Optical driving base and preparation method

Abstract

The invention discloses an optical driving base and a preparation method, the optical driving base comprises an insulating body, a connecting terminal embedded in the insulating body and an electronic element connected to the connecting terminal, the connecting terminal comprises a main body part and a connecting part, the connecting part comprises a connecting surface, and the connecting surface is provided with a plurality of through holes. The thickness of the connecting part is smaller than that of the main body part, and the connecting part comprises a flat connecting surface; the connecting surface is exposed out of the insulating body and is used for being connected with an electronic element. The optical driving base and the preparation method are used for improving the flatness of the connecting surface in the connecting part and ensuring the connecting effect of the connecting terminal and the electronic element.

Description

Technical Field

[0001] The present invention relates to the technical field of motors, and particularly to an optical drive base and a preparation method thereof. Background Art

[0002] In devices such as mobile phones and tablet computers, a camera module is usually provided to achieve a shooting function. The camera module generally includes a motor and a camera. The motor is connected to the camera and is used to achieve functions such as anti-shake and focusing of the camera. The motor generally includes an optical drive base on which electronic components are installed. An insulating body and a plurality of connection terminals are provided in the optical drive base, and the connection terminals are connected to the electronic components.

[0003] The connection terminals in the optical drive base are usually formed by stamping from a tape. In order to make the plurality of connection terminals relatively independent, at least the connection portions of the connection terminals are stamped and cut to separate the plurality of terminals. Since the thickness of the connection terminals is relatively thin, when stamping and cutting the connection portions of the connection terminals, the relatively large impact force generated by stamping will cause the connection portions of the terminals to warp and deform due to impact stress. At this time, the connection surface for connecting with the electronic components of the connection portion is uneven. As Figure 1 shown, a higher first region 223' is formed on the side of the connection portion 22' of the connection terminal 2' away from the stamping position, while the side of the connection portion 22' adjacent to the stamping position is concave or warped due to impact stress and forms a second region 224'. As Figure 2 shown, when the insulating body 1' is injection-molded, the higher first region 223' in the connection portion 22' is exposed outside the insulating body 1', while the lower second region 224' in the connection portion 22' will be covered by the insulating body 1', so that only a part of the connection portion 22' is exposed outside the insulating body 1'. The reduction of the exposed area will directly lead to a significant reduction in the bonding reliability when the connection portion 22 is welded and fixed to the electronic component. And due to the influence of impact stress, it is difficult to control the exposed areas of the connection portions 22' of the plurality of connection terminals 2'. When the exposed areas of the plurality of connection portions 22' vary greatly, it will further affect the connection effect between the connection terminal 2' and the electronic component.

[0004] The Chinese utility model patent with the patent number CN216625430U provides a voice coil motor base, which makes the welding portion form a convex structure by stamping, or, in the welding foot end, only includes one-time stamping from the plane where the welding foot connection section is located to the first plane direction, and the formed welding portion is torn and cut to control the size of the welding portion area so as to ensure the welding effect of the electronic component. The ways of forming a convex or tearing and cutting by stamping both require additional stamping operations on the welding portions of the terminals, which will exacerbate the degree and risk of the terminals warping and deforming, and there will still be a problem that the exposed areas of the plurality of welding portions are inconsistent, affecting the connection effect between the connection terminals and the electronic components. Summary of the Invention

[0005] The object of the present invention is to provide an optical drive base and a preparation method thereof, which are used to improve the flatness of the connection surface in the connection part and ensure the connection effect between the connection terminal and the electronic component.

[0006] The object of the present invention is achieved by the following technical solutions:

[0007] An optical drive base includes an insulating body, a connection terminal embedded in the insulating body, and an electronic component connected to the connection terminal. The connection terminal includes a main body part and a connection part. The connection part includes a connection surface. The thickness of the connection part is less than the thickness of the main body part and the connection part includes a flat connection surface; the connection surface is exposed from the insulating body to connect with the electronic component.

[0008] Preferably, the connection part is forged along the thickness direction and formed after plastic deformation, and the connection surface is an end surface at one end of the connection part along the thickness direction.

[0009] Preferably, the thickness of the main body part is 0.05 - 0.2 mm, and the thickness of the connection part is 80% - 95% of the thickness of the main body part.

[0010] Preferably, the width of the connection part near one end of the main body part is greater than the width of the main body part near one end of the connection part.

[0011] Preferably, the connection part includes a mating surface opposite to the connection surface along the thickness direction; the main body part includes a first end surface and a second end surface oppositely arranged along the thickness direction;

[0012] The connection surface is flush with the first end surface along the thickness direction, and the mating surface is recessed relative to the second end surface along the thickness direction so as to form a step between the mating surface and the second end surface;

[0013] Or, the mating surface is flush with the second end surface along the thickness direction, and the connection surface is recessed relative to the first end surface along the thickness direction so as to form a step between the connection surface and the first end surface;

[0014] Or, the mating surface is recessed relative to the second end surface along the thickness direction so as to form a step between the mating surface and the second end surface, and the connection surface is recessed relative to the first end surface along the thickness direction so as to form a step between the connection surface and the first end surface.

[0015] Preferably, the insulating body includes an installation cavity for installing an electronic component and a recessed cavity further recessed from the bottom of the installation cavity. The connection surface is flush with the bottom of the recessed cavity and exposed from the recessed cavity.

[0016] Preferably, the insulating body includes a positioning hole that extends from the mating surface through the insulating body in the thickness direction, and the positioning hole is used to accommodate a positioning jig for positioning the connecting portion.

[0017] Preferably, a tearing portion is formed at the connection between the connecting portion and the main body portion. The tearing portion is recessed inwards in the thickness direction from the connection surface so that a blocking groove is formed at the connection between the connecting portion and the main body portion. The blocking groove is filled with the insulating body, and the tearing portion is used to control the area of the connecting portion exposed from the insulating body.

[0018] Preferably, the connecting terminal further includes a mounting portion that protrudes outwards from the insulating body, and a chamfer is formed on the mounting portion.

[0019] A method for manufacturing an optical drive base includes:

[0020] Step S01: Provide a strip of material, form a plurality of connecting terminals on the strip of material, and separate the connecting portions of the plurality of connecting terminals by stamping.

[0021] Step S03: Forge the connecting portion so that the connecting portion plastically deforms and a flat connection surface is formed.

[0022] Step S04: Injection-mold an insulating body and expose the connection surface to the insulating body.

[0023] Step S05: Provide an electronic component and connect the electronic component to the connection surface.

[0024] Preferably, step S03 specifically includes:

[0025] Use the connection surface of the connecting portion as the forging surface for forging, so that the connecting portion plastically deforms and the connection surface is recessed.

[0026] Or, use the mating surface of the connecting portion opposite to the connection surface as the forging surface for forging, so that the connecting portion plastically deforms and the mating surface is recessed.

[0027] Or, simultaneously use the connection surface and the mating surface as the forging surface for forging, so that the connecting portion plastically deforms and the connection surface and the mating surface are respectively recessed.

[0028] Compared with the prior art, the beneficial effects of the present invention at least include:

[0029] By reducing the thickness of the connecting part, such as making the connecting part plastically deformed through forging or the like to form a flat connecting surface, when the insulating body is injection-molded, the connecting surface can be closely attached to the mold, thereby ensuring the area of the connecting surface exposed on the insulating body and ensuring the connection effect between the connecting part and the electronic component. Description of the Drawings

[0030] Figure 1 is a partial structural schematic diagram of a connecting terminal in the prior art;

[0031] Figure 2 is a partial structural schematic diagram of an optical drive base in the prior art;

[0032] Figure 3 is a structural schematic diagram of an optical drive base according to an embodiment of the present invention;

[0033] Figure 4 is a structural schematic diagram of an optical drive base according to an embodiment of the present invention from another perspective;

[0034] Figure 5 is an exploded perspective schematic diagram of an optical drive base according to an embodiment of the present invention;

[0035] Figure 6 is a partial structural schematic diagram of an optical drive base according to an embodiment of the present invention;

[0036] Figure 7 is a partial structural schematic diagram of a connecting terminal according to an embodiment of the present invention;

[0037] Figure 8 is a partial structural schematic diagram of a connecting terminal according to an embodiment of the present invention from another perspective;

[0038] Figure 9 is a partial structural schematic diagram of an optical drive base according to another embodiment of the present invention;

[0039] Figure 10 is a partial structural schematic diagram of a connecting terminal according to another embodiment of the present invention;

[0040] Figure 11 is a partial structural schematic diagram of a connecting terminal according to still another embodiment of the present invention;

[0041] Figure 12 is a partial structural schematic diagram of a connecting terminal according to another embodiment of the present invention;

[0042] Figure 13 is a partial cross-sectional view of an optical drive base according to another embodiment of the present invention;

[0043] Figure 14 is another partial structural schematic diagram of an optical drive base according to an embodiment of the present invention.

[0044] In the figure: 1 and 1' are insulating bodies; 11 is an installation cavity; 115 is a blocking portion; 12 is a recessed cavity; 13 is a positioning hole; 2 and 2' are connection terminals; 21 is a main body portion; 211 is a first end face; 212 is a second end face; 22 and 22' are connection portions; 221 is a connection surface; 222 is a mating surface; 223' is a first region; 224' is a second region; 23 is a tearing portion; 231 is a blocking groove; 24 is an installation portion; 241 is a chamfer; 3 is an electronic component. Specific embodiments

[0045] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. Like reference numerals in the figures denote like or similar structures, and thus their repetitive description will be omitted.

[0046] In the present invention, the words describing the position and direction are illustrated by taking the accompanying drawings as examples, but can be changed according to needs, and all the changes made are included in the protection scope of the present invention.

[0047] As Figures 3 to 14 shown, the present invention provides an optical drive base, which can be applied to the optical drive mechanism of a camera module and is used to drive optical components such as a lens assembly or an aperture assembly. The optical drive base can be a focusing motor base, an anti-shake motor base, an aperture assembly base, a periscope motor base, a voice coil motor base, etc. The optical drive base includes an insulating body 1, a connection terminal 2 embedded in the insulating body 1, and an electronic component 3.

[0048] Referring to Figure 3 、 Figure 5 and Figure 6 , the insulating body 1 can be formed by a one-shot injection molding or a two-shot injection molding method using an insulating material, and the insulating body 1 can be provided with an installation cavity 11 for accommodating the electronic component 3. A part of the connection terminal 2 can be exposed in the installation cavity 11 and connected to the electronic component 3. Among them, the electronic component 3 can be a Hall Sensor, an IC (Integrated Circuit), a TMR (Tunnel Magneto Resistance), etc. The connection between the connection terminal 2 and the electronic component 3 can be fixed by soldering, that is, first apply solder to the connection terminal 2, install the electronic component 3 on the insulating body 1 and overlap it with the corresponding connection terminal 2, and then fix the connection by heating the solder.

[0049] Referring to Figure 6 and Figure 7 Figure 7

[0050] The connecting portion 22 includes two opposite end faces along its thickness direction, and the two end faces are a connecting surface 221 and a mating surface 222 respectively. The connecting surface 221 is exposed to the insulating body 1 and is used for connecting with the electronic component 3. When forming the insulating body 1, a plastic mold is used to abut against the connecting surface 221, and other plastic molds are also used in cooperation so that multiple plastic molds act together to limit a space having the same shape as the insulating body 1, and the molten liquid insulating material is filled into this space. After the liquid insulating material cools and solidifies, the insulating body 1 is formed. When the connecting surface 221 of the connecting portion 22 is uneven, the plastic mold cannot fit closely with the connecting portion 22. The plastic mold abuts against the higher position of the connecting portion 22, and there are gaps between the plastic mold and other positions of the connecting portion 22. When forming the insulating body 1, the liquid insulating material will fill in the gaps between the plastic mold and the connecting portion 22, so that the insulating body 1 will cover a partial area of the connecting surface 221 of the connecting portion 22, and only the higher area of the connecting portion 22 can be exposed to the insulating body 1. Since a part of the connecting portion 22 is covered by the insulating body 1, the area of the connecting portion 22 exposed to the insulating body 1 is reduced, and the connecting area between the connecting portion 22 and the electronic component 3 is decreased. When fixedly connecting by soldering, the bonding area between the solder and the connecting portion 22 is reduced, thereby resulting in a decrease in the bonding force between the connecting portion 22 and the electronic component 3, and the electronic component 3 is likely to fall off from the corresponding connecting portion 22; moreover, since the deformation degree of the connecting surface 221 on the connecting portions 22 of multiple connecting terminals 2 is uncontrollable, the exposed areas of the connecting surfaces 221 on the multiple connecting portions 22 may be different from each other, and the connecting effect between the connecting portions 22 and the electronic components 3 is poor.

[0051] To improve the surface flatness of the connection surface 221 of the connection portion 22, the connection portion 22 can be plastically deformed so that the connection surface 221 forms a flat surface. Specifically, a pressing force can be applied to the connection portion 22 so that the connection portion 22 is extruded to produce permanent plastic deformation. At this time, the connection portion 22 becomes thinner and its thickness is less than that of the main body portion 21. During the plastic deformation of the connection portion 22, the pressing force for plastic deformation will correct the position of the connection portion 22 and flatten the connection portion 22 so that a flat connection surface 221 can be formed after the plastic deformation of the connection portion 22.

[0052] After the connection portion 22 undergoes plastic deformation, the connection surface 221 is a flat surface. When the insulating body 1 is formed, the connection surface 221 can be closely attached to the plastic mold, and there is basically no gap between the connection surface 221 and the plastic mold. Therefore, the liquid insulating material will not flow between the connection surface 221 and the plastic mold, and the portion of the connection surface 221 blocked by the plastic mold can be completely exposed outside the insulating body 1 and flush with the bottom of the installation cavity 11 after the insulating body 1 is formed. Therefore, the connection surface 221 can be basically not blocked by the insulating body 1, and the connection area between the connection portion 22 and the electronic component 3 is relatively large, which can ensure the bonding force after the connection between the connection portion 22 and the electronic component 3; moreover, the exposed area of the connection surface 221 can be the same as the predetermined exposed area, the exposed area of the connection surface 221 is controllable, and the exposed areas of multiple connection surfaces 221 can be set to be basically the same, thereby ensuring the connection effect between the connection terminal 2 and the electronic component 3. Among them, the predetermined exposed area is controlled by the fitting area between the plastic mold and the connection surface 221, and the area of the plastic mold covering the connection surface 221 is the predetermined exposed area. By adjusting the structure of the plastic mold, the adjustment of the exposed area of the connection surface 221 can be realized.

[0053] In the prior art, the general method for ensuring the connection effect between the connection portion 22 and the electronic component 3 is to form a convex hull by stamping, and the surface of the convex hull is used to connect with the electronic component 3, or to form a welding portion by tearing, so as to control the area of the welding portion. The methods of forming a convex hull by stamping and tearing are equivalent to secondary stamping of the connection terminal 2, making the connection portion 22 of the connection terminal 2 more likely to be skewed and deformed, and the surface flatness of the connection surface 221 of the connection portion 22 is worse, which cannot effectively ensure the connection effect between the connection portion 22 and the electronic component 3; moreover, the processing method of forming a welding portion by tearing is relatively difficult, and if the mass production requirements are to be met, the cost paid is relatively high.

[0054] In this application, by causing the connecting portion 22 to undergo plastic deformation, during the process of plastic deformation, the pressing force generated by the plastic deformation corrects the position of the connecting portion 22, so that the connecting portion 22 after plastic deformation can be in a flat state, and the connecting surface 221 of the connecting portion 22 is a flat surface, which can ensure the connection effect between the connecting portion 22 and the electronic component 3. Moreover, the processing method of plastic deformation is easier to implement compared to the tearing and cutting processing method, and it can meet the requirements of mass production in the industry.

[0055] Specifically, the connecting portion 22 can be formed by forging along its thickness direction, so that the connecting portion 22 undergoes plastic deformation by forging. Among them, forging the connecting portion 22 can specifically be taking one or more end faces of the connecting portion 22 along the thickness direction as the forging surface, and then using components such as a hydraulic press or a mechanical press to forge the forging surface.

[0056] Refer to Figure 7 and Figure 8 , after the connecting portion 22 is forged, its thickness becomes thinner and its width increases. Flat surfaces are respectively formed on the opposite end faces of the connecting portion 22 along its thickness direction. Therefore, the connecting surface 221 and the mating surface 222 located at the opposite ends of the connecting portion 22 along the thickness direction respectively form flat surfaces; moreover, after being forged, the width of the connecting portion 22 increases, and the width of the end of the connecting portion 22 adjacent to the main body portion 21 is greater than the width of the end of the main body portion 21 adjacent to the connecting portion 22. The increase in the width of the connecting portion 22 can increase the area of the connecting surface 221, thereby increasing the connection area between the connecting surface 221 and the electronic component 3. When fixed and connected by soldering, the welding area between the solder and the connecting surface 221 increases, further enhancing the connection effect between the connecting terminal 2 and the electronic component 3.

[0057] Among them, the thickness of the main body portion 21 connected to the connecting portion 22 can be 0.05 - 0.2 mm. The thickness of the connecting portion 22 before plastic deformation is the same as that of the main body portion 21, and the thickness of the connecting portion 22 after plastic deformation can be 80% - 95% of the thickness of the main body portion 21. When the thickness of the connecting portion 22 after plastic deformation is relatively thin, the strength of the connecting portion 22 will be reduced, resulting in the connecting portion 22 being prone to deformation during the manufacturing process; if the change in the thickness of the connecting portion 22 after plastic deformation is small, it may lead to the connecting portion 22 not being effectively flattened, and thus the flatness of the connecting surface 221 of the connecting portion 22 is difficult to meet the requirements; by controlling the thickness of the connecting portion 22 after plastic deformation to be 80% - 95% of the thickness of the main body portion 21, while flattening the connecting portion 22, the strength of the connecting portion 22 is ensured.

[0058] Refer to Figure 7, in some specific embodiments, when forging the connecting portion 22, the connecting surface 221 of the connecting portion 22 can be placed on a platform, and then the mating surface 222 of the connecting portion 22 is used as the forging surface, and a pressing force is applied to the mating surface 222 of the connecting portion 22 so that the mating surface 222 of the connecting portion 22 is concave with respect to the corresponding end surface of the main body portion 21, thereby realizing the plastic deformation of the connecting portion 22, and at this time, the connecting surface 221 of the connecting portion 22 is flush with the corresponding end surface in the main body portion 21. The main body portion 21 forms a first end surface 211 and a second end surface 212 along the thickness direction. Among them, before forging, the mating surface 222 of the connecting portion 22 is flush with the second end surface 212 of the main body portion 21, and the second end surface 212 of the main body portion 21 corresponds to the mating surface 222 of the connecting portion 22; and, the connecting surface 221 of the connecting portion 22 is flush with the first end surface 211 of the main body portion 21, and the first end surface 211 of the main body portion 21 corresponds to the connecting surface 221 of the connecting portion 22. After forging, the mating surface 222 of the connecting portion 22 is concave with respect to the second end surface 212 and a step is formed between the mating surface 222 and the second end surface 212.

[0059] In the existing optical drive base, after the insulating body 1 is formed, the connecting surface 221 of the connecting portion 22 can be flush with the bottom of the installation cavity 11 in the insulating body 1; therefore, when forming the insulating body 1, a plastic mold can be used to abut against the connecting surface 221 while also abutting against the bottom of the installation cavity 11. In the present application, by using the mating surface 222 of the connecting portion 22 as the forging surface, the connecting surface 221 of the connecting portion 22 can remain flush with the corresponding first end surface 211 of the main body portion 21. At this time, even if the width of the connecting portion 22 increases, the connecting surface 221 of the connecting portion 22 still remains flush with the bottom of the installation cavity 11 in the insulating body 1. At this time, the existing plastic mold can be used to abut against the connecting portion 22, without the need to additionally process the corresponding plastic mold, reducing the demand for plastic molds and the cost of plastic molds.

[0060] When connecting the connecting portion 22 of the connecting terminal 2 to the electronic component 3, welding materials such as solder are added to the connecting surface 221 of the connecting portion 22, and then the electronic component 3 is installed in the installation cavity 11. The electronic component 3 can be in direct contact with the connecting surface 221 of the connecting portion 22 and be welded through solder. Specifically, the electronic component 3 can be provided with a convex bump that cooperates with the connecting surface 221, and the vertex of the convex bump of the electronic component 3 abuts against the connecting surface 221 of the connecting portion 22 to improve the connection reliability between the electronic component 3 and the connecting portion 22, and the solder covers the connecting surface 221 and the outer peripheral surface of the convex bump to facilitate the welding of the connecting portion 22 and the electronic component 3.

[0061] Refer to Figure 10, in some other specific embodiments, when forging the connecting portion 22, the mating surface 222 of the connecting portion 22 can be placed on a platform, and then the connecting surface 221 of the connecting portion 22 is used as the forging surface, and a pressing force is applied to the connecting surface 221 of the connecting portion 22 so that the connecting surface 221 of the connecting portion 22 is concave with respect to the corresponding first end face 211 of the main body portion 21, thereby realizing the plastic deformation of the connecting portion 22. A step is formed between the connecting surface 221 of the connecting portion 22 and the first end face 211, and at this time, the mating surface 222 of the connecting portion 22 is flush with the corresponding second end face 212 in the main body portion 21.

[0062] Referring to Figure 9 , the main body portion 21 of the connection terminal 2 can be flush with the bottom of the installation cavity 11, and the insulating body 1 is provided with a recessed cavity 12 formed by further recessing from the installation cavity 11. The bottom of the recessed cavity 12 is at least flush with or lower than the recessed connecting surface 221 so that at least a part of the connecting surface 221 can be received in the recessed cavity 12 and can be exposed in the recessed cavity 12. Wherein, the insulating body 1 forms a barrier portion 115 around the periphery of the recessed cavity 12 at the bottom of the installation cavity 11. Most of the connecting surface 221 of the connecting portion 22 is exposed in the recessed cavity 12, and the part of the connecting portion 22 adjacent to the main body portion 21 is covered by the barrier portion 115 of the insulating body 1. The surface of the barrier portion 115 is flush with the first end face 211 of the main body portion 21 in the thickness direction and higher than the connecting surface 221 of the connecting portion 22. When connecting the connecting portion 22 of the connection terminal 2 to the electronic component 3, welding materials such as solder are added to the connecting surface 221 of the connecting portion 22, and then the electronic component 3 is installed in the installation cavity 11. The electronic component 3 is connected to the connecting portion 22 through solder. The barrier portion 115 of the insulating body 1 covering the connecting surface 221 can block the flow of solder towards the main body portion 21, so as to facilitate the concentration of solder on the connecting surface 221, and can also better control the exposed area of the connecting surfaces 221 of multiple connection terminals 2, making the size of the exposed area as consistent as possible to better ensure the soldering effect with the electronic component; and, the recessed cavity 12 can be used to accommodate solder to reduce the risk of short circuit or poor soldering caused by excessive overflow of solder due to the extrusion of the electronic component 3.

[0063] Referring to Figure 11, in some other specific embodiments, when forging the connecting portion 22, the connecting surface 221 and the mating surface 222 of the connecting portion 22 can both be used as forging surfaces for forging. The connecting surface 221 and the mating surface 222 are respectively forged so that the connecting portion 22 is plastically deformed and then recessed relative to the corresponding first end surface 211 and second end surface 212 of the main body portion 21. At this time, a step is formed between the connecting surface 221 and the first end surface 211, and a step is formed between the mating surface 222 and the second end surface 212; and the insulating body 1 is provided with a recessed cavity 12 formed by further recessing from the installation cavity 11. At least a part of the recessed connecting surface 221 is received in the recessed cavity 12 and can be exposed to the recessed cavity 12.

[0064] When connecting the connecting portion 22 with the electronic component 3, solder wicking phenomenon will occur on the connecting surface 221 of the connecting portion 22, and thus a certain traction force will be generated on the electronic component 3. The traction force of the solder on the electronic component 3 during solder wicking is related to the area of the connecting surface 221 to which the solder adheres. When the exposed areas of multiple connecting surfaces 221 connected to the same electronic component 3 are basically the same, the traction forces generated by the solder on the multiple connecting surfaces 221 on the electronic component 3 are approximately the same and can cancel each other out. At this time, the position of the electronic component 3 can be kept basically unchanged; while if the exposed areas of multiple connecting surfaces 221 connected to the same electronic component 3 vary greatly, the traction forces generated by the solder on the multiple connecting surfaces 221 on the electronic component 3 are different and cannot cancel each other out. At this time, the electronic component 3 will be pulled and move, resulting in the deviation of the position of the electronic component 3.

[0065] Refer to Figure 12 and Figure 13, to ensure that the exposed areas of multiple connection surfaces 221 connected to the same electronic component 3 are approximately the same, a partial number of connection terminals 2 can be formed with a tear portion 23 by tearing. The tear portion 23 is located at the connection between the connection portion 22 and the main body portion 21. The tear portion 23 is recessed inward in the thickness direction from the connection surface 221 so that a blocking groove 231 is formed between the connection portion 22 and the main body portion 21, and the tear portion 23 is used to control the exposed area of the connection surface 221. Specifically, among the multiple connection surfaces 221 connected to the same electronic component 3, when the exposed area of a partial number of connection surfaces 221 on the insulating body 1 is relatively large, the portion of the connection portion 22 adjacent to the main body portion 21 can be recessed through tearing to form the tear portion 23. The portion of the connection surface 221 of the connection portion 22 that is not used to form the tear portion 23 is connected to the electronic component 3, and the tear portion 23 is covered by the insulating body 1 when the insulating body 1 is formed. After a part of the connection surface 221 is recessed and used to form the tear portion 23, the area of the connection surface 221 exposed on the insulating body 1 becomes smaller. By controlling the area of the connection surface 221 of the connection portion 22 that is recessed to form the tear portion 23, the area of the connection surface 221 of the connection portion 22 used to connect to the electronic component 3 can be controlled, and thus the connection surfaces 221 of multiple connection portions 22 connected to the same electronic component 3 can be kept substantially the same. Among them, the exposed area of the connection surface 221 is the area of the connection surface 221 exposed on the insulating body 1. The tear portion 23 can be formed only by the inward recess of a partial structure of the connection portion 22, or the tear portion 23 can be formed by the inward recess of a partial connection portion 22 and a partial main body portion 21, and the partial connection portion 22 and the partial main body portion 21 are connected.

[0066] Referring to Figure 4 , when the insulating body 1 is formed, to ensure the accurate position of the connection terminal 2, a positioning fixture is used to fix the connection terminal 2. The positioning fixture can abut against the mating surface 222 of the connection portion 22, so that the connection portion 22 is clamped by the joint action of the positioning fixture and the plastic mold abutting against the connection surface 221 of the connection portion 22, thereby realizing the fixation of the connection portion 22. After the insulating body 1 is formed, the positioning fixture is removed, and the insulating body 1 forms a positioning hole 13 extending from the mating surface 222 through the insulating body 1 in the thickness direction. The positioning hole 13 is a hole for accommodating the positioning fixture that mates with the connection portion 22.

[0067] In addition, referring to Figure 14, a positioning jig can also be used to position the mounting portion 24 of the connection terminal 2. To prevent metal chips from being generated at the corners of the mounting portion 24 when the positioning jig positions the mounting portion 24, the mounting portion 24 can be processed to form a chamfer 241 before forming the insulating body 1 and after stamping to separate the plurality of connection terminals 2. Specifically, the corners of the mounting portion 24 are extruded to form an inclined chamfer. After pre-processing the chamfer 241 on the mounting portion 24, it can effectively prevent metal chips from being generated at the corners of the mounting portion 24 when the positioning jig positions the mounting portion 24.

[0068] The present invention also provides a preparation method of an optical drive base, which is used to prepare and form the above-mentioned optical drive base. The preparation method of the optical drive base includes steps S01 to S05.

[0069] Step S01: Provide a strip, form a plurality of connection terminals 2 on the strip, and separate the connection portions 22 of the plurality of connection terminals 2 through stamping. Among them, the connection portions 22 of the plurality of connection terminals 2 may be warped and deformed after stamping.

[0070] Step S02: Tear and cut at the connection position between the connection portion 22 and the main body portion 21 to form a tear and cut portion 23 to control the exposed area of the connection surface 221 in the connection portion 22. Among them, this step S02 can be executed when the area differences of the plurality of connection surfaces 221 connected to the same terminal element are relatively large, and when the area differences of the plurality of connection surfaces 221 connected to the same terminal element are relatively small, this step S02 can be not executed. At least a part of the tear and cut portion 23 is formed by the depression of the connection portion 22 to reduce the area of the connection surface 221 of the connection portion 22 connected to the electronic component 3. By reducing the area of the connection surface 221 with a larger area connected to the electronic component 3, the areas of the plurality of connection surfaces 221 connected to the same electronic component 3 are made substantially the same.

[0071] Step S03: Forge the connection portion 22 to make the connection portion 22 plastically deformed and form a flat connection surface 221. Among them, the connection surface 221 of the connection portion 22 can be used as the forging surface for forging, and the connection surface 221 is concave to make the connection portion 22 plastically deformed; or, the mating surface 222 of the connection portion 22 can be used as the forging surface for forging, and the mating surface 222 is concave to make the connection portion 22 plastically deformed; or, the connection surface 221 and the mating surface 222 are used as the forging surfaces for forging, and the connection surface 221 and the mating surface 222 are respectively concave to make the connection portion 22 plastically deformed. After plastic deformation, the connection portion 22 is flattened to eliminate the warping and deformation generated in the connection portion 22 during stamping, and further make the connection surface 221 of the connection portion 22 form a flat surface.

[0072] Step S04: Injection-mold the insulating body 1 and expose the connection surface 221 on the insulating body 1. When a tearing portion 23 is formed at the connection position between the connecting portion 22 and the main body portion 21, the insulating body 1 covers the tearing portion 23. When the connection surface 221 serves as a forging surface and is concave with respect to the corresponding end surface of the main body portion 21, a recessed groove is formed in the insulating body 1 for accommodating at least a part of the concave connection surface 221. Before forming the insulating body 1, the installation portion 24 can be chamfered first; a space identical to the insulating body 1 is restricted by a plastic mold, and a positioning jig is used to position the connection terminal 2, and then the insulating body 1 is injection-molded.

[0073] Step S05: After the insulating body 1 is formed, the electronic component 3 is installed in the installation cavity 11 and welded and fixed to the connecting portion 22 of the connection terminal 2.

[0074] The insulating body 1 can be formed by one-shot injection molding or two-shot injection molding. When the insulating body 1 is formed by two-shot injection molding, a partial structure of the insulating body 1 is first injection-molded, the electronic component 3 is installed on this partial structure and welded to the connection terminal 2, and then the remaining partial structure of the insulating body 1 is injection-molded, so that the electronic component 3 can be integrated on the optical drive base during the process of two-shot injection molding of the insulating body 1.

[0075] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Without departing from the principle and purpose of the present invention, those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the invention, and all such changes should fall within the protection scope of the claims of the present invention.

Claims

1. An optical drive base, characterized in that, It includes an insulating body (1), a connection terminal (2) embedded in the insulating body (1), and an electronic component (3) connected to the connection terminal (2). The connection terminal (2) includes a main body portion (21) and a connection portion (22). The thickness of the connection portion (22) is less than that of the main body portion (21), and the connection portion (22) includes a flat connection surface (221); the connection surface (221) is exposed to the insulating body (1) to connect with the electronic component (3).

2. The optical drive base according to claim 1, characterized in that, The connection portion (22) is formed by forging along the thickness direction and undergoing plastic deformation, and the connection surface (221) is the end face at one end of the connection portion (22) along the thickness direction.

3. The optical drive base according to claim 1, wherein The thickness of the main body portion (21) is 0.05 - 0.2 mm, and the thickness of the connection portion (22) is 80% - 95% of the thickness of the main body portion (21).

4. The optical drive base according to claim 1, characterized in that, The width of the connection portion (22) at one end adjacent to the main body portion (21) is greater than the width of the main body portion (21) at one end adjacent to the connection portion (22).

5. The optical drive base according to claim 1, characterized in that, The connection portion (22) includes a mating surface (222) opposite to the connection surface (221) along the thickness direction; the main body portion (21) includes a first end face (211) and a second end face (212) arranged opposite to each other along the thickness direction; The connection surface (221) is flush with the first end face (211) along the thickness direction, and the mating surface (222) is recessed relative to the second end face (212) along the thickness direction so as to form a step between the mating surface (222) and the second end face (212); Or, the mating surface (222) is flush with the second end face (212) along the thickness direction, and the connection surface (221) is recessed relative to the first end face (211) along the thickness direction so as to form a step between the connection surface (221) and the first end face (211); Or, the mating surface (222) is recessed relative to the second end face (212) along the thickness direction so as to form a step between the mating surface (222) and the second end face (212), and the connection surface (221) is recessed relative to the first end face (211) along the thickness direction so as to form a step between the connection surface (221) and the first end face (211).

6. The optical drive base according to claim 5, characterized in that, The insulating body (1) includes an installation cavity (11) for installing the electronic component (3) and a recessed cavity (12) further recessed from the bottom of the installation cavity (11). The connection surface (221) is flush with the bottom of the recessed cavity (12) and is exposed to the recessed cavity (12).

7. The optical drive base according to claim 5, characterized in that, The insulating body (1) includes a positioning hole (13). The positioning hole (13) extends from the mating surface (222) to penetrate through the insulating body (1) along the thickness direction, and the positioning hole (13) is used to accommodate and position a positioning jig for the connection portion (22).

8. The optical drive base according to claim 1, wherein A tear portion (23) is formed at the connection between the connecting portion (22) and the main body portion (21). The tear portion (23) is recessed in the thickness direction from the connection surface (221) so that a blocking groove (231) is formed at the connection between the connecting portion (22) and the main body portion (21). The blocking groove (231) is filled with the insulating body (1). The tear portion (23) is used to control the area of the connecting portion (22) exposed from the insulating body (1).

9. The optical drive base according to claim 1, wherein The connecting terminal (2) further includes a mounting portion (24) protruding from the insulating body (1), and a chamfer (241) is formed on the mounting portion (24).

10. A preparation method of an optical drive base, characterized in that, Including: Step S01: Provide a strip of material, form a plurality of connecting terminals (2) on the strip of material, and separate the connecting portions (22) of the plurality of connecting terminals (2) by stamping. Step S03: Forge the connecting portion (22) to cause plastic deformation of the connecting portion (22) and form a flat connecting surface (221). Step S05: Injection-mold the insulating body (1) and expose the connecting surface (221) to the insulating body (1). Step S06: Provide an electronic component (3) and connect the electronic component (3) to the connecting surface (221).

11. The preparation method of the optical driving base according to claim 10, characterized in that, The specific steps of Step S03 include: Using the connecting surface (221) of the connecting portion (22) as the forging surface for forging, so that the connecting portion (22) is plastically deformed and the connecting surface (221) is recessed. Or, using the mating surface (222) of the connecting portion (22) opposite to the connecting surface (221) as the forging surface for forging, so that the connecting portion (22) is plastically deformed and the mating surface (222) is recessed. Or, simultaneously using the connecting surface (221) and the mating surface (222) as the forging surface for forging, so that the connecting portion (22) is plastically deformed and the connecting surface (221) and the mating surface (222) are respectively recessed.

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