Printed circuit board and electronic device

Abstract

The invention discloses a printed circuit board and an electronic device, which are used for improving the electromagnetic shielding effect of the printed circuit board. The embodiment of the invention provides a printed circuit board. The printed circuit board comprises a substrate; the at least one component is positioned on one side of the substrate; the at least one connecting unit and the component are positioned on the same side of the substrate; the connecting unit comprises at least one interface; the protective layer is positioned on one side, deviating from the substrate, of the component and the connecting unit; the orthographic projection of the protection layer on the substrate covers the orthographic projection of the component on the substrate; the protective layer is in contact with the connection unit in at least a partial region outside the at least one interface.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a printed circuit board and an electronic device. Background Art

[0002] Currently, printed circuit boards (PCBs) require a large number of components, and a protective layer is required to cover these components. However, due to the shrinking space on the PCB, the edges of the protective layer may be unable to cover the components and may warp, reducing the electromagnetic shielding effect of the protective layer and affecting the yield of the PCB. Summary of the Invention

[0003] Embodiments of the present disclosure provide a printed circuit board and an electronic device to improve the electromagnetic shielding effect of the printed circuit board.

[0004] An embodiment of the present disclosure provides a printed circuit board, comprising:

[0005] substrate;

[0006] at least one component located on one side of the substrate;

[0007] At least one connection unit is located on the same side of the substrate as the components; the connection unit includes: at least one interface;

[0008] The protective layer is located on a side of the components and the connecting unit facing away from the substrate; the orthographic projection of the protective layer on the substrate covers the orthographic projection of the components on the substrate; and the protective layer contacts the connecting unit in at least a portion of the area outside at least one interface.

[0009] In some embodiments, the connecting unit includes:

[0010] At least one ground pin is located on at least one side of the at least one interface; the protective layer contacts the ground pin.

[0011] In some embodiments, at least a portion of the area where the protective layer contacts the connection unit is located between an orthographic projection of at least one interface on the substrate and an orthographic projection of at least one component on the substrate.

[0012] In some embodiments, the printed circuit board includes a plurality of components; orthographic projections of at least some of the plurality of components on the substrate are respectively located on both sides of an orthographic projection of at least one connection unit on the substrate in a first direction;

[0013] The protective layer contacts at least one interface on both sides in a first direction;

[0014] The length of the printed circuit board in the first direction is greater than the width of the printed circuit board in the second direction, and the second direction intersects the first direction.

[0015] In some embodiments, the substrate includes a first edge and a second edge extending along the second direction;

[0016] A distance between an orthographic projection of at least one connection unit on the substrate and a bisector of the substrate extending along the second direction is smaller than a distance between an orthographic projection of at least one connection unit on the substrate and the first edge or the second edge.

[0017] In some embodiments, the substrate includes a plurality of traces; the connecting unit is electrically connected to at least some of the plurality of components through at least some of the traces;

[0018] The substrate includes a third edge and a fourth edge extending along the first direction; the orthographic projection of the at least one connecting unit on the substrate is located between the third edge and the fourth edge;

[0019] A distance between an orthographic projection of at least one connection unit on the substrate and the third edge is smaller than a distance between an orthographic projection of at least one connection unit on the substrate and the fourth edge;

[0020] The orthographic projection of the component on the substrate does not overlap with the area between the connecting unit and the third edge and the area between the connecting unit and the fourth edge; the routing line is at least located in the area between the connecting unit and the fourth edge.

[0021] In some embodiments, the protective layer includes: a first region and a second region;

[0022] In a direction perpendicular to the substrate, an orthographic projection of the first region overlaps with the substrate, the second region does not overlap with the substrate, and the second region is located on a side of the third edge away from the fourth edge;

[0023] A width of the second region in the second direction is greater than or equal to 1 mm and less than or equal to 5 mm.

[0024] In some embodiments, the protective layer includes a first opening;

[0025] The orthographic projection of the interface on the substrate falls within the orthographic projection of the first opening on the substrate.

[0026] In some embodiments, the protective layer includes a first region, the first region including: two first sub-portions located on both sides of the interface in a first direction, and at least one second sub-portion;

[0027] The first subsection is in contact with the connecting unit;

[0028] The orthographic projection of the second sub-portion on the substrate is located on one side of the orthographic projection of the connecting unit on the substrate in the second direction, and the second sub-portion is in contact with the substrate;

[0029] The second sub - part connects two first sub - parts; the protective layer further includes at least one second opening; at least one second opening is located between the area where the first sub - part contacts the connection unit and the area where the second sub - part connects to the substrate.

[0030] In some embodiments, the protective layer includes a first opening; the orthographic projection of the first opening on the substrate falls within the orthographic projection of the connection unit on the substrate;

[0031] Alternatively, the orthographic projection of the first opening on the substrate falls on the side of the connection unit facing the third edge or the fourth edge.

[0032] In some embodiments, the protective layer includes: a first insulating protective layer, a conductor layer, and a second insulating protective layer stacked in sequence on the side away from the substrate;

[0033] The orthographic projection of the area where the protective layer contacts the connection unit on the substrate does not overlap with the orthographic projection of the first insulating protective layer on the substrate;

[0034] The orthographic projection of the conductor layer on the substrate overlaps with the orthographic projection of the connection unit on the substrate, and the conductor layer contacts the connection unit;

[0035] The orthographic projection of the conductor layer on the substrate falls within the orthographic projection of the second insulating protective layer on the substrate.

[0036] In some embodiments, the connection unit includes a ground pin, and the conductor layer contacts the ground pin.

[0037] In some embodiments, in the direction perpendicular to the substrate, the thickness of the protective layer is greater than the thickness of the interface.

[0038] In some embodiments, in the direction perpendicular to the substrate, the thickness of the interface is greater than the thickness of the ground pin.

[0039] An electronic device provided by an embodiment of the present disclosure, the electronic device includes:

[0040] A printed circuit board provided by an embodiment of the present disclosure;

[0041] A display panel, electrically connected to the printed circuit board.

[0042] The printed circuit board and the display device provided by the embodiments of the present disclosure, the protective layer contacts the connection unit, thereby avoiding the problem of edge warping caused by the inability of the protective layer to contact the substrate in the area between the component and the connection unit, and can also protect the side of the component, improving the electromagnetic shielding effect of the protective layer. When the printed circuit board is applied to an electronic product, it can improve the electromagnetic interference resistance of the electronic product and enhance the user experience. Moreover, the protective layer contacts the connection unit in the area outside the interface of the connection unit, that is, the contact between the two does not affect the electrical connection between the connection unit and other devices. Description of the Drawings

[0043] To more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can also be obtained based on these drawings.

[0044] Figure 1 A schematic structural diagram of a printed circuit board provided by the related art;

[0045] Figure 2 A schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0046] Figure 3 Another schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0047] Figure 4 Another schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0048] Figure 5 Another schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0049] Figure 6 Another schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0050] Figure 7 Another schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0051] Figure 8 Another schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0052] Figure 9 Another schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0053] Figure 10 Another schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0054] Figure 11 Another schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0055] Figure 12 Another schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0056] Figure 13 Another schematic structural diagram of a printed circuit board provided by an embodiment of the present disclosure;

[0057] Figure 14 A schematic structural diagram of an electronic device provided by an embodiment of the present disclosure. Detailed implementation manners

[0058] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some but not all of the embodiments of the present disclosure. And, without conflict, the embodiments in the present disclosure and the features in the embodiments may be combined with each other. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the protection scope of the present disclosure.

[0059] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the ordinary meanings understood by those of ordinary skill in the art to which the present disclosure pertains. The "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are only used to distinguish different components. The terms such as "including" or "comprising" mean that the elements or items appearing before this term cover the elements or items listed after this term and their equivalents, without excluding other elements or items. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0060] It should be noted that the sizes and shapes of the various figures in the drawings do not reflect the true proportions, and the purpose is only to schematically illustrate the content of the present disclosure. Also, the same or similar reference numerals throughout the drawings denote the same or similar elements or elements having the same or similar functions.

[0061] In the related art, as Figure 1 shown, the distance h1 between the component 2 and the connection unit 3 is very small. For the component 2 closest to the connection unit 3, the space between the component 2 and the connection unit 3 is not sufficient for the edge of the protective layer 4 to wrap around the side of the component 2 and contact the substrate 1, and the edge region of the protective layer 4, i.e., the E1 region in the figure, will be warped, affecting the electromagnetic shielding effect of the protective layer. When the printed circuit board is applied to electronic products such as displays, electromagnetic interference is more likely to occur, affecting the user experience.

[0062] An embodiment of the present disclosure provides a printed circuit board, as Figure 2 shown, the printed circuit board includes:

[0063] A substrate 1;

[0064] At least one component 2, located on one side of the substrate 1;

[0065] At least one connection unit 3, on the same side of the substrate 1 as the component 2; the connection unit 3 includes: at least one interface 301;

[0066] A protective layer 4, on the side of the component 2 and the connection unit 3 away from the substrate 1; the orthographic projection of the protective layer 4 on the substrate 1 covers the orthographic projection of the component 2 on the substrate 1; at least a partial area of the protective layer 4 outside at least one interface 301 is in contact with the connection unit 3.

[0067] In the printed circuit board provided by the embodiment of the present disclosure, the protective layer is in contact with the connection unit, so that the problem of edge warping caused by the inability of the protective layer to contact the substrate in the area between the component and the connection unit can be avoided, and the side of the component can also be protected, improving the electromagnetic shielding effect of the protective layer. When the printed circuit board is applied to an electronic product, the electromagnetic interference resistance of the electronic product can be improved, enhancing the user experience. Moreover, the protective layer is in contact with the connection unit in the area outside the interface of the connection unit, that is, the contact between the two does not affect the electrical connection between the connection unit and other devices.

[0068] It should be noted that the printed circuit board can be applied to electronic devices such as display devices. Taking a display device as an example, the printed circuit board is electrically connected to the driving module of the main board of the display device through connection components such as a flexible circuit board. One end of the connection components such as the flexible circuit board is connected to the interface, and the connection method can be plugging.

[0069] In some embodiments, as Figure 2 、 Figure 3 shown, the printed circuit board includes one connection unit 3; the connection unit 3 includes one interface 301.

[0070] In some embodiments, as Figure 2 、 Figure 3 shown, the printed circuit board includes multiple components 2;

[0071] As Figure 3 shown, the substrate 1 includes multiple traces 101; the connection unit 3 is electrically connected to at least some of the multiple components 2 through at least some of the multiple traces 101.

[0072] It should be noted that Figure 3 Taking the printed circuit board including 4 components 2 electrically connected to the connection unit 3 through traces 101 as an example for illustration.

[0073] In some embodiments, the substrate includes: a first substrate, at least one conductive layer on one side of the first substrate, and at least one insulating layer;

[0074] The insulating layer is at least located on the side of at least one conductive layer facing away from the first substrate, that is, the insulating layer is provided above the conductive layer furthest from the first substrate;

[0075] At least one conductive layer includes a plurality of traces; the insulating layer on the side of at least one conductive layer facing away from the first substrate includes vias; components are electrically connected to the traces through the vias;

[0076] When the substrate includes a plurality of conductive layers stacked, the insulating layer is also located between two adjacent conductive layers; two adjacent conductive layers are electrically connected through the vias of the insulating layer therebetween.

[0077] In some embodiments, when the printed circuit board is applied to a display device, the plurality of components include, for example: a timing controller, a flash memory unit, a logic power management unit. The timing controller and the logic power management unit are both electrically connected to the connection unit through traces.

[0078] In some embodiments, when the display device includes an organic light-emitting diode display panel, the plurality of components further include: a light-emitting control power management unit. The light-emitting control power management unit is electrically connected to the connection unit through a trace.

[0079] In some embodiments, the timing controller, the flash memory unit, the logic power management unit, and the light-emitting control power management unit are integrated circuit chips.

[0080] In some embodiments, the plurality of components of the printed circuit board may further include: components such as capacitors, resistors, transistors, etc. The specific components included in the printed circuit board can be set according to its actual application scenario and function.

[0081] In some embodiments, as Figure 2 shown, at least a part of the area where the protective layer 4 contacts the connection unit 3 in the orthographic projection on the substrate 1 is located between the orthographic projection of at least one interface 301 on the substrate 1 and the orthographic projection of at least one component 2 on the substrate 1.

[0082] For the printed circuit board provided by the embodiments of the present disclosure, at least a part of the area where the protective layer contacts the connection unit in the orthographic projection on the substrate is located between the orthographic projection of at least one interface on the substrate and the orthographic projection of at least one component on the substrate, that is, the protective layer can cover the side surface of the component closest to the connection unit, improving the electromagnetic shielding effect of the protective layer.

[0083] In some embodiments, as Figure 2 、 Figure 3 shown, the orthographic projections of at least some of the plurality of components 2 on the substrate 1 are respectively located on both sides of the orthographic projection of at least one connection unit 3 on the substrate 1 in the first direction X;

[0084] The protective layer 4 is in contact with at least one interface 301 on both sides in the first direction X;

[0085] The length h3 of the printed circuit board in the first direction X is greater than the width h4 of the printed circuit board in the second direction Y, and the second direction Y intersects the first direction X.

[0086] For the printed circuit board provided in the embodiment of the present disclosure, the length h3 of the printed circuit board in the first direction X is greater than the width h4 of the printed circuit board in the second direction Y, that is, the space of the printed circuit board in the first direction X is more sufficient than its space in the second direction Y. Multiple components are respectively located on both sides of the connection unit in the first direction X, which can reduce the difficulty of arranging the components and also reduce the design difficulty of the traces for electrically connecting the components and the connection unit. Compared with the case where multiple components are only located on one side of the connection unit, it is possible to reduce the routing space of multiple traces in the second direction, which is more conducive to reducing the width h4 of the printed circuit board in the second direction Y. The protective layer is in contact with the interface on both sides in the first direction X, so that the protective layer can cover the side surfaces of the components closest to the connection unit in the first direction X, improving the electromagnetic shielding effect of the protective layer.

[0087] In some embodiments, as Figure 3 shown, the substrate 1 includes a first edge A1 and a second edge A2 that extend along the second direction Y; for example, the first edge A1 and the second edge A2 are parallel to each other;

[0088] The distance h5 between the orthographic projection of at least one connection unit 3 on the substrate 1 and the bisector F1 of the substrate 1 extending along the second direction Y is less than the distance h6 between the orthographic projection of at least one connection unit 3 on the substrate 1 and the first edge A1 or the second edge A2.

[0089] That is, the connection unit 3 is closer to the middle region of the substrate 1.

[0090] In some embodiments, as Figure 3 shown, the orthographic projection of at least one connection unit 3 on the substrate 1 overlaps with the bisector F1 of the substrate 1 extending along the second direction Y. That is, the bisector F1 passes through the orthographic projection of at least one connection unit 3 on the substrate 1.

[0091] In some embodiments, as Figure 3 shown, the substrate 1 includes a third edge A3 and a fourth edge A4 that extend along the first direction X; the orthographic projection of at least one connection unit 3 on the substrate 1 is located between the third edge A3 and the fourth edge A4;

[0092] The distance h7 between the orthographic projection of at least one connection unit 3 on the substrate 1 and the third edge A3 is less than the distance h8 between the orthographic projection of at least one connection unit 3 on the substrate 1 and the fourth edge A4;

[0093] The orthographic projection of component 2 on substrate 1 does not overlap with the regions between connection unit 3 and third edge A3 and between connection unit 3 and fourth edge A4; trace 101 is at least located in the region between connection unit 3 and fourth edge A4.

[0094] That is, for the printed circuit board provided in the embodiments of the present disclosure, components are not provided between the connection unit and the third edge and between the connection unit and the fourth edge, thereby avoiding increasing the size of the substrate in the second direction Y. The distance between the connection unit and the third edge is less than the distance between the connection unit and the fourth edge, thereby improving the routing space of the trace located between the connection unit and the fourth edge.

[0095] In some embodiments, as Figure 2 shown, the distance h1 between connection unit 3 and component 2 is greater than 0 and less than or equal to 5 millimeters, and the thickness h2 of the thickest component 2 is greater than or equal to 0.5 millimeter and less than or equal to 1.1 millimeters.

[0096] It should be noted that the printed circuit board includes a relatively large number of components. In order to reduce the size of the printed circuit board, the setting space of the components is limited, and components need to be arranged around the connection unit. The distance between the connection unit and the component is small, and the thickness of the component is thick, so the protective layer is likely to warp at the covering edge of the component close to the connection unit, affecting the shielding effect. For the printed circuit board provided in the embodiments of the present disclosure, since the protective layer contacts the connection unit, even if the distance between the connection unit and the component is very small and the thickness of the component is thick, the protective layer will not warp badly, and the electromagnetic shielding effect can be improved.

[0097] In some embodiments, as Figure 2 、 Figure 3 shown, connection unit 3 includes:

[0098] At least one grounding pin 302, located on at least one side of at least one interface 301; protective layer 4 contacts grounding pin 302.

[0099] For the printed circuit board provided in the embodiments of the present disclosure, the protective layer contacts the grounding pin of the connection unit, that is, the protective layer is grounded, thereby increasing the electrostatic discharge path of the protective layer without changing the setting mode of the connection unit and avoiding electrostatic accumulation.

[0100] In some embodiments, as Figure 3 shown, connection unit 3 includes a peripheral area N1 surrounding interface 301; peripheral area N1 includes grounding pin 302.

[0101] In some embodiments, as Figure 3 shown, the entire peripheral area N1 is grounding pin 302; protective layer 4 contacts a partial area of peripheral area N1.

[0102] In some embodiments, the ground pin is a metal pin.

[0103] In some embodiments, as Figure 3 shown, the protective layer 4 includes: a first region B1 and a second region B2;

[0104] In a direction perpendicular to the substrate 1, the orthographic projection of the first region B1 overlaps with the substrate 1, the second region B2 does not overlap with the substrate 1, and the second region B2 is located on a side of the third edge A3 away from the fourth edge A4.

[0105] For the printed circuit board provided by the embodiments of the present disclosure, in addition to having the function of electromagnetic shielding, the protective layer also has the function of static electricity conduction. When the printed circuit board is applied to an electronic device, the second region beyond the base region can contact the assembly frame of the electronic device, etc., so as to ground the second region and release static electricity to avoid static electricity accumulation.

[0106] In some embodiments, as Figure 3 shown, in a direction perpendicular to the substrate 1, the orthographic projection of the first region B1 covers the substrate 1.

[0107] In specific implementation, it can be set that the size of the first region in the first direction is greater than the size of the substrate in the first direction, and the size of the first region in the second direction is greater than the size of the substrate in the second direction. Thus, even if there is a misalignment, it can be ensured that the first region covers the substrate, avoiding the situation where the first region exposes the substrate, and the protection effect of the protective layer can be improved.

[0108] In some embodiments, as Figure 3 shown, the width h9 of the second region B2 in the second direction Y is greater than or equal to 1 mm and less than or equal to 5 mm.

[0109] In the related art, in order to ensure the static electricity release effect of the second region, the width of the second region in the second direction is usually greater than 5 mm.

[0110] For the printed circuit board provided by the embodiments of the present disclosure, since the protective layer is electrically connected to the ground pin of the connection unit, it is equivalent to increasing the path of static electricity release. h9 is greater than or equal to 1 mm and less than or equal to 5 mm, that is, it is equivalent to reducing the width of the second region in the second direction, and further reducing the overall width of the printed circuit board in the second direction. When the printed circuit board is applied to an electronic device, the assembly space of the printed circuit board can be reduced, and further the volume of the electronic device can be reduced.

[0111] In some embodiments, as Figure 4 shown, the substrate 1 further includes at least one first bonding region N2;

[0112] The first bonding region N2 includes a plurality of bonding pins 102.

[0113] It should be noted that when the printed circuit board is applied to a display device, the printed circuit board also needs to be electrically connected to the display panel. The display device further includes a flexible circuit board that is bonded to the printed circuit board and the display panel. The flexible circuit board is bonded to the printed circuit board in the first bonding region and is electrically connected to the plurality of bonding pins.

[0114] In some embodiments, as Figure 4 shown, the first bonding region N2 is adjacent to the fourth edge A4. That is, it is bonded to the display panel closer to the fourth edge A4, which will not affect the contact between the second region of the protective layer and the display device frame.

[0115] In some embodiments, as Figure 4 shown, in the direction perpendicular to the substrate 1, the orthographic projection of the first region B1 does not overlap with the first bonding region N2. Thereby, it can be avoided that the protective layer affects the bonding of the printed circuit board.

[0116] In some embodiments, as Figure 2 shown, in the direction perpendicular to the substrate 1, the thickness of the interface 301 is greater than the thickness of the ground pin 302. Thereby, it is convenient for the protective layer 4 to contact the ground pin 302.

[0117] In some embodiments, as Figure 2 shown, the thickness of the protective layer 4 is less than the thickness of the connection unit 2.

[0118] Or, in some embodiments, as Figure 5 shown, in the direction perpendicular to the substrate 1, the thickness of the protective layer 4 is greater than the thickness of the interface 301.

[0119] In some embodiments, as Figure 5 shown, the protective layer 4 includes: a first insulating protective layer 401, a conductor layer 402, and a second insulating protective layer 403 that are sequentially stacked on the side away from the substrate 1;

[0120] The orthographic projection of the region where the protective layer 4 contacts the connection unit 3 on the substrate 1 does not overlap with the orthographic projection of the first insulating protective layer 401 on the substrate 1; that is, the first insulating protective layer 401 exposes the region that contacts the connection unit 3;

[0121] The orthographic projection of the conductor layer 402 on the substrate 1 overlaps with the orthographic projection of the connection unit 3 on the substrate 1, and the conductor layer 402 contacts the connection unit 3;

[0122] The orthographic projection of the conductor layer 402 on the substrate 1 falls within the orthographic projection of the second insulating protective layer 403 on the substrate 1.

[0123] In some embodiments, as Figure 5As shown, the conductor layer 402 is in contact with the ground pin 302.

[0124] For the printed circuit board provided by the embodiments of the present disclosure, the first insulating protective layer exposes the area in contact with the connection unit, so that the conductor layer can contact the ground pin of the connection unit to release static electricity.

[0125] In some embodiments, the first area of the protective layer includes the first insulating protective layer, and the second area of the protective layer does not include the first insulating protective layer; that is, the conductor layer is exposed in the second area, so that the conductor layer can contact the assembly frame of the electronic component for static electricity release.

[0126] In some embodiments, both the first area and the second area include a conductor layer and a second insulating protective layer.

[0127] In some embodiments, in the direction perpendicular to the substrate, the orthographic projection of the conductor layer falls within the orthographic projection of the second insulating protective layer. That is, the second insulating protective layer covers the conductor layer.

[0128] In some embodiments, the width of the second insulating protective layer in the first direction is greater than the width of the conductor layer in the first direction, and the width of the second insulating protective layer in the second direction is greater than the width of the conductor layer in the second direction. Thus, the situation where the second insulating protective layer cannot completely cover the conductor layer due to alignment deviation can be avoided.

[0129] In some embodiments, the first insulating protective layer and the second insulating protective layer are insulating mylar. The material of the insulating mylar is, for example, polycarbonate (PC) or polyethylene glycol terephthalate (PET). Among them, polycarbonate is also called PC plastic.

[0130] In some embodiments, the conductor layer is a conductor mylar, and the conductor mylar is, for example, copper foil or aluminum foil. Or,

[0131] The conductor layer is a conductive cloth, and the conductive cloth includes: a substrate layer, and conductive particle layers located on both sides of the substrate layer on the side facing the first insulating protective layer and the side facing the second insulating protective layer, respectively.

[0132] In some embodiments, as Figure 3 、 Figure 4 shown, the protective layer 4 includes a first opening C1;

[0133] The orthographic projection of the interface 301 on the substrate 1 falls within the orthographic projection of the first opening C1 on the substrate 1.

[0134] In the printed circuit board provided by the embodiments of the present disclosure, the first opening of the protective layer exposes the interface of the connection unit, so that the contact between the protective layer and the connection unit will not affect the connection between the interface and other devices, and the difficulty of connecting the interface with other devices can be reduced.

[0135] In some embodiments, as Figure 3 , Figure 4 shown, the first opening C1 divides the second region B2 into two parts arranged along the first direction X. The first opening C1 is a non-closed opening, and in the region on the side of the interface 301 away from the fourth edge A4, the protective layer 4 is completely removed.

[0136] Of course, in some embodiments, the first opening may also be a closed opening, that is, as Figure 6 shown, the orthographic projection of the protective layer 4 on the substrate 1 surrounds the orthographic projection of the interface 301 on the substrate 1.

[0137] In some embodiments, as Figure 3 , Figure 4 , Figure 6 shown, in the region on the side of the interface 301 facing the fourth edge A4, the protective layer 4 is not completely removed, that is, in the direction perpendicular to the substrate 1, the orthographic projection of the protective layer 4 overlaps with the region on the side of the interface 301 facing the fourth edge A4.

[0138] In some embodiments, as Figure 7 shown, the first region B1 includes: two first sub-parts 4-1 respectively located on both sides of the interface 301 in the first direction X, and at least one second sub-part 4-2;

[0139] The first sub-part 4-1 is in contact with the connection unit 3;

[0140] The orthographic projection of the second sub-part 4-2 on the substrate 1 is located on one side of the orthographic projection of the connection unit 3 on the substrate 1 in the second direction Y, and the second sub-part 4-2 is in contact with the substrate 1;

[0141] The second sub-part 4-2 connects the two first sub-parts 4-1; the protective layer 4 further includes at least one second opening C2; at least one second opening C2 is located between the region where the first sub-part 4-1 is in contact with the connection unit and the connection region between the second sub-part 4-2 and the substrate 1.

[0142] It should be noted that the first sub-part is in contact with the connection unit, while the second sub-part is in contact with the substrate. Since the connection unit is higher than the substrate, there is a step difference between the first sub-part and the second sub-part. There may be uneven areas in the regions where the wave nonsense is in contact with the connection unit and the substrate, affecting the coating effect of the protective layer.

[0143] The printed circuit board provided by the embodiments of the present disclosure includes at least one second opening between the area where the first sub - part contacts the connection unit and the connection area between the second sub - part and the substrate, that is, between the area where the first sub - part contacts the connection unit and the connection area between the second sub - part and the substrate, the protective layer has a disconnection area, which can avoid uneven contact caused by a step difference between the first sub - part and the second sub - part.

[0144] It should be noted that, for clearly showing the second opening C2, Figure 7 only a partial area of the printed circuit board is shown, and the traces and components are not shown.

[0145] In some embodiments, as Figure 7 shown, the extension directions of the edge of the second sub - part 4 - 2 facing the first opening C1 and the edge of the first sub - part 4 - 1 facing the first opening C1 intersect, that is, there is a corner area at the connection of the extension lines of the edge of the second sub - part 4 - 2 facing the first opening C1 and the edge of the first sub - part 4 - 1 facing the first opening C1, and the second opening C2 is at least located in the corner area.

[0146] In some embodiments, as Figure 7 shown, at least one second opening C2 communicates with the first opening C1.

[0147] In some embodiments, as Figure 7 shown, at least one second opening C2 extends along the second direction Y.

[0148] Or, in some embodiments, as Figure 8 shown, at least one second opening C2 extends along the first direction X.

[0149] Or, in some embodiments, as Figure 9 shown, the extension direction of at least one second opening C2 intersects both the first direction X and the second direction Y.

[0150] In some embodiments, as Figures 7 - 9 shown, the shape of at least one second opening C2 is strip - shaped.

[0151] Or, in some embodiments, as Figure 10 shown, the shape of at least one second opening C2 is non - linear, Figure 9 taking the shape of the second opening C2 as a curve as an example. Of course, the shape of the second opening C2 can also be a broken - line shape or other shapes.

[0152] It should be noted that, Figures 7 - 10 taking there being one second opening C2 between the area where the first sub - part 4 - 1 contacts the connection unit and the connection area between the second sub - part 4 - 2 and the substrate 1 as an example for illustration. Of course, in some embodiments, asFigure 11 As shown, between the region where the first sub - part 4 - 1 contacts the connection unit and the connection region between the second sub - part 4 - 2 and the substrate 1, there are a plurality of second openings C2.

[0153] It should be noted that Figures 3 - 4 , Figures 6 - 11 Taking the first opening C1 exposing the interface 301 as an example for illustration. Of course, the first opening C1 can also be set at other positions.

[0154] In some embodiments, as Figure 12 shown, the orthographic projection of the first opening C1 on the substrate 1 falls within the orthographic projection of the connection unit 3 on the substrate 1;

[0155] Or, as Figure 13 shown, the orthographic projection of the first opening C1 on the substrate 1 falls on the side of the connection unit 3 facing the third edge A3 or the fourth edge A4.

[0156] For the printed circuit board provided by the embodiments of the present disclosure, the protective layer is provided with a first opening, and the device electrically connected to the connection unit can pass through the first opening to connect with the interface.

[0157] It should be noted that Figure 13 Taking the case where the orthographic projection of the first opening C1 on the substrate 1 falls on the side of the connection unit 3 facing the fourth edge A4 as an example for illustration. In the region between the first opening C1 and the interface 301, the protective layer 4 is not connected to the substrate 1 and the connection unit 3.

[0158] In some embodiments, as Figure 12 , Figure 13 shown, the first opening C1 is a closed opening, that is, the orthographic projection of the first opening C1 on the substrate 1 is surrounded by the orthographic projection of the protective layer 4 on the substrate 1.

[0159] In some embodiments, when the first opening no longer exposes the interface, the length of the first opening in the first direction and its width in the second direction can be set according to the size of the device connected to the connection unit. The length of the first opening in the first direction is greater than the length of the device connected to the connection unit in the first direction, and the width of the first opening in the second direction is at least greater than the thickness of the device connected to the connection unit.

[0160] Based on the same inventive concept, the embodiments of the present disclosure also provide an electronic device, and the electronic device includes:

[0161] The printed circuit board provided by the embodiments of the present disclosure.

[0162] Since the electronic device provided by the embodiment of the present disclosure includes the printed circuit board provided by the embodiment of the present disclosure, the protective layer of the printed circuit board is in contact with the connection unit, so that the problem of edge warping caused by the inability of the protective layer to contact the substrate in the area between the component and the connection unit can be avoided, and the side of the component can be protected, improving the electromagnetic shielding effect of the protective layer, improving the electromagnetic interference resistance of the electronic product, and enhancing the user experience. Moreover, the protective layer is in contact with the connection unit in the area outside the interface of the connection unit, that is, the contact between the two does not affect the electrical connection between the connection unit and other devices.

[0163] In some embodiments, as Figure 14 shown, the electronic device further includes:

[0164] A display panel 5, electrically connected to the printed circuit board 6.

[0165] That is, the electronic device provided by the embodiment of the present disclosure is a display device. The display device provided by the embodiment of the present disclosure is: any product or component with a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc. Other essential components of the display device should be understood by those of ordinary skill in the art and will not be elaborated here, nor should they be regarded as a limitation to the present disclosure.

[0166] In some embodiments, as Figure 14 shown, the electronic device further includes:

[0167] At least one flexible circuit board 7, electrically connected to the printed circuit board 6 and the display panel 5;

[0168] At least one connection part 8, electrically connected to the connection unit 3 of the printed circuit board 6;

[0169] A main board 9, the main board 9 is electrically connected to the connection unit 3 of the printed circuit board 6 through the connection part 8; that is, one end of the connection part 8 is electrically connected to the connection unit 3 of the printed circuit board 6, and the other end of the connection part 8 is electrically connected to the main board 9.

[0170] In some embodiments, as Figure 14 shown, the peripheral area NA3 of the display panel 5 includes a fan-out area NA302;

[0171] The fan-out area NA302 includes a second bonding area NA3021;

[0172] One end of the flexible circuit board 7 is bonded to the second bonding area NA3021, and the other end of the flexible circuit board 7 is bonded to the first bonding area NA2 of the printed circuit board 6.

[0173] In some embodiments, the display panel has a front side and a back side, where the front side is the display side of the display panel and the back side faces away from the display side; the display panel includes a display area and a peripheral area surrounding the display area; as Figure 14 shown, the peripheral area NA3 of the display panel 5 further includes a bending area NA301; the bending area NA301 is bent along a bending axis (not shown) so that the fan-out area NA302 is located on the back side 5-1 of the display panel;

[0174] It should be noted that when the bending area is in an unbent state, the fan-out area is located on the side of the bending area away from the display area. Figure 14 The components on the printed circuit board 6 are not shown. Figure 14 In the example, the main board 9 is located on the side of the printed circuit board 6 away from the fan-out area NA301. Figure 14 In the example, the electronic device includes a flexible circuit board 7 electrically connecting the display panel 5 and the printed circuit board 6. In some embodiments, the electronic device may also include multiple flexible circuit boards 7 electrically connecting the display panel 5 and the printed circuit board 6.

[0175] In some embodiments, a driving chip is also bonded to the flexible circuit board electrically connecting the display panel and the printed circuit board.

[0176] In some embodiments, the connecting portion may be a flexible circuit board, or the connecting portion may also be a patch cord; the patch cord includes multiple signal lines.

[0177] It should be noted that the test of electromagnetic field interference (EMI) of an electronic device is a very important test. The desensitization index of the EMI test is one of the important indexes to measure the quality of the electronic device. A desensitization value less than 2 is generally considered to have better electromagnetic interference resistance. The EMI test needs to perform electromagnetic radiation interference on different areas of the printed circuit board, and the average desensitization value of each test position is used as the desensitization value of the EMI test. The smaller the desensitization value, the better the electromagnetic radiation resistance of the printed circuit board, and correspondingly, the better the electromagnetic field interference resistance of the electronic device. In the related art, for a printed circuit board where the protective layer cannot cover the side of the component near the connection unit and is prone to warping, the desensitization value of the EMI test is usually greater than 3. However, for the electronic device provided by the embodiments of the present disclosure, the protective layer of the printed circuit board is in contact with the connection unit, which can avoid the warping of the protective layer. The desensitization value of the EMI test is about 0.8, which can greatly reduce the desensitization value compared with the related art and improve the electromagnetic interference resistance.

[0178] In summary, for the printed circuit board and the electronic device provided by the embodiments of the present disclosure, the protective layer is in contact with the connection unit, thereby avoiding the problem of edge warping caused by the inability of the protective layer to contact the substrate in the area between the component and the connection unit, and can also protect the side surface of the component, improving the electromagnetic shielding effect of the protective layer. When the printed circuit board is applied to an electronic product, the electromagnetic interference resistance of the electronic product can be improved, enhancing the user experience. Moreover, the protective layer is in contact with the connection unit in the area outside the interface of the connection unit, that is, the contact between the two does not affect the electrical connection between the connection unit and other devices.

[0179] Although the preferred embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications to these embodiments once they learn the basic creative concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0180] Obviously, those skilled in the art can make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalent technologies, the present disclosure is also intended to include these modifications and variations.

Claims

1. A printed circuit board, wherein, The printed circuit board includes: a substrate; at least one component located on one side of the substrate; at least one connection unit located on the same side of the substrate as the component; the connection unit includes: at least one interface; a protective layer located on the side of the component and the connection unit facing away from the substrate; the orthographic projection of the protective layer on the substrate covers the orthographic projection of the component on the substrate; at least a partial area of the protective layer outside the at least one interface is in contact with the connection unit.

2. The printed circuit board according to claim 1, wherein, The connection unit includes: at least one ground pin located on at least one side of the at least one interface; the protective layer is in contact with the ground pin.

3. The printed circuit board according to claim 1 or 2, wherein The orthographic projection on the substrate of at least a partial area of the protective layer in contact with the connection unit is located between the orthographic projection of the at least one interface on the substrate and the orthographic projection of at least one of the components on the substrate.

4. The printed circuit board according to claim 3, wherein, The printed circuit board includes a plurality of the components; at least a partial area of the orthographic projections of the plurality of components on the substrate are respectively located on both sides of the orthographic projection of at least one of the connection units on the substrate in a first direction; The protective layer is in contact with both sides of at least one of the interfaces in the first direction; The length of the printed circuit board in the first direction is greater than the width of the printed circuit board in a second direction, and the second direction intersects the first direction.

5. The printed circuit board according to claim 4, wherein, The substrate includes a first edge and a second edge extending along the second direction; The distance between the orthographic projection of at least one of the connection units on the substrate and the bisector of the substrate extending along the second direction is less than the distance between the orthographic projection of at least one of the connection units on the substrate and the first edge or the second edge.

6. The printed circuit board according to claim 4, wherein, The substrate includes a plurality of traces; the connection unit is electrically connected to at least a partial area of the plurality of components through at least a partial area of the plurality of traces; The substrate includes a third edge and a fourth edge extending along the first direction; The orthographic projection of at least one of the connection units on the substrate is located between the third edge and the fourth edge; The distance between the orthographic projection of at least one of the connection units on the substrate and the third edge is less than the distance between the orthographic projection of at least one of the connection units on the substrate and the fourth edge; The orthographic projection of the component on the substrate does not overlap with the area between the connection unit and the third edge and the area between the connection unit and the fourth edge; the trace is at least located in the area between the connection unit and the fourth edge.

7. The printed circuit board according to claim 6, wherein, The protective layer includes: a first area and a second area; In the direction perpendicular to the substrate, the orthographic projection of the first area overlaps with the substrate, the second area does not overlap with the substrate, and the second area is located on the side of the third edge facing away from the fourth edge; The width of the second area in the second direction is greater than or equal to 1 mm and less than or equal to 5 mm.

8. The printed circuit board according to any one of claims 1 to 2, 4 to 7, wherein, The protective layer includes a first opening; The orthographic projection of the interface on the substrate falls within the orthographic projection of the first opening on the substrate.

9. The printed circuit board according to claim 8, wherein, The protective layer includes a first region, and the first region includes: two first sub-parts respectively located on both sides of the interface in a first direction, and at least one second sub-part; The first sub-part is in contact with the connection unit; The positive projection of the second sub-part on the substrate is located on one side of the positive projection of the connection unit on the substrate in a second direction, and the second sub-part is in contact with the substrate; The second sub-part connects the two first sub-parts; the protective layer further includes at least one second opening; the at least one second opening is located between the region where the first sub-part is in contact with the connection unit and the connection region between the second sub-part and the substrate.

10. The printed circuit board according to any one of claims 1 to 2, 4 to 7, wherein, The protective layer includes a first opening, and the substrate includes a third edge and a fourth edge; the positive projection of the first opening on the substrate falls within the positive projection of the connection unit on the substrate; Alternatively, the positive projection of the first opening on the substrate falls on one side of the connection unit facing the third edge or the fourth edge.

11. The printed circuit board according to any one of claims 1 to 2, 4 to 7, and 9, wherein, The protective layer includes: a first insulating protective layer, a conductor layer, and a second insulating protective layer stacked in sequence on a side away from the substrate; The positive projection of the region where the protective layer is in contact with the connection unit on the substrate does not overlap with the positive projection of the first insulating protective layer on the substrate; The positive projection of the conductor layer on the substrate overlaps with the positive projection of the connection unit on the substrate, and the conductor layer is in contact with the connection unit; The positive projection of the conductor layer on the substrate falls within the positive projection of the second insulating protective layer on the substrate.

12. The printed circuit board according to claim 11, wherein, The connection unit includes a ground pin, and the conductor layer is in contact with the ground pin.

13. The printed circuit board according to any one of claims 1 to 2, 4 to 7, 9, and 12, wherein, In a direction perpendicular to the substrate, the thickness of the protective layer is greater than the thickness of the interface.

14. The printed circuit board according to claim 13, wherein, In a direction perpendicular to the substrate, the thickness of the interface is greater than the thickness of the ground pin.

15. An electronic device, wherein, The electronic device includes: The printed circuit board according to any one of claims 1 to 14; A display panel, electrically connected to the printed circuit board.

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