Optical device testing method

Abstract

The invention discloses an optical device testing method, and relates to the technical field of optical devices. A direct-current test board and a radio-frequency test board are arranged according to test functions, the direct-current test board is provided with a direct-current test circuit, the radio-frequency test board is provided with a high-frequency terminal, a driving chip and an interface used for being connected with an optical device, the high-frequency terminal is used for being connected with test equipment, and the high-frequency terminal and the interface are electrically connected with the driving chip. The radio frequency test board is further provided with a direct current board interface, the direct current board interface is used for being detachably connected with the direct current test board, and when the direct current test board is connected with the radio frequency test board through the direct current board interface, the direct current test board is electrically connected with the radio frequency test board. According to the invention, the direct-current test board and the radio-frequency test board are detachably connected, so that different direct-current test boards and different radio-frequency test boards can be randomly combined to achieve the effect of reducing the cost.

Description

Technical Field

[0001] The present invention relates to the technical field of optical devices, and specifically provides a method for testing optical devices. Background Art

[0002] After the production of optical devices, it is necessary to comprehensively test various performances of the optical devices, and the evaluation test data serves as the parameter basis for the optical devices when leaving the factory for customers' reference. For the same type of devices, due to different usage scenarios of customers, different flexible circuit boards need to be matched. Therefore, from one type of optical device, multiple types of optical devices will be derived, and different types of optical devices require test equipment with different types of interfaces. Moreover, in many cases, the performance parameters of the optical devices are the same, only the pin pitch is different, and the test equipment cannot be used in common. To deal with different types of optical devices, corresponding equipment needs to be equipped, resulting in a variety of test equipment types. This is very unfavorable for the production line process management and also increases the production test cost. Summary of the Invention

[0003] The present invention provides a method for testing optical devices, which is used to solve the problem of high test cost caused by the need to separately set up a test board to connect with the test equipment for different optical devices.

[0004] The technical solution of the present invention is as follows:

[0005] A method for testing optical devices, in which a DC test board and an RF test board are set according to the test function. The DC test board is provided with a DC test circuit. The RF test board is provided with high-frequency terminals, a driving chip, and an interface for connecting with the optical device. The high-frequency terminals are used to connect with the test equipment. The high-frequency terminals and the interface are electrically connected to the driving chip. The RF test board is also provided with a DC board interface, and the DC board interface is used for detachable connection with the DC test board. When the DC test board is connected to the RF test board through the DC board interface, the DC test board and the RF test board are electrically connected.

[0006] In this solution, according to the functions of DC test and RF test, the DC test circuit is set on the DC test board, and the DC test board and the RF test board are detachably connected through the DC board interface on the RF test board. When testing different optical devices, the DC test boards with different DC test circuits can be combined with the RF test boards with different interfaces, high-frequency terminals, and driving chips for use, so as to form multiple combinations. Through the combinations, multiple required test circuits can be obtained, improving the utilization rate of each DC test board and RF test board, and achieving the effect of reducing the test cost.

[0007] To solve the problem of high cost in manufacturing multiple DC test boards, a socket and a functional module are provided on the DC test board. The functional module is provided with a plug, and the plug is detachably connected to the socket. The functional module is provided with a DC test circuit, and the DC test circuit of the DC test board is changed by replacing the functional module.

[0008] In this solution, since the functional module is provided with a support test circuit and the functional module is detachably connected to the DC test board, the DC test circuit of the DC test board can be changed by replacing the functional module. Therefore, the functional module can be replaced during testing, further improving the utilization rate of the functional module and the DC test board, and further reducing costs.

[0009] To solve the problem of reducing the test efficiency due to frequent disassembly and assembly of the functional module, at least two sockets are provided on the DC test board, and each socket is respectively used to connect the functional module.

[0010] In this solution, the DC test circuit of the DC test board is increased by increasing the number of functional modules connected to the DC test board, and the functions that can be tested are increased. The functional modules required for testing the corresponding optical devices can be directly installed on the DC test board in advance, and there is no need to replace the functional module during the test process, improving the test efficiency.

[0011] Preferably, each functional module is respectively provided with a DC test circuit for testing different data.

[0012] Optionally, the DC test board can directly set a DC test circuit and can set two or more DC test circuits for testing different data to improve the comprehensiveness of the test. If the DC detection of the optical device can be completed entirely on one DC test board, the DC test efficiency can be increased to the highest, significantly reducing the time cost of the test.

[0013] To improve the versatility of the RF test board, at least two interfaces are provided on the RF test board.

[0014] In this solution, at least two interfaces are set, enabling the RF test board to be used to connect to different optical devices, thereby testing different optical devices, improving the utilization rate of the RF test board, and reducing costs.

[0015] Preferably, the interface includes a transmitter terminal and a receiver terminal, and the drive chip is compatible with the transmitter and the receiver.

[0016] In this solution, optical devices can be classified into transmitters and receivers according to their functions. The interfaces provided include transmitter terminals and receiver terminals. The transmitter terminals are used to connect to transmitters, while the receiver terminals are used to connect to receivers. Moreover, the drive chip is compatible with both transmitters and receivers, enabling the RF test board to be applicable to both transmitters and receivers simultaneously, improving the versatility of the RF test board and reducing the test cost.

[0017] Preferably, the RF test board is provided with interfaces of different models and is connected to optical devices of different models through different interfaces.

[0018] In this solution, by providing interfaces of different models, it can be applicable to optical devices of different models, improving the versatility of the RF test board.

[0019] Preferably, the interface is a pin, and the optical device is directly connected to the pin of the RF circuit board through the pin.

[0020] In this solution, the optical device can be directly connected to the RF test board by simply pressing the pin of the optical device onto the pin of the RF circuit board, improving the connection efficiency between the optical device and the RF circuit.

[0021] The traditional high-frequency terminal is connected to the high-frequency wire through a thread, and each high-frequency wire needs to be tightened separately, resulting in low connection efficiency. To improve the connection efficiency between the RF circuit board and the detection device, therefore, the high-frequency terminal is provided with a number of high-frequency jacks for connecting high-frequency wires, and each high-frequency wire is connected to the high-frequency jack through a plug-in method.

[0022] In this solution, multiple high-frequency wires can be connected simultaneously through the plug-in method, significantly improving the connection efficiency.

[0023] Advantages of the present invention:

[0024] The present invention adopts a detachable connection method between the DC test board and the RF test board, enabling different DC test boards and different RF test boards to be arbitrarily combined to achieve the effect of cost reduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solution of the present invention, the drawings required for describing the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 It is a schematic diagram of the present invention.

[0027] In the above drawings, the corresponding reference numerals are shown as follows:

[0028] 1. DC test board; 2. RF test board; 3. Function module; 4. DC board interface; 5. High-frequency terminal; 6. Driver chip; 7. Transmitter terminal; 8. Receiver terminal. Detailed implementation mode

[0029] In combination with the attached drawings, through the specific implementation mode of the embodiments of the present invention, the technical solutions of the present invention are clearly and completely described.

[0030] Embodiment 1:

[0031] As Figure 1 shown, Embodiment 1 of the present invention provides an optical device testing method. By using a detachable connection method between the DC test board 1 and the RF test board 2, different DC test boards 1 and different RF test boards 2 are combined to meet the testing requirements of different optical devices. The RF test board 2 is provided with a DC board interface 4. The DC test board 1 is provided with a cable, and the cable is provided with a plug adapted to the DC board interface 4, and is detachably connected to the DC board interface 4 through the plug.

[0032] The DC test board 1 is provided with a plurality of DC test circuits for testing different data. Each DC test circuit is respectively used to test different data of the optical device.

[0033] Since the items to be tested for each optical device are different, the DC test circuits to be adapted are also different. To improve the utilization rate of the DC test board 1 and reduce costs. Therefore, a DC test circuit with high versatility is provided on the DC test board 1, and a socket is provided on the DC test board 1. Other DC test circuits with low versatility are respectively provided on several function modules 3. Plugs are provided on the function modules 3, and the function modules 3 are connected to the sockets on the DC test board 1 through the plugs, so that the DC test circuits on the function modules 3 are connected to the circuits on the DC test board 1.

[0034] The number of sockets on the DC test board 1 can be set to multiple, such as two, three, four or more, so that the DC test board 1 can install two or more function modules 3.

[0035] The plugs on the function modules 3 can be directly provided on the bottom surface of the function modules 3. When the plugs are connected to the sockets on the DC circuit board, the function modules 3 are simultaneously fixed.

[0036] The RF circuit board is also provided with a high-frequency terminal 5, a driver chip 6 and an interface for connecting to the optical device.

[0037] Among them, the high-frequency terminal 5, the DC board interface 4 and the interface are respectively electrically connected to the driver chip 6. The high-frequency terminal 5 is used to connect the equipment for testing. The equipment for testing is connected to the high-frequency terminal 5 through a high-frequency wire.

[0038] The interface for connecting with the optical device uses pins. The pins are arranged on the edge of the RF circuit board for easy connection with the pins on the optical device. The number of interfaces includes two or more. The interfaces can also adopt connection structures such as probes and gold wires. The pins are preferably used for the interfaces, and the pins have the advantages of high connection efficiency, high connection stability, and better signal quality. The pin pitches of different pins are different to be applicable to different models of optical devices.

[0039] The optical device includes a flexible circuit board and a housing. The flexible circuit board is connected to the housing, and pins are provided at one end of the flexible circuit board. When the pins of the optical device coincide with the pins of the RF test board 2, a pressing rod can be used to press the flexible circuit board of the optical device, which can ensure that the pins of the optical device will not move relative to the pins of the RF test board 2, ensuring stable and reliable signal transmission.

[0040] The high-frequency terminal 5 includes a number of high-frequency jacks. The high-frequency wires for connecting with the high-frequency terminal 5 can be provided with plugs adapted to the jacks. By corresponding and fixing the positions of the plugs, the plugs can be inserted into the high-frequency jacks at one time, improving the connection efficiency between the high-frequency terminal 5 and the test equipment.

[0041] Embodiment 2:

[0042] This Embodiment 2 provides an optical device testing method. Different from Embodiment 1, the RF circuit board in this Embodiment 2 is different.

[0043] The RF circuit board in this Embodiment 2 is provided with more than two interfaces. And, the interfaces include a receiver terminal 8 and a transmitter terminal 7. The drive chip 6 is compatible with the receiver and the transmitter, and can convert the optical signal into an electrical signal and at the same time convert the electrical signal into an optical signal.

[0044] The receiver terminal 8 and the transmitter terminal 7 are arranged on the RF circuit board in a star design manner, so that the receiver terminal 8 and the transmitter terminal 7 have the same test environment. Because of the same test environment, this setting method can achieve the effect of alternately testing the receiver and the transmitter. The receiver terminal 8 and the transmitter terminal 7 are arranged in a straight line, which is convenient for connecting with the optical device during alternate testing and improves the connection efficiency.

Claims

1. A method for testing an optical device, characterized in that, Set up the DC test board (1) and the RF test board (2) according to the test function. The DC test board (1) is provided with a DC test circuit. The RF test board (2) is provided with a high-frequency terminal (5), a driving chip (6), and an interface for connecting to an optical device. The high-frequency terminal (5) is used to connect to a test device, and the high-frequency terminal (5) and the interface are electrically connected to the driving chip (6). The RF test board (2) is further provided with a DC board interface (4). The DC board interface (4) is used for detachably connecting to the DC test board (1). When the DC test board (1) is connected to the RF test board (2) through the DC board interface (4), the DC test board (1) and the RF test board (2) are electrically connected.

2. The optical device testing method according to claim 1, wherein The DC test board (1) is provided with a socket and a function module (3). The function module (3) is provided with a plug, and the plug is detachably connected to the socket. The function module (3) is provided with a DC test circuit, and the DC test circuit of the DC test board (1) is changed by replacing the function module (3).

3. A method for testing an optical device according to claim 2, characterized in that, The DC test board (1) is provided with at least two sockets, and each socket is respectively used for connecting the function module (3).

4. The optical device testing method according to claim 3, wherein Each function module (3) is respectively provided with a DC test circuit for testing different data.

5. A method for testing an optical device according to claim 1, characterized in that, The DC test board (1) is provided with two DC test circuits for testing different data.

6. The optical device testing method according to claim 1, characterized in that The RF test board (2) is provided with at least two interfaces.

7. A method for testing an optical device according to claim 6, characterized in that, The interface includes a transmitter terminal (7) and a receiver terminal (8), and the driving chip (6) is compatible with the transmitter and the receiver.

8. A method for testing an optical device according to claim 6, characterized in that, The RF test board (2) is provided with interfaces of different models, and is connected to different models of optical devices through different interfaces.

9. A method for testing an optical device according to claim 1, characterized in that, The interface is a pin, and the optical device is directly connected to the pin of the RF circuit board through the pin.

10. A method for testing an optical device according to claim 1, characterized in that, The high-frequency terminal (5) is provided with a number of high-frequency jacks. The high-frequency jacks are used for connecting high-frequency wires, and each high-frequency wire is connected to the high-frequency jack by plugging.

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