Packaging device with guide mechanism for circuit substrate production

Abstract

The invention discloses a packaging device with a guide mechanism for circuit substrate production, and relates to the technical field of packaging devices for circuit substrate production. The packaging device with the guide mechanism for circuit substrate production comprises a base, the top of the base is fixedly connected with a first supporting plate and a second supporting plate through supporting rods, the surface of the first supporting plate is fixedly connected with the guide mechanism, and the top of the base is further fixedly connected with a third supporting plate; and the inner part of the third supporting plate is fixedly connected with a connecting rod. According to the packaging device with the guide mechanism for circuit substrate production, a vibration generator is arranged, and when the vibration generator reaches the steering position of a third conveying belt, the vibration generator is started to enable a circuit substrate which is just packaged in a limiting bearing box to be separated from the surface of the limiting bearing box; and it is avoided that the circuit substrate adheres to the surface of the limiting bearing box to affect follow-up transportation, and therefore the circuit substrate processing efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board production and packaging devices, and specifically relates to a packaging device with a guiding mechanism for circuit board production. Background Art

[0002] A circuit board is an important component in electronic devices. It plays a role in supporting, connecting, and conducting electronic components. When the circuit board needs to shield external electromagnetic interference, ferrite materials are often added in the form of thin films or patches on one side of the insulating material of a single-sided circuit board.

[0003] Referring to the invention patent with the Chinese publication number "CN118434012A", a transmission mechanism, and the transmission mechanism further includes a fixed base. The present invention utilizes the fact that one side of a single-sided board is a copper foil conductive layer and the other side is an insulating material. When the two sides contact the second transmission belt, different phenomena will occur. First, when the copper foil conductive layer faces the second transmission belt, at this time, the second transmission belt generates a relatively weak electromagnetic adsorption force through the electromagnetic ring, adsorbing the metal inside the copper foil conductive layer and carrying the single-sided board for transmission. When the single-sided board reaches the transmission tube, due to the influence of the electromagnetic adsorption force, it will not immediately fall into the transmission tube, but continue to move forward, and one end of the bottom of the single-sided board contacts the top of the rotating body.

[0004] However, before processing the single-sided board, the biggest problem is that workers need to change the orientation of the single-sided board to ensure that the copper foil conductive layer can always face the packaging device. The side with the added ferrite material often faces away from the packaging device. The manual turning efficiency is low, and the adsorption force of the electromagnetic ring assisted by energization is affected by current fluctuations, affecting the packaging efficiency. Summary of the Invention

[0005] In view of the deficiencies of the prior art, the present invention provides a packaging device with a guiding mechanism for circuit board production to solve the problems raised in the above background art.

[0006] To achieve the above objectives, the present invention is realized through the following technical solutions: A packaging device with a guiding mechanism for circuit board production includes a base. The top of the base is fixedly connected with a first support plate and a second support plate through a support rod. A guiding mechanism is fixedly connected to the surface of the first support plate. A third support plate is also fixedly connected to the top of the base. A transportation mechanism is fixedly connected to the inside of the third support plate. A packaging mechanism is fixedly connected to the surface of the third support plate. A flipping assistance mechanism is fixedly connected to the surface of the second support plate; The guiding mechanism includes: A first motor, which is fixedly connected to the surface of the first support plate; The first conveyor belt is rotationally connected to the surface of the output shaft rotationally connected inside the first motor, and a magnet is fixedly connected inside the first conveyor belt.

[0007] Preferably, a second blocking scraper is fixedly connected to the surface of the first support plate, a first blocking scraper is fixedly connected inside the second support plate, a second motor is fixedly connected to the surface of the second support plate, a second conveyor belt is rotationally connected inside the second motor through an output shaft, and through holes are formed on the surface of the second conveyor belt for forming negative pressure when adsorbing a circuit board.

[0008] Preferably, the guiding mechanism further includes a vacuum adsorption plate, the vacuum adsorption plate is fixedly connected inside the second support plate, the number of the vacuum adsorption plates is five, a rectangular groove is formed at the bottom of the vacuum adsorption plate, and through holes are formed on the inner wall of the rectangular groove.

[0009] Preferably, a sub-pipeline is fixedly connected to the top of the vacuum adsorption plate, a five-way solenoid valve is further fixedly connected to the top of the vacuum adsorption plate, a vacuum distributor is fixedly connected to the surface of the sub-pipeline, a main pipeline is fixedly connected to the surface of the vacuum distributor, a vacuum pump is fixedly connected to the surface of the main pipeline, and the vacuum pump is arranged on the inner wall of the second support plate, and a photoelectric sensor is fixedly connected to the bottom of the second support plate.

[0010] Preferably, the transportation mechanism includes a third motor, the third motor is fixedly connected to the surface of the third support plate, a third conveyor belt is rotationally connected inside the third motor through an output shaft, a connecting block is fixedly connected to the surface of the third conveyor belt, a limiting bearing box is movably connected to the bottom of the connecting block, and a first spring is fixedly connected to the surface of the limiting bearing box.

[0011] Preferably, a vibration generator is fixedly connected to the bottom of the limiting bearing box, a supporting elastic plate is further fixedly connected to the bottom of the limiting bearing box, and a second spring is fixedly connected to the bottom of the supporting elastic plate, and the second spring is arranged between the third conveyor belt and the limiting bearing box.

[0012] Preferably, the encapsulation mechanism includes an adjusting support beam, the adjusting support beam is fixedly connected to the surface of the third support plate, a fourth motor is fixedly connected to the top of the adjusting support beam, a sliding support plate is slidably connected inside the fourth motor through an output shaft, and the sliding support plate is slidably connected inside the adjusting support beam, a telescoping machine is fixedly connected to the top of the sliding support plate, and a sealer is fixedly connected to the inside of the telescoping machine through an output shaft.

[0013] Preferably, the flipping assistance mechanism includes a fifth motor fixedly connected to the surface of the second support plate. A connecting rod is fixedly connected to the inside of the fifth motor through an output shaft. A slider is fixedly connected to the surface of the connecting rod, and the slider is slidably connected to the inside of the second support plate. A limiting assistance plate is fixedly connected to the surface of the slider.

[0014] The present invention provides a packaging device with a guiding mechanism for circuit board production. It has the following beneficial effects: 1. For the packaging device with a guiding mechanism for circuit board production, by setting multiple vacuum suction plates and controlling the vacuum suction respectively through the cooperation of a vacuum distributor and a photoelectric sensor, the vacuum suction plates can adsorb the circuit board when it passes by, avoiding the burden on the rotation of the second conveyor belt caused by simultaneous vacuum suction and improving the subsequent packaging efficiency. By setting magnets on the surface of the first conveyor belt, the side with ferrite material added has a strong magnetic attraction to the magnets, while the other side has a relatively small magnetic adsorption force. Cooperating with a vacuum pump, it is convenient to adsorb the circuit board on the side with a small magnetic adsorption force onto the surface of the second conveyor belt, thus facilitating the subsequent automatic flipping of the circuit board. Compared with the traditional electromagnetic flipping method, it solves the problem that the adsorption force of the electromagnetic ring is affected by current fluctuations, resulting in the inability to flip the circuit board, and improves the subsequent packaging efficiency.

[0015] 2. For the packaging device with a guiding mechanism for circuit board production, by setting a limiting assistance plate and starting the fifth motor, the connecting rod and the slider are driven to rotate through the output shaft, thereby driving the limiting assistance plate to rotate, avoiding the problem that the circuit board slides down due to insufficient adsorption force when it reaches the turning point of the second conveyor belt. It has high mechanical efficiency and does not require manual intervention, ensuring the flipping of the circuit board.

[0016] 3. For the packaging device with a guiding mechanism for circuit board production, by setting a limiting bearing box, after the circuit board is conveyed to the surface of the limiting bearing box, start the vibration generator. The start of the vibration generator drives the limiting bearing box to vibrate at a high frequency and low amplitude, so that the circuit board can be completely placed in the groove opened on the surface of the limiting bearing box without damaging the circuit board, facilitating subsequent packaging. At the same time, a support spring plate is arranged at the bottom of the limiting bearing box to support the limiting bearing box and make the circuit board inside the limiting bearing box more stable during vibration, and buffer the circuit board when it slides down from the second blocking scraper and the first blocking scraper, avoiding damage to the circuit board, thereby improving the subsequent packaging efficiency.

[0017] 4. A packaging device with a guiding mechanism for producing circuit substrates is provided with a vibration generator. When the vibration generator reaches the turning point of the third conveyor belt, the vibration generator is started to make the circuit substrate just packaged inside the limiting carrying box separate from the surface of the limiting carrying box, so as to avoid the circuit substrate adhering to the surface of the limiting carrying box and affecting the subsequent transportation, thereby improving the efficiency of processing the circuit substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the main three-dimensional structure of the present invention; Figure 2 is a cross-sectional view of a second conveyor belt of the present invention; Figure 3 For the present invention Figure 2 The enlarged schematic diagram at A in the middle; Figure 4 It is a schematic diagram of the flip assisting mechanism of the present invention; Figure 5 It is a schematic diagram of the guide mechanism of the present invention; Figure 6 A bottom view of the guide mechanism of the present invention; Figure 7 It is a schematic diagram of the transport mechanism of the present invention; Figure 8 For the present invention Figure 7 The enlarged schematic diagram of point B in the middle; Figure 9 It is a schematic diagram of the packaging mechanism of the present invention.

[0019] In the figure: 1, base; 2, first support plate; 3, second support plate; 4, third support plate; 5, guide mechanism; 51, first motor; 52, first conveyor belt; 53, magnet; 54, second motor; 55, second conveyor belt; 56, first blocking scraper; 57, second blocking scraper; 58, vacuum pump; 59, main pipeline; 510, vacuum distributor; 511, branch pipeline; 512, five-way solenoid valve; 513, vacuum adsorption plate; 514, rectangular groove; 515, light Electric sensor; 6. Transport mechanism; 61. Third conveyor belt; 62. Third motor; 63. Limit bearing box; 64. Connecting block; 65. First spring; 66. Second spring; 67. Vibration generator; 68. Support spring plate; 7. Packaging mechanism; 71. Adjustable support beam; 72. Fourth motor; 73. Telescopic machine; 74. Sliding support plate; 75. Sealer; 8. Flipping auxiliary mechanism; 81. Fifth motor; 82. Connecting rod; 83. Sliding block; 84. Limit auxiliary plate. DETAILED DESCRIPTION

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0021] Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present invention and should not be construed as a limitation to the present invention.

[0022] Embodiment 1: Please refer to Figures 1-6 , the present invention provides a technical solution: a packaging device with a guiding mechanism for circuit board production, including a base 1. The top of the base 1 is fixedly connected with a first support plate 2 and a second support plate 3 through a support rod. The surface of the first support plate 2 is fixedly connected with a guiding mechanism 5. The top of the base 1 is also fixedly connected with a third support plate 4. The inside of the third support plate 4 is fixedly connected with a transportation mechanism 6. The surface of the third support plate 4 is fixedly connected with a packaging mechanism 7. The surface of the second support plate 3 is fixedly connected with a flipping auxiliary mechanism 8; The guiding mechanism 5 includes: A first motor 51, which is fixedly connected to the surface of the first support plate 2; A first conveyor belt 52, which is rotatably connected to the surface of the output shaft rotatably connected inside the first motor 51. A magnet 53 is fixedly connected inside the first conveyor belt 52.

[0023] A second blocking scraper 57 is fixedly connected to the surface of the first support plate 2. A first blocking scraper 56 is fixedly connected inside the second support plate 3. A second motor 54 is fixedly connected to the surface of the second support plate 3. A second conveyor belt 55 is rotatably connected inside the second motor 54 through an output shaft. Through holes are provided on the surface of the second conveyor belt 55 for forming negative pressure when adsorbing the circuit board.

[0024] The guiding mechanism 5 further includes a vacuum adsorption plate 513, which is fixedly connected inside the second support plate 3. The number of the vacuum adsorption plates 513 is five. A rectangular groove 514 is provided at the bottom of the vacuum adsorption plate 513, and through holes are provided on the inner wall of the rectangular groove 514.

[0025] A sub-pipeline 511 is fixedly connected to the top of the vacuum adsorption plate 513. A five-way solenoid valve 512 is also fixedly connected to the top of the vacuum adsorption plate 513. A vacuum distributor 510 is fixedly connected to the surface of the sub-pipeline 511. A main pipeline 59 is fixedly connected to the surface of the vacuum distributor 510. A vacuum pump 58 is fixedly connected to the surface of the main pipeline 59, and the vacuum pump 58 is arranged on the inner wall of the second support plate 3. A photoelectric sensor 515 is fixedly connected to the bottom of the second support plate 3.

[0026] During use, first start the first motor 51. The start of the first motor 51 drives the first conveyor belt 52 to rotate through the output shaft. The circuit board transported to the surface of the first conveyor belt 52 moves in the direction of the second motor 54 under the start of the first motor 51. At the same time, start the vacuum pump 58. The start of the vacuum pump 58 is connected through a pipeline to cooperate with the photoelectric sensor 515 and the five-way solenoid valve 512 to make one of the vacuum suction plates 513 have a vacuum suction force. When a circuit board is transported to the photoelectric sensor 515 farthest from the second blocking scraper 57, the vacuum suction plate 513 farthest from the second blocking scraper 57 has suction force. By analogy, other photoelectric sensors 515 and five-way solenoid valves 512 cooperate on the same principle. Start the second motor 54. The start of the second motor 54 drives the second conveyor belt 55 to rotate. At this time, the circuit board on the side with the ferrite material added has a strong magnetic suction force with the magnet 53. Although the subsequent photoelectric sensor 515 detects the presence of the circuit board, it is not enough to lift the circuit board. In this case, the circuit board continues to be transported with the rotation of the first conveyor belt 52. When it reaches the turning point of the first conveyor belt 52, the circuit board warps, so as to facilitate the second blocking scraper 57 to carry out the next transportation. And the circuit board on the side without the ferrite material added has a small magnetic suction force with the magnet 53. After being detected by the photoelectric sensor 515, the five-way solenoid valve 512 is controlled to be sufficient to lift the circuit board. The lifted circuit board rotates with the second conveyor belt 55 and moves in the opposite direction to the circuit board on the surface of the first conveyor belt 52, that is, the circuit board moves in the direction of the flipping auxiliary mechanism 8. When it reaches the position of the limit auxiliary plate 84, start the fifth motor 81 to drive the connecting rod 82 and the limit auxiliary plate 84 to rotate together, so that the limit auxiliary plate 84 supports the circuit board, facilitating the circuit board to be transported to the top of the second conveyor belt 55. Subsequently, the circuit board moves in the direction of the first blocking scraper 56. When it reaches the turning point of the second conveyor belt 55, it is the same as the principle when the circuit board reaches the turning point of the first conveyor belt 52, and it slides along the surfaces of the second blocking scraper 57 and the first blocking scraper 56 to the surface of the limit bearing box 63.

[0027] By setting multiple vacuum adsorption plates 513 and cooperating with a vacuum distributor 510 and a photoelectric sensor 515, the vacuum adsorption can be controlled separately, so that the vacuum adsorption plates 513 adsorb the circuit board when it passes by, avoiding the increased burden on the rotation of the second conveyor belt 55 due to simultaneous vacuum adsorption, improving the subsequent packaging efficiency. By setting magnets 53 on the surface of the first conveyor belt 52, the side with the added ferrite material has a strong magnetic attraction force with the magnet 53, while the other side has a small magnetic adsorption force. Cooperating with the vacuum pump 58, it is convenient to adsorb the circuit board on the side with the small magnetic adsorption force onto the surface of the second conveyor belt 55, thus facilitating the automatic flipping of the subsequent circuit board. Compared with the traditional electromagnetic flipping method, it solves the problem that the adsorption force of the electromagnetic ring is affected by current fluctuations, resulting in the inability to flip the circuit board, and improves the subsequent packaging efficiency.

[0028] Embodiment 2: Please refer to Figures 1-9 , based on Embodiment 1, the present invention provides a technical solution: The transportation mechanism 6 includes a third motor 62, the third motor 62 is fixedly connected to the surface of the third support plate 4, the inside of the third motor 62 is rotationally connected with a third conveyor belt 61 through an output shaft, a connecting block 64 is fixedly connected to the surface of the third conveyor belt 61, the bottom of the connecting block 64 is movably connected with a limit bearing box 63, and a first spring 65 is fixedly connected to the surface of the limit bearing box 63.

[0029] The bottom of the limit bearing box 63 is fixedly connected with a vibration generator 67, the bottom of the limit bearing box 63 is also fixedly connected with a support elastic plate 68, the bottom of the support elastic plate 68 is fixedly connected with a second spring 66, and the second spring 66 is arranged between the third conveyor belt 61 and the limit bearing box 63.

[0030] The packaging mechanism 7 includes an adjustment support beam 71, the adjustment support beam 71 is fixedly connected to the surface of the third support plate 4, a fourth motor 72 is fixedly connected to the top of the adjustment support beam 71, a sliding support plate 74 is slidably connected to the inside of the fourth motor 72 through an output shaft, and the sliding support plate 74 is slidably connected to the inside of the adjustment support beam 71. A telescopic machine 73 is fixedly connected to the top of the sliding support plate 74, and a sealer 75 is fixedly connected to the inside of the telescopic machine 73 through an output shaft.

[0031] The flipping auxiliary mechanism 8 includes a fifth motor 81, the fifth motor 81 is fixedly connected to the surface of the second support plate 3, a connecting rod 82 is fixedly connected to the inside of the fifth motor 81 through an output shaft, a slider 83 is fixedly connected to the surface of the connecting rod 82, and the slider 83 is slidably connected to the inside of the second support plate 3. A limit auxiliary plate 84 is fixedly connected to the surface of the slider 83.

[0032] When in use, after the circuit substrate slides to the surface of the limiting carrying box 63, the vibration generator 67 is started. The vibration of the vibration generator 67 drives the limiting carrying box 63 to vibrate at a high frequency and a low amplitude, so that the circuit substrate falls completely into the groove opened on the surface of the limiting carrying box 63 to complete the positioning, and then the third motor 62 is started. The start of the third motor 62 drives the third conveyor belt 61 to rotate through the output shaft, so that the circuit substrate is transported to the bottom of the sealer 75. After reaching the bottom of the sealer 75, the fourth motor 72 is started. The start of the fourth motor 72 drives the sliding support plate 74 to move to the bottom, and then the telescopic machine 73 is started. The start of the telescopic machine 73 drives the sealer 75 to move to the bottom surface of the circuit substrate through the output shaft to complete the packaging. After the packaging is completed, the circuit substrate continues to be transported to the turning point of the third conveyor belt 61, and at the same time, the vibration generator 67 is started to vibrate again, so as to facilitate the shedding of the circuit substrate and the collection.

[0033] By setting the limit auxiliary plate 84 and starting the fifth motor 81 to drive the connecting rod 82 and the slider 83 to rotate through the output shaft, the limit auxiliary plate 84 is driven to rotate, thereby avoiding the problem of the circuit substrate slipping due to insufficient adsorption force when the circuit substrate reaches the turning point of the second conveyor belt 55. The mechanical efficiency is high and no manual intervention is required, thereby ensuring the flipping of the circuit substrate.

[0034] By setting a limit carrying box 63, when the circuit substrate is conveyed to the surface of the limit carrying box 63, the vibration generator 67 is started. The start of the vibration generator 67 drives the limit carrying box 63 to vibrate at a high frequency and a low amplitude, so that the circuit substrate is completely positioned in the groove opened on the surface of the limit carrying box 63 without damaging the circuit substrate, which is convenient for subsequent packaging. A supporting spring plate 68 is set at the bottom of the limit carrying box 63 to support the limit carrying box 63 and make the circuit substrate inside the limit carrying box 63 more stable when vibrating, and to cushion the circuit substrate when it slides down from the second blocking scraper 57 and the first blocking scraper 56, thereby avoiding damage to the circuit substrate and improving subsequent packaging efficiency.

[0035] By setting up a vibration generator 67, when the vibration generator 67 reaches the turning point of the third conveyor belt 61, the vibration generator 67 is started to make the circuit substrate just packaged inside the limiting carrying box 63 separate from the surface of the limiting carrying box 63, so as to avoid the circuit substrate adhering to the surface of the limiting carrying box 63 and affecting the subsequent transportation, thereby improving the efficiency of processing the circuit substrate.

[0036] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An encapsulation device with a guiding mechanism for circuit board production, including a base (1), characterized in that: The top of the base (1) is fixedly connected with a first support plate (2) and a second support plate (3) through a support rod. A guiding mechanism (5) is fixedly connected to the surface of the first support plate (2). The top of the base (1) is also fixedly connected with a third support plate (4). A transportation mechanism (6) is fixedly connected inside the third support plate (4). An encapsulation mechanism (7) is fixedly connected to the surface of the third support plate (4). A flipping auxiliary mechanism (8) is fixedly connected to the surface of the second support plate (3). The guiding mechanism (5) includes: A first motor (51), which is fixedly connected to the surface of the first support plate (2); A first conveyor belt (52), which is rotatably connected to the surface of the output shaft rotatably connected inside the first motor (51). A magnet (53) is fixedly connected inside the first conveyor belt (52).

2. The packaging device with a guiding mechanism for the production of a circuit board according to claim 1, wherein: A second blocking scraper (57) is fixedly connected to the surface of the first support plate (2). A first blocking scraper (56) is fixedly connected inside the second support plate (3). A second motor (54) is fixedly connected to the surface of the second support plate (3). A second conveyor belt (55) is rotatably connected inside the second motor (54) through an output shaft. Through holes are formed on the surface of the second conveyor belt (55) to form negative pressure when adsorbing the circuit board.

3. The encapsulation device with a guiding mechanism for the production of a circuit board according to claim 2, characterized in that: The guiding mechanism (5) further includes a vacuum adsorption plate (513), which is fixedly connected inside the second support plate (3). The number of the vacuum adsorption plates (513) is five. A rectangular groove (514) is formed at the bottom of the vacuum adsorption plate (513), and through holes are formed on the inner wall of the rectangular groove (514).

4. The encapsulation device with a guiding mechanism for the production of a circuit board according to claim 3, wherein: A sub-pipeline (511) is fixedly connected to the top of the vacuum adsorption plate (513). A five-way solenoid valve (512) is also fixedly connected to the top of the vacuum adsorption plate (513). A vacuum distributor (510) is fixedly connected to the surface of the sub-pipeline (511). A main pipeline (59) is fixedly connected to the surface of the vacuum distributor (510). A vacuum pump (58) is fixedly connected to the surface of the main pipeline (59), and the vacuum pump (58) is arranged on the inner wall of the second support plate (3). A photoelectric sensor (515) is fixedly connected to the bottom of the second support plate (3).

5. The packaging device with a guiding mechanism for circuit board production according to claim 4, characterized in that: The transportation mechanism (6) includes a third motor (62), which is fixedly connected to the surface of the third support plate (4). A third conveyor belt (61) is rotatably connected inside the third motor (62) through an output shaft. A connecting block (64) is fixedly connected to the surface of the third conveyor belt (61). A limiting bearing box (63) is movably connected to the bottom of the connecting block (64). A first spring (65) is fixedly connected to the surface of the limiting bearing box (63).

6. The encapsulation device with a guiding mechanism for the production of a circuit board according to claim 5, characterized in that: The bottom of the limit bearing box (63) is fixedly connected with a vibration generator (67). The bottom of the limit bearing box (63) is also fixedly connected with a support elastic plate (68). The bottom of the support elastic plate (68) is fixedly connected with a second spring (66), and the second spring (66) is arranged between the third conveyor belt (61) and the limit bearing box (63).

7. The packaging device with a guiding mechanism for the production of a circuit board according to claim 6, characterized in that: The encapsulation mechanism (7) includes an adjustment support beam (71). The adjustment support beam (71) is fixedly connected to the surface of the third support plate (4). The top of the adjustment support beam (71) is fixedly connected with a fourth motor (72). A sliding support plate (74) is slidably connected to the inside of the fourth motor (72) through an output shaft, and the sliding support plate (74) is slidably connected to the inside of the adjustment support beam (71). The top of the sliding support plate (74) is fixedly connected with a telescopic machine (73). A seal (75) is fixedly connected to the inside of the telescopic machine (73) through an output shaft.

8. The encapsulation device with a guiding mechanism for circuit board production according to claim 7, characterized in that: The flipping auxiliary mechanism (8) includes a fifth motor (81). The fifth motor (81) is fixedly connected to the surface of the second support plate (3). A connecting rod (82) is fixedly connected to the inside of the fifth motor (81) through an output shaft. A slider (83) is fixedly connected to the surface of the connecting rod (82), and the slider (83) is slidably connected to the inside of the second support plate (3). A limit auxiliary plate (84) is fixedly connected to the surface of the slider (83).

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