequence to obtain a candidate measurement result of the sample to be tested in the current time sequence, and the measurement result of the material strain information of the sample to be tested is updated based on the candidate measurement result;

[0116] It should be noted that the candidate measurement result refers to the temporary result obtained after accumulating the strain information of the current time series and the previous time series, which is used to update and correct the strain data to ensure its accuracy and continuity.

[0117] It is understandable that since the strain of the material is a gradual accumulation process, the strain information of different time series needs to be accumulated to reflect the overall deformation of the material during the loading process. Therefore, performing step A52 can avoid the one-sided understanding of the overall deformation of the material caused by considering only the strain information of a single time series, and prevent the data from being updated in a timely or inaccurate manner, thereby realizing the dynamic update and accumulation of strain information, and then more realistically reflecting the deformation history of the material during the loading process, thereby improving the accuracy and completeness of the test results.

[0118] For example, after obtaining the positional relationship between the speckle and the sample to be measured in the target time series and the previous time series, the strain information measurement results of the current time series (for example, the strain distribution matrix calculated using DIC technology, containing the strain values ​​of each measurement point) are first read from the database. Then, based on the previously determined positional relationship, these strain values ​​are mapped to the coordinate system of the previous time series. The strain information measurement results of the previous time series are also represented in the same manner. Next, the strain matrix of the current time series and the strain matrix of the previous time series are accumulated through matrix operations (such as simple matrix addition or weighted addition operations, where the weights can be determined based on factors such as loading step size or time interval) to obtain a preliminary accumulated strain matrix, i.e., the candidate measurement result. For example, if the target time series strain matrix is ​​[[ε11, ε12], [ε21, ε22]] and the previous time series strain matrix is ​​[[ε'11, ε'12], [ε'21, ε'22]], then the candidate measurement result matrix might be [[ε11+ε'11,ε12+ε'12], [ε21+ε'21, ε22+ε'22]] (assuming equal weights and direct addition). Finally, this candidate measurement result is compared and analyzed with the original current time series strain information to check whether the accumulated strain value is within a reasonable range (for example, whether it conforms to the material's strain hardening or softening law). The target time series strain information measurement result is then updated with the more accurate and comprehensive accumulated strain data, thus reflecting the strain accumulation effect of the material during the loading process.

[0119] Step A53 , after sequentially traversing the measurement results of the material strain information of each sample to be tested, the measurement results of the material strain information of the sample to be tested that have been updated multiple times are used as the DIC test results of the sample to be tested.

[0120] It is understandable that since it is necessary to integrate all strain information of different time series to form a complete description of the strain distribution and deformation process in order to comprehensively analyze the mechanical behavior of the material, step A53 can be performed to avoid the problem of scattered and unintegrated data, and prevent inaccurate judgment of the material deformation mechanism due to lack of overall analysis, thereby realizing a comprehensive strain analysis of the material during the loading process, providing a detailed strain distribution and development history, and providing a strong basis for studying the mechanical properties of the material and optimizing the design.

[0121] For example, after completing a full loading cycle (comprising multiple time-series loading steps), the strain information from all time-series is aggregated. Starting with the first time-series, the updated strain information for each time-series is retrieved sequentially. These results, after being accumulated and updated with the strain information from the previous time-series, are stored in a data structure (such as a list or array). For example, for a metal sample that undergoes 10 time-series loading, the updated strain data for time-series 1 through 10 are obtained. This data is then integrated, either by sequentially arranging the strain values ​​for each measurement point across all time-series to form a complete strain-time-series dataset, or by calculating statistical features such as the mean, maximum, and minimum strain values ​​for each measurement point to reflect the overall strain behavior of the material during loading. During the integration process, visualization tools (such as Origin or ParaView) can be used to plot these data into a strain cloud sequence or a strain-time-series curve to intuitively display the strain changes at different locations and times. Ultimately, this integrated data set and corresponding visualization results are determined as the DIC test results of the sample to be tested, which is used to comprehensively analyze the deformation mechanism and performance of the material during the loading process.

[0122] In this embodiment, by adopting the technical means of image coincidence processing and data accumulation and updating, the measurement errors and data one-sidedness caused by the change of speckle position and single time-series strain information are avoided, and the accurate accumulation and integration of strain information is achieved, which fully reflects the deformation of the material during the loading process.

[0123] In another feasible implementation, step S40 may further include step S401 before step S40:

[0124] Step S401: placing the target sample to be tested on a preset positioning fixture, and taking a positioning picture of the target sample to be tested, wherein the positioning picture includes the target sample to be tested and the positioning fixture;

[0125] It should be noted that the positioning image refers to an image containing the target sample to be tested and the positioning tooling, which is used to determine the position and orientation of the sample at different shooting time points, provide a stable reference frame, and ensure the comparability of the images.

[0126] It is understandable that since the sample to be tested needs to be removed from the tensile testing machine during the speckle removal process and subsequently needs to be loaded back into the tensile testing machine for DIC measurement, it is necessary to ensure that the target sample to be tested is accurately positioned during multiple shots and different loading stages in order to accurately correlate the material strain information at different time points. The positioning fixture can provide a stable reference frame, so performing step S401 can avoid image matching and strain calculation errors caused by position changes of the sample at different shooting time points, thereby achieving accurate positioning of the target sample to be tested, ensuring that the images before and after deformation can be compared and analyzed in the same coordinate system, and improving the accuracy of strain measurement.

[0127] For example, a high-precision positioning fixture is prepared, such as a fixture with a V-groove, and the target sample to be tested (assuming it is a small metal sample) is placed in the V-groove to ensure that the sample is stable and fixed in position in the fixture. A high-speed camera is then used to photograph the sample and the positioning fixture from directly above to obtain a clear positioning picture. This picture not only contains the initial position information of the speckle on the surface of the sample, but also contains the relative position relationship between the sample and the positioning fixture, such as the specific placement angle and position of the sample in the V-groove. The features of the positioning fixture (such as the edge of the V-groove) are clearly visible in the picture, providing a stable reference mark for subsequent image processing. The positioning picture obtained in this way can ensure that the position change of the sample can be accurately tracked during the subsequent loading process.

[0128] The step of determining the DIC test results of the samples to be tested based on the obtained measurement results of the material strain information of each sample to be tested in step S50 may include steps B51 to B53:

[0129] Step B51: For any obtained measurement result of the material strain information of the sample to be tested, position correlation is performed based on the positioning image corresponding to the measurement result of the material strain information of the sample to be tested and the positioning image corresponding to the measurement result of the material strain information of the sample to be tested in the previous time sequence of the target time sequence, to obtain the positional relationship between the speckle and the sample to be tested in the target time sequence and the previous time sequence, wherein the target time sequence is the time sequence in which the measurement result of the material strain information of the sample to be tested is obtained;

[0130] It can be understood that since it is necessary to determine the position change of the speckle relative to the sample at different loading stages in order to accurately calculate the strain information, performing step B51 can avoid strain calculation errors caused by unclear speckle position changes, thereby achieving precise tracking of speckle position changes and ensuring the accuracy of strain information.

[0131] For example, assume that for the strain information measurement results of the material of the sample to be tested in the current time series, we have the corresponding positioning image (an image of the sample and the positioning fixture taken after a certain stress is applied). At the same time, we also have the positioning image of the previous time series (i.e., the previous stretching stage). First, use image processing software (such as MATLAB) to read the two positioning images and extract the feature points therein, such as the corner points of the positioning fixture and the marking points on the edge of the sample. Then, by calculating the position change of these feature points in the two images, using geometric transformation methods such as affine transformation or perspective transformation, the positional relationship between the speckle and the sample to be tested in the current time series and the previous time series is determined. Specifically, the displacement vectors of the speckle pattern on the sample surface are calculated. These vectors reflect the local deformation of each part of the sample during the stretching process and provide accurate position correspondence for subsequent strain accumulation.

[0132] Step B52: Based on the positional relationship, the measurement result of the material strain information of the sample to be tested is accumulated with the measurement result of the material strain information of the sample to be tested obtained in the previous time sequence to obtain a candidate measurement result of the sample to be tested in the current time sequence, and the measurement result of the material strain information of the sample to be tested is updated based on the candidate measurement result;

[0133] It is understandable that since the strain of the material is gradually accumulated, the strain information at different time points needs to be accumulated to reflect the actual deformation of the material. Therefore, performing step B52 can avoid the one-sided understanding of the overall deformation of the material caused by considering only the strain information of a single time series, thereby realizing the dynamic update and accumulation of strain information to more realistically reflect the deformation history of the material during the loading process.

[0134] For example, the strain information measurement results of the current time series (e.g., strain field data calculated using DIC technology, including strain values ​​at each measurement point) are accumulated with the strain information measurement results of the previous time series. Specifically, the strain matrix of the previous time series (a two-dimensional array containing strain values ​​for each region of the specimen) is aligned with the strain matrix of the current time series based on the positional relationship of the speckle pattern, and then element-by-element addition is performed. For example, if the strain at a point in the previous time series is ε1 and the strain at that point in the current time series is ε2, the accumulated strain is ε1 + ε22. This results in a candidate measurement result matrix. Next, this candidate measurement result is compared with the strain result of the current time series measured directly using DIC to check whether the accumulated strain value is within a reasonable range (e.g., whether it conforms to the nonlinear deformation characteristics of the material). If so, the accumulated candidate measurement result is used to update the strain information measurement results of the current time series to ensure that it reflects the actual strain accumulation of the material during loading.

[0135] Step S53 , after sequentially traversing the measurement results of the material strain information of each sample to be tested, the measurement results of the material strain information of the sample to be tested that have been updated multiple times are used as the DIC test results of the sample to be tested.

[0136] It is understandable that since it is necessary to integrate all strain information of different time series to form a complete description of the strain distribution and deformation process, performing step B53 can avoid the problem of data dispersion and inconsistency, and at the same time prevent inaccurate judgment of the material deformation mechanism due to lack of overall analysis, thereby realizing a comprehensive strain analysis of the material during the loading process, and thus providing a detailed strain distribution and development history.

[0137] For example, after completing a multi-stage loading experiment on a metal specimen, the accumulated and updated strain information for each time series is collected. Starting with the first time series in the initial test phase, the updated strain data for each time series is retrieved sequentially. This data takes into account the cumulative strain effect of the previous time series and is linked to a positioning image to ensure positional accuracy. This data is then integrated into a three-dimensional array, with two dimensions representing the specimen surface location and the third dimension representing the strain variation over the loading time series. Furthermore, professional visualization software (such as Tecplot or ParaView) is used to plot this data as a series of strain contours and strain-time curves. For example, a series of color contours are generated showing the strain variation at different locations of the specimen with increasing loading times, as well as a line graph showing the strain variation over time at key measurement points. These integrated data and visualizations ultimately constitute the DIC test results for the metal specimen, comprehensively demonstrating the strain distribution and development process during the loading process, providing a detailed basis for subsequent material property analysis.

[0138] In this embodiment, by using positioning tooling to assist in taking positioning pictures and combining position association with data accumulation and update, the strain information matching error and data incoherence caused by sample position offset and speckle position change are avoided, and the accurate accumulation and integration of material strain information is achieved, thereby accurately reflecting the overall deformation behavior of the material during the loading process.

[0139] This embodiment provides a testing method for collaborative acquisition of material deformation. The method first performs EBSD calibration on the sample to be tested. After calibration, DIC speckle patterns are prefabricated for in-situ loading and simultaneous DIC strain measurement. The prefabricated speckle patterns are then completely cleaned to restore the surface to a fresh state, and EBSD calibration is performed after deformation. This process is repeated until all tests are complete. Because the speckle is completely removed after DIC testing, it has no impact on subsequent EBSD calibration. Furthermore, there is no need to consider the impact of DIC on EBSD calibration quality. Therefore, speckle materials of various particle sizes can be used. This overcomes the limitations of the electron beam in EBSD calibration on speckle particle size or DIC observation area size, thereby improving the testing efficiency of collaborative acquisition of material deformation.

[0140] For example, to help understand the implementation process of the test method for collaborative collection of material deformation in this embodiment, please refer to Figure 2 , Figure 2 A brief flow chart of a test method for collaborative collection of material deformation is provided. Specifically:

[0141] First, the sample surface must be mechanically polished, electrolytically polished, vibratory polished, or argon ion polished to obtain a fresh, residual stress-free surface. EBSD calibration or SEM topography imaging is then performed within the electron microscope chamber. After EBSD calibration, the sample is removed from the microscope chamber and sprayed with a single-layer graphene flake suspension (or other speckle suspensions such as alumina suspensions, or atomized speckle particles can be directly deposited on the sample surface). Heating can be used, if necessary, to accelerate solvent evaporation and reduce the tendency of speckle particles to agglomerate. (Quasi-) in-situ loading is then performed, accompanied by DIC measurement. After a single loading cycle, the sample can be placed on a positioning fixture to capture a speckle topography image (i.e., a positioning image or a direct image of the entire sample topography) to accurately identify the location of speckle sub-regions on the sample surface. The speckle particles are then removed using alcohol, acetone, or other surface-friendly cleaning agents. Ultrasonication or compressed air can be used as auxiliary cleaning agents if necessary. The cleaned sample is then subjected to a new round of EBSD calibration or SEM imaging. Finally, using the positioning image, according to the principle that the strain calculated by different speckles at the same position can be accumulated, refer to Figure 3 The DIC strain calculation results at different stages are accumulated (i.e., εtotal = ε1 + ε2). This directly associates DIC calculation results or sub-region numbers at the same location based on positional coordinates, thereby reconstructing the local strain evolution process of the sample throughout the entire deformation stage. Alternatively, the positional relationship between the sample parts in the speckle images of the previous and next stages can be directly calculated to establish an indirect positional relationship between the previous and next speckle patterns, thus achieving strain accumulation. Figure 3 Where x and y represent a coordinate point on the surface of the sample to be tested at different time stages, and ε0 indicates that no strain is generated.

[0142] Furthermore, the state change of the sample to be tested can be referred to Figure 4 .

[0143] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar contents as those in the above embodiment 1 can be referred to the above introduction and will not be described in detail later. Figure 5 The speckles on the target sample to be tested include multiple sets of speckles with different particle sizes, and each set of speckles is prepared sequentially on the surface of the sample to be tested based on particle sizes from small to large;

[0144] The step of in-situ loading the target sample to be tested for digital image correlation (DIC) measurement in step S30 may further include steps B31 to B34:

[0145] Step B31, photographing the sample morphology before deformation at different scales of the target sample to be tested, wherein the photographed scale corresponds to the particle size of the speckle;

[0146] It can be understood that in order to obtain initial state information at different scales to correspond to subsequent strain analysis at different scales, step B31 is performed to avoid the problem of initial information mismatch caused by scale differences, thereby providing accurate basic data for multi-scale strain analysis and supporting subsequent multi-scale DIC measurement.

[0147] For example, the speckle production process of a single set of speckle experiment process is changed to first spraying (or pre-fabricating) speckles with finer particle size (such as 50nm silica particles), and then spraying sparser speckles with coarser particle size (such as 10μm graphene sheets). During the DIC imaging process, the coarse speckles (50 times) and the local fine speckles (5000 times) in the gaps between the coarse speckles are photographed. The sample morphology before deformation can be referred to. Figure 6 Among them, it should be noted that when shooting, it is necessary to ensure that the shooting light path is on the same optical axis.

[0148] Step B32, applying stress to the target sample to be tested based on a preset in-situ loading task;

[0149] Step B33, after the target sample to be tested reaches the deformation amount specified by the in-situ loading task, photographing the deformed sample morphology images of the target sample to be tested at different scales;

[0150] It is understandable that in order to record the deformed state at different scales for comparison with the initial state and to perform strain analysis, step B33 is performed. This can avoid the problem of mismatched information after deformation due to inconsistent scales, thereby providing detailed data after deformation for multi-scale strain analysis and ensuring the comprehensiveness and accuracy of subsequent strain calculations.

[0151] For example, use the same high-resolution microscope camera system as before deformation to capture topographic images of the deformed sample at the same magnification (e.g., 50x and 5000x). Ensure that imaging conditions (such as lighting, camera position, and focal length) are consistent with those used before deformation to accurately record the deformation of the speckle pattern at different scales. These deformed topographic images will correspond exactly to the pre-deformation images, providing the necessary data for subsequent multi-scale DIC measurements.

[0152] Step B34: performing digital image correlation (DIC) measurement based on the sample topography image before deformation and the sample topography image after deformation at any scale to obtain measurement results of the strain information of the sample material to be measured at multiple scales.

[0153] It is understandable that since it is necessary to integrate information at different scales to fully understand the deformation mechanism of the material, B34 can avoid the one-sided understanding of the material deformation behavior caused by considering only a single scale, prevent incomplete data, and thus achieve a comprehensive analysis of the strain distribution of the material at different scales, providing more complete and detailed deformation information.

[0154] For example, after taking images of the sample's topography before and after deformation, these images are imported into professional DIC analysis software (such as VIC-3D or Ncorr). For each scale (e.g., 50x and 5000x magnification), the corresponding pre- and post-deformation images are selected for analysis. Appropriate parameters are set in the software, such as the sub-area size (adjusted according to the speckle particle size, for example, 1-micron speckles correspond to smaller sub-area sizes, and 10-micron speckles correspond to larger sub-area sizes), step size, and correlation function type. Through software calculations, the strain distribution diagram of the sample at each scale is obtained, including information such as plane strain and shear strain. Finally, the strain results at different scales are integrated and compared to analyze the deformation behavior and strain distribution characteristics of the material at different scales, providing detailed data support for the study of the material's microscopic deformation mechanism.

[0155] In this embodiment, by combining multi-scale photography with DIC measurement, the inability to fully capture the strain information of different microstructural levels of the material at a single scale and the limitations of traditional strain measurement methods are avoided. Accurate measurement and analysis of the strain distribution of the material at different scales is achieved, providing detailed data for studying the multi-scale microscopic deformation behavior of the material.

[0156] For example, in order to help understand the implementation process of the test method for collaborative collection of material deformation obtained by combining this embodiment with the above embodiment 1, please refer to Figure 7 , Figure 7A brief flow chart of a test method for collaborative collection of material deformation is provided. Specifically, the test method for collaborative collection of material deformation of the AZ91 magnesium alloy sample to be tested is as follows:

[0157] (1) The AZ91 as-cast sample was cut into double-gauge tensile specimens with a thickness of 0.5 mm. The sample surface was polished with sandpaper ranging from 150# to 7000#. Then, the sample was electrolytically polished at low temperature using electrolytic polishing liquid to eliminate the residual stress on the sample surface.

[0158] (2) Using the EBSD probe in the field emission electron microscope, a large-scale low-magnification (50x) EBSD calibration is performed on the surface of the undeformed sample to obtain the grain orientation information inside the sample, that is, the measurement result of the grain orientation information inside the sample to be tested.

[0159] (3) After the sample is taken out, a 50-fold diluted and fully dispersed silica suspension with a particle size of 50 nm is first used to treat the sample surface. Specifically, a drop of the suspension is dropped on the sample surface, and after it stays for 2 seconds, it is quickly rinsed with slow running water for 1 minute, and then quickly blown dry with a cold air gun to obtain a prefabricated speckle pattern for high-resolution DIC, which is the candidate sample to be tested.

[0160] (4) Take 0.1g of graphene flakes with a diameter of about 10μm and add them to 50ml of alcohol. Disperse them thoroughly by ultrasonication and then add them to the spray gun reservoir. Place the sample on an 80℃ heating table and spray the graphene suspension onto the sample surface with a spray gun. A single spray only takes 1 second. After the heat from the heating table quickly evaporates the alcohol solvent, repeat the spraying of the graphene suspension until the desired speckle density is achieved, thus obtaining the target sample to be tested.

[0161] (4) The sample is placed in a field emission scanning electron microscope chamber, and a high-resolution (5000x) morphology image of the designated area 1 covered with silica particles is captured, i.e., the morphology image of the sample before deformation.

[0162] (5) After completing the high-resolution imaging, the sample is removed and placed back into the tensile testing machine. A high-magnification industrial CCD camera is used to capture the changes in the surface speckle displacement of the sample during the tensile process. After reaching the specified deformation, the loading is stopped, the sample is removed, and then placed back into the field emission electron microscope to capture the morphological changes in the specified area 1 after deformation, which is the sample morphology after deformation.

[0163] (6) Place the photographed sample into a plastic test tube filled with alcohol and use an ultrasonic cleaner to clean the sample for a certain period of time.

[0164] (7) Place the cleaned sample back into the field emission electron microscope chamber and continue with the EBSD calibration after deformation.

[0165] (8) Summarize the data, cross-compare the changes in grain orientation and the differences in strain distribution at different scales before and after deformation, and obtain the EBSD test results and DIC test results of the sample to be tested.

[0166] This application also provides a testing device for collaborative collection of material deformation, please refer to Figure 8 , the testing device for collaborative collection of material deformation includes:

[0167] The EBSD calibration module 10 is used to perform electron backscatter diffraction (EBSD) calibration on the sample surface to be tested, and obtain the measurement result of the internal grain orientation information of the sample to be tested;

[0168] The speckle preparation module 20 is used to prepare speckles on the sample surface to obtain a target sample to be tested;

[0169] A DIC measurement module 30 is used to load the target sample in situ to perform digital image correlation (DIC) measurement to obtain a measurement result of the material strain information of the sample;

[0170] a speckle removal module 40 for removing speckles from the target sample to be tested, and returning to the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the target sample to be tested based on the sample to be tested after speckle removal, until the in-situ loading of the target sample to be tested reaches a preset loading target;

[0171] The result calculation module 50 is used to determine the EBSD test results of the samples to be tested based on the obtained measurement results of the internal grain orientation information of each sample to be tested, and to determine the DIC test results of the samples to be tested based on the obtained measurement results of the material strain information of each sample to be tested.

[0172] Optionally, the DIC measurement module 30 is further configured to:

[0173] Taking a sample morphology image of the target sample before deformation;

[0174] Applying stress to the target sample to be tested based on a preset in-situ loading task;

[0175] After the target sample to be tested reaches the deformation amount specified by the in-situ loading task, photographing the sample morphology after deformation of the target sample to be tested;

[0176] Digital image correlation (DIC) measurement is performed based on the sample morphology image before deformation and the sample morphology image after deformation.

[0177] Optionally, the result calculation module 50 is further configured to:

[0178] For any obtained measurement result of the material strain information of the sample to be tested, image coincidence processing is performed based on the pre-deformation sample topography corresponding to the measurement result of the material strain information of the sample to be tested and the post-deformation sample topography corresponding to the measurement result of the material strain information of the sample to be tested in the previous time sequence of the target time sequence, to obtain the positional relationship between the speckle and the sample to be tested in the target time sequence and the previous time sequence, wherein the target time sequence is the time sequence of obtaining the measurement result of the material strain information of the sample to be tested;

[0179] Accumulating the measurement result of the material strain information of the sample to be tested with the measurement result of the material strain information of the sample to be tested obtained in the previous time sequence based on the positional relationship to obtain a candidate measurement result of the sample to be tested in the current time sequence, and updating the measurement result of the material strain information of the sample to be tested based on the candidate measurement result;

[0180] After sequentially traversing the measurement results of the material strain information of each sample to be tested, the measurement results of the material strain information of the sample to be tested that have been updated multiple times are used as the DIC test results of the sample to be tested.

[0181] Optionally, before the step of removing the speckles on the target sample to be tested, the method further includes: placing the target sample to be tested on a preset positioning fixture, and taking a positioning picture of the target sample to be tested, wherein the positioning picture includes the target sample to be tested and the positioning fixture;

[0182] The result calculation module 50 is further used for:

[0183] For any obtained measurement result of the material strain information of the sample to be tested, position correlation is performed between the positioning picture corresponding to the measurement result of the material strain information of the sample to be tested and the positioning picture corresponding to the measurement result of the material strain information of the sample to be tested in the previous time sequence of the target time sequence, to obtain the positional relationship between the speckle and the sample to be tested in the target time sequence and the previous time sequence, wherein the target time sequence is the time sequence in which the measurement result of the material strain information of the sample to be tested is obtained;

[0184] Accumulating the measurement result of the material strain information of the sample to be tested with the measurement result of the material strain information of the sample to be tested obtained in the previous time sequence based on the positional relationship to obtain a candidate measurement result of the sample to be tested in the current time sequence, and updating the measurement result of the material strain information of the sample to be tested based on the candidate measurement result;

[0185] After sequentially traversing the measurement results of the material strain information of each sample to be tested, the measurement results of the material strain information of the sample to be tested that have been updated multiple times are used as the DIC test results of the sample to be tested.

[0186] Optionally, the speckles on the target sample to be tested include multiple sets of speckles with different particle sizes, and each set of speckles is prepared sequentially on the sample surface of the sample to be tested based on particle sizes from small to large;

[0187] The DIC measurement module 30 is further configured to:

[0188] Taking pictures of the sample morphology before deformation at different scales for the target sample to be tested, wherein the scale of the pictures corresponds to the particle size of the speckle;

[0189] Applying stress to the target sample to be tested based on a preset in-situ loading task;

[0190] After the target sample to be tested reaches the deformation amount specified by the in-situ loading task, taking deformed sample morphology images of the target sample to be tested at different scales;

[0191] Digital image correlation (DIC) measurement is performed based on the sample topography before deformation and the sample topography after deformation at any scale to obtain measurement results of the strain information of the sample material to be measured at multiple scales.

[0192] Optionally, the speckle pattern preparation module 20 is further configured to:

[0193] Spraying a preset speckle suspension or depositing atomized speckle particles on the surface of the sample to obtain a candidate sample to be tested, wherein the material of the speckle particles on the candidate sample to be tested is an inert material;

[0194] The candidate sample to be tested is heated to obtain a target sample to be tested.

[0195] Optionally, the speckle removal module 40 is further configured to:

[0196] The speckles on the target sample to be tested are removed by a preset cleaning agent, ultrasonic treatment, or compressed air to obtain a sample to be tested after the speckles have been removed.

[0197] The testing device for collaborative material deformation acquisition provided in this application, employing the testing method for collaborative material deformation acquisition in the aforementioned embodiments, can address the technical problem of removing the electron beam limitations on speckle particle size or DIC observation area size in EBSD calibration. Compared to the prior art, the beneficial effects of the testing device for collaborative material deformation acquisition provided in this application are the same as those of the testing method for collaborative material deformation acquisition provided in the aforementioned embodiments. Other technical features of the testing device for collaborative material deformation acquisition are the same as those disclosed in the aforementioned embodiments and are not further elaborated here.

[0198] The present application provides an electronic device, which includes: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the test method for collaborative acquisition of material deformation in the above-mentioned embodiment one.

[0199] Reference below Figure 9 , which shows a schematic diagram of the structure of an electronic device suitable for implementing the embodiments of the present application. The electronic devices in the embodiments of the present application may include, but are not limited to, mobile terminals such as mobile phones, laptop computers, digital broadcast receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Descriptions), PMPs (Portable Media Players), in-vehicle terminals (such as in-vehicle navigation terminals), and fixed terminals such as digital TVs and desktop computers. Figure 9 The electronic device shown is merely an example and should not limit the functions and scope of use of the embodiments of the present application.

[0200] like Figure 9 As shown, the electronic device may include a processing device 1001 (e.g., a central processing unit, a graphics processing unit, etc.), which can perform various appropriate actions and processes based on programs stored in a read-only memory 1002 or programs loaded from a storage device 1003 into a random access memory 1004. The random access memory 1004 also stores various programs and data required for the operation of the electronic device. The processing device 1001, the read-only memory 1002, and the random access memory 1004 are interconnected via a bus 1005. An input / output interface 1006 is also connected to the bus. Typically, the following systems may be connected to the input / output interface 1006: an input device 1007 including, for example, a touchscreen, touchpad, keyboard, mouse, image sensor, microphone, accelerometer, gyroscope, etc.; an output device 1008 including, for example, a liquid crystal display (LCD), speaker, vibrator, etc.; a storage device 1003 including, for example, a magnetic tape or hard disk; and a communication device 1009. The communication device 1009 may allow the electronic device to communicate with other devices wirelessly or wired to exchange data.

[0201] In particular, according to the embodiments disclosed in the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs, which can be downloaded and installed from a network via a communication device, or installed from the storage device 1003, or installed from the read-only memory 1002. When the computer program is executed by the processing device 1001, the above functions defined in the methods of the embodiments disclosed in the present application are performed.

[0202] The electronic device provided in this application, utilizing the material deformation collaborative acquisition testing method described in the aforementioned embodiment, can address the technical problem of removing the electron beam limitations on speckle particle size or DIC observation area size in EBSD calibration. Compared to the prior art, the electronic device provided in this application achieves the same beneficial effects as the material deformation collaborative acquisition testing method described in the aforementioned embodiment. Other technical features of this electronic device are the same as those disclosed in the aforementioned embodiment and are not further elaborated here.

[0203] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, a computer program) stored thereon, wherein the computer-readable program instructions are used to execute the test method for collaborative acquisition of material deformation in the above-mentioned embodiment.

[0204] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems or devices, or any combination thereof.

[0205] The computer-readable storage medium carries one or more programs. When the one or more programs are executed by an electronic device, the electronic device is caused to: perform electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested to obtain a measurement result of grain orientation information inside the sample to be tested; generate speckle on the sample surface to obtain a target sample to be tested; perform in-situ loading on the target sample to be tested to perform digital image correlation (DIC) measurement to obtain a measurement result of material strain information of the sample to be tested; remove the speckle on the target sample to be tested, and return to the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the sample to be tested based on the sample to be tested after the speckle is removed, until the in-situ loading of the target sample to be tested reaches a preset loading target; determine an EBSD test result of the sample to be tested based on the obtained measurement result of the grain orientation information inside each sample to be tested, and determine a DIC test result of the sample to be tested based on the obtained measurement result of the material strain information of each sample to be tested.

[0206] The computer-readable storage medium provided in this application stores computer-readable program instructions (i.e., a computer program) for executing the aforementioned testing method for coordinated material deformation acquisition. This computer-readable storage medium addresses the technical problem of removing the electron beam limitations on speckle particle size or DIC observation area size in EBSD calibration. Compared to the prior art, the computer-readable storage medium provided in this application offers the same advantages as the testing method for coordinated material deformation acquisition provided in the aforementioned embodiments, and therefore is not further elaborated here.

Claims

1. A testing method for collaborative collection of material deformation, characterized in that: The testing method for collaborative collection of material deformation includes: Perform electron backscatter diffraction (EBSD) calibration on the sample surface to obtain the measurement results of the internal grain orientation information of the sample; Spraying a preset speckle suspension or depositing atomized speckle particles on the surface of the sample to obtain a candidate sample to be tested, wherein the material of the speckle particles on the candidate sample to be tested is an inert material; Heating the candidate sample to be tested to obtain a target sample to be tested; In-situ loading is performed on the target sample to perform a digital image correlation (DIC) measurement to obtain a measurement result of the material strain information of the sample; Cleaning the speckle on the target sample to be tested, and returning to the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the target sample to be tested based on the sample to be tested after the speckle cleaning, until the target sample to be tested is in-situ loaded to reach a preset loading target; The EBSD test results of the samples to be tested are determined based on the obtained measurement results of the internal grain orientation information of each sample to be tested, and the DIC test results of the samples to be tested are determined based on the obtained measurement results of the material strain information of each sample to be tested.

2. The testing method for collaborative collection of material deformation according to claim 1, characterized in that: The step of in-situ loading the target sample to be tested for digital image correlation (DIC) measurement includes: Taking a sample morphology image of the target sample before deformation; Applying stress to the target sample to be tested based on a preset in-situ loading task; After the target sample to be tested reaches the deformation amount specified by the in-situ loading task, photographing the sample morphology after deformation of the target sample to be tested; Digital image correlation (DIC) measurement is performed based on the sample morphology image before deformation and the sample morphology image after deformation.

3. The testing method for collaborative collection of material deformation according to claim 2, characterized in that: The step of determining the DIC test results of the samples to be tested based on the obtained measurement results of the material strain information of each sample to be tested includes: For any obtained measurement result of the material strain information of the sample to be tested, image coincidence processing is performed based on the pre-deformation sample topography corresponding to the measurement result of the material strain information of the sample to be tested and the post-deformation sample topography corresponding to the measurement result of the material strain information of the sample to be tested in the previous time sequence of the target time sequence, to obtain the positional relationship between the speckle and the sample to be tested in the target time sequence and the previous time sequence, wherein the target time sequence is the time sequence of obtaining the measurement result of the material strain information of the sample to be tested; Accumulating the measurement result of the material strain information of the sample to be tested with the measurement result of the material strain information of the sample to be tested obtained in the previous time sequence based on the positional relationship to obtain a candidate measurement result of the sample to be tested in the current time sequence, and updating the measurement result of the material strain information of the sample to be tested based on the candidate measurement result; After sequentially traversing the measurement results of the material strain information of each sample to be tested, the measurement results of the material strain information of the sample to be tested that have been updated multiple times are used as the DIC test results of the sample to be tested.

4. The testing method for collaborative collection of material deformation according to claim 1, characterized in that: Before the step of removing the speckles on the target sample to be tested, the method further includes: placing the target sample to be tested on a preset positioning fixture, and taking a positioning picture of the target sample to be tested, wherein the positioning picture includes the target sample to be tested and the positioning fixture; The step of determining the DIC test results of the samples to be tested based on the obtained measurement results of the material strain information of each sample to be tested includes: For any obtained measurement result of the material strain information of the sample to be tested, position correlation is performed between the positioning picture corresponding to the measurement result of the material strain information of the sample to be tested and the positioning picture corresponding to the measurement result of the material strain information of the sample to be tested in the previous time sequence of the target time sequence, to obtain the positional relationship between the speckle and the sample to be tested in the target time sequence and the previous time sequence, wherein the target time sequence is the time sequence in which the measurement result of the material strain information of the sample to be tested is obtained; Accumulating the measurement result of the material strain information of the sample to be tested with the measurement result of the material strain information of the sample to be tested obtained in the previous time sequence based on the positional relationship to obtain a candidate measurement result of the sample to be tested in the current time sequence, and updating the measurement result of the material strain information of the sample to be tested based on the candidate measurement result; After sequentially traversing the measurement results of the material strain information of each sample to be tested, the measurement results of the material strain information of the sample to be tested that have been updated multiple times are used as the DIC test results of the sample to be tested.

5. The testing method for collaborative collection of material deformation according to claim 1, characterized in that: The speckles on the target sample to be tested include multiple sets of speckles with different particle sizes, and each set of speckles is prepared sequentially on the surface of the sample to be tested based on particle sizes from small to large; The step of in-situ loading the target sample to be tested for digital image correlation (DIC) measurement includes: Taking pictures of the sample morphology before deformation at different scales for the target sample to be tested, wherein the scale of the pictures corresponds to the particle size of the speckle; Applying stress to the target sample to be tested based on a preset in-situ loading task; After the target sample to be tested reaches the deformation amount specified by the in-situ loading task, taking deformed sample morphology images of the target sample to be tested at different scales; Digital image correlation (DIC) measurement is performed based on the sample topography before deformation and the sample topography after deformation at any scale to obtain measurement results of the strain information of the sample material to be measured at multiple scales.

6. The testing method for collaborative collection of material deformation according to claim 1, characterized in that: The step of removing speckles on the target sample to be tested comprises: The speckles on the target sample to be tested are removed by a preset cleaning agent, ultrasonic treatment, or compressed air to obtain a sample to be tested after the speckles have been removed.

7. A testing device for collaborative collection of material deformation, characterized in that: The testing device for collaborative collection of material deformation includes: EBSD calibration module, used to perform electron backscatter diffraction EBSD calibration on the sample surface to obtain the measurement results of the internal grain orientation information of the sample to be tested; a speckle preparation module, configured to spray a preset speckle suspension or deposit atomized speckle particles on the surface of the sample to obtain a candidate sample to be tested, wherein the speckle particles on the candidate sample to be tested are made of an inert material; and heat the candidate sample to be tested to obtain a target sample to be tested; A DIC measurement module is used to load the target sample in situ to perform digital image correlation (DIC) measurement to obtain a measurement result of the material strain information of the sample; a speckle removal module, configured to remove speckles on the target sample to be tested, and return to the step of performing electron backscatter diffraction (EBSD) calibration on the sample surface of the target sample to be tested based on the sample to be tested after speckle removal, until the in-situ loading of the target sample to be tested reaches a preset loading target; The result calculation module is used to determine the EBSD test results of the samples to be tested based on the measurement results of the internal grain orientation information of each sample to be tested, and to determine the DIC test results of the samples to be tested based on the measurement results of the material strain information of each sample to be tested.

8. An electronic device, characterized in that: The device includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program is configured to implement the steps of the testing method for collaborative acquisition of material deformation according to any one of claims 1 to 6.

9. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the test method for collaborative collection of material deformation according to any one of claims 1 to 6 are implemented.

Images