Wafer lug detection mechanism suitable for open type loading equipment and adjusting method

Abstract

The invention belongs to the technical field of semiconductor processing equipment, and provides a wafer lug detection mechanism suitable for open type loading equipment and an adjusting method. The device comprises a loading platform and a wafer, a lug adjusting tool and a first material box are arranged on the upper surface of the loading platform, the wafer is horizontally placed in the first material box, the lug adjusting tool is located on the side face of the first material box, the lug adjusting tool is provided with at least two measuring faces, and the measuring faces make contact with the side face of the wafer. The vertical planes where the measuring surfaces are located are parallel to each other and have a distance difference. According to the invention, the problem that the difference of detection results between the first layer of wafers and the last layer of wafers in the material box is large is solved; the pitching jackscrew and the front and back jackscrews are adopted to improve the positioning precision of the lug detection mechanism, so that the adjusting efficiency of the wafer lug is improved; the positioning mode of the lug detection mechanism is changed, the adjustment difficulty is reduced, and the production and assembly cost is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and relates to a wafer tab detection mechanism and an adjustment method applicable to an open loading device. Background Art

[0002] When a wafer tab phenomenon occurs in a cassette, it is necessary for the detection mechanism to detect it in time to avoid the situation of wafer dropping or the Aligner device being unable to correct it; the tab gap of the wafer is generally set to be relatively small, and it is difficult to achieve accurate detection. The main reason is that most of the existing technologies use photoelectric sensors, and the light column has the characteristic of gradually diverging, which makes it difficult to adjust the sensor and seriously affects the production efficiency. At the same time, the sensor fixing method of the tab detection mechanism used in the existing technology is a split type, that is, the sensor is sequentially connected by a plurality of connecting pieces and fixed on the loading platform. Since the light column of the sensor is actually in a divergent state of a cone shape from near to far, there is a large difference in the detection results between the first and last layer wafers in the cassette. Therefore, the requirement for the orientation adjustment of the sensor is very high, not a single-direction horizontal adjustment. The current adjustment method has a large adjustment difficulty and poor adjustment accuracy, greatly consuming the debugging time. The inventor believes that there is a large room for improvement in the existing technology. Summary of the Invention

[0003] The purpose of the present invention is to solve problems such as the large difference in detection results between the first and last layer wafers in the cassette caused by the nature of the photoelectric sensor itself during wafer tab monitoring. Secondly, improve the positioning accuracy of the tab detection mechanism, thereby improving the adjustment efficiency of wafer tabs; change the adjustment method of the tab detection mechanism, reduce the adjustment difficulty, and save the production and assembly costs. To this end, the present application provides a wafer tab detection mechanism applicable to an open loading device, including a loading platform and a wafer. The upper surface of the loading platform is provided with a tab adjustment tooling and a first cassette. The wafer is horizontally placed inside the first cassette. The tab adjustment tooling is located on the side of the first cassette. The tab adjustment tooling is provided with at least two measurement surfaces, and the measurement surfaces are in contact with the side surface of the wafer. The vertical planes where each measurement surface is located are parallel to each other and have a distance difference A. When the tab adjustment tooling is in contact with the wafer, since the tab adjustment tooling is provided with different measurement surfaces, wafers in different layers generate a distance difference because they contact different measurement surfaces, and the difference value is A, and A is the tab gap value of the wafer. By using the tab adjustment tooling to contact wafers in different layers and pushing the wafers to make the photoelectric sensor emit a detection signal to position the cassette. At the same time, control the protruding degree of the upper layer wafer so that the upper layer wafer can be detected by the photoelectric sensor, trigger the photoelectric sensor signal, and reduce the risk of wafer dropping of the upper layer wafer; use the same component and mechanical device to push wafers in different layers at the same time to ensure the reliability and stability of wafer control and avoid electrical and transmission errors.

[0004] Preferably, the loading platform is provided with a tab sensor. The tab sensor and the tab adjusting tooling are located on both sides of the wafer. The tab sensor is provided with an upward light column, and the light column has an adjustable angle with the vertical direction. The light column emitted by the tab sensor can be adjusted so that the light near the wafer on the outer side of the light column is close to the vertical, reducing the distance that the upper wafer needs to protrude when being detected and reducing the risk of the upper wafer falling off.

[0005] Preferably, the loading platform is further provided with front and rear setscrews. The front and rear setscrews are threadedly connected to the loading platform and are in horizontal contact with the tab sensor. The front and rear setscrews can adjust the distance between the tab sensor and the tab adjusting tooling.

[0006] Preferably, the loading platform is further provided with a pitch setscrew. The pitch setscrew is threadedly connected to the loading platform and is in contact with the upper surface and / or the lower surface of the tab sensor. The pitch setscrew can adjust the angle between the tab sensor and the horizontal plane. By rotating the pitch setscrew, the vertical displacement of the pitch setscrew is amplified by the thread, that is, the angular change of the tab sensor is amplified, improving the control accuracy of the tab sensor to improve the detection accuracy of the wafer tabs.

[0007] Preferably, a sensor connection block is provided inside the loading platform. The pitch setscrew and the front and rear setscrews pass through the sensor connection block to adjust the tab sensor. The sensor connection block is provided with a rotating shaft hole and a pitch adjustment hole. The pitch adjustment hole is a circular waist-shaped hole with the rotating shaft hole as the center. The side surface of the tab sensor is connected to the rotating shaft hole and the pitch adjustment hole. The rotating shaft hole and the pitch adjustment hole fix the pitch state of the tab sensor. Cooperating with the pitch setscrew to rotate the tab sensor, the light cone inclination formed by the light column emitted by the tab sensor due to its own nature is compensated, avoiding the increase of detection error caused by the accumulation of wafer height, resulting in the upper wafer needing to protrude more distance to be detected, that is, the upper wafer has the risk of falling off.

[0008] Preferably, the loading platform is further provided with a second cassette. The second cassette is sleeved outside the first cassette. The wafers can be horizontally placed inside the second cassette. The wafers in the second cassette are located above the first cassette. The measuring surface of the tab adjusting tooling can simultaneously contact the wafers in the first cassette and the second cassette. Using the same tooling to adjust the two cassettes simultaneously can improve the consistency of cassette positioning and avoid the operation error between secondary operations, resulting in the positioning error between the cassettes.

[0009] Preferably, the tab sensor further includes a sensor reflector, and the sensor reflector is located above the second cassette.

[0010] Preferably, at least two limit blocks are provided on the upper surface of the loading platform, and the limit blocks are matched with the outer shapes of the first cassette and the second cassette.

[0011] Preferably, the tab adjusting tooling includes an adjusting bracket and an adjusting spacer. The bottom of the adjusting bracket contacts the loading platform. An adjusting spacer is provided on the side of the adjusting bracket close to the wafer. The measuring surfaces are all arranged on the side of the adjusting spacer close to the wafer. Different measuring surfaces are located on the same part, reducing the influencing factors of the error of distance A and avoiding the error of the value of distance A caused by the assembly error of the measuring surfaces of different components; since only the adjusting spacer has the measuring surface, only the adjusting spacer needs to be finely processed, reducing the production cost of the components.

[0012] Preferably, the bottom of the adjusting bracket is an inclined surface with a middle height. The inclined surface is provided with a center scale line, and the center scale line is aligned with the centers of the loading platform and the first cassette.

[0013] An adjusting method for a wafer tab detection mechanism applicable to an open loading device, applicable to the above-mentioned wafer tab detection mechanism for an open loading device, and the steps are as follows: 1. Adjust the first cassette and its limit block to a suitable position, which needs to meet that there is no warping after the first cassette is placed, there is no gap when the first cassette is moved left and right, forward and backward, and it is convenient to pick up and place; 2. Place one wafer on the first layer and the fifth layer of the first cassette respectively, and uniformly place the wafers at the tail of the first cassette, that is, on the side of the first cassette where the tab adjusting tooling is located; 3. Align the center scale line of the tab adjusting tooling with the left and right centers of the loading platform, and push the tab adjusting tooling forward with both hands. During the pushing process, the wafer on the first layer first contacts the first measuring surface of the adjusting tooling. Continue to push until it stops when the second measuring surface contacts the wafer on the fifth layer. At this time, the wafer on the first layer is in the position protruding by A, that is, push the tab adjusting tooling towards the first cassette. Two wafers located on different layers generate a distance difference because they contact different measuring surfaces, and the difference value is A. A is the tab gap value of the wafer, and the specific value of A is set according to the actual situation; 4. Adjust the front and rear setscrews to make the tab sensor slowly push forward until the sensor light column touches the wafer on the first layer, and stop adjusting when the tab sensor is triggered. It should be noted that the light column does not only contact a certain layer of wafer, because the emitted light column of the sensor is actually in a conical divergent state from near to far, and if the sensor is to be triggered, it is necessary to block more than about 80% of the area of the light column; 5. At this time, the front and rear positions of the sensor are fixed, and just tighten the front and rear fixing screws of the sensor; 6. If the sensor is not adjusted for pitching, the upper wafer needs to protrude a greater distance to be detected, and there is a risk of wafer dropping. Therefore, in order to ensure that the wafer can be detected when setting the tab gap distance, it is necessary to pitch the sensor upward; If the sensor is not pitch-adjusted, the upper wafer needs to protrude a greater distance to be detected, which may cause the wafer to fall off. Therefore, in order to ensure that the wafer can be detected when the protruding wafer gap distance is set, the sensor needs to be pitch-adjusted upwards. 7. Place a wafer on the 22nd and 25th layers of the first material box respectively, and place the wafers uniformly at the tail of the material box, that is, on the side of the convex piece adjustment tooling of the first material box; 8. Push the convex piece adjustment tool forward. During the pushing process, the 25th layer of wafer first contacts the first measuring surface of the convex piece adjustment tool. Continue to push until the second measuring surface contacts the 22nd layer of wafer. At this time, the 25th layer of wafer is in the position of protrusion A. That is, the convex piece adjustment tool is pushed toward the first material box. The two wafers at different layers contact different measuring surfaces, resulting in a distance difference. The difference is A. A is the convex piece gap value of the wafer. The specific value of A is set according to the actual situation. 9. Adjust the pitch screw of the connector, and then adjust the pitch angle of the convex sensor until the light column touches the 25th layer of wafer. The sensor is triggered and the adjustment stops; 10. After the pitch position of the sensor is determined, tighten the fasteners at the shaft hole of the sensor connection block; 11. Loosen the fixing screws of the longitudinal limit block at the front end of the second material box, and limit the left and right positions of the material box by the front transverse limit block and the rear limit block; 12. Push the tab adjustment tool forward. During the pushing process, the first layer of wafers first contacts the first measuring surface of the tab adjustment tool. Continue pushing until the second measuring surface contacts the third layer of wafers. At this time, the first layer of wafers is in the position of protrusion A. That is, the tab adjustment tool is pushed toward the first material box. The two wafers at different layers contact different measuring surfaces, resulting in a distance difference. The difference is A, and A is the tab gap value of the wafer. The specific value of A is set according to the actual situation. 13. Remove the convex piece adjustment tooling and slowly push the second material box forward until the first wafer just triggers the sensor. At this point, all the limit blocks of the material box can be fixed. At this point, the adjustment of the convex piece sensor and the position adjustment of the first and second material boxes are completed.

[0014] The present invention adjusts the pitch angle of the photoelectric sensor itself to compensate for the inclination angle of the light cone formed by the light column generated by the photoelectric sensor, thereby solving the problem of large differences in detection results between the first and last layers of wafers in a material box; adopts pitch top screws and front and rear top screws to improve the adjustment accuracy of the convex piece detection mechanism, thereby improving the adjustment efficiency of the wafer convex piece; changes the adjustment method of the convex piece detection mechanism, reduces the adjustment difficulty, and saves production and assembly costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings described below are only exemplary. For those of ordinary skill in the art, without creative efforts, other implementation drawings can also be obtained based on the provided drawings.

[0016] Figure 1 It is a schematic structural diagram of a wafer tab detection mechanism applicable to an open loading device; Figure 2 It is a schematic bottom view structural diagram of a wafer tab detection mechanism applicable to an open loading device; Figure 3 It is a schematic rear view structural diagram of a wafer tab detection mechanism applicable to an open loading device; Figure 4 It is a top view of the loading platform; Figure 5 It is a sectional view of a wafer tab detection mechanism applicable to an open loading device; Figure 6 It is a schematic structural diagram of the first cassette loading wafers; Figure 7 It is a schematic structural diagram of the sensor connection block; Figure 8 It is a schematic structural diagram of the initial state of the tab sensor; Figure 9 It is a schematic structural diagram of the state of the tab sensor after pitching adjustment; Figure 10 It is a schematic structural diagram of the tab adjustment tooling; Figure 11 It is a side view of the tab adjustment tooling.

[0017] Explanation of reference numerals: 1 loading platform; 2 second cassette; 3 first cassette; 4 second limit block; 41 front longitudinal limit block; 42 front transverse limit block; 43 rear transverse limit block; 5 first limit block; 51 front limit block; 52 rear limit block; 6 tab sensor; 7 sensor connection block; 71 rotating shaft hole; 72 pitching adjustment hole; 73 pin hole; 74 connection hole; 75 pitching setscrew hole; 8 front and rear setscrews; 9 sensor reflector; 10 pitching setscrew; 11 tab adjustment tooling; 11a adjustment bracket; 11b adjustment pad; 11c measuring surface; 11d first measuring surface; 11e second measuring surface; 12 wafer; 13 center line. Detailed implementation manners

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0019] Embodiment 1 Combined with Figure 1 、 Figure 2 and Figure 3 As shown, a wafer bump detection mechanism applicable to an open loading device includes a loading platform 1 and a wafer 12. The upper surface of the loading platform 1 is provided with a bump adjusting tooling 11 and a first cassette 3. The wafer 12 is horizontally placed inside the first cassette 3. The bump adjusting tooling 11 is located on the side of the first cassette 3. The bump adjusting tooling 11 is provided with at least two measuring surfaces 11c. The measuring surfaces 11c are in contact with the side surface of the wafer 12. The vertical planes where each measuring surface 11c is located are parallel to each other and have a distance difference A. When the bump adjusting tooling 11 is in contact with the wafer 12, due to the different measuring surfaces 11c provided on the bump adjusting tooling 11, the wafers 12 in different layers generate a distance difference because they contact different measuring surfaces 11c. The difference value is A, and A is the bump gap value of the wafer 12.

[0020] As Figure 8 、 9 shown, the loading platform 1 is provided with a bump sensor 6. The bump sensor 6 and the bump adjusting tooling 11 are located on both sides of the wafer 12. The bump sensor 6 is provided with an upward light column, and the light column has an adjustable angle with the vertical direction. The light column emitted by the bump sensor 6 can be adjusted so that the light near the wafer 12 on the outer side of the light column is close to the vertical, reducing the distance that the upper-layer wafer 12 needs to protrude when being detected and reducing the risk of the upper-layer wafer 12 falling off.

[0021] Combined with Figure 1 and Figures 7 to 9 shown, the loading platform 1 is further provided with front and rear set screws 8. The front and rear set screws 8 are threadedly connected to the loading platform 1. The front and rear set screws 8 are in contact with the bump sensor 6 in the horizontal direction. The front and rear set screws 8 can adjust the distance between the bump sensor 6 and the bump adjusting tooling 11.

[0022] The loading platform 1 is further provided with a pitch set screw 10. The pitch set screw 10 is threadedly connected to the loading platform 1. The pitch set screw 10 is in contact with the upper surface and / or the lower surface of the bump sensor 6. The pitch set screw 10 can adjust the angle between the bump sensor 6 and the horizontal plane.

[0023] Inside the loading platform 1, there is a sensor connection block 7. The pitch adjusting screw 10 and the front and rear adjusting screws 8 pass through the sensor connection block 7 to adjust the tab sensor 6. The sensor connection block 7 is provided with a rotating shaft hole 71, a pitch adjusting hole 72, a pin hole 73, a connection hole 74, and a pitch adjusting screw hole 75. The pitch adjusting hole 72 is a circular waist-shaped hole centered on the rotating shaft hole 71. The side surface of the tab sensor 6 is connected to the rotating shaft hole 71 and the pitch adjusting hole 72. The rotating shaft hole 71 and the pitch adjusting hole 72 fix the pitch state of the tab sensor 6. By rotating the tab sensor 6 in cooperation with the pitch adjusting screw 10, the light cone inclination formed by the light column emitted by the tab sensor 6 due to its own nature is compensated, avoiding the risk that the upper layer of the wafer 12 needs to protrude more distance to be detected due to the height accumulation of the wafer 12, that is, there is a risk of the upper layer of the wafer 12 falling off. The sensor connection block 7 is connected to the loading platform 1 through the connection hole 74, and the front and rear adjusting screws 8 are fixed by the pin holes.

[0024] The loading platform 1 is also provided with a second cassette 2. The second cassette 2 is sleeved outside the first cassette 3. The wafers 12 can be horizontally placed inside the second cassette 2. The wafers 12 in the second cassette 2 are located above the first cassette 3. The measuring surface 11c of the tab adjusting tooling 11 can simultaneously contact the wafers 12 of the first cassette 3 and the second cassette 2. Adjusting the two cassettes simultaneously with the same tooling can improve the consistency of the cassette positioning and avoid the operation error between the secondary operations, resulting in an error in the positioning between the cassettes.

[0025] As Figure 1 shown, the tab sensor 6 further includes a sensor reflector 9. The sensor reflector 9 is located above the second cassette 2.

[0026] As Figure 4 shown, the upper surface of the loading platform 1 is provided with two types of limit blocks. The limit blocks include a first limit block and a second limit block 4. The first limit block 5 includes a front end limit block 51 and a rear end limit block 52. The first limit block matches the outer shape of the first cassette 3. The first cassette 3 is an 8-inch cassette in this embodiment; the second limit block 4 includes a front end longitudinal limit block 41, a front end transverse limit block 42, and a rear end transverse limit block 43. The second limit block 4 matches the outer shape of the second cassette 2. The second cassette 2 is a 6-inch cassette in this embodiment.

[0027] Combined with Figure 5 、 Figure 10 and Figure 11As shown in the figure, the tab adjusting tooling 11 includes an adjusting bracket 11a and an adjusting spacer 11b. The bottom of the adjusting bracket 11a contacts the loading platform 1. An adjusting spacer 11b is provided on one side of the adjusting bracket 11a close to the wafer 12. The measuring surfaces 11c are all arranged on the side of the adjusting spacer 11b close to the wafer 12. The bottom of the adjusting bracket 11a is an inclined surface with a middle height. A center marking line 13 is provided on the inclined surface, and the center marking line 13 is aligned with the centers of the loading platform 1 and the first magazine 3.

[0028] The different measuring surfaces 11c are located on the same part, reducing the influencing factors of the error of the distance A and avoiding the error of the value of the distance A caused by the assembly error of the measuring surfaces 11c of different components. Since only the adjusting spacer 11b has the measuring surface 11c, only the adjusting spacer 11b needs to be finely processed, reducing the production cost of the components.

[0029] An adjusting method applicable to the wafer tab detection mechanism of an open loading device, which is applicable to the above-mentioned wafer tab detection mechanism of an open loading device, and the steps are as follows: 1. Adjust the first magazine 3 and its limit blocks to appropriate positions, which need to meet that there is no warping after the first magazine 3 is placed, there is no gap when the first magazine 3 is moved left and right, front and back, and it is convenient to pick up and place. 2. Place one wafer 12 on the first layer and the fifth layer of the first magazine 3 respectively, and uniformly place the wafers 12 at the tail of the first magazine 3, that is, on the side of the first magazine 3 where the tab adjusting tooling 11 is located. 3. Align the center marking line 13 of the tab adjusting tooling 11 with the left and right centers of the loading platform 1, and push the tab adjusting tooling 11 forward with both hands. During the pushing process, as Figure 6 shown in the figure, start counting from the bottom of the detection mechanism upwards. The bottom is the first layer, and the top is the 25th layer. The wafer 12 on the first layer first contacts the first measuring surface 11d of the adjusting tooling. Continue to push until it stops when the second measuring surface 11e contacts the wafer 12 on the fifth layer. At this time, the wafer 12 on the first layer is in the position protruding by A, that is, push the tab adjusting tooling 11 towards the first magazine 3. The two wafers 12 located on different layers generate a distance difference because they contact different measuring surfaces 11c, and the difference value is A. A is the tab gap value of the wafer 12, and the specific value of A is set according to the actual situation. 4. Adjust the front and rear setscrews 8 so that the tab sensor 6 slowly advances forward until the sensor light column touches the wafer 12 on the first layer, and stop adjusting when the tab sensor 6 is triggered. It should be noted that the light column does not only contact a certain layer of the wafer 12, because the emitted light column of the sensor is actually in a conical divergent state from near to far, and if the sensor is to be triggered, it needs to block more than about 80% of the area of the light column. 5. At this time, the front and rear positions of the sensor are fixed, and just tighten the front and rear fixing screws of the sensor. 6. If the sensor does not perform pitch adjustment, the upper wafer 12 needs to protrude a greater distance to be detected, which poses a risk of wafer dropping. Therefore, to ensure that the wafer 12 can be detected when setting the tab gap distance, the sensor needs to be pitched upward; 6. If the sensor does not perform pitch adjustment, the upper wafer 12 needs to protrude a greater distance to be detected, which poses a risk of wafer dropping. Therefore, to ensure that the wafer 12 can be detected when setting the tab gap distance, the sensor needs to be pitched upward; 7. Place one wafer 12 on the 22nd layer and the 25th layer of the first cassette 3 respectively, and place the wafers 12 uniformly at the tail of the cassette, that is, on the side of the tab adjustment tooling 11 of the first cassette 3; 8. Push the tab adjustment tooling 11 forward. During the pushing process, the wafer 12 on the 25th layer first contacts the first measurement surface 11d of the tab adjustment tooling 11. Continue to push until it stops when the second measurement surface 11e contacts the wafer 12 on the 22nd layer. At this time, the wafer 12 on the 25th layer is in the position protruding by A, that is, push the tab adjustment tooling 11 towards the first cassette 3. Two wafers 12 on different layers generate a distance difference because they contact different measurement surfaces 11c, and the difference value is A. A is the tab gap value of the wafer 12, and the specific value of A is set according to the actual situation; 9. Adjust the pitch top screw 10 of the connecting piece, and then adjust the pitch angle of the tab sensor 6 until the light column touches the wafer 12 on the 25th layer, and stop adjusting when the sensor is triggered; 10. After determining the pitch position of the sensor, fasten the fastener at the rotating shaft hole 71 of the sensor connecting block 7; 11. Loosen the fixing screw of the front longitudinal limiting block 41 of the second cassette 2, and limit the left and right positions of the cassette through the front transverse limiting block 42 and the rear transverse limiting block 43; 12. Push the tab adjustment tooling 11 forward. During the pushing process, the wafer 12 on the 1st layer first contacts the first measurement surface 11d of the tab adjustment tooling 11. Continue to push until it stops when the second measurement surface 11e contacts the wafer 12 on the 3rd layer. At this time, the wafer 12 on the 1st layer is in the position protruding by A, that is, push the tab adjustment tooling 11 towards the first cassette 3. Two wafers 12 on different layers generate a distance difference because they contact different measurement surfaces 11c, and the difference value is A. A is the tab gap value of the wafer 12, and the specific value of A is set according to the actual situation; 13. Remove the tab adjustment tooling 11, and slowly push the second cassette 2 forward until the first wafer 12 just triggers the sensor. At this time, fix all the limiting blocks of the cassette. Thus, the adjustment of the tab sensor 6 and the position adjustment of the first cassette 3 and the second cassette 2 are completed.

[0030] The present invention compensates for the inclination angle of the light cone formed by the light column generated by the optoelectronic sensor by adjusting the pitch angle of the optoelectronic sensor itself, so as to solve problems such as large differences in detection results between the first and last wafers in the cassette; uses pitch set screws and front-back set screws to improve the adjustment accuracy of the tab detection mechanism, thereby improving the adjustment efficiency of the wafer tabs; changes the adjustment method of the tab detection mechanism, reduces the adjustment difficulty, and saves production and assembly costs.

[0031] The above embodiments and / or implementation manners are only used to illustrate the preferred embodiments and / or implementation manners for implementing the technology of the present invention, and do not impose any formal restrictions on the implementation manners of the technology of the present invention. Any person skilled in the art, without departing from the scope of the technical means disclosed in the content of the present invention, may make some modifications to other equivalent embodiments, but should still be regarded as the same technology or embodiment as the present invention in essence.

Claims

1. A wafer bump detection mechanism applicable to an open loading device, comprising a loading platform (1) and a wafer (12), characterized in that, The upper surface of the loading platform (1) is provided with a tab adjusting tooling (11) and a first cassette (3). The wafer (12) is horizontally placed inside the first cassette (3). The tab adjusting tooling (11) is located on the side of the first cassette (3). The tab adjusting tooling (11) is provided with at least two measuring surfaces (11c), and the measuring surfaces (11c) are in contact with the side surface of the wafer (12). The vertical planes where each measuring surface (11c) is located are parallel to each other and have a distance difference. The loading platform (1) is provided with a tab sensor (6). The loading platform (1) is further provided with a pitching set screw (10). The pitching set screw (10) is in contact with the upper surface and / or the lower surface of the tab sensor (6), and the pitching set screw (10) can adjust the angle between the tab sensor (6) and the horizontal plane.

2. The wafer bump detection mechanism for an open loading device according to claim 1, characterized in that, The tab sensor (6) and the tab adjusting tooling (11) are located on both sides of the wafer (12). The tab sensor (6) is provided with an upward light column, and the light column has an adjustable angle with the vertical direction.

3. The wafer bump detection mechanism for an open loading device according to claim 2, wherein The pitching set screw (10) is threadedly connected to the loading platform (1).

4. The wafer bump detection mechanism for an open loading device according to claim 3, characterized in that The loading platform (1) is further provided with a front-back set screw (8). The front-back set screw (8) is threadedly connected to the loading platform (1). The front-back set screw (8) is in contact with the tab sensor (6) in the horizontal direction, and the front-back set screw (8) can adjust the distance between the tab sensor (6) and the tab adjusting tooling (11).

5. The wafer bump detection mechanism for an open loading device according to claim 4, characterized in that, Inside the loading platform (1), there is a sensor connection block (7). The pitching set screw (10) and the front-back set screw (8) pass through the sensor connection block (7) to adjust the tab sensor (6). The sensor connection block (7) is provided with a rotating shaft hole (71) and a pitching adjustment hole (72). The pitching adjustment hole (72) is a circular waist-shaped hole with the rotating shaft hole (71) as the center. The side surface of the tab sensor (6) is connected to the rotating shaft hole (71) and the pitching adjustment hole (72).

6. The wafer bump detection mechanism for an open loading device according to claim 2, characterized in that, The loading platform (1) is further provided with a second cassette (2). The second cassette (2) is sleeved outside the first cassette (3). The wafer (12) can be horizontally placed inside the second cassette (2). The wafer (12) in the second cassette (2) is located above the first cassette (3). The measuring surfaces (11c) of the tab adjusting tooling (11) can simultaneously contact the wafers (12) in the first cassette (3) and the second cassette (2).

7. The wafer bump detection mechanism for an open loading device according to claim 6, characterized in that, The tab sensor (6) further includes a sensor reflector (9). The sensor reflector (9) is located above the second cassette (2).

8. The wafer bump detection mechanism for an open loading device according to claim 6, characterized in that, The upper surface of the loading platform (1) is provided with at least two limit blocks, and the limit blocks are matched with the outer shapes of the first cassette (3) and the second cassette (2).

9. The wafer bump detection mechanism for an open loading device according to claim 1, characterized in that, The tab adjusting tooling (11) includes an adjusting bracket (11a) and an adjusting spacer (11b). The bottom of the adjusting bracket (11a) contacts the loading platform (1). An adjusting spacer (11b) is provided on one side of the adjusting bracket (11a) close to the wafer (12). The measuring surface (11c) is disposed on the surface of the adjusting spacer (11b) close to the wafer (12).

10. The wafer bump detection mechanism for an open loading device according to claim 9, characterized in that, The bottom of the adjusting bracket (11a) is an inclined surface with a middle height. The inclined surface is provided with a center marking line (13), and the center marking line (13) is aligned with the centers of the loading platform (1) and the first cassette (3).

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