Clamping device for monolithic circuit packaging

Abstract

The invention discloses a clamping device for packaging a monolithic circuit. The clamping device comprises an upper cover plate, a base and a lower cover plate, a pin column positioning hole is formed in the upper cover plate, and a positioning pin column is arranged at the top of the base; the upper cover plate is precisely matched with the positioning pins of the base through the pin positioning holes; a plurality of tube shell edge pressing holes are formed in the upper cover plate; a tube shell placing hole is formed in the top of the base; the tube shell placing hole is matched with the tube shell edge pressing hole; and the lower cover plate is in assembly connection with the base through a bottom pin column. The production efficiency of monolithic circuit packaging is improved, and the performance stability of products is ensured.

Description

Technical Field

[0001] The present invention belongs to the technical field of fastening and clamping, and relates to a clamping device for single-chip circuit packaging. Background Art

[0002] As an important part of integrated circuits, the packaging production capacity of single-chip circuits is expanding rapidly in an exponential trend to meet the growing market demand. However, the current production mode of single-chip circuits mainly relies on single-process matrix production. Although this mode realizes production automation to a certain extent, it is only limited to the level of single process and single equipment, and it is difficult to meet the requirements of modern manufacturing for efficient, flexible, and high-quality production.

[0003] In order to cope with the challenges of increasing multi-variety and small-batch production tasks and improve production efficiency and product quality, the full-process matrix production mode has become an inevitable trend in the industry development. The full-process matrix production mode emphasizes the whole-process automation and intelligence from raw material input to finished product output, and requires seamless connection and efficient cooperation between production processes. However, in the packaging production process of single-chip circuits, a series of technical problems are faced in realizing this mode.

[0004] Specifically, when the same batch of circuits are transferred between different processes, operations such as upper and lower molds and placement need to be carried out multiple times. This not only leads to a large amount of repetitive labor, increases labor costs and production cycles, but also easily causes appearance quality problems such as deformation of the shell leads and surface scratches, seriously affecting the product yield and reliability. Therefore, how to effectively solve these repetitive labor problems and ensure the appearance quality of products during the production process has become the key to realizing the full-process matrix production mode.

[0005] At present, flexible clamping devices and flexible processing technologies for digital production lines have been widely used in the field of machining. These technologies achieve precise clamping and efficient processing of workpieces through advanced positioning and fixing methods. However, when these technologies are applied to single-chip circuit packaging and processing, there are many inadaptabilities. On the one hand, the existing positioning and fixing methods cannot meet the strict requirements of single-chip circuits for clamping and positioning accuracy, and it is difficult to ensure the stability and consistency of products during the processing; on the other hand, these technologies do not fully consider the particularity of single-chip circuit packaging and processing, such as being carried out in a high-temperature environment of 300°C, resulting in the inability to achieve surface damage-free processing, thus affecting the overall performance and quality of products. Summary of the Invention

[0006] The purpose of the present invention is to solve the technical problems of low production efficiency and prominent appearance quality in the prior art during single-chip circuit packaging, and to provide a clamping device for single-chip circuit packaging.

[0007] To achieve the above object, the present invention is implemented by the following technical solutions: The present invention discloses a clamping device for a single-chip circuit package, including an upper cover plate, a base, and a lower cover plate; The upper cover plate is provided with pin positioning holes, and the top of the base is provided with positioning pin columns; the upper cover plate forms a precise fit with the positioning pin columns of the base through the pin positioning holes; several shell edge pressing holes are provided on the upper cover plate; The top of the base is provided with a shell placement hole; the shell placement hole is provided in a matching manner with the shell edge pressing holes; The lower cover plate is assembled and connected to the base through bottom pin columns.

[0008] Further, the upper cover plate is provided with through holes for assembly fastening; several rows of the through holes for assembly fastening are provided.

[0009] Further, the top of the base is provided with threaded holes for assembly fastening, which are cooperatively fastened with the through holes for assembly fastening of the upper cover plate.

[0010] Further, each shell edge pressing hole is provided with a window hole for processing and detection in a matching manner.

[0011] Further, grasping grooves are symmetrically arranged on the side surface of the base.

[0012] Further, a convenient loading and unloading groove is provided on the side surface of the base to facilitate the loading and unloading of the cover plate.

[0013] Further, the edge of the shell placement hole is of a chamfered structure Further, the shell placement hole is provided with deep micro-holes, and the deep micro-holes are arranged at the radially extending positions of the shell placement hole.

[0014] Further, the lower cover plate is provided with several ventilation holes.

[0015] Further, positioning grooves are provided at the bottom of the positions of the ventilation holes on the lower cover plate.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The present invention discloses a clamping device for single-chip circuit packaging. Through the precise cooperation between the pin positioning holes on the upper cover plate and the positioning pin columns on the base, precise positioning of the package is achieved, ensuring the position consistency of the single-chip circuit packaging during testing or processing, and effectively avoiding offset errors. The matching design of the package placement holes and the pressing holes further guarantees the fixing stability of the package, reducing vibration or external force interference; adopting a modular layered structure (upper cover plate, base, lower cover plate) simplifies the assembly process. The array design of the pressing holes on the edge of the package supports rapid clamping and disassembly. Combined with the standardized connection method of the bottom pin columns, the operation efficiency in batch production or testing scenarios is significantly improved. The layout of the package placement holes and the pressing holes can be flexibly adjusted according to different package sizes to adapt to the requirements of various specifications of single-chip circuit packaging. The detachable design of the lower cover plate is convenient for maintenance or replacement, and at the same time provides an expansion interface for bottom heat dissipation or electrical signal connection. The layered pressing mechanism (the cooperative action of the pressing holes on the upper cover plate and the placement holes on the base) realizes the uniform distribution of axial pressure, avoiding damage to the package caused by local stress concentration. The rigid connection design between the base and the lower cover plate enhances the anti-deformation ability of the overall device, ensuring the structural reliability during long-term use.

[0017] Furthermore, through the redundant design of multiple rows of assembly fastening through-holes, more fixing points are provided to ensure the rigid connection between the upper cover plate and the base, effectively suppressing connection loosening caused by external loads or high-frequency vibrations, and enhancing the anti-interference ability of the overall device; multiple rows of through-holes allow uniform application of fastening force along the edge of the package, avoiding deformation or damage to the package caused by single-point pressure concentration, especially suitable for the protection requirements of brittle materials or high-precision packaging. The arrangement direction and spacing of multiple rows of through-holes can be flexibly adjusted according to different package sizes, and by selecting the appropriate fastening positions to match diverse package shapes, the adaptation cost is reduced. The combination of the standardized through-hole layout and the modular assembly design simplifies the bolt / screw fastening operation process, and combined with automated equipment, rapid positioning and locking are achieved, shortening the production cycle, especially suitable for batch packaging testing scenarios. Multiple rows of fastening through-holes disperse the risk of stress concentration during the long-term use of the device, reducing the possibility of thread wear or fatigue fracture of the connecting parts, extending the service life of key components, and reducing the maintenance frequency.

[0018] Furthermore, through the window hole for processing inspection that matches the pressing hole at the edge of the package shell, the processing status of the encapsulated package shell (such as the morphology of solder joints, bonding accuracy, etc.) can be directly observed or measured without disassembling the device, supporting real-time adjustment of process parameters, reducing the efficiency loss caused by downtime inspection, and enhancing the process control ability. The inspection window hole avoids the mechanical friction or accidental collision caused by frequent disassembly and inspection of traditional clamping devices, especially provides physical protection for high-value and fragile precision circuit packages, and reduces the yield loss caused by human operation. The collaborative layout of the inspection window hole and the pressing hole (such as the window hole avoiding the stress concentration area of the pressing) ensures that the inspection area and the clamping function do not interfere with each other, taking into account both the clamping stability and the inspection accessibility, and avoiding performance compromise caused by structural conflicts.

[0019] Furthermore, the symmetrically arranged grasping grooves conform to the ergonomic design, facilitating stable grasping by humans or robotic arms. Combined with the anti-slip texture design in the grooves, it avoids accidental detachment caused by slipping during handling or assembly, reducing the risk of damage to the device and the encapsulated package shell. The symmetric groove design enables the external force to be evenly distributed on the base during handling or assembly, avoiding tilting of the device or displacement of the package shell position caused by unilateral force application, and ensuring the absolute stability of the clamping posture during the precision encapsulation process. The inlaid groove structure reduces the redundant volume of the outer contour of the base while ensuring the grasping function, facilitating dense stacking storage or integration into compact devices, and reducing the cost of warehouse and production line space occupation. The grasping grooves can also serve as auxiliary heat dissipation channels to enhance the heat exchange efficiency between the base and the external environment; at the same time, the groove positions avoid the key circuit encapsulation areas to prevent accidental contact with the package shell or connection pins during operation, improving the process reliability.

[0020] Furthermore, through the convenient loading and unloading groove specially provided on the side of the base, operators or mechanical devices can quickly apply force through the groove to pry or separate the upper cover plate, eliminating the cumbersome steps of traditional tool-assisted disassembly, significantly shortening the cover plate loading and unloading time, especially suitable for high-intensity test scenarios with frequent opening and closing. The groove provides a clear force application point and operation boundary, avoiding problems such as scratches and deformation on the surface of the cover plate or the base caused by blind prying, and at the same time reducing the risk of accidental contact of the tool with the internal package shell, ensuring the safety of the precision circuit package.

[0021] Furthermore, the chamfer structure effectively eliminates the acute angles at the edges of the package placement holes, avoiding scratches or cracks caused by edge friction when the package (especially made of brittle ceramics or glass) is inserted or removed. At the same time, the chamfer slope forms a self-guiding effect, assisting the package to be quickly and accurately aligned, and reducing the time-consuming of manual fine-tuning. The chamfer design makes the contact stress between the package and the base evenly distributed along the slope, avoiding local stress concentration that may cause package deformation or base wear; combined with the pressing force of the upper cover plate, the chamfer structure can also optimize the fit between the package and the placement hole, reduce the micro-gap, and enhance the airtightness or electrical contact reliability in the packaging process. The chamfer structure alleviates the hard contact between the base and the package, reduces the wear on the edges of the placement holes during long-term clamping operations, prevents the decrease in hole diameter accuracy caused by burr growth, and extends the overall service life of the device.

[0022] Furthermore, the ventilation holes form an air flow channel that penetrates the lower cover plate, accelerating the heat exchange between the inside and outside of the device, effectively discharging the heat generated by the packaged shell during testing or processing, suppressing the influence of local temperature rise on circuit performance, and is particularly suitable for the heat dissipation requirements of high-power chip packaging scenarios. The ventilation holes can balance the internal and external air pressures of the device, avoid the accumulation of internal pressure caused by vacuum adsorption or high-temperature processes, prevent the positioning offset of the package caused by the deformation of the upper cover plate and the base due to pressure difference, and ensure the repeatability and consistency of the precision packaging process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0024] Figure 1 is a perspective view of the clamping device for single-chip circuit packaging of the present invention; Figure 2 is the structure diagram of the upper cover plate of the clamping device for single-chip circuit packaging of the present invention; Figure 3 is the structure diagram of the base of the clamping device for single-chip circuit packaging of the present invention; Figure 4 is the structure diagram of the lower cover plate of the clamping device for single-chip circuit packaging of the present invention; Figure 5 is; the bottom view of the clamping device for single-chip circuit packaging of the present invention.

[0025] Wherein: 1. Upper cover plate; 1-1. Pin positioning hole; 1-2. Window hole for processing and detection; 1-3. Tube shell edge pressing hole; 1-4. Through hole for assembly and fastening; 2. Base; 2-1. Positioning pin; 2-2. Groove for side grasping; 2-3. Threaded hole for assembly and fastening; 2-4. Tube shell placement hole; 2-5. Deep micro-hole; 2-6. Groove for convenient loading and unloading; 3. Lower cover plate; 3-1. Bottom pin; 3-2. Positioning groove; 3-3. Vent hole. Detailed implementation manners

[0026] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. The components of the embodiments of the present invention described and marked in the accompanying drawings here can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts fall within the scope of protection of the present invention.

[0028] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0029] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper", "lower", "horizontal", "inner", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships in which the product of the invention is usually placed during use, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation of the present invention. In addition, terms such as "first", "second", etc. are only used for descriptive distinction and cannot be construed as indicating or implying relative importance.

[0030] In addition, if the term "horizontal" appears, it does not mean that the component is required to be absolutely horizontal, but it can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but it can be slightly inclined.

[0031] In the description of the embodiments of the present invention, it should also be noted that unless otherwise clearly specified and limited, if the terms "set", "installed", "connected", and "connected" are used, they should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] The present invention will be further described in detail below with reference to the accompanying drawings: See Figures 1 - 5 , the present invention discloses a clamping device for a single-chip circuit package, including an upper cover plate 1, a base 2, and a lower cover plate 3; The bottom of the upper cover plate 1 is provided with a pin column positioning hole 1-1, which forms an interference fit with the positioning pin column 2-1 at the top of the base 2. The upper cover plate 1 is provided with through holes 1-4 for assembly fastening, corresponding to the threaded holes 2-3 for assembly fastening of the base 2, and is locked by bolts. The upper cover plate 1 is also provided with a number of shell edge pressing holes 1-3, and the hole positions are designed to be concentric with the shell placement holes 2-4 of the base 2. A processing and detection window hole 1-2 is provided beside each pressing hole 1-3, which is convenient for processing or observing the side wall of the shell during laser marking or visual inspection.

[0033] The top of the base 2 is provided with a shell placement hole 2-4, and the edge is designed with a chamfer structure to facilitate the quick centering of the shell. A deep micro-hole 2-5 is machined along the radial direction at the bottom of the shell placement hole 2-4. The side of the base 2 is symmetrically provided with grasping grooves 2-2, which is convenient for mechanical arms or manual clamping; at the same time, a convenient disassembly and assembly groove 2-6 is provided on the side, and the groove is arc-shaped, which is convenient for quickly disassembling the upper cover plate 1. The top of the base 2 is provided with threaded holes 2-3 for assembly fastening corresponding to the through holes 1-4 for assembly fastening of the upper cover plate 1 to ensure uniform locking force.

[0034] The lower cover plate 3 is connected to the positioning hole of the base 2 through the bottom pin column 3-1. Its surface is provided with ventilation holes 3-3 for gas circulation during heat dissipation inside the device or vacuum adsorption. A positioning groove 3-2 is provided at the corresponding position at the bottom of the ventilation hole 3-3 for positioning with various devices to prevent the lower cover plate 3 from being misaligned.

[0035] In an embodiment of the present invention, the through holes for assembly fastening, the shell edge pressing holes, the shell placement holes, and the ventilation holes can all be arranged in a matrix.

[0036] In the present invention, the upper cover plate and the base are in clearance-free fit through the pin positioning holes and the positioning pin columns, effectively solving the problem of shell offset caused by clearance in traditional clamping devices; the through holes and threaded holes for assembly fastening are arranged in a matrix and cooperate with bolts for fastening, so that the clamping force acts uniformly on the surface of the shell, avoiding shell deformation or damage caused by local stress concentration. A detection window hole is provided beside each shell edge pressing hole, supporting direct processing and observation of the shell side wall by equipment such as laser marking and vision detection, reducing the turnover time between processes and improving the detection efficiency. The chamfer design at the edge of the shell placement hole on the base guides the shell to quickly align, shortening the single-piece clamping time and significantly improving the efficiency compared with traditional manual alignment. The upper cover plate, the base, and the lower cover plate can be quickly disassembled and assembled through pin columns and bolts, adapting to the shell sizes of different packaging forms (flat, dual in-line, circular), shortening the replacement time and improving the equipment utilization rate. The key functional holes (clamping holes, pressing holes, ventilation holes) are arranged in a matrix, supporting simultaneous clamping of multiple shells (single loading capacity ≥ 1000 pieces), and improving the batch processing consistency by 50%. The ventilation holes on the lower cover plate are connected to the internal air channels of the equipment, and together with the deep micro-holes on the base, they form a heat convection channel, reducing the surface temperature gradient of the tooling during baking and curing by 20%, effectively avoiding shell damage caused by local overheating. The positioning grooves match the vacuum adsorption hole positions of the equipment, reserving a gas flow path, supporting the expansion of the vacuum adsorption process, and being compatible with various packaging equipment without additional modification. The pressing holes and the shell placement holes are concentrically designed to achieve non-destructive clamping, and the shell surface scratch rate is reduced from 1.2% to 0.03%.

[0037] The assembly process of the present invention is as follows: Place the shell to be encapsulated into the shell placement hole of the base 2. The deep micro-hole structure guides the correct placement and positioning of the shell legs, and the chamfer structure effectively prevents damage to the shell surface; Match the upper cover plate 1 with the positioning pin columns of the base 2 through the pin positioning holes for preliminary fixation; Use bolts to pre-tighten through the through holes for assembly fastening and the threaded holes for assembly fastening, so that the edges of the shells are evenly pressed; When handling is required, transfer the overall device through the side gripping grooves; when maintenance is required, quickly separate the upper cover plate 1 using the loading and unloading grooves.

[0038] In an embodiment of the present invention, the upper cover plate is precision milled from 5A06-H112 aluminum alloy, with three rows of M6 threaded holes (hole pitch 50mm × 50mm) arranged on the surface, and the edges of the shells are evenly pressed through stepped pressing blocks. The contact surface of the pressing block is designed with a 0.5mm deep V-shaped groove, which adapts to the sealing edges of dual in-line shells (width 2.5 - 3.5mm) and the flange plates of circular shells (outer diameter φ38mm).

[0039] The base is made of quenched 45 steel, with shell positioning holes distributed in an array pattern at the top (double-row hole pitch of 22.86 mm, circular holes with a diameter of φ30 mm + a chamfer of 1 mm), and radial probe channels (φ2 mm × depth of 12 mm) are machined on the hole walls. Symmetrical side-grabbing grooves (width of 12 mm × depth of 4 mm) and convenient loading and unloading grooves are designed on the sides of the base.

[0040] The lower cover plate adopts a hollow structure design with an opening rate of 40%, hole diameter of φ1.2 mm, a positioning groove integrated at the bottom to match the equipment workbench, and 3 bottom pin posts are set at the top to match the base.

[0041] The surface of the device is selected with a surface insulation oxidation plating method to ensure that the flexible clamping device itself will not affect the appearance of the single-chip circuit.

[0042] The working process of the present invention is as follows: In the matrix production mode of the automated full process of single-chip circuit packaging, the flexible clamping device is used for processing according to the following steps: ① Select a suitable flexible clamping device according to the model and characteristics of the single-chip circuit shell.

[0043] ② Place each single-chip circuit shell in the placement holes on the base of the flexible clamping device, install the upper cover plate and fasten it with quick-action screws.

[0044] ③ The lower cover plate is connected to the general platform of the processing equipment in a matrix pattern, and the base is installed on the lower cover plate to prepare for the processing of the single-chip circuit in each process.

[0045] ④ During the processing of the automatic die bonder (Datacon 2200evo and Palomar 3800), oven (STPH-102M and PHH-101), automatic silicon-aluminum wire bonder (KS Asterion) / automatic gold wire bonder (KS Iconn) / automatic thick wire bonder (KS Asterion), and semi-automatic flat seam machine (AVIO and AF8500), the matrix-type flexible clamping device is processed along with the entire general platform; during the detection process of the non-destructive tensile tester (70PT-E), high-power microscope (BX51M), and low-power microscope (SMZ445), a single set of flexible clamping devices needs to be transferred.

[0046] ⑤ The matrix unitized circulation of the circuit semi-finished products between each process is realized. In the 7 processes of the single-chip circuit packaging process, only the upper and lower clamping is carried out once, and the full-process matrix production mode can be realized. The circuit coplanarity is less than 150 um, the relative deviation in the X and Y directions is less than 150 um, the fastening degree can meet the requirements of the automatic bonding process, using a single set of flexible clamping devices, the loading number of single-chip circuits > 1000, and the production efficiency and the economic benefits of unit production capacity are improved, and the appearance quality problems are greatly reduced.

[0047] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A clamping device for a monolithic circuit package, characterized in that, It includes an upper cover plate (1), a base (2) and a lower cover plate (3); The upper cover plate (1) is provided with pin post positioning holes, and the top of the base (2) is provided with positioning pin posts; the upper cover plate (1) forms a precise fit with the positioning pin posts of the base (2) through the pin post positioning holes; several shell edge pressing holes are provided on the upper cover plate (1); The top of the base (2) is provided with shell placement holes; the shell placement holes are arranged in a matching manner with the shell edge pressing holes; The lower cover plate (3) is assembled and connected to the base (2) through bottom pin posts.

2. The clamping device for the monolithic circuit package according to claim 1, wherein The upper cover plate (1) is provided with through holes for assembly and fastening; several rows of the through holes for assembly and fastening are provided.

3. The clamping device for a monolithic circuit package according to claim 2, characterized in that, The top of the base (2) is provided with threaded holes for assembly and fastening, which are matched and fastened with the through holes for assembly and fastening of the upper cover plate (1).

4. The clamping device for a monolithic circuit package according to claim 1, characterized in that, Each shell edge pressing hole is provided with a window hole for processing and detection in a matching manner.

5. The clamping device for a monolithic circuit package according to claim 1, characterized in that, The side surface of the base (2) is symmetrically provided with grooves for grasping.

6. The clamping device for a single-chip circuit package according to claim 1, characterized in that, The side surface of the base (2) is provided with a convenient loading and unloading groove for facilitating the loading and unloading of the cover plate (1).

7. The clamping device for the monolithic circuit package according to claim 1, characterized in that, The edge of the shell placement hole is a chamfered structure.

8. The clamping device for the monolithic circuit package according to claim 1, characterized in that, The shell placement hole is provided with deep micro-holes, and the deep micro-holes are arranged at the radially extending position of the shell placement hole.

9. The clamping device for a monolithic circuit package according to claim 1, wherein, The lower cover plate (3) is provided with several ventilation holes.

10. The clamping device for the monolithic circuit package according to claim 9, characterized in that, A positioning groove is provided at the bottom of the position of the ventilation holes on the lower cover plate (3).

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