Circuit board assembly

Abstract

The invention discloses a circuit board assembly. The circuit board assembly comprises a substrate, at least one heat source and at least one radiating fin, the substrate has a front surface and a back surface. The front face is opposite to the back face. The at least one heat source comprises a heating part and at least one heat conduction part. The heating part is arranged on the front face and connected with the at least one heat conduction part. The at least one heat conduction part penetrates through the substrate. The at least one radiating fin is fixedly arranged on the back surface through a solder paste layer and is thermally coupled to the at least one heat conduction part.

Description

Technical Field

[0001] The present invention relates to a circuit board assembly, and particularly to a circuit board assembly provided with a heat sink. Background Art

[0002] With the rapid development of technology, the computing efficiency of various electronic components has increased significantly, and at the same time, a large amount of heat is generated. In order to ensure that the electronic components are not damaged by high heat, a heat dissipation device needs to be installed on the electronic components to dissipate excessive heat.

[0003] Manufacturers will, for example, install a heat sink on the circuit board to dissipate heat from the electronic components. Generally, manufacturers will fix the heat sink to the electronic components by screws. However, currently, the method of fixing the heat sink to the electronic components by screws limits the setting of the heat sink to the position of the screw holes, making the heat sink unable to be set according to the configuration of the electronic components on the circuit board. That is to say, the current heat sink has low flexibility in setting. In addition, fixing by screws still results in insufficient tightness of the heat sink attached to the electronic components, leaving gaps between the heat sink and the electronic components, thereby reducing the heat dissipation effect of the heat sink. Therefore, how to improve the flexibility of the heat sink in setting and avoid reducing the heat dissipation effect of the heat sink on the electronic components is one of the problems that researchers should solve. Summary of the Invention

[0004] The present invention aims to provide a circuit board assembly to improve the flexibility of the heat sink in setting and avoid reducing the heat dissipation effect of the heat sink on the heat source.

[0005] The circuit board assembly disclosed in an embodiment of the present invention includes a substrate, at least one heat source, and at least one heat sink. The substrate has a front surface and a back surface. The front surface and the back surface face away from each other. The at least one heat source includes a heat generating portion and at least one heat conducting portion. The heat generating portion is disposed on the front surface and is connected to the at least one heat conducting portion. The at least one heat conducting portion penetrates through the substrate. The at least one heat sink is disposed on the back surface and is thermally coupled to the at least one heat conducting portion.

[0006] In the above circuit board assembly, the at least one heat sink is connected to the at least one heat conducting portion.

[0007] In the above circuit board assembly, it further includes a heat conducting layer. The heat conducting layer is disposed on the back surface, and the at least one heat conducting portion protrudes from the back surface and is separated from the at least one heat sink. The at least one heat sink is thermally coupled to the at least one heat conducting portion through the heat conducting layer.

[0008] The above-mentioned circuit board assembly, wherein the substrate includes at least one first positioning structure, the at least one heat sink includes at least one second positioning structure, and the at least one second positioning structure is in concave-convex matching with the at least one first positioning structure. The at least one second positioning structure is disposed on the at least one first positioning structure to position the at least one heat sink on the substrate.

[0009] The above-mentioned circuit board assembly, wherein the number of the at least one first positioning structure and the number of the at least one second positioning structure are both two.

[0010] The above-mentioned circuit board assembly, wherein the at least one first positioning structure is a positioning groove, and the at least one second positioning structure is a positioning bump.

[0011] The above-mentioned circuit board assembly, wherein the at least one heat sink includes a first extension portion, a second extension portion, a third extension portion, and a connecting portion. The first extension portion, the second extension portion, and the third extension portion are connected to the connecting portion and perpendicular to the connecting portion. The second extension portion is located between the first extension portion and the third extension portion, and the first extension portion, the second extension portion, the third extension portion, and the connecting portion are coplanar.

[0012] The above-mentioned circuit board assembly, wherein the at least one heat sink further includes a fourth extension portion. The fourth extension portion is connected to one end of the first extension portion away from the connecting portion and is located on a side of the first extension portion close to the second extension portion and the third extension portion. The fourth extension portion is perpendicular to the first extension portion, and the first extension portion, the second extension portion, the third extension portion, the fourth extension portion, and the connecting portion are coplanar.

[0013] The above-mentioned circuit board assembly, wherein at least one relief notch is provided on a side of the third extension portion away from the first extension portion and the second extension portion. The at least one relief notch is used for making a space for at least one electronic component to be disposed on the substrate.

[0014] The above-mentioned circuit board assembly, wherein the number of the at least one heat conducting portion is multiple, and at least some of the heat conducting portions are respectively located between the first extension portion and the second extension portion and between the second extension portion and the third extension portion.

[0015] The above-mentioned circuit board assembly, wherein the at least one heat sink includes an annular main body portion and a hollow portion, and the annular main body portion surrounds the hollow portion.

[0016] The above-mentioned circuit board assembly, wherein the number of the at least one heat conducting portion is multiple, the heat conducting portions protrude from the back surface, and the annular main body portion separates the heat conducting portions so that the heat conducting portions are respectively located on opposite sides of the hollow portion and the annular main body portion.

[0017] The above-mentioned circuit board assembly, wherein the at least one heat conducting part is a heat conducting pin.

[0018] For the circuit board assembly according to the above embodiment, since at least one heat source and at least one heat sink are respectively disposed on the front and back sides of the substrate, and at least one heat sink is mounted on the substrate by surface mount technology instead of being fixed by screws, the setting of at least one heat sink is not limited by the position of the screw holes, and there is no gap between at least one heat sink and at least one heat source as they are connected by soldering, so that at least one heat sink can be closely attached to at least one heat source. In this way, the flexibility of setting at least one heat sink can be improved, and the heat dissipation effect of at least one heat sink on the back side on at least one heat source on the front side can be prevented from being reduced.

[0019] The above description of the content of the present invention and the following description of the embodiments are used to illustrate and explain the principle of the present invention, and provide a further explanation of the scope of the patent application of the present invention. Description of the Drawings

[0020] Figure 1 It is a perspective view of the circuit board assembly according to the first embodiment of the present invention.

[0021] Figure 2 It is Figure 1 an exploded view of the circuit board assembly.

[0022] Figure 3 It is Figure 1 a plan view of the circuit board assembly.

[0023] Figure 4 It is along Figure 3 a sectional view of the circuit board assembly taken along the cutting plane line 4-4 of

[0024] Figure 5 It is along Figure 3 a partially enlarged sectional view of the circuit board assembly taken along the cutting plane line 4-4 of

[0025] Figure 6 It is a sectional view of the circuit board assembly according to the second embodiment of the present invention.

[0026] Wherein, reference numerals:

[0027] 10, 10A: circuit board assembly

[0028] 11: substrate

[0029] 111: front side

[0030] 112: back side

[0031] 113: first positioning structure

[0032] 12, 12A: Heat source

[0033] 121: Heating part

[0034] 122, 122A: Heat conducting part

[0035] 13: First heat sink

[0036] 131: First extension part

[0037] 132: Second extension part

[0038] 133: Third extension part

[0039] 1331: Relief notch

[0040] 134: Fourth extension part

[0041] 135: Connecting part

[0042] 136: Second positioning structure

[0043] 14: Second heat sink

[0044] 141: Annular main body part

[0045] 142: Hollow part

[0046] 143: Second positioning structure

[0047] 15: Heat conducting layer

[0048] 16: Heat sink

[0049] A, B: Direction Detailed implementation manners

[0050] Please refer to Figures 1 to 5 . Figure 1 It is a three-dimensional schematic diagram of the circuit board assembly according to the first embodiment of the present invention. Figure 2 It is Figure 1 the exploded schematic diagram of the circuit board assembly. Figure 3 It is Figure 1 the planar schematic diagram of the circuit board assembly. Figure 4 It is Figure 3 the cross-sectional schematic diagram of the circuit board assembly along the 4-4 cutting plane line. Figure 5 It is Figure 3 the partially enlarged cross-sectional schematic diagram of the circuit board assembly along the 4-4 cutting plane line.

[0051] The circuit board assembly 10 of this embodiment includes a substrate 11, a plurality of heat sources 12, a first heat sink 13, a second heat sink 14, a heat conducting layer 15, a printing layer 16, and a solder paste layer 17. The substrate 11 has a front surface 111 and a back surface 112. The front surface 111 and the back surface 112 face away from each other. These heat sources 12 are, for example, electronic components such as transformers, and include a heat generating portion 121 and a plurality of heat conducting portions 122.

[0052] The heat generating portion 121 is disposed on the front surface 111 and is connected to these heat conducting portions 122. These heat conducting portions 122 are, for example, heat conducting pins. These heat conducting portions 122 penetrate from the front surface 111 to the back surface 112 and protrude from the back surface 112. The first heat sink 13 and the second heat sink 14 are, for example, surface mount devices (SMDs), and are mounted on the substrate 11 by surface mount technology (SMT). The so-called surface mount technology refers to, for example, soldering surface mount components such as resistors, capacitors, or transistors to a circuit board so that the surface mount components are electrically connected to the circuits provided on the circuit board, without providing perforations on the circuit board for inserting the pins of the resistors, capacitors, or transistors.

[0053] The first heat sink 13 and the second heat sink 14 are, for example, separated from each other. The first heat sink 13 and the second heat sink 14 are disposed on the back surface 112 and are separated from these heat conducting portions 122. The heat conducting layer 15 is, for example, a copper foil and is disposed on the back surface 112, and the first heat sink 13 and the second heat sink 14 are thermally coupled to these heat conducting portions 122 through the heat conducting layer 15. In this way, when these heat sources 12 located on the front surface 111 operate to generate heat, the heat can be transferred through these heat conducting portions 122 to the first heat sink 13 and the second heat sink 14 located on the back surface 112 through the heat conducting layer 15 for heat dissipation. The so-called thermal coupling means thermal contact or connection through other heat conducting media. In addition, the solder paste layer 17 at least partially covers the heat conducting layer 15. The first heat sink 13 and the second heat sink 14 are fixed to the substrate 11 through the solder paste layer 17. The printing layer 16 is used for electrical insulation and at least partially covers the heat conducting layer 15.

[0054] In this embodiment, since the heat source 12, the first heat sink 13, and the second heat sink 14 are respectively disposed on the front surface 111 and the back surface 112 of the substrate 11, and the first heat sink 13 and the second heat sink 14 are mounted on the substrate 11 by surface mount technology rather than by screwing, the arrangement of the first heat sink 13 and the second heat sink 14 is not limited by the position of the screw holes. Moreover, there is no gap between the first heat sink 13 and the second heat sink 14 and the heat source 12 as they are connected by soldering, enabling the first heat sink 13 and the second heat sink 14 to closely adhere to the heat source 12. In this way, the flexibility of the arrangement of the first heat sink 13 and the second heat sink 14 can be improved, and the heat dissipation effect of the first heat sink 13 and the second heat sink 14 located on the back surface 112 on the heat source 12 located on the front surface 111 can be prevented from being reduced.

[0055] In this embodiment, the first heat sink 13 is, for example, in an inverted E shape and includes a first extension portion 131, a second extension portion 132, a third extension portion 133, a fourth extension portion 134, and a connecting portion 135. The first extension portion 131, the second extension portion 132, and the third extension portion 133 are connected to the connecting portion 135 and perpendicular to the connecting portion 135. The second extension portion 132 is located between the first extension portion 131 and the third extension portion 133. The fourth extension portion 134 is connected to one end of the first extension portion 131 away from the connecting portion 135 and is located on one side of the first extension portion 131 close to the second extension portion 132 and the third extension portion 133. The fourth extension portion 134 is perpendicular to the first extension portion 131. The first extension portion 131, the second extension portion 132, the third extension portion 133, the fourth extension portion 134, and the connecting portion 135 are coplanar. At least some of these heat conducting portions 122 are respectively located between the first extension portion 131 and the second extension portion 132 and between the second extension portion 132 and the third extension portion 133.

[0056] In addition, a plurality of relief notches 1331 are formed on one side of the third extension portion 133 away from the first extension portion 131 and the second extension portion 132. These relief notches 1331 are, for example, arc-shaped and are used for making way to allow a plurality of electronic components (not shown) to be disposed on the back surface 112 of the substrate 11.

[0057] The second heat sink 14 is, for example, rectangular and includes an annular main body portion 141 and a hollowed-out portion 142. The annular main body portion 141 surrounds the hollowed-out portion 142. The annular main body portion 141 separates these heat conducting portions 122 so that these heat conducting portions 122 are respectively located on opposite sides of the hollowed-out portion 142 and the annular main body portion 141.

[0058] In this embodiment, the substrate 11 may further include four first positioning structures 113, and the first heat sink 13 and the second heat sink 14 each include two second positioning structures 136 and 143. The four first positioning structures 113 are, for example, positioning grooves, and the four second positioning structures 136 and 143 are, for example, positioning bumps. The four second positioning structures 136 and 143 are in concave-convex matching with the four first positioning structures 113, and the four second positioning structures 136 and 143 are respectively disposed on the four first positioning structures 113 to position the first heat sink 13 and the second heat sink 14 on the substrate 11. In this way, the first heat sink 13 and the second heat sink 14 can be pre-positioned on the substrate 11 through the four first positioning structures 113 and the four second positioning structures 136 and 143, so that before the first heat sink 13 and the second heat sink 14 are mounted on the substrate 11 by surface adhesion technology, the first heat sink 13 and the second heat sink 14 can be pre-aligned with the substrate 11, and can accurately dissipate heat from the heat source 12 to maintain the heat dissipation effect.

[0059] In this embodiment, the total number of the heat sinks 13 and 14 is two, but this is not limiting. In other embodiments, the total number of the heat sinks may also be only one or more than three.

[0060] In this embodiment, the first heat sink 13 and the second heat sink 14 are separated, but this is not limiting. In other embodiments, the two heat sinks may also be connected.

[0061] In this embodiment, the first positioning structure 113 is a positioning groove, and the second positioning structure 136 is a positioning bump, but this is not limiting. In other embodiments, the first positioning structure may also be a positioning bump, and the second positioning structure may also be a positioning groove.

[0062] In this embodiment, the first heat sink 13 and the second heat sink 14 located on the back surface 112 mainly dissipate heat from these heat sources 12 located on the front surface 111, but this is not limiting. The first heat sink 13 and the second heat sink 14 may also dissipate heat from the heat sources 12 located on the back surface 112, as long as the heat sources 12 located on the back surface 112 are thermally coupled to the first heat sink 13 and the second heat sink 14.

[0063] Such as Figure 4As shown. The first heat sink 13 and the second heat sink 14 dissipate heat from these heat sources 12 in the same way. That is to say, the heat transfer paths from these heat sources 12 to the first heat sink 13 are similar to those of the second heat sink 14. Therefore, the following will take the second heat sink 14 as an example for illustration. When these heat sources 12 operate to generate heat, first, these heat sources 12 located on the front surface 111 will transfer heat to the heat conduction layer 15 and the solder paste layer 17 located on the back surface 112 along direction A through these heat conduction parts 122. Then, the heat conduction layer 15 and the solder paste layer 17 will transfer heat to the second heat sink 14 located on the back surface 112 along direction B. In this way, the second heat sink 14 can dissipate heat from these heat sources 12.

[0064] In this embodiment, the first heat sink 13 and the second heat sink 14 are separated from these heat conduction parts 122 and are thermally coupled to these heat conduction parts 122 through the heat conduction layer 15, but not limited thereto. In other embodiments, please refer to Figure 6 . Figure 6 It is a schematic cross-sectional view of a circuit board assembly according to the second embodiment of the present invention.

[0065] The circuit board assembly 10A of this embodiment is similar to the circuit board assembly 10 of the first embodiment. Therefore, the following will describe the differences between this embodiment and the first embodiment, and the same parts will not be described again. In this embodiment, the heat source 12A of the circuit board assembly 10A is directly connected to the heat sink 16 through the heat conduction part 122A and is thermally coupled. In this way, when the heat source 12A located on the front surface 111 operates to generate heat, the heat can be directly transferred to the heat sink 16 located on the back surface 112 through the heat conduction part 122A for heat dissipation.

[0066] For the circuit board assembly according to the above embodiment, since the heat source, the first heat sink and the second heat sink are respectively arranged on the front and back surfaces of the substrate, and the first heat sink and the second heat sink are mounted on the substrate through surface mounting technology instead of being fixed by screws, the arrangement of the first heat sink and the second heat sink is not limited by the position of the screw holes, and there are no gaps between the first heat sink and the second heat sink and the heat source because they are connected by solder, so that the first heat sink and the second heat sink can be closely attached to the heat source. In this way, the flexibility of the setting of the first heat sink and the second heat sink can be improved, and the heat dissipation effect of the first heat sink and the second heat sink located on the back surface on the heat source located on the front surface can be avoided from being reduced.

[0067] Although the present invention is disclosed as the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the relevant art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification.

Claims

1. A circuit board assembly, characterized in that, Comprising: A substrate having a front side and a back side, the front side and the back side facing away from each other; At least one heat source including a heating part and at least one heat conducting part, the heating part being disposed on the front side and connected to the at least one heat conducting part, the at least one heat conducting part penetrating from the front side to the back side; and At least one heat sink fixedly disposed on the back side through a solder paste layer and thermally coupled to the at least one heat conducting part.

2. The circuit board assembly according to claim 1, characterized in that, The at least one heat sink is connected to the at least one heat conducting part.

3. The circuit board assembly according to claim 1, wherein Further comprising a heat conducting layer disposed on the back side, and the at least one heat conducting part protruding from the back side and being separated from the at least one heat sink, the at least one heat sink being thermally coupled to the at least one heat conducting part through the heat conducting layer.

4. The circuit board assembly according to claim 1, characterized in that, The substrate includes at least one first positioning structure, the at least one heat sink includes at least one second positioning structure, and the at least one second positioning structure is in concave-convex matching with the at least one first positioning structure, the at least one second positioning structure being disposed on the at least one first positioning structure to position the at least one heat sink on the substrate.

5. The circuit board assembly according to claim 4, wherein The number of the at least one first positioning structure and the number of the at least one second positioning structure are each two.

6. The circuit board assembly according to claim 4, wherein The at least one first positioning structure is a positioning groove, and the at least one second positioning structure is a positioning bump.

7. The circuit board assembly according to claim 1, wherein The at least one heat sink includes a first extension part, a second extension part, a third extension part and a connecting part, the first extension part, the second extension part and the third extension part being connected to the connecting part and perpendicular to the connecting part, the second extension part being located between the first extension part and the third extension part, and the first extension part, the second extension part, the third extension part and the connecting part being coplanar.

8. The circuit board assembly according to claim 7, wherein The at least one heat sink further includes a fourth extension part connected to one end of the first extension part away from the connecting part and located on a side of the first extension part close to the second extension part and the third extension part, the fourth extension part being perpendicular to the first extension part, and the first extension part, the second extension part, the third extension part, the fourth extension part and the connecting part being coplanar.

9. The circuit board assembly according to claim 8, wherein, One side of the third extension part away from the first extension part and the second extension part has at least one relief notch for making way for at least one electronic component to be disposed on the substrate.

10. The circuit board assembly according to claim 9, characterized in that, The number of the at least one heat conducting part is multiple, and at least some of the heat conducting parts are respectively located between the first extension part and the second extension part and between the second extension part and the third extension part.

11. The circuit board assembly according to claim 1, wherein The at least one heat sink includes an annular main body part and a hollow part, the annular main body part surrounding the hollow part.

12. The circuit board assembly according to claim 11, wherein, The number of the at least one heat conducting part is multiple, the heat conducting parts protruding from the back side, and the annular main body part separating the heat conducting parts so that the heat conducting parts are respectively located on opposite sides of the hollow part and the annular main body part.

13. The circuit board assembly according to claim 1, wherein The at least one heat conducting part is a heat conducting pin.

14. The circuit board assembly according to claim 3, wherein At least part of the solder paste layer covers the heat conducting layer.

15. The circuit board assembly according to claim 1, wherein Further comprising a printing layer, at least part of the printing layer covering the heat conducting layer for electrical insulation through the printing layer.

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