An optical device testing method

Abstract

The application discloses an optical device testing method and relates to the technical field of optical devices. According to the application, a direct current testing board and a radio frequency testing board are arranged according to testing functions, the direct current testing board is provided with a direct current testing circuit, the radio frequency testing board is provided with a high-frequency terminal, a driving chip and an interface for connecting with an optical device, the high-frequency terminal is used for connecting with testing equipment, the high-frequency terminal and the interface are electrically connected with the driving chip, the radio frequency testing board is further provided with a direct current board interface, the direct current board interface is used for detachably connecting with the direct current testing board, and the direct current testing board is electrically connected with the radio frequency testing board when the direct current testing board is connected with the radio frequency testing board through the direct current board interface. The direct current testing board and the radio frequency testing board are detachably connected, so that different direct current testing boards and different radio frequency testing boards can be combined at will to reduce the cost.

Description

Technical Field

[0001] This invention relates to the field of optical device technology, and specifically provides a method for testing optical devices. Background Technology

[0002] After production, optical devices require comprehensive performance testing. The test data serves as the parameter basis for shipment and is provided to customers for reference. For the same type of device, different flexible circuit boards are needed depending on the customer's application scenario. Therefore, a single type of optical device can lead to multiple types, each requiring different interface testing equipment. Furthermore, in many cases, optical devices have identical performance parameters, differing only in pin spacing. Since testing equipment is not interchangeable, specific equipment is needed to handle different types of optical devices, resulting in a diverse range of testing equipment. This is highly detrimental to production line process management and increases production and testing costs. Summary of the Invention

[0003] This invention provides a testing method for optical devices, which solves the problem of high testing costs caused by the need to set up separate test boards and connect them to test equipment for different optical devices.

[0004] The technical solution of the present invention is as follows:

[0005] A method for testing optical devices includes a DC test board and an RF test board configured according to testing functions. The DC test board is equipped with a DC test circuit, and the RF test board is equipped with high-frequency terminals, a driver chip, and an interface for connecting to optical devices. The high-frequency terminals are used to connect to test equipment, and the high-frequency terminals and the interface are electrically connected to the driver chip. The RF test board is also equipped with a DC board interface for detachable connection of the DC test board. When the DC test board is connected to the RF test board through the DC board interface, the DC test board and the RF test board are electrically connected.

[0006] In this solution, DC testing and RF testing are differentiated based on their functions. The DC testing circuit is set on the DC testing board, and the DC testing board and the RF testing board are detachably connected through the DC board interface on the RF testing board. When testing different optical devices, DC testing boards with different DC testing circuits can be combined with RF testing boards with different interfaces, high-frequency terminals, and driver chips to form various combinations. Through combination, a variety of required test circuits can be obtained, improving the utilization rate of each DC testing board and RF testing board, thereby reducing testing costs.

[0007] To address the issue of high manufacturing costs for various DC test boards, the DC test board is equipped with a socket and a functional module. The functional module has a plug, which is detachably connected to the socket. The functional module contains a DC test circuit, and the DC test circuit of the DC test board can be changed by replacing the functional module.

[0008] In this solution, because the functional modules are equipped with supporting test circuits and are detachably connected to the DC test board, the DC test circuit of the DC test board can be changed by replacing the functional modules. Therefore, the functional modules can be replaced during testing, further improving the utilization rate of the functional modules and the DC test board, and further reducing costs.

[0009] To address the issue of reduced testing efficiency due to frequent disassembly and reassembly of functional modules, the DC test board is equipped with at least two sockets, each used to connect a functional module.

[0010] In this solution, the DC test circuit of the DC test board is increased by increasing the number of functional modules connected to the DC test board, thereby increasing the number of testable functions. The functional modules required for testing corresponding optical devices can be directly installed on the DC test board in advance, eliminating the need to replace functional modules during the test and improving test efficiency.

[0011] Preferably, each functional module is equipped with a DC test circuit for testing different data.

[0012] Optionally, the DC test board can be directly configured with DC test circuits, and can be configured with two or more DC test circuits for testing different data to improve the comprehensiveness of the test. If the DC testing of optical devices can be completed on a single DC test board, the efficiency of DC testing can be maximized, significantly reducing the time cost of testing.

[0013] To improve the versatility of the RF test board, the RF test board is provided with at least two interfaces.

[0014] In this solution, at least two interfaces are provided, enabling the RF test board to be used to connect with different optical devices, thereby testing different optical devices, which can improve the utilization rate of the RF test board and reduce costs.

[0015] Preferably, the interface includes a transmitter terminal and a receiver terminal, and the driver chip is compatible with both the transmitter and the receiver.

[0016] In this solution, optical devices can be divided into transmitters and receivers according to their functions. The interfaces include transmitter terminals and receiver terminals. The transmitter terminals are used to connect to the transmitter, while the receiver terminals are used to connect to the receiver. The driver chip is compatible with both transmitters and receivers, so that the RF test board can be used with both transmitters and receivers, which improves the versatility of the RF test board and reduces testing costs.

[0017] Preferably, the RF test board is provided with different types of interfaces, which can be connected to different types of optical devices.

[0018] In this solution, by setting different types of interfaces, it can be applied to different types of optical devices, thereby improving the versatility of the RF test board.

[0019] Preferably, the interface is a pin, and the optical device is directly connected to the pin of the radio frequency circuit board through the pin.

[0020] In this solution, optical devices can be directly connected to the RF test board via pins. The pins of the optical devices can be directly pressed onto the pins on the RF circuit board, thereby improving the connection efficiency between the optical devices and the RF circuit.

[0021] Traditional high-frequency terminals and high-frequency wires are connected by threads, and each high-frequency wire needs to be tightened individually, resulting in low connection efficiency. To improve the connection efficiency between the RF circuit board and the testing equipment, the high-frequency terminal is provided with several high-frequency sockets. The high-frequency sockets are used to connect high-frequency wires, and each high-frequency wire is connected to the high-frequency socket by plugging in.

[0022] In this solution, multiple high-frequency lines can be connected simultaneously through plug-in connection, which greatly improves connection efficiency.

[0023] The beneficial effects of this invention are:

[0024] This invention employs a detachable connection between the DC test board and the RF test board, allowing different DC test boards and different RF test boards to be combined arbitrarily to achieve cost reduction. Attached Figure Description

[0025] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the present invention.

[0027] In the above figures, the corresponding reference numerals are as follows:

[0028] 1. DC test board; 2. RF test board; 3. Functional modules; 4. DC board interface; 5. High-frequency terminals; 6. Driver chip; 7. Transmitter terminals; 8. Receiver terminals. Detailed Implementation

[0029] The technical solution of the present invention will be clearly and completely described in conjunction with the accompanying drawings and through specific embodiments of the present invention.

[0030] Example 1:

[0031] like Figure 1 As shown, this embodiment provides a method for testing optical devices. It employs a detachable connection between a DC test board 1 and an RF test board 2, allowing different DC test boards 1 to be combined with different RF test boards 2 to meet the testing requirements of different optical devices. The RF test board 2 is equipped with a DC board interface 4, and the DC test board 1 is equipped with cables. The cables have plugs adapted to the DC board interface 4 and are detachably connected to the DC board interface 4 via the plugs.

[0032] The DC test board 1 is equipped with multiple DC test circuits for testing different data. Each DC test circuit is used to test different data of the optical device.

[0033] Different optical devices require different testing items, which in turn necessitates different DC test circuits. To improve the utilization rate of the DC test board 1 and reduce costs, a highly versatile DC test circuit is installed on the DC test board 1, along with a socket. Other less versatile DC test circuits are installed on several functional modules 3, each with a plug. The functional modules 3 connect to the socket on the DC test board 1 via the plug, enabling communication between the DC test circuits on the functional modules 3 and the circuits on the DC test board 1.

[0034] The number of sockets on the DC test board 1 can be set to multiple, such as two, three, four or more, so that the DC test board 1 can install more than two functional modules 3.

[0035] The plug on functional module 3 can be directly mounted on the bottom surface of functional module 3. When the plug is connected to the socket on the DC circuit board, functional module 3 is simultaneously fixed.

[0036] The RF circuit board also includes a high-frequency terminal 5, a driver chip 6, and an interface for connecting to optical devices.

[0037] The high-frequency terminal 5, DC board interface 4, and interface are electrically connected to the driver chip 6. The high-frequency terminal 5 is used to connect to the testing equipment. The testing equipment is connected to the high-frequency terminal 5 via a high-frequency cable.

[0038] Interfaces for connecting to optical devices utilize pins. These pins are located at the edge of the RF circuit board for easy connection to pins on the optical devices. Two or more interfaces are possible, and probes, gold wires, and other connection structures can also be used. Pins are preferred due to their advantages of high connection efficiency, high connection stability, and better signal quality. Different pins have different pin pitches to accommodate different types of optical devices.

[0039] The optical device includes a flexible circuit board and a housing. The flexible circuit board is connected to the housing. One end of the flexible circuit board is provided with pins. When the pins of the optical device coincide with the pins of the RF test board 2, a pressure rod can be used to press the flexible circuit board of the optical device, which can ensure that the pins of the optical device will not move relative to the pins of the RF test board 2, thus ensuring stable and reliable signal transmission.

[0040] The high-frequency terminal 5 includes several high-frequency sockets. The high-frequency wires of the high-frequency terminal 5 can be equipped with plugs that are compatible with each socket. By aligning and fixing the positions of each plug, the plugs can be inserted into each high-frequency socket at once, thereby improving the connection efficiency between the high-frequency terminal 5 and the testing equipment.

[0041] Example 2:

[0042] This second embodiment provides a method for testing optical devices. The difference between this second embodiment and the first embodiment is that the radio frequency circuit board is different.

[0043] The RF circuit board in this second embodiment has two or more interfaces. These interfaces include a receiver terminal 8 and a transmitter terminal 7. The driver chip 6 is compatible with both the receiver and transmitter, and can convert optical signals into electrical signals, and vice versa.

[0044] Receiver terminal 8 and transmitter terminal 7 are arranged in a star configuration on the RF circuit board, ensuring they share the same testing environment. This identical environment allows for alternating testing of the receiver and transmitter. The straight-line arrangement of receiver terminal 8 and transmitter terminal 7 facilitates connection to optical devices during alternating testing, improving connection efficiency.

Claims

1. A testing method for optical devices, characterized in that, The test board (1) and the radio frequency test board (2) are configured according to the test functions. The DC test board (1) is equipped with a DC test circuit. The radio frequency test board (2) is provided with a high-frequency terminal (5), a driver chip (6), and an interface for connecting to optical devices. The high-frequency terminal (5) is used to connect to the test equipment, and the high-frequency terminal (5) and the interface are electrically connected to the driver chip (6). The RF test board (2) is also provided with a DC board interface (4), which is used to detachably connect to the DC test board (1). When the DC test board (1) is connected to the RF test board (2) through the DC board interface (4), the DC test board (1) and the RF test board (2) are electrically connected. The RF test board (2) is provided with at least two interfaces, including a transmitter terminal (7) and a receiver terminal (8). The driver chip (6) is compatible with both transmitters and receivers. The interface connected to the optical device is a pin. The optical device is directly connected to the pin of the RF test board (2) through the pin. By using a pressure rod to press the flexible circuit board of the optical device, it can be ensured that the pin of the optical device will not move relative to the pin of the RF test board (2), thus ensuring stable and reliable signal transmission. The DC test board (1) is equipped with cables, and the cables are equipped with plugs that are compatible with the DC board interface (4). The plugs are detachably connected to the DC board interface (4). The DC test board (1) is equipped with sockets and functional modules (3). The functional modules (3) are equipped with plugs. The plugs are detachably connected to the sockets. The functional modules (3) are equipped with DC test circuits. The DC test circuit of the DC test board (1) can be changed by replacing the functional modules (3). The DC test board (1) is equipped with at least two sockets, and each socket is used to connect to the functional modules (3). The RF test board (2) is equipped with different types of interfaces, and can be connected to different types of optical devices through different interfaces.

2. The optical device testing method according to claim 1, characterized in that, Each functional module (3) is equipped with a DC test circuit for testing different data.

3. The optical device testing method according to claim 1, characterized in that, The DC test board (1) is equipped with two DC test circuits for testing different data.

4. The optical device testing method according to claim 1, characterized in that, The high-frequency terminal (5) is provided with several high-frequency sockets, which are used to connect high-frequency lines. Each high-frequency line is connected to the high-frequency socket by plugging in.

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