Case and electronic equipment

Abstract

The invention discloses a case and electronic equipment, and relates to the technical field of liquid cooling, and the case comprises a bottom plate and a fixed structural member. The bottom plate comprises a liquid cooling area and a liquid blocking wall arranged on the periphery of the liquid cooling area. The liquid cooling area comprises a flow guide groove part and a convex part, the convex part is surrounded by the flow guide groove part, the convex part and the liquid blocking wall both protrude out of the upper surface of the flow guide groove part, and a flow guide groove is formed among the upper surface of the flow guide groove part, the convex part and the liquid blocking wall. The fixing structural part is connected to the top of the protruding part. Therefore, the electronic equipment is not easy to fail due to liquid leakage of the liquid cooling assembly.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and particularly to a chassis and an electronic device. Background Art

[0002] With the continuous improvement of the performance of electronic devices, more and more heat is generated during the operation of electronic devices. Liquid cooling has advantages such as high heat dissipation efficiency and is widely used in electronic devices.

[0003] However, the liquid cooling components used for liquid cooling of electronic devices are prone to liquid leakage, and electronic devices are prone to malfunction due to liquid leakage from the liquid cooling components. Summary of the Invention

[0004] Embodiments of this application provide a chassis and an electronic device to at least solve the problem that electronic devices in related technologies are prone to malfunction due to liquid leakage from liquid cooling components.

[0005] Embodiments of this application provide a chassis, which includes a bottom plate and a fixing structure member. The bottom plate includes a liquid cooling area and a liquid retaining wall provided on the periphery of the liquid cooling area. The liquid cooling area includes a diversion groove portion and a protruding portion, the protruding portion is surrounded by the diversion groove portion, and both the protruding portion and the liquid retaining wall protrude from the upper surface of the diversion groove portion. A diversion groove is formed between the upper surface of the diversion groove portion and the protruding portion and the liquid retaining wall. The fixing structure member is connected to the top of the protruding portion.

[0006] Embodiments of this application also provide an electronic device, which includes a heat generating module, a liquid cooling component, and the chassis in any of the above embodiments. The heat generating module and the liquid cooling component are both provided in the chassis. The heat generating module is fixedly connected to the fixing structure member of the chassis, the liquid cooling component is in contact with the heat generating module, and the orthographic projections of the liquid cooling component and the heat generating module on the bottom plate of the chassis are both located within the liquid cooling area of the bottom plate.

[0007] With this application, by providing a liquid blocking wall, the liquid blocking wall can prevent the liquid leaked from the liquid cooling component from flowing randomly onto the bottom plate, making it difficult for the electronic devices located outside the liquid cooling area to be affected by the liquid leakage of the liquid cooling component, thereby reducing the risk of the electronic device malfunctioning due to the liquid leakage of the liquid cooling component. By providing a convex portion and a diversion groove portion, and enclosing a diversion groove with the convex portion, the diversion groove portion and the liquid blocking wall, the leaked liquid generated by the liquid cooling component can be gathered in the diversion groove, facilitating the discharge of the leaked liquid generated by the liquid cooling component from the chassis through the guidance of the diversion groove, thereby reducing the risk of the electronic device malfunctioning due to the liquid leakage of the liquid cooling component. In addition, by connecting the fixed structural member to the top of the convex portion, while facilitating the stable assembly of the heat generating module and the bottom plate, the leaked liquid generated by the liquid cooling component is not likely to flow to the fixed structural member and leak from the fixed structural member to the lower part of the chassis, thus not easily causing damage to the devices or components located below the chassis. Moreover, since the leaked liquid generated by the liquid cooling component is not likely to flow to the fixed structural member, the sealing requirement for the connection between the fixed structural member and the bottom plate is relatively low, making the connection method between the fixed structural member and the bottom plate more flexible. Furthermore, the fixed structural member is connected to the top of the convex portion, while facilitating the stable assembly of the heat generating module and the bottom plate, the fixed structural member is not likely to block the flow of the liquid in the diversion groove, making the flow of the liquid in the diversion groove smoother and facilitating the rapid discharge of the liquid in the diversion groove. In addition, the formed convex portion can also play a role in improving the strength of the bottom plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0009] Figure 1 An exploded view of an electronic device provided by an embodiment of the present application;

[0010] Figure 2 A top view of a base provided by an embodiment of the present application;

[0011] Figure 3 A cross-sectional view of a base provided by an embodiment of the present application;

[0012] Figure 4 For Figure 3 An enlarged view of part A in

[0013] Figure 5 A top view of an electronic device provided by an embodiment of the present application;

[0014] Figure 6 For Figure 5Enlarged view of part B;

[0015] Figure 7 Schematic cross-sectional view of an electronic device provided by an embodiment of the present application;

[0016] Figure 8 is Figure 7 Enlarged view of part C;

[0017] Figure 9 Schematic cross-sectional view of another electronic device provided by an embodiment of the present application;

[0018] Figure 10 is Figure 9 Enlarged view of part D;

[0019] Figure 11 Schematic view of one perspective of a gasket provided by an embodiment of the present application;

[0020] Figure 12 Schematic view of another perspective of a gasket provided by an embodiment of the present application;

[0021] Figure 13 Schematic view of yet another perspective of a gasket provided by an embodiment of the present application;

[0022] Figure 14 Schematic view of yet another perspective of a gasket provided by an embodiment of the present application;

[0023] Figure 15 Partial top view of a tray provided by an embodiment of the present application.

[0024] Among them, the above-mentioned drawings include the following reference numerals:

[0025] 10, chassis; 11, base; 12, upper cover; 20, front window module; 30, rear window module; 40, heating module; 41, tray; 42, main board assembly; 421, main board; 422, heating device; 43, stud; 44, screw; 45, gasket; 451, first structural segment; 452, second structural segment; 50, liquid cooling assembly; 51, cold plate; 52, liquid cooling joint; 60, pipeline assembly; 70, flow guiding strip;

[0026] 100, bottom plate; 110, liquid cooling area; 111, flow guiding groove part; 112, convex part; 120, liquid retaining wall; 121, first wall segment; 122, second wall segment; 123, third wall segment; 124, fourth wall segment;

[0027] 200, fixing structural member;

[0028] G1, flow guiding groove; G2, liquid discharge groove; G3, communication groove;

[0029] H1, Drain hole; H2, First through hole; H3, Second through hole; H4, Third through hole; H5, Fourth through hole; H6, Fifth through hole;

[0030] C, Notch. Detailed implementation

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0032] It should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present application. The terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood in specific situations.

[0033] In order to enable those skilled in the art of this technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific implementation manners.

[0034] An embodiment of the present application provides an electronic device, which includes but is not limited to a computing device, a storage device, a switching device, a power supply device, etc. The computing device may be a server, and an embodiment of the present application takes the electronic device as a server as an example for illustration.

[0035] Figure 1 FIG. 4 is an exploded view of an electronic device provided in an embodiment of the present application. In the illustrated coordinate system, the direction pointed by the x arrow is the front, the direction pointed by the y arrow is the right, and the direction pointed by the z arrow is the top.

[0036] In some examples, the size of the electronic device in the front-back direction is greater than the size of the electronic device in the left-right direction. In other examples, the size of the electronic device in the front-back direction is less than the size of the electronic device in the left-right direction.

[0037] As Figure 1 shown, the electronic device includes a chassis 10, a heat generating module 40, a liquid cooling component 50, and a pipeline component 60. The heat generating module 40 and the liquid cooling component 50 are both disposed in the chassis 10, and the chassis 10 can play a role in carrying and protecting the components disposed in the chassis 10. The liquid cooling component 50 is connected to a cold source device disposed outside the chassis 10 through the pipeline component 60, and the liquid cooling component 50, the pipeline component 60, and the cold source device are used to form a coolant circulation loop for the coolant to circulate. The liquid cooling component 50 is in contact with the heat generating module 40, and the liquid cooling component 50 is used to perform liquid cooling on the heat generating module 40. Specifically, the coolant from the cold source device flows into the liquid cooling component 50 through the pipeline component 60. The coolant flowing into the liquid cooling component 50 absorbs the heat generated by the heat generating module 40. After the coolant that has absorbed the heat generated by the heat generating module 40 in the liquid cooling component 50 flows out of the liquid cooling component 50, it flows back to the cold source device through the pipeline component 60 for heat dissipation.

[0038] Exemplarily, the cold source device may be a cooling distribution unit (CDU).

[0039] Exemplarily, the heat generating module 40 may be fixedly connected to the chassis 10.

[0040] Exemplarily, the liquid cooling component 50 may be fixedly connected to the heat generating module 40 and fixed to the chassis 10 through the heat generating module 40.

[0041] Exemplarily, the piping assembly 60 includes a built-in liquid inlet pipe, a built-in liquid outlet pipe, an external liquid inlet joint and an external liquid outlet joint, the external liquid inlet joint and the external liquid outlet joint are arranged on the upper part of the chassis 10, the external liquid inlet joint is connected to the outlet of the cold source device, and the external liquid outlet joint is connected to the inlet of the cold source device, the built-in liquid inlet pipe and the built-in liquid outlet pipe are both arranged in the chassis 10, the external liquid inlet joint is connected to the inlet of the liquid cooling assembly 50 through the built-in liquid inlet pipe, and the external liquid outlet joint is connected to the outlet of the liquid cooling assembly 50 through the built-in liquid outlet pipe.

[0042] Exemplarily, the heating module 40 includes a tray 41 and a motherboard assembly 42. The motherboard assembly 42 is fixedly connected to the tray 41, and the tray 41 is fixedly connected to the chassis 10. The tray 41 can improve the strength of the motherboard assembly 42 and protect the motherboard 421. The liquid cooling assembly 50 is in contact with the motherboard assembly 42, and the liquid cooling assembly 50 is used to perform liquid cooling on the motherboard assembly 42.

[0043] Exemplarily, the motherboard assembly 42 includes a motherboard 421 and a heating device 422. The motherboard 421 is fixedly connected to the tray 41. The heating device 422 is arranged on the motherboard 421. The heating device 422 can be located on the side of the motherboard 421 away from the tray 41. The motherboard 421 can carry the heating device 422 and realize the circuit connection. The heating device 422 is in contact with the liquid cooling assembly 50, and the liquid cooling assembly 50 can be used to perform liquid cooling on the heating device 422.

[0044] Exemplarily, a plurality of heating devices 422 may be provided on the mainboard 421, and any heating device 422 may include but is not limited to a central processing unit (CPU), a graphics processing unit (GPU), a memory, etc. For example, the memory may include but is not limited to dual-inline-memory-modules (DIMM), etc.

[0045] Exemplarily, the liquid cooling assembly 50 may be fixedly connected to at least one of the mainboard 421 and the heating device 422 .

[0046] Exemplarily, the chassis 10 includes a base 11 and an upper cover 12, the top of the base 11 has an opening, the upper cover 12 is openable and closable and connected to the top of the base 11, and the base 11 and the upper cover 12 enclose an inner cavity of the chassis 10. At this time, the components disposed in the chassis 10 can be maintained by opening the upper cover 12.

[0047] Exemplarily, the base 11 includes a bottom plate 100, a left side plate and a right side plate, the lower end of the left side plate is fixedly connected to the left end of the bottom plate 100, the lower end of the right side plate is fixedly connected to the right end of the bottom plate 100, the upper end of the left side plate is detachably connected to the left end of the upper cover 12, and the upper end of the right side plate is detachably connected to the right end of the upper cover 12, and the bottom plate 100, the left side plate, the right side plate and the upper cover 12 are used to enclose and form an inner cavity of the chassis 10.

[0048] Exemplarily, the heating module 40 is fixedly connected to the bottom plate 100. Specifically, the tray 41 is fixedly connected to the bottom plate 100, and the mainboard assembly 42 is located on the side of the tray 41 away from the bottom plate 100, that is, the mainboard assembly 42 is located above the tray 41. At this time, the mainboard 421 and the heating device 422 provided on the mainboard 421 are both located on the side of the tray 41 away from the bottom plate 100.

[0049] Exemplarily, the liquid cooling assembly 50 may be fixed to the base plate 100 through the heating module 40 , and the liquid cooling assembly 50 may be located on a side of the heating module 40 facing away from the base plate 100 , that is, the liquid cooling assembly 50 may be located above the heating module 40 .

[0050] Exemplarily, the base 11 further includes a fixed structure 200, which is fixedly connected to the bottom plate 100, and the heating module 40 is fixedly connected to the fixed structure 200, so that the heating module 40 is fixedly connected to the bottom plate 100 through the fixed structure 200, so as to achieve a stable assembly of the heating module 40 and the bottom plate 100. Specifically, the tray 41 is fixedly connected to the fixed structure 200, so that the tray 41 is fixedly connected to the bottom plate 100 through the fixed structure 200.

[0051] Exemplarily, the fixing structure 200 may include but is not limited to an I-nail, a stud, etc. When the fixing structure 200 is a stud, the tray 41 may be fixedly connected to the fixing structure 200 via a threaded connector (eg, a screw) threadedly connected to the fixing structure 200 .

[0052] Exemplarily, the mainboard 421 is electrically connected to the tray 41, and the tray 41 is electrically connected to the bottom plate 100, so that the mainboard assembly 42 can be grounded through the bottom plate 100. For example, the fixed structure 200 can be a conductive member made of metal or other materials, and the tray 41 can be electrically connected to the bottom plate 100 through the fixed structure 200.

[0053] Exemplarily, the electronic device further includes a front window module 20 and a rear window module 30. The front window module 20 and the rear window module 30 are disposed inside the chassis 10. The front window module 20 is disposed in front of the heat generating module 40, and the rear window module 30 is disposed behind the heat generating module 40. The base 11 further includes a front window structural member and a rear window structural member. The front window structural member is fixedly connected to the front part of the bottom plate 100, and the rear window structural member is fixedly connected to the rear part of the bottom plate 100. The front window structural member and the rear window structural member are located between the bottom plate 100 and the upper cover 12. The front window module 20 is fixedly connected to the front window structural member, and the rear window module 30 is fixedly connected to the rear window structural member.

[0054] Exemplarily, the external liquid inlet joint and the external liquid outlet joint can be connected to the rear window structural member.

[0055] Exemplarily, the front window module 20 can include one or more of a backplane, a hard disk, a fan, an IO card, etc.

[0056] Exemplarily, the rear window module 30 can include one or more of a fan, a hard disk, a backplane, an IO card, etc.

[0057] In an example where the server is a whole cabinet server, the electronic device further includes a cabinet, and the chassis 10 is disposed inside the cabinet.

[0058] During the process of liquid cooling and heat dissipation, the liquid cooling component 50 is prone to leakage.

[0059] In the related art, after the liquid leakage generated by the liquid cooling component in the chassis spills onto the bottom plate, it will flow randomly on the bottom plate, easily causing damage to the electronic components inside the electronic device, and further easily causing the electronic device to malfunction. In addition, after the liquid leakage generated by the liquid cooling component in the chassis spills onto the bottom plate, it is easy to leak from the fixed structural member to the lower part of the chassis, and further easily cause damage to the devices or components located below the chassis.

[0060] Figure 2 This is a top view of a base provided by an embodiment of the present application. Figure 3 This is a cross-sectional schematic diagram of a base provided by an embodiment of the present application. Figure 4 For Figure 3 an enlarged view of part A in Figure 2 In , the direction pointed by the dashed arrow is the flow direction of the liquid leakage received in the diversion groove G1.

[0061] Based on this, as Figure 2As shown, in the embodiment of the present application, the bottom plate 100 includes a liquid cooling area 110 and a liquid retaining wall 120 provided on the periphery of the liquid cooling area 110. The orthographic projections of the liquid cooling component 50 and the heat generating module 40 on the bottom plate 100 are both located within the liquid cooling area 110 of the bottom plate 100. The liquid retaining wall 120 can prevent the liquid leaked from the liquid cooling component 50 from flowing randomly on the bottom plate 100, so that the electronic devices provided outside the liquid cooling area 110 are not easily affected by the liquid leakage of the liquid cooling component 50, thereby reducing the risk of the electronic device malfunctioning due to the liquid leakage of the liquid cooling component 50.

[0062] Exemplarily, the liquid cooling area 110 can be determined according to the layout positions of the liquid cooling component 50 and the heat generating module 40, as long as the orthographic projections of the liquid cooling component 50 and the heat generating module 40 on the bottom plate 100 are located within the liquid cooling area 110.

[0063] As Figure 2 、 Figure 4 shown, the liquid cooling area 110 includes a diversion groove part 111 and a convex part 112, and the convex part 112 is surrounded by the diversion groove part 111. Both the convex part 112 and the liquid retaining wall 120 protrude from the upper surface of the diversion groove part 111. A diversion groove G1 is formed between the upper surface of the diversion groove part 111 and the convex part 112 and the liquid retaining wall 120. The diversion groove G1 can be used to accommodate the leaked liquid generated at the liquid cooling component 50 and can be used to guide the flow of the liquid in the diversion groove G1. The fixing structural member 200 is connected to the top of the convex part 112, and the heat generating module 40 is fixedly connected to the convex part 112 through the fixing structural member 200. Specifically, the tray 41 is fixedly connected to the convex part 112 through the fixing structural member 200.

[0064] In this way, a flow guiding groove G1 is formed by enclosing the convex portion 112, the flow guiding groove portion 111, and the liquid retaining wall 120, so that the leaked liquid generated by the liquid cooling component 50 can be converged in the flow guiding groove G1, and it is convenient to discharge the leaked liquid generated by the liquid cooling component 50 out of the chassis 10 through the guidance of the flow guiding groove G1, thereby reducing the risk of failure of the electronic device due to the leaked liquid generated by the liquid cooling component 50. In addition, the fixing structural member 200 is connected to the top of the convex portion 112. While facilitating the stable assembly of the heat generating module 40 and the bottom plate 100, the leaked liquid generated by the liquid cooling component 50 is not likely to flow to the fixing structural member 200 and leak from the fixing structural member 200 to the lower part of the chassis 10, thus it is not likely to cause damage to the devices or components located below the chassis 10. Additionally, since the leaked liquid generated by the liquid cooling component 50 is not likely to flow to the fixing structural member 200, the sealing requirement for the connection between the fixing structural member 200 and the bottom plate 100 is relatively low, and thus the connection method between the fixing structural member 200 and the bottom plate 100 is relatively flexible. Moreover, the fixing structural member 200 is connected to the top of the convex portion 112. While facilitating the stable assembly of the heat generating module 40 and the bottom plate 100, the fixing structural member 200 is not likely to block the flow of the liquid in the flow guiding groove G1, making the flow of the liquid in the flow guiding groove G1 relatively smooth and facilitating the rapid discharge of the liquid in the flow guiding groove G1. In addition, the formed convex portion 112 can also play a role in improving the strength of the bottom plate 100.

[0065] Exemplarily, the liquid cooling area 110 includes a plurality of convex portions 112 arranged at intervals, and there is a flow guiding groove portion 111 between the convex portions 112. The position and number of the convex portions 112 can be determined according to the strength requirement of the bottom plate 100 and the components to be connected (for example, the heat generating module 40).

[0066] Exemplarily, the chassis 10 has a liquid discharge hole H1, and the flow guiding groove G1 is communicated with the liquid discharge hole H1, and the liquid in the flow guiding groove G1 can be discharged out of the chassis 10 through the liquid discharge hole H1.

[0067] Exemplarily, a liquid receiving tray can be provided outside the chassis 10, and the liquid receiving tray is used to receive the liquid discharged from the liquid discharge hole H1. That is to say, the liquid flowing out of the chassis 10 through the liquid discharge hole H1 can be received by the liquid receiving tray. For example, the liquid receiving tray can be provided below the liquid discharge hole H1.

[0068] In the example where the server is a full rack server, the liquid receiving tray can be provided inside the rack.

[0069] Exemplarily, the height of the liquid retaining wall 120 can be greater than or equal to 1 mm, so that the liquid in the flow guiding groove G1 is not likely to overflow from the liquid retaining wall 120.

[0070] In some examples, the liquid retaining wall 120 can surround the liquid cooling area 110 for one week. At this time, the flow guiding groove portion 111 can be provided with a liquid discharge hole H1.

[0071] In some examples, the liquid retaining wall 120 can surround a part of the liquid cooling area 110. At this time, the liquid retaining wall 120 has a notch C communicating with the diversion groove G1. The drain hole H1 can be located outside the liquid cooling area 110. The diversion groove G1 can communicate with the drain hole H1 through the notch C. The leaked liquid received in the diversion groove G1 can flow through the notch C to the drain hole H1.

[0072] Exemplarily, the bottom plate 100 is formed with a drain groove G2. The drain groove G2 is located outside the liquid cooling area 110. The notch C of the liquid retaining wall 120 forms an inlet of the drain groove G2. The inlet of the drain groove G2 communicates with the diversion groove G1. The drain hole H1 is provided on the groove wall of the drain groove G2. The liquid in the diversion groove G1 can flow through the drain groove G2 to the drain hole H1. The drain hole H1 is used to discharge the liquid in the drain groove G2 out of the chassis 10. That is to say, the leaked liquid received in the diversion groove G1 can be discharged out of the chassis 10 through the drain groove G2 and the drain hole H1. In this way, it is convenient to direct the liquid in the diversion groove G1 to the drain hole H1 outside the liquid cooling area 110 for external discharge, making the arrangement of the liquid receiving tray outside the chassis 10 more flexible and convenient.

[0073] Exemplarily, the drain hole H1 is provided on the bottom plate 100.

[0074] In some possible implementation manners, the bottom surface of the diversion groove G1 is an inclined surface. The bottom surface of the diversion groove G1 is used to converge the leaked liquid received in the diversion groove G1 to the inlet of the drain groove G2, so as to facilitate the automatic and rapid external discharge of the liquid in the diversion groove G1, and make it not easy to have problems such as electronic equipment failure caused by excessive liquid accumulation in the diversion groove G1.

[0075] Exemplarily, the bottom surface of the drain groove G2 is an inclined surface. The bottom surface of the drain groove G2 is used to converge the liquid in the drain groove G2 to the drain hole H1, so as to facilitate the automatic and rapid external discharge of the liquid flowing into the drain groove G2. For example, the drain hole H1 and the inlet of the drain groove G2 are respectively located at two ends of the drain groove G2. The bottom surface of the drain groove G2 gradually decreases in height from the end where the inlet of the drain groove G2 is located to the end where the drain hole H1 is located.

[0076] Exemplarily, the notch C of the liquid retaining wall 120 is located behind the diversion groove G1. The bottom surface of the diversion groove G1 is an inclined surface that gradually decreases in height from front to back. At this time, the drain hole H1 can be located at the rear end of the bottom plate 100. In this way, it is convenient to direct the liquid in the diversion groove G1 to the drain hole H1 located at the rear end of the chassis 10 for external discharge, making the arrangement of the liquid receiving tray outside the chassis 10 relatively easy.

[0077] Exemplarily, the liquid retaining wall 120 includes a first wall segment 121, a second wall segment 122, a third wall segment 123, and a fourth wall segment 124. The first wall segment 121 is located in front of the liquid cooling region 110 and between the liquid cooling region 110 and the front window module 20. The second wall segment 122 is located on the right side of the liquid cooling region 110 and between the liquid cooling region 110 and the right side plate. The third wall segment 123 is located behind the liquid cooling region 110 and between the liquid cooling region 110 and the rear window module 30. The fourth wall segment 124 is located on the left side of the liquid cooling region 110 and between the liquid cooling region 110 and the left side plate. The left and right ends of the first wall segment 121 are respectively connected to the second wall segment 122 and the fourth wall segment 124. The third wall segment 123 is connected to one of the second wall segment 122 and the fourth wall segment 124, and the third wall segment 123 is spaced from the other of the second wall segment 122 and the fourth wall segment 124 to form a notch C of the liquid retaining wall 120. For example, the right end of the third wall segment 123 is connected to the second wall segment 122, and the left end of the third wall segment 123 is spaced from the fourth wall segment 124 to form a notch C of the liquid retaining wall 120.

[0078] Exemplarily, a part of the fourth wall segment 124 may be located between the right end of the rear window module 30 and the right side plate, a part of the third wall segment 123 may be located between the right end of the rear window module 30 and the fourth wall segment 124, and at least a part of the drain groove G2 may be enclosed and formed by the bottom plate 100, the part of the fourth wall segment 124 located between the right end of the rear window module 30 and the right side plate, and the part of the third wall segment 123 located between the right end of the rear window module 30 and the fourth wall segment 124.

[0079] In some possible implementation manners, the liquid retaining wall 120, the flow guiding groove portion 111, and the convex portion 112 are of an integral structure.

[0080] In this way, the sealing performance at the connection between the liquid retaining wall 120 and the convex portion 112 and the flow guiding groove portion 111 is relatively good, and the liquid in the flow guiding groove G1 is not easily discharged from the connection between the liquid retaining wall 120 and the flow guiding groove portion 111 and the connection between the convex portion 112 and the flow guiding groove portion 111. It is convenient to limit the leakage of the liquid cooling component 50 within the flow guiding groove G1 and conduct external discharge through the guidance of the flow guiding groove G1, which helps to reduce the risk of the electronic device malfunctioning due to the leakage of the liquid cooling component 50.

[0081] In some examples where the liquid retaining wall 120, the flow guiding groove portion 111, and the convex portion 112 are of an integral structure, at least one of the liquid retaining wall 120 and the convex portion 112 is a structure formed by stamping the lower surface of the bottom plate 100 using a stamping process. At this time, the liquid retaining wall 120 and the convex portion 112 arch upward relative to the flow guiding groove portion 111, and the lower surfaces of the liquid retaining wall 120 and the convex portion 112 form a groove structure.

[0082] In this way, the bottom plate 100 is easy to manufacture, has a relatively low processing cost, and has good reliability after forming. In addition, forming the liquid retaining wall 120 and the protrusion 112 protruding from the upper surface of the bottom plate 100 does not require additional materials, which is beneficial to the lightweight design of the electronic device.

[0083] Exemplarily, both the liquid retaining wall 120 and the protrusion 112 are structures formed by stamping the lower surface of the bottom plate 100 using a stamping process.

[0084] Exemplarily, the material of the bottom plate 100 can be a galvanized steel plate, so that the bottom plate 100 has good corrosion resistance and rust prevention ability. In addition, it is also convenient to form the liquid retaining wall 120 and the protrusion 112 by stamping the bottom plate 100.

[0085] In some examples where the liquid retaining wall 120, the flow guiding groove portion 111, and the protrusion 112 are of an integral structure, the liquid retaining wall 120, the protrusion 112, and the flow guiding groove portion 111 can also be integrally formed by means such as casting and machining.

[0086] In some possible implementation manners, the liquid retaining wall 120 can be hermetically connected to the flow guiding groove portion 111 by means such as welding and bonding. At this time, a sealant can be provided between the liquid retaining wall 120 and the flow guiding groove portion 111.

[0087] In some possible implementation manners, the protrusion 112 can be hermetically connected to the flow guiding groove portion 111 by means such as welding and bonding. At this time, a sealant can be provided between the protrusion 112 and the flow guiding groove portion 111.

[0088] In some possible implementation manners, the fixing structural member 200 is riveted to the top of the protrusion 112.

[0089] In this way, while it is not easy for the liquid leakage generated by the liquid cooling component 50 to leak from the fixing structural member 200 to the lower part of the chassis 10, the cost of connecting the fixing structural member 200 to the bottom plate 100 is relatively low. In addition, the fixing structural member 200 is connected to the protrusion 112 by riveting, and there is a certain sealing effect at the riveting joint of the fixing structural member 200 and the protrusion 112. When a small amount of liquid flows to the riveting joint of the fixing structural member 200 and the protrusion 112, the liquid flowing to the fixing structural member 200 is not easy to leak from the riveting joint of the fixing structural member 200 and the protrusion 112 to the lower part of the chassis 10.

[0090] In some other possible implementation manners, the fixing structural member 200 can also be fixedly connected to the bottom plate 100 by other means such as welding.

[0091] Figure 5 This is a top view of an electronic device provided by an embodiment of the present application.

[0092] As Figure 5As shown, in some possible embodiments, the liquid cooling component 50 includes a cold plate 51 and a liquid cooling joint 52. The cold plate 51 is connected to the pipeline component 60 through the liquid cooling joint 52. The cold plate 51 contacts the heating module 40, and the cold plate 51 is used to perform liquid cooling on the heating module 40. Specifically, the cold plate 51 contacts the heating device 422, and the cold plate 51 is used to perform liquid cooling on the heating device 422.

[0093] Exemplarily, the cold plate 51 can be fixedly connected to the heating module 40. Specifically, the cold plate 51 can be fixedly connected to at least one of the heating device 422 and the main board 421.

[0094] Exemplarily, the liquid cooling component 50 includes a plurality of liquid cooling joints 52. The plurality of liquid cooling joints 52 include a liquid cooling inlet joint and a liquid cooling outlet joint. The inlet of the cold plate 51 is communicated with the built-in inlet pipe through the liquid cooling inlet joint, so as to be communicated with the external inlet joint through the built-in inlet pipe. The outlet of the cold plate 51 is communicated with the built-in outlet pipe through the liquid cooling outlet joint, so as to be communicated with the external outlet joint through the built-in outlet pipe.

[0095] Exemplarily, the liquid cooling component 50 can include a plurality of cold plates 51. The plurality of liquid cooling joints 52 include a plurality of liquid cooling inlet joints corresponding to the cold plates 51 one by one, and a plurality of liquid cooling outlet joints corresponding to the cold plates 51 one by one.

[0096] In the example where the liquid cooling component 50 includes a plurality of cold plates 51, the plurality of liquid cooling joints 52 can further include a distribution joint. The inlets of the plurality of cold plates 51 can be communicated with the distribution joint through the corresponding liquid cooling inlet joints, and communicated with the built-in inlet pipe through the distribution joint. For example, when the liquid cooling component 50 includes 2 cold plates 51, the distribution joint can be a three-way joint, and the three ports of the distribution joint are respectively communicated with the built-in inlet pipe and the liquid cooling inlet joints corresponding to the 2 cold plates 51.

[0097] In some examples where the heating module 40 includes a central processing unit, the liquid cooling component 50 includes a cold plate 51 for performing liquid cooling on the central processing unit. The cold plate 51 for performing liquid cooling on the central processing unit can be called a central processing unit cold plate. The central processing unit cold plate can be arranged on the side of the central processing unit facing away from the main board 421 and contact the central processing unit.

[0098] In some examples where the heating module 40 includes a graphics processing unit, the liquid cooling component 50 includes a cold plate 51 for performing liquid cooling on the graphics processing unit. The cold plate 51 for performing liquid cooling on the graphics processing unit can be called a graphics processing unit cold plate. The graphics processing unit cold plate can be arranged on the side of the graphics processing unit facing away from the main board 421 and contact the graphics processing unit.

[0099] In some examples where the heating module 40 includes a memory, the liquid cooling component 50 includes a cold plate 51 for liquid cooling and dissipating heat from the memory. The cold plate 51 for liquid cooling and dissipating heat from the memory can be called a memory cold plate. The memory cold plate can be disposed on a side of the memory facing away from the main board 421 and in contact with the memory.

[0100] The orthographic projections of all the cold plates 51 and all the liquid cooling connectors 52 on the bottom plate 100 are all located within the liquid cooling area 110.

[0101] Figure 6 For Figure 5 the enlarged view of part B in Figure 7 is a cross-sectional schematic view of an electronic device provided by an embodiment of the present application, Figure 8 For Figure 7 the enlarged view of part C in Figure 7 The cross-section in

[0102] Since liquid leakage is likely to occur at the liquid cooling connector 52, as shown in Figure 6 and Figure 8 the electronic device further includes a diversion strip 70. One end of the diversion strip 70 is connected to the liquid cooling connector 52, and the other end of the diversion strip 70 is located in the diversion groove G1. The diversion strip 70 is used to guide the liquid leakage at the liquid cooling connector 52 into the diversion groove G1.

[0103] In this way, when there is a small amount of liquid leakage at the liquid cooling connector 52, the liquid leakage at the liquid cooling connector 52 can flow into the diversion groove G1 along the diversion strip 70 and be discharged from the chassis 10 through the diversion groove G1. Thus, the risk of electronic device failure caused by the liquid leakage at the liquid cooling connector 52 randomly dripping onto the devices below can be reduced. In addition, by using the diversion strip 70 to guide the liquid leakage at the liquid cooling connector 52 into the diversion groove G1, the arrangement of the diversion strip 70 is relatively flexible, the disassembly and assembly are relatively convenient, the versatility is good, and the maintainability is high.

[0104] Exemplarily, the diversion strip 70 can be made of a flexible material with poor hydrophilicity. For example, the diversion strip 70 can be made of non-hydrophilic silicone, rubber and other materials. In this way, the arrangement of the diversion strip 70 can be relatively flexible and convenient, and it is convenient to guide the liquid leakage at the liquid cooling connector 52 into the diversion groove G1.

[0105] Exemplarily, when the liquid cooling component 50 includes a plurality of liquid cooling connectors 52, a diversion strip 70 can be connected to each liquid cooling connector 52.

[0106] Exemplarily, one end of the diversion strip 70 can be sleeved on the liquid cooling connector 52, and the other end of the diversion strip 70 can be fixed in the diversion groove G1.

[0107] In some possible embodiments, the main board 421 has a first through hole H2 that penetrates through the upper and lower sides of the main board 421, the tray 41 has a second through hole H3 that penetrates through the upper and lower sides of the tray 41, and the flow guiding strip 70 is inserted into the first through hole H2 and the second through hole H3. At this time, the liquid flowing along the flow guiding strip 70 flows into the flow guiding groove G1 after passing through the first through hole H2 and the second through hole H3.

[0108] In this way, the routing of the flow guiding strip 70 is more convenient, the length of the flow guiding strip 70 is shorter, the path of the liquid flowing along the flow guiding strip 70 is shorter, and the stability of liquid guiding through the flow guiding strip 70 is better. In addition, the shorter path of the liquid flowing along the flow guiding strip 70 makes it less likely for the liquid flowing along the flow guiding strip 70 to flow to other devices and cause electronic device failures.

[0109] Exemplarily, the first through hole H2 and the second through hole H3 are vertically opposite.

[0110] Exemplarily, the projections of the first through hole H2 and the second through hole H3 on the bottom plate 100 are both located within the flow guiding groove G1.

[0111] Exemplarily, when the liquid cooling assembly 50 includes a plurality of liquid cooling joints 52, the main board 421 may have a plurality of first through holes H2 corresponding one-to-one to the liquid cooling joints 52, the tray 41 may have a plurality of second through holes H3 corresponding one-to-one to the liquid cooling joints 52, and the flow guiding strips 70 connected at the liquid cooling joints 52 are inserted into the corresponding first through holes H2 and the corresponding second through holes H3.

[0112] Exemplarily, the flow guiding strip 70 is spaced from the hole wall of the first through hole H2, so that the liquid flowing along the flow guiding strip 70 is not likely to flow onto the main board 421 when passing through the first through hole H2, and it is not easy to have the problem of electronic device failures caused by the liquid flowing along the flow guiding strip 70 flowing onto the main board 421.

[0113] Exemplarily, the two ends of the flow guiding strip 70 can be respectively fixed to the liquid cooling joint 52 and the groove wall of the flow guiding groove G1, and the length of the flow guiding strip 70 can be controlled to space the flow guiding strip 70 from the hole wall of the first through hole H2.

[0114] Figure 9 It is a cross-sectional schematic diagram of another electronic device provided by an embodiment of the present application. Figure 10 For Figure 9 an enlarged view of part D in Figures 11 - 14 It is a schematic diagram of several different perspectives of a gasket provided by an embodiment of the present application. Figure 15 It is a partial top view of a tray provided by an embodiment of the present application. Among them, Figure 9 the cross-section in Figure 12 is a cross-section cutting the third through hole H4. A schematic diagram of the side of the gasket 45 facing the main board 421Figure 13 Schematic diagram of the side of the gasket 45 facing away from the main board 421 Figure 14 Side view of the gasket 45

[0115] In some possible embodiments, such as Figure 10 shown, the main board 421 of the heating module 40 has a third through hole H4, and the third through hole H4 penetrates through the upper and lower sides of the main board 421. The third through hole H4 is used for the liquid on the upper surface of the main board 421 to flow to the tray 41 of the heating module 40. As Figure 15 shown, the tray 41 has a fourth through hole H5, and the fourth through hole H5 penetrates through the upper and lower sides of the tray 41. The fourth through hole H5 is used for the liquid on the upper surface of the tray 41 to flow to the liquid cooling area 110

[0116] In this way, it is convenient for the liquid on the upper surface of the main board 421 and the liquid on the upper surface of the tray 41 to quickly flow into the diversion groove G1 and be discharged from the chassis 10 through the diversion groove G1, so that it is not easy for the upper surface of the main board 421 and the upper surface of the tray 41 to generate accumulated liquid, and it is not easy for the electronic device to malfunction due to the accumulated liquid on the upper surface of the main board 421 and the upper surface of the tray 41

[0117] In some possible embodiments, at least part of the orthographic projection of the fourth through hole H5 on the bottom plate 100 is located in the diversion groove G1 of the chassis 10, so that the liquid flowing out of the fourth through hole H5 can quickly flow into the diversion groove G1

[0118] Exemplarily, the orthographic projection of the fourth through hole H5 on the bottom plate 100 is located in the diversion groove G1 of the chassis 10, so that the liquid flowing out of the fourth through hole H5 is not easy to flow to the fixed structural member 200 provided on the protruding portion 112, and it is not easy to have the problem that the liquid leaks to the lower part of the chassis 10 at the fixed structural member 200

[0119] Such as Figure 10 shown, in some possible embodiments, the tray 41 is provided with a stud 43, a screw 44 is inserted into the third through hole H4, and the screw 44 is threadedly connected to the stud 43. The main board 421 and the tray 41 are fixedly connected by the screw 44 and the stud 43. Gaskets 45 are provided between the screw 44 and the upper surface of the main board 421, and between the lower surface of the main board 421 and the upper surface of the tray 41

[0120] Such as Figure 10 、 Figure 11 shown, the side of the gasket 45 facing the main board 421 has a communication groove G3, the communication groove G3 penetrates through the outer peripheral surface of the gasket 45, the communication groove G3 is communicated with the third through hole H4, and the communication groove G3 is also communicated with the space outside the radial direction of the gasket 45

[0121] Such as Figure 15 shown, at least part of the fourth through hole H5 is provided outside the stud 43

[0122] As Figure 10 , Figure 15 shown, the communication groove G3, the third through hole H4 of the gasket 45 disposed between the upper surface of the screw 44 and the main board 421, the communication groove G3 of the gasket 45 disposed between the lower surface of the main board 421 and the upper surface of the tray 41, and the fourth through hole H5 are sequentially communicated to form a flow path for the liquid on the upper surface of the main board 421 to flow to the liquid cooling area 110. The liquid on the upper surface of the main board 421 can flow to the upper surface of the tray 41 through the communication groove G3, the third through hole H4 of the gasket 45 disposed between the upper surface of the screw 44 and the main board 421, and the communication groove G3 of the gasket 45 disposed between the lower surface of the main board 421 and the upper surface of the tray 41. The liquid on the upper surface of the tray 41 can flow to the liquid cooling area 110 through the fourth through hole H5.

[0123] In this way, in addition to being used for guiding the flow, the third through hole H4 is also used to realize the connection between the main board 421 and the tray 41, so that there are fewer openings on the main board 421, which is beneficial to the wiring inside the main board 421 and the arrangement of components. By providing the communication groove G3 on the gasket 45, it is convenient to fix and connect the main board 421 and the tray 41 through the screw 44 and the stud 43, and at the same time, the area above the main board 421 is communicated with the area between the main board 421 and the tray 41 through the third through hole H4, so as to facilitate the liquid on the upper surface of the main board 421 to flow to the upper surface of the tray 41 through the third through hole H4.

[0124] Exemplarily, the lower surface of the main board 421 is spaced from the upper surface of the tray 41, so that the accumulated liquid on the upper surface of the tray 41 is not likely to affect the main board 421.

[0125] Exemplarily, the screw 44, the stud 43 and the gasket 45 are all made of conductive materials such as metal, and the main board 421 is electrically connected to the tray 41 through the screw 44, the stud 43 and the gasket 45, so as to realize grounding through the tray 41.

[0126] As Figure 11 shown, the gasket 45 has a fifth through hole H6, and the fifth through hole H6 penetrates through both sides in the thickness direction of the gasket 45, and the screw 44 is inserted into the fifth through hole H6.

[0127] As Figures 11 - 14 shown, in some possible implementation manners, the side of the communication groove G3 away from the main board 421 is a sealed structure.

[0128] In this way, the strength of the gasket 45 is better, so that the gasket 45 is not easily deformed due to extrusion, which is beneficial to maintaining the communication performance of the communication groove G3.

[0129] Exemplarily, the gasket 45 includes a first structural segment 451 and a second structural segment 452, the first structural segment 451 and the second structural segment 452 are arranged along the thickness direction of the gasket 45, the first structural segment 451 is used to abut against the main board 421, and the second structural segment 452 is used to abut against the stud 43 or the screw head of the screw 44. The connecting groove G3 is provided in the first structural segment 451, and the second structural segment 452 covers the side of the connecting groove G3 away from the main board 421.

[0130] In some possible implementations, one end of the communicating groove G3 close to the central axis of the gasket 45 is a sealing structure.

[0131] In this way, the gasket 45 has good strength, so that the gasket 45 is not easily deformed due to extrusion, which is beneficial to maintaining the connectivity of the connecting groove G3.

[0132] In some other possible implementations, the connecting groove G3 may penetrate both sides of the gasket 45 in the thickness direction.

[0133] In some other possible implementations, one end of the connecting groove G3 close to the central axis of the gasket 45 is an open structure, that is, one end of the connecting groove G3 close to the central axis of the gasket 45 is connected to the fifth through hole H6.

[0134] like Figure 15 As shown, in some possible embodiments, the gasket 45 has a plurality of connecting grooves G3 arranged at intervals along the circumference of the gasket 45, so that the liquid on the upper surface of the mainboard 421 can quickly flow through the third through hole H4 to the upper surface of the tray 41. The tray 41 is provided with a plurality of fourth through holes H5 arranged at intervals along the circumference of the stud 43, so that the liquid on the upper surface of the tray 41 can quickly flow through the fourth through holes H5 to the liquid cooling area 110.

[0135] Exemplarily, the orthographic projection of the stud 43 on the base plate 100 is located in the guide groove G1, so that the orthographic projection of the fourth through hole H5 arranged around the stud 43 on the base plate 100 is located in the guide groove G1, thereby facilitating the liquid flowing out of the fourth through hole H5 to quickly flow into the guide groove G1.

[0136] The cooling device and electronic device provided by the present application are introduced in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A chassis (10), characterized in that, It includes a bottom plate (100) and a fixing structure member (200); The bottom plate (100) includes a liquid cooling area (110) and a liquid retaining wall (120) provided on the periphery of the liquid cooling area (110); The liquid cooling area (110) includes a flow guiding groove part (111) and a convex part (112). The convex part (112) is surrounded by the flow guiding groove part (111). Both the convex part (112) and the liquid retaining wall (120) protrude from the upper surface of the flow guiding groove part (111). A flow guiding groove (G1) is formed between the upper surface of the flow guiding groove part (111) and the convex part (112) and the liquid retaining wall (120); The fixing structure member (200) is connected to the top of the convex part (112).

2. The chassis (10) according to claim 1, characterized in that, The liquid retaining wall (120), the flow guiding groove part (111) and the convex part (112) are of an integral structure.

3. The chassis (10) according to claim 2, characterized in that, At least one of the liquid retaining wall (120) and the convex part (112) is a structure formed by stamping the lower surface of the bottom plate (100) using a stamping process.

4. The chassis (10) according to any one of claims 1-3, characterized in that, The fixing structure member (200) is riveted to the top of the convex part (112).

5. The chassis (10) according to any one of claims 1-3, characterized in that, The bottom plate (100) is formed with a liquid drainage groove (G2). The liquid drainage groove (G2) is located outside the liquid cooling area (110). The inlet of the liquid drainage groove (G2) is communicated with the flow guiding groove (G1); The bottom surface of the flow guiding groove (G1) is an inclined surface. The bottom surface of the flow guiding groove (G1) is used to converge the leaked liquid received in the flow guiding groove (G1) to the inlet of the liquid drainage groove (G2).

6. The chassis (10) according to claim 5, characterized in that, The liquid retaining wall (120) has a notch (C). The notch (C) is located behind the flow guiding groove (G1). The notch (C) forms the inlet of the liquid drainage groove (G2); The bottom surface of the flow guiding groove (G1) is an inclined surface with a gradually decreasing height from front to back.

7. An electronic device, characterized in that, It includes a heat generating module (40), a liquid cooling component (50), and a chassis (10) according to any one of claims 1-6; Both the heat generating module (40) and the liquid cooling component (50) are provided in the chassis (10). The heat generating module (40) is fixedly connected to the fixing structure member (200) of the chassis (10). The liquid cooling component (50) is in contact with the heat generating module (40). The orthographic projections of the liquid cooling component (50) and the heat generating module (40) on the bottom plate (100) of the chassis (10) are both located in the liquid cooling area (110) of the bottom plate (100).

8. The electronic device according to claim 7, characterized in that, It further includes a pipeline component (60) and a flow guiding strip (70); The liquid cooling component (50) includes a cold plate (51) and a liquid cooling joint (52). The cold plate (51) is connected to the pipeline component (60) through the liquid cooling joint (52); One end of the flow guiding strip (70) is connected to the liquid cooling joint (52). The other end of the flow guiding strip (70) is located in the flow guiding groove (G1) of the chassis (10). The flow guiding strip (70) is used to introduce the leaked liquid at the liquid cooling joint (52) into the flow guiding groove (G1).

9. The electronic device according to claim 8, wherein The heating module (40) comprises a tray (41) and a main board (421); The tray (41) is fixedly connected to the fixed structure (200), the main board (421) is fixedly connected to the tray (41), and the main board (421) is located on a side of the tray (41) away from the bottom board (100); The main board (421) has a first through hole (H2), the tray (41) has a second through hole (H3), and the guide bar (70) is arranged through the first through hole (H2) and the second through hole (H3); The guide bar (70) is spaced apart from the hole wall of the first through hole (H2).

10. The electronic device according to any one of claims 7-9, characterized in that, The main board (421) of the heating module (40) has a third through hole (H4), and the third through hole (H4) is used to allow liquid located on the upper surface of the main board (421) to flow toward the tray (41) of the heating module (40). The tray (41) has a fourth through hole (H5), and the fourth through hole (H5) is used to allow liquid on the upper surface of the tray (41) to flow toward the liquid cooling area (110).

11. The electronic device according to claim 10, characterized in that, At least part of the orthographic projection of the fourth through hole (H5) on the bottom plate (100) is located in the guide groove (G1) of the chassis (10).

12. The electronic device according to claim 10, characterized in that, The tray (41) is provided with a stud (43), a screw (44) is inserted into the third through hole (H4), the screw (44) is threadedly connected to the stud (43), the main board (421) and the tray (41) are fixedly connected via the screw (44) and the stud (43), and the lower surface of the main board (421) is spaced apart from the upper surface of the tray (41); Gaskets (45) are provided between the screws (44) and the upper surface of the main board (421), and between the lower surface of the main board (421) and the upper surface of the tray (41); The gasket (45) has a communication groove (G3) on one side facing the main board (421), the communication groove (G3) passes through the outer peripheral surface of the gasket (45), and the communication groove (G3) is connected to the third through hole (H4); At least a portion of the fourth through hole (H5) is disposed on the outside of the stud (43); The connecting groove (G3) of the gasket (45) provided between the screw (44) and the upper surface of the main board (421), the third through hole (H4), the connecting groove (G3) of the gasket (45) provided between the lower surface of the main board (421) and the upper surface of the tray (41), and the fourth through hole (H5) are connected in sequence to form a flow channel for liquid located on the upper surface of the main board (421) to flow to the liquid cooling area (110).

13. The electronic device according to claim 12, wherein The side of the communication groove (G3) facing away from the main board (421) is a sealing structure.

14. The electronic device according to claim 12, wherein One end of the connecting groove (G3) close to the central axis of the gasket (45) is a sealing structure.

15. The electronic device according to claim 12, characterized in that, The gasket (45) has a plurality of the communicating grooves (G3) arranged at intervals along the circumference of the gasket (45); The tray (41) is provided with a plurality of the fourth through holes (H5) arranged at intervals in the circumferential direction of the stud (43).

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