Electroplating equipment

Abstract

The invention discloses electroplating equipment which is suitable for electroplating an object to be electroplated with a plurality of through holes. The electroplating equipment comprises an electroplating bath, a first anode plate, a second anode plate, a cathode plate, a first sensing module and a second sensing module, wherein the first anode plate and the second anode plate are arranged in the electroplating bath in parallel; the cathode plate is connected to an object to be electroplated; the cathode plate and the to-be-plated object are arranged in the electroplating bath and located between the first anode plate and the second anode plate. The first sensing module and the second sensing module are arranged in the electroplating bath and located between the first anode plate and the second anode plate. The first sensing module comprises a light source arranged between the to-be-plated object and the first anode plate and a light sensor arranged between the to-be-plated object and the second anode plate. The second sensing module comprises a first electrical sensor arranged between the to-be-plated object and the first anode plate and a second electrical sensor arranged between the to-be-plated object and the second anode plate.

Description

Technical Field

[0001] The present invention relates to an electroplating technology, and more particularly to an electroplating apparatus. Background Art

[0002] A conductive via is part of a circuit structure in a circuit board or a wafer and is used to electrically connect two or more circuit layers. Specifically, the process of forming a conductive via is to first form a via in an insulating substrate or a semiconductor substrate by drilling methods such as etching, laser or mechanical means, and then electroplate the via to fill the via with copper to form a conductive via. If the electroplating quality is poor, the probability of non-uniform or incomplete filling of the via will relatively increase. For example, voids are formed in the conductive via, which affects the resistance and current-carrying capacity of the conductive via. Summary of the Invention

[0003] The present invention is directed to an electroplating apparatus that helps to improve the electroplating uniformity and reduce the probability of void formation.

[0004] According to an embodiment of the present invention, an electroplating apparatus is adapted to electroplate an object to be plated having a plurality of vias. The electroplating apparatus includes an electroplating tank, a first anode plate and a second anode plate arranged in parallel in the electroplating tank, a cathode plate connected to the object to be plated, a first sensing module, and a second sensing module. The cathode plate and the object to be plated are disposed in the electroplating tank and are located between the first anode plate and the second anode plate. The first sensing module and the second sensing module are disposed in the electroplating tank and are located between the first anode plate and the second anode plate. The first sensing module includes a light source disposed between the object to be plated and the first anode plate and a light sensor disposed between the object to be plated and the second anode plate. The second sensing module includes a first electrical sensor disposed between the object to be plated and the first anode plate and a second electrical sensor disposed between the object to be plated and the second anode plate. Brief Description of the Drawings

[0005] Figure 1 is a schematic cross-sectional view of an electroplating apparatus according to an embodiment of the present invention;

[0006] Figure 2A is Figure 1 a partial enlarged view of region R1 of

[0007] Figure 2B is Figure 1 a partial enlarged view of region R2 of

[0008] Figure 3A is Figure 1 a partial enlarged view of region R3 of

[0009] Figure 3B is Figure 1 a partial enlarged view of region R4 of

[0010] Figures 4A to 4H is Figure 3A a front view schematic diagram of the first nozzle of

[0011] Figure 5 and its nozzle plate in different examples;

[0012] Figures 6A to 6D is Figure 5 a partial cross-sectional schematic diagram of the electroplating via filling process in multiple regions of the object to be plated of

[0013] Explanation of reference numerals:

[0014] 10. Object to be plated;

[0015] 11. Through hole;

[0016] 20. Adhesion layer;

[0017] 40. Surface plating layer;

[0018] 50. Conductive through hole;

[0019] 100. Electroplating equipment;

[0020] 101 - 107. Nozzle plates;

[0021] 1061. Jet hole;

[0022] 110. Electroplating bath;

[0023] 111. Liquid level;

[0024] 112. Inert gas injection port;

[0025] 120a. First anode plate;

[0026] 120b. Second anode plate;

[0027] 130. Cathode plate;

[0028] 140. First sensing module;

[0029] 141. Light source;

[0030] 142. Light sensor;

[0031] 150. Second sensing module;

[0032] 151. First electrical sensor;

[0033] 152. Second electrical sensor;

[0034] 160a. First positioning bracket;

[0035] 160b, second positioning bracket;

[0036] 170, eccentric swing module;

[0037] 171, motor;

[0038] 172, drive rod;

[0039] 173, connecting rod;

[0040] 180a, first nozzle;

[0041] 181a, 181b, jet openings;

[0042] 180b, second nozzle;

[0043] 180c, first bottom nozzle;

[0044] 180d, second bottom nozzle;

[0045] 190a, first flowmeter;

[0046] 190b, second flowmeter;

[0047] 190c, first bottom flowmeter;

[0048] 190d, second bottom flowmeter;

[0049] 501, bridging;

[0050] D1, first distance;

[0051] D2, second distance;

[0052] D3, eccentric distance;

[0053] D4, D5, D6, distances;

[0054] R1, R2, R3, R4, RC, RT, RB, RR, RL, regions;

[0055] X, Y, Z, directions;

[0056] AX, axis. Detailed Description of the Invention

[0057] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0058] Figure 1 is a schematic cross-sectional view of an electroplating apparatus according to an embodiment of the present invention. Figure 2A is Figure 1 a partially enlarged schematic view of region R1 ofFigure 2B Yes Figure 1 Partial enlarged schematic view of the region R2. Please refer to Figure 1 , Figure 2A and Figure 2B , in this embodiment, the electroplating apparatus 100 is applicable to a circuit board process or a semiconductor process, and is suitable for electroplating the object to be plated 10. Further, the object to be plated 10 may be an insulating substrate or a semiconductor substrate having a plurality of through holes 11, and each through hole 11 may be a hole with a high aspect ratio that penetrates the insulating substrate or the semiconductor substrate.

[0059] As Figure 1 shown, the electroplating apparatus 100 includes an electroplating bath 110, a first anode plate 120a, a second anode plate 120b, a cathode plate 130, a first sensing module 140, and a second sensing module 150. Specifically, the first anode plate 120a and the second anode plate 120b are arranged in parallel in the electroplating bath 110, and at least a part of the first anode plate 120a and at least a part of the second anode plate 120b are immersed in the electroplating solution. In addition, the cathode plate 130 and the object to be plated 10 are arranged in the electroplating bath 110. In the X direction, the cathode plate 130 and the object to be plated 10 are located between the first anode plate 120a and the second anode plate 120b. At least a part of the cathode plate 130 is immersed in the electroplating solution, wherein the object to be plated 10 is completely immersed in the electroplating solution and is connected to the end of the cathode plate 130.

[0060] During the electroplating process, the object to be plated 10 connected to the cathode plate 130 serves as a cathode, and metal ions in the electroplating solution can be reduced to metals on the cathode to be deposited in each through hole 11 of the object to be plated 10 (see Figure 2A and Figure 2B ). In addition, the first anode plate 120a and the second anode plate 120b may be soluble anodes, insoluble anodes, or a combination thereof. For example, a soluble anode can oxidize to generate metal ions during the electroplating process to supplement the metal ion concentration in the electroplating solution reduced by the cathode reduction reaction. On the other hand, an insoluble anode can oxidize to generate hydroxide ions during the electroplating process to keep the metal ion concentration in the electroplating solution stable.

[0061] As Figure 1 and Figure 2AAs shown, in this embodiment, the first sensing module 140 is disposed within the electroplating bath 110 and is completely immersed in the electroplating solution. Specifically, the first sensing module 140 includes a light source 141 and a photosensor 142. In the X direction, the light source 141 is disposed between the object to be plated 10 and the first anode plate 120a, and the photosensor 142 is disposed between the object to be plated 10 and the second anode plate 120b. The light source 141 can be a light-emitting diode or a gas discharge tube, and is adapted to project light with a wavelength range between 400 nanometers and 700 nanometers onto the object to be plated 10. In other examples, the light source can be an infrared light source, an ultraviolet light source, a laser light source, a halogen light source, or other light sources suitable for image detection.

[0062] During the process of electroplating and filling the vias 11, a bridge will be formed in each via 11 first, and then deposition will occur from the bridge to the opposite two openings to completely fill the via 11. To monitor the via filling situation in real time, the light source 141 can project light onto each via 11, and the photosensor 142 can detect the light passing through each via 11 to determine the bridge formation state in each via 11, so as to ensure that each via 11 can be completely filled subsequently to form a conductive via without voids.

[0063] As Figure 1 and Figure 2B shown, in this embodiment, the second sensing module 150 is disposed within the electroplating bath 110 and is completely immersed in the electroplating solution. Specifically, the second sensing module 150 includes a first electrical sensor 151 and a second electrical sensor 152. In the X direction, the first electrical sensor 151 is disposed between the object to be plated 10 and the first anode plate 120a, and the second electrical sensor 152 is disposed between the object to be plated 10 and the second anode plate 120b. The first electrical sensor 151 and the second electrical sensor 152 can be reference electrodes, and include a silver / silver chloride electrode, a calomel electrode, or a saturated mercury / mercurous sulfate electrode.

[0064] During the process of electroplating and filling the vias 11, to monitor the via filling situation in real time, the first electrical sensor 151 and the second electrical sensor 152 can measure the change in potential or current to determine at least one of the bridge formation rate, bridge formation state, via filling rate, and via filling state in each via 11, so as to ensure that each via 11 is completely filled to form a conductive via without voids.

[0065] As Figure 1 shown, in this embodiment, the first anode plate 120a and the cathode plate 130 are separated by a first distance D1 in the X direction, and the second anode plate 120b and the cathode plate 130 are separated by a second distance D2 equal to the second distance D2 in the X direction. The first distance D1 is equal to the second distance D2 and remains unchanged, for example, between 3 centimeters and 10 centimeters.

[0066] Specifically, the electroplating apparatus 100 further includes a first positioning bracket 160a and a second positioning bracket 160b that are arranged in parallel within the electroplating tank 110, and at least part of the first positioning bracket 160a and at least part of the second positioning bracket 160b are immersed in the electroplating solution. On the other hand, the cathode plate 130 is clamped and positioned between the first positioning bracket 160a and the second positioning bracket 160b. In the X direction, the first positioning bracket 160a is located between the first anode plate 120a and the cathode plate 130, and the second positioning bracket 160b is located between the second anode plate 120b and the cathode plate 130.

[0067] As Figure 1 , Figure 2A and Figure 2B shown, in the X direction, the first sensing module 140 is arranged between the first positioning bracket 160a and the second positioning bracket 160b, wherein the light source 141 is connected to the side of the first positioning bracket 160a facing the cathode plate 130 or the object to be plated 10, and the light sensor 142 is connected to the side of the second positioning bracket 160b facing the cathode plate 130 or the object to be plated 10. On the other hand, in the X direction, the second sensing module 150 is arranged between the first positioning bracket 160a and the second positioning bracket 160b, wherein the first electrical sensor 151 is connected to the side of the first positioning bracket 160a facing the cathode plate 130 or the object to be plated 10, and the second electrical sensor 152 is connected to the side of the second positioning bracket 160b facing the cathode plate 130 or the object to be plated 10.

[0068] As Figure 1 shown, in this embodiment, the electroplating apparatus 100 further includes an eccentric swing module 170, wherein the eccentric swing module 170 is arranged above the electroplating tank 110 and connected to the cathode plate 130. Specifically, the eccentric swing module 170 includes a motor 171, a drive rod 172, and a connecting rod 173. The drive rod 172 is connected to the motor 171 and is adapted to be driven by the motor 171 to rotate about the axis AX. For example, the drive rod 172 extends in the X direction and is parallel to the axis AX. In the Y direction, the drive rod 172 is spaced from the axis AX by an eccentric distance D3.

[0069] On the other hand, the connecting rod 173 extends in the Y direction and is perpendicular to the drive rod 172. Further, the drive rod 172 is connected to the cathode plate 130 through the connecting rod 173. When the drive rod 172 is driven by the motor 171 to rotate about the axis AX, the connecting rod 173, the cathode plate 130, the object to be plated 10, the first bracket 160a, and the second bracket 160b are adapted to rotate about the axis AX synchronously with the drive rod 172. In addition, the rotational speed of the motor 171 can be between 5 revolutions per minute and 400 revolutions per minute.

[0070] Since the object to be plated 10 can be driven by the eccentric swing module 170 in the electroplating solution to swing along a specific path and has movement trajectories in the Y direction and the Z direction, it helps to improve the uneven or incomplete filling of each via hole 11, so as to ensure that each via hole 11 is completely filled to form a conductive via hole without voids.

[0071] For example, the eccentric distance D3 can be 1 / 10 to 1 / 2 times the distance D4 from the edge of the object to be plated 10 to the center of the object to be plated 10. Taking the object to be plated 10 as a circular object to be plated as an example, the center of the object to be plated 10 can be the center of the circle, and the distance D4 can be the radius of the object to be plated 10. Taking the object to be plated 10 as an object to be plated with other geometric shapes as an example, the center of the object to be plated 10 can be the geometric center. Taking the object to be plated 10 as a parallelogram as an example, the center of the object to be plated 10 can be the geometric center, that is, the intersection point of the two diagonals in the parallelogram.

[0072] Figure 3A Yes Figure 1 Partial enlarged schematic diagram of the region R3. Figure 3B Yes Figure 1 Partial enlarged schematic diagram of the region R4. Please refer to Figure 1 , Figure 3A and Figure 3B , in this embodiment, the electroplating device 100 further includes a plurality of first nozzles 180a and a plurality of second nozzles 180b, wherein each first nozzle 180a and each second nozzle 180b are arranged corresponding to the object to be plated 10 in the electroplating tank 110 and are completely immersed in the electroplating solution. Further, each first nozzle 180a is connected to the side of the first anode plate 120a facing the cathode plate 130 or the object to be plated 10, and each second nozzle 180b is connected to the side of the second anode plate 120b facing the cathode plate 130 or the object to be plated 10.

[0073] For example, each first nozzle 180a is integrated with the first anode plate 120a and penetrates through the first anode plate 120a to protrude from the side of the first anode plate 120a facing the cathode plate 130 or the object to be plated 10. In addition, each second nozzle 180b is integrated with the second anode plate 120b and penetrates through the second anode plate 120b to protrude from the side of the second anode plate 120b facing the cathode plate 130 or the object to be plated 10. In the X direction, the cathode plate 130, the object to be plated 10, the first sensing module 140 and the second sensing module 150 are located between each first nozzle 180a and each second nozzle 180b.

[0074] In other examples, each first nozzle 180a is integrated into the first anode plate 120a and embedded in the first anode plate 120a to be flush with the side of the first anode plate 120a facing the cathode plate 130 or the object to be plated 10. Additionally, each second nozzle 180b is integrated into the second anode plate 120b and embedded in the second anode plate 120b to be flush with the side of the second anode plate 120b facing the cathode plate 130 or the object to be plated 10.

[0075] As Figure 1 , Figure 3A and Figure 3B shown, in this embodiment, each first nozzle 180a has a jet opening 181a facing the object to be plated 10, and each second nozzle 180b has a jet opening 181b facing the object to be plated 10. Therefore, each first nozzle 180a and each second nozzle 180b can spray the electroplating solution onto the object to be plated 10 in the X direction, for improving the filling efficiency and filling quality of each through hole 11.

[0076] As Figure 1 shown, in the Y direction, the depths of each first nozzle 180a from the liquid surface 111 of the electroplating tank 110 are different, so as to be arranged in multiple rows on the first anode plate 120a. Further, the first nozzles 180a in the same row are arranged in the Z direction. On the other hand, in the Y direction, the depths of each second nozzle 180b from the liquid surface 111 of the electroplating tank 110 are different, so as to be arranged in multiple rows on the second anode plate 120b. Further, the second nozzles 180b in the same row are arranged in the Z direction.

[0077] In this embodiment, the electroplating device 100 further includes a plurality of first flow meters 190a provided corresponding to different rows of the first nozzles 180a and a plurality of second flow meters 190b provided corresponding to different rows of the second nozzles 180b. Specifically, the first nozzles 180a in the same row are connected to the same first flow meter 190a, so that the first flow meter 190a controls or regulates the first nozzles 180a at the same liquid surface depth to spray the electroplating solution with the same flow rate. Additionally, the second nozzles 180b in the same row are connected to the same second flow meter 190b, so that the second flow meter 190b controls or regulates the second nozzles 180b at the same liquid surface depth to spray the electroplating solution with the same flow rate.

[0078] For example, the first flowmeter 190a can control or regulate the ejection flow rate of the first nozzle 180a to be between 0.2 liters per minute and 15 liters per minute, and the second flowmeter 190b can control or regulate the ejection flow rate of the second nozzle 180b to be between 0.2 liters per minute and 15 liters per minute. As the liquid level depth increases, the first flowmeter 190a can increase the ejection flow rate of the first nozzle 180a, and the second flowmeter 190b can increase the ejection flow rate of the second nozzle 180b to increase the flow rate or exchange efficiency of the electroplating solution near the bottom of the electroplating tank 110.

[0079] As Figure 1 shown, in this embodiment, the electroplating apparatus 100 further includes at least one row of bottom nozzles disposed at the bottom of the electroplating tank 110. Here, the first bottom nozzle 180c and the second bottom nozzle 180d arranged in two rows along the Z direction are used for illustration, but not limited thereto. In the X direction, the first bottom nozzle 180c is located between the cathode plate 130 and the first anode plate 120a, and the second bottom nozzle 180d is located between the cathode plate 130 and the second anode plate 120b.

[0080] For example, the distance D5 between the first bottom nozzle 180c and the cathode plate 130 is less than or equal to 1 / 3 times the first distance D1, and the distance D6 between the second bottom nozzle 180d and the cathode plate 130 is less than or equal to 1 / 3 times the second distance D2.

[0081] In this embodiment, the electroplating apparatus 100 further includes at least one bottom flowmeter. Here, the first bottom flowmeter 190c and the second bottom flowmeter 190d corresponding to the first bottom nozzle 180c and the second bottom nozzle 180d are used for illustration, but not limited thereto. Specifically, the first bottom flowmeter 190c is connected to the first bottom nozzle 180c in the same row to control or regulate the electroplating solution ejected from the first bottom nozzle 180c in the same row to have the same flow rate. In addition, the second bottom flowmeter 190d is connected to the second bottom nozzle 180d in the same row to control or regulate the electroplating solution ejected from the second bottom nozzle 180d in the same row to have the same flow rate.

[0082] Please refer to Figure 1 , in this embodiment, an inert gas injection port 112 is provided at the bottom of the electroplating tank 110. In the X direction, the inert gas injection port 112 is located between the first anode plate 120a and the second anode plate 120b, and between the first bottom nozzle 180c and the second bottom nozzle 180d. Specifically, the inert gas injection port 112 extends along the Z direction. In the Y direction, the object to be plated 10 is located between the cathode plate 130 and the inert gas injection port 112, and at least part of the inert gas injection port 112 falls within the projection range of the cathode plate 130 on the bottom of the electroplating tank 110.

[0083] For example, the inert gas injection port 112 can inject nitrogen or other inert gases into the electroplating solution to reduce the oxygen concentration and prevent oxidation.

[0084] Figures 4A to 4H Yes Figure 3A The front view schematic diagrams of the first nozzle and its nozzle plate in different examples. Please refer to Figure 1 、 Figure 3A and Figure 3B , in this embodiment, the structural designs of the first nozzle 180a, the second nozzle 180b, the first bottom nozzle 180c and the second bottom nozzle 180d are the same or similar. The following will take the structural design of the first nozzle 180a as an example for description, and the structural designs of the second nozzle 180b, the first bottom nozzle 180c and the second bottom nozzle 180d will not be elaborated one by one.

[0085] Such as Figure 1 and Figure 4A , in one example, a nozzle plate 101 is installed at the jet opening 181a of the first nozzle 180a, and the nozzle plate 101 has jet holes distributed in a brick-tile shape. Such as Figure 1 and Figure 4B , in one example, a nozzle plate 102 is installed at the jet opening 181a of the first nozzle 180a, and the nozzle plate 102 has jet holes distributed in a diamond grid shape. Such as Figure 1 and Figure 4C , in one example, a nozzle plate 103 is installed at the jet opening 181a of the first nozzle 180a, and the nozzle plate 103 has jet holes distributed in a tile shape or a fish scale shape. Such as Figure 1 and Figure 4D , in one example, a nozzle plate 104 is installed at the jet opening 181a of the first nozzle 180a, and the nozzle plate 104 has jet holes distributed in a knitted shape.

[0086] Such as Figure 1 and Figure 4E , in one example, a nozzle plate 105 is installed at the jet opening 181a of the first nozzle 180a, and the nozzle plate 105 has jet holes distributed in a honeycomb shape. Such as Figure 1 and Figure 4F , in one example, a nozzle plate 106 is installed at the jet opening 181a of the first nozzle 180a, and the nozzle plate 106 has a plurality of jet holes 1061. Specifically, the plurality of jet holes 1061 are a plurality of round holes and are arranged in multiple circles outward from the center of the jet opening 181a. In the radial direction of the jet opening 181a, the aperture of the jet holes 1061 decreases from the inside to the outside. Such as Figure 1 and Figure 4G, in one example, a nozzle plate 107 is installed at the jet opening 181a of the first nozzle 180a, and the nozzle plate 107 has jet holes distributed in a striped pattern. As Figure 1 And Figure 4H , in one example, no nozzle plate is installed at the jet opening 181a of the first nozzle 180a, and the jet opening 181a is a single circular opening.

[0087] For example, the aperture diameter of the jet holes in the above-mentioned multiple examples ranges from 1.9 mm to 5.2 mm.

[0088] Figure 5 is a top view schematic diagram of the object to be plated. Figures 6A to 6D is Figure 5 a partial cross-sectional schematic diagram of the electroplating via filling process in multiple regions of the object to be plated. Please refer to Figure 1 And Figure 5 , the object to be plated 10 can be driven by the eccentric swing module 170 in the electroplating solution to swing along a specific path, and has movement trajectories in the Y direction and the Z direction. Therefore, through this swing design, the electroplating rates and electroplating uniformity in each region RC, RT, RB, RR, and RL of the object to be plated 10 can tend to be consistent, so as to reduce the difference in the thickness of the surface coating in region RC and the thickness of the surface coatings in other regions RT, RB, RR, and RL. For example, region RC is the central region of the object to be plated 10, and regions RT, RB, RR, and RL are the peripheral regions outside the central region.

[0089] Please refer to Figure 5 , Figure 6A And Figure 6B , first, a wet metallization technique is used to form an adhesion layer 20 on the surface of the object to be plated 10 and on the inner wall surfaces of each through hole 11 in each region RC, RT, RB, RR, and RL. Then, please refer to Figure 5 And Figure 6C , electroplate the object to be plated 10, for example, perform electroplating via filling on each through hole 11 in each region RC, RT, RB, RR, and RL. During the process of electroplating via filling each through hole 11, a bridge 501 will be formed in each through hole 11 first, and then deposit from the bridge 501 to the opposite two openings to completely fill the through hole 11 to form Figure 6D the conductive through hole 50 shown.

[0090] As Figure 2A And Figure 6CAs shown, in order to monitor the formation status of the bridge 501 in real time, the light source 141 can project light rays into each through hole 11, and the light sensor 142 can detect the light rays passing through each through hole 11 to determine whether the bridge 501 in each through hole 11 is completely formed. For example, when the bridge 501 in each through hole 11 is completely formed, the light rays emitted by the light source 141 are blocked by the bridge 501 in each through hole 11, so they cannot be detected by the light sensor 142, based on which it is determined that the bridge 501 is completely formed.

[0091] As Figure 2B , Figure 6C and Figure 6D As shown, during the process of electroplating and filling the through holes 11, the first electrical sensor 151 and the second electrical sensor 152 can measure the change in potential or current to determine at least one of the bridge formation rate, bridge formation status, filling rate, and filling status in each through hole 11, so as to ensure that each through hole 11 is completely filled to form a conductive through hole 50 without voids.

[0092] As Figure 1 and Figure 6D As shown, since the object to be plated 10 is driven by the eccentric swing module 170 in the electroplating solution to swing along a specific path, the thickness of the surface coating 40 on the object to be plated 10 in each region RC, RT, RB, RR, and RL can tend to be consistent. For example, the maximum thickness difference can be less than or equal to 6 micrometers, and the electroplating uniformity can be greater than 95%. That is to say, the object to be plated 10 can be electroplated by the electroplating device 100 to achieve extremely high electroplating uniformity.

[0093] In summary, the electroplating device of the present invention can monitor the electroplating and filling conditions of the through holes in real time through the first sensing module and the second sensing module to ensure that each through hole of the object to be plated is completely filled to form a conductive through hole without voids. Specifically, the first sensing module adopts a light sensing mechanism to assist in judging the bridge formation status in each through hole based on the results of light sensing. In addition, the second sensing module adopts an electrical measurement mechanism to assist in judging at least one of the bridge formation rate, bridge formation status, filling rate, and filling status in each through hole based on the results of electrical measurement.

[0094] In addition, since the object to be plated can be driven by the eccentric swing module in the electroplating solution to swing along a specific path, it helps to improve the uneven or incomplete filling of the through holes of the object to be plated, so as to ensure that each through hole of the object to be plated is completely filled to form a conductive through hole without voids.

[0095] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An electroplating device, suitable for electroplating an object to be plated having a plurality of through holes, characterized in that, The electroplating equipment includes: An electroplating bath; A first anode plate; A second anode plate, disposed in parallel with the first anode plate in the electroplating bath; A cathode plate, connected to the object to be plated, wherein the cathode plate and the object to be plated are disposed in the electroplating bath and located between the first anode plate and the second anode plate; A first sensing module, disposed in the electroplating bath and located between the first anode plate and the second anode plate, wherein the first sensing module includes: A light source, disposed between the object to be plated and the first anode plate; and A light sensor, disposed between the object to be plated and the second anode plate; and A second sensing module, disposed in the electroplating bath and located between the first anode plate and the second anode plate, wherein the second sensing module includes: A first electrical sensor, disposed between the object to be plated and the first anode plate; and A second electrical sensor, disposed between the object to be plated and the second anode plate.

2. The electroplating equipment according to claim 1, characterized in that It further includes: An eccentric swing module, disposed above the electroplating bath and connected to the cathode plate.

3. The electroplating equipment according to claim 2, characterized in that, The eccentric swing module includes: A motor; A drive rod, connected to the motor, wherein the drive rod is adapted to be driven by the motor to rotate about an axis; and A connecting rod, wherein the drive rod is connected to the cathode plate through the connecting rod, and the connecting rod, the cathode plate and the object to be plated are adapted to rotate synchronously about the axis with the drive rod.

4. The electroplating equipment according to claim 3, characterized in that, There is an eccentric distance between the drive rod and the axis, and the eccentric distance is 1 / 10 times to 1 / 2 times the distance from the edge of the object to be plated to the center of the object to be plated.

5. The electroplating equipment according to claim 3, characterized in that, The drive rod is parallel to the axis and perpendicular to the connecting rod.

6. The electroplating equipment according to claim 3, characterized in that, The rotational speed of the motor is between 5 revolutions per minute and 400 revolutions per minute.

7. The electroplating equipment according to claim 1, wherein It further includes: A first positioning bracket; And A second positioning bracket, disposed in parallel with the second positioning bracket in the electroplating bath, and the cathode plate is clamped and positioned between the first positioning bracket and the second positioning bracket, wherein the first positioning bracket is located between the first anode plate and the cathode plate, and the second positioning bracket is located between the second anode plate and the cathode plate.

8. The electroplating equipment according to claim 7, characterized in that, The light source is connected to the side of the first positioning bracket facing the object to be plated, and the light sensor is connected to the side of the second positioning bracket facing the object to be plated.

9. The electroplating equipment according to claim 7, characterized in that The first electrical sensor is connected to the side of the first positioning bracket facing the object to be plated, and the second electrical sensor is connected to the side of the second positioning bracket facing the object to be plated.

10. The electroplating equipment according to claim 1, characterized in that The first anode plate and the cathode plate are separated by a first distance, and the second anode plate and the cathode plate are separated by a second distance equal to the first distance.

11. The electroplating equipment according to claim 10, characterized in that, The first distance is between 3 cm and 10 cm.

12. The electroplating equipment according to claim 1, characterized in that, The wavelength range of the light source is between 400 nanometers and 700 nanometers.

13. The electroplating equipment according to claim 1, wherein, It further includes: A plurality of first nozzles, disposed in the electroplating bath and connected to the first anode plate; And A plurality of second nozzles, disposed in the electroplating bath and connected to the second anode plate.

14. The electroplating equipment according to claim 13, characterized in that, The plurality of first nozzles are connected to a side of the first anode plate facing the cathode plate, and the plurality of second nozzles are connected to a side of the second anode plate facing the cathode plate.

15. The electroplating equipment according to claim 13, characterized in that, The cathode plate, the object to be plated, the first sensing module, and the second sensing module are located between the plurality of first nozzles and the plurality of second nozzles.

16. The electroplating apparatus according to claim 13, characterized in that, The depths of the plurality of first nozzles from the liquid level of the electroplating bath are different to be arranged in multiple rows on the first anode plate, and the depths of the plurality of second nozzles from the liquid level of the electroplating bath are different to be arranged in multiple rows on the second anode plate.

17. The electroplating equipment according to claim 16, wherein, Further comprising: A plurality of first flow meters, provided corresponding to different rows of the plurality of first nozzles, and the plurality of first nozzles in the same row are connected to the same first flow meter; And A plurality of second flow meters, provided corresponding to different rows of the plurality of second nozzles, and the plurality of second nozzles in the same row are connected to the same second flow meter.

18. The electroplating equipment according to claim 13, characterized in that, Each of the first nozzles and each of the second nozzles individually has a jet opening facing the object to be plated, and each of the jet openings is provided with a nozzle plate, and each of the nozzle plates has a plurality of jet holes.

19. The electroplating equipment according to claim 18, characterized in that, The aperture diameters of the jet holes are between 1.9 millimeters and 5.2 millimeters.

20. The electroplating equipment according to claim 1, characterized in that, The first electrical sensor and the second electrical sensor are reference electrodes, and include silver / silver chloride electrodes, calomel electrodes, or saturated mercury / mercurous sulfate electrodes.

21. The electroplating equipment according to claim 1, characterized in that, Further comprising: At least one row of bottom nozzles, arranged at the bottom of the electroplating bath and located between the first anode plate and the cathode plate or between the second anode plate and the cathode plate.

22. The electroplating equipment according to claim 21, wherein, Further comprising: At least one bottom flow meter, connected to the at least one row of bottom nozzles.

23. The electroplating equipment according to claim 1, characterized in that, An inert gas injection port is provided at the bottom of the electroplating bath and is located between the first anode plate and the second anode plate.

24. The electroplating equipment according to claim 23, characterized in that, The object to be plated is located between the cathode plate and the inert gas injection port, and at least a part of the inert gas injection port falls within the projection range of the cathode plate on the bottom of the electroplating bath.

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