Micropore machining device and method

Abstract

The invention relates to the field of hard and brittle material micropore machining, in particular to a micropore machining device and method, the machining device comprises a cutter assembly, the cutter assembly is used for feeding and drilling in the vertical direction, and the cutter assembly comprises a power shaft used for providing drilling power; the micro needle is fixedly connected with the power shaft, and the micro needle is used for drilling holes; the carrier assembly is arranged below the cutter assembly, and the carrier assembly comprises a carrier used for bearing a workpiece; and the adjusting part directly or indirectly acts on the carrier, so that the carrier can be movably adjusted in the vertical direction, and the microneedle is always in contact with a workpiece during drilling. The technical effect of improving the micropore machining quality is achieved.

Description

Technical Field

[0001] This application relates to the field of micro-hole machining of hard and brittle materials, and in particular to a micro-hole machining device and a machining method. Background Art

[0002] Ceramic materials such as silicon carbide and aluminum nitride have been widely used in the fields of electronics and semiconductors due to their outstanding properties such as high thermal conductivity, high insulation, and high temperature resistance. However, due to the extremely high hardness and brittleness of ceramic materials, it is quite difficult to perform shaping processing on them. This processing difficulty is particularly evident in micro-hole machining. The machining of small apertures not only needs to cope with the challenges of the rigid and brittle properties of the material itself but also poses almost demanding requirements on the accuracy and stability of the processing technology, making the related processing technology a research difficulty and focus in this field.

[0003] In the prior art, the commonly used methods for micro-hole machining of hard and brittle materials include machining center machine tool machining, ultrasonic drilling, and laser machining. However, these machining methods have obvious deficiencies: when performing micro-hole drilling on a machining center machine tool, the tool faces significant wear problems; in laser machining, due to the heat-affected zone problem, it is easy to cause material deformation or generate micro-cracks, and these conditions will all lead to poor quality of micro-hole machining.

[0004] Therefore, the technical problem of the prior art is that the quality of micro-hole machining is poor. Summary of the Invention

[0005] This application provides a micro-hole machining device and a machining method, achieving the technical effect of improving the quality of micro-hole machining.

[0006] On the one hand, a micro-hole machining device provided by this application adopts the following technical solution: A micro-hole machining device includes: A tool assembly, the tool assembly is arranged in the vertical direction and has a degree of freedom of movement in the vertical direction. The tool assembly includes: A power shaft, the power shaft is used to provide drilling power; A micro-needle, the micro-needle is fixedly connected to the power shaft, and the micro-needle is used to drill holes in the workpiece; A carrier assembly, the carrier assembly is arranged below the tool assembly. The carrier assembly includes: A carrier, the carrier is used to carry the workpiece; the carrier has a degree of freedom of movement in the vertical direction relative to the tool assembly; An adjusting member, the adjusting member directly or indirectly acts on the carrier to enable the carrier to be movably adjusted in the vertical direction so that the micro-needle is always in contact with the workpiece during drilling.

[0007] Preferably, the carrier has a force-receiving part which has magnetism or ferromagnetism; the adjusting member is a magnet, and the magnet is used to cooperate with the force-receiving part so that the carrier can be adjusted in the vertical direction.

[0008] Preferably, the magnet is arranged above the force-receiving part, and the force-receiving part has ferromagnetism so that the magnet attracts the carrier upward; or, The magnet is arranged above the force-receiving part, and the force-receiving part has magnetism and is opposite to the magnet in magnetism so that the magnet attracts the carrier upward.

[0009] Preferably, the magnet is arranged below the force-receiving part, and the force-receiving part has magnetism and is the same as the magnet in magnetism so that the magnet repels the carrier upward.

[0010] Preferably, the carrier assembly further includes a frame; the adjusting member is a spring, and the spring is connected between the frame and the carrier, and the spring is in a compressed state to act on the carrier upward.

[0011] Preferably, a guiding assembly is further included, and the guiding assembly is used to guide the adjustment of the carrier. The guiding assembly includes: A guiding rod which is arranged in the vertical direction and is slidably connected with the carrier so that the carrier can be adjusted in the direction where the guiding rod is located.

[0012] On the other hand, a micro-hole processing method provided by the present application adopts the following technical solution: A micro-hole processing method applicable to the micro-hole processing device includes: Placing a workpiece on the carrier; Bringing the micro-needle into contact with the workpiece and pressing down on the workpiece and the carrier so that the micro-needle drills a hole in the workpiece; The adjusting member drives the carrier to float upward so that during the process of the micro-needle drilling a hole in the workpiece, the micro-needle and the workpiece always remain in contact.

[0013] Preferably, before the step of "bringing the micro-needle into contact with the workpiece and pressing down on the workpiece and the carrier so that the micro-needle drills a hole in the workpiece", the method further includes: Spraying diamond abrasive liquid on the area of the workpiece to be drilled; or, Spraying diamond abrasive liquid on the micro-needle.

[0014] Preferably, it is defined that the acting force of the adjusting member on the carrier is Fx, and Fx changes with the position of the carrier relative to the adjusting member; Define that when the workpiece is placed on the carrier, the carrier is in the first position. In the first position, (m1 + m2)g = Fx, where m1 is the mass of the workpiece and m2 is the mass of the carrier; The "making the microneedle contact the workpiece and pressing down on the workpiece and the carrier" includes: Making the microneedle press down by a distance of L, driving the carrier to descend to the second position. In the second position, F + (m1 + m2)g = Fx, where F is the pressure of the microneedle on the workpiece; L is the thickness of the workpiece; So that during the process of the microneedle drilling the workpiece, the carrier floats upward, causing Fx to gradually decrease until Fx = (m1 + m2)g after the drilling is completed.

[0015] Preferably, it further includes: Obtaining the initial height L0 of the microneedle descent; After drilling, obtaining the descent height Lx of the microneedle; If Lw - (L0 - Lx) < L, the microneedle needs to be replaced, where Lw is the initial length of the microneedle and L is the thickness of the workpiece.

[0016] In summary, the present application includes at least one of the following beneficial technical effects: 1. In the drilling process of the present application, diamond slurry is provided. The diamond slurry adheres to the bottom of the microneedle. By using vibration, the microneedle continuously presses down on the diamond slurry, causing fatigue in the processing material, accelerating the drilling efficiency and improving the quality of the micro-holes.

[0017] 2. In the present application, the carrier is adjusted by the adjusting member. The adjusting member causes the carrier to float upward, ensuring that the workpiece and the microneedle are always in contact during the drilling process, preventing the diamond slurry from falling off and reducing the wear of the microneedle.

[0018] 3. The acting force of the adjusting member on the carrier (or the workpiece) gradually decreases. As the drilling progresses, the thickness of the workpiece gradually becomes thinner. By controlling the decrease of the acting force through the adjusting member, the edge collapse of the micro-hole is effectively prevented, which is beneficial to improving the quality of the micro-hole. Description of the Drawings

[0019] Figure 1 is a schematic diagram of the processing device described in the present application; Figure 2 is a schematic diagram of the first / second adjusting member of the processing device described in the present application; Figure 3 is a schematic diagram of the third adjusting member of the processing device described in the present application; Figure 4 is a schematic diagram of the fourth adjusting member of the processing device described in the present application; Figure 5 is a schematic diagram of the processing method described in the present application.

[0020] Explanation of the reference numerals: 100, tool assembly; 110, power shaft; 120, microneedle; 130, driving member; 200, carrier assembly; 210, carrier; 211, force-bearing part; 220, adjusting member; 221, magnet; 222, spring; 230, frame; 300, guide assembly; 310, guide rod; 400, workpiece. DETAILED DESCRIPTION

[0021] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of this application, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0022] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0023] The present application provides a micro-hole processing device and a processing method, which achieve the technical effect of improving the micro-hole processing quality.

[0024] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present application and are not used to limit the present application.

[0025] The present application provides a micro-hole processing device for drilling holes in hard and brittle materials, such as Figure 1 As shown, it includes a tool assembly 100 and a carrier assembly 200 . The tool assembly 100 is used as a drilling execution structure for performing drilling processing and is used to drill a workpiece 400 . The carrier assembly 200 is used as a carrying platform for the workpiece 400 and is used to carry the workpiece 400 .

[0026] likeFigure 1 As shown, the tool assembly 100 is used for drilling the workpiece 400. Specifically, the tool assembly 100 is arranged in the vertical direction and has a degree of freedom of movement in the vertical direction. The tool assembly 100 is used to feed in the vertical direction and act on the workpiece 400 to perform drilling. The tool assembly 100 includes a power shaft 110, a micro-needle 120, and a driving member 130. The power shaft 110 is arranged vertically and is used to provide the drilling power for the micro-needle 120. For example, ultrasonic vibration is used as the drilling power source. In one embodiment, the power shaft 110 is a transducer. The micro-needle 120 is fixedly connected to the bottom end of the power shaft 110 and is arranged vertically. The micro-needle 120 is the drilling component that directly acts on the workpiece 400. The tip of the micro-needle 120 is designed for micro-hole processing to ensure that precise micro-holes can be formed on the workpiece 400. In one embodiment, there are multiple groups of micro-needles 120, and the multiple groups of micro-needles 120 are evenly connected to the bottom end of the power shaft 110 in the vertical direction to achieve multi-hole processing on the workpiece 400. The driving member 130 is used to drive the micro-needle 120 and the power shaft 110 to move up or down in the vertical direction. The power shaft 110 is fixedly connected to the driving member 130, so that the power shaft 110 and the micro-needle 120 can move up or down in the vertical direction. Optionally, the driving member 130 can be a linear motor, a cylinder, an electric cylinder, a screw slider, or other linear driving structures.

[0027] As Figures 1-4 shown, the carrier assembly is used to carry the workpiece 400. The carrier assembly is arranged below the tool assembly 100, so that the tool assembly 100 drills the workpiece 400 located on the carrier assembly vertically downward. The carrier 210 is used to carry the workpiece 400. The carrier 210 has a degree of freedom of movement in the vertical direction compared to the tool assembly 100. The upper surface of the carrier 210 is flat to ensure the stability of the placement of the workpiece 400. The adjusting member 220 acts directly or indirectly on the carrier 210, so that the carrier 210 can be adjusted vertically, so as to ensure that the micro-needle 120 and the workpiece 400 are always in contact during the drilling process.

[0028] Furthermore, as Figures 1-4 shown, the carrier 210 has a force-receiving portion 211, and the force-receiving portion 211 has magnetism or ferromagnetic property. The adjusting member 220 is a magnet 221, and the magnet 221 is used to cooperate with the force-receiving portion 211 to enable the carrier 210 to be adjusted vertically. Preferably, the magnet 210 can be an electromagnet, and the magnitude of the adjusting force can be adjusted based on the specifications of the workpiece 400 and the carrier 210. The carrier assembly 200 further includes a frame 230, and the adjusting member 220 can be fixed to the frame 230.

[0029] Further, the processing device further includes a guiding assembly 300 for guiding the movable adjustment of the carrier 210. The guiding assembly 300 includes a guiding rod 310 arranged in the vertical direction. The guiding rod 310 is slidably connected to the carrier 210 so that the carrier 210 can be movably adjusted along the direction where the guiding rod 310 is located. More specifically, the force-receiving part 211 of the carrier 210 is slidably connected to the guiding rod 310, or the force-receiving part 211 is sleeved on the guiding rod 310. The arrangement of the guiding rod 310 ensures the stability and accuracy of the movement of the carrier 210 in the vertical direction, avoiding lateral deviation, thereby ensuring the contact position accuracy between the microneedle 120 and the workpiece 400. The carrier assembly 200 further includes a frame 230, and the guiding rod 310 can be fixedly connected to the frame 230.

[0030] In one embodiment, as Figure 2 shown, the magnet 221 is arranged above the force-receiving part 211, and the force-receiving part 211 has ferromagnetism so that the magnet 221 attracts the carrier 210 upward; in other words, when the magnet 221 is arranged above the force-receiving part 211, if the force-receiving part 211 has ferromagnetism, the magnet 221 will attract the carrier 210 upward.

[0031] Specifically, the power shaft 110 of the tool assembly 100 is connected to the microneedle 120, and the power shaft 110 can drive the microneedle 120 to generate ultrasonic vibration; the force-receiving part 211 with ferromagnetism is arranged on the carrier 210 of the carrier assembly 200, the adjusting part 220 is a magnet 221, and the adjusting part 220 is arranged above the force-receiving part 211; the guiding assembly 300 includes a vertical guiding rod 310, and the carrier 210 is slidably connected to the guiding rod 310.

[0032] Place the workpiece 400 on the carrier 210. Define that the carrier 210 is in the first position. At this time, the total gravity (m1 + m2)g of the carrier 210 and the workpiece 400 is balanced with the upward attraction Fx of the magnet 221 to the ferromagnetic force-receiving part 211, that is, (m1 + m2)g = Fx; lower the microneedle 120 to contact the workpiece 400 and press down. The carrier 210 is lowered and defined as the second position. The sum of the pressure F of the microneedle 120 on the workpiece 400 and the total gravity is equal to Fx at this time, that is, F+(m1 + m2)g = Fx; since the microneedle 120 only drills holes through ultrasonic vibration and the position no longer descends, as the drilling progresses, the material of the workpiece 400 is removed, and the carrier 210 gradually floats upward under the action of the attraction of the magnet 221, and Fx gradually decreases, always keeping the microneedle 120 in contact with the workpiece 400; after the drilling is completed, the carrier 210 returns to the first position, and at this time Fx approaches 0.

[0033] In the second embodiment, as Figure 2As shown in the figure, the magnet 221 is disposed above the force-receiving portion 211. The force-receiving portion 211 has magnetism and has a magnetic property opposite to that of the magnet 221, so that the magnet 221 attracts the carrier 210 upward; in other words, when the magnet 221 is disposed above the force-receiving portion 211, if the force-receiving portion 211 has a magnetic property opposite to that of the magnet 221, an upward attractive force will also be generated.

[0034] Specifically, the power shaft 110 of the tool assembly 100 is connected to the micro needle 120, and the power shaft 110 can drive the micro needle 120 to generate ultrasonic vibration; a magnetic force-receiving portion 211 is provided on the carrier 210 of the carrier assembly 200, the adjusting member 220 is a magnet 221, and the adjusting member 220 is disposed above the force-receiving portion 211, and the magnetic property of the force-receiving portion 211 is opposite to that of the magnet 221; the guiding assembly 300 includes a vertical guiding rod 310, and the carrier 210 is slidably connected to the guiding rod 310.

[0035] The workpiece 400 is placed on the carrier 210. It is defined that the carrier 210 is in the first position. At this time, the total gravity (m1 + m2)g of the carrier 210 and the workpiece 400 is balanced with the upward attractive force Fx of the magnet 221 on the force-receiving portion 211 with opposite magnetism, that is, (m1 + m2)g = Fx; the micro needle 120 is lowered to contact the workpiece 400 and pressed downward, and the carrier 210 is lowered and defined as the second position. The sum of the pressure F of the micro needle 120 on the workpiece 400 and the total gravity is equal to Fx at this time, that is, F+(m1 + m2)g = Fx; since the micro needle 120 only drills holes through ultrasonic vibration and the position does not drop any more, as the drilling progresses, the material of the workpiece 400 is removed, and the carrier 210 gradually floats upward under the action of the attractive force of the magnet 221, and Fx gradually decreases, and the micro needle 120 is always kept in contact with the workpiece 400; after the drilling is completed, the carrier 210 returns to the first position, and at this time Fx approaches 0.

[0036] In the third embodiment, as Figure 3 shown in the figure, the magnet 221 is disposed below the force-receiving portion 211. The force-receiving portion 211 has magnetism and has the same magnetic property as the magnet 221, so that the magnet 221 repels the carrier 210 upward; in other words, when the magnet 221 is disposed below the force-receiving portion 211 and the force-receiving portion 211 has the same magnetic property as the magnet 221, the magnet 221 will repel the carrier 210 upward. The magnetic interaction can provide an adjustment force in the vertical direction for the carrier 210, so that the carrier 210 can automatically adjust its position according to the force condition during the processing.

[0037] Specifically, the power shaft 110 of the tool assembly 100 is connected to the microneedle 120, and the power shaft 110 can drive the microneedle 120 to generate ultrasonic vibration; a magnetic force-receiving part 211 is provided on the carrier 210 of the carrier assembly 200, the adjusting member 220 is a magnet 221, and the adjusting member 220 is arranged below the force-receiving part 211, and the magnetism of the force-receiving part 211 is the same as that of the magnet 221; the guiding assembly 300 includes a vertical guiding rod 310, and the carrier 210 is slidably connected to the guiding rod 310.

[0038] Place the workpiece 400 on the carrier 210. Define that the carrier 210 is in the first position. At this time, the total gravity (m1 + m2)g of the carrier 210 and the workpiece 400 is balanced with the upward repulsive force Fx of the magnet 221 on the force-receiving part 211 with the same magnetism, that is, (m1 + m2)g = Fx; lower the microneedle 120 to contact the workpiece 400 and press down. The subsequent downward movement of the carrier 210 is defined as the second position. The sum of the pressure F of the microneedle 120 on the workpiece 400 and the total gravity is equal to Fx at this time, that is, F+(m1 + m2)g = Fx; since the microneedle 120 only drills holes through ultrasonic vibration and does not descend further in position, as the drilling progresses, the material of the workpiece 400 is removed, and the carrier 210 gradually floats upward under the action of the repulsive force of the magnet 221, and Fx gradually decreases, always keeping the microneedle 120 in contact with the workpiece 400; after the drilling is completed, the carrier 210 returns to the first position, and at this time Fx approaches 0.

[0039] Optionally, as Figure 4 shown, the adjusting member 220 is a spring 222. The spring 222 is connected between the frame 230 and the carrier 210, and the spring 222 is in a compressed state to act upward on the carrier 210; specifically, the carrier assembly 200 further includes a frame 230, the adjusting member 220 is a spring 222, and the spring 222 is connected between the frame 230 and the carrier 210 and is in a compressed state, so as to act upward on the carrier 210; the elastic force of the spring 222 can apply a continuous upward acting force on the carrier 210 during the processing, and cooperate with the downward pressing action of the microneedle 120 to realize the vertical movement adjustment of the carrier 210.

[0040] Specifically, the spring 222 is connected to the frame 230. The spring 222 is in a compressed state and acts upward on the carrier 210. The guiding rod 310 is vertically arranged, and the carrier 210 slides along the guiding rod 310.

[0041] Place the workpiece 400 on the carrier 210, defining that the carrier 210 is in the first position. At this time, the total gravity (m1 + m2)g of the carrier 210 and the workpiece 400 is balanced with the upward elastic force Fx of the spring 222 on the carrier 210, that is, (m1 + m2)g = Fx; lower the micro-needle 120 to contact the workpiece 400 and press it down. The downward movement of the carrier 210 is defined as the second position. The spring 222 is further compressed. The sum of the pressure F of the micro-needle 120 on the workpiece 400 and the total gravity is equal to Fx at this time, that is, F+(m1 + m2)g = Fx; since the micro-needle 120 only drills holes through ultrasonic vibration and its position no longer descends, as the drilling progresses, the material of the workpiece 400 is removed, and the carrier 210 gradually floats upward under the action of the spring 222, and Fx gradually decreases, always keeping the micro-needle 120 in contact with the workpiece 400; after the drilling is completed, the carrier 210 returns to the first position, and at this time Fx approaches 0.

[0042] During the processing, the acting force of the adjusting member 220 on the carrier 210 (or the workpiece 400) gradually decreases. As the drilling process progresses, the thickness of the workpiece 400 gradually becomes thinner. By controlling the decrease of the acting force through the adjusting member 220, the edge chipping of the micro-holes can be effectively prevented, which is beneficial to improving the quality of the micro-holes.

[0043] This application also provides a micro-hole processing method, which is applicable to the above-mentioned micro-hole processing device, such as Figure 5 shown. The micro-hole processing method includes: S1: Place the workpiece 400 on the carrier 210; S3: Make the micro-needle 120 contact the workpiece 400 and press it down on the workpiece 400 and the carrier 210, so that the micro-needle 120 drills holes in the workpiece 400; S4: The adjusting member 220 drives the carrier 210 to float upward, so that during the process of the micro-needle 120 drilling holes in the workpiece 400, the micro-needle 120 and the workpiece 400 always remain in contact.

[0044] Furthermore, before the micro-needle 120 contacts the workpiece 400 and presses it down to drill holes after placing the workpiece 400 on the carrier 210, it further includes: S2: Spray diamond abrasive liquid on the area to be drilled of the workpiece 400 or the micro-needle 120. The diamond abrasive particles in the diamond abrasive liquid will adhere to the bottom of the micro-needle 120 or the surface of the workpiece 400. During the subsequent processing, using the ultrasonic vibration of the micro-needle 120, the diamond abrasive continuously acts on the processing material, causing the material to fatigue, thereby improving the drilling efficiency.

[0045] It should be noted that the micro-hole processing method is not limited to the above steps. For example, the order of S1 and S2 can be interchanged.

[0046] Define the force exerted by the adjusting member 220 on the carrier 210 as Fx, which varies with the position of the carrier 210 relative to the adjusting member 220. Define the first position of the carrier 210 when the workpiece 400 is placed on the carrier 210. At the first position, (m1 + m2)g = Fx, where m1 is the mass of the workpiece 400 and m2 is the mass of the carrier 210. "Bringing the microneedle 120 into contact with the workpiece 400 and pressing down on the workpiece 400 and the carrier 210" includes: pressing down the microneedle 120 by a distance L, driving the carrier 210 to descend to the second position. At the second position, F+(m1 + m2)g = Fx, where F is the pressure exerted by the microneedle 120 on the workpiece 400; L is the thickness of the workpiece 400; so that during the drilling process of the microneedle 120 on the workpiece 400, the carrier 210 floats upward, causing Fx to gradually decrease until Fx = (m1 + m2)g after the drilling is completed. Here, the premise for Fx = (m1 + m2)g to hold is to neglect the mass of the removed material.

[0047] Furthermore, bring the microneedle 120 into contact with the workpiece 400 and press down on the workpiece 400 and the carrier 210, and the microneedle 120 drills the workpiece 400. During this process, the adjusting member 220 drives the carrier 210 to float upward to ensure that the microneedle 120 always remains in contact with the workpiece 400. Specifically, define the force exerted by the adjusting member 220 on the carrier 210 as Fx, which varies with the position of the carrier 210 relative to the adjusting member 220. When the workpiece 400 is placed on the carrier 210, the carrier 210 is in the first position, and at this time, (m1 + m2)g = Fx, where m1 is the mass of the workpiece 400 and m2 is the mass of the carrier 210. This is because the carrier 210 is subject to gravity (the total gravity of the workpiece 400 and the carrier 210) and the force Fx of the adjusting member 220 in the vertical direction and is in a balanced state. When the microneedle 120 is pressed down by a distance L (L is equal to the thickness of the workpiece 400), driving the carrier 210 to descend to the second position, the force balance relationship at this time becomes F+(m1 + m2)g = Fx, where F is the pressure exerted by the microneedle 120 on the workpiece 400. During the drilling process, the position of the microneedle 120 remains unchanged (the height remains the same), and the workpiece 400 is drilled only by ultrasonic means. As the microneedle 120 drills into the workpiece 400, the carrier 210 is subjected to the upward pushing action of the adjusting member 220 (such as the attraction of the magnet 221 or the change in the elastic force of the spring 222), Fx gradually decreases, and the carrier 210 floats upward, so that the microneedle 120 always remains in contact with the workpiece 400 until Fx = (m1 + m2)g after the drilling is completed.

[0048] In other words, when in the first position, the carrier 210 is stationary and the forces in the vertical direction are balanced. The total gravity is equal to the acting force of the adjusting member 220, that is, (m1 + m2)g = Fx. After pressing down, the microneedle 120 applies a pressure F, and the carrier 210 is stationary in the second position. At this time, F+(m1 + m2)g = Fx. Since the acting force of the adjusting member 220 increases as the position of the carrier 210 changes (for example, as the compression amount of the spring 222 increases, the elastic force increases; as the distance of the magnet 221 changes, the magnetic force changes); as the drilling progresses, the material of the workpiece 400 is removed, and the carrier 210 floats upward under the action of the adjusting member 220, and the acting force Fx of the adjusting member 220 gradually decreases until the drilling is completed, Fx = (m1 + m2)g, and the carrier 210 returns to the first position.

[0049] It should be noted that after the microneedle 120 presses down the workpiece 400 and the carrier 210, the position of the microneedle 120 does not change anymore, that is, the height remains unchanged. The microneedle 120 drills the workpiece 400 only by means of ultrasonic waves. As the microneedle 120 drills into the workpiece 400, the carrier 210 is pushed upward by the adjusting member 220, so that the workpiece 400 and the microneedle 120 always remain in contact; and diamond slurry is sprayed on the microneedle 120 or the workpiece 400, and diamond adheres to the bottom of the microneedle 120. By using ultrasonic vibration, the diamond at the needle hole is continuously pushed downward, and the processed material generates fatigue, thereby improving the drilling efficiency.

[0050] Furthermore, it further includes: Obtaining the initial height L0 when the microneedle 120 descends to the surface of the workpiece 400; After drilling, when drilling next time, obtaining the height Lx when the microneedle 120 descends to the surface of the workpiece 400; If Lw-(L0 - Lx) < L, then the microneedle 120 needs to be replaced, where Lw is the initial length of the microneedle 120 and L is the thickness of the workpiece 400.

[0051] In other words, the starting height position of the microneedle 120 is fixed, the initial length of the microneedle 120 is Lw, the initial height L0 when the microneedle 120 descends to the surface of the workpiece 400. After drilling, when drilling next time, the height when the microneedle 120 descends to the surface of the workpiece 120 is Lx. Then L0 - Lx is the wear amount of the microneedle 120; if Lw-(L0 - Lx) < L, it means that the wear amount of the microneedle 120 exceeds the allowable range, that is, the length of the microneedle 120 cannot penetrate the workpiece, and the microneedle 120 needs to be replaced to ensure the accuracy and quality of subsequent processing.

[0052] Although the preferred embodiments of the present application have been described, those skilled in the art can make additional changes and modifications once they learn the basic creative concepts. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications falling within the scope of the present application.

[0053] Obviously, those skilled in the art can make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, this application is also intended to cover these changes and modifications.

Claims

1. A micro-hole processing device, characterized in that, Comprising: A tool assembly (100), the tool assembly (100) is arranged in the vertical direction and has a degree of freedom of movement in the vertical direction. The tool assembly (100) includes: A power shaft (110), the power shaft (110) is used to provide drilling power; A micro-needle (120), the micro-needle (120) is fixedly connected to the power shaft (110), and the micro-needle (120) is used to drill holes in a workpiece (400); A carrier assembly (200), the carrier assembly (200) is arranged below the tool assembly (100). The carrier assembly (200) includes: A carrier (210), the carrier (210) is used to carry the workpiece (400), and the carrier (210) has a degree of freedom of movement in the vertical direction relative to the tool assembly (100); An adjusting member (220), the adjusting member (220) directly or indirectly acts on the carrier (210) to enable the carrier (210) to be adjusted vertically, so that the micro-needle (120) is always in contact with the workpiece (400) during drilling.

2. The micro-hole processing device according to claim 1, wherein The carrier (210) has a force-receiving portion (211), and the force-receiving portion (211) has magnetism or ferromagnetic property; the adjusting member (220) is a magnet (221), and the magnet (221) is used to cooperate with the force-receiving portion (211) to enable the carrier (210) to be adjusted vertically.

3. The micro-hole processing device according to claim 2, characterized in that, The magnet (221) is arranged above the force-receiving portion (211), and the force-receiving portion (211) has ferromagnetic property, so that the magnet (221) attracts the carrier (210) upward; or, The magnet (221) is arranged above the force-receiving portion (211), and the force-receiving portion (211) has magnetism and is opposite to the magnetism of the magnet (221), so that the magnet (221) attracts the carrier (210) upward.

4. A micro-hole machining device according to claim 2, wherein The magnet (221) is arranged below the force-receiving portion (211), and the force-receiving portion (211) has magnetism and is the same as the magnetism of the magnet (221), so that the magnet (221) repels the carrier (210) upward.

5. A micro-hole processing device according to claim 1, characterized in that The adjusting member (220) is a spring (222), the spring (222) is connected to the carrier (210), and the spring (222) is in a compressed state to act on the carrier (210) upward.

6. A micro-hole machining device according to any one of claims 1-5, characterized in that, It further includes a guiding assembly (300), the guiding assembly (300) is used to guide the vertical adjustment of the carrier (210). The guiding assembly (300) includes: A guiding rod (310), the guiding rod (310) is arranged in the vertical direction, and the guiding rod (310) is slidably connected to the carrier (210), so that the carrier (210) can be adjusted vertically along the direction of the guiding rod (310).

7. A micro-hole processing method, characterized in that, Applicable to the micro-hole machining device according to any one of claims 1-6, including: Placing the workpiece (400) on the carrier (210); Bring the microneedle (120) into contact with the workpiece (400) and press down on the workpiece (400) and the carrier (210) so that the microneedle (120) drills into the workpiece (400); The adjusting member (220) drives the carrier (210) to float upward so that during the process of the microneedle (120) drilling into the workpiece (400), the microneedle (120) and the workpiece (400) always remain in contact.

8. A micro-hole processing method according to claim 7, characterized in that, Before "Bring the microneedle (120) into contact with the workpiece (400) and press down on the workpiece (400) and the carrier (210) so that the microneedle (120) drills into the workpiece (400)", it further includes: Spray diamond abrasive liquid on the area of the workpiece (400) to be drilled; or, Spray diamond abrasive liquid on the microneedle (120).

9. A micro-hole machining method according to claim 7, wherein Define the acting force of the adjusting member (220) on the carrier (210) as Fx, and Fx changes with the position of the carrier (210) relative to the adjusting member (220); Define that when the workpiece (400) is placed on the carrier (210), the carrier (210) is in the first position, and at the first position, (m1 + m2)g = Fx, where m1 is the mass of the workpiece (400) and m2 is the mass of the carrier (210); The "Bring the microneedle (120) into contact with the workpiece (400) and press down on the workpiece (400) and the carrier (210)" includes: Press the microneedle (120) down by a distance of L, driving the carrier (210) to descend to the second position. At the second position, F+(m1 + m2)g = Fx, where F is the pressure of the microneedle (120) on the workpiece (400); L is the thickness of the workpiece (400); So that during the process of the microneedle (120) drilling into the workpiece (400), the carrier (210) floats upward, causing Fx to gradually decrease until Fx = (m1 + m2)g after the drilling is completed.

10. A micro-hole processing method according to claim 7, characterized in that, It further includes: Obtain the initial height L0 when the microneedle (120) descends to the surface of the workpiece (400); After drilling, obtain the height Lx when the microneedle (120) descends to the surface of the workpiece (400); If Lw-(L0 - Lx) < L, the microneedle (120) needs to be replaced, where Lw is the initial length of the microneedle (120) and L is the thickness of the workpiece (400).

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