Power module and power conversion equipment

Abstract

The invention provides a power module and power conversion equipment, and relates to the technical field of electronics. The power conversion equipment comprises a circuit board, a power module and a radiator, and the power module is arranged between the circuit board and the radiator in the thickness direction of the circuit board. The power module comprises a substrate, pins, a power device and a plastic package part, the power device and the pins are arranged on the side, facing the circuit board, of the substrate, the plastic package part wraps at least part of the substrate, the power device and part of the pins, the pins penetrate through the circuit board in the thickness direction of the circuit board and are arranged on the circuit board, and the radiator abuts against the side, back to the circuit board, of the substrate; wherein at least one supporting body is arranged between the plastic package part and the circuit board, and the supporting body is fixedly connected with one of the plastic package part and the circuit board and abuts against the other one of the plastic package part and the circuit board in the thickness direction of the circuit board. The circuit board is supported by the support body, so that the length of the pin is reduced to reduce parasitic inductance on the basis of reducing the deformation of the circuit board.

Description

Technical Field

[0001] This application relates to the field of electronic technologies, and particularly to a power module and a power conversion device. Background Art

[0002] Silicon carbide is a semiconductor material with high-frequency characteristics and high conversion efficiency, which is widely used in power modules. In order to exert the high-frequency characteristics of the silicon carbide material, the parasitic inductance of the power module needs to be lower. In existing power conversion devices, the pins of the power module are usually mounted on the circuit board, such that the power devices of the power module face the circuit board, and then the heat sink is disposed on the side of the power module facing away from the circuit board and mounted on the circuit board. However, the length of the pins is set to be very long to reduce the micro-deformation of the circuit board, which results in a large parasitic inductance of the pins, and the electrical performance of the power module and the power conversion device is poor. Summary of the Invention

[0003] This application provides a power module and a power conversion device, aiming to solve the technical problem of poor electrical performance of the power module and the power conversion device.

[0004] In a first aspect, an embodiment of this application provides a power conversion device. The power conversion device includes a circuit board, a power module, and a heat sink. In the thickness direction of the circuit board, the power module is disposed between the circuit board and the heat sink. The power module includes a substrate, pins, power devices, and a plastic package. The power devices and the pins are both disposed on the side of the substrate facing the circuit board. The plastic package covers at least part of the substrate, the power devices, and part of the pins. The pins penetrate through the circuit board along the thickness direction of the circuit board, and the heat sink abuts against the side of the substrate facing away from the circuit board. Wherein, at least one support body is provided between the plastic package and the circuit board. Along the thickness direction of the circuit board, one side of the support body is fixedly connected to one of the plastic package and the circuit board, and the other side of the support body abuts against the other of the plastic package and the circuit board.

[0005] In the power conversion device provided by the embodiment of the present application, the heat generated by the operation of the power device can be transferred to the radiator through the substrate and then to the external environment to achieve heat dissipation of the power device. In the existing power conversion device, the pins of the power module are first mounted on the circuit board so that the power devices of the power module face the circuit board, and then the radiator is mounted on the circuit board. An interference fit is often provided between the radiator and the circuit board to ensure close contact between the power module and the radiator to improve the reliability of heat dissipation. A large stress is applied to the connection position between the pins of the power module and the circuit board, resulting in micro-deformation of the circuit board. To reduce the micro-deformation of the circuit board, the length of the pins is set very long, resulting in a large parasitic inductance of the pins, and the electrical performance of the power module and the power conversion device is poor. In the embodiment of the present application, since along the thickness direction of the circuit board, one side of the support body is fixedly connected to one of the plastic package and the circuit board, and the other side of the support body abuts against the other of the plastic package and the circuit board, the support body can support the circuit board. On the one hand, it is beneficial to reduce the micro-deformation of the part of the circuit board around the pins, and devices can be arranged around the pins on the circuit board, which is beneficial to improving the area utilization rate of the circuit board; on the other hand, the pins can be prevented from being set too long, which is beneficial to reducing the parasitic inductance and beneficial to improving the electrical performance of the power module and the power conversion device. In addition, through the support body, close contact between the power module and the radiator can be ensured, which is beneficial to increasing the contact area between the power module and the radiator and beneficial to improving the heat dissipation efficiency of the power device; and additional fasteners can be avoided, which is beneficial to simplifying the structure of the power conversion device and beneficial to reducing the processing cost of the power conversion device.

[0006] In a possible implementation manner, the circuit board is further provided with a stress sensor device, the stress sensor device is located on one side of the circuit board in the thickness direction of the circuit board, and the projection of the stress sensor device along the thickness direction of the circuit board overlaps with the projection of the power module along the thickness direction of the circuit board.

[0007] Due to the support of the support body, the degree of deformation of the part of the circuit board opposite to the power module is small. Such a design, on the one hand, can locate the position where the stress sensor device is to be arranged, facilitate the arrangement of the stress sensor device on the circuit board, and is beneficial to reducing the risk of damage to the stress sensor device arranged on the circuit board due to micro-deformation of the circuit board; on the other hand, the stress sensor device is close to the pins of the power module, which is beneficial to improving the current-carrying performance between the stress sensor device and the pins of the power module and beneficial to improving the electrical performance of the stress sensor device and the power conversion device.

[0008] In a possible implementation manner, the projection of the stress sensor device along the thickness direction of the circuit board is located between the projection of the support body along the thickness direction of the circuit board and the projection of the pins along the thickness direction of the circuit board.

[0009] The degree of deformation of the part of the circuit board between the support body and the pins is small. Such a design is conducive to reducing the risk of damage to the stress-sensitive components provided on the circuit board due to the micro-deformation of the circuit board, and is conducive to improving the reliability of the stress-sensitive components.

[0010] In a possible implementation, the strength of the support body is greater than or equal to the strength of the plastic package and greater than or equal to the strength of the circuit board.

[0011] In this way, it is possible to avoid deformation of the support body during the process of supporting the circuit board, ensure that the support body can provide stable support for the circuit board, and is conducive to improving the structural stability and reliability of the support body. Moreover, the amount of interference fit between the heat sink and the circuit board can be designed to be higher, and the support body, the circuit board and the plastic package can be in closer contact, which is conducive to improving the support effect of the support body on the circuit board.

[0012] In a possible implementation, the support body, the circuit board and the plastic package are stacked, and the size of the support body in the thickness direction of the circuit board is smaller than the size of the plastic package in the thickness direction of the circuit board.

[0013] In this way, on the basis of ensuring that the support body can provide stable support for the circuit board, it is conducive to reducing the size of the support body in the thickness direction of the circuit board, conducive to reducing the size of the power conversion device in the thickness direction of the circuit board, and conducive to the miniaturization and lightweight design of the power conversion device.

[0014] In a possible implementation, the area of the projection of the support body in the thickness direction of the circuit board is smaller than the area of the projection of the plastic package in the thickness direction of the circuit board.

[0015] In this way, on the basis of ensuring that the support body can provide stable support for the circuit board, it is possible to avoid the support body completely occupying the part of the circuit board opposite to the plastic package, and devices can also be arranged on the side of the part of the circuit board opposite to the plastic package facing the plastic package, which is conducive to improving the area utilization rate of the circuit board; moreover, it is conducive to reducing the volume of the support body and conducive to the lightweight design of the power conversion device.

[0016] In a possible implementation, the area of the projection of the support body in the thickness direction of the circuit board is greater than the area of the projection of the part where the pins pass through the circuit board in the thickness direction of the circuit board.

[0017] In this way, it is ensured that the support body has a large contact area with the circuit board and the plastic package, which is conducive to improving the structural stability of the support body, conducive to improving the support effect of the support body on the circuit board, conducive to reducing the degree of deformation of the circuit board, and conducive to improving the area utilization rate of the circuit board. Moreover, it is easy to manufacture and conducive to reducing processing costs.

[0018] In a possible implementation, the power conversion device further includes an abutting member, and the plastic package is abutted between the abutting member and the heat sink.

[0019] In this way, the abutting member can ensure close contact between the heat sink and the power module, which is beneficial to increasing the contact area between the power module and the heat sink and improving the heat dissipation efficiency of the power device.

[0020] In a possible implementation, the circuit board is provided with a first through hole that penetrates the circuit board along the thickness direction of the circuit board. The first through hole is disposed opposite to the abutting member. In the direction perpendicular to the thickness direction of the circuit board, the abutting member is located on the side of the support body away from the pins.

[0021] In this way, the abutting member can pass through the circuit board through the first through hole, which can avoid leaving too much installation space between the circuit board and the plastic package and is beneficial to the miniaturized design of the power conversion device. Moreover, the first through hole can be disposed on the side of the support body away from the pins, ensuring that the deformation degree of the part of the circuit board located between the pins and the support body is very small, which is convenient for arranging devices around the pins on the circuit board.

[0022] In a possible implementation, the support body is further provided with a second through hole that penetrates the support body along the thickness direction of the circuit board, and at least a part of the abutting member is received in the second through hole.

[0023] In this way, it is beneficial to improve the space utilization rate of the abutting member and the support body and is beneficial to the miniaturized design of the power conversion device. Moreover, the distribution of the abutting member will affect the distribution of the first through hole, and thus affect the support effect of the support body on the circuit board. This is also beneficial to improving the support effect of the support body on the circuit board and reducing the deformation degree of the circuit board.

[0024] In a possible implementation, in the direction perpendicular to the thickness direction of the circuit board, at least one support body is close to the side of the plastic package away from the pins.

[0025] The deformation degree of the part of the circuit board between the pins and the support body is small. In this way, it is beneficial to increase the area of the part of the circuit board between the pins and the support body, which is convenient for arranging devices on the part of the circuit board between the pins and the support body and is beneficial to improving the area utilization rate of the circuit board.

[0026] In a possible implementation, in the direction perpendicular to the thickness direction of the circuit board, at least one support body is close to the side of the plastic package close to the pins.

[0027] In this way, the support strength of the support body for the part of the circuit board around the pins is higher, which is beneficial to reducing the deformation degree of the part of the circuit board between the pins and the support body.

[0028] In a possible implementation, at least one support is located at the corners of the surface of the encapsulant facing the circuit board.

[0029] In this way, it is convenient to arrange the support between the circuit board and the encapsulant, convenient to position the support, and beneficial to reducing the design cost and processing cost of the support.

[0030] In a possible implementation, the pins extend from the side of the encapsulant facing the circuit board and penetrate through the circuit board along the thickness direction of the circuit board.

[0031] In this way, it is beneficial to reducing the stress at the connection position of the pins on the circuit board, beneficial to reducing the deformation degree of the circuit board, and beneficial to improving the area utilization rate of the circuit board.

[0032] In a possible implementation, part of the pins extend from one side of the encapsulant in the first direction, part is located outside the encapsulant and penetrates through the circuit board along the thickness direction of the circuit board, and the first direction is perpendicular to the thickness direction of the circuit board.

[0033] In this way, it is possible to avoid the pins occupying the area on the side of the encapsulant facing the circuit board, beneficial to reducing the difficulty of arranging the support between the encapsulant and the circuit board, and moreover, the processing difficulty of arranging the pins on the substrate is low, beneficial to reducing the manufacturing difficulty of the power module and beneficial to reducing the processing cost.

[0034] In a possible implementation, the number of pins is multiple. In the direction perpendicular to the thickness direction of the circuit board, a part of the multiple pins is located on one side of the power device, and the other part is located on the other side of the power device.

[0035] In this way, the stress applied to the power module due to the assembly of the heat sink and the circuit board can be shared by the multiple pins located on both sides of the power device, beneficial to reducing the stress applied to the connection position of each pin and the circuit board, and beneficial to reducing the micro-deformation degree of the circuit board.

[0036] In a second aspect, an embodiment of the present application further provides a power module. The power module is used to be installed on a circuit board. The power module includes a substrate, pins, a power device, and an encapsulant. In the thickness direction of the substrate, the power device and the pins are both arranged on the side of the substrate facing the circuit board. The encapsulant covers at least part of the substrate, the power device, and part of the pins. The pins penetrate through the circuit board along the thickness direction of the substrate. At least one support is provided on the side of the encapsulant facing the circuit board. Along the thickness direction of the circuit board, one side of the support is fixedly connected to the encapsulant, and the other side abuts against the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the following will describe the drawings required to be used in the embodiments of the present application or the background art.

[0038] Figure 1 It is a three-dimensional structural schematic diagram of a power conversion device provided by an embodiment of the present application;

[0039] Figure 2 is Figure 1 A three-dimensional structural schematic diagram of the power module, support body and abutting member of the power conversion device shown;

[0040] Figure 3 is Figure 1 A structural schematic diagram of the power conversion device shown cut along line A-A;

[0041] Figure 4 is Figure 1 A structural schematic diagram of the power conversion device shown cut along line B-B;

[0042] Figure 5 It is a structural schematic diagram of another power conversion device provided by an embodiment of the present application;

[0043] Figure 6 is Figure 5 A three-dimensional structural schematic diagram of the power module and support body of the power conversion device shown;

[0044] Figure 7 It is a structural schematic diagram of another power conversion device provided by an embodiment of the present application;

[0045] Figure 8 It is a structural schematic diagram of another power conversion device provided by an embodiment of the present application;

[0046] Figure 9 It is a structural schematic diagram of another power conversion device provided by an embodiment of the present application;

[0047] Figure 10 It is a structural schematic diagram of another power conversion device provided by an embodiment of the present application;

[0048] Figure 11 It is a structural schematic diagram of another power conversion device provided by an embodiment of the present application;

[0049] Figure 12 It is a structural schematic diagram of another power conversion device provided by an embodiment of the present application;

[0050] Figure 13 is Figure 12 A three-dimensional structural schematic diagram of the power module and support body of the power conversion device shown. Detailed implementation manners

[0051] Embodiments of the present application provide a power module and a power conversion device. The power module is applied to the power conversion device. The power conversion device is an electronic device for voltage conversion and voltage transformation.

[0052] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

[0053] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 , Figure 1 which is a schematic three-dimensional structure diagram of a power conversion device 100 provided by the embodiments of the present application. Figure 2 is Figure 1 a schematic three-dimensional structure diagram of the power module 20, the support body 50 and the abutting member 60 of the power conversion device 100 shown in Figure 3 is Figure 1 a schematic cross-sectional structure diagram of the power conversion device 100 cut along the A-A line shown in Figure 4 is Figure 1 a schematic cross-sectional structure diagram of the power conversion device 100 cut along the B-B line shown in

[0054] As shown in Figure 1 、 Figure 2 and Figure 3 exemplarily, the power conversion device 100 is an inverter, specifically a photovoltaic inverter. The power conversion device 100 can be used to convert the direct current output by the photovoltaic module into alternating current and supply it to an AC load (or the power grid). In some other embodiments, the power conversion device 100 can also be a rectifier, and the power conversion device 100 can be used to convert the alternating current output by the power grid (or AC power supply) into direct current to supply a DC load (such as an electronic device that can receive direct current like a battery or a motor controller, etc.). In some other embodiments, the power conversion device 100 can also be a transformer, and the power conversion device 100 is used to step up or step down the current. The power conversion device 100 can be applied to blade power supplies, UPS (Uninterruptible Power Supply), server power supplies, or charging piles, etc.

[0055] The power conversion device 100 includes a circuit board 10, a power module 20, and a heat sink 30. For ease of description, in the embodiments of the present application, the direction perpendicular to the thickness direction of the circuit board 10 (i.e., the X-axis direction shown in the figure) is defined as the first direction (the Z-axis direction shown in the figure), and the direction perpendicular to both the thickness direction of the circuit board 10 and the first direction is defined as the second direction (the Y-axis direction shown in the figure), that is, the first direction, the second direction, and the thickness direction of the circuit board 10 are perpendicular to each other. In this embodiment, the first direction is the length direction of the circuit board 10, and the second direction is the width direction of the circuit board 10. In some other embodiments, the first direction may also be the width direction of the circuit board 10, and the second direction is the length direction of the circuit board 10.

[0056] In the X-axis direction (i.e., the thickness direction of the circuit board 10), the power module 20, the circuit board 10, and the heat sink 30 are arranged in sequence, and the heat sink 30 is fixedly connected to the circuit board 10 and abuts against the side of the power module 20 facing away from the circuit board 10. Specifically, the power conversion device 100 further includes a fastener 40, and the heat sink 30 is fixedly connected to the circuit board 10 through the fastener 40. Among them, the circuit board 10 is provided with a mounting hole 11, and the mounting hole 11 penetrates the circuit board 10 along the X-axis direction. The heat sink 30 is provided with a mating mounting hole 31, and the mating mounting hole 31 extends along the X-axis direction from the side of the heat sink 30 facing the circuit board 10. The fastener 40 passes through the mounting hole 11 and is fixedly connected to the mating mounting hole 31, and abuts against the side of the circuit board 10 facing away from the heat sink 30. The projection of the fastener 40 along the X-axis direction is spaced from the projection of the power module 20 along the X-axis direction. The number of the fastener 40, the mounting hole 11, and the mating mounting hole 31 can be 1, 2, or more, and the fastener 40, the mounting hole 11, and the mating mounting hole 31 correspond to each other one by one. In some other embodiments, it is also possible that the side of the heat sink 30 facing the circuit board 10 is provided with a protrusion, and the protrusion is fixedly connected to the circuit board 10 by means including but not limited to welding, gluing, or clamping.

[0057] The power module 20 includes a substrate 21, pins 22, a power device 23, and a plastic package 24. In this embodiment, the thickness direction of the substrate 21 is parallel to the X-axis direction. In the X-axis direction (i.e., the thickness direction of the substrate 21), the substrate 21 is spaced apart from the circuit board 10, and the power device 23 and the pins 22 are both disposed on the side of the substrate 21 facing the circuit board 10. Specifically, the power device 23 is fixedly laminated with the substrate 21, and the pins 22 are in contact with and fixedly connected to the substrate 21. The plastic package 24 covers at least part of the substrate 21, the power device 23, and part of the pins 22, and the pins 22 are disposed through the circuit board 10 in the X-axis direction (the thickness direction of the circuit board 10, which is also the thickness direction of the substrate 21). The heat sink 30 abuts against the side of the substrate 21 facing away from the circuit board 10. Specifically, the heat sink 30 is fixedly laminated on the side of the substrate 21 facing away from the circuit board 10 and is fixedly connected to the plastic package 24. In the X-axis direction, the plastic package 24 is spaced apart from the circuit board 10.

[0058] Among them, the power device 23 can be used to convert the direct current output by the photovoltaic module into alternating current to supply an AC load (or the power grid). The power device 23 realizes the power conversion function of the power conversion device 100. The power device 23 can be a power conversion device such as a diode, a triode, or a chip. The power device 23 can be made of silicon carbide or silicon. The pins 22 can be made of conductive materials such as copper, aluminum, or iron. Exemplarily, the number of the pins 22 is multiple, and the multiple pins 22 are sequentially spaced apart in the Y-axis direction. In this way, the processing difficulty is low, it is convenient for manufacturing, and it is beneficial to reduce the processing cost.

[0059] Exemplarily, the substrate 21 is an insulating substrate. The substrate 21 includes an insulating layer 211, a first metal layer 212, and a second metal layer 213. The insulating layer 211 can be made of insulating materials including but not limited to ceramics or epoxy resins. The first metal layer 212 and the second metal layer 213 can be made of metal materials including but not limited to copper, aluminum, or iron. In the X-axis direction, the first metal layer 212 and the second metal layer 213 are fixedly laminated on both sides of the insulating layer 211. The power device 23 is fixedly laminated on the side of the first metal layer 212 facing away from the insulating layer 211. The pins 22 are fixedly connected to the side of the first metal layer 212 facing away from the insulating layer 211. The second metal layer 213 is fixedly laminated with the heat sink 30.

[0060] Wherein, a heat conduction layer 25 is provided between the second metal layer 213 and the heat sink 30. The heat conduction layer 25 is fixedly laminated between the second metal layer 213 and the heat sink 30. The entire substrate 21 is covered by the encapsulant 24. The heat conduction layer 25 is partially covered by the encapsulant 24. One side of the heat conduction layer 25 facing away from the substrate 21 is exposed outside the encapsulant 24. The heat conduction layer 25 can be made of heat conductive materials including but not limited to heat conductive silicone grease, sintered silver, sintered copper or tin. The heat generated by the operation of the power device 23 can be sequentially transferred to the heat sink 30 through the substrate 21 and the heat conduction layer 25, and then transferred to the external environment to achieve heat dissipation of the power device 23. In some other embodiments, the heat conduction layer 25 can also be omitted. The substrate 21 is partially covered by the encapsulant 24, and one side of the substrate 21 facing away from the circuit board 10 is exposed outside the encapsulant 24. The substrate 21 is in contact with the heat sink 30 and fixedly laminated.

[0061] At least one support 50 is provided between the encapsulant 24 and the circuit board 10. Along the Z-axis direction (the thickness direction of the circuit board 10, that is, the thickness direction of the substrate 21), the support 50 is fixedly connected to one of the encapsulant 24 and the circuit board 10, and abuts against the other of the encapsulant 24 and the circuit board 10. Specifically, one side of the support 50 is fixedly connected to one of the encapsulant 24 and the circuit board 10, and the other side of the support 50 abuts against the other of the encapsulant 24 and the circuit board 10. Exemplarily, the support 50 is fixedly connected to the encapsulant 24 and abuts against the circuit board 10. One side of the support 50 is fixedly connected to the encapsulant 24, and the other side of the support 50 abuts against the circuit board 10. Wherein, the encapsulant 24 includes a mating surface 240, and the mating surface 240 faces the circuit board 10 and is fixedly connected to the support 50. Specifically, the support 50 is fixedly laminated with the mating surface 240 (encapsulant 24), and is laminated and abuts against the circuit board 10. That is to say, along the Z-axis direction (the thickness direction of the circuit board 10, that is, the thickness direction of the substrate 21), one side of the support 50 is fixedly connected to the encapsulant 24 and abuts against the circuit board 10. Wherein, the encapsulant 24 and the support 50 are integrally formed. This is beneficial to improving the connection strength between the support 50 and the encapsulant 24, and is beneficial to improving the structural stability and reliability.

[0062] In some other embodiments, the encapsulant 24 can also be fixedly connected to the circuit board 10 and in contact with the encapsulant 24. The encapsulant 24 can be integrally formed with the circuit board 10. In some other embodiments, the support 50 can also be disposed between the encapsulant 24 and the circuit board 10 by means including but not limited to welding, bonding or snap connection.

[0063] In the power conversion device 100 provided by the embodiment of the present application, the heat generated by the operation of the power device 23 can be transferred to the heat sink 30 through the substrate 21 and then to the external environment to achieve heat dissipation of the power device 23. In the existing power conversion device 100, first, the pins 22 of the power module 20 are mounted on the circuit board 10 so that the power device 23 of the power module 20 faces the circuit board 10, and then the heat sink 30 is mounted on the circuit board 10. An interference fit is often provided between the heat sink 30 and the circuit board 10 to ensure close contact between the power module 20 and the heat sink 30 to improve the reliability of heat dissipation. A large stress is applied at the connection position between the pins 22 of the power module 20 and the circuit board 10, resulting in micro-deformation of the circuit board 10. To reduce the micro-deformation of the circuit board 10, the length of the pins 22 is set very long, resulting in a large parasitic inductance of the pins 22 and poor electrical performance of the power module 20 and the power conversion device 100.

[0064] In the embodiment of the present application, along the Z-axis direction (the thickness direction of the circuit board 10, that is, the thickness direction of the substrate 21), one side of the support body 50 is fixedly connected to one of the plastic package 24 and the circuit board 10, and the other side of the support body 50 abuts against the other of the plastic package 24 and the circuit board 10. The support body 50 can support the circuit board 10. On the one hand, it is beneficial to reduce the micro-deformation of the part of the circuit board 10 around the pins 22, and devices can be arranged around the pins 22 of the circuit board 10, which is beneficial to improving the area utilization rate of the circuit board 10; on the other hand, it is possible to avoid setting the pins 22 too long, which is beneficial to reducing the parasitic inductance and beneficial to improving the electrical performance of the power module 20 and the power conversion device 100. In addition, through the support body 50, it is possible to ensure close contact between the power module 20 and the heat sink 30, which is beneficial to increasing the contact area between the power module 20 and the heat sink 30 and beneficial to improving the heat dissipation efficiency of the power device 23; and it is possible to avoid setting additional fasteners, which is beneficial to simplifying the structure of the power conversion device 100 and beneficial to reducing the processing cost of the power conversion device 100.

[0065] In some embodiments, the strength of the support body 50 is greater than or equal to the strength of the plastic package 24 and greater than or equal to the strength of the circuit board 10. In this way, it is avoided that the support body 50 is deformed during the process of supporting the circuit board 10, ensuring that the support body 50 can provide stable support for the circuit board 10, which is beneficial to improving the structural stability and reliability of the support body 50. Moreover, the amount of interference fit between the heat sink and the circuit board 10 can be designed higher, and the support body 50, the circuit board 10 and the plastic package 24 can be in closer contact, which is beneficial to improving the support effect of the support body 50 on the circuit board 10.

[0066] In some embodiments, the support body 50, the circuit board 10, and the encapsulant 24 are stacked. The dimension of the support body 50 in the X-axis direction (i.e., the thickness direction of the circuit board 10) is smaller than the dimension of the encapsulant 24 in the X-axis direction (i.e., the thickness direction of the circuit board 10). In this way, on the basis of ensuring that the support body 50 can provide stable support for the circuit board 10, it is beneficial to reduce the dimension of the support body 50 in the X-axis direction (i.e., the thickness direction of the circuit board 10), which is beneficial to reducing the dimension of the power conversion device 100 in the X-axis direction (i.e., the thickness direction of the circuit board 10), and is beneficial to the miniaturization design and lightweight design of the power conversion device 100.

[0067] In some embodiments, the area of the projection of the support body 50 in the X-axis direction (i.e., the thickness direction of the circuit board 10) is smaller than the area of the projection of the encapsulant 24 in the X-axis direction (i.e., the thickness direction of the circuit board 10). In this way, on the basis of ensuring that the support body 50 can provide stable support for the circuit board 10, it is possible to prevent the support body 50 from completely occupying the part of the circuit board 10 opposite to the encapsulant 24, and devices can also be arranged on the side of the part of the circuit board 10 opposite to the encapsulant 24 facing the encapsulant 24, which is beneficial to improving the area utilization rate of the circuit board 10; moreover, it is beneficial to reducing the volume of the support body 50 and is beneficial to the lightweight design of the power conversion device 100. In some other embodiments, the area of the projection of the support body 50 in the X-axis direction (i.e., the thickness direction of the circuit board 10) may also be equal to the area of the projection of the encapsulant 24 in the X-axis direction (i.e., the thickness direction of the circuit board 10).

[0068] In some embodiments, the area of the projection of the support body 50 in the X-axis direction (i.e., the thickness direction of the circuit board 10) is larger than the area of the projection of the part where the pin 22 penetrates through the circuit board 10 in the X-axis direction (i.e., the thickness direction of the circuit board 10). In this way, it is ensured that the support body 50 has a large contact area with both the circuit board 10 and the encapsulant 24, which is beneficial to improving the structural stability of the support body 50, beneficial to improving the support effect of the support body 50 on the circuit board 10, beneficial to reducing the deformation degree of the circuit board 10, and beneficial to improving the area utilization rate of the circuit board 10. Moreover, it is easy to manufacture and beneficial to reducing the processing cost.

[0069] Further, part of the pin 22 extends out from one side of the encapsulant 24 in the Z-axis direction (i.e., the first direction), and part is located outside the encapsulant 24 and penetrates through the circuit board 10 in the X-axis direction (i.e., the thickness direction of the circuit board 10). In this way, it is possible to prevent the pin 22 from occupying the area of the side of the encapsulant 24 facing the circuit board 10 (the mating surface 240), which is beneficial to reducing the difficulty of arranging the support body 50 between the encapsulant 24 and the circuit board 10. Moreover, the processing difficulty of arranging the pin 22 on the substrate 21 is low, which is beneficial to reducing the manufacturing difficulty of the power module 20 and beneficial to reducing the processing cost.

[0070] InFigure 1 , Figure 2 and Figure 3 In the embodiments shown in Figure 3 , the pin 22 includes a first portion 221 and a second portion 222. In the X-axis direction, the second portion 222 is fixedly connected to one side of the first portion 221. The first portion 221 is fixedly laminated on one side of the substrate 21 facing the circuit board 10 and extends out from one side of the plastic package 24 in the Z-axis direction along the Z-axis direction. The second portion 222 extends along the X-axis direction and penetrates through the circuit board 10. Among them, a part of the second portion 222 is located on the side of the circuit board 10 facing away from the heat sink 30, a part is located in the circuit board 10, and a part is located between the circuit board 10 and the first portion 221. The area of the projection of the support 50 along the X-axis direction is larger than the area of the projection of the second portion 222 along the X-axis direction.

[0071] In some embodiments, in the direction perpendicular to the Z-axis direction (i.e., the thickness direction of the circuit board 10), at least one support 50 is close to the side of the plastic package 24 away from the pin 22. Specifically, the mating surface 240 is a rectangular surface. In the Z-axis direction, the support 50 is close to the side of the mating surface 240 facing away from the pin 22. Among them, the surface of the support 50 facing away from the second portion 222 (i.e., the pin 22) is aligned with the side of the mating surface 240 facing away from the second portion 222 (i.e., the pin 22). The degree of deformation of the part of the circuit board 10 between the pin 22 and the support 50 is small. In this way, it is beneficial to increase the area of the part of the circuit board 10 between the pin 22 and the support 50, facilitate the arrangement of devices on the part of the circuit board 10 between the pin 22 and the support 50, and is beneficial to improving the area utilization rate of the circuit board 10.

[0072] In some embodiments, in the direction perpendicular to the Z-axis direction (i.e., the thickness direction of the circuit board 10), at least one support 50 is close to the side of the plastic package 24 close to the pin 22. Specifically, in the Z-axis direction, the support 50 is close to the side of the mating surface 240 facing the second portion 222 (i.e., the pin 22). Among them, the surface of the support 50 facing the pin 22 is aligned with the side of the mating surface 240 facing the second portion 222 (i.e., the pin 22). In this way, the support strength of the support 50 for the part of the circuit board 10 around the pin 22 is higher, which is beneficial to reducing the degree of deformation of the part of the circuit board 10 between the pin 22 and the support 50.

[0073] In some embodiments, at least one support 50 is located at the corner of the mating surface 240 (i.e., the surface of the plastic package 24 facing the circuit board 10). In this way, it is convenient to set the support 50 between the circuit board 10 and the plastic package 24, convenient to position the support 50, and beneficial to reducing the design cost and processing cost of the support 50.

[0074] In Figure 1 , Figure 2 and Figure 3In the illustrated embodiment, at least one support 50 includes at least one first support 50a and at least one second support 50b. In the Z-axis direction (i.e., the first direction), at least one first support 50a is closer to the side of the encapsulant 24 away from the pins 22, and at least one second support 50b is closer to the side of the encapsulant 24 close to the pins 22. In the Y-axis direction (i.e., the second direction), at least one second support 50b is spaced apart from at least one first support 50a. Among them, in the Z-axis direction, the first support 50a is close to the side of the mating surface 240 facing away from the second part 222 (i.e., the pins 22), and the surface of the first support 50a facing away from the second part 222 (i.e., the pins 22) is aligned with the side of the mating surface 240 facing away from the second part 222 (i.e., the pins 22). The second support 50b is close to the side of the mating surface 240 facing the second part 222 (i.e., the pins 22). And the surface of the second support 50b facing the second part 222 (i.e., the pins 22) is aligned with the side of the mating surface 240 facing the second part 222 (i.e., the pins 22).

[0075] Exemplarily, the number of the first supports 50a and the number of the second supports 50b are both multiple, specifically both 2. In some other embodiments, the number of the first supports 50a and the number of the second supports 50b may also be 1, 3 or more. The multiple first supports 50a are spaced apart in the Y-axis direction. The multiple second supports 50b are spaced apart in the Y-axis direction. In the Y-axis direction, one second support 50b is located on one side of the multiple first supports 50a and is spaced apart from the multiple first supports 50a, and the other second support 50b is located on the other side of the multiple first supports 50a and is spaced apart from the multiple first supports 50a.

[0076] In this way, both the first support 50a and the second support 50b can support the circuit board 10. Moreover, the first support 50a and the second support 50b distributed in this way can support more parts of the circuit board 10, which is beneficial to improving the support effect of the multiple supports 50 and reducing the degree of micro-deformation of the circuit board 10.

[0077] Two of the plurality of second supports 50b are respectively located at two adjacent corners of the mating surface 240 (i.e., the surface of the encapsulant 24 facing the circuit board 10). In this way, it is beneficial to improve the supporting effect of the plurality of second supports 50b on the circuit board 10 and is beneficial to reducing the degree of micro-deformation of the circuit board 10. Specifically, the mating surface 240 includes a first corner 241, a second corner 242, a third corner 243, and a fourth corner 244. In the Z-axis direction, the first corner 241 and the second corner 242 are close to the pins 22, and the third corner 243 and the fourth corner 244 are far from the pins 22. In the Y-axis direction, the first corner 241 and the second corner 242 are spaced apart. The fourth corner 244 and the second corner 242 are spaced apart. Among them, one second support 50b is located at the first corner 241, and the other second support 50b is located at the second corner 242. Two first supports 50a are located between the third corner 243 and the fourth corner 244. In some other embodiments, the two first supports 50a may also be respectively located at the third corner 243 and the fourth corner 244.

[0078] In some embodiments, at least one support 50 further includes at least one third support 50c, and at least one third support 50c is located between the first support 50a and the second support 50b. In this way, the part corresponding to the middle part of the circuit board 10 and the encapsulant 24 can be supported, which is beneficial to reducing the degree of micro-deformation of the circuit board 10. Exemplarily, the number of the third supports 50c is multiple, specifically 3. In some other embodiments, the number of the third supports 50c may also be 1, 2, or more. In the Y-axis direction, one second support 50b is located on one side of the plurality of third supports 50c and is spaced apart from the plurality of third supports 50c, and the other second support 50b is located on the other side of the plurality of third supports 50c and is spaced apart from the plurality of third supports 50c. Among them, the projection of the plurality of third supports 50c in the Z-axis direction overlaps with the projection of the plurality of first supports 50a in the Z-axis direction. In some other embodiments, they may not overlap. The dimensions of the first support 50a, the second support 50b, and the third support 50c in the X-axis direction are all equal.

[0079] Such as Figure 1 、 Figure 2 and Figure 4As shown, in some embodiments, the power conversion device 100 further includes an abutting member 60, and the plastic package 24 abuts between the abutting member 60 and the heat sink 30. Further, the circuit board 10 is provided with a first through hole 12, and the first through hole 12 penetrates the circuit board 10 along the X-axis direction (i.e., the thickness direction of the circuit board 10), and the abutting member 60 is disposed opposite to the first through hole 12. In this way, the heat sink 30 can be ensured to be in close contact with the power module 20 through the abutting member 60, which is beneficial to increasing the contact area between the power module 20 and the heat sink 30 and improving the heat dissipation efficiency of the power device 23. Moreover, the abutting member 60 can pass through the circuit board 10 through the first through hole 12, which can avoid leaving too much installation space between the circuit board 10 and the plastic package 24 and is beneficial to the miniaturization design of the power conversion device 100.

[0080] In Figure 1 , Figure 2 and Figure 4 In the embodiments shown, in the Z-axis direction, the first through hole 12 is located between the first support 50a and the third support 50c. The power module 20 is provided with a mating hole 26, and the mating hole 26 penetrates the plastic package 24, the substrate 21, and the heat conducting layer 25 along the X-axis direction. In the X-axis direction, the mating hole 26 is disposed opposite to the first through hole 12. Specifically, the projection of the mating hole 26 along the X-axis direction overlaps with the projection of the first through hole 12 along the X-axis direction. The heat sink 30 is provided with a connection hole 32, and the connection hole 32 extends from the side of the heat sink 30 facing the circuit board 10 along the X-axis direction and communicates with the mating hole 26. Exemplarily, the abutting member 60 is a screw. The abutting member 60 passes through the circuit board 10 from the side of the circuit board 10 facing away from the heat sink 30 through the first through hole 12, and a part of the abutting member 60 is disposed through the mating hole 26 and the connection hole 32 and is threadedly connected to the connection hole 32; the other part abuts against the side of the mating surface 240 facing the circuit board 10. In the Z-axis direction, the abutting member 60 is located between the third support 50c and the first support 50a.

[0081] In this way, the plastic package 24 can be abutted between the abutting member 60 and the heat sink 30 through the threaded connection between the abutting member 60 and the connection hole 32, so as to ensure that the heat conducting layer 25 can be in close contact with the heat sink 30, which is beneficial to increasing the contact area between the heat conducting layer 25 and the heat sink 30 and improving the heat dissipation efficiency of the power device 23. In some other embodiments, the abutting member 60 can also be a pressing member such as a spring or a spring clip, and the abutting member 60 abuts between the circuit board 10 and the plastic package 24.

[0082] Such as Figure 1 , Figure 3 and Figure 4As shown, in some embodiments, the circuit board 10 is further provided with a stress sensor device 70. The stress sensor device 70 is located on one side of the circuit board 10 in the X-axis direction (i.e., the thickness direction of the circuit board 10). The projection of the stress sensor device 70 in the X-axis direction (i.e., the thickness direction of the circuit board 10) overlaps with the projection of the power module 20 in the X-axis direction (i.e., the thickness direction of the circuit board 10). Due to the support of the support body 50, the degree of deformation of the part of the circuit board 10 opposite to the power module 20 is small. With such a design, on the one hand, it can locate the position where the stress sensor device 70 is to be set, facilitating the arrangement of the stress sensor device 70 on the circuit board 10, and is beneficial to reducing the risk of damage to the stress sensor device 70 arranged on the circuit board 10 due to the micro-deformation of the circuit board 10; on the other hand, the stress sensor device 70 is close to the pin 22 of the power module 20, which is beneficial to improving the current-carrying performance between the stress sensor device 70 and the pin 22 of the power module 20, and is beneficial to improving the electrical performance of the stress sensor device 70 and the power conversion device 100. Exemplarily, the stress sensor device 70 is a capacitor. Specifically, it is a ceramic capacitor. The stress sensor device 70 is used to filter the current output by the power device 23. In some other embodiments, the stress sensor device 70 can also be other electronic devices such as a magnetic bead or a crystal oscillator.

[0083] Further, the projection of the stress sensor device 70 in the X-axis direction (i.e., the thickness direction of the circuit board 10) is located between the projection of the third support body 50c (i.e., the support body 50) in the X-axis direction (i.e., the thickness direction of the circuit board 10) and the projection of the pin 22 in the X-axis direction (i.e., the thickness direction of the circuit board 10). Specifically, the projection of the stress sensor device 70 in the X-axis direction is located between the projection of the third support body 50c (i.e., the support body 50) in the X-axis direction and the projection of the second part 222 of the pin 22 in the X-axis direction. The degree of deformation of the part of the circuit board 10 between the third support body 50c (i.e., the support body 50) and the pin 22 is small. With such a design, it is beneficial to reducing the risk of damage to the stress sensor device 70 arranged on the circuit board 10 due to the micro-deformation of the circuit board 10, and is beneficial to improving the reliability of the stress sensor device 70.

[0084] In Figure 1 、 Figure 3 and Figure 4 In the embodiments shown, the stress sensor device 70 is fixedly connected to the side of the circuit board 10 facing away from the radiator 30. The projection of the stress sensor device 70 in the X-axis direction overlaps with the projection of the plastic package 24 in the X-axis direction, and is spaced from the projection of the pin 22 in the X-axis direction. In the Z-axis direction, the stress sensor device 70 is located between the third support body 50c and the second support body 50b. Among them, the projection of the stress sensor device 70 in the X-axis direction is spaced from the projection of the third support body 50c in the X-axis direction and the projection of the second support body 50b in the X-axis direction.

[0085] In some other embodiments, the stress sensor device 70 may also be fixedly connected to the side of the circuit board 10 facing the heat sink 30. The projection of the stress sensor device 70 in the X-axis direction may also overlap with the projection of the third support 50c in the X-axis direction and the projection of the second support 50b in the X-axis direction. The stress sensor device 70 may also be disposed between the second support 50b and the second portion 222 of the pin 22, and the projection of the stress sensor device 70 in the X-axis direction may also overlap with the projection of the first portion 221 in the X-axis direction.

[0086] Please refer to Figure 5 and Figure 6 , and in combination with Figure 4 , Figure 5 FIG. is a schematic structural diagram of another power conversion device 100 provided by an embodiment of the present application. Figure 6 is Figure 5 a three-dimensional structural diagram of the power module 20 and the support 50 of the power conversion device 100 shown in

[0087] As shown in Figure 4 , Figure 5 and Figure 6 , Figure 5 and Figure 6 the embodiments shown in Figure 4 are similar in structure to the embodiment shown in Figure 5 and Figure 6 . The difference between the two is that the number of supports 50 is different, and the first through hole 12 and the abutting member 60 can be omitted. In the embodiments shown in

[0088] It can be understood that Figure 5 and Figure 6 in the embodiments shown in Figures 1 - 4 any one of the embodiments shown, the design in which the number of supports 50 is 1 and the first through hole 12 and the abutting member 60 are omitted can be applied to

[0089] Please refer to Figure 7 and in combination with Figure 5 , Figure 7 FIG. is a schematic structural diagram of another power conversion device 100 provided by an embodiment of the present application.

[0090] As Figure 5 and Figure 7 shown Figure 7 The illustrated embodiment and Figure 5 the illustrated embodiment have a similar structure. The difference between the two is that the arrangement of the multiple pins 22 is different. In Figure 7 the illustrated embodiment, in the Z-axis direction (i.e., the direction perpendicular to the thickness direction of the circuit board 10), a part of the multiple pins 22 is located on one side of the power device 23, and the other part is located on the other side of the power device 23. In this way, the stress applied to the power module 20 due to the assembly of the heat sink 30 and the circuit board 10 can be shared by the multiple pins 22 located on both sides of the power device 23, which is beneficial to reducing the stress applied to the connection position of each pin 22 and the circuit board 10, and is beneficial to reducing the degree of micro-deformation of the circuit board 10.

[0091] Specifically, the multiple pins 22 include a first pin 22a and a second pin 22b. The first part 221 of the first pin 22a is fixedly laminated on the side of the substrate 21 facing the circuit board 10 and is located on one side of the power device 23 in the Z-axis direction, and extends from one side of the plastic package 24 in the Z-axis direction along the Z-axis direction. The second part 222 is fixedly connected to the first part 221 and penetrates through the circuit board 10 along the X-axis direction. The first part 221 of the second pin 22b is fixedly laminated on the side of the substrate 21 facing the circuit board 10 and is located on the other side of the power device 23 in the Z-axis direction, and extends from the other side of the plastic package 24 in the Z-axis direction along the Z-axis direction. The second part 222 is fixedly connected to the first part 221 and penetrates through the circuit board 10 along the X-axis direction. The number of the first pins 22a and the number of the second pins 22b can both be multiple. The multiple first pins 22a are sequentially arranged at intervals along the Y-axis direction. The multiple second pins 22b are sequentially arranged at intervals along the Y-axis direction.

[0092] It can be understood that Figure 7 the design in which pins 22 are arranged on both sides of the power device 23 in the illustrated embodiment can be applied to Figures 1 - 6 any of the illustrated embodiments.

[0093] Please refer to Figure 8 and in combination with Figure 5 , Figure 8 FIG. is a schematic structural diagram of another power conversion device 100 provided by an embodiment of the present application.

[0094] As Figure 5 and Figure 8 shown Figure 8 the illustrated embodiment and Figure 5 the illustrated embodiment have a similar structure. The difference between the two is that the arrangement of the pins 22 is different. In Figure 8In the illustrated embodiment, all the pins 22 extend along the X-axis direction. The pins 22 are fixedly stacked on one side of the substrate 21 facing the circuit board 10 and are spaced apart from the power device 23 in the Z-axis direction. The pins 22 extend from one side of the plastic package 24 facing the circuit board 10 and penetrate through the circuit board 10 along the X-axis direction (i.e., the thickness direction of the circuit board 10). Among them, the pins 22 are close to one side of the plastic package 24 in the Z-axis direction. In this way, it is beneficial to reduce the stress at the connection position of the pins 22 on the circuit board 10, beneficial to reduce the deformation degree of the circuit board 10, and beneficial to improve the area utilization rate of the circuit board 10.

[0095] It can be understood that Figure 8 in the illustrated embodiment, the design that the pins 22 extend from one side of the plastic package 24 facing the circuit board 10 can be applied to Figures 1 - 7 any of the illustrated embodiments.

[0096] Please refer to Figure 9 and in combination with Figure 5 Figure 9 which is a schematic structural diagram of another power conversion device 100 provided by an embodiment of the present application.

[0097] As Figure 5 and Figure 9 shown, Figure 9 the structure of the illustrated embodiment is similar to that of Figure 5 the illustrated embodiment. The difference between the two is that the setting and cooperation relationship of the substrate 21 are different, and the heat-conducting layer 25 can be omitted. In Figure 9 the illustrated embodiment, the substrate 21 is a metal plate. The substrate 21 can be made of conductive metal materials such as copper, aluminum, or iron. Part of the substrate 21 is covered by the plastic package 24, and the side of the substrate 21 facing away from the circuit board 10 is exposed outside the plastic package 24. An insulator 80 is further provided between the substrate 21 and the radiator 30, and the insulator 80 is fixedly stacked with the substrate 21 and the radiator 30. The plastic package 24 is fixedly connected to one side of the insulator 80 facing away from the radiator 30. The insulator 80 can be made of insulating materials with good heat-conducting performance including but not limited to ceramics, rubber, or alumina. In this way, the heat generated by the operation of the power device 23 can be transferred to the radiator 30 through the substrate 21 and the insulator 80, and then transferred to the external environment to achieve heat dissipation of the power device 23. The structure of the substrate 21 is diverse, and a suitable substrate 21 can be selected according to actual needs.

[0098] It can be understood that Figure 9 in the illustrated embodiment, the design that the substrate 21 is a metal plate and the insulator 80 is provided between the substrate 21 and the radiator 30 can be applied to Figures 1 - 8 the illustrated embodiment.

[0099] Please refer to Figure 10 and in combination with Figure 4 ​Figure 10 It is a schematic structural diagram of another power conversion device 100 provided by an embodiment of the present application.

[0100] As Figure 4 and Figure 10 shown, Figure 10 The embodiment shown is similar in structure to the embodiment shown in Figure 4 The difference between the two is that the number of support bodies 50 is different, the position of the abutting member 60 is different, and correspondingly, the position of the first through hole 12 is different. In the embodiment shown in Figure 10 the number of support bodies 50 is 1. In the Z-axis direction (i.e., the direction perpendicular to the thickness direction of the circuit board 10), the first through hole 12 is located on the side of the support body 50 away from the pin 22, and the abutting member 60 is located on the side of the support body 50 away from the pin 22 and is spaced apart from the support body 50. Among them, the abutting member 60 is located at the edge of the plastic package 24 on the side away from the pin 22. In this way, the first through hole 12 can be arranged on the side of the support body 50 away from the pin 22, ensuring that the degree of deformation of the part of the circuit board 10 located between the pin 22 and the support body 50 is very small, which is convenient for arranging devices (such as stress-sensitive devices 70) around the pin 22. In some other embodiments, the number of support bodies 50 can also be 2, 3 or more.

[0101] It can be understood that Figure 10 the design in the embodiment shown where the abutting member 60 is located on the side of the support body 50 away from the pin 22 can be applied to Figures 1 - 9 any of the embodiments shown.

[0102] Please refer to Figure 11 and in combination with Figure 4 , Figure 11 It is a schematic structural diagram of another power conversion device 100 provided by an embodiment of the present application.

[0103] As Figure 4 and Figure 11 shown, Figure 11 The embodiment shown is similar in structure to the embodiment shown in Figure 4 The difference between the two is that the number of support bodies 50 is different, the structure of the support body 50 is different, the position of the abutting member 60 is different, and correspondingly, the position of the first through hole 12 is different. In Figure 11In the illustrated embodiment, the number of the support bodies 50 is one. In the X-axis direction, the first through hole 12 is disposed opposite to the support body 50. Specifically, the projection of the first through hole 12 in the X-axis direction overlaps with the projection of the support body 50 in the X-axis direction. The support body 50 is further provided with a second through hole 51 which penetrates through the support body 50 in the X-axis direction (i.e., the thickness direction of the circuit board 10), communicates with the first through hole 12 and communicates with the mating hole 26. The abutting member 60 is at least partially received in the second through hole 51. Specifically, the abutting member 60 is partially disposed through the mating hole 26 and the connection hole 32, and partially received in the second through hole 51 and abuts against the surface of the encapsulant 24 facing the circuit board 10. In this way, it is beneficial to improve the space utilization rate of the abutting member 60 and the support body 50, and is beneficial to the miniaturized design of the power conversion device 100. Moreover, the distribution of the abutting member 60 affects the distribution of the first through hole 12, and further affects the supporting effect of the support body 50 on the circuit board 10. In this way, it is also beneficial to improve the supporting effect of the support body 50 on the circuit board 10 and is beneficial to reducing the deformation degree of the circuit board 10.

[0104] In some other embodiments, the abutting member 60 may also be a pressing member (such as a spring or a spring clip), the mating hole 26 and the connection hole 32 may be omitted, and the abutting member 60 may be entirely received in the second through hole 51 and abut between the encapsulant 24 and the circuit board 10. The abutting member 60 can also achieve close contact between the power module 20 and the heat sink 30.

[0105] It can be understood that Figure 11 the design that the abutting member 60 is at least partially received in the second through hole 51 of the support body 50 in the illustrated embodiment can be applied to Figures 1 - 10 any of the illustrated embodiments.

[0106] Please refer to Figure 12 and Figure 13 , and in combination with Figure 4 , Figure 12 which is a schematic structural diagram of another power conversion device 100 provided by an embodiment of the present application. Figure 13 It is Figure 12 a three-dimensional structural diagram of the power module 20 and the support body 50 of the power conversion device 100 shown.

[0107] As shown in Figure 4 , Figure 12 and Figure 13 shown, Figure 12 and Figure 13 the embodiments shown in Figure 4 are similar in structure to the embodiment shown in Figure 12 and Figure 13In the illustrated embodiment, the third support 50c may be omitted. The number of the first supports 50a is one. In the Z-axis direction (i.e., the first direction), the first support 50a is close to the side of the encapsulant 24 away from the pins 22. A plurality of second supports 50b are close to the side of the encapsulant 24 close to the pins 22. The plurality of second supports 50b are located on both sides of the first support 50a in the Y-axis direction (i.e., the second direction). Specifically, in the Y-axis direction, two second supports 50b are located on both sides of the first support 50a, and the distances between the first support 50a and the two second supports 50b are equal. In some other embodiments, they may not be equal. Among them, the two second supports 50b are located at adjacent corners of the surface of the encapsulant 24 facing the circuit board 10. Specifically, one second support 50b is located at the first corner 241, and the other second support 50b is located at the second corner 242. In this way, the degree of deformation of the part of the circuit board 10 between the pins 22 and the first support 50a and the part between the first support 50a and the second support 50b will be reduced. The arrangement and number of the supports 50 are diverse, and a suitable solution can be selected according to actual needs. The design of the support 50 has a low difficulty and a wide universality.

[0108] It can be understood that Figure 12 and Figure 13 the arrangement relationship between the first support 50a and the second support 50b in the illustrated embodiment and the design of omitting the third support 50c can be applied to Figures 1 - 11 any of the illustrated embodiments.

Claims

1. A power conversion device, characterized in that, The power conversion device includes a circuit board, a power module, and a heat sink. In the thickness direction of the circuit board, the power module is disposed between the circuit board and the heat sink; The power module includes a substrate, pins, power devices, and a plastic package. The power devices and the pins are both disposed on a side of the substrate facing the circuit board. The plastic package covers at least part of the substrate, the power devices, and part of the pins. The pins penetrate through the circuit board in the thickness direction of the circuit board, and the heat sink abuts against a side of the substrate facing away from the circuit board; At least one support is provided between the plastic package and the circuit board. In the thickness direction of the circuit board, one side of the support is fixedly connected to one of the plastic package and the circuit board, and the other side of the support abuts against the other of the plastic package and the circuit board.

2. The power conversion device according to claim 1, characterized in that, The circuit board is further provided with a stress sensor device. The stress sensor device is located on one side of the circuit board in the thickness direction of the circuit board. The projection of the stress sensor device in the thickness direction of the circuit board overlaps with the projection of the power module in the thickness direction of the circuit board.

3. The power conversion device according to claim 2, characterized in that, The projection of the stress sensor device in the thickness direction of the circuit board is located between the projection of the support in the thickness direction of the circuit board and the projection of the pins in the thickness direction of the circuit board.

4. The power conversion device according to any one of claims 1-3, characterized in that, The support is stacked with the circuit board and the plastic package, and the dimension of the support in the thickness direction of the circuit board is smaller than the dimension of the plastic package in the thickness direction of the circuit board.

5. The power conversion device according to any one of claims 1-4, characterized in that, The power conversion device further includes an abutting member. The plastic package abuts between the abutting member and the heat sink.

6. The power conversion device according to claim 5, characterized in that, The circuit board is provided with a first through hole that penetrates through the circuit board in the thickness direction of the circuit board. The first through hole is disposed opposite to the abutting member. In a direction perpendicular to the thickness direction of the circuit board, the abutting member is located on a side of the support away from the pins.

7. The power conversion device according to claim 5, characterized in that, The support is further provided with a second through hole that penetrates through the support in the thickness direction of the circuit board. At least part of the abutting member is received in the second through hole.

8. The power conversion device according to any one of claims 1-7, characterized in that, In a direction perpendicular to the thickness direction of the circuit board, at least one of the supports is close to a side of the plastic package away from the pins.

9. The power conversion device according to any one of claims 1-8, characterized in that, In a direction perpendicular to the thickness direction of the circuit board, at least one of the supports is close to a side of the plastic package close to the pins.

10. The power conversion device according to any one of claims 1-9, characterized in that, At least one of the supports is located at a corner of the surface of the plastic package facing the circuit board.

11. The power conversion device according to any one of claims 1-10, characterized in that, The pins extend from a side of the plastic package facing the circuit board and penetrate through the circuit board in the thickness direction of the circuit board.

12. The power conversion device according to any one of claims 1-10, characterized in that, Part of the pins extends from a side of the plastic package in a first direction, and part of the pins is located outside the plastic package and penetrates through the circuit board in the thickness direction of the circuit board. The first direction is perpendicular to the thickness direction of the circuit board.

13. The power conversion device according to any one of claims 1-12, characterized in that, The number of the pins is multiple. In a direction perpendicular to the thickness direction of the circuit board, a part of the multiple pins is located on one side of the power device, and the other part is located on the other side of the power device.

14. A power module for being mounted on a circuit board, characterized in that, The power module includes a substrate, pins, a power device, and a plastic package. In the thickness direction of the substrate, the power device and the pins are both arranged on the side of the substrate facing the circuit board. The plastic package covers at least part of the substrate, the power device, and part of the pins. The pins penetrate through the circuit board along the thickness direction of the substrate. At least one support is provided on the side of the plastic package facing the circuit board. In the thickness direction of the substrate, one surface of the support is fixedly connected to the plastic package, and the other surface abuts against the circuit board.

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