Power supply and electronic equipment

Abstract

The invention provides a power supply and electronic equipment, the power supply comprises a functional device, a filtering module and an electromagnetic shielding structure, the filtering module comprises a differential mode capacitor and a filtering device which are electrically connected with each other, and the differential mode capacitor is arranged close to an input port of the power supply and is electrically connected with the input port to form a differential mode loop structure; the electromagnetic shielding structure is arranged on one side, close to the filter device and the functional device, of the differential mode capacitor, so that the differential mode loop structure is electromagnetically isolated from the filter device and the functional device. According to the embodiment of the invention, the interference of the interference magnetic field generated by the functional device on the differential mode loop structure is reduced, so that the induction current generated by the interference magnetic field on the differential mode loop structure is reduced or eliminated, and the EMC performance and the use performance of the power supply are improved.

Description

Technical Field

[0001] This application belongs to the field of computing technology, and particularly relates to a power supply and an electronic device. Background Art

[0002] A switched-mode power supply (SMPS) is a power supply device that maintains a stable output voltage by controlling the time ratio of the switching tube to turn on and off. However, the EMC (Electro Magnetic Compatibility) performance of the switched-mode power supply directly affects the performance of the switched-mode power supply. Summary of the Invention

[0003] The purpose of the embodiments of this application is to provide a power supply and an electronic device, which can improve the EMC performance of the power supply, and thus have better performance in use.

[0004] The first aspect of the embodiments of this application proposes a power supply, including:

[0005] Functional devices;

[0006] A filtering module, arranged between the functional device and the input port of the power supply. The filtering module includes a common-mode capacitor and a filtering device that are electrically connected to each other, and the filtering device is electrically connected to the functional device; the common-mode capacitor is arranged close to the input port of the power supply and is electrically connected to the input port to form a common-mode loop structure;

[0007] An electromagnetic shielding structure, which is arranged on the side of the common-mode capacitor close to the filtering device and the functional device to electromagnetically isolate the common-mode loop structure from the filtering device and the functional device.

[0008] Exemplarily, the functional device is a device that generates a magnetic field during the operation of the power supply. In the embodiments of this application, the electromagnetic shielding structure is arranged between the common-mode capacitor and the functional device, thereby electromagnetically isolating the common-mode loop structure and the functional device, which is beneficial to reducing the interference of the interference magnetic field generated by the functional device on the common-mode loop structure, so as to reduce or eliminate the induced current generated on the common-mode loop structure due to the above interference magnetic field, and thus is beneficial to improving the EMC performance and its performance in use of the power supply.

[0009] Exemplarily, the functional device includes a power conversion element and / or a voltage conversion element. Specifically, the power conversion element can be a rectifying element or an inverting element. The voltage conversion element can be a boosting element or a bucking element. The rectifying element, the inverting element, the boosting element, and the bucking element are prone to generate currents with relatively large instantaneous changes, and thus are prone to generate interference magnetic fields.

[0010] In some implementation manners of the present application, an electromagnetic shielding cavity is formed in the electromagnetic shielding structure, and the differential mode loop structure is disposed in the electromagnetic shielding cavity.

[0011] In this way, setting the electromagnetic shielding cavity is beneficial to multi-directionally shield the differential mode loop structure, and thus is beneficial to improving the EMC performance and service performance of the power supply.

[0012] In some implementation manners of the present application, the power supply further includes a housing, and the housing is electrically connected to the electromagnetic shielding structure to jointly define an electromagnetic shielding cavity, and the differential mode loop structure is disposed in the electromagnetic shielding cavity.

[0013] In this way, a part of the structure of the housing can be used to form the electromagnetic shielding cavity, which is beneficial to saving the internal space of the power supply.

[0014] In some implementation manners of the present application, the power supply further includes a circuit board, the circuit board is disposed in the housing, the filtering module and the functional device are disposed on the circuit board, and the electromagnetic shielding structure is electrically connected to the ground plane of the circuit board and the housing.

[0015] In this way, the electromagnetic shielding structure and the housing are grounded through the circuit board, and then the entire electromagnetic shielding cavity is grounded to achieve the electromagnetic shielding effect of the electromagnetic shielding cavity.

[0016] In other implementation manners, the electromagnetic shielding structure can also be connected to other fixed positions to achieve its electromagnetic shielding effect.

[0017] In some implementation manners of the present application, the power supply further includes a connecting portion, and the connecting portion is a conductive structure; the connecting portion is disposed between the housing and the electromagnetic shielding structure and forms a line contact or a surface contact with the housing and the electromagnetic shielding structure.

[0018] It can be understood that, compared with the point contact structure, the line contact structure or the surface contact structure has a larger current-carrying area, which is beneficial to reducing the impedance of the connecting portion between the housing and the electromagnetic shielding structure.

[0019] In some implementation manners of the present application, the power supply includes a connecting portion, and the connecting portion is a conductive structure. The connecting portion is disposed between the electromagnetic shielding structure and the ground plane of the circuit board and forms a line contact or a surface contact with the electromagnetic shielding structure and the ground plane of the circuit board.

[0020] In this way, the current-carrying area between the electromagnetic shielding structure and the circuit board can be increased to reduce the impedance of the connecting portion between the electromagnetic shielding structure and the circuit board.

[0021] In some implementation manners of the present application, the electromagnetic shielding structure includes a first shielding plate and a second shielding plate, and the first shielding plate and the second shielding plate are arranged crosswise to form an electromagnetic shielding cavity and a shielding region. The differential-mode loop structure is disposed in the electromagnetic shielding cavity, and the functional device is disposed in the shielding region.

[0022] In some examples, both the electromagnetic shielding cavity and the shielding region can be one or more.

[0023] It can be understood that the differential-mode capacitance loop can be disposed in an electromagnetic shielding cavity, and the functional device can be disposed in the shielding region. On the one hand, some shielding plates in the shielding region can shield the interference magnetic field emitted by the functional device from the source to prevent the leakage of its interference magnetic field. On the other hand, the electromagnetic shielding cavity can enclose the differential-mode loop structure to prevent it from being interfered by the interference magnetic field.

[0024] In some implementation manners of the present application, heat dissipation holes are provided on the electromagnetic shielding structure.

[0025] In some implementation manners of the present application, the filtering module further includes a common-mode capacitor, the common-mode capacitor is disposed close to the input port of the power supply and is electrically connected to the input port, and the electromagnetic shielding structure is further disposed between the common-mode capacitor and the functional device to electromagnetically isolate the common-mode capacitor from the functional device.

[0026] Since the common-mode capacitor needs to be grounded, the common-mode capacitor may form a common-mode loop structure through the grounding structure at the input port, and the common-mode loop structure may also be affected by the interference magnetic field to generate current. In the implementation manner of the present application, by disposing the electromagnetic shielding structure between the common-mode capacitor and the functional device, it is beneficial to reduce the influence of the common-mode capacitor on the power supply EMC performance.

[0027] In some implementation manners of the present application, the electromagnetic shielding structure includes a first shielding plate and a second shielding plate, and the first shielding plate and the second shielding plate are arranged crosswise to form an electromagnetic shielding cavity and a shielding region. The common-mode capacitor is disposed in the electromagnetic shielding cavity, and the functional device is disposed in the shielding region.

[0028] In some examples, both the electromagnetic shielding cavity and the shielding region can be one or more.

[0029] It can be understood that the common-mode capacitor can be placed in the electromagnetic shielding cavity, and the functional device can be placed in the shielding region. On the one hand, it can shield the interference magnetic field emitted by the functional device from the source through some shielding plates in the shielding region to prevent the leakage of its interference magnetic field. On the other hand, it can enclose the common-mode structure through the electromagnetic shielding cavity to prevent it from being interfered by the interference magnetic field.

[0030] In a second aspect, an embodiment of the present application further provides an electronic device, including the power supply and the load according to any one of claims 1 to 9, and the power supply is used to supply power to the load.

[0031] In a third aspect, the present application further provides a test system, the test system includes a line impedance stabilization network and the power supply as described above; the line impedance stabilization network is connected to the input port of the power supply.

[0032] After setting the electromagnetic shielding structure in the above manner, it is beneficial to improve the accuracy of the current at the input port, and further beneficial to the test accuracy of the test system. Description of the Drawings

[0033] Figure 1 It is a schematic structural diagram of the power supply provided by an embodiment of the present application;

[0034] Figure 2 It is a schematic structural diagram of the power supply provided by an implementation manner of the present application;

[0035] Figure 3 It is a schematic structural diagram of the power supply provided by another implementation manner of the present application;

[0036] Figure 4 It is a schematic structural diagram of the power supply provided by yet another implementation manner of the present application;

[0037] Figure 5 It is a schematic structural diagram of the power supply provided by still another implementation manner of the present application;

[0038] Figure 6 It is a schematic structural diagram of the power supply provided by another yet implementation manner of the present application;

[0039] Figure 7 It is a schematic structural diagram of the power supply provided by another still implementation manner of the present application;

[0040] Figure 8 It is a schematic circuit diagram of the power supply provided by an implementation manner of the present application;

[0041] Figure 9 It is a schematic circuit diagram of the power supply provided by another implementation manner of the present application;

[0042] Figure 10 It is a schematic framework diagram of the test system provided by an embodiment of the present application.

[0043] Specific component symbol description: 100 - power supply, 110 - input port, 120 - functional device, 130 - filtering module, 131 - common - mode capacitor, 132 - filtering device, 140 - electromagnetic shielding structure, 141 - first shielding plate, 142 - second shielding plate, 143 - heat dissipation hole, 150 - first power supply line, 160 - second power supply line, 170 - housing, 180 - connection part, a - first direction, b - second direction. Specific embodiments

[0044] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the following further details this application in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application.

[0045] It should be noted that when an element is referred to as being "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0046] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality of" means two or more, unless otherwise specifically defined.

[0047] The switching power supply provided by the embodiments of this application can be applied in computing devices. For example, taking the computing device as a server, in the server, the switching power supply can be the power supply unit (PSU, Power Supply Unit) of the server or server node, providing a stable power supply for the server node; it can also be the on - board power supply of the server, providing a stable power supply for various on - board devices (such as CPU, memory, hard disk, etc.). The switching power supply in the embodiments of this application can also be applied in the field of new energy charging. For example, in a charging host, the switching power supply can be arranged in the charging module of the charging host. Or, for example, in a charging terminal, the switching power supply can provide power supply for the control board of the liquid - cooling distribution unit (CDU). In addition, the switching power supply can be the power supply for monitoring devices in scenarios such as communication base stations and data centers. For example, in the scenario of variable - voltage output, the switching power supply can convert single - phase input alternating current into lower - voltage direct current.

[0048] Please refer to Figure 1 , Figure 1The schematic structural diagram of the power supply 100 provided by the embodiment of the present application is shown. The power supply 100 of this embodiment includes a functional device 120, a filtering module 130, and an electromagnetic shielding structure 140. The filtering module 130 is disposed between the functional device and the input port of the power supply. The filtering module 130 includes a differential-mode capacitor 131 and a filtering device 132 that are electrically connected to each other. The differential-mode capacitor 131 is disposed close to the input port 110 of the power supply and is electrically connected to the input port 110 to form a differential-mode loop structure. The filtering device 132 is connected to the functional device; the electromagnetic shielding structure 140 is disposed on one side of the differential-mode capacitor close to the filtering device 132 and the functional device to electromagnetically shield the differential-mode loop structure from the filtering device 132 and the functional device 120.

[0049] It should be explained that the functional device 120 refers to an element that can play a certain functional role during the operation of the power supply 100 of the embodiment of the present application; and when the power supply 100 is in the working state, the functional device 120 will generate a current with obvious changes, thereby generating an interfering magnetic field. For example, the switching tube in the rectifying element realizes the voltage regulation function of the switching power supply 100 by controlling the rapid conduction / disconnection of the switching tube. However, the rapid conduction / disconnection of the switching tube will generate an interfering magnetic field. The filtering module 130 refers to a module that can filter interfering signals in the power supply. The filtering device 132 can be components such as a common-mode inductor and a differential-mode inductor in the filtering module 130.

[0050] It can be understood that the differential-mode capacitor 131 is usually used to filter differential-mode noise in the circuit. The differential-mode capacitor in the embodiment of the present application means that the differential-mode capacitor is directly connected to the input port, and there is no DC filtering element such as an inductor between the differential-mode capacitor and the input port. Specifically, at least two power supply lines are connected to the input port, and the differential-mode capacitor is connected between the two power supply lines. For the differential-mode capacitor 131 in the embodiment of the present application, since the differential-mode capacitor 131 is disposed close to the input port 110 and there is no DC filtering element between the input port and the differential-mode capacitor to filter the interfering current, the interfering current generated by the influence of the interfering magnetic field will directly flow into the input port 110.

[0051] In the embodiment of the present application, placing the electromagnetic shielding structure 140 between the differential-mode loop structure and the functional device 120 is beneficial to reducing the interference of the interfering magnetic field generated by the functional device 120 on the differential-mode loop structure, so as to reduce or eliminate the induced current generated on the differential-mode loop structure due to the above-mentioned interfering magnetic field, and further beneficial to improving the EMC performance and the service performance of the power supply 100.

[0052] In some implementation manners, the electromagnetic shielding structure 140 is made of a conductive material (such as a metal conductive material), and the electromagnetic shielding function is realized by grounding or connecting the electromagnetic shielding structure 140 to a fixed position.

[0053] In some exemplary descriptions, the functional device 120 includes a power conversion element and / or a voltage transformation element. It should be noted that the power conversion element can be a rectifying element or an inverting element. The voltage transformation element can be a boosting element or a bucking element. In the rectifying element, inverting element, boosting element, and bucking element, a current with a relatively large instantaneous change degree is likely to be generated, and thus an interfering magnetic field is likely to be generated.

[0054] Exemplarily, for example, a rectifying bridge formed by combining a plurality of switching elements is provided in the rectifying element. When the power supply 100 operates, the switching elements need to be continuously turned on / off, thereby generating a changing current, and the changing current will generate a changing interfering magnetic field.

[0055] In some exemplary descriptions, the functional device 120 includes a parasitic diode. Since there is a reverse current pulse during the recovery of the parasitic diode, a changing interfering magnetic field is also likely to be generated in the parasitic loop.

[0056] In some implementation manners of the present application, please refer to Figure 2 and Figure 3 , Figure 2 which shows a schematic structural diagram of the power supply 100 provided by this implementation manner, Figure 3 and which shows another schematic structural diagram of the power supply 100 provided by this implementation manner. An electromagnetic shielding cavity is formed in the electromagnetic shielding structure 140 of this implementation manner, and the differential-mode loop structure is disposed in the electromagnetic shielding cavity.

[0057] It can be understood that setting the electromagnetic shielding cavity is beneficial to multi-directionally shield the differential-mode loop structure, and thus is beneficial to improving the EMC performance and service performance of the power supply 100.

[0058] In some implementation manners of the present application, please continue to refer to Figure 2 , a part of the electromagnetic shielding structure 140 is in an L-shaped structure. When the functional device 120 is multiple ( Figure 2 two functional devices shown), and they are dispersedly distributed on both adjacent sides of the differential-mode loop structure, the L-shaped electromagnetic shielding structure 140 can shield the interfering magnetic fields extending from different directions.

[0059] Please continue to refer to Figure 3 , and it can also be understood that a part of the interfering magnetic field generated by the functional device 120 is a magnetic field directly extending from the functional device 120 towards the differential-mode loop structure (the first direction a shown in the figure), and another part is a magnetic field entering from the side of the differential-mode loop structure along a curved direction from the functional device 120 (the second direction b shown in the figure). The L-shaped electromagnetic shielding structure 140 can shield the interfering magnetic fields extending from the front and side directions.

[0060] In some implementation manners of the present application, please refer toFigure 4 , Figure 4 shows a schematic structural diagram of the power supply 100 provided by this implementation; the power supply 100 of this implementation further includes a housing 170, and the housing 170 is electrically connected to the electromagnetic shielding structure 140 to jointly define an electromagnetic shielding cavity, and the differential mode loop structure is arranged in the electromagnetic shielding cavity.

[0061] It can be understood that part of the structure of the housing 170 can be used to form the electromagnetic shielding cavity, which is beneficial to saving the internal space of the power supply 100.

[0062] In some implementations of this application, the power supply 100 further includes a circuit board, the circuit board is arranged in the housing, the filtering module 130 and the functional devices are arranged on the circuit board, and the electromagnetic shielding structure is electrically connected to the grounding plane of the circuit board and to the housing.

[0063] It should be explained that the housing can be connected to the grounding plane of the circuit board through the electromagnetic shielding structure, or directly connected to the grounding plane of the circuit board. The housing 170 of the power supply 100 is grounded, which is not only beneficial to preventing the electric shock risk caused by the leakage or electrostatic accumulation of the power supply 100, but also helps to discharge the possible electromagnetic interference. It can be understood that by grounding the entire electromagnetic shielding cavity, the electromagnetic shielding effect of the electromagnetic shielding cavity is achieved. In some other implementations, the electromagnetic shielding structure 140 can also be connected to other fixed positions to achieve its electromagnetic shielding effect.

[0064] In some implementations of this application, please refer to Figure 5 , Figure 5 shows a schematic structural diagram of the power supply 100 provided by this implementation; the power supply 100 of this implementation further includes a connecting portion 180, the connecting portion 180 is a conductive structure, the connecting portion 180 is arranged between the housing 170 and the electromagnetic shielding structure 140, and forms a line contact or a surface contact with the housing 170 and the electromagnetic shielding structure 140.

[0065] It should be explained that compared with the point contact structure, the technical solution of this implementation has a larger current-carrying area for the line contact structure or the surface contact structure, which is beneficial to reducing the impedance of the connecting portion 180 between the housing 170 and the electromagnetic shielding structure 140.

[0066] In some implementations of this application, the connecting portion is arranged between the electromagnetic shielding structure and the grounding plane of the circuit board, and forms a line contact or a surface contact with the electromagnetic shielding structure and the grounding plane of the circuit board. This can increase the current-carrying area between the electromagnetic shielding structure and the circuit board to reduce the impedance of the connecting portion between the electromagnetic shielding structure and the circuit board.

[0067] In some implementations, the connecting portion 180 is made of a conductive adhesive material.

[0068] In some implementation manners of the present application, please refer to Figure 6 , Figure 6 which shows a schematic structural diagram of the power supply 100 provided by this implementation manner. The electromagnetic shielding structure 140 of this implementation manner includes a first shielding plate 141 and a second shielding plate 142. The first shielding plate 141 and the second shielding plate 142 are arranged crosswise to form at least one electromagnetic shielding cavity and at least one shielding region. The differential-mode loop structure is arranged in the electromagnetic shielding cavity, and the functional devices are arranged in the shielding region.

[0069] It can be understood that the differential-mode capacitor 131 loop can be placed in an electromagnetic shielding cavity, and the functional device 120 can be placed in the shielding region. On the one hand, some shielding plates in the shielding region can shield the interference magnetic field emitted by the functional device 120 from the source to prevent the leakage of its interference magnetic field. On the other hand, the electromagnetic shielding cavity can enclose the differential-mode loop structure to prevent it from being interfered by the interference magnetic field.

[0070] In some implementation manners, the crosswise arrangement of the first shielding plate 141 and the second shielding plate 142 can define two shielding regions, and together with the housing, two electromagnetic shielding cavities are defined. In the case where there are more functional devices 120 and the functional devices 120 are prone to interfere with each other, the functional devices can be placed in different shielding regions, and the differential-mode loop structure and other devices that are easily affected can be arranged in different electromagnetic shielding cavities respectively to improve the anti-interference performance of the power supply.

[0071] In some implementation manners, the included angle between the first shielding plate 141 and the second shielding plate 142 is about 90°.

[0072] In some implementation manners, the included angle between the first shielding plate and the second shielding plate can also be about 30°, 45°, 60°, etc.

[0073] In some implementation manners of the present application, please refer to Figure 7 , Figure 7 which shows a schematic structural diagram of the power supply 100 provided by this implementation manner. Heat dissipation holes 143 are provided on the electromagnetic shielding structure 140 of this implementation manner.

[0074] It can be understood that the internal components of the power supply 100 can dissipate heat through the heat dissipation holes 143 to balance the temperature inside the power supply 100 and improve the working stability of the power supply 100.

[0075] In some implementation manners of the present application, please refer to Figure 8 , Figure 8 which shows a schematic circuit diagram of the power supply 100 provided by this implementation manner. As Figure 8As shown, taking the preset impedance of the LISN (Line Impedance Stabilization Network) as 25 OHM as an example, Figure 8 The SCREEN in Figure 8 corresponds to the electromagnetic shielding structure 140 described above. Both T1 and T2 are common-mode inductors in the subsequent circuit, and C1 is the differential-mode capacitor 131. In the implementation of this application, taking the power supply 100 accessing the line impedance stabilization network 200 as an example, the power supply 100 in this implementation includes a first power supply line 150 and a second power supply line 160. The differential-mode capacitor 131 is connected between the first power supply line 150 and the second power supply line 160.

[0076] It can be understood that when there is a voltage difference between the first power supply line 150 and the second power supply line 160, the differential-mode capacitor 131 can play a filtering role.

[0077] In some implementation manners, please continue to refer to Figure 8 , the first power supply line 150 is the live wire, and the second power supply line 160 is the neutral wire. In other implementation manners, the first power supply line 150 is the positive wire, and the second power supply line 160 is the negative wire.

[0078] In some implementation manners of this application, the first power supply line 150 has a first part located between the input port 110 and the differential-mode capacitor 131, the second power supply line 160 has a second part located between the input port 110 and the differential-mode capacitor 131, and the differential-mode capacitor 131 forms a differential-mode loop structure with the first part and the second part.

[0079] In some implementation manners of this application, please refer to Figure 9 , Figure 9 shows a schematic circuit diagram of the power supply 100 provided by this implementation manner; in the implementation manner of this application, taking C2 as the common-mode capacitor as an example, in the implementation manner of this application, taking the power supply 100 accessing the line impedance stabilization network as an example, the filtering module 130 of this implementation manner further includes a common-mode capacitor. The common-mode capacitor is arranged close to the input port 110 of the power supply 100 and is electrically connected to the input port. The electromagnetic shielding structure 140 is also arranged between the common-mode capacitor and the functional device to electromagnetic shield the common-mode capacitor from the functional device 120.

[0080] It can be understood that the common-mode capacitor in the implementation manner of the present application is a common-mode capacitor directly connected to the input port, that is, there is no DC filtering device 132 between the common-mode capacitor and the input port. Specifically, the common-mode capacitor is two grounded capacitors, which are respectively connected to different power supply lines. Since the common-mode capacitor needs to be grounded, the common-mode capacitor may form a common-mode loop structure through the grounding structure at the input port 110, and the common-mode loop structure may also be affected by the interference magnetic field to generate current. In the implementation manner of the present application, an electromagnetic shielding structure 140 is provided to electromagnetically shield the common-mode capacitor from the functional device 120, which is beneficial to reducing the influence of the common-mode capacitor on the EMC performance of the power supply 100.

[0081] In some implementation manners of the present application, the electromagnetic shielding structure 140 includes a first shielding plate 141 and a second shielding plate 142. The first shielding plate 141 and the second shielding plate 142 are arranged crosswise to form at least one electromagnetic shielding cavity and at least one shielding region. The common-mode capacitor is disposed in the electromagnetic shielding cavity, and the functional device is disposed in the shielding region.

[0082] It can be understood that the common-mode capacitor can be placed in the electromagnetic shielding cavity, and the functional device 120 can be placed in the shielding region. On the one hand, it can shield the interference magnetic field emitted by the functional device 120 from the source through a part of the shielding plate in the shielding region to prevent the leakage of its interference magnetic field. On the other hand, it can enclose the common-mode structure through the electromagnetic shielding cavity to prevent it from being interfered by the interference magnetic field.

[0083] In some implementation manners, please continue to refer to Figure 9 ., the common-mode capacitor includes at least two sub-capacitors (grounded capacitors). The two sub-capacitors include a first sub-capacitor and a second sub-capacitor. The first sub-capacitor is disposed between the first power supply line 150 and the ground terminal, and the second sub-capacitor is disposed between the second power supply line 160 and the ground terminal; the electromagnetic shielding structure 140 is disposed between at least one sub-capacitor and the functional device 120.

[0084] Further, in order to better implement the power supply 100 in any of the above embodiments or implementation manners, on the basis of the above power supply 100, the embodiments of the present application further provide an electronic device, including the above power supply 100.

[0085] In some embodiments, the electronic device can be a computer, a server, a communication device, a monitoring device, a voltage transformation device, and the like.

[0086] Still further, in order to better implement the power supply 100 in any of the above embodiments or implementation manners, on the basis of the above power supply 100, please continue to refer to Figure 8 、 Figure 9 and refer to Figure 10 , Figure 10The figure shows a schematic diagram of the framework structure of the test system provided by this implementation manner; an embodiment of the present application further provides a test system, and the test system includes a line impedance stabilization network 200. The line impedance stabilization network 200 is connected to the input port 110 of the power supply 100.

[0087] It should be noted that the line impedance stabilization network 200 is a key device in EMC testing, which is used to isolate the interference of the power supply 100 and provide a stable test impedance. The line impedance stabilization network 200 ensures that the measured interference is that of the product itself, rather than the power supply 100 noise, in conducted emission (CE) testing and radiated emission (RE) testing.

[0088] Specifically, in the test system, the line impedance stabilization network 200 is arranged on the input port 110 of the power supply 100. The line impedance stabilization network 200 is used to simulate the impedance characteristics in the real line and ensure that the input impedance of the input port 110 of the power supply 100 remains stable during the test. In some exemplary instances, the LISN also has the ability to filter out interference signals, which helps to ensure the purity of the test environment. In some embodiments, the preset impedance of the LISN can be 25 - 100 Ω. Specifically, the preset impedance of the LISN can be any one of 25 Ω, 50 Ω, or 100 Ω.

[0089] In the above embodiments, the descriptions of each embodiment have their own emphases. For parts not detailed or recorded in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0090] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only an example and does not constitute a limitation to the present application. Although not explicitly stated here, those skilled in the art may make various modifications, improvements, and corrections to the present application. Such modifications, improvements, and corrections are proposed in the present application, so such modifications, improvements, and corrections still fall within the spirit and scope of the exemplary embodiments of the present application.

[0091] At the same time, the present application uses specific terms to describe the embodiments of the present application. Such as "an embodiment", "one embodiment", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this specification is not necessarily the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the present application can be appropriately combined.

[0092] Similarly, it should be noted that, in order to simplify the description disclosed in this application and thus help to understand one or more embodiments of the invention, in the foregoing description of the embodiments of this application, sometimes multiple features are incorporated into one embodiment, drawing, or description thereof. However, this disclosure method does not mean that the features required by the subject matter of this application are more than those mentioned in the claims. In fact, the features of the embodiments are fewer than all the features of the individual embodiments disclosed above.

[0093] The foregoing embodiments are only used to illustrate the technical solutions of this application and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements for some of the technical features. And these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application and should all be included within the protection scope of this application.

Claims

1. A power supply, characterized in that, Comprising: Functional device; Filter module, arranged between the functional device and the input port of the power supply. The filter module includes a differential-mode capacitor and a filter device that are electrically connected to each other. The filter device is electrically connected to the functional device; the differential-mode capacitor is arranged close to the input port of the power supply and is electrically connected to the input port to form a differential-mode loop structure; Electromagnetic shielding structure, which is arranged on the side of the differential-mode capacitor close to the filter device and the functional device to electromagnetically isolate the differential-mode loop structure from the filter device and the functional device.

2. The power supply according to claim 1, characterized in that, The electromagnetic shielding structure forms an electromagnetic shielding cavity, and the differential-mode loop structure is arranged in the electromagnetic shielding cavity.

3. The power supply according to claim 1, wherein The power supply further includes a housing, and the housing is electrically connected to the electromagnetic shielding structure to jointly define the electromagnetic shielding cavity, and the differential-mode loop structure is arranged in the electromagnetic shielding cavity.

4. The power supply according to claim 3, characterized in that, The power supply further includes a circuit board, the circuit board is arranged in the housing, the filter module and the functional device are arranged on the circuit board, and the electromagnetic shielding structure is electrically connected to the ground plane of the circuit board and the housing.

5. The power supply according to claim 4, characterized in that, The power supply further includes a connecting part, and the connecting part is a conductive structure; The connecting part is arranged between the housing and the electromagnetic shielding structure and forms a line contact or a surface contact with the housing and the electromagnetic shielding structure; And / or, the connecting part is arranged between the electromagnetic shielding structure and the ground plane of the circuit board and forms a line contact or a surface contact with the electromagnetic shielding structure and the ground plane of the circuit board.

6. The power supply according to any one of claims 1 to 5, characterized in that The electromagnetic shielding structure includes a first shielding plate and a second shielding plate, and the first shielding plate and the second shielding plate are arranged crosswise to form an electromagnetic shielding cavity and a shielding area. The differential-mode loop structure is arranged in the electromagnetic shielding cavity, and the functional device is arranged in the shielding area.

7. The power supply according to any one of claims 1 to 5, characterized in that, The filter module further includes a common-mode capacitor, the common-mode capacitor is arranged close to the input port of the power supply and is electrically connected to the input port, and the electromagnetic shielding structure is further arranged between the common-mode capacitor and the functional device to be used for electromagnetically isolating the common-mode capacitor from the functional device.

8. The power supply according to claim 7, characterized in that, The electromagnetic shielding structure includes a first shielding plate and a second shielding plate, and the first shielding plate and the second shielding plate are arranged crosswise to form an electromagnetic shielding cavity and a shielding area. The common-mode capacitor is arranged in the electromagnetic shielding cavity, and the functional device is arranged in the shielding area.

9. The power supply according to any one of claims 1 to 5, characterized in that, The electromagnetic shielding structure is provided with heat dissipation holes.

10. An electronic device, characterized in that, Comprising the power supply according to any one of claims 1 to 9 and a load, and the power supply is used for supplying power to the load.

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