Frequency conversion cabinet

Abstract

The invention discloses a frequency conversion cabinet, which relates to the technical field of electrical control equipment design and mainly comprises a reactor independent air duct module, a capacitor module and a power module. In the independent air duct module of the reactor, the circuit breaker, the reactor, the contactor and the charging resistor form a laminated structure through the first separator in the separator group, and the parts in the three modules adopt a layered layout design, so that the space is fully utilized, the space utilization rate is improved, and the miniaturization design of the frequency conversion cabinet is realized. Moreover, the three modules are provided with respective independent air ducts, so that heat dissipation among the modules can be ensured not to influence each other, and the heat dissipation effect is ensured. Therefore, compared with the frequency conversion cabinet in the prior art, the frequency conversion cabinet provided by the invention can ensure the heat dissipation effect on the basis of realizing the miniaturization design.

Description

Technical Field

[0001] The present application relates to the technical field of electrical control equipment design, and in particular to a frequency conversion cabinet. Background Art

[0002] The frequency converter is an electrical control device used to adjust the speed of the motor. It controls the connected motor by changing the frequency and voltage of the alternating current. The frequency converter can improve the operating efficiency of the equipment and provide a variety of protection functions to ensure the reliability and safety of the system.

[0003] The layout of the frequency converter cabinet is crucial, considering both the smoothness of electrical connections and the mutual influence between components with different heat generation. In order to meet the heat dissipation requirements, the existing frequency converter cabinets are laid out according to the order of electrical connections and the intervals between components are appropriately widened. However, this layout method reduces the space utilization of the frequency converter cabinet and does not conform to the development trend of miniaturization and integration of frequency converter cabinets. Summary of the invention

[0004] In view of this, the present application provides a frequency conversion cabinet to solve the problem that both the space utilization and the heat dissipation effect of the existing frequency conversion cabinet cannot be taken into account at the same time.

[0005] A frequency conversion cabinet, comprising: a reactor independent air duct module, a capacitor module, a power module, an isolation component group and a back plate group; wherein:

[0006] The isolation member group includes a first isolation member and a second isolation member;

[0007] The backplane assembly includes a first backplane and a second backplane;

[0008] The reactor independent air duct module includes a circuit breaker, a reactor, a contactor and a charging resistor; the circuit breaker forms a stacked structure with the reactor, the contactor and the charging resistor through a first isolating member; the first isolating member and the first back plate form a first independent air duct, and the first independent air duct includes the reactor located on the top layer and the contactor and the charging resistor located in parallel on the bottom layer;

[0009] The capacitor module includes a busbar electrolytic capacitor, a DC copper busbar, a voltage-equalizing resistor, and a circuit board; the second isolating member and the second back plate form a second independent air duct, and the second independent air duct includes a busbar electrolytic capacitor;

[0010] The space where the power module is located is the third independent channel. The power module includes a rectifier bridge, an inverter bridge, a current sensor and an absorption capacitor.

[0011] Optionally, the reactor independent air duct module further includes a first cooling fan;

[0012] The first heat dissipation fan is located at the first air outlet of the first independent air duct.

[0013] Optionally, the heat dissipation process of the first independent air duct includes:

[0014] The gas sucked in through the first air inlet of the first independent air duct first passes through the contactor and charging resistor located at the bottom layer, then passes through the reactor with a large heat dissipation amount, and the first heat dissipation fan discharges the gas carrying heat through the first air outlet.

[0015] Optionally, the power module further includes a heat dissipation component and a semiconductor switch;

[0016] The rectifier bridge and the semiconductor switch are installed on the heat dissipation component;

[0017] The absorption capacitor is located at the bottom layer of the power module, and the current sensor is located at the top layer of the power module.

[0018] Optionally, the semiconductor switch is an insulated gate bipolar transistor.

[0019] Optionally, the capacitor module is located above one side of the frequency conversion cabinet, and the capacitor module further includes a second heat dissipation fan;

[0020] The second heat dissipation fan is located at the second air outlet of the second independent air duct.

[0021] Optionally, the power module is located below the capacitor module, and the third independent air duct of the power module is interconnected with the second independent air duct of the capacitor module.

[0022] Optionally, the heat dissipation processes of the second independent air duct and the third independent air duct include:

[0023] The gas sucked in through the second air inlet of the third independent air duct sequentially passes through the current sensor and the absorption capacitor from bottom to top and enters the second independent air duct, passes through the bus electrolytic capacitor, and the second heat dissipation fan discharges the gas carrying heat through the second air outlet.

[0024] Optionally, the isolator in the isolator group is a sheet metal or an acrylic sheet.

[0025] Optionally, the reactor independent air duct module is located on one side of the frequency conversion cabinet, and the capacitor module and the power module are located on the other side of the frequency conversion cabinet.

[0026] As can be seen from the above solution, the frequency conversion cabinet disclosed in this application mainly includes a reactor independent air duct module, a capacitor module, and a power module. In the reactor independent air duct module, the circuit breaker forms a stacked structure with the reactor, contactor, and charging resistor through the first isolator in the isolator group. Moreover, the components in these three modules adopt a layered layout design, making full use of space and improving space utilization rate, thereby achieving the miniaturized design of the frequency conversion cabinet. Additionally, these three modules have their own independent air ducts, which can ensure that the heat dissipation between the modules does not affect each other and guarantee the heat dissipation effect. Therefore, compared with the frequency conversion cabinets in the prior art, the frequency conversion cabinet provided in this application can ensure the heat dissipation effect on the basis of achieving the miniaturized design. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with this application and, together with the specification, are used to explain the principles of this application.

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the following will briefly introduce the accompanying drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0029] Figure 1 is a schematic diagram of the composition structure of the frequency conversion cabinet provided in this application;

[0030] Figure 2 is an example diagram of the internal electrical topology of the frequency conversion cabinet provided in this application;

[0031] Figure 3 is a schematic diagram of the heat dissipation channel of the frequency conversion cabinet provided in this application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0032] In order to enable those skilled in the art to better understand the solution of this application, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of this application.

[0033] It should be noted that the terms "first", "second", etc. in the description, claims and the above-mentioned drawings of this application are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the present application described here can be implemented in an order other than those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0034] One of the development directions of frequency conversion cabinets is miniaturization and integrated design, and the structural space and heat dissipation effect usually affect and restrict each other. In order to achieve a better heat dissipation effect, the existing frequency conversion cabinets can only sacrifice the structural space. Or the heat dissipation effect is greatly sacrificed for space utilization. The requirement for miniaturization is not only to make the components of the frequency conversion cabinet more compact and reduce the size, but to make the frequency conversion cabinet compact on the premise of ensuring heat dissipation, which requires higher heat dissipation design and space layout for the frequency conversion cabinet. The frequency conversion cabinets in the prior art cannot achieve both the structural space and the heat dissipation effect.

[0035] Therefore, this application provides a frequency conversion cabinet that can ensure the heat dissipation effect on the basis of achieving miniaturization.

[0036] See Figure 1 , the schematic diagram of the composition structure of the frequency conversion cabinet provided by this application. As Figure 1 shown, the frequency conversion cabinet mainly includes three modules: a reactor independent air duct module, a capacitor module and a power module.

[0037] It should be noted that in addition to the above three main modules, the frequency conversion cabinet also includes an isolation component group and a backplane group. The isolation component group includes a first isolation component and a second isolation component, and the backplane group includes a first backplane and a second backplane.

[0038] The function of the isolation component is to isolate each module or the components in the module. On the one hand, it can form an independent air duct, and on the other hand, it can isolate according to the heat generation of different modules or the heat generation of each component in a single module, effectively reducing the mutual influence between each module or each component in a single module, thereby improving the heat dissipation efficiency of the frequency conversion cabinet.

[0039] Each separator in the separator group can be made of sheet metal or plexiglass sheet, etc. Sheet metal is relatively thin and light, which can reduce the weight of the frequency conversion cabinet and facilitate the handling and installation of the frequency conversion cabinet. Although sheet metal is a thin plate material, it has relatively high metal strength, good impact resistance and durability. Sheet metal has good electrical conductivity and can effectively isolate electromagnetic interference. The cost of sheet metal is relatively low, the processing is simple, it is suitable for large-scale production and can reduce costs. Moreover, sheet metal is easy to customize and can be made into separators of different shapes and sizes through a series of cold processing techniques such as cutting, folding and welding according to specific requirements to meet specific application needs. In short, in this application, sheet metal is selected as the separator due to its advantages such as light weight, high strength, easy processing and economy. The separator in this application can also be a plexiglass sheet, which can also be called an acrylic sheet. It is a thermoplastic with good comprehensive performance. The plexiglass sheet has good chemical stability, is non-toxic, easy to process, has good weather resistance, is light in weight and has high cost-effectiveness.

[0040] The functions of the backplane in this application are as follows: structural support, providing a physical installation foundation for various electrical components in the frequency conversion cabinet to ensure that these components can be stably installed in the cabinet; heat dissipation and protection: the presence of the backplane in this application helps with heat dissipation and can also prevent dust and debris from entering, protecting the electrical components from damage; modular design: the backplane in this application plays a role in isolating between modules, facilitating the subsequent rapid replacement or upgrade of the components in the frequency conversion cabinet without large-scale modification of all the components in the entire frequency conversion cabinet; the use of the backplane in this application also takes into account electromagnetic compatibility. By arranging the backplane in a reasonable position, electromagnetic interference can be reduced, thus ensuring the normal operation of the electromagnetic cabinet; a reasonable backplane design is convenient for maintenance personnel to carry out inspections and tests, improving the maintenance efficiency.

[0041] For the reactor independent air duct module, it includes a circuit breaker, a reactor, a contactor and a charging resistor, and the charging resistor can also be called a buffer resistor. Among them, the heat generation of the circuit breaker is very small and it is not easily affected by the contactor and the reactor. Therefore, the circuit breaker, the reactor and the contactor are combined in the reactor independent air duct module.

[0042] The circuit breaker forms a stacked structure with the reactor, the contactor and the charging resistor through the first separator. The circuit breaker is separated from the reactor, the contactor and the charging resistor by the first separator and the first backplane, forming a first independent air duct including the reactor, the contactor and the charging resistor. Specifically, the reactor, the circuit breaker and the charging resistor are installed on the first backplane, and the circuit breaker is installed directly in front of the three and fixed on the first separator. It is equivalent to that the reactor, the circuit breaker and the charging resistor are located in the independent space formed by the first separator and the first backplane, and the circuit breaker is located outside this independent space and installed on the first separator.

[0043] The stacked structure of the reactor independent air duct module improves space utilization.

[0044] Exemplarily, the first isolating member is a mounting sheet metal, the first back plate is a frequency converter cabinet rear plate, and the circuit breaker is stacked with the reactor, contactor, and charging resistor through the mounting sheet metal, that is, the reactor, contactor, and charging resistor are mounted on the rear plate of the frequency converter cabinet, and the circuit breaker is placed in front of the three components of the reactor, contactor, and charging resistor, and is fixed on the mounting sheet metal. The rear plate of the frequency converter cabinet and the mounting sheet metal form an independent air duct, and the reactor, contactor, and charging resistor are installed in the independent air duct.

[0045] In the first independent air duct, the reactor, contactor and charging resistor are designed in a layered layout, with the reactor located on the top layer and the reactor and charging resistor located side by side on the bottom layer.

[0046] Since the heat generated by the reactor is greater than that of the contactor and the charging resistor, and considering that heat usually flows naturally from top to bottom, a first cooling fan is provided at the outlet of the first independent air duct. Specifically, an air outlet, i.e., a cooling fan, is provided at the top of the first independent air duct, i.e., on the upper side of the back plate of the frequency converter cabinet. Considering the heat generated by each component, the reactor is placed at the top of the independent air duct near the air outlet, and the contactor and the charging resistor are placed directly below the reactor space, so that the gas sucked in from the lower air inlet first passes through the contactor and the charging resistor, takes away the heat from the contactor and the charging resistor, and then passes through the reactor, and finally discharges the heat from the frequency converter cabinet through the cooling fan at the air outlet.

[0047] The reactor independent air duct module improves the space utilization through the stacked structure, thereby improving the space utilization of the frequency converter cabinet, and by setting up an independent air duct, effective heat dissipation of the reactor, contactor and charging resistor is ensured.

[0048] The capacitor module includes a busbar electrolytic capacitor, a DC copper busbar, a voltage-equalizing resistor, and a circuit board. In the module, the busbar electrolytic capacitor generates the most heat, so the busbar electrolytic capacitor is placed in the second independent air duct. The second independent air duct is mainly formed by a second isolation member and a second backplane.

[0049] For the capacitor module, each component is also designed in a layered layout, with the busbar electrolytic capacitor located at the bottom layer, and the voltage-equalizing resistor and circuit board located at the top layer. This layered layout design can improve space utilization. In addition, considering the high heat generation of the busbar electrolytic capacitor, the busbar electrolytic capacitor is placed separately in the second independent air duct, and a second cooling fan is set at the outlet of the second independent air duct.

[0050] Specifically, a second independent air duct including the bus electrolytic capacitor from left to right is designed, and the second isolation member is a supporting sheet metal, which can be U-shaped or other shapes with a supporting function. Other components such as voltage-sharing resistors and circuit boards can be installed on the surface of the supporting sheet metal of the bus electrolytic capacitor, improving the space utilization rate of the capacitor module, and thus improving the space utilization rate of the entire frequency conversion cabinet.

[0051] Through the hierarchical layout design of the capacitor module and the installation of other components except the bus electrolytic capacitor on the second isolation member, the space utilization rate is improved. Moreover, by setting up an independent air duct, the bus electrolytic capacitor can be effectively cooled.

[0052] For the power module, it includes a rectifier bridge, an inverter bridge, a current sensor, and an absorption capacitor.

[0053] It should be noted that the space where the power module is located is the third independent channel. The power module also includes semiconductor switches and heat dissipation components.

[0054] The semiconductor switch is an IGBT (Insulated Gate Bipolar Transistor).

[0055] The heat dissipation component can be a heat dissipation plate, which can be a liquid-cooled heat dissipation plate or an air-cooled heat dissipation plate. The heat dissipation plate mainly dissipates heat from the rectifier bridge and the IGBT. The rectifier bridge and the IGBT generate a large amount of heat. Therefore, in this application, the heat dissipation plate is used to dissipate heat from these two components, and the heat is dissipated through the bottom substrate of the components. It should be noted that the DC sides of the rectifier bridge and the IGBT are connected in parallel with the absorption capacitor, so as to absorb the peak voltage. The current sensor is installed on the output phase copper bar of the IGBT to detect the output current of the frequency conversion cabinet.

[0056] In terms of spatial arrangement, since the heat generated by the absorption capacitor is greater than that of the current sensor, the absorption capacitor is placed on the upper side of the power module, and the current sensor is placed on the lower side of the power module.

[0057] When the frequency conversion cabinet is fed from the left side, the circuit breaker is placed on the left side, and the three-phase input line goes to the lower left side of the frequency conversion cabinet after passing through the circuit breaker, and the rectifier bridge is located in the lower right part on the right side.

[0058] Through the hierarchical layout design of the power module, the space utilization rate is improved, and thus the space utilization rate of the entire frequency conversion cabinet is improved. Moreover, heat dissipation plates are provided for the rectifier bridge and the IGBT with relatively large heat generation to ensure effective heat dissipation of the power module.

[0059] It should be noted that the second independent channel of the capacitor module and the third independent channel of the power module are interconnected, and a common heat dissipation fan, that is, the second heat dissipation fan, can be shared.

[0060] Exemplarily, seeFigure 2 , an internal electrical topology example diagram of the frequency conversion cabinet provided by this application.

[0061] As Figure 2 shown, the frequency conversion cabinet mainly includes three modules: a reactor independent air duct module, a capacitor module, and a power module. The reactor independent air duct module mainly consists of a circuit breaker, a reactor, a contactor, and a buffer resistor, and the contactor can be a DC contactor. The capacitor module mainly includes bus capacitors, DC busbars, and can also include circuit boards such as voltage equalizing resistors and control boards. The power module consists of a rectifier bridge, an inverter bridge, and a current sensor.

[0062] It should be noted that in the frequency conversion cabinet, the reactor independent air duct module is located on one side, and the capacitor module and the power module are located on the other side. Moreover, the capacitor module is located in the upper half, and the power module is located in the lower half.

[0063] Specifically, when the frequency conversion cabinet has a left-side inlet, the reactor independent air duct module is located on the left side of the frequency conversion cabinet, and the capacitor module and the power module are located on the right side of the frequency conversion cabinet. When the frequency conversion cabinet has a right-side inlet, for the convenience of inlet, the reactor independent air duct module is located on the right side of the frequency conversion cabinet, and the capacitor module and the power module are located on the left side of the frequency conversion cabinet. For the capacitor module and the power module, the heat generated by the bus electrolytic capacitor in the capacitor module is greater than that of the absorption capacitor, and the rectifier bridge and IGBT in the power module are cooled by heat dissipation components. Therefore, the heat generated by the capacitor module is greater than that of the power module. Considering that heat usually flows naturally from top to bottom, the capacitor module is placed above the power module.

[0064] In summary, the frequency conversion cabinet disclosed in this application mainly includes a reactor independent air duct module, a capacitor module, and a power module. In the reactor independent air duct module, the circuit breaker forms a stacked structure with the reactor, the contactor, and the charging resistor through the first isolator in the isolator group. Moreover, the components in these three modules adopt a hierarchical layout design, making full use of space and improving space utilization rate, thereby realizing the miniaturized design of the frequency conversion cabinet. And these three modules have their own independent air ducts, which can ensure that the heat dissipation between the modules does not affect each other and ensure the heat dissipation effect. Therefore, the frequency conversion cabinet provided by this application can ensure the heat dissipation effect on the basis of realizing the miniaturized design compared with the frequency conversion cabinets in the prior art.

[0065] Optionally, refer to Figure 3 , a schematic diagram of the heat dissipation channel of the frequency conversion cabinet provided by this application.

[0066] As Figure 3 shown, for the first independent air duct of the reactor independent air duct module, the gas enters from the air inlet 2, first passes through the contactor and the charging resistor located at the bottom layer, and then passes through the reactor with a large heat dissipation, and the fan discharges the gas carrying heat.

[0067] For the power module and the capacitor module, a common heat dissipation channel and a fan are shared. The gas enters from the air inlet 1, passes through the third independent air duct and the absorption capacitor in sequence, then enters the second independent air duct, and finally passes through the electrolytic capacitor. The fan 1 discharges the gas carrying heat.

[0068] The frequency conversion cabinet provided by this application adopts a modular design, combines several parts of components together to form a module, sets a separate heat dissipation channel and heat dissipation method for each module, and the modules can be arranged through isolation parts or according to the heat generation amount, so as to reduce the mutual influence between modules and improve the heat dissipation efficiency of the frequency conversion cabinet. Moreover, each module adopts a stacked design, so as to ensure full utilization of space on the premise of heat dissipation, improve the space utilization rate, and realize the miniaturized design of the frequency conversion cabinet.

[0069] Exemplarily, traditional fixed-frequency screw and other high-power water-cooled central air conditioners are gradually replaced by oil-free and frictionless magnetic and air-bearing centrifugal large-scale water-cooled central air conditioners. For oil-free and frictionless magnetic and air-bearing centrifugal large-scale water-cooled central air conditioners, their frequency conversion cabinets play a particularly crucial role. The frequency conversion cabinet provided by this application can be applied to oil-free and frictionless magnetic and air-bearing centrifugal large-scale water-cooled central air conditioners, and on the basis of realizing the miniaturized and integrated design of high-power frequency conversion cabinets, ensure good heat dissipation effects.

[0070] It should be noted that the various embodiments in this specification are all described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0071] For the convenience of description, when describing the above system or device, it is described by dividing it into various modules or units according to functions. Of course, when implementing this application, the functions of each unit can be realized in the same or multiple software and / or hardware.

[0072] From the description of the above implementation manners, those skilled in the art can clearly understand that this application can be realized by means of software plus a necessary general hardware platform. Based on such an understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a storage medium, such as ROM / RAM, magnetic disk, optical disc, etc., and includes several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in various embodiments or some parts of the embodiments of this application.

[0073] Finally, it should also be noted that in this text, relational terms such as first, second, third, and fourth are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element.

[0074] The above are only the preferred embodiments of the present application. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present application.

Claims

1. A frequency conversion cabinet, characterized in that, Comprising: A reactor independent air duct module, a capacitor module, a power module, an isolation component group, and a backplane group; wherein: The isolation component group includes a first isolation component and a second isolation component; The backplane group includes a first backplane and a second backplane; The reactor independent air duct module includes a circuit breaker, a reactor, a contactor, and a charging resistor; the circuit breaker forms a stacked structure with the reactor, the contactor, and the charging resistor through the first isolation component; the first isolation component and the first backplane form a first independent air duct, and the first independent air duct includes the reactor located at the top layer and the contactor and the charging resistor located side by side at the bottom layer; The capacitor module includes a bus electrolytic capacitor, a DC copper bar, a voltage equalizing resistor, and a circuit board; the second isolation component and the second backplane form a second independent air duct, and the second independent air duct includes the bus electrolytic capacitor; The space where the power module is located is a third independent channel, and the power module includes a rectifier bridge, an inverter bridge, a current sensor, and an absorption capacitor.

2. The frequency conversion cabinet according to claim 1, wherein The reactor independent air duct module further includes a first cooling fan; The first cooling fan is located at the first air outlet of the first independent air duct.

3. The frequency conversion cabinet according to claim 2, wherein The heat dissipation process of the first independent air duct includes: The gas sucked in from the first air inlet of the first independent air duct first passes through the contactor and the charging resistor located at the bottom layer, then passes through the reactor with a large heat dissipation amount, and the first cooling fan discharges the gas carrying heat through the first air outlet.

4. The frequency conversion cabinet according to claim 1, characterized in that The power module further includes a heat dissipation component and a semiconductor switch; The rectifier bridge and the semiconductor switch are mounted on the heat dissipation component; The absorption capacitor is located at the bottom layer of the power module, and the current sensor is located at the top layer of the power module.

5. The frequency conversion cabinet according to claim 4, wherein, The semiconductor switch is an insulated gate bipolar transistor.

6. The frequency conversion cabinet according to claim 1, characterized in that The capacitor module is located above one side of the frequency conversion cabinet, and the capacitor module further includes a second cooling fan; The second cooling fan is located at the second air outlet of the second independent air duct.

7. The frequency conversion cabinet according to claim 6, wherein The power module is located below the capacitor module, and the third independent air duct of the power module is communicated with the second independent air duct of the capacitor module.

8. The frequency conversion cabinet according to claim 7, wherein, The heat dissipation processes of the second independent air duct and the third independent air duct include: The gas sucked in from the second air inlet of the third independent air duct sequentially passes through the current sensor and the absorption capacitor from bottom to top and enters the second independent air duct, passes through the bus electrolytic capacitor, and the second cooling fan discharges the gas carrying heat through the second air outlet.

9. The frequency conversion cabinet according to claim 1, characterized in that, The isolation components in the isolation component group are made of sheet metal or plexiglass.

10. The frequency conversion cabinet according to claim 1, wherein The reactor independent air duct module is located on one side of the frequency conversion cabinet, and the capacitor module and the power module are located on the other side of the frequency conversion cabinet.

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