A loading and unloading device for semiconductor static testing

Abstract

The present invention relates to the field of semiconductor wafer transportation technology, and in particular to a loading and unloading device for semiconductor static testing. It comprises a frame, the frame is provided with symmetrically distributed power modules, the symmetrically distributed power modules are jointly provided with symmetrically distributed conveyor belts, and array-distributed air suction members are fixed between the symmetrically distributed conveyor belts, the air suction members are made of soft and stretchable material, the frame is fixed with symmetrically distributed diversion shells, the diversion shells are fixed with air pumps, the diversion shells are slidably connected with sealing belts, the air intake of the air pump is connected to the diversion cavity through a pipeline, and the air suction members are fixed and connected with a fixed shell. The present invention provides two-phase fixation for the wafer through the air suction member and the air pump during the process of the vacuum suction cup automatically grabbing the wafer, preventing the hard fixation from possibly damaging the wafer while preventing external factors such as mechanical vibration from causing relative displacement between the wafer and the conveyor belt, thereby ensuring the wafer loading efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer transportation, and in particular to a loading and unloading device for semiconductor static testing. Background Art

[0002] Semiconductor wafer static testing technology is a very important part of the semiconductor manufacturing process. It is mainly used to detect the electrical performance, structural integrity and other key characteristics of the wafer during the manufacturing process. Static testing is usually performed after the wafer completes the manufacturing process and before it is packaged. The purpose is to detect potential defects or unqualified chips as early as possible, thereby reducing waste and cost losses in subsequent processes.

[0003] In the wafer processing flow, wafer positioning and transportation must be completed by an automated transmission system before testing. The current standard process uses a conveyor belt continuous transport combined with a vacuum suction cup gripping operation mode: first, the conveyor belt transports the wafers one by one to the test station, and then the vacuum suction cup mechanism implements precise gripping and transfers them to the test platform. It is worth noting that there are key process risks in this link - when the conveying system encounters mechanical vibration or instantaneous impact, the static friction coefficient between the wafer and the conveyor belt is insufficient, resulting in relative displacement between the wafer and the conveyor belt, which causes position deviation during subsequent absorption. In severe cases, it may even cause the wafer to collide with the outer casing of the conveyor device, resulting in damage to the wafer, which in turn triggers abnormal shutdown events such as equipment alarms and gripping failures, thereby affecting wafer loading efficiency. Summary of the Invention

[0004] In order to overcome the above-mentioned shortcomings, the technical problem of the present invention is to provide a loading and unloading device for semiconductor static testing.

[0005] Technical solution: A loading and unloading equipment for static testing of semiconductors, comprising a frame, on which symmetrically distributed power modules are arranged, and the symmetrically distributed power modules are jointly provided with symmetrically distributed conveyor belts, and array-distributed air suction members are fixedly connected between the symmetrically distributed conveyor belts, and the part of the air suction member away from the diversion shell is made of soft and stretchable material, and a symmetrically distributed diversion shell is fixedly connected in the frame, and the diversion shell is fixedly connected to an air pump through a mounting frame, and the diversion shell is slidably connected to a sealing belt, and the diversion shell and the sealing belt together constitute a diversion cavity, and the air intake of the air pump is connected to the diversion cavity through a pipeline, and the air suction member is fixedly connected and connected to a fixed shell, and the fixed shell is connected to a symmetrically distributed drainage pipe, and the drainage pipe is fixed to the adjacent sealing belt, and the fixed shell is connected to the diversion cavity through the drainage pipe.

[0006] In addition, it is particularly preferred that it also includes symmetrically distributed sliding frames, which are all slidably connected to the fixed shell, and the sliding frames are fixed with sealing plugs, which are used to seal the drainage tube, and the fixed shell is provided with symmetrically distributed damping mechanisms for providing damping for the sliding frames according to the state inside the fixed shell.

[0007] In addition, it is particularly preferred that the drainage tube consists of a truncated cone-shaped pipe and a cylindrical pipe, and the diameter of the sealing plug is larger than the inner diameter of the cylindrical pipe of the drainage tube.

[0008] In addition, it is particularly preferred that the maximum cross-sectional area of ​​the frustum-shaped pipe on the drainage pipe is equal to twice the cross-sectional area of ​​the cylindrical pipe on the drainage pipe.

[0009] In addition, it is particularly preferred that the diverter housing is fixedly connected to a first fixing frame, the first fixing frame is fixedly connected to symmetrically distributed first extrusion frames, and the first extrusion frames are used to extrude the sliding frame.

[0010] In addition, it is particularly preferred that the damping mechanism includes a damping shell, which is fixed to the fixed shell through a mounting frame, and the damping shell is slidably connected to a symmetrically distributed damping frame, a tension spring is provided between the damping frame and the damping shell, the sliding frame is fixed with a piston, and the piston is slidably connected to the adjacent damping shell, and a limit assembly for limiting the position of the damping frame is provided on the fixed shell.

[0011] In addition, it is particularly preferred that the limiting assembly includes a symmetrically distributed second fixing frame, the symmetrically distributed second fixing frames are all fixed in the fixed shell, the second fixing frames are slidably connected to the limiting frame, the damping frame is fixed with a fixing rod, and the limiting frame is used to limit the position of the fixing rod.

[0012] In addition, it is particularly preferred that the limiting assembly further includes symmetrically distributed monitoring rods, the monitoring rods are fixed to the adjacent limiting frames, and the monitoring rods are slidably connected to the fixed shell.

[0013] In addition, it is particularly preferred that evenly distributed second extrusion frames are slidably connected to the sliding frame, a spring is provided between the second extrusion frame and the sliding frame, and the second extrusion frame is used to extrude the damping frame.

[0014] In addition, it is particularly preferred that the first fixing frame is fixedly connected with symmetrically distributed spacer frames, and the spacer frames are used to press the sliding frame.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention provides two-phase fixation (sunken wrapping fixation, negative pressure suction fixation) for the wafer through the suction piece and the air pump during the process of the vacuum suction cup automatically grasping the wafer, preventing the rigid fixation from damaging the wafer while preventing external factors such as mechanical vibration from causing relative displacement between the wafer and the conveyor belt, thereby ensuring the wafer loading efficiency; the negative pressure state in the fixed shell (whether there is a wafer) is judged by the monitoring rod, and the symmetrically distributed damping frame is controlled according to the result to change the reset damping of the sealing plug, so that the suction piece currently transporting the wafer and the suction piece not transporting the wafer can flexibly distribute the pressure provided by the air pump, thereby reducing energy consumption while ensuring the stable fixation of the wafer by the suction piece. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0017] Figure 2 Schematic diagram of the three-dimensional structure of the diverter housing and the air pump of the present invention;

[0018] Figure 3 It is a schematic diagram of the three-dimensional structure of the diverter housing and the first fixing frame of the present invention;

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of the diverter housing, the air pump and the first fixing bracket of the present invention;

[0020] Figure 5 Schematic diagram of the three-dimensional structure of the diverter shell and the sealing belt of the present invention;

[0021] Figure 6 It is a schematic diagram of the three-dimensional structure of the first fixing frame and the first extrusion frame of the present invention;

[0022] Figure 7 A sectional view of the three-dimensional structure of the air suction member and the fixed shell of the present invention;

[0023] Figure 8 It is a three-dimensional structural cross-sectional view of the sealing belt and the drainage tube of the present invention;

[0024] Figure 9 Schematic diagram of the three-dimensional structure of the first fixing frame and the partition frame of the present invention;

[0025] Figure 10 It is a schematic diagram of the three-dimensional structure of the sliding frame and the piston of the present invention;

[0026] Figure 11 It is a schematic diagram of the three-dimensional structure of the limiting frame and the fixing rod of the present invention.

[0027] In the figure: 1. frame, 2. power module, 3. conveyor belt, 4. suction part, 5. diverter shell, 6. air pump, 7. sealing belt, 8. fixed shell, 9. drainage tube, 10. sliding frame, 11. sealing plug, 12. first fixed frame, 13. first extrusion frame, 14. damping shell, 15. damping frame, 16. piston, 17. second fixed frame, 18. limit frame, 19. fixed rod, 20. monitoring rod, 21. second extrusion frame, 22. partition frame. DETAILED DESCRIPTION

[0028] To make the objectives, technical solutions, and advantages of the present invention more clearly understood, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present invention.

[0029] Example 1

[0030] This embodiment discloses a loading and unloading device for semiconductor static testing, which is used to transport semiconductor wafers (hereinafter referred to as wafers) to a testing position.

[0031] The specific structure and connection relationship of the loading and unloading equipment are as follows:

[0032] like Figures 1-8As shown, it includes a frame 1, a control panel is provided on the front side of the frame 1, and the control panel is electrically connected to all the electronic control components in the device, a symmetrically distributed power module 2 is provided on the frame 1, and the symmetrically distributed power module 2 is jointly provided with two conveyor belts 3 symmetrically distributed in front and back, and the two conveyor belts 3 both rotate clockwise, and the power module 2 is composed of a transmission shaft and a transmission wheel, etc., for supporting the conveyor belt 3 and providing power for it, and an array of suction members 4 is fixed between the two conveyor belts 3, and the suction member 4 is provided with two rectangular through holes. There is no requirement for the number of suction pieces 4 for normal operation of the device. The number of suction pieces 4 can be adjusted according to actual needs. The number of suction pieces 4 in the figure is only for reference. Adjacent suction pieces 4 are connected by soft connectors to prevent the wafer from falling between two adjacent suction pieces 4 due to vibrations, etc. The inner side of the rack 1 is fixed with two symmetrically distributed diverter shells 5 through a steel structure frame and bolts. The part of the suction piece 4 away from the diverter shell 5 is made of soft and stretchable material, which is used to wrap the wafer, and the fixed part of the conveyor belt 3 and the suction piece 4 is made of hard material. The shape of the diverter shell 5 is The overall shape is similar to that of the conveyor belt 3, both of which are waist-shaped. The diverter shell 5 is fixedly connected to the air pump 6 through a mounting bracket. The air pump 6 has an overpressure protection module, that is, when the pressure provided by the air pump 6 is difficult to meet the demand, the air pump 6 automatically stops to protect the body. The diverter shell 5 is slidably connected to the sealing belt 7. The diverter shell 5 and the sealing belt 7 are dynamically sealed. The sealing belt 7 is a deformable material. The diverter shell 5 and the sealing belt 7 together form a diverter cavity. The air intake of the air pump 6 is connected to the diverter cavity through a pipeline. The air suction member 4 is fixed to one side of the diverter shell 5 and is connected to a fixed Shell 8, the suction member 4 and the fixed shell 8 together constitute a single chamber, the fixed shell 8 is connected with two drainage pipes 9 symmetrically distributed front and back, the drainage pipe 9 is fixedly connected to the adjacent sealing belt 7, the conveyor belt 3 drives the sealing belt 7 to move through the suction member 4, the fixed shell 8 and the drainage pipe 9, the fixed shell 8 is connected with the diversion cavity through the drainage pipe 9, the air pump 6, the diversion cavity, the drainage pipe 9 and the fixed shell 8 together constitute a gas flow path, when the rectangular through hole on the suction member 4 is not blocked, the suction provided by the air pump 6 will not cause negative pressure to be formed in the chamber composed of the suction member 4 and the fixed shell 8.

[0033] The working process of the loading and unloading equipment in this embodiment is as follows:

[0034] Delivery preparation:

[0035] When the wafer needs to be transported, the user controls the two power modules 2 to drive the two conveyor belts 3 to rotate, and at the same time the user starts the air pump 6. The air suction port of the air pump 6 extracts the gas in the cavity composed of the suction part 4 and the fixed shell 8 through the diversion cavity composed of the pipeline, the diversion shell 5 and the sealing belt 7 and the drainage pipe 9. At this time, the preparation work is completed.

[0036] Conveying process:

[0037] The user places the wafers one by one (or the user uses the existing device to place the wafers one by one) on the suction member 4. As the wafers block the rectangular through holes on the suction member 4, the air inlet area of ​​the suction member 4 (the air inlet area refers to the sum of the areas of the two rectangular through holes on the suction member 4) decreases. The suction member 4 and the fixed shell 8 together form a negative pressure in the cavity, and adsorb the wafer on the upper surface of the suction member 4. The suction force provided by the air pump 6 is sufficient to pull the wafer and deform the soft and stretchable material on the suction member 4, causing the wafer to sink, so that the suction member 4 completes the double fixation of the wafer (sinking and wrapping fixation, negative pressure attraction fixation), thereby preventing external factors such as mechanical vibration from causing relative displacement of the wafer and the conveyor belt, preventing the wafer from being damaged by hard collision, and ensuring the wafer loading efficiency.

[0038] Example 2

[0039] In the above-mentioned embodiment 1, all the suction parts 4 perform suction work. If the wafer supply device fails (or when a small number of wafers of different models are used for sampling tests), or the wafer supply amount to the wafer supply device fluctuates, the wafer supply frequency will be unstable. That is, when transporting to a research and development test line or a multi-variety small batch production line, such frequency fluctuations will have a dynamic impact on the negative pressure adsorption environment during transportation, thereby affecting the stable transportation of the wafers.

[0040] This embodiment discloses a loading and unloading device for semiconductor static testing, which is further improved on the basis of the first embodiment.

[0041] The structure, connection relationship and working process of the loading and unloading equipment in Example 1 are not described in detail, and the working principle of the following structure is mainly explained.

[0042] like Figure 6-Figure 8As shown, it also includes two sliding frames 10 symmetrically distributed front and back, and the two sliding frames 10 are both slidably connected to the fixed shell 8. The sliding frame 10 is composed of a T-shaped rod and two L-shaped rods. The T-shaped rod portion of the sliding frame 10 is fixedly connected with a sealing plug 11, which is used to seal the drainage tube 9. As the sealing plug 11 gradually moves upward, the distance between the sealing plug 11 and the inner wall of the drainage tube 9 gradually increases (that is, the flow area of ​​the drainage tube 9 gradually increases). A damping mechanism is symmetrically distributed in the fixed shell 8 and is used to provide damping for the sliding frame 10 according to the state in the fixed shell 8. The drainage tube 9 is composed of a truncated cone-shaped pipe and a cylindrical pipe, and the diameter of the sealing plug 11 is larger than the inner diameter of the cylindrical pipe of the drainage tube 9. The minimum radius of the truncated cone-shaped pipe is equal to the radius of the cylindrical pipe, and the maximum cross-sectional area of ​​the truncated cone-shaped pipe on the drainage tube 9 is equal to the cross-sectional area of ​​the cylindrical pipe on the drainage tube 9. Twice the cross-sectional area of ​​the channel, that is, when the sealing plug 11 is at the uppermost side, the annular flow area between the sealing plug 11 and the drainage pipe 9 is equal to the flow area of ​​the cylindrical pipe of the drainage pipe 9, so as to reduce the air flow resistance. The sealing plug 11 is initially located at the connection between the truncated cone tube and the cylindrical tube of the drainage pipe 9, and seals the drainage pipe 9. The diverter shell 5 is fixed with a first fixed frame 12, which is a steel structure frame, and a lubricating medium is coated between the first fixed frame 12 and the sliding frame 10. The first fixed frame 12 is fixed with a symmetrically distributed first extrusion frame 13, which is located near the right side of the wafer loading position (the upper left side of the first fixed frame 12). The maximum vertical distance between the first extrusion frame 13 and the first fixed frame 12 is equal to the distance between the sealing plug 11 and the maximum diameter of the truncated cone pipe of the drainage pipe 9. The first extrusion frame 13 is used to extrude the sliding frame 10.

[0043] like Figure 7-11 As shown, the damping mechanism includes a damping shell 14, which is fixed to the fixed shell 8 through a mounting frame. The upper side of the damping shell 14 is slidably connected with two damping frames 15 symmetrically distributed front and back. The damping frame 15 is composed of a T-shaped rod and a semicircular plate, and its semicircular plate part is provided with a circular hole. The two damping frames 15 of the same damping shell 14 are a group, and the upper semicircular plate parts of the two damping frames 15 of the same damping shell 14 are pieced together to form a whole circular plate, and the upper part of the damping shell 14 is blocked. A tension spring is provided between the damping frame 15 and the damping shell 14, and the tension spring between the two is initially in a stretched state. The sliding frame 10 is fixed with a piston 16, which is initially located at the lower side of the damping shell 14. The piston 16 is slidably connected to the adjacent damping shell 14, and the two are dynamically sealed. A limiting component for limiting the position of the damping frame 15 is provided on the fixed shell 8.

[0044] like Figure 7-11As shown, the limit assembly includes a symmetrically distributed second fixing frame 17, which is fixed in the fixed shell 8. The second fixing frame 17 is slidably connected to the limit frame 18. The limit frame 18 is composed of a rectangular plate and a hook-shaped rod, and the opposite sides of the hook-shaped rod parts of the two limit frames 18 are provided with an inclined surface gradually moving away from the top to the bottom. The damping frame 15 is fixed with a fixing rod 19. The limit frame 18 is used to limit the position of the fixing rod 19. The fixing rod 19 squeezes the inclined surface of the hook-shaped rod part on the limit frame 18. The limit frame 18 is squeezed and moved upward to reset. The limit assembly also includes symmetrically distributed monitoring rods 20. The lower side of the monitoring rod 20 is in contact with the external air pressure environment. When the air pressure in the fixed shell 8 decreases, the external air pressure squeezes the monitoring rod 20 to move upward and drives the limit frame 18 to move upward, thereby releasing the limit of the limit frame 18 on the fixed rod 19. The monitoring rod 20 is fixed to the lower side of the rectangular plate portion of the adjacent limit frame 18. The monitoring rod 20 is slidably connected to the fixed shell 8. There is a dynamic seal between the two. The sliding connection on the sliding frame 10 There are four evenly distributed second extrusion frames 21, and a spring is arranged between the second extrusion frames 21 and the sliding frame 10. The four second extrusion frames 21 are divided into two parts symmetrical on the left and right, and each part is composed of two second extrusion frames symmetrical on the front and back. The second extrusion frames 21 are used to squeeze the damping frame 15. The first fixed frame 12 is fixed with a symmetrically distributed partition frame 22. The partition frame 22 is located near the left side of the wafer unloading position (the upper right part of the first fixed frame 12). The side of the partition frame 22 close to the first extrusion frame 13 is lower than the highest point of the first extrusion frame 13, and the height of the highest points of the two is the same. The right side of the partition frame 22 gradually tilts downward, which is used to control the sealing plug 11 to gradually block the drainage pipe 9, thereby preventing the sealing plug 11 from quickly blocking the drainage pipe 9 and causing the wafer to bounce up due to the reaction force of the soft part on the suction part 4. The partition frame 22 is used to squeeze the sliding frame 10. There is a gap between the rightmost end of the partition frame 22 and the first fixed frame 12 for the sliding frame 10 that is not on the partition frame 22 to pass through.

[0045] The working process of the loading and unloading equipment in this embodiment is as follows:

[0046] The sealing plug 11 is attracted by the air flow of the air pump 6 and moves downwards, so that the L-shaped rod bending part of the sliding frame 10 falls to the lower side of the partition frame 22, and the sealing plug 11 resumes the blocking of the drainage pipe 9, thereby preventing the pressure provided by the air pump 6 from being wasted and saving energy.

[0047] If a wafer is placed on the suction part 4 when the air pump 6 extracts the gas in the fixed shell 8 through the diverter shell 5, negative pressure will gradually be generated in the fixed shell 8, and the external air pressure will squeeze the monitoring rod 20 to move upward, and the monitoring rod 20 will drive the limit frame 18 to move upward, thereby losing the limit on the fixed rod 19. The tension spring between the damping shell 14 and the damping frame 15 will drive the two damping frames 15 to move in opposite directions. The semicircular plate parts of the two damping frames 15 are spliced ​​into a full circular plate, and the upper and lower side spaces of the two damping frames 15 can only be connected through the two through holes of the full circular plate part, until the sliding frame 10 passes over the first squeezing frame 13, the sliding frame 10 loses support, and the sealing plug 11 is affected by the air from the air pump 6 However, the two damping frames 15 are spliced ​​into a whole circular plate, and the piston 16 moves downward synchronously with the sliding frame 10 (that is, the piston 16 draws the gas on the upper side of the damping frame 15 to between the two through the two through holes in the whole circular plate). The resistance of the air passing through the through holes slows down the downward movement of the sealing plug 11 and the sliding frame 10. As the sliding frame 10 continues to move to the right, the sliding frame 10 falls onto the partition frame 22. As the sliding frame 10 continues to move to the right, the partition frame 22 squeezes the sliding frame 10 to drive the sealing plug 11 to move up and reset, and maintains the attraction of the air pump 6 to the wafer, thereby ensuring the stability of the wafer during the entire transportation process.

[0048] When the sliding frame 10 moves to the right to the inclined part on the right side of the partition frame 22, the sliding frame 10 gradually moves downward as it moves to the right, and the sealing plug 11 and the sliding frame 10 move downward synchronously, and the flow area of ​​the drainage tube 9 is gradually reduced, thereby gradually releasing the fixation of the wafer. In this process, the second extrusion frame 21 moves downward synchronously and is squeezed with the T-shaped rod part of the damping frame 15. The left and right parts of the second extrusion frame 21 are squeezed and move backwards and squeeze the spring between the second extrusion frame 21 and the sliding frame 10 until the second extrusion frame 21 passes over the damping frame 15 downward. The spring between the second extrusion frame 21 and the sliding frame 10 drives the second extrusion frame 21 to reset, and then the wafer is taken away by a robot and a vacuum suction cup.

[0049] When the two assembled damping frames 15 rotate a full circle and move to the left side of the first extrusion frame 13 again, the sliding frame 10 is squeezed by the first extrusion frame 13 to drive the sealing plug 11 and the piston 16 to move upward. During the process, the sliding frame 10 drives the second extrusion frame 21 to move upward, and the second extrusion frame 21 squeezes and drives the damping frame 15 to move away from the damping shell 14. At the same time, the tension spring between the damping frame 15 and the damping shell 14 is stretched, and the damping frame 15 drives the fixing rod 19 to move and reset. The fixing rod 19 squeezes the inclined surface of the limit frame 18 and resets, so that the limit frame 18 is reset. The fixed rod 19 is limited, and the damping frame 15 is reset until the second extrusion frame 21 stops moving up with the sliding frame 10. At this time, the second extrusion frame 21 is located above the damping frame 15. The negative pressure state in the fixed shell 8 (whether there are wafers) is judged by the monitoring rod 20, and the symmetrically distributed damping frames 15 are controlled according to the result to change the reset damping of the sealing plug, so that the pressure provided to the air pump 6 by the suction part 4 currently transporting the wafer and the suction part 4 not transporting the wafer can be flexibly distributed, thereby reducing energy consumption while ensuring the stable fixation of the wafer by the suction part 4.

[0050] The above description is merely an example of the present invention and is not intended to limit the present invention. Any equivalent substitutions made within the principles of the present invention are intended to be included within the scope of protection of the present invention. Any content not elaborated in detail herein is already known to those skilled in the art.

Claims

1. A loading and unloading device for semiconductor static testing, characterized in that: The invention comprises a frame (1), wherein the frame (1) is provided with symmetrically distributed power modules (2), the symmetrically distributed power modules (2) are jointly provided with symmetrically distributed conveyor belts (3), the symmetrically distributed conveyor belts (3) are fixedly connected with array-distributed air suction members (4), the frame (1) is fixedly provided with symmetrically distributed diversion shells (5), the portion of the air suction members (4) away from the diversion shells (5) is made of a soft and easily stretchable material, and the diversion shells (5) are fixedly provided with a mounting frame. An air pump (6), wherein the diversion shell (5) is slidably connected to a sealing belt (7), the diversion shell (5) and the sealing belt (7) together form a diversion cavity, the air intake of the air pump (6) is connected to the diversion cavity through a pipeline, the air suction member (4) is fixedly connected to and connected to a fixed shell (8), the fixed shell (8) is connected to symmetrically distributed drainage pipes (9), the drainage pipes (9) are fixedly connected to the adjacent sealing belt (7), and the fixed shell (8) is connected to the diversion cavity through the drainage pipes (9); The invention also includes symmetrically distributed sliding frames (10), which are all slidably connected to the fixed shell (8). The sliding frames (10) are fixed with a sealing plug (11), which is used to seal the drainage tube (9). The fixed shell (8) is provided with a symmetrically distributed damping mechanism for providing damping for the sliding frames (10) according to the state inside the fixed shell (8).

2. The semiconductor static test loading and unloading equipment according to claim 1, characterized in that: The drainage tube (9) is composed of a truncated cone-shaped pipe and a cylindrical pipe, and the diameter of the sealing plug (11) is larger than the inner diameter of the cylindrical pipe of the drainage tube (9).

3. The semiconductor static test loading and unloading equipment according to claim 2, characterized in that: The maximum cross-sectional area of ​​the truncated cone-shaped pipe on the drainage pipe (9) is equal to twice the cross-sectional area of ​​the cylindrical pipe on the drainage pipe (9).

4. The semiconductor static test loading and unloading equipment according to claim 3, characterized in that: The diversion housing (5) is fixedly connected to a first fixing frame (12), the first fixing frame (12) is fixedly connected to symmetrically distributed first extrusion frames (13), and the first extrusion frames (13) are used to extrude the sliding frame (10).

5. The semiconductor static test loading and unloading equipment according to claim 4, characterized in that: The damping mechanism includes a damping shell (14), the damping shell (14) is fixedly connected to the fixed shell (8) through a mounting frame, the damping shell (14) is slidably connected to symmetrically distributed damping frames (15), a tension spring is provided between the damping frame (15) and the damping shell (14), the sliding frame (10) is fixedly connected to a piston (16), the piston (16) is slidably connected to the adjacent damping shell (14), and a limiting component for limiting the position of the damping frame (15) is provided on the fixed shell (8).

6. The semiconductor static test loading and unloading equipment according to claim 5, characterized in that: The limiting assembly includes symmetrically distributed second fixing frames (17), the symmetrically distributed second fixing frames (17) are all fixedly connected to the fixed shell (8), the second fixing frames (17) are slidably connected to the limiting frame (18), the damping frame (15) is fixedly connected to a fixing rod (19), and the limiting frame (18) is used to limit the position of the fixing rod (19).

7. The semiconductor static test loading and unloading equipment according to claim 6, characterized in that: The limiting assembly further comprises symmetrically distributed monitoring rods (20), wherein the monitoring rods (20) are fixed to the adjacent limiting frames (18), and the monitoring rods (20) are slidably connected to the fixed shell (8).

8. The semiconductor static test loading and unloading equipment according to claim 7, characterized in that: The sliding frame (10) is slidably connected to a uniformly distributed second extrusion frame (21), a spring is provided between the second extrusion frame (21) and the sliding frame (10), and the second extrusion frame (21) is used to extrude the damping frame (15).

9. The semiconductor static test loading and unloading equipment according to claim 8, characterized in that: The first fixed frame (12) is fixedly connected to symmetrically distributed partition frames (22), and the partition frames (22) are used to squeeze the sliding frame (10).

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