PCB (Printed Circuit Board) processing equipment and PCB processing method thereof

Abstract

The invention discloses processing equipment for a PCB (Printed Circuit Board) and a PCB processing method thereof. A machine body is provided with a processing platform; the machining platform moves in the first direction; the cross beam is arranged on the machine body and extends in the second direction, and part of the cross beam is located above the machining platform; the machining assembly is movably arranged on the cross beam in the second direction. Each machining assembly at least comprises two main shafts, and the main shafts are constructed to be used for machining the PCB on the machining platform; according to the PCB machining equipment, by arranging the movable machining platform and the cutters installed on the machining platform, the occupied area during operation of the PCB machining equipment can be reduced, peripheral holes and asymmetric areas are machined through a single shaft through the machining assembly, the machining efficiency is improved, the machining cost is reduced, and the machining efficiency is improved. Only the service life of the machining shaft cutter is calculated, and cutter waste is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB processing, and in particular to a processing device for PCB and a PCB board processing method thereof. Background Art

[0002] With the rapid development of the PCB industry, in order to improve the processing efficiency and maximize the use of site space, a PCB drilling machine with single table and dual-axis processing has been newly introduced. The entire table processing area is completed by the coordinated cooperation of two main shafts, and the stroke of each main shaft is two-thirds of the entire table. For the peripheral holes of the PCB board, the two main shafts grasp the tools simultaneously. When the first main shaft processes the peripheral holes within the first main shaft area and then retracts the tool, the tool in the second main shaft also retracts synchronously. Similarly, when the second main shaft processes the peripheral holes in the second main shaft area, the tool of the first main shaft also works in the same principle.

[0003] For the peripheral holes of the PCB board, the two main shafts grasp the tools simultaneously. After the first main shaft finishes processing the peripheral hole area and retracts the tool, the tool in the second main shaft also retracts synchronously, and the tool life is correspondingly reduced. When changing the tool, the number of holes drilled by the two main shafts will be compared, and then the larger value of the two will be taken as the new number of holes drilled by the two main shafts to reduce frequent tool changes and facilitate tool management. Therefore, when the tool life of the second main shaft reaches, although the tool in the first main shaft has not been used, it is also marked as having reached the life after tool change, so it will cause waste of the corresponding tool life. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides a processing device for PCB, which can reduce the waste of tool processing.

[0005] A fuselage, on which a processing platform is provided; the processing platform moves along a first direction;

[0006] A cross beam, which is arranged on the fuselage, extends along a second direction, and a part of the cross beam is located above the processing platform;

[0007] A processing component, which is movably arranged on the cross beam along the second direction; each processing component at least includes two main shafts, and the main shafts are configured to process the PCB board on the processing platform;

[0008] A tool disc, which is installed on the processing platform and is configured to place the tools required for the main shaft processing.

[0009] The processing equipment for PCB according to an embodiment of the present invention can reduce the floor area during the operation of the PCB processing equipment and improve the utilization rate of the site by setting a movable processing platform and a tool mounted on the processing platform. By processing only the peripheral holes and the asymmetric areas with a single axis by the processing component and only calculating the tool life of the processing axis tool, the waste of tools is reduced.

[0010] In addition, the processing equipment for PCB according to the present invention may further have the following additional technical features:

[0011] In some embodiments, each of the main shafts corresponds to a tool disc, and the number of the tool discs is the same as the number of the main shafts.

[0012] In some embodiments, a tool accommodating cavity is provided in the tool disc, and the number of tools accommodated in the accommodating cavities of two adjacent tool discs is different.

[0013] In some embodiments, along the second direction, a second driving component is further included, and the second driving component is used to drive the processing component to move along the second direction, and the second driving component is located on the cross beam;

[0014] A first guide rail is further included: the first guide rail is provided on the cross beam, the second driving component drives the processing component to move along the second direction on the first guide rail, and the second driving component drives the processing component to move along the second direction on the guide rail.

[0015] In some embodiments, the main shaft includes a main shaft motor, and the main shaft motor is used to control its main shaft to move along the third direction.

[0016] To achieve the above object, an embodiment of the second aspect of the present invention proposes a processing method for a PCB board, which is applied to the above-mentioned processing equipment for PCB. The main shafts of the processing component include a first main shaft and a second main shaft; the processing method is characterized in that the processing method includes:

[0017] Determine the layout of the sheet material on the processing platform; determine the first processing area and the second processing area;

[0018] Control the first main shaft and the second main shaft to simultaneously process the first processing area;

[0019] Control the first main shaft and the second main shaft to move to the tool disc to change the tool

[0020] Turn off the first main shaft, and control the second main shaft to process the second processing area;

[0021] Control the second main shaft to move to the tool disc to change the tool.

[0022] In some embodiments, the tool disc further includes a first tool disc and a second tool disc, and one spindle corresponds to one tool disc; the method for controlling the first spindle and the second spindle to replace tools on the tool disc further includes:

[0023] Calculate the processing quantities of the first spindle and the second spindle respectively;

[0024] After comparing the processing quantity of the first spindle and the processing quantity of the second spindle, take the maximum value of the processing quantities between the first spindle and the second spindle; calculate the maximum tool life value according to the maximum value

[0025] Compare the maximum life value with the available tool life value; if the maximum life value ≥ the available tool life value, control the first spindle and the second spindle to move to the first tool disc and the second tool disc respectively for tool change;

[0026] If the maximum life value < the available tool life value, the first spindle and the second spindle can be controlled to continue processing.

[0027] In some embodiments, the tool disc further includes a first tool disc and a second tool disc; the method for controlling the second spindle to move to the tool disc for tool change further includes;

[0028] Calculate the processing quantity of the second spindle; calculate its life value according to the processing quantity of the second spindle;

[0029] Compare the life value of the second spindle with the available tool life value; if the life value of the second spindle ≥ the available tool life value, control the second spindle to move to the second tool disc for tool change;

[0030] If the life value of the second spindle < the available tool life value, the second spindle can be controlled to continue processing.

[0031] In some embodiments, the number of tools accommodated in the accommodation cavity of the second tool disc is greater than the number of tools accommodated in the accommodation cavity of the first tool disc.

[0032] In some embodiments, the method for controlling the first spindle and the second spindle to simultaneously process the second processing area further includes; adjusting the axial distance between the first spindle and the second spindle.

[0033] In some embodiments, the method for closing the first spindle and controlling the second spindle to process the first processing area further includes; turning off the spindle motor of the first spindle.

[0034] The second spindle performs full-table processing. For the peripheral holes, the processing components are saved from frequently switching the spindles to process their respective processing areas. The single-lined area and the peripheral holes are processed separately by the second spindle, and only the tool life of the second spindle is calculated, reducing tool waste.

[0035] At the corresponding position of the first tool disc corresponding to the first main shaft, there is no need to place a tool, which reduces the time for manual tool arrangement.

[0036] Additional aspects and advantages of the present invention will be given in part in the following description, will become apparent in part from the following description, or will be learned through the practice of the present invention. Description of the Drawings

[0037] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0038] Figure 1 is a perspective view of a processing device for a PCB according to a first embodiment of the present invention;

[0039] Figure 2 is a flow perspective view of a processing method for a PCB according to a second embodiment of the present invention;

[0040] Figure 3 is a schematic layout diagram of a processing area of a processing platform according to the first and second embodiments of the present invention.

[0041] Reference Numerals:

[0042] 1, fuselage; 11, processing platform; 12, first processing area; 13, second processing area; 14, first drive assembly; 2, cross beam; 3, tool disc; 4, processing assembly; 41, main shaft; 42, main shaft motor. Detailed Description of the Embodiments

[0043] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0044] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0045] In addition, the terms "second", "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "second", "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality of" means two or more unless otherwise specifically defined.

[0046] In the present invention, unless otherwise clearly specified and defined, terms such as "mounted", "connected", "connected to", "fixed" and the like should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection, an electrical connection, or a communication connection; it may be directly connected, or indirectly connected through an intermediate medium, and may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] The following refers to the attached Figure 1 Describe a processing device for a PCB according to an embodiment of the present invention.

[0048] It should be noted that the first direction refers to Figure 1 The X direction shown may be the front-back direction, the second direction refers to Figure 1 The Y direction shown may be the left-right direction, and the third direction refers to Figure 1 The Z direction shown may be the up-down direction.

[0049] As Figure 1 shown, a processing device for a PCB according to an embodiment of the present invention: a fuselage 1, on which a processing platform 11 is provided; the processing platform 11 moves along the first direction;

[0050] A cross beam 2, which is provided on the fuselage 1, extends along the second direction, and a part of the cross beam 2 is located above the processing platform 11;

[0051] A processing assembly 4, which is movably provided on the cross beam 2 along the second direction; each processing assembly 4 includes at least two spindles 41, and the spindles 41 are configured to process the PCB sheet on the processing platform 11; a plurality of spindles 41 can process the PCB at the same time, thereby improving the production efficiency of the processing device for the PCB

[0052] A tool disc 3, which is installed on the processing platform 11 and is configured to place the tools required for the spindles 41 to process.

[0053] Specifically, referring to the attached Figure 1As shown, a processing platform 11 is provided on the fuselage 1. The fuselage 1 is used to support the processing platform 11 to improve the position stability of the processing platform 11, thereby making the overall structure of the processing equipment stable and improving the processing quality of the processing equipment. A PCB board is suitable to be placed on the processing platform 11. The processing platform 11 can play a role in supporting the PCB board, and further make the position of the PCB board stable, facilitating the subsequent processing of the PCB board.

[0054] Furthermore, a first driving component 14 is further included. The first driving component 14 is used to drive the processing platform 11 to move along the first direction, thereby realizing the movability of the processing platform 11 in the second direction, so that the PCB board material installed on the processing platform 11 can also move in the first direction, facilitating the processing of the PCB board placed above the processing platform 11.

[0055] Furthermore, referring to Att Figure 1 、Att Figure 3 As shown, a cross beam 2 is provided on the fuselage 1, so that the cross beam 2 can be supported by the fuselage 1. The cross beam 2 extends along the second direction, and a part of the cross beam 2 is located above the processing platform 11. The processing component 4 is movably arranged on the cross beam 2 along the third direction. At the same time, the processing component 4 is movable in the second direction, facilitating the processing of the PCB board placed above the processing platform 11. Among them, the third direction and the second direction are perpendicular to each other.

[0056] Among them, a first driving component 14 is further included. The first driving component 14 is used to drive the processing platform 11 to move along the first direction, thereby realizing the movability of the processing component 4 in two directions, namely the third direction and the second direction, facilitating the processing component 4 to process the PCB board placed above the processing platform 11. Among them, the third direction and the second direction are perpendicular to each other.

[0057] For example, in the Figure 1 shown example, there are multiple processing platforms 11. The multiple processing platforms 11 are spaced apart in the second direction. Each processing platform 11 is provided with a processing component 4. Each processing component 4 includes at least two spindles 41. The spindles 41 are configured to process the PCB board material on the processing platform 11. The processing component 4 is used to process the PCB board material in its corresponding processing platform 11.

[0058] Among them, each processing component 4 includes at least two spindles 41, and at least one of the spindles 41 can process the entire processing platform 11. Specifically: the movable distance of the processing platform 11 in the second direction > the length of the working platform in the second direction;

[0059] The movable distance of the processing platform 11 in the second direction > the sum of the lengths of the working platform and the processing component 4 in the second direction, that is, at least the movable distance of one spindle 41 in the second direction ≥ the length of the processing platform 11 in the second direction;

[0060] Cooperating in this way enables one of the main spindles 41 to be closed, and the machining platform 11 moving along the second direction, thereby realizing the sheet metal processing of the entire machining platform 11.

[0061] Furthermore, a tool disc 3 is installed on the machining platform 11. The tool disc 3 is configured to place the tools required for the machining of the main spindle 41. When the tool on the main spindle 41 finishes machining the PCB sheet metal and the tool reaches a certain service life or is damaged, it needs to be replaced on the tool disc 3. Generally, the tool disc 3 is provided with a new tool area and an old tool area.

[0062] At the same time, it should be noted that for better machining of the sheet metal and the relationships such as the size and quantity of the sheet metal to be machined; and the area of the machining platform 11 is fixed. Generally, the sheet metal layout will be carried out according to actual requirements.

[0063] In this embodiment, in combination with Figure 3 As shown: The machining layout on the machining platform 11 includes a first machining area 12 and a second machining area 13: The first machining area 12 is the area where the main spindles 41 in the machining assembly 4 machine simultaneously; The second machining area 13 is the area where the main spindles 41 in the machining assembly 4 need to machine separately and the peripheral holes.

[0064] For the convenience of understanding, the main spindle 41 in the second machining area 13 is called the second main spindle, and the other main spindles 41 that do not need to machine in the second area are called the first main spindles;

[0065] For the PCB board with odd layout: The symmetric layout area is the first machining area 12. The first main spindle and the second main spindle in the machining assembly 4 change tools simultaneously to machine the PCB sheet metal material in the first machining area 12, and the tool lives of the two main spindles 41 are calculated synchronously. And when the tool life reaches a certain level or the tool is damaged, the two main spindles 41 move to the tool disc 3 for tool replacement. The single layout area and the peripheral holes, that is, the second machining area 13, are machined separately by the second main spindle, and the first main spindle is closed. The first main spindle does not need to change tools, and the second main spindle changes tools separately. According to the principle of taking the maximum value of the main spindles 41 in the machining assembly 4 for the tool life, the loss of the tool life on the second main spindle is calculated throughout the process.

[0066] For the PCB board with even layout: The main spindles 41 in the machining assembly 4 change tools simultaneously for machining, and the tool lives of the main spindles 41 in the machining assembly 4 are calculated synchronously. The peripheral holes, that is, the second machining area 13, are machined separately by one of the main spindles 41, and the other main spindles 41 are closed. The other main spindles 41 do not need to change tools. One of the main spindles 41 changes tools separately. According to the principle of taking the maximum value of the main spindles 41 in the machining assembly 4 for the tool life, the loss of the tool life of one of the main spindles 41 is calculated throughout the process. For the non-machining area or the peripheral holes in the machining area, the frequent switching of the main spindles 41 to machine their respective machining areas is omitted.

[0067] Compared with the processing method of simultaneously processing sheet materials with two axes in the prior art, under the condition of the same processing stroke, it avoids the situation where when the tool life of the tool on the processing spindle 41 reaches, although the tools in the remaining spindles 41 are not used, they are also marked as having reached the life after tool change, so it will cause waste of the corresponding tool life, improves the utilization rate of the tool, and can reduce the waste of processing tools and the tool cost of PCB processing sheet materials.

[0068] The processing equipment for PCB according to the embodiment of the present invention realizes the comprehensive processing of the PCB board on the processing platform 11 by setting a movable processing platform 11 and cooperating with the processing component 4 on the cross beam 2. At the same time, a tool disc 3 is arranged on the processing platform 11, which can reduce the floor area when changing tools of the PCB processing equipment, improve the utilization rate of the site and the tool change sales volume, and can also improve the processing efficiency of the processing component 4, improve the accuracy of the position of the PCB board and the processing precision of the PCB board.

[0069] In some embodiments of the present invention, refer to the attached Figure 1 As shown, each spindle 41 corresponds to a tool disc 3, and the number of tool discs 3 is consistent with the number of spindles 41. According to different processing requirements, tool wear and usage degrees of each spindle 41, the number of tools in the tool disc 3 is different. According to actual requirements, each spindle 41 corresponds to a tool disc 3. After the spindle 41 finishes processing, it moves to the tool disc 3 for replacement, which is convenient for replacing the tool disc 3 at the same time.

[0070] In some embodiments of the present invention, a tool disc 3 is also arranged on the fuselage 1. Refer to the attached Figure 1 As shown, the tool disc 3 is arranged at one end of the fuselage 1 along the first direction and on the side facing the processing component 4. The tool disc 3 is used to provide tools for processing the PCB board.

[0071] In some embodiments of the present invention, a tool accommodation cavity is arranged in the tool disc 3, and the number of tools accommodated in the accommodation cavities of adjacent two tool discs 3 is different. The tool accommodation cavity in the tool disc 3 is configured to place tools. Specifically, the accommodation cavity of the tool disc 3 is divided into multiple intervals, and each interval is used to place tools. Further, a guiding structure can be arranged in each interval, and the guiding structure enables the tools to be placed better.

[0072] Among them, since the tool processing frequencies of the first spindle and the second spindle in the processing component 4 are different, their tool replacement frequencies are different, and the number of tools that can be accommodated in the tool accommodation cavities corresponding to the first spindle and the second spindle is also different.

[0073] Further: along the second direction, there is also a second driving assembly which is used to drive the processing assembly 4 to move along the second direction, and the second driving assembly is located on the cross beam 2; specifically: there is a first guide rail extending along the second direction on one of the cross beams 2, and a second driving assembly installed on the cross beam 2. Driven by the second driving assembly, the processing assembly 4 can move along the first guide rail in the second direction, and it is ensured that the processing assembly 4 will not deviate from the established route during the movement, so as to effectively and accurately drive the main shaft 41 to move along the second direction by using the processing assembly 4, thereby ensuring the accuracy of the position of the processing assembly 4.

[0074] In another embodiment, the processing assembly 4 is arranged on a mounting plate. One side of the mounting plate is provided with a slider which is slidably arranged on the first guide rail. Driven by the second driving assembly, the mounting plate drives the processing assembly 4 to move along the second direction. The second driving assembly is arranged on the cross beam 2, and the second driving assembly is connected to the mounting plate to drive the support plate to move along the second direction, thereby realizing the automatic control of the movement of the processing assembly 4 in the second direction, facilitating the processing of the PCB board placed above the processing platform 11, and improving the processing efficiency.

[0075] In a further embodiment of the present invention, refer to the attached Figure 1 and the attached Figure 3 As shown, along the second direction, the second driving assembly is located in the middle part of the cross beam 2, which can make the driving effect on the cross beam 2 in the second direction more balanced, avoid the unequal driving forces received at both ends of the length direction of the cross beam 2, and further cause the cross beam 2 to tilt in the second direction. There are two first guide rails which are respectively located at both ends of the length direction of the cross beam 2, which can further ensure that the cross beam 2 will not deviate from the established route during the movement, thereby ensuring the accuracy of the position of the processing assembly 4.

[0076] One of the processing assembly 4 and the cross beam 2 is provided with a first guide rail extending along the second direction, and the other is provided with a first guide groove matching with the first guide rail, so that the processing assembly 4 can move along the second direction, and it is ensured that the support plate will not deviate from the established route during the movement, so as to effectively and accurately drive the processing assembly 4 to move along the second direction by using the support plate, thereby ensuring the accuracy of the position of the processing assembly 4.

[0077] In a further embodiment of the present invention, along the second direction, there are two second driving components, which are respectively located at both ends of the cross beam 2 in the length direction, and there is one first guide rail located in the middle of the cross beam 2. The two second driving components drive the cross beam 2 respectively from both ends of the cross beam 2 in the length direction, so that the load of each second driving component is relatively small, which can improve the performance of the stable movement of the cross beam 2, ensure the movement accuracy while accelerating the moving speed of the cross beam 2, thereby improving the moving speed of the processing component 4 and the accuracy of the position after movement, and further improving the processing efficiency and processing quality of the processing equipment for PCB.

[0078] Optionally, the second driving component can be a linear motor or a transmission system composed of a rotary motor and a lead screw, and no more restrictions are made here.

[0079] In some embodiments, the processing component 4 includes a plurality of spindles 41, and a spindle motor 42 is arranged on each spindle 41. Each spindle motor 42 can control the spindle 41 to move independently along the third guide rail in the third direction.

[0080] In another embodiment, a second guide rail can also be arranged on the mounting plate. The processing component 4 is arranged on a mounting plate. The processing component 4 includes a plurality of spindles 41, and a spindle motor 42 is arranged on each spindle 41. Each spindle motor 42 can control the spindle 41 to move independently along the second guide rail in the second direction. A slider is arranged on one side of the mounting plate, and the slider is slidably arranged on the second guide rail. Driven by the second driving component, the mounting plate drives the processing component 4 to move along the second direction.

[0081] In another embodiment, the processing component 4 is arranged on a mounting plate. A slider is arranged on one side of the mounting plate, and the slider is slidably arranged on the second guide rail. Driven by the second driving component, the mounting plate drives the processing component 4 to move along the second direction. The second driving component is arranged on the cross beam 2, and the second driving component is connected to the mounting plate to drive the support plate to move along the second direction, thereby realizing the automatic control of the movement of the processing component 4 in the second direction, facilitating the processing of the PCB board placed above the processing platform 11, and improving the processing efficiency.

[0082] The spindle 41 includes a spindle motor 42, and the spindle motor 42 is used to control its spindle 41 to move along the direction. Each spindle 41 is provided with a spindle motor 42. The driving component is arranged on the cross beam 2, and the spindle motor 42 is connected to the processing component 4 to drive the processing component 4 to move along the direction, thereby realizing the automatic control of the movement of the processing component 4 in the direction, facilitating the processing of the PCB board placed above the processing platform 11.

[0083] One of the spindle motor 42 and the crossbeam 2 is provided with a third guide rail extending in the third direction, and the other is provided with a third guide groove cooperating with the third guide rail, so that the spindle 41 can move along the third direction and ensure that the spindle 41 does not deviate from the established route during the movement, so as to effectively and accurately drive the processing component 4 to move along the third direction by using the support plate, thereby ensuring the accuracy of the position of the processing component 4.

[0084] Optionally, the spindle motor 42 can be a linear motor or a transmission system composed of a rotary motor and a lead screw, and no more restrictions are made here.

[0085] Of course, the present invention is not limited thereto. The connection between the crossbeam 2 and the fuselage 1 is not limited to the form of a guide rail, and can also be connected in a pneumatic floating form.

[0086] The second embodiment, in combination with Figures 1-3 ; In order to solve the problem that when multi-axis machining is performed, when the tool life of the second spindle reaches, although the tool in the first spindle has not been used, it is also marked that the tool life has reached after tool change, so it will cause waste of the corresponding tool life; A PCB board processing method is provided in the present invention. The processing equipment for PCB described above, the spindle 41 of the processing component 4 includes a first spindle and a second spindle; characterized in that the method includes:

[0087] Determine the layout of the sheet material on the processing platform 11; determine the first processing area 12 and the second processing area 13

[0088] Control the first spindle and the second spindle to simultaneously machine the first processing area 12;

[0089] Control the first spindle and the second spindle to the tool turret 3 to change the tool

[0090] Turn off the first spindle and control the second spindle to machine the second processing area 13;

[0091] Control the second spindle to move to the tool turret 3 to change the tool.

[0092] It can be understood that the processing arrangement on the processing platform 11 includes a first processing area 12 and a second processing area 13: the first processing area 12 is the area where the spindles 41 in the processing component 4 are simultaneously machined; the second processing area 13 is the area where the spindles 41 in the processing component 4 need to be individually machined and the peripheral holes.

[0093] For the convenience of understanding, the first processing area 12 of the spindle 41 is called the second spindle, and the remaining spindles 41 that do not need to process the second area are called the first spindles.

[0094] In this example, for the full-table machining of the second spindle, for the peripheral holes, the time for frequently switching the spindle 41 in the machining component 4 to machine their respective machining areas is saved. At the same time, the second machining area 13 and the peripheral holes are machined separately by the second spindle, and only the tool life of the second spindle is calculated, reducing the waste of the tools of the first spindle.

[0095] In this embodiment, first, determine the layout of the PCB sheet machining to determine whether it is an odd layout or an even layout; this embodiment adopts an odd layout.

[0096] The symmetric layout area is the first machining area 12. Control the first spindle and the second spindle to machine the first machining area 12 simultaneously, and calculate the tool lives of the first spindle and the second spindle synchronously. Then control the first spindle and the second spindle to move to the tool disc 3 to change tools.

[0097] Then turn off the first spindle, and control the second spindle to machine the second machining area 13 and the peripheral holes separately. Without changing the tools for the first spindle, control the second spindle to move to the tool disc 3 to change tools alone.

[0098] In some other embodiments, for the PCB board with an even layout:

[0099] First, the first spindle and the second spindle machine the first machining area 12 simultaneously. Then calculate the tool lives of the first spindle and the second spindle synchronously, and control the first spindle and the second spindle to move to the tool disc 3 to change tools. Then turn off the first spindle and control the second spindle to machine the peripheral holes, i.e., the second machining area 13, separately. Without changing the tools for the first spindle and the second spindle. The second spindle changes tools alone. According to the principle of taking the maximum value of the tool lives of the first spindle and the second spindle, calculate the loss of the tool life of the second spindle throughout the process.

[0100] In some embodiments, the tool disc 3 further includes at least a second tool disc and a second tool disc, and one spindle 41 corresponds to one tool disc 3. The method for controlling the first spindle and the second spindle to move to the tool disc 3 to change tools further includes:

[0101] Calculate the drilling numbers of the first spindle and the second spindle respectively.

[0102] After comparing the drilling number of the second spindle with the drilling number of the second spindle, take the maximum value of the drilling numbers of the first spindle and the second spindle; calculate the maximum life value according to the maximum value.

[0103] Compare the maximum life value with the available tool life value; if the maximum life value ≥ the available tool life value, then control the first spindle and the second spindle to move to the second tool disc and the second tool disc respectively to change tools.

[0104] If the maximum life value < the available tool life value, then control the first spindle and the second spindle to continue machining.

[0105] Among them, the number of tool holders of the first tool disc and the second tool disc is proportional to the machining amount of their first main shaft and second main shaft.

[0106] In this way, since the first main shaft does not need to machine the second machining area 13, the number of tools used by the first main shaft is less, so that there is no need to place tools at the corresponding position of the first tool disc, reducing the time for manual tool arrangement.

[0107] The tool life method is as follows: based on the principle of the maximum value of the main shaft 41 in the machining component 4, when the main shafts 41 of the machining component 4 are machining simultaneously and the maximum value of one of the main shafts 41 reaches the available life value of the tool, it is recommended to replace the tool.

[0108] Among them, each main shaft 41 corresponds to a tool disc 3. On the one hand, it is beneficial to the replacement of the tool disc 3. After the tools in the tool disc 3 corresponding to a certain main shaft 41 are replaced, only the tool disc 3 corresponding to its main shaft 41 needs to be replaced. On the other hand, it is beneficial to the installation of the tool disc 3. The tool disc 3 corresponding to the main shaft 41 is smaller in volume and easier to install; it is more convenient for the PCB processing device to place the tool disc 3, without the need to specifically reserve a large space for the tool disc 3, increasing the utilization rate of the tool disc 3. At the same time, each main shaft 41 corresponding to a tool disc 3 can perform tool layout according to the use and wear rate of the tool disc 3 of its main shaft 41, reducing the time for manual tool arrangement.

[0109] Furthermore, the tool disc 3 also includes a second tool disc and a second tool disc; the method for controlling the second main shaft to move to the tool disc 3 for tool replacement also includes;

[0110] Calculate the number of drill holes of the second main shaft; calculate its life value according to the number of drill holes of the second main shaft;

[0111] Compare the life value of the second main shaft with the available life value of the tool; if the life value of the second main shaft ≥ the available life value of the tool, control the second main shaft to move to the second tool disc for tool replacement;

[0112] If the life value of the second main shaft < the available life value of the tool, control the second main shaft to continue machining.

[0113] Furthermore, the number of tools accommodated in the accommodation cavity of the second tool disc is greater than the number of tools accommodated in the accommodation cavity of the second tool disc. Due to the different machining amounts of the first main shaft and the second main shaft, the first main shaft does not need to machine the second machining area 13, so that the number of tools used by the first main shaft is less, and there is no need to place tools at the corresponding position of the accommodation cavity in its first tool disc, reducing the time for manual tool arrangement. The second main shaft needs to machine the second machining area 13, so that the number of tools used by the second main shaft is more, and tools need to be placed at the corresponding position of the accommodation cavity in its second tool disc.

[0114] Further, the method for controlling the first main shaft and the second main shaft to simultaneously machine the second machining area 13 further includes: adjusting the axial distance between the first main shaft and the second main shaft. According to the arrangement of the PCB boards on the machining platform 11, the axial distance between the first main shaft and the second main shaft is adjusted so that the machining assembly 4 can machine the PCB boards better.

[0115] Further, the method for closing the first main shaft and controlling the second main shaft to machine the second machining area 13 further includes: turning off the main shaft motor 42 of the first main shaft. When the second main shaft machines the second machining area 13 alone, the first main shaft and the second main shaft will move simultaneously along the second direction. By turning off the main shaft motor 42 of the first main shaft, when the second main shaft moves up and down along the third direction to machine the PCB board material, the main shaft motor 42 of the first main shaft is in the off state, and the first main shaft cannot move up and down along the third direction. In this way, the first main shaft cannot machine the PCB board material in the second machining area 13, that is, the second main shaft alone realizes machining of the second machining area 13. The fact that the first main shaft and the second main shaft move simultaneously along the second direction is beneficial to prevent the first main shaft and the second main shaft from colliding or interfering with each other during the movement.

[0116] Further, each machining assembly 4 includes at least two main shafts 41, and at least one of the main shafts 41 can machine the entire machining platform 11. Specifically: the movable distance of the machining platform 11 in the second direction > the length of the working platform in the second direction.

[0117] The movable distance of the machining platform 11 in the second direction > the sum of the lengths of the working platform and the machining assembly 4 in the second direction, that is, at least the movable distance of one main shaft 41 in the second direction ≥ the length of the machining platform 11 in the second direction.

[0118] This cooperation enables turning off one of the main shafts 41 and cooperating with the machining platform 11 moving along the second direction to realize machining of the board material on the entire machining platform 11.

[0119] The other components and operations of the PCB processing equipment according to the embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail here.

[0120] The other components and operations of the PCB processing equipment according to the embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail here.

[0121] In the description of this specification, the descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0122] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A processing device for a PCB, characterized in that, Comprising: A fuselage, on which a processing platform is provided; the processing platform moves along a first direction; A cross beam, which is arranged on the fuselage, extends along a second direction, and a part of the cross beam is located above the processing platform; A processing component, which is movably arranged on the cross beam along the second direction; each processing component includes at least two spindles, and the spindles are configured to process PCB blanks on the processing platform; A tool disc, which is installed on the processing platform and is configured to place the tools required for the spindle processing.

2. The processing device for PCB according to claim 1, wherein, Each spindle corresponds to one tool disc, and the number of tool discs is the same as the number of spindles.

3. The processing device for PCB according to claim 1, characterized in that, A tool accommodation cavity is arranged in the tool disc, and the number of tools accommodated in the accommodation cavities of two adjacent tool discs is different.

4. The processing equipment for PCB according to claim 1, characterized in that, Along the second direction, a second driving component is further included, and the second driving component is used to drive the processing component to move along the second direction, and the second driving component is located on the cross beam; A first guide rail is further included: the first guide rail is arranged on the cross beam, and the second driving component drives the processing component to move along the second direction on the first guide rail, and the second driving component drives the processing component to move along the second direction on the guide rail.

5. The processing device for PCB according to claim 1, wherein The spindle includes a spindle motor, and the spindle motor is used to control its spindle to move along a third direction.

6. A processing method for a PCB board, which is applied to the processing equipment for PCB according to any one of claims 1-5, and the main shafts of the processing components include a first main shaft and a second main shaft; characterized in that, The processing method includes: Determine the blank layout on the processing platform; determine the first processing area and the second processing area; Control the first spindle and the second spindle to simultaneously process the first processing area; Control the first spindle and the second spindle to move to the tool disc to change tools Turn off the first spindle, and control the second spindle to process the second processing area; Control the second spindle to move to the tool disc to change tools.

7. The processing method of the PCB board according to claim 6, characterized in that, The tool disc further includes at least a first tool disc and a second tool disc, and one spindle corresponds to one tool disc; the method for controlling the first spindle and the second spindle to move to the tool disc to change tools further includes: Respectively calculate the processing quantities of the first spindle and the second spindle; After comparing the processing quantity of the first spindle and the processing quantity of the second spindle, take the maximum value of the processing quantities between the first spindle and the second spindle; calculate the maximum tool life value according to the maximum value Compare according to the maximum life value and the available tool life value; if the maximum life value ≥ the available tool life value, control the first spindle and the second spindle to move to the first tool disc and the second tool disc respectively to change tools; If the maximum life value < the available tool life value, the first spindle and the second spindle can be controlled to continue processing.

8. The processing method of the PCB board according to claim 6, characterized in that, The tool disc further includes a first tool disc and a second tool disc; the method for controlling the second spindle to move to the tool disc to change tools further includes; Calculate the processing quantity of the second spindle; calculate its life value according to the processing quantity of the second spindle; Compare according to the life value of the second spindle and the available tool life value; if the life value of the second spindle ≥ the available tool life value, control the second spindle to move to the second tool disc to change tools; If the life value of the second spindle < the available tool life value, the second spindle can be controlled to continue processing.

9. The processing method of the PCB board according to claim 8, characterized in that, The number of tools accommodated in the accommodation cavity of the second cutter head is greater than the number of tools accommodated in the accommodation cavity of the first cutter head.

10. The processing method of the PCB board according to claim 6, characterized in that, The method for controlling the first main shaft and the second main shaft to simultaneously machine a first machining area further includes: adjusting the axial spacing between the first main shaft and the second main shaft.

11. The processing method of the PCB board according to claim 6, characterized in that, The method for closing the first main shaft and controlling the second main shaft to machine a first machining area further includes: turning off the main shaft motor of the first main shaft.

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