High-power thick film heating device for new energy automobile

Abstract

The invention provides a high-power thick film heating device for a new energy automobile. The high-power thick film heating device comprises a thick film heating plate, a ceramic medium surface layer is arranged on the upper surface of the thick film heating plate, a metal substrate surface is arranged on the lower surface of the thick film heating plate, an upper runner cavity mechanism is arranged above the thick film heating plate, and a lower runner cavity mechanism is arranged below the thick film heating plate; according to the thick film heating device, the single-layer thick film heating plate is adopted and matched with the upper runner cavity mechanism and the lower runner cavity mechanism to conduct up-down parallel flow guiding on the heat-conducting medium, so that heat on the upper face and the lower face of the thick film heating plate is synchronously absorbed through the heat-conducting medium, the double-face heat exchange effect is achieved, and the heat exchange coefficient and the heat exchange area of the thick film heating device are increased; therefore, the maximum power density limitation of the thick film heating plate in the traditional design is broken through, the thick film heating device can realize higher electric power output under the same area, and meanwhile, due to the improvement of the heat exchange capability, the heat conversion efficiency of the product is also improved.

Description

Technical Field

[0001] The present invention relates to a heating device, specifically a high-power thick-film heating device for energy vehicles, belonging to the technical field of new energy vehicle coolant heating. Background Technique

[0002] With the increase in the capacity of the vehicle's high-voltage battery and the requirements for cockpit heating, defrosting, and demisting, etc., the vehicle's power demand for the electric heater is continuously increasing, and higher requirements are also put forward for the product's volume size, efficiency, and cost. Due to the limitation of the maximum operating power density of the thick-film heating plate, the thick-film heater needs to increase the planar area of the thick-film heating plate to achieve power increase; the currently known design solutions on the market are generally as follows: Solution 1: Achieve the arrangement of a large-area thick-film heating plate by increasing the size of the heater; Solution 2: Achieve the improvement of the thick-film heating plate area and thus the power increase through the design solution of two-layer heating plates; However, the product in Solution 1 has a large planar size, it is difficult to meet the design requirements for the flatness of the heating plate, and the cost is relatively high. While the product in Solution 2 has low heat conversion efficiency, complex structural design, low reliability, and the parts and overall manufacturing cost of this solution are relatively high. Therefore, a high-power thick-film heating device for new energy vehicles is proposed. Summary of the Invention

[0003] In view of this, the present invention provides a high-power thick-film heating device for new energy vehicles to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0004] The technical solution of the embodiment of the present invention is implemented as follows: A high-power thick-film heating device for new energy vehicles includes a thick-film heating plate. A ceramic dielectric surface layer is provided on the upper surface of the thick-film heating plate, and a metal substrate surface is provided on the lower surface of the thick-film heating plate. An upper flow channel chamber mechanism is provided above the thick-film heating plate, and a lower flow channel chamber mechanism is provided below the thick-film heating plate. The upper flow channel chamber mechanism and the lower flow channel chamber mechanism are connected by bolt threads. The inlets and outlets of the upper flow channel chamber mechanism and the lower flow channel chamber mechanism are interconnected. A heat-conducting silicone pad is applied between the ceramic dielectric surface layer and the upper flow channel chamber mechanism, and a heat-conducting silicone coating is applied between the metal substrate surface and the lower flow channel chamber mechanism; Among them, the upper flow channel chamber mechanism and the lower flow channel chamber mechanism are used to conduct parallel upper and lower flow guiding of the heat exchange medium entering the thick-film heating device, and synchronously absorb the heat on both the upper and lower surfaces of the thick-film heating plate to perform double-sided heat exchange on a single thick-film heating plate.

[0005] Further preferably, the upper flow channel chamber mechanism includes an upper flow channel chamber frame, an upper flow channel chamber inlet, an upper flow channel chamber outlet, and an upper flow channel cover plate; Among them, the inlet of the upper flow channel chamber is opened on one side of the inner side wall of the upper flow channel frame, the outlet of the upper flow channel chamber is opened on the other side of the inner side wall of the upper flow channel frame, the upper flow channel cover plate is fixed and sealed in the middle of the inner side wall of the upper flow channel frame by friction welding process or sealing rubber strip, and the heat-conducting silica gel pad is pasted between the upper surface of the ceramic medium surface layer and the lower surface of the upper flow channel frame.

[0006] Further preferably, the lower flow channel chamber mechanism includes a lower flow channel frame, a lower flow channel chamber inlet, a lower flow channel chamber outlet, a total flow channel inlet, a total flow channel outlet and a lower flow channel cover plate; Among them, the heat-conducting silica gel coating is coated between the upper surface of the lower flow channel frame and the lower surface of the metal substrate surface. The lower flow channel frame is connected to the bottom of the upper flow channel frame by bolts in a threaded manner. The inlet of the lower flow channel chamber is opened on one side of the inner side wall of the lower flow channel frame, the outlet of the lower flow channel chamber is opened on the other side of the inner side wall of the lower flow channel frame. The lower flow channel chamber inlet and the upper flow channel chamber inlet are arranged vertically corresponding and communicated. The lower flow channel chamber outlet and the upper flow channel chamber outlet are arranged vertically corresponding and communicated. The total flow channel inlet is arranged on one side of the lower flow channel frame, the total flow channel outlet is arranged on the other side of the lower flow channel frame, and the lower flow channel cover plate and the lower flow channel frame are fixed and sealed by friction welding process or sealing rubber strip; Among them, the total flow channel inlet is used to introduce the heat exchange medium into the thick film heating device. The heat exchange medium is branched at the lower flow channel chamber inlet and the upper flow channel chamber inlet and enters the upper flow channel frame and the lower flow channel frame respectively; Among them, the total flow channel outlet is used to export the heat exchange medium from the thick film heating device. The heat exchange medium flowing out of the upper flow channel frame and the lower flow channel frame converges at the lower flow channel chamber outlet and the upper flow channel chamber outlet and is discharged through the total flow channel outlet.

[0007] Further preferably, a plurality of heat exchange fins are fixedly connected to the inner side walls of the upper flow channel frame and the lower flow channel frame. A heat exchange medium flow channel is formed between the plurality of heat exchange fins, and the plurality of heat exchange fins are integrally cast with the upper flow channel frame and the lower flow channel frame respectively.

[0008] Further preferably, an inlet sealing element, an outlet sealing element and a housing sealing element are fixedly connected to the bottom of the inner side wall of the upper flow channel frame. The inlet sealing element is arranged between the lower flow channel chamber inlet and the upper flow channel chamber inlet and is used to seal between the lower flow channel chamber inlet and the upper flow channel chamber inlet. The outlet sealing element is arranged between the lower flow channel chamber outlet and the upper flow channel chamber outlet and is used to seal between the lower flow channel chamber outlet and the upper flow channel chamber outlet.

[0009] Further preferably, a control chamber is provided at the top of the inner side wall of the upper flow channel cavity frame. A PCBA control board is installed on the inner side wall of the control chamber. One end of the thick film heating plate is provided with an ear. The ear penetrates the upper flow channel cavity frame and is electrically connected to the PCBA control board.

[0010] Further preferably, a sealant groove is formed on the upper surface of the upper flow channel cavity frame, and an upper cover plate is bonded to the inner side wall of the sealant groove.

[0011] Further preferably, the thermal conductivity coefficient of the material of the thermal conductive silicone coating is greater than 3 w / m·°C, and the thickness is 0.15 - 0.3 mm. The thermal conductivity coefficient of the thermal conductive silicone pad is greater than 3 w / m·°C, the original thickness is 0.7 - 0.8 mm, the Shore hardness is 60, and the residual thickness after compression is 0.5 mm ± 0.05 mm.

[0012] Further preferably, the thick film heating plate is composed of a heating resistance layer and a ceramic dielectric insulation layer; Among them, the ceramic dielectric insulation layer is printed on the surface of the metal substrate surface by screen printing, the heating resistance layer is printed on the surface of the ceramic dielectric insulation layer by screen printing, and the ceramic dielectric surface layer is printed on the surface of the heating resistance layer by screen printing.

[0013] Due to the above technical solutions adopted in the embodiments of the present invention, it has the following advantages: In the present invention, by adopting a single-layer thick film heating plate and cooperating with the upper flow channel chamber mechanism and the lower flow channel chamber mechanism to conduct the heat conduction medium in parallel up and down, so as to utilize the heat conduction medium to synchronously absorb the heat on both sides of the thick film heating plate, so as to achieve a double-sided heat exchange effect, so as to improve the heat exchange coefficient and heat exchange area of the thick film heating device, thereby breaking through the maximum power density limit that can be used in the traditional design of the thick film heating plate, enabling the thick film heating device to achieve a higher electric power output under the same area, and at the same time, due to the improvement of the heat exchange capacity, the thermal conversion efficiency of its products is also improved.

[0014] The present invention has the characteristics of a compact overall structure, high power, and high thermal conversion efficiency, and the parts and overall manufacturing costs adopted are relatively low, and the quality is reliable, meeting the heating requirements of new energy vehicles.

[0015] The above summary is only for the purpose of the specification and is not limited in any way. In addition to the above-described illustrative aspects, embodiments, and features, other aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and the following detailed description. Description of the Drawings

[0016] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 Schematic diagram of the forward explosion structure of the present invention.

[0018] Figure 2 Schematic diagram of the reverse explosion structure of the present invention.

[0019] Figure 3 Schematic diagram of the internal structure of the upper flow channel cavity frame of the present invention.

[0020] Figure 4 Schematic diagram of the internal structure of the lower flow channel cavity frame of the present invention.

[0021] Figure 5 Schematic diagram of the sectional structure of the present invention from the first perspective.

[0022] Figure 6 Schematic diagram of the sectional structure of the present invention from the second perspective.

[0023] Figure 7 Schematic diagram of the top view structure of the upper flow channel cavity frame of the present invention.

[0024] Figure 8 Schematic diagram of the explosion structure of the thick film heating plate of the present invention.

[0025] Reference numerals: 1, thick film heating plate; 2, ceramic dielectric surface layer; 3, metal substrate surface; 4, upper flow channel chamber mechanism; 5, lower flow channel chamber mechanism; 6, heat exchange fins; 7, heat exchange medium flow channel; 8, inlet sealing element; 9, outlet sealing element; 10, housing sealing element; 11, thermal conductive silicone coating; 12, thermal conductive silicone pad; 13, tab; 14, control chamber; 15, PCBA control board; 16, upper cover plate; 17, sealant groove; 401, upper flow channel cavity frame; 402, upper flow channel chamber inlet; 403, upper flow channel chamber outlet; 404, upper flow channel cover plate; 501, lower flow channel cavity frame; 502, lower flow channel chamber inlet; 503, lower flow channel chamber outlet; 504, total flow channel inlet; 505, total flow channel outlet; 506, lower flow channel cover plate; 101, heating resistance layer; 102, ceramic dielectric insulation layer. Detailed implementation manners

[0026] In the following text, only some exemplary embodiments are briefly described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present invention. Therefore, the drawings and the description are considered to be exemplary in nature rather than restrictive.

[0027] It should be noted that terms such as "first", "second", "symmetric", "array", etc. are only used for the purpose of distinguishing descriptions and position descriptions, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "symmetric", etc. may explicitly or implicitly include one or more of such features; similarly, when there is no numerical limitation on certain features in the form of "two", "three", etc., it should be noted that such features also explicitly or implicitly include one or more feature quantities.

[0028] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Embodiment

[0029] As Figures 1-7 shown, the embodiment of the present invention provides a high-power thick-film heating device for new energy vehicles, including a thick-film heating plate 1. A ceramic dielectric surface layer 2 is provided on the upper surface of the thick-film heating plate 1, and a metal substrate surface 3 is provided on the lower surface of the thick-film heating plate 1. An upper flow channel chamber mechanism 4 is provided above the thick-film heating plate 1, and a lower flow channel chamber mechanism 5 is provided below the thick-film heating plate 1. The upper flow channel chamber mechanism 4 and the lower flow channel chamber mechanism 5 are connected by bolt threads, and the inlets and outlets of the upper flow channel chamber mechanism 4 and the lower flow channel chamber mechanism 5 are interconnected. A heat-conducting silica gel pad 12 is applied between the ceramic dielectric surface layer 2 and the upper flow channel chamber mechanism 4, and a heat-conducting silica gel coating 11 is coated between the metal substrate surface 3 and the lower flow channel chamber mechanism 5; Among them, the upper flow channel chamber mechanism 4 and the lower flow channel chamber mechanism 5 are used to conduct the heat exchange medium entering the thick-film heating device in parallel up and down, and synchronously absorb the heat on both the upper and lower surfaces of the thick-film heating plate 1 to perform double-sided heat exchange on a single thick-film heating plate 1.

[0030] In one embodiment, the upper flow channel chamber mechanism 4 includes an upper flow channel chamber frame 401, an upper flow channel chamber inlet 402, an upper flow channel chamber outlet 403, and an upper flow channel cover plate 404; Among them, the upper flow channel chamber inlet 402 is opened on one side of the inner wall of the upper flow channel chamber frame 401, the upper flow channel chamber outlet 403 is opened on the other side of the inner wall of the upper flow channel chamber frame 401, the upper flow channel cover plate 404 is fixed and sealed in the middle of the inner wall of the upper flow channel chamber frame 401 by friction welding process or a sealing rubber strip, and the heat-conducting silica gel pad 12 is applied between the upper surface of the ceramic dielectric surface layer 2 and the lower surface of the upper flow channel chamber frame 401; The downstream channel chamber mechanism 5 includes a downstream channel chamber frame 501, a downstream channel chamber inlet 502, a downstream channel chamber outlet 503, a total channel inlet 504, a total channel outlet 505, and a downstream channel cover plate 506; Among them, a heat-conducting silicone coating 11 is coated between the upper surface of the downstream channel chamber frame 501 and the lower surface of the metal substrate surface 3. The downstream channel chamber frame 501 is connected to the bottom of the upstream channel chamber frame 401 by bolt threads. The downstream channel chamber inlet 502 is opened on one side of the inner wall of the downstream channel chamber frame 501, and the downstream channel chamber outlet 503 is opened on the other side of the inner wall of the downstream channel chamber frame 501. The downstream channel chamber inlet 502 and the upstream channel chamber inlet 402 are arranged vertically corresponding and communicated. The downstream channel chamber outlet 503 and the upstream channel chamber outlet 403 are arranged vertically corresponding and communicated. The total channel inlet 504 is arranged on one side of the downstream channel chamber frame 501, and the total channel outlet 505 is arranged on the other side of the downstream channel chamber frame 501. The downstream channel cover plate 506 and the downstream channel chamber frame 501 are fixed and sealed by friction welding process or sealing rubber strips; Among them, the total channel inlet 504 is used to introduce the heat exchange medium into the thick film heating device. The heat exchange medium is divided at the downstream channel chamber inlet 502 and the upstream channel chamber inlet 402 and enters the upstream channel chamber frame 401 and the downstream channel chamber frame 501 respectively; Among them, the total channel outlet 505 is used to export the heat exchange medium from the thick film heating device. The heat exchange medium flowing out of the upstream channel chamber frame 401 and the downstream channel chamber frame 501 converges at the downstream channel chamber outlet 503 and the upstream channel chamber outlet 403 and is discharged through the total channel outlet 505.

[0031] Inject the heat-conducting medium into the downstream channel chamber frame 501 through the total channel inlet 504, and then divide and introduce the heat-conducting medium into the inside of the upstream channel chamber frame 401 through the downstream channel chamber inlet 502 in cooperation with the upstream channel chamber outlet 403. When the heat-conducting medium in the upstream channel chamber frame 401 flows to the upstream channel chamber outlet 403 and the heat-conducting medium in the downstream channel chamber frame 501 flows to the downstream channel chamber outlet 503, the heat-exchanged heat-conducting medium converges, and then the converged heat-conducting medium is discharged through the total channel outlet 505.

[0032] In one embodiment, a number of heat exchange fins 6 are fixedly connected to the inner walls of the upstream channel chamber frame 401 and the downstream channel chamber frame 501. A heat exchange medium flow channel 7 is formed between the number of heat exchange fins 6. The number of heat exchange fins 6 are integrally cast with the upstream channel chamber frame 401 and the downstream channel chamber frame 501 respectively.

[0033] The heat exchange fins 6 cooperate with the heat-conducting medium to absorb the heat of the upstream channel chamber frame 401 and the downstream channel chamber frame 501, and the heat exchange medium flow channel 7 is used to guide the heat-conducting medium in the upstream channel chamber frame 401 and the downstream channel chamber frame 501.

[0034] In one embodiment, an inlet sealing element 8, an outlet sealing element 9 and a housing sealing element 10 are fixedly connected to the bottom of the inner side wall of the upper flow channel frame 401. The inlet sealing element 8 is arranged between the inlet 502 of the lower flow channel chamber and the inlet 402 of the upper flow channel chamber for sealing between the inlet 502 of the lower flow channel chamber and the inlet 402 of the upper flow channel chamber. The outlet sealing element 9 is arranged between the outlet 503 of the lower flow channel chamber and the outlet 403 of the upper flow channel chamber for sealing between the outlet 503 of the lower flow channel chamber and the outlet 403 of the upper flow channel chamber.

[0035] Through the provided inlet sealing element 8 and outlet sealing element 9, the inlet 502 of the lower flow channel chamber and the inlet 402 of the upper flow channel chamber, and the outlet 503 of the lower flow channel chamber and the outlet 403 of the upper flow channel chamber are respectively sealed; the housing sealing element 10 is used for sealing between the upper flow channel frame 401 and the heat-conducting silica gel pad 12.

[0036] In one embodiment, a control chamber 14 is provided at the top of the inner side wall of the upper flow channel frame 401. A PCBA control board 15 is installed on the inner side wall of the control chamber 14. One end of the thick film heating plate 1 is provided with a tab 13, and the tab 13 penetrates through the upper flow channel frame 401 and is electrically connected to the PCBA control board 15.

[0037] The PCBA control board 15 controls the thick film heating plate 1 by using the tab 13.

[0038] In one embodiment, a sealant groove 17 is formed on the upper surface of the upper flow channel frame 401, and an upper cover plate 16 is bonded to the inner side wall of the sealant groove 17.

[0039] The upper cover plate 16 is used for sealing the top of the upper flow channel frame 401, and the sealant groove 17 is provided for fixing the upper cover plate 16 in the upper flow channel frame 401 in cooperation with sealant.

[0040] In one embodiment, the heat-conducting silica gel coating 11 has a thermal conductivity coefficient greater than 3 w / m·°C and a thickness of 0.15 - 0.3 mm. The heat-conducting silica gel pad 12 has a thermal conductivity coefficient greater than 3 w / m·°C, an original thickness of 0.7 - 0.8 mm, a Shore hardness of 60, and a residual thickness after compression of 0.5 mm ± 0.05 mm.

[0041] Through the provided heat-conducting silica gel coating 11 and heat-conducting silica gel pad 12, heat conduction is carried out between the thick film heating plate 1 and the lower flow channel frame 501, and between the thick film heating plate 1 and the upper flow channel frame 401.

[0042] In one embodiment, the thick film heating plate 1 is composed of a heating resistance layer 101 and a ceramic dielectric insulation layer 102; Among them, the ceramic dielectric insulating layer 102 is printed on the surface of the metal substrate surface 3 by a screen printing process, the heating resistance layer 101 is printed on the surface of the ceramic dielectric insulating layer 102 by a screen printing process, and the ceramic dielectric surface layer 2 is printed on the surface of the heating resistance layer 101 by a screen printing process.

[0043] By using a screen printing process to print a ceramic paste material on the metal substrate surface 3, and then through high-temperature sintering, a ceramic dielectric insulating layer 102 is formed on the metal substrate surface 3. Then, a screen printing process is used again to print silver and palladium materials on the ceramic dielectric insulating layer 102, and a heating resistance layer 101 is formed after high-temperature sintering. Then, a screen printing process is used again to print a ceramic paste material on the heating resistance layer 101, and a ceramic dielectric surface layer 2 is formed after high-temperature sintering. The specific structure is as Figure 8 shown; When the present invention is working: The heat-conducting medium is injected into the lower flow channel cavity frame 501 through the total flow channel inlet 504, and then is shunted and introduced into the interior of the upper flow channel cavity frame 401 through the lower flow channel chamber inlet 502 in cooperation with the upper flow channel chamber outlet 403. Then, the heat-conducting medium entering the lower flow channel cavity frame 501 and the upper flow channel cavity frame 401 is guided by the provided heat exchange fins 6, so that it flows in the heat exchange medium flow channel 7.

[0044] When the thick film heating plate 1 is working, the heat on the upper and lower surfaces of the thick film heating plate 1 is conducted to the surfaces of the upper flow channel cavity frame 401 and the lower flow channel cavity frame 501 respectively by using the heat-conducting silicone coating 11 and the heat-conducting silicone pad 12. Then, the heat of the upper flow channel cavity frame 401 and the lower flow channel cavity frame 501 is absorbed by the heat exchange fins 6 in cooperation with the heat-conducting medium. Furthermore, the heat on both sides of the thick film heating plate 1 can be exchanged by using the heat-conducting medium synchronously.

[0045] When the heat-conducting medium in the upper flow channel cavity frame 401 flows to the upper flow channel chamber outlet 403, and the heat-conducting medium in the lower flow channel cavity frame 501 flows to the lower flow channel chamber outlet 503, the heat-exchanged heat-conducting medium converges, and then the converged heat-conducting medium is discharged through the total flow channel outlet 505, thereby completing the heating operation of the heat-conducting medium.

[0046] Through the provided inlet sealing element 8 and outlet sealing element 9, the spaces between the lower flow channel chamber inlet 502 and the upper flow channel chamber inlet 402, and between the lower flow channel chamber outlet 503 and the upper flow channel chamber outlet 403 are sealed respectively.

[0047] Embodiment

[0048] In the first embodiment, the upstream flow channel chamber mechanism 4 and the downstream flow channel chamber mechanism 5 are connected in parallel to guide the heat exchange medium. To extend the residence time of the heat exchange medium in the channel or make the heat exchange medium absorb the heat of the thick film heating plate 1 more evenly, the upstream flow channel chamber mechanism 4 and the downstream flow channel chamber mechanism 5 can also be connected in series, that is: after the heat exchange medium passes through the downstream flow channel chamber mechanism 5, it flows into the upstream flow channel chamber mechanism 4, and finally flows out through the outlet of the downstream flow channel chamber mechanism 5; or it flows into the upstream flow channel chamber mechanism 4 through the inlet of the downstream flow channel chamber mechanism 5, then flows back into the downstream flow channel chamber mechanism 5, and finally flows out through the outlet of the downstream flow channel chamber mechanism 5.

[0049] The above is only the specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various changes or substitutions, and these should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A high-power thick-film heating device for new energy vehicles, comprising a thick-film heating plate (1), characterized in that, The upper surface of the thick film heating plate (1) is provided with a ceramic dielectric surface layer (2), the lower surface of the thick film heating plate (1) is provided with a metal substrate surface (3), an upper flow channel chamber mechanism (4) is arranged above the thick film heating plate (1), a lower flow channel chamber mechanism (5) is arranged below the thick film heating plate (1), the upper flow channel chamber mechanism (4) and the lower flow channel chamber mechanism (5) are connected by bolts and threads, the inlets and outlets of the upper flow channel chamber mechanism (4) and the lower flow channel chamber mechanism (5) are interconnected, a heat-conducting silica gel pad (12) is applied between the ceramic dielectric surface layer (2) and the upper flow channel chamber mechanism (4), and a heat-conducting silica gel coating (11) is coated between the metal substrate surface (3) and the lower flow channel chamber mechanism (5). Among them, the upper flow channel chamber mechanism (4) and the lower flow channel chamber mechanism (5) are used for conducting the heat exchange medium entering the thick film heating device in parallel up and down, and synchronously absorbing the heat on both the upper and lower surfaces of the thick film heating plate (1) to perform double-sided heat exchange on a single thick film heating plate (1).

2. The high-power thick-film heating device for new energy vehicles according to claim 1, characterized in that: The upper flow channel chamber mechanism (4) includes an upper flow channel chamber frame (401), an upper flow channel chamber inlet (402), an upper flow channel chamber outlet (403) and an upper flow channel cover plate (404); Among them, the upper flow channel chamber inlet (402) is opened on one side of the inner side wall of the upper flow channel chamber frame (401), the upper flow channel chamber outlet (403) is opened on the other side of the inner side wall of the upper flow channel chamber frame (401), the upper flow channel cover plate (404) is fixed and sealed in the middle of the inner side wall of the upper flow channel chamber frame (401) by friction welding process or a sealing rubber strip, and the heat-conducting silica gel pad (12) is applied between the upper surface of the ceramic dielectric surface layer (2) and the lower surface of the upper flow channel chamber frame (401).

3. The high-power thick-film heating device for new energy vehicles according to claim 2, wherein: The lower flow channel chamber mechanism (5) includes a lower flow channel chamber frame (501), a lower flow channel chamber inlet (502), a lower flow channel chamber outlet (503), a total flow channel inlet (504), a total flow channel outlet (505) and a lower flow channel cover plate (506); Among them, the heat-conducting silicone coating (11) is coated between the upper surface of the downstream channel cavity frame (501) and the lower surface of the metal substrate surface (3). The downstream channel cavity frame (501) is connected to the bottom of the upstream channel cavity frame (401) by bolt threads. The downstream channel chamber inlet (502) is opened on one side of the inner wall of the downstream channel cavity frame (501), and the downstream channel chamber outlet (503) is opened on the other side of the inner wall of the downstream channel cavity frame (501). The downstream channel chamber inlet (502) and the upstream channel chamber inlet (402) are arranged vertically corresponding and communicated. The downstream channel chamber outlet (503) and the upstream channel chamber outlet (403) are arranged vertically corresponding and communicated. The total channel inlet (504) is arranged on one side of the downstream channel cavity frame (501), and the total channel outlet (505) is arranged on the other side of the downstream channel cavity frame (501). The downstream channel cover plate (506) and the downstream channel cavity frame (501) are fixed and sealed by friction welding process or sealing rubber strip; Among them, the total channel inlet (504) is used to introduce the heat exchange medium into the thick film heating device. The heat exchange medium is branched at the downstream channel chamber inlet (502) and the upstream channel chamber inlet (402), and respectively enters the upstream channel cavity frame (401) and the downstream channel cavity frame (501); Among them, the total channel outlet (505) is used to export the heat exchange medium from the thick film heating device. The heat exchange medium flowing out of the upstream channel cavity frame (401) and the downstream channel cavity frame (501) converges at the downstream channel chamber outlet (503) and the upstream channel chamber outlet (403), and is discharged through the total channel outlet (505).

4. The high-power thick film heating device for new energy vehicles according to claim 3, characterized in that: A plurality of heat exchange fins (6) are fixedly connected to the inner side walls of the upstream channel cavity frame (401) and the downstream channel cavity frame (501). A heat exchange medium flow channel (7) is formed between the plurality of heat exchange fins (6). The plurality of heat exchange fins (6) are integrally cast with the upstream channel cavity frame (401) and the downstream channel cavity frame (501) respectively.

5. The high-power thick-film heating device for new energy vehicles according to claim 3, characterized in that: An inlet sealing element (8), an outlet sealing element (9) and a housing sealing element (10) are fixedly connected to the bottom of the inner side wall of the upstream channel cavity frame (401). The inlet sealing element (8) is arranged between the downstream channel chamber inlet (502) and the upstream channel chamber inlet (402) for sealing between the downstream channel chamber inlet (502) and the upstream channel chamber inlet (402). The outlet sealing element (9) is arranged between the downstream channel chamber outlet (503) and the upstream channel chamber outlet (403) for sealing between the downstream channel chamber outlet (503) and the upstream channel chamber outlet (403).

6. The high-power thick-film heating device for new energy vehicles according to claim 2, wherein: A control chamber (14) is provided at the top of the inner side wall of the upstream channel cavity frame (401). A PCBA control board (15) is installed on the inner side wall of the control chamber (14). An ear (13) is installed at one end of the thick film heating plate (1). The ear (13) penetrates the upstream channel cavity frame (401) and is electrically connected to the PCBA control board (15).

7. The high-power thick film heating device for new energy vehicles according to claim 2, characterized in that: The upper surface of the upper flow channel cavity frame (401) is provided with a sealant groove (17), and an upper cover plate (16) is adhesively bonded to the inner side wall of the sealant groove (17).

8. The high-power thick-film heating device for new energy vehicles according to claim 1, characterized in that: The thermal conductivity coefficient of the material of the thermal conductive silicone coating (11) is greater than 3W / m·°C, and the thickness is 0.15 - 0.3mm. The thermal conductivity coefficient of the thermal conductive silicone pad (12) is greater than 3W / m·°C, the original thickness is 0.7 - 0.8mm, the Shore hardness is 60, and the residual thickness after compression is 0.5mm ± 0.05mm.

9. The high-power thick-film heating device for new energy vehicles according to claim 1, wherein: The thick film heating plate (1) is composed of a heating resistance layer (101) and a ceramic dielectric insulation layer (102); Among them, the ceramic dielectric insulation layer (102) is printed on the surface of the metal substrate surface (3) by a screen printing process and formed by high-temperature sintering. The heating resistance layer (101) is printed on the surface of the ceramic dielectric insulation layer (102) by a screen printing process and formed by high-temperature sintering. The ceramic dielectric surface layer (2) is printed on the surface of the heating resistance layer (101) by a screen printing process and formed by high-temperature sintering.

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