Control method of needle grinding machine, electronic device, storage medium and needle grinding machine

Abstract

The present invention discloses a control method for a needle grinder, an electronic device, a storage medium, and a needle grinder. The method includes obtaining the arrangement type of the probe tips of the probe card when the probe card has been fixed by a fixing module of the needle grinder; determining a grinding method corresponding to the arrangement type based on the arrangement type and a first preset rule; determining grinding parameters corresponding to the grinding method based on the grinding method and a second preset rule; and controlling the first driving part, the second driving part, and the third driving part of the needle grinder to drive the motion platform to move based on the grinding parameters, so as to grind the probe tips of the probe card using the grinding method corresponding to the probe card. This application determines the grinding method of the probe card based on the arrangement type and the first preset rule, and then controls the needle grinder to grind the probe tips using a suitable grinding method according to the arrangement type of the probe tips of the probe card, thereby avoiding deformation of the probe during the grinding process and improving the grinding effect.

Description

Technical Field

[0001] The present invention relates to the field of high-end equipment manufacturing, and in particular to a control method, electronic equipment, storage medium and needle grinding machine. Background Art

[0002] Currently, the chip industry is booming. During the chip production process, the wafer needs to be inspected before the chip is packaged to avoid further processing of unqualified wafers. A probe card is needed to inspect the wafer. The probe card includes multiple probes. The probes transmit test signals by directly contacting the pads or bumps on the wafer. During the manufacturing process of the probe card, the newly processed probe tips are usually sharper. If they directly contact the wafer, it is easy to cause problems such as virtual connection, poor contact or scratches on the pads, which in turn affects the test accuracy and causes yield loss. Therefore, a needle grinder is needed to grind the needle tip into a spherical or nearly spherical shape to increase the contact area, reduce contact impedance, and ensure test stability.

[0003] Currently, during the grinding process of the probe tip, a motion platform used for grinding is generally controlled to continuously move in a circular motion to grind the probe tip.

[0004] However, there are various types of probe cards and various arrangements of probes. If circular motion grinding is used for all of them, the probes of some arrangements may be easily deformed. Summary of the Invention

[0005] In response to the shortcomings of the existing technology, the present application provides a control method, electronic device, storage medium and needle grinder for a needle grinder, which determines the grinding method of the probe card based on the arrangement type and the first preset rule, determines the grinding parameters according to the grinding method and the second preset rule, and then controls the needle grinder to grind the probe needle tip using a suitable grinding method according to the arrangement type of the probe needle tip of the probe card, thereby avoiding deformation of the probe during the grinding process, thereby improving the grinding effect.

[0006] In order to solve the above problems, the present invention provides the following technical solutions:

[0007] In a first aspect, an embodiment of the present application provides a control method for a needle grinding machine, comprising: when a probe card has been fixed by a fixing module of the needle grinding machine, obtaining an arrangement type of probe tips of the probe card;

[0008] Determining a grinding method corresponding to the arrangement type based on the arrangement type and a first preset rule, wherein the first preset rule includes determining that the grinding method of the probe card is a circular motion grinding method when the arrangement type is a vertical arrangement, and capturing an image of the probe card and determining the grinding method corresponding to the arrangement type based on the image of the probe card when the arrangement type is a linear arrangement or an arc arrangement;

[0009] determining grinding parameters corresponding to the grinding method according to the grinding method and a second preset rule, the grinding parameters including a first motion parameter of a first driving unit of the needle grinder, a first motion parameter of a second driving unit, and a third motion parameter of a third driving unit, wherein the first driving unit is used to drive a motion platform of the needle grinder to move in a first direction, the second driving unit is used to drive the motion platform to move in a second direction, and the third driving unit is used to drive the motion platform to move in a third direction, the first direction, the second direction and the third direction are different from each other, and the motion platform is used to grind the probe tip of the probe card;

[0010] Based on the grinding parameters, the first driving part, the second driving part and the third driving part of the needle grinding machine are controlled to drive the motion platform to move, so as to grind the probe needle tip of the probe card using a grinding method corresponding to the probe card.

[0011] In some embodiments, determining the grinding method corresponding to the arrangement type based on the arrangement type and a first preset rule includes:

[0012] Determining the grinding method corresponding to the arrangement type based on the arrangement type and preset correspondence information between the arrangement type and the grinding method; or

[0013] The arrangement type is displayed, and in response to receiving a grinding mode determination instruction, a grinding mode corresponding to the arrangement type is acquired according to the grinding mode determination instruction.

[0014] In some embodiments, the arrangement type includes a linear arrangement, a vertical arrangement, and an arc arrangement, and determining the grinding method corresponding to the arrangement type based on the arrangement type and the first preset rule includes:

[0015] When the arrangement type is vertical arrangement, determining that the grinding mode of the probe card is a circular motion grinding mode;

[0016] When the arrangement type is the linear arrangement or the arc arrangement, taking an image of the probe card;

[0017] determining, based on the image of the probe card, a first expression for a first line formed by an arrangement of a plurality of probe tips and a second expression for a second line where each probe tip is located;

[0018] A grinding method of the probe card is determined based on the first expression and all of the second expressions.

[0019] In some embodiments, determining a first expression for a first line formed by an arrangement of multiple probe tips and a second expression for a second line where each probe tip is located based on the image of the probe card comprises:

[0020] identifying a plurality of probe feature regions in the image of the probe card, wherein a plurality of probes in each of the probe feature regions are closely adjacent to each other;

[0021] Calculate a first expression of a first line formed by the arrangement of multiple probe tips and a second expression of a second line where each probe is located in each probe feature area;

[0022] The determining of the grinding method of the probe card based on the first expression and all the second expressions includes:

[0023] Determine the grinding mode corresponding to each probe feature region based on the first expression and all the second expressions of each probe feature region;

[0024] The polishing method of the probe card is determined to be polishing using the polishing method corresponding to each probe characteristic area.

[0025] In some embodiments, determining the grinding mode corresponding to each probe characteristic region based on the first expression and all the second expressions for each probe characteristic region includes:

[0026] For each of the probe feature areas, when the arrangement type is the linear arrangement, calculating a third expression for the trend lines of all the second lines based on all the second expressions of the probe feature areas;

[0027] When it is determined based on the third expression and the first expression that the difference between the angle between the trend line of all the second lines and the first line and 90 degrees is less than a preset difference, determining that the grinding method corresponding to the probe characteristic area is a grinding method of linear reciprocating motion along the trend line;

[0028] When the arrangement type is the arc arrangement, the arc of the first line is calculated according to the first expression, and the arc is determined as the rotation angle of the circular motion;

[0029] Calculating expressions of perpendicular lines of the plurality of tangent lines of the first line according to the first expression, and determining trend lines of all the perpendicular lines based on the expressions of all the perpendicular lines, and determining the trend lines of all the perpendicular lines as the straight lines on which the motion directions of the linear reciprocating sub-motion lie, thereby determining the circular sub-motion and the linear reciprocating sub-motion;

[0030] It is determined that the grinding mode corresponding to the characteristic area of ​​the probe is a grinding mode of a composite motion of the circular motion and the linear reciprocating motion.

[0031] In some embodiments, determining the grinding parameters corresponding to the grinding method according to the grinding method and a second preset rule includes:

[0032] Determining the grinding parameters corresponding to the grinding method according to the grinding method and the corresponding relationship information between the preset grinding method and the grinding parameters; or

[0033] displaying the grinding mode, and in response to receiving a grinding parameter determination instruction, acquiring grinding parameters corresponding to the grinding mode according to the grinding parameter determination instruction; or

[0034] Determining the motion trajectory and motion speed of the motion platform according to the grinding method;

[0035] A first motion parameter of the first driving unit, a first motion parameter of the second driving unit, and a third motion parameter of the third driving unit are determined based on the motion trajectory and the motion speed, thereby determining grinding parameters corresponding to the grinding method.

[0036] In some embodiments, determining the motion trajectory and motion speed of the motion platform according to the grinding method includes:

[0037] Determining the motion trajectory and motion speed of the motion platform during the grinding process according to the grinding method;

[0038] Whenever the length of the motion trajectory of the motion platform reaches a preset length, the motion trajectory and motion speed of the motion platform during a non-polishing process are determined according to preset adjustment parameters, so that the motion platform moves a preset distance without contacting the probe card, and then contacts the probe card to continue the polishing process;

[0039] The motion trajectory and motion speed of the motion platform in the entire working process are determined based on the motion trajectory and motion speed of the motion platform in the grinding process and the non-grinding process.

[0040] In a second aspect, an embodiment of the present application provides an electronic device, comprising:

[0041] at least one processor; and,

[0042] a memory communicatively connected to the at least one processor; wherein,

[0043] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the control method of the needle grinding machine as described in the first aspect.

[0044] In a third aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores an executable program, and the executable program is executed by a processor to implement the control method of the needle grinding machine as described in the first aspect.

[0045] In a fourth aspect, an embodiment of the present application provides a needle grinding machine, comprising a main body, the electronic device as described in the second aspect, and a motion module;

[0046] The electronic device is mounted on the main body, and the electronic device is used to control the motion module;

[0047] The motion module includes a motion platform and a driving portion capable of driving the motion platform to move, wherein the motion platform is driven by the driving portion to move to grind the probes of the probe card;

[0048] The driving part includes a first driving part, a second driving part and a third driving part;

[0049] The first driving portion includes a first slider and a first electromagnetic driving member, wherein the first electromagnetic driving member is used to drive the first slider to move along a first direction;

[0050] The second driving portion includes a second slider and a second electromagnetic driving member, and the second electromagnetic driving member is used to drive the second slider to move along the second direction;

[0051] The motion platform is fixedly connected to the first slider of the first driving part, the first driving part is fixedly connected to the second slider of the second driving part, the second driving part is fixedly connected to the third slider of the third driving part, and the third slider can move along a third direction. The first direction, the second direction and the third direction are different from each other.

[0052] The present application provides a control method, electronic device, storage medium and needle grinder for a needle grinder. The present application determines the grinding method of the probe card based on the arrangement type and the first preset rule, determines the grinding parameters according to the grinding method and the second preset rule, and then controls the needle grinder to grind the probe needle tip using a suitable grinding method according to the arrangement type of the probe needle tip of the probe card, which can avoid deformation of the probe during the grinding process, thereby improving the grinding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 It is a flow chart of the control method of the needle grinding machine provided in the embodiment of the present application.

[0054] Figure 2 This is a schematic diagram of an image of a probe card when the arrangement type provided in an embodiment of the present application is a linear arrangement.

[0055] Figure 3 This is a schematic diagram of an image of a probe card when the arrangement type provided in an embodiment of the present application is an arc arrangement.

[0056] Figure 4 This is a structural diagram of an electronic device provided in an embodiment of the present application.

[0057] Figure 5 This is a structural block diagram of a computer-readable storage medium provided in an embodiment of the present application.

[0058] Figure 6 It is a schematic diagram of the three-dimensional structure of the needle grinding machine provided in an embodiment of the present application.

[0059] Figure 7 It is an exploded schematic diagram of the needle grinding machine provided in an embodiment of the present application.

[0060] Figure 8 It is a schematic diagram of the first connecting member, the first driving part and the second driving part of the needle grinding machine provided in an embodiment of the present application.

[0061] Figure 9 It is a schematic diagram of the servo motor, lead screw and vertical motion assembly of the third drive unit of the needle grinding machine provided in an embodiment of the present application. DETAILED DESCRIPTION

[0062] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0063] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0064] The present application provides a control method, electronic device, storage medium and needle grinder for a needle grinder, which determines the grinding method of a probe card based on the arrangement type and a first preset rule, determines the grinding parameters according to the grinding method and the second preset rule, and then controls the needle grinder to grind the probe needle tip using a suitable grinding method according to the arrangement type of the probe needle tip of the probe card, thereby avoiding deformation of the probe during the grinding process, thereby improving the grinding effect.

[0065] The needle grinding machine involved in the present application is used to grind the probe tip of a probe card, and belongs to a machine tool for grinding or polishing. The control method of the needle grinding machine involved in the present application belongs to a process for grinding or polishing.

[0066] The control method of the needle grinding machine provided by the present application will be described in detail below with reference to the accompanying drawings.

[0067] See also Figure 1 , Figure 1 Schematic diagram of the control method of the needle grinding machine provided in the embodiment of the present application. Figure 1 As shown, the control method of the needle grinding machine includes: steps S100 to S400.

[0068] Step S100 : When the probe card has been fixed by the fixing module of the needle grinding machine, the arrangement type of the probe tips of the probe card is obtained.

[0069] The arrangement type of the probe tips of the probe card refers to the type of lines formed by the arrangement of the probe tips of the probe card.

[0070] In some embodiments, the types of probe cards include vertical probe cards and cantilever probe cards, etc. The arrangement types of the probe tips of the probe card include but are not limited to vertical arrangement, linear arrangement and arc arrangement, etc. The arrangement type of the probe tips of the vertical probe card is vertical arrangement, and vertical arrangement means that the probes of the probe card are perpendicular to the substrate and are located in the vertical direction. The vertical probe card may include a vertical spring needle type probe card, which is a special vertical probe card whose probes adopt a spring needle structure. The cantilever probe card is a probe card including a tiny cantilever beam structure, and its probes contact the wafer surface through elastic bending. There are many types of arrangement of the probe tips of the cantilever probe card, including linear arrangement, arc arrangement and arbitrary shape arrangement, etc.

[0071] Step S200: determining a grinding method corresponding to the arrangement type based on the arrangement type and a first preset rule.

[0072] Among them, the first preset rule includes determining that the grinding method of the probe card is a circular motion grinding method when the arrangement type is a vertical arrangement; when the arrangement type is a linear arrangement or an arc arrangement, taking an image of the probe card and determining the grinding method corresponding to the arrangement type based on the image of the probe card.

[0073] Optionally, the grinding method can be a grinding method that makes the moving platform of the needle grinder make any specified movement. For example, the grinding method can include a circular motion grinding method, a linear reciprocating motion grinding method, a compound motion grinding method, a reciprocating motion grinding method along an arc, a reciprocating motion grinding method along an arbitrary curve, and other motion grinding methods, which are not limited here.

[0074] Optionally, the circular motion grinding method may further include a full-circle reciprocating motion grinding method and a semi-circle reciprocating motion grinding method. In the circular motion grinding method, the rotation direction may be changed.

[0075] In some embodiments, the linear reciprocating grinding pattern may include a grinding pattern along a specified or calculated linear reciprocating motion.

[0076] Optionally, the first preset rule further includes determining the grinding method corresponding to the arrangement type based on the arrangement type and preset correspondence information between the arrangement type and the grinding method, and directly determining the grinding method corresponding to the arrangement type according to a manually input instruction. In this case, step S200 includes step S210 or step S220.

[0077] Step S210: determining a grinding method corresponding to the arrangement type based on the arrangement type and preset correspondence information between the arrangement type and the grinding method.

[0078] In some embodiments, in the preset correspondence information between the arrangement type and the grinding mode, one arrangement type corresponds to one grinding mode, and the grinding mode corresponding to the arrangement type can be determined according to the correspondence information between the arrangement type and the grinding mode.

[0079] Step S220: displaying the arrangement type, and in response to receiving a grinding method determination instruction, obtaining a grinding method corresponding to the arrangement type according to the grinding method determination instruction.

[0080] Optionally, the grinding mode determination instruction includes a motion trajectory of a specified motion platform, and the grinding mode corresponding to the arrangement type can be directly acquired according to the grinding mode determination instruction.

[0081] When determining the grinding method for the appropriate arrangement type, it's important to minimize the motion of the platform along the line that the probes are positioned on. This reduces friction on the probe tip in directions other than the line, thereby minimizing probe deformation. For example, if the line that the probes are positioned on aligns with the X-axis, reciprocating the motion platform along the X-axis prevents deformation of the probe tip due to friction along the Y-axis, where the X-axis is perpendicular to the Y-axis.

[0082] In some embodiments, the arrangement types include linear arrangement, vertical arrangement, and arc arrangement. Step S200 includes steps S230 to S260.

[0083] Step S230: When the arrangement type is vertical arrangement, determining that the polishing method of the probe card is a circular motion polishing method.

[0084] When the arrangement type is vertical, the probes are perpendicular to the plane of the motion platform, so the probe card is polished using circular motion. The circular motion of the motion platform prevents continuous friction on the probe tips, thus minimizing probe deformation.

[0085] Step S240: When the arrangement type is a linear arrangement or an arc arrangement, an image of the probe card is captured.

[0086] When the arrangement type is a linear arrangement or an arc arrangement, in order to determine the first line formed by the probe tip arrangement and the second line where each probe is located, and further determine the moving direction of the moving platform, it is necessary to capture an image of the probe card.

[0087] Step S250 : determining a first expression of a first line formed by the arrangement of the plurality of probe tips and a second expression of a second line where each probe tip is located based on the image of the probe card.

[0088] In some embodiments, an image recognition model is used to identify characteristic areas of the probe tips and the probes themselves in an image of the probe card, thereby determining a first expression of a first line formed by an arrangement of multiple probe tips and a second expression of a second line where each probe itself is located.

[0089] Optionally, the first expression and the second expression in the plane coordinate system of the plane where the motion platform is located may be determined based on the image.

[0090] In some embodiments, step S250 includes steps S251 to S252.

[0091] Step S251: Identify multiple probe feature areas in the image of the probe card.

[0092] Wherein, multiple probes in each probe feature region are closely adjacent.

[0093] In some embodiments, the probe card includes multiple probe groups, multiple probes in each probe group are closely adjacent, and each probe group is not adjacent to other probe groups. In the image of the probe card, one probe feature area corresponds to one probe group.

[0094] Optionally, in each probe group, the straight lines where the first lines formed by the arrangement of the multiple probe tips are located are different, so the movement direction of the motion platform also needs to be correspondingly different. A method of grinding each probe group separately can be adopted.

[0095] Step S252: Calculate a first expression of a first line formed by the arrangement of multiple probe tips and a second expression of a second line where each probe itself is located in each probe feature region.

[0096] See also Figure 2 and Figure 3 , Figure 2 is a schematic diagram of an image of a probe card when the arrangement type provided in an embodiment of the present application is a linear arrangement, Figure 3 Schematic diagram of the probe card when the arrangement type provided in the embodiment of the present application is an arc arrangement. Figure 2 As shown, the probe card image 2 includes a probe feature area A1 and a probe feature area A2. Figure 2 FIG shows a first line L1 and four second lines L2 of the probe characteristic region A1, where the second lines L2 are straight lines. The probe characteristic region A1 and the probe characteristic region A2 represent different probe groups. Figure 3 As shown, in the probe characteristic area A3, the second line L2 is an arc line.

[0097] It is understood that the number of probes on the probe card is relatively large. For example, a probe group may include 1000 probes. Figure 2 and Figure 3 Only a few first lines are drawn for illustration.

[0098] Step S260: Determine the polishing method of the probe card based on the first expression and all the second expressions.

[0099] In some embodiments, step S260 includes steps S261 to S264.

[0100] Step S261: determining the grinding mode corresponding to each probe feature region based on the first expression and all second expressions of each probe feature region.

[0101] In some embodiments, step S261 includes steps S2611 to S2615.

[0102] Step S2611: For each probe feature region, when the arrangement type is a linear arrangement, a third expression of the trend line of all second lines is calculated based on all second expressions of the probe feature region.

[0103] In some embodiments, the least square method is used to calculate a third expression for the trend lines of all the second lines based on all the second expressions. The trend lines of all the second lines are used to represent the overall directional trend of all the second lines.

[0104] Step S2612: When the difference between the angle between the trend line of all second lines and the first line and 90 degrees is less than the preset difference based on the third expression and the first expression, the grinding method corresponding to the probe feature area is determined to be a grinding method of linear reciprocating motion along the trend line.

[0105] Optionally, the preset difference may be 5 degrees, 10 degrees, or 15 degrees, etc.

[0106] like Figure 2 As shown, when the arrangement type is linear, the second lines L2 in the probe characteristic area A1 are often approximately parallel to each other. If, based on the third expression and the first expression, the difference between the angle between the trend line of all second lines and the first line and 90 degrees is less than a preset difference, the corresponding grinding method for the probe characteristic area can be determined to be linear reciprocating grinding along the trend line. This method can reduce frictional forces on the probe tip in directions not aligned with the probe's own line, thereby reducing the degree of probe deformation.

[0107] In some embodiments, when the difference between the angle between the trend line of all second lines and the first line and 90 degrees is determined to be no less than a preset difference based on the third expression and the first expression, the corresponding grinding method for the probe characteristic area can be determined to be a combined linear reciprocating motion along the trend line and a circular motion. Optionally, the rotation angle of the circular motion can be the angle between the trend line and the first line. In this way, while reducing the frictional force on the probe tip in directions not along the straight line of the probe itself, the probe tip can also be fully ground from different angles, thereby improving the grinding effect.

[0108] In other embodiments, when it is determined based on the third expression and the first expression that the difference between the angle between the trend line of all second lines and the first line and 90 degrees is not less than the preset difference, it can also be determined that the grinding method corresponding to the probe feature area is a grinding method of linear reciprocating motion along the trend line.

[0109] Step S2613: When the arrangement type is an arc arrangement, the arc of the first line is calculated according to the first expression, and the arc is determined as the rotation angle of the circular motion.

[0110] like Figure 3As shown, when the arrangement type is an arc, the second lines L2 in the probe characteristic area A3 are often not parallel to each other and may even intersect. In this case, if a linear reciprocating grinding method is used, a portion of the probe tip will be continuously subjected to friction forces in a direction not aligned with the probe's own line, which can easily cause deformation. However, if the grinding method is a circular motion, a portion of the probe tip will also be continuously subjected to friction forces in a direction not aligned with the probe's own line. Therefore, when the arrangement type is an arc, a grinding method that combines circular and linear reciprocating motion can be used.

[0111] Step S2614: Calculate the expressions of the perpendicular lines of the multiple tangents of the first line according to the first expression, and determine the trend lines of all the perpendicular lines based on the expressions of all the perpendicular lines, and determine the trend lines of all the perpendicular lines as the straight lines where the motion directions of the linear reciprocating motion are located, and then determine the circular motion and the linear reciprocating motion.

[0112] like Figure 3 As shown in the figure, when the arrangement type is an arc, the second line L2 will be approximately perpendicular to a tangent line of the first line. Determining the trend line of all perpendicular lines as the line of motion for the linear reciprocating sub-motion can help to keep the velocity direction of the motion platform close to the second line where the probe itself is located, thereby reducing the friction on the probe tip in directions not along the probe's line.

[0113] Step S2615: Determine that the grinding method corresponding to the probe characteristic area is a grinding method of a composite motion of circular motion and linear reciprocating motion.

[0114] When the motion platform performs a composite motion of circular motion and linear reciprocating motion, the tangential velocity of the circular motion can be partially offset, thereby making the velocity direction of the motion platform as close as possible to the second line where the probe itself is located, reducing the friction force on the probe tip in a direction not along the straight line where the probe itself is located, and avoiding deformation of the probe during the grinding process.

[0115] Step S262: determining the polishing method of the probe card to polish each probe characteristic area using the polishing method corresponding to each probe characteristic area.

[0116] In some embodiments, during the grinding process, abrasive paper is fixed to the motion platform. If the area of ​​the pre-fixed abrasive paper is smaller than the area occupied by any two probe groups on the probe card, only one probe group can be ground at a time. Alternatively, by pre-fixing abrasive paper with a pre-designed shape for the probe card, multiple probe groups corresponding to the same grinding method can be ground together.

[0117] Optionally, by controlling the movement of the motion platform, the position of the grinding area where the grinding sandpaper contacts the probe tip can be controlled, so that multiple probe groups corresponding to the same grinding method can be ground together.

[0118] In some embodiments, the probe feature area may not be identified, and the polishing method corresponding to the arrangement type may be determined directly according to the arrangement type. In this case, as described above, step S200 includes step S210 or step S220.

[0119] As mentioned above, this application does not limit the arrangement type. For other arrangement types, it is only necessary to calculate the movement mode that makes the speed direction of the moving platform as close as possible to the second line where the probe itself is located based on the first expression and the second expression, and then determine the grinding method based on the movement mode.

[0120] Optionally, an artificial intelligence model may be used to calculate the motion mode of the motion platform based on the first expression and the second expression. The artificial intelligence model may be a deep Q network model or a neural network model.

[0121] Step S300: determining grinding parameters corresponding to the grinding method according to the grinding method and a second preset rule.

[0122] Among them, the grinding parameters include the first motion parameter of the first driving part of the needle grinder, the first motion parameter of the second driving part and the third motion parameter of the third driving part. The first driving part is used to drive the motion platform of the needle grinder to move in the first direction, the second driving part is used to drive the motion platform to move in the second direction, and the third driving part is used to drive the motion platform to move in the third direction. The first direction, the second direction and the third direction are different from each other. The motion platform is used to grind the probe tip of the probe card.

[0123] Optionally, the first direction, the second direction and the third direction are perpendicular to each other.

[0124] In some embodiments, the first direction is the Y axis of the spatial coordinate system, the second direction is the X axis of the spatial coordinate system, and the third direction is the Z axis of the spatial coordinate system. The plane where the X axis and the Y axis are located is a horizontal plane, and the Z axis direction is a vertical direction.

[0125] Optionally, the first motion parameter includes motion speed, motion direction, number of motions, one-time motion distance, etc.

[0126] Optionally, the second motion parameter includes motion speed, motion direction, number of motions, one-time motion distance, etc.

[0127] Optionally, the third motion parameter includes the grinding needle height, rising speed, number of rises, one-time rising height, descending speed, return to origin speed, descending speed after the grinding process is completed, etc.

[0128] In some embodiments, step S300 includes step S310, step S320, or steps S330 to S340.

[0129] Step S310: determining the grinding parameters corresponding to the grinding method according to the grinding method and the preset correspondence relationship information between the grinding method and the grinding parameters.

[0130] In some embodiments, in the preset correspondence information between grinding modes and grinding parameters, one grinding mode corresponds to a set of grinding parameters. The grinding parameters corresponding to the grinding mode can be determined based on the grinding mode and the correspondence information between the grinding mode and the grinding parameters.

[0131] Optionally, in the preset correspondence information between grinding modes and grinding parameters, one grinding mode corresponds to multiple sets of grinding parameters. The grinding modes and the multiple sets of grinding parameters corresponding to the grinding modes may be displayed, and in response to receiving a grinding parameter determination instruction, the grinding parameters corresponding to the grinding modes are obtained according to the grinding parameter determination instruction.

[0132] In some embodiments, the number of each set of grinding parameters, the grinding needle height, the number of movements of the motion platform, the number of rises of the third driving unit, the height of one rise, and the current position, etc. can be displayed.

[0133] Step S320: displaying the grinding mode, and in response to receiving the grinding parameter determination instruction, obtaining grinding parameters corresponding to the grinding mode according to the grinding parameter determination instruction.

[0134] In some embodiments, manually input grinding parameters can be obtained according to the grinding parameter determination instruction. In this way, the grinding method can be any grinding method, which increases the diversity of grinding methods and can also be targeted to grind the probe when the arrangement type is more complex.

[0135] In some embodiments, when the grinding method has been calculated and determined, the grinding method can be displayed, and the movement speeds and movement times of the first drive unit, the second drive unit, and the third drive unit of the needle grinder can be obtained from the grinding parameters corresponding to the manually input grinding method according to the grinding parameter determination instruction. In this case, the movement directions of the first drive unit, the second drive unit, and the third drive unit can be automatically determined based on the grinding method.

[0136] In step S330 and step S340 , the grinding parameters can be automatically calculated according to the grinding method.

[0137] Step S330: determining the motion trajectory and motion speed of the motion platform according to the grinding method.

[0138] For example, when the grinding method is a linear reciprocating motion along the trend line, the motion trajectory of the motion platform can be determined as a partial line segment on the trend line, and the motion speed corresponding to the grinding method can be determined based on the preset correspondence information between the grinding method and the motion speed.

[0139] Step S340: determining a first motion parameter of the first driving unit, a first motion parameter of the second driving unit, and a third motion parameter of the third driving unit based on the motion trajectory and the motion speed, thereby determining grinding parameters corresponding to the grinding method.

[0140] In some embodiments, a conversion model between the motion trajectory and velocity of the motion platform and the grinding parameters can be predetermined based on the mechanical connection between the first, second, and third drive units, and thus the motion platform. Using this conversion model, a first motion parameter of the first drive unit, a first motion parameter of the second drive unit, and a third motion parameter of the third drive unit can be determined based on the motion trajectory and velocity, thereby determining the grinding parameters corresponding to the grinding method.

[0141] In some embodiments, step S340 includes steps S341 to S343.

[0142] Step S341: determining the motion trajectory and motion speed of the motion platform during the grinding process according to the grinding method.

[0143] Step S342: Whenever the length of the motion trajectory of the motion platform reaches a preset length, the motion trajectory and motion speed of the motion platform during the non-grinding process are determined according to the preset adjustment parameters, so that the motion platform moves a preset distance without contacting the probe card, and then contacts the probe card to continue the grinding process.

[0144] During the grinding process, the motion platform on which the grinding sandpaper is fixed is controlled to move back and forth, so that a grinding area on the grinding sandpaper is worn away. When the grinding sandpaper is worn away, the grinding efficiency is reduced.

[0145] In some embodiments, whenever the length of the motion trajectory of the motion platform reaches a preset length, it can be determined that the wear level of a grinding area on the currently used abrasive paper exceeds a preset level. The motion trajectory and speed of the motion platform during the non-grinding process can be determined based on preset adjustment parameters. Based on the motion trajectory and speed of the motion platform during the non-grinding process, the motion platform can be controlled to move a preset distance without contacting the probe card. Then, a grinding area on the abrasive paper with a wear level below the preset level can be brought into contact with the probe card to continue the grinding process. In this way, compared to existing methods that only use a fixed area of ​​abrasive paper for circular grinding, the abrasive paper can be fully utilized, improving grinding efficiency.

[0146] Step S343: determining the motion trajectory and motion speed of the motion platform during the entire working process based on the motion trajectory and motion speed of the motion platform during the grinding process and the non-grinding process.

[0147] Step S400: Based on the grinding parameters, the first driving unit, the second driving unit and the third driving unit of the needle grinder are controlled to drive the motion platform to move, so as to grind the probe tip of the probe card using a grinding method corresponding to the probe card.

[0148] In some embodiments, the needle grinder further includes an alarm device. The method further includes: when the alarm device detects an abnormality in the grinding process, displaying an alarm message. The alarm message includes the current date, the alarm trigger time, the abnormality details, and the recovery time.

[0149] In some implementations, a list of all abnormal situations that may trigger an alarm may be displayed, and a function area for clearing the alarm content area may be displayed.

[0150] In some embodiments, monitoring information of the grinding process can also be displayed. The monitoring information can include operating parameters of the first drive unit, the second drive unit, and the third drive unit during the grinding process. The operating parameters can include the number of movements and the distance of movement.

[0151] In some embodiments, the main body of the needle grinder further includes a display screen. The method further includes: displaying an initial interface, and in response to receiving administrator login information and the administrator login information being verified, displaying a system version list; and in response to a system version selection instruction, performing a control interface of a control system of a corresponding version according to the system version selection instruction. Each system version corresponds to a model of needle grinder. In the control system, grinding parameter limits are pre-set for each model of needle grinder. For example, the maximum movement distance of the first drive unit, the second drive unit, and the third drive unit of the needle grinder is limited according to the model of the needle grinder.

[0152] In some embodiments, the method further includes: in response to receiving a zero point setting instruction, setting a current position of the motion platform of the needle grinding machine as a zero point according to the zero point setting instruction.

[0153] In summary, the control method of the needle grinding machine provided in the embodiment of the present application has the following advantages:

[0154] 1. By determining the grinding method of the probe card based on the arrangement type and the first preset rule, determining the grinding parameters according to the grinding method and the second preset rule, and then controlling the needle grinder to grind the probe needle tip using a suitable grinding method according to the arrangement type of the probe needle tip of the probe card, deformation of the probe during the grinding process can be avoided, thereby improving the grinding effect.

[0155] 2. When the arrangement type is vertical arrangement, the grinding method of the probe card is determined to be circular motion grinding. During the circular motion of the motion platform, no friction force is continuously generated on the probe tip along a certain direction, thereby reducing the deformation of the probe.

[0156] 3. When it is determined based on the third expression and the first expression that the difference between the angle between the trend line of all second lines and the first line and 90 degrees is not less than the preset difference, it is determined that the grinding method corresponding to the characteristic area of ​​the probe is a composite motion of linear reciprocating motion and circular motion along the trend line. While reducing the friction force on the probe tip in a direction not along the straight line where the probe itself is located, the probe tip can also be fully ground from different angles, thereby improving the grinding effect.

[0157] 4. When the arrangement type is an arc arrangement, by determining that the grinding method corresponding to the characteristic area of ​​the probe is a composite grinding method of circular motion and linear reciprocating motion, the tangential velocity of the circular motion can be partially offset, thereby making the velocity direction of the motion platform as close as possible to the second line where the probe itself is located, reducing the friction force on the probe tip in the direction not along the straight line where the probe itself is located, and avoiding deformation of the probe during the grinding process.

[0158] 5. Whenever the length of the motion trajectory of the motion platform reaches a preset length, the motion trajectory and motion speed of the motion platform during the non-grinding process are determined according to the preset adjustment parameters, so that the motion platform moves a preset distance without contacting the probe card, and then contacts the probe card to continue the grinding process. Compared with the existing method of only using a fixed area of ​​grinding paper for circular grinding, it can make full use of the grinding paper and improve the grinding efficiency.

[0159] See also Figure 4 , Figure 4 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 4 As shown, the electronic device 400 includes: one or more processors 410 and a memory 420, Figure 4 A processor 410 is taken as an example.

[0160] In some embodiments, the processor 410 and the memory 420 may be connected via a bus or other means. Figure 4 The bus connection is taken as an example.

[0161] In some embodiments, the processor 410 is configured to obtain an arrangement type of the probe tips of the probe card when the probe card has been fixed by a fixing module of the needle grinder; determine a grinding method corresponding to the arrangement type based on the arrangement type and a first preset rule, wherein the first preset rule includes determining that the grinding method of the probe card is a circular motion grinding method when the arrangement type is a vertical arrangement, and when the arrangement type is a linear arrangement or an arc arrangement, taking an image of the probe card and determining the grinding method corresponding to the arrangement type based on the image of the probe card; determining grinding parameters corresponding to the grinding method according to the grinding method and the second preset rule, wherein the grinding parameters include a first preset rule of the needle grinder; The first motion parameter of the driving unit, the first motion parameter of the second driving unit and the third motion parameter of the third driving unit, the first driving unit is used to drive the motion platform of the needle grinder to move along the first direction, the second driving unit is used to drive the motion platform to move along the second direction, and the third driving unit is used to drive the motion platform to move along the third direction, the first direction, the second direction and the third direction are different from each other, and the motion platform is used to grind the probe needle tip of the probe card; based on the grinding parameters, the first driving unit, the second driving unit and the third driving unit of the needle grinder are controlled to drive the motion platform to move, so as to grind the probe needle tip of the probe card using the grinding method corresponding to the probe card.

[0162] In some embodiments, the memory 420, as a non-volatile computer-readable storage medium, can be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as the program instructions / modules for the needle grinder control method in the embodiments of the present application. The processor 410 executes the non-volatile software programs, instructions, and modules stored in the memory 420 to execute various functional applications and data processing of the electronic device 400, thereby implementing the needle grinder control method in the above-mentioned method embodiment.

[0163] In some embodiments, the memory 420 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and applications required for at least one function; the data storage area may store data created based on the use of the electronic device 400, etc. In addition, the memory 420 may include a high-speed random access memory and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device. In some embodiments, the memory 420 may optionally include a memory remotely located relative to the processor 410, and these remote memories may be connected to the controller via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0164] In some embodiments, one or more modules are stored in the memory 420, and when executed by one or more processors 410, the control method of the needle grinding machine in any of the above method embodiments is executed, for example, the control method described above is executed. Figure 1 Method steps S100 to S400.

[0165] Please refer to Figure 5 , Figure 5 The computer-readable storage medium 500 stores a program code 510, which can be called by a processor to execute the control method of the needle grinding machine described in the above method embodiment.

[0166] The computer-readable storage medium 500 can be an electronic memory such as flash memory, electrically erasable programmable read-only memory (EEPROM), a hard disk, or read-only memory (ROM). Alternatively, the computer-readable storage medium includes non-volatile computer-readable media. The computer-readable storage medium 500 has storage space for program code that executes any method steps in the needle grinding machine control method described above. This program code can be read from or written to one or more computer program products. The program code can be compressed, for example, in a suitable format.

[0167] This application also provides a needle grinding machine. Please refer to Figure 6 , Figure 6 Schematic diagram of the three-dimensional structure of the needle grinding machine provided in the embodiment of the present application. Figure 6 As shown, in some embodiments, the needle grinding machine 1 includes a main body 10, the electronic device as described above, and a motion module 20. The electronic device is mounted on the main body 10, and the electronic device is used to control the motion module 20.

[0168] Optionally, the main body 10 includes a cabinet having a storage space, wherein the cabinet has a cabinet door mounted at an opening of the cabinet by a movable connection. The electronic device 400 and the motion module 20 are both disposed in the storage space of the cabinet.

[0169] In some embodiments, the motion module 20 includes a motion platform 21 and a driving portion D capable of driving the motion platform 21 to move. The motion platform 21 is driven by the driving portion D to move to grind the probes of the probe card.

[0170] In some embodiments, a working platform 11 is disposed on the main body 10 of the needle grinding machine 1. The needle grinding machine 1 also includes a fixing module 30. The fixing module 30 is disposed on the working platform 11 and includes multiple sets of symmetrically arranged fixing brackets. The multiple sets of fixing brackets are used to fix the probe card to positions corresponding to the motion platform 21 in the working window 40. The motion platform 21 can move within the working window 40 under the drive of the driving unit D to grind the probes of the probe card.

[0171] Optionally, the material of the working platform 11 is marble.

[0172] See also Figure 7 , Figure 7 Schematic diagram of the explosion of the needle grinding machine provided in the embodiment of the present application. Figure 7 As shown, in some embodiments, the plurality of symmetrically arranged fixing brackets include a first fixing bracket 31 for fixing a square probe card and a second fixing bracket 32 ​​for fixing a circular probe card.

[0173] like Figure 6 As shown, in some embodiments, a first imaging module 50 and a second imaging module 60 are further provided on the working platform 11 .

[0174] Optionally, the first imaging module 50 includes a first robotic arm 51 disposed on the working platform 11, a microscopic imaging device 52 and a first display screen 53 disposed on the first robotic arm 51. The first robotic arm 51 can drive the microscopic imaging device 52 to move, and the first display screen 53 can display the image obtained by the microscopic imaging device 52 when photographing the probe card from a first angle.

[0175] Optionally, the second imaging module 60 includes a camera 61 and a second display screen 62 provided on the working platform 11 . The second display screen 62 can display an image obtained by the camera 61 photographing the probe card from a second angle, which is different from the first angle.

[0176] Optionally, the second imaging module 60 includes a plurality of cameras 61, which are disposed at different positions on the working platform 11. Therefore, the shooting angle of each camera 61 may be different.

[0177] In some embodiments, in step S240 , the camera 61 of the second imaging module 60 , which is disposed on the working platform 11 and located directly above the working window 40 , may be controlled to capture an image of the probe card.

[0178] like Figure 6As shown, in some embodiments, the main body 10 of the needle grinding machine 1 is further provided with a third display screen 70 and a plurality of operation buttons 80. The third display screen 70 is used to display the control interface of the needle grinding machine 1 system. Optionally, the third display screen 70 can be a touch screen. The plurality of operation buttons 80 can include a start button, an emergency stop button, and a reset button.

[0179] like Figure 7 As shown, in some embodiments, a plurality of mounting holes K arranged in a preset arrangement relationship for mounting a magnetic fixing member are provided on the work platform 11 corresponding to each fixing bracket. In this case, the fixing bracket may include a magnet that attracts the magnetic fixing member.

[0180] Optionally, the magnetic fixing member may be a magnetic strip.

[0181] In some embodiments, the work platform 11 is also provided with a plane calibration device. The plane calibration device includes a guide rod arranged in a vertical direction, a sliding assembly slidably mounted on the guide rod, and a micrometer screw mounted on the sliding assembly. The micrometer screw is directly opposite the plane of the work platform 11. The micrometer screw is used to measure the distance between the motion platform 21 and the micrometer screw, allowing staff to adjust the motion platform 21 so that the motion platform 21 is flush with the upper surface of the work platform 11, thereby allowing the motion platform 21 to evenly grind the probe.

[0182] like Figure 7 As shown, the drive unit D optionally includes a first drive unit D1, a second drive unit D2, and a third drive unit D3. Both the first drive unit D1 and the second drive unit D2 include linear motors. The first drive unit D1 includes a first slider D11 and a first electromagnetic driver D12, which is used to drive the first slider D11 to move in a first direction. The second drive unit D2 includes a second slider and a second electromagnetic driver, which is used to drive the second slider to move in a second direction.

[0183] Optionally, the first electromagnetic driver D12 and the second electromagnetic driver may be iron cores or magnetic cores. When the first driver D1 is energized, the first electromagnetic driver D12 can electromagnetically drive the first slider D11 to move in the first direction. When the second driver D2 is energized, the second electromagnetic driver D12 can electromagnetically drive the second slider D11 to move in the second direction.

[0184] In some embodiments, the third drive unit D3 includes a third slider D34. Optionally, the third drive unit D3 also includes a servo motor, a screw, and a vertical motion assembly. The vertical motion assembly is fixedly connected to the third slider, the servo motor is used to drive the screw to rotate, and the vertical motion assembly can convert the rotational motion of the screw into vertical motion of the third slider.

[0185] In some embodiments, the motion platform 21 is fixedly connected to the first slider D11 of the first driving part D1, the first driving part D1 is fixedly connected to the second slider of the second driving part D2, and the second driving part D2 is fixedly connected to the third slider D34 of the third driving part D3. The third slider D34 can move along a third direction, and the first direction, the second direction and the third direction are different from each other.

[0186] like Figure 7 As shown, in some embodiments, the motion platform 21 includes a first connecting plate 211 and a second connecting plate 212. Figure 8 , Figure 8 Schematic diagram of the first connecting member, the first driving part and the second driving part of the needle grinding machine provided in the embodiment of the present application. Figure 8 As shown, in some embodiments, the first connecting plate 211 is fixedly connected to the first slider D11, and the second connecting plate 212 is fixedly connected to the first connecting plate 211. The first connecting plate 211 includes a first hole 2111. The first driving unit D1 also includes a first grating scale and a fourth slider D13 connected to the sliding portion G1 of the first grating scale. The fourth slider D13 is embedded in the first hole 2111 and fixedly connected to the first connecting plate 211 via a plurality of fasteners.

[0187] Optionally, the fasteners may be screws or rivets.

[0188] Through the first connecting plate 211, the motion platform 21 can move under the drive of the first slider D11 of the first driving part D1. When the first connecting plate 211 moves, it can drive the fourth slider D13 connected to the sliding part G1 of the first grating ruler to move, thereby making the first grating ruler work. Through the first grating ruler, high-precision position feedback control of the linear motor of the first driving part D1 can be achieved, thereby accurately controlling the movement of the motion platform 21.

[0189] In some embodiments, the first drive unit D1 further includes a third connecting plate near the second drive unit D2, and the third connecting plate is fixedly connected to the second slider of the second drive unit D2. Optionally, the third connecting plate includes a second hole. The second drive unit D2 also includes a second grating scale and a fifth slider connected to the sliding portion of the second grating scale, and the fifth slider is embedded in the second hole and fixedly connected to the third connecting plate through a plurality of fasteners. Through the third connecting plate, the first drive unit D1 can move under the drive of the second slider of the second drive unit D2. When the third connecting plate moves, it can drive the fifth slider connected to the sliding portion of the second grating scale to move, thereby making the second grating scale work. The second grating scale can realize high-precision position feedback control of the linear motor of the second drive unit D2, thereby accurately controlling the movement of the first drive unit D1.

[0190] In some embodiments, the first driving unit D1 further includes a first limiting device D14 that can limit the movement of the first slider D11 in the first direction. When the first limiting device D14 is triggered by the first slider D11, the first electromagnetic driving member D12 can stop driving the first slider D11.

[0191] In some embodiments, the second driving portion D2 further includes a second limiting device that can limit the movement of the second slider in the second direction. When the second limiting device is triggered by the second slider, the second electromagnetic driving member can stop driving the second slider to move.

[0192] Optionally, the first limiting device D14 or the second limiting device may be a limit sensor, and the limit sensor may include a photoelectric limit sensor, a contact limit sensor, an electromagnetic induction limit sensor, and the like.

[0193] In some embodiments, the first drive unit D1 further includes two first rails D15. Each first rail D15 includes a first rail groove D151, a first rail assembly D152, and a second rail assembly D153. The first rail assembly D152 is fixedly connected to the motion platform 21 and located within the first rail groove D151. The second rail assembly D153 is fixedly disposed on the first rail groove D151 and is parallel to the first rail assembly D152. The second rail assembly D153 can restrict the first rail assembly D152 from sliding within the first rail groove D151.

[0194] Optionally, the first slide rail assemblies D152 of the two first slide rails D15 are fixedly connected to the first connecting plate 211 of the motion platform 21. The two first slide rails D15 can restrict the motion platform 21 from sliding in a first direction determined by the first slide rail grooves D151.

[0195] In some embodiments, the second drive unit D2 further includes two second rails. Each second rail includes a second rail slot, a third rail assembly, and a fourth rail assembly. The third rail assembly is fixedly connected to the first drive unit D1 and located within the second rail slot. The fourth rail assembly is fixedly disposed on the second rail slot and parallel to the third rail assembly. The fourth rail assembly can constrain the third rail assembly from sliding within the second rail slot.

[0196] Optionally, the third rail assembly of the two second rails is fixedly connected to the third connecting plate of the first drive unit D1. The two second rails can restrict the first drive unit D1 from sliding in the second direction determined by the second rail groove. Simultaneously, the first drive unit D1 can drive the motion platform 21 to move in the first direction, and the third drive unit D3 can drive the second drive unit D2 to move in the third direction, thereby enabling the motion platform 21 to perform a composite motion in the first, second, and third directions. Because the first, second, and third directions are different from one another, the motion platform 21 can be driven by the drive unit D to move arbitrarily in space.

[0197] like Figure 8 As shown, in some embodiments, a first slide rail adjustment device D154 is provided on the second slide rail assembly D153, and the first slide rail adjustment device D154 can adjust the fixed position of the second slide rail assembly D153 to adjust the first distance between the first slide rail assembly D152 and the second slide rail assembly D153.

[0198] In some embodiments, a second slide rail adjustment device is provided on the second slide rail assembly D153, and the second slide rail adjustment device can adjust the fixed position of the fourth slide rail assembly to adjust the second distance between the third slide rail assembly and the fourth slide rail assembly.

[0199] Optionally, the first slide rail adjusting device D154 or the second slide rail adjusting device may include screws or rivets, etc.

[0200] See also Figure 9 , Figure 9 Schematic diagram of the servo motor, screw rod and vertical motion assembly of the third drive unit of the needle grinding machine provided in the embodiment of the present application. Figure 9 As shown, in some embodiments, the third driving unit D3 further includes a servo motor D31, a screw rod D32, and a vertical motion assembly D33. The servo motor D31 is connected to the screw rod D32, which is movably connected to the vertical motion assembly D33. The vertical motion assembly D33 is fixedly connected to the third slider D34. The vertical motion assembly D33 can convert the rotational motion of the screw rod D32 into vertical motion of the third slider D34. The third direction is the vertical direction.

[0201] Optionally, the vertical motion assembly D33 includes a fifth rail assembly D331 and a sixth rail assembly D332. A third slider D34 is slidably connected to the fifth and sixth rail assemblies D331 and D332. A screw rod D32 movably extends through the vertical motion assembly D33. When the servo motor D31 rotates the screw rod D32, the screw rod D32 drives the vertical motion assembly D33 horizontally, while the third slider D34, guided by the fifth and sixth rail assemblies D331 and D332, moves vertically.

[0202] In some embodiments, the third driving unit D3 further includes an origin detection device D35 disposed on the vertical motion component D33. The origin detection device D35 is used to detect whether the vertical motion component D33 moves to a preset origin position.

[0203] In summary, the present application provides a control method for a needle grinder, an electronic device, a storage medium and a needle grinder, the control method of the needle grinder comprising: when the probe card has been fixed by a fixing module of the needle grinder, obtaining the arrangement type of the probe needle tips of the probe card; determining the grinding method corresponding to the arrangement type based on the arrangement type and a first preset rule, the first preset rule comprising: when the arrangement type is a vertical arrangement, determining that the grinding method of the probe card is a circular motion grinding method; when the arrangement type is a linear arrangement or an arc arrangement, taking an image of the probe card, and determining the grinding method corresponding to the arrangement type based on the image of the probe card; determining the grinding parameters corresponding to the grinding method according to the grinding method and the second preset rule; The grinding parameters include the first motion parameter of the first drive unit of the needle grinder, the first motion parameter of the second drive unit, and the third motion parameter of the third drive unit. The first drive unit is used to drive the motion platform of the needle grinder to move in the first direction, the second drive unit is used to drive the motion platform to move in the second direction, and the third drive unit is used to drive the motion platform to move in the third direction. The first direction, the second direction and the third direction are different from each other. The motion platform is used to grind the probe tip of the probe card; based on the grinding parameters, the first drive unit, the second drive unit and the third drive unit of the needle grinder are controlled to drive the motion platform to move, so as to grind the probe tip of the probe card using the grinding method corresponding to the probe card. The present application determines the grinding method of the probe card based on the arrangement type and the first preset rule, determines the grinding parameters according to the grinding method and the second preset rule, and then controls the needle grinder to grind the probe tip using a suitable grinding method according to the arrangement type of the probe tip of the probe card, thereby avoiding deformation of the probe during the grinding process, thereby improving the grinding effect.

[0204] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A control method for a needle grinding machine, characterized in that: include: When the probe card is fixed by the fixing module of the needle grinding machine, obtaining the arrangement type of the probe tips of the probe card; Determining a grinding method corresponding to the arrangement type based on the arrangement type and a first preset rule, wherein the first preset rule includes determining that the grinding method of the probe card is a circular motion grinding method when the arrangement type is a vertical arrangement, and capturing an image of the probe card and determining the grinding method corresponding to the arrangement type based on the image of the probe card when the arrangement type is a linear arrangement or an arc arrangement; determining grinding parameters corresponding to the grinding method according to the grinding method and a second preset rule, the grinding parameters including a first motion parameter of a first driving unit of the needle grinder, a first motion parameter of a second driving unit, and a third motion parameter of a third driving unit, wherein the first driving unit is used to drive a motion platform of the needle grinder to move in a first direction, the second driving unit is used to drive the motion platform to move in a second direction, and the third driving unit is used to drive the motion platform to move in a third direction, the first direction, the second direction and the third direction are different from each other, and the motion platform is used to grind the probe tip of the probe card; Based on the grinding parameters, the first driving part, the second driving part and the third driving part of the needle grinding machine are controlled to drive the motion platform to move, so as to grind the probe needle tip of the probe card using a grinding method corresponding to the probe card.

2. The control method of the needle grinding machine according to claim 1, characterized in that: The determining of the grinding method corresponding to the arrangement type based on the arrangement type and the first preset rule includes: Determining the grinding method corresponding to the arrangement type based on the arrangement type and preset correspondence information between the arrangement type and the grinding method; or The arrangement type is displayed, and in response to receiving a grinding mode determination instruction, a grinding mode corresponding to the arrangement type is acquired according to the grinding mode determination instruction.

3. The control method of the needle grinding machine according to claim 1, characterized in that: The arrangement types include linear arrangement, vertical arrangement, and arc arrangement. The determining of the grinding method corresponding to the arrangement type based on the arrangement type and the first preset rule includes: When the arrangement type is vertical arrangement, determining that the grinding mode of the probe card is a circular motion grinding mode; When the arrangement type is the linear arrangement or the arc arrangement, taking an image of the probe card; determining, based on the image of the probe card, a first expression for a first line formed by an arrangement of a plurality of probe tips and a second expression for a second line where each probe tip is located; A grinding method of the probe card is determined based on the first expression and all of the second expressions.

4. The control method of the needle grinding machine according to claim 3, characterized in that: The method of determining a first expression for a first line formed by an arrangement of a plurality of probe tips and a second expression for a second line where each probe tip is located based on the image of the probe card includes: identifying a plurality of probe feature regions in the image of the probe card, wherein a plurality of probes in each of the probe feature regions are closely adjacent to each other; Calculate a first expression of a first line formed by the arrangement of multiple probe tips and a second expression of a second line where each probe is located in each probe feature area; The determining of the grinding method of the probe card based on the first expression and all the second expressions includes: Determine the grinding mode corresponding to each probe feature region based on the first expression and all the second expressions of each probe feature region; The polishing method of the probe card is determined to be polishing using the polishing method corresponding to each probe characteristic area.

5. The control method of the needle grinding machine according to claim 4, characterized in that: The determining, based on the first expression and all the second expressions for each of the probe feature regions, of the grinding mode corresponding to the probe feature region includes: For each of the probe feature areas, when the arrangement type is the linear arrangement, calculating a third expression for the trend lines of all the second lines based on all the second expressions of the probe feature areas; When it is determined based on the third expression and the first expression that the difference between the angle between the trend line of all the second lines and the first line and 90 degrees is less than a preset difference, determining that the grinding method corresponding to the probe characteristic area is a grinding method of linear reciprocating motion along the trend line; When the arrangement type is the arc arrangement, the arc of the first line is calculated according to the first expression, and the arc is determined as the rotation angle of the circular motion; Calculating expressions of perpendicular lines of the plurality of tangent lines of the first line according to the first expression, and determining trend lines of all the perpendicular lines based on the expressions of all the perpendicular lines, and determining the trend lines of all the perpendicular lines as the straight lines on which the motion directions of the linear reciprocating sub-motion lie, thereby determining the circular sub-motion and the linear reciprocating sub-motion; It is determined that the grinding mode corresponding to the characteristic area of ​​the probe is a grinding mode of a composite motion of the circular motion and the linear reciprocating motion.

6. The control method of the needle grinding machine according to claim 1, characterized in that: Determining the grinding parameters corresponding to the grinding method according to the grinding method and a second preset rule includes: Determining the grinding parameters corresponding to the grinding method according to the grinding method and the corresponding relationship information between the preset grinding method and the grinding parameters; or displaying the grinding mode, and in response to receiving a grinding parameter determination instruction, acquiring grinding parameters corresponding to the grinding mode according to the grinding parameter determination instruction; or Determining the motion trajectory and motion speed of the motion platform according to the grinding method; A first motion parameter of the first driving unit, a first motion parameter of the second driving unit, and a third motion parameter of the third driving unit are determined based on the motion trajectory and the motion speed, thereby determining grinding parameters corresponding to the grinding method.

7. The control method of the needle grinding machine according to claim 6, characterized in that: The determining of the motion trajectory and the motion speed of the motion platform according to the grinding method includes: Determining the motion trajectory and motion speed of the motion platform during the grinding process according to the grinding method; Whenever the length of the motion trajectory of the motion platform reaches a preset length, the motion trajectory and motion speed of the motion platform during a non-polishing process are determined according to preset adjustment parameters, so that the motion platform moves a preset distance without contacting the probe card, and then contacts the probe card to continue the polishing process; The motion trajectory and motion speed of the motion platform in the entire working process are determined based on the motion trajectory and motion speed of the motion platform in the grinding process and the non-grinding process.

8. An electronic device, characterized in that: The electronic device comprises: at least one processor; and, a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the control method of the needle grinding machine according to any one of claims 1 to 7.

9. A computer-readable storage medium, characterized in that The computer-readable storage medium stores an executable program, and the executable program is executed by a processor to implement the control method of the needle grinding machine according to any one of claims 1 to 7.

10. A needle grinding machine, characterized in that: The needle grinding machine comprises a main body, the electronic device according to claim 8 and a motion module; The electronic device is mounted on the main body, and the electronic device is used to control the motion module; The motion module includes a motion platform and a driving portion capable of driving the motion platform to move, wherein the motion platform is driven by the driving portion to move to grind the probes of the probe card; The driving part includes a first driving part, a second driving part and a third driving part; The first driving portion includes a first slider and a first electromagnetic driving member, wherein the first electromagnetic driving member is used to drive the first slider to move along a first direction; The second driving portion includes a second slider and a second electromagnetic driving member, and the second electromagnetic driving member is used to drive the second slider to move along the second direction; The motion platform is fixedly connected to the first slider of the first driving part, the first driving part is fixedly connected to the second slider of the second driving part, the second driving part is fixedly connected to the third slider of the third driving part, and the third slider can move along a third direction. The first direction, the second direction and the third direction are different from each other.

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