Test data processing method and device, terminal equipment and program product

Abstract

The invention is suitable for the technical field of testing, and provides a test data processing method and device, terminal equipment and a program product, and the method comprises the steps: obtaining the test data of a semiconductor chip in a product testing process; data analysis is carried out on the test data to obtain analyzed data, and the data analysis comprises at least one of unique identification code duplicate checking analysis, dynamic test item distribution analysis and yield difference calculation; the analyzed data are classified and identified, identified data are obtained, and the identified data are used for a user to check the test condition of the semiconductor chip. According to the method, the test data is subjected to at least one of unique identification code duplicate checking analysis, dynamic test item distribution analysis and yield difference calculation to obtain the analyzed data, so that the processing means of the existing test data are enriched, the accuracy of the data processing result is improved, and the quality of the semiconductor chip is improved.

Description

Technical Field

[0001] This application belongs to the field of testing technology, and particularly relates to a method, device, terminal device, and program product for processing test data. Background Art

[0002] Since the development of the semiconductor industrial chain to date, from chip design, simulation, wafer foundry tape-out, mid-stage testing, chip packaging, back-end testing to product shipment, there has been a relatively complete process flow. The test data in the whole process is of great significance to each process, representing the process capabilities of each wafer foundry, test factory, and packaging factory. Therefore, how to accurately determine the test data generated in these different dimensions is a very important task.

[0003] However, due to the limitations of test equipment and test software, the data formats, contents, and acquisition methods of test data are diverse in each link. However, the existing methods for processing test data are relatively single, resulting in relatively low accuracy of data processing results, which seriously affects the quality of semiconductor chips. Summary of the Invention

[0004] Embodiments of this application provide a method, device, terminal device, and program product for processing test data, which can enrich the existing means for processing test data, improve the accuracy of data processing results, and thus improve the quality of semiconductor chips.

[0005] In a first aspect, embodiments of this application provide a method for processing test data, including:

[0006] Obtain test data of a semiconductor chip during product testing;

[0007] Perform data analysis on the test data to obtain analyzed data, where the data analysis includes at least one of unique identification code duplicate check analysis, dynamic test item distribution analysis, and yield difference calculation;

[0008] Perform classification and identification on the analyzed data to obtain identified data, and the identified data is used for a user to view the test situation of the semiconductor chip.

[0009] In a possible implementation manner of the first aspect, performing classification and identification on the analyzed data to obtain identified data includes:

[0010] Generate a unique classification code corresponding to the analyzed data;

[0011] Based on the unique classification code, perform identification on the analyzed data to obtain identified data;

[0012] Store the identified data in a database.

[0013] In a possible implementation of the first aspect, data analysis is performed on the test data to obtain the analyzed data, including:

[0014] Preprocess the test data to obtain preprocessed data, where the preprocessing includes data verification and / or format conversion;

[0015] Perform data analysis on the preprocessed data to obtain the analyzed data, and the data form of the analyzed data includes at least one of a bar chart, a line chart, a pie chart, and a normal distribution chart.

[0016] In a possible implementation of the first aspect, perform format verification on the test data to obtain the format verification result of the test data;

[0017] If the format verification result indicates that the test data meets the preset format conditions, perform format conversion on the test data to obtain the preprocessed data;

[0018] If the format verification result indicates that the test data does not meet the preset format conditions, generate the first abnormal data information corresponding to the test data, and the first abnormal data information is used to prompt the user to check the test data.

[0019] In a possible implementation of the first aspect, the test data includes the current data file of the semiconductor chip during product testing on the test equipment. Perform format verification on the test data to obtain the format verification result of the test data, including at least one of the following:

[0020] Verify whether the file name of the current data file conforms to the set specification;

[0021] Verify whether the file format of the header file in the current data file is the set format;

[0022] Verify whether the file sizes of the current data file and the historical data file are the same, where the current data file and the historical data file are data files of the same type of semiconductor chip during product testing on the same test equipment at different time points.

[0023] In a possible implementation of the first aspect, after performing data analysis on the test data to obtain the analyzed data, the method further includes:

[0024] Perform data evaluation on at least part of the analyzed data based on the preset standard data to obtain the data evaluation result of at least part of the analyzed data;

[0025] If the data evaluation result indicates that at least part of the analyzed data is greater than the preset standard data, generate the second abnormal data information corresponding to at least part of the analyzed data, and the second abnormal data information is used to prompt the user to check the test equipment corresponding to at least part of the analyzed data.

[0026] In a possible implementation of the first aspect, the test data at least includes wafer data and performance data. Among them, the wafer data is the map data of the wafer corresponding to the semiconductor chip during testing on the probe station, and the performance data is the data of the semiconductor chip during performance testing on the tester.

[0027] In a second aspect, an embodiment of the present application provides a processing device for test data, including:

[0028] An acquisition module, configured to acquire test data of a semiconductor chip during product testing;

[0029] An analysis module, configured to perform data analysis on the test data to obtain analyzed data. Among them, the data analysis includes at least one of unique identification code duplicate check analysis, dynamic test item distribution analysis, and yield difference calculation;

[0030] A classification and identification module, configured to perform classification and identification on the analyzed data to obtain identified data, and the identified data is used for a user to view the test situation of the semiconductor chip.

[0031] In a third aspect, an embodiment of the present application provides a terminal device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the method according to any item of the first aspect is implemented.

[0032] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, and the computer-readable storage medium stores a computer program. When the computer program is executed by a processor, the method according to any item of the first aspect is implemented.

[0033] In a fifth aspect, an embodiment of the present application provides a computer program product. When the computer program product runs on a terminal device, the terminal device is enabled to execute the method according to any item of the first aspect.

[0034] An embodiment of the present application provides a method, device, terminal device, and program product for processing test data. The method includes: acquiring test data of a semiconductor chip during product testing; performing data analysis on the test data to obtain analyzed data. Among them, the data analysis includes at least one of unique identification code duplicate check analysis, dynamic test item distribution analysis, and yield difference calculation; performing classification and identification on the analyzed data to obtain identified data, and the identified data is used for a user to view the test situation of the semiconductor chip. By using the above technical solution, by performing at least one of unique identification code duplicate check analysis, dynamic test item distribution analysis, and yield difference calculation on the test data to obtain analyzed data, the existing means for processing test data is enriched, the accuracy of the data processing result is improved, and thus the quality of the semiconductor chip is improved. Description of the Drawings

[0035] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0036] Figure 1 is a schematic flowchart of a method for processing test data provided by an embodiment of the present application;

[0037] Figure 2 is a schematic flowchart of another method for processing test data provided by an embodiment of the present application;

[0038] Figure 3 is a schematic overall flowchart of a method for processing test data provided by an embodiment of the present application;

[0039] Figure 4 is a schematic overall flowchart of another method for processing test data provided by an embodiment of the present application;

[0040] Figure 5 is a structural block diagram of a device for processing test data provided by an embodiment of the present application;

[0041] Figure 6 is a schematic structural diagram of a terminal device provided by an embodiment of the present application. Detailed implementation manners

[0042] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present application. However, those skilled in the art should clearly understand that the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details from interfering with the description of the present application.

[0043] It should be understood that when used in the specification of the present application and the appended claims, the term "comprising" indicates the presence of the described features, wholes, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or their combinations.

[0044] It should also be understood that the term "and / or" used in the specification of the present application and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0045] As used in the specification and claims of this application, the term "if" may be construed, depending on the context, as "when", "once", "in response to determining", or "in response to detecting". Similarly, the phrases "if determined" or "if [described condition or event] is detected" may be construed, depending on the context, to mean "once determined", "in response to determining", "once [described condition or event] is detected", or "in response to detecting [described condition or event]".

[0046] In addition, in the description of the specification and claims of this application, the terms "first", "second", "third", etc. are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance.

[0047] References to "one embodiment" or "some embodiments" or the like described in the specification of this application mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in one or more embodiments of this application. Thus, statements such as "in one embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments", etc. that appear in different places in this specification do not necessarily all refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized. The terms "comprising", "including", "having", and their variants mean "including but not limited to", unless otherwise specifically emphasized.

[0048] It can be considered that due to the limitations of test equipment and test software, the data formats, contents, acquisition methods, and output formats of test data are diverse in each link, resulting in an increase in the difficulty of data processing. For example, it is very difficult to achieve unified collection, processing and analysis of test data and the determination of analysis results. Especially in recent years, the test requirements for complementary metal oxide semiconductor image sensors (CMOS Image Sensors, CIS), radio frequency (RF), and automotive-grade chips have increased, and the requirements for test data processing have become more and more stringent. Key automotive-grade parameters such as good die in bad neighborhood (GDBN) have brought the processing of test data to a very high level. However, in the actual production process, problems such as time delay, incomplete data, and data errors often occur in the processing of test data. Therefore, how to process test data faster, more accurately, and more securely, and be able to determine the test data in each link is an urgent problem to be solved currently.

[0049] Based on this, an embodiment of the present application provides a method for processing test data, which can make the processing of test data efficient, fast, and accurate, and can meet the requirements of different formats, different customers, and different scenarios. It has high practicability and simple operation, and can be promoted and used on various products.

[0050] The method for processing test data provided by the embodiment of the present application can be applied to terminal devices such as mobile phones, tablet computers, in-vehicle devices, augmented reality (AR) / virtual reality (VR) devices, laptop computers, ultra-mobile personal computers (UMPCs), netbooks, personal digital assistants (PDAs), etc. The embodiment of the present application does not impose any restrictions on the specific types of terminal devices.

[0051] Figure 1 FIG. is a schematic flowchart of a method for processing test data provided by an embodiment of the present application. As an example but not a limitation, this method can be applied to a terminal device, such as Figure 1 shown, the method includes:

[0052] S101. Obtain test data during the product test of the semiconductor chip.

[0053] In this embodiment, the test data of the semiconductor chip can be obtained in real time. For example, data in different formats collected by various different test devices can be automatically obtained, solving the problem of time delay that often occurs during the processing of test data. Among them, the test device can include at least one of a probe station, a sorter, and a tester, and can also include fixtures used in the test, such as a probe card and a test socket.

[0054] Taking wafer testing as an example, the tester, probe station, and probe card can be used in cooperation. The signal is input and read by the probe card piercing the pads of the semiconductor chip, and verifications such as voltage, current, timing, and function are completed.

[0055] As an example, the test data at least includes wafer data and performance data. Among them, the wafer data is the map data of the wafer corresponding to the semiconductor chip tested on the probe station, and the performance data is the data of the semiconductor chip tested on the tester for performance testing. On this basis, by including at least wafer data and performance data in the test data, the source of the test data is enriched, and the problems of incomplete data and data errors that often occur during the processing of test data are solved, providing a data basis for subsequent data analysis.

[0056] Exemplarily, a tester can be used to detect the functional integrity of integrated circuits in semiconductor chips. By applying excitation signals and monitoring output signals, it verifies whether the functions of semiconductor chips are normal. The performance data generated by the tester can be represented as test data, which is statistically analyzed in units of a die. It can include the location information of the die, test items, test results, etc. The performance data can be used to evaluate the functions and performance of semiconductor chips, help identify defective products, and provide a basis for subsequent production and quality control.

[0057] A prober can be used to precisely test each die on a wafer. By contacting the pads on the wafer with probes to read the electrical signals of semiconductor chips, it generates map data, which can be represented as test map. It can intuitively display the yield situation of the entire wafer, including information such as Hard Bin and Soft Bin; the map data can be provided to the packaging process as the basis for die selection in packaging, helping to screen out qualified semiconductor chips for packaging to ensure the quality of the final product.

[0058] S102. Perform data analysis on the test data to obtain the analyzed data.

[0059] Among them, the data analysis includes at least one of the following: duplicate check analysis of unique identification codes, distribution analysis of dynamic test items, and yield difference calculation.

[0060] After obtaining the test data of semiconductor chips during the product testing process, this step can analyze the test data according to different dimensions. For example, the items of data analysis can include at least one of the following: duplicate check analysis of unique identification codes, distribution analysis of dynamic test items, and yield difference calculation. The items of data analysis can also include Z-axis part average test analysis, static test item distribution analysis, Process Capability Index for Key Characteristics (CPK), Soft Bin Limit (SYL) analysis, AC / DC voltage AD / DC test item distribution analysis, Serial Bus Logic (SBL) analysis, and Test time, etc., so as to find out risky semiconductor chips through different analysis methods and improve the quality and reliability of semiconductor chips.

[0061] Among them, the Universally Unique Identifier (UID) can be the unique identifier for each semiconductor chip, which can be jointly composed of the wafer lot number, batch number, inspection code, packaging factory code, customer code, and operation serial code. The parsing difficulty, uniqueness, and security are higher. The UID duplicate check analysis can be used to identify the test data of the same semiconductor chip. The Dynamic Part Average Testing (DPAT) can find risky semiconductor chips by setting dynamic upper and lower limits for test items. For example, in this embodiment, the license management mode can be adopted to configure different permissions of licenses for different customers, different chip products, and different test equipment to ensure the security of customer data. The yield difference calculation can refer to the difference between the first-test yield and the final-test yield of the test data. The first-test yield can refer to the qualified ratio of the semiconductor chip during the first test, and the final-test yield is the qualified ratio of the semiconductor chip after all test processes. Calculating the yield difference can help understand the change in the qualified situation of the semiconductor chip during the entire test process. The Z-axis Part Average Testing (ZPAT) can find risky semiconductor chips by the longitudinal yield size of the same coordinate. The Static Part Average Testing (SPAT) can find risky semiconductor chips by setting static upper and lower limits for test items. The process capability index CPK analysis of semiconductor chips can be a method for evaluating the production capacity and quality stability during the semiconductor chip manufacturing process, and the process capability index is calculated to measure whether the process can stably produce semiconductor chips that meet the quality requirements. The SYL analysis can be a logical standard for classifying and screening the test results of semiconductor chips. The SBL analysis can be a logical circuit or test item related to the serial communication interface for testing semiconductor chips.

[0062] In the specific implementation, according to the actual requirements of data analysis, the test data of the same dimension can be analyzed separately, or the test data of all dimensions can be integrated and analyzed uniformly. The test data of the same dimension can include, for example, the data generated by the same test equipment, the test data of the same semiconductor chip model, or the test data of the same batch of semiconductor chips, etc.; or it can also analyze the same test item for different semiconductor chips, analyze the semiconductor chip yield at the same position for different semiconductor chips, or analyze the consistency of test items for the same semiconductor chip, etc.

[0063] S103. Classify and label the analyzed data to obtain the labeled data.

[0064] Among them, the data after identification is used for users to view the test situation of the semiconductor chip.

[0065] This embodiment does not limit the process of classification identification. For example, all the analyzed data obtained can be directly classified and identified, or after certain data processing on all the analyzed data, specific classification identification can be carried out. Or classification identification of the analyzed data can be carried out while performing certain data processing on all the analyzed data. In addition, the means of specific classification identification can be classified and identified according to the pre-set classification, or different classification identifications can be carried out according to the actual situation of the test data.

[0066] As an example of classification identification, classifying and identifying the analyzed data to obtain the data after identification includes:

[0067] Generating a unique classification code corresponding to the analyzed data;

[0068] Identifying the analyzed data based on the unique classification code to obtain the data after identification;

[0069] Storing the data after identification in a database.

[0070] The unique classification code can be regarded as a label for the analyzed data, used to characterize the dimension of data analysis. For example, it can be marked according to the dimension of analysis. For different analyzed data obtained through Part Average Testing (PAT) and CPK dimension, labels PAT-20250310105143 and CPK-20250310105243 (i.e., unique classification codes) can be newly created respectively. After identifying the analyzed data based on the newly created labels, the data after identification can be stored in the database, enabling users to view the test situation of the semiconductor chip in the database at any time, which helps to quickly locate the results of data analysis.

[0071] A method for processing test data provided by this embodiment includes: obtaining test data of a semiconductor chip during product testing; performing data analysis on the test data to obtain analyzed data, where the data analysis includes at least one of unique identification code duplicate checking analysis, dynamic test item distribution analysis, and yield difference calculation; classifying and identifying the analyzed data to obtain the data after identification, and the data after identification is used for users to view the test situation of the semiconductor chip. Using this method, by performing at least one of unique identification code duplicate checking analysis, dynamic test item distribution analysis, and yield difference calculation on the test data, analyzed data is obtained, enriching the existing means of processing test data, improving the accuracy of data processing results, and thus enhancing the quality of semiconductor chips.

[0072] In some embodiments, after performing data analysis on test data to obtain the analyzed data, the method further includes:

[0073] Performing data evaluation on at least part of the analyzed data based on preset standard data to obtain the data evaluation result of at least part of the analyzed data;

[0074] If the data evaluation result indicates that at least part of the analyzed data is greater than the preset standard data, generating second abnormal data information corresponding to at least part of the analyzed data, where the second abnormal data information is used to prompt the user to check the test equipment corresponding to at least part of the analyzed data.

[0075] In the specific implementation, each piece of test data will undergo data analysis in different dimensions, and the final output result can be selected according to the user's needs; similarly, after performing data analysis on the test data, specific data processing operations can be further performed on the analyzed data according to the user's needs. For example, specific data processing operations can be performed on part of the analyzed data, or specific data processing operations can be performed on all of the analyzed data. Specifically, it can be configured according to the actual situation of the analyzed data. For example, if some analyzed data is for more intuitive viewing of the data results, no subsequent data processing operations are required. If some analyzed data is for viewing the consistency and accuracy of the data, specific data processing operations can be performed on this type of analyzed data at this time.

[0076] As an example, data evaluation can be performed on at least part of the analyzed data based on preset standard data to obtain the data evaluation result of at least part of the analyzed data. For example, part of the analyzed data can be compared with the preset standard data in the Manufacturing Execution System (MES) system, or a series of evaluation calculations can be performed on part of the analyzed data and the preset standard data in the MES system to obtain the corresponding data evaluation result. According to different data evaluation results, different operations can be performed subsequently. For example, if the comparison passes, it can automatically proceed to the next process. If the comparison fails, the MES system will hold this batch of products here and generate second abnormal data information to prompt the user to check the test equipment corresponding to at least part of the analyzed data. For example, the abnormal information can be pushed to the email of relevant technicians, and the technicians can verify the abnormal test equipment, confirm the cause of the abnormality, and formulate containment measures, etc.

[0077] Figure 2It is a schematic flowchart of a method for processing test data provided by another embodiment of the present application. In this embodiment, data analysis will be performed on the test data, and the obtained analyzed data will be further optimized as follows: preprocess the test data to obtain preprocessed data, and the preprocessing includes data verification and / or format conversion; perform data analysis on the preprocessed data to obtain analyzed data, and the data form of the analyzed data includes at least one of a bar chart, a line chart, a pie chart, and a normal distribution chart. As Figure 2 shown, the method includes:

[0078] S201. Obtain test data during the product test of the semiconductor chip.

[0079] S202. Preprocess the test data to obtain preprocessed data.

[0080] S203. Perform data analysis on the preprocessed data to obtain analyzed data.

[0081] In this embodiment, the preprocessing may include data verification and / or format conversion. The content of the data verification is not limited. For example, it may include form verification of the test data or content verification of the test data, etc., to enhance the standardization of the data. The data form of the analyzed data may include at least one of a bar chart, a line chart, a pie chart, and a normal distribution chart.

[0082] In some embodiments, preprocessing the test data to obtain preprocessed data includes:

[0083] Perform format verification on the test data to obtain the format verification result of the test data;

[0084] If the format verification result indicates that the test data meets the preset format conditions, perform format conversion on the test data to obtain preprocessed data;

[0085] If the format verification result indicates that the test data does not meet the preset format conditions, generate the first abnormal data information corresponding to the test data, and the first abnormal data information is used to prompt the user to check the test data.

[0086] The preset format conditions can be pre-set format conditions for verifying the standardization of the test data; the format verification result is the result of performing format verification on the test data.

[0087] In a specific embodiment, format verification can be performed on the test data to obtain the format verification result of the test data, and different processing can be performed on the test data according to different format verification results. For example, the format verification of the test data can be implemented based on a verification model. By inputting the test data into the verification model, the format verification result of the test data is output. The verification model can be a pre-trained neural network model; or the test data can be verified item by item based on the preset format conditions, etc.

[0088] Furthermore, if the format verification result indicates that the test data conforms to the preset format conditions, it means that the collected test data conforms to the specifications. Then, format conversion can be performed on the test data. For example, all the test data that passes the verification can be converted into a unified XML format. On this basis, by using the concise XML format, it is convenient for unified standardization, so that test information such as product code, yield, model number, binning, etc. can be displayed more directly and clearly, improving the accuracy of data analysis. If the format verification result indicates that the test data does not conform to the preset format conditions, it means that the collected test data does not conform to the specifications. Then, the first abnormal data information corresponding to the test data can be generated. For example, an alarm message (i.e., the first abnormal data information) can be pushed to the email of the technical staff. The first abnormal data information can include information such as incomplete test data or verification error, etc., to prompt the user to check the test data. On this basis, by performing format verification on the test data, the standardization of the test data for subsequent data analysis is improved, and by performing format conversion on the test data, the consistency of the test data is ensured, and the consistency and reliability of subsequent data analysis are ensured.

[0089] In some embodiments, the test data includes the current data file of the semiconductor chip during product testing on the test equipment. The performing format verification on the test data to obtain the format verification result of the test data includes at least one of the following:

[0090] Verifying whether the file name of the current data file conforms to the set specifications;

[0091] Verifying whether the file format of the header file in the current data file is the set format;

[0092] Verifying whether the file size of the current data file is the same as that of the historical data file, where the current data file and the historical data file are data files of the same type of semiconductor chip during product testing on the same test equipment at different time points.

[0093] In the specific implementation, the test data may include the current data file of the semiconductor chip for product testing on the test equipment. The number of semiconductor chips may be one or more. In the case of multiple semiconductor chips, the types of the semiconductor chips are not limited. For example, the same type of semiconductor chip may correspond to one current data file, and the test data of different types of semiconductor chips may be stored in different current data files. The content of the specific format verification may include at least one of the following: verifying whether the file name of the current data file conforms to the specification; verifying whether the format of the header file in the file content is correct; comparing with the previous and subsequent files to ensure that the size of the test data generated by the same wafer is consistent. On this basis, the integrity of the test data is ensured, errors in the test data are prevented, and the efficiency of subsequent data analysis is improved.

[0094] S204. Classify and label the analyzed data to obtain the labeled data.

[0095] A method for processing test data provided in this embodiment provides an accurate data basis for subsequent data analysis by preprocessing the test data, and further improves the accuracy of the data processing result.

[0096] Figure 3 is the overall flowchart of a method for processing test data provided in an embodiment of the present application. As Figure 3 shown, the Electrical Analysis Program (EAP) can automatically collect test data in different data formats from various test equipment. For example, the test equipment may include a prober, a tester, and a handler. The data formats may include the plain text format TXT, the CSV text format with fields separated by commas, etc., the general data file format DAT, the standard storage format STDF, the MDB format used by the Microsoft Access database, the LOG text file that records the running events of the system, programs, etc. according to time, and other data files, and the integrity of the data must be ensured; the data conversion center can generate a fixed XML format after processing and converting the received data files in various formats. The EAP may be a software system or tool set used to analyze and evaluate the electrical performance of chips during the chip testing process.

[0097] Then, according to the preset requirements, the processed data can be analyzed in detail from different dimensions, such as including the analysis of items such as UID duplicate checking, yield difference calculation, PAT, SPAT, DPAT, ZPAT, CPK, SYL, AD / DC normal distribution, SBL, and Test time, and the data analysis results can be output in the form of bar charts, line charts, pie charts, normal distribution charts, etc.; finally, the analyzed data can be compared with the standard data of MES. For example, according to the set standards, the comparison results of the test data can be determined, and it can be decided whether the product needs to continue production (such as release) or be detained. If the analyzed data exceeds the standard data of MES, the abnormal data can be classified and marked.

[0098] Figure 4 It is a schematic diagram of the overall process of another method for processing test data provided by an embodiment of the present application. As Figure 4 shown, the entire implementation process mainly goes through data collection, data verification, data conversion, data analysis, MES interaction, data marking, and data storage. Specifically, first, the EAP system can collect test data generated by the test machine and test map data generated by the probe station device in real time, and there will be no problem of time delay in the entire data collection process. Then, it can include verifying the collected test data to confirm the integrity of the data transmitted to the next stage. For the test data with correct verification, the data format can be converted, and all the test data can be converted into a unified XML format; then, the converted XML format file can be analyzed layer by layer, and the analysis results can be output according to different dimensions.

[0099] For the analyzed data, on the one hand, it can be compared with the set standard data in the MES system. If the comparison passes, the MES system automatically goes to the next process. If the comparison fails, the MES system will detain this batch of products here and at the same time push the abnormal information to the technician's email. The technician will immediately verify the abnormal equipment, confirm the cause of the abnormality, and formulate containment measures; on the other hand, the analyzed data can be classified and marked so that the analyzed data can be saved in the database according to different categories for the inspection of engineering and technical personnel. The data in the database is data with extremely high credibility and can be used as a standard data template for each process.

[0100] Each of the above steps can work in sequence, cooperate with each other, and operate together to ensure the timeliness and reliability of the final result of the entire solution, and realize the unified analysis of diversified test data.

[0101] In summary, the method for processing test data in this embodiment enables developers to automatically complete the entire test data processing flow after developing the system environment of the terminal device, without the need for additional intervention during the process, greatly improving the accuracy and timeliness of test data analysis and reducing operating costs. At the same time, through experiments and confirmations in actual production, the method for processing test data in this embodiment can efficiently solve problems such as time delay, incomplete test data, and incorrect data results in test data analysis, accurately, efficiently, and completely complete the analysis of test data, and maximize the satisfaction of customer needs.

[0102] Corresponding to the method for processing test data in the above embodiment, Figure 5 FIG. is a structural block diagram of a test data processing device provided by an embodiment of the present application. For ease of description, only parts related to the embodiment of the present application are shown.

[0103] Referring to Figure 5 , the device includes:

[0104] An acquisition module 301, configured to acquire test data of a semiconductor chip during product testing;

[0105] An analysis module 302, configured to perform data analysis on the test data to obtain analyzed data, where the data analysis includes at least one of unique identifier duplicate check analysis, dynamic test item distribution analysis, and yield difference calculation;

[0106] A classification and identification module 303, configured to perform classification and identification on the analyzed data to obtain identified data, and the identified data is used for a user to view the test situation of the semiconductor chip.

[0107] A test data processing device provided in this embodiment acquires test data of a semiconductor chip during product testing through an acquisition module; performs data analysis on the test data through an analysis module to obtain analyzed data, where the data analysis includes at least one of unique identifier duplicate check analysis, dynamic test item distribution analysis, and yield difference calculation; and performs classification and identification on the analyzed data through a classification and identification module to obtain identified data, and the identified data is used for a user to view the test situation of the semiconductor chip. By using this device, at least one of unique identifier duplicate check analysis, dynamic test item distribution analysis, and yield difference calculation is performed on the test data to obtain analyzed data, enriching the existing means for processing test data, improving the accuracy of data processing results, and thus enhancing the quality of semiconductor chips.

[0108] Optionally, the classification and identification module is specifically configured to:

[0109] Generate a unique classification code corresponding to the analyzed data;

[0110] Identify the analyzed data based on the unique classification code to obtain the identified data;

[0111] Store the identified data in a database.

[0112] Optionally, the analysis module includes:

[0113] A preprocessing unit for preprocessing the test data to obtain preprocessed data. The preprocessing includes data verification and / or format conversion;

[0114] A data analysis unit for performing data analysis on the preprocessed data to obtain analyzed data. The data form of the analyzed data includes at least one of a bar chart, a line chart, a pie chart, and a normal distribution chart.

[0115] Optionally, the preprocessing unit includes:

[0116] A verification subunit for performing format verification on the test data to obtain the format verification result of the test data;

[0117] A format conversion subunit for performing format conversion on the test data to obtain preprocessed data if the format verification result indicates that the test data meets the preset format conditions;

[0118] An exception subunit for generating first exception data information corresponding to the test data if the format verification result indicates that the test data does not meet the preset format conditions. The first exception data information is used to prompt the user to check the test data.

[0119] Optionally, the test data includes the current data file of a semiconductor chip undergoing product testing on a test device. The verification subunit is specifically used for at least one of the following:

[0120] Verify whether the file name of the current data file conforms to the set specification;

[0121] Verify whether the file format of the header file in the current data file is the set format;

[0122] Verify whether the file sizes of the current data file and the historical data file are the same, where the current data file and the historical data file are the original data files of the same type of semiconductor chip undergoing product testing on the same test device at different time points.

[0123] Optionally, a processing device for test data provided in this embodiment further includes:

[0124] A data evaluation module for performing data evaluation on at least part of the analyzed data based on preset standard data to obtain the data evaluation result of at least part of the analyzed data after performing data analysis on the test data to obtain the analyzed data;

[0125] An exception module, which is configured to generate second exception data information corresponding to at least part of the analyzed data if the data evaluation result indicates that at least part of the analyzed data is greater than the preset standard data, and the second exception data information is used to prompt the user to check the test equipment corresponding to at least part of the analyzed data.

[0126] Optionally, the test data includes at least wafer data and performance data, where the wafer data is map data obtained by testing a wafer corresponding to a semiconductor chip on a probe station, and the performance data is data obtained by performing performance testing on the semiconductor chip on a tester.

[0127] It should be noted that for the information interaction, execution process, etc. between the above-mentioned devices / units, since they are based on the same concept as the method embodiments of the present application, their specific functions and the technical effects brought about can be specifically referred to in the method embodiment part, and will not be elaborated here.

[0128] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the above-mentioned division of each functional unit and module is used as an example. In actual applications, the above-mentioned functions can be allocated to different functional units and modules according to needs, that is, the internal structure of the device is divided into different functional units or modules to complete all or part of the functions described above. Each functional unit and module in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit. In addition, the specific names of each functional unit and module are only for the convenience of mutual distinction and do not limit the protection scope of the present application. The specific working process of the units and modules in the above system can refer to the corresponding process in the foregoing method embodiments and will not be elaborated here.

[0129] An embodiment of the present application further provides a terminal device. Figure 6 It is a schematic structural diagram of a terminal device provided by an embodiment of the present application. As Figure 6 shown, the terminal device includes: at least one processor 401, a memory 402, an input device 403, an output device 404, and a computer program stored in the memory 402 and executable on at least one processor 401. When the processor 401 executes the computer program, the steps in any of the foregoing method embodiments are implemented.

[0130] The input device 403 can be used to receive input digital or character information, and generate key signal inputs related to the user settings and function controls of the terminal device. The output device 404 may include a display device such as a display screen.

[0131] The embodiments of the present application also provide a computer-readable storage medium. The computer-readable storage medium stores a computer program, and when the computer program is executed by the processor 401, the steps in the above method embodiments can be implemented.

[0132] The embodiments of the present application provide a computer program product. When the computer program product runs on a terminal device, the terminal device can implement the steps in the above method embodiments when executed.

[0133] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, to implement all or part of the processes in the above method embodiments of the present application, a computer program can be used to instruct the relevant hardware to complete. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by the processor 401, the steps in the above method embodiments can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in the form of source code, object code, executable file or some intermediate form, etc. The computer-readable storage medium can at least include: any entity or device that can carry the computer program code to the device / terminal device, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electrical carrier signal, telecommunication signal, and software distribution medium. For example, a USB flash drive, a mobile hard disk, a magnetic disk or an optical disc, etc. In some jurisdictions, according to legislation and patent practice, the computer-readable storage medium cannot be an electrical carrier signal and a telecommunication signal.

[0134] In the above embodiments, the descriptions of the various embodiments have their own emphases. For the parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0135] Those of ordinary skill in the art can realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are executed in a hardware or software manner depends on the specific application and design constraints of the technical solution. Professionals can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the present application.

[0136] In the embodiments provided in the present application, it should be understood that the disclosed device / terminal device and method can be implemented in other ways. For example, the device / terminal device embodiments described above are merely illustrative. For example, the division of modules or units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection between each other can be through some interfaces. The indirect coupling or communication connection of devices or units can be in electrical, mechanical or other forms.

[0137] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0138] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for processing test data, characterized in that, Including: Obtaining test data of a semiconductor chip during product testing; Performing data analysis on the test data to obtain analyzed data, where the data analysis includes at least one of duplicate check analysis of unique identification codes, distribution analysis of dynamic test items, and yield difference calculation; Performing classification and identification on the analyzed data to obtain identified data, and the identified data is used for a user to view the test situation of the semiconductor chip.

2. The method for processing test data according to claim 1, wherein The performing classification and identification on the analyzed data to obtain identified data includes: Generating a unique classification code corresponding to the analyzed data; Identifying the analyzed data based on the unique classification code to obtain identified data; Storing the identified data in a database.

3. The method for processing test data according to claim 1, wherein The performing data analysis on the test data to obtain analyzed data includes: Performing preprocessing on the test data to obtain preprocessed data, where the preprocessing includes data verification and / or format conversion; Performing data analysis on the preprocessed data to obtain analyzed data, and the data form of the analyzed data includes at least one of bar charts, line charts, pie charts, and normal distribution charts.

4. The method for processing test data according to claim 3, wherein, The performing preprocessing on the test data to obtain preprocessed data includes: Performing format verification on the test data to obtain the format verification result of the test data; If the format verification result indicates that the test data meets the preset format conditions, performing format conversion on the test data to obtain the preprocessed data; If the format verification result indicates that the test data does not meet the preset format conditions, generating first abnormal data information corresponding to the test data, and the first abnormal data information is used to prompt the user to check the test data.

5. The method for processing test data according to claim 4, wherein The test data includes the current data file of the semiconductor chip during product testing by a test device, and the performing format verification on the test data to obtain the format verification result of the test data includes at least one of the following: Verifying whether the file name of the current data file conforms to the set specification; Verifying whether the file format of the header file in the current data file is the set format; Verifying whether the file size of the current data file is the same as that of the historical data file, where the current data file and the historical data file are data files of the same type of semiconductor chip during product testing on the same test device at different time points.

6. The method for processing test data according to claim 1, wherein After the performing data analysis on the test data to obtain analyzed data, the method further includes: Performing data evaluation on at least part of the analyzed data based on preset standard data to obtain data evaluation results of at least part of the analyzed data; If the data evaluation results indicate that at least part of the analyzed data is greater than the preset standard data, generating second abnormal data information corresponding to at least part of the analyzed data, and the second abnormal data information is used to prompt the user to check the test device corresponding to at least part of the analyzed data.

7. The method for processing test data according to any one of claims 1-6, characterized in that, The test data at least includes wafer data and performance data, wherein the wafer data is the map data of the wafer corresponding to the semiconductor chip tested on a probe station, and the performance data is the data of the performance test of the semiconductor chip on a tester.

8. A processing device for test data, characterized in that, including: an acquisition module, configured to acquire test data during the product test of the semiconductor chip; an analysis module, configured to perform data analysis on the test data to obtain analyzed data, wherein the data analysis includes at least one of unique identifier duplicate check analysis, dynamic test item distribution analysis, and yield difference calculation; a classification and identification module, configured to perform classification and identification on the analyzed data to obtain identified data, and the identified data is used for a user to view the test situation of the semiconductor chip.

9. A terminal device, comprising a processor, a memory, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, the terminal device implements the method according to any one of claims 1-7.

10. A computer program product, characterized in that, When the computer program product runs on a terminal device, the terminal device executes the method according to any one of claims 1-7.

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