Semiconductor module strength detection device

Abstract

The invention relates to the technical field of semiconductor production, and discloses a semiconductor module strength detection device which comprises a high-temperature strength detection equipment body and a semiconductor module body. The high-temperature-resistant rubber sleeve on the detection head body can be placed on a metal substrate provided with the semiconductor module body, then the micro motor body is started, and at the moment, the semiconductor module body can be wrapped by the high-temperature-resistant rubber sleeve under the cooperation of the wrapping type detection assembly; the wrapping of the high temperature resistant rubber sleeve can prevent the erosion of external dust and corrosive liquid, and plays a role in protecting the semiconductor module body for high temperature strength detection, and meanwhile, the plurality of temperature sensing patches can be tightly attached to the side edge of the semiconductor module. And the metal sensor on the temperature sensor body can be in contact with the top of the semiconductor module, so that the effect of adapting to semiconductor module bodies in different shapes is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and specifically to a semiconductor module strength detection device. Background Art

[0002] A semiconductor module is a device that uses a certain semiconductor material as the working substance to generate stimulated emission, and is a part of a semiconductor laser. Its working principle is that through a certain excitation method, non-equilibrium carrier population inversion is achieved between the energy bands (conduction band and valence band) of the semiconductor material, or between the energy band of the semiconductor material and the energy levels of impurities (acceptors or donors). When a large number of electrons and holes in the population inversion state recombine, stimulated emission occurs. There are mainly three excitation methods for semiconductor lasers, namely, electrical injection, optical pumping, and high-energy electron beam excitation. In the patent application with the application publication number CN116577624A, it includes a detection body, a moving plate, a display lamp, a positive electrode plate, and a negative electrode plate, etc.; a moving plate is connected to the top of the detection body in a sliding manner up and down. A display lamp is fixedly connected to the front side of the moving plate. At least two positive electrode plates are connected to the bottom of the moving plate in a sliding manner up and down. The top of the detection body is connected with negative electrode plates having the same number as the positive electrode plates, and the upper and lower positions of the negative electrode plates and the positive electrode plates correspond one by one. The detection body is electrically connected to both the positive electrode plates and the negative electrode plates. The sinking mechanism and the first elastic member cooperate to enable the positive electrode plates and the negative electrode plates to adaptively adjust to semiconductors of different thicknesses, and enable the adjustment of their positions to be carried out in stages, making the connection of the semiconductor more stable.

[0003] In the above-mentioned patents or prior arts, during the use of the semiconductor module, there will be a situation where local heat is relatively large. Therefore, high-temperature strength detection equipment is required to detect its temperature. However, in a relatively harsh detection environment, corrosive liquid splashing and dust covering usually occur during detection, resulting in inaccurate temperature detection. At the same time, due to the splashing of corrosive liquid, the surface of the semiconductor module will be corroded. When splashed with corrosive liquid containing acidic substances, the acidic substances will chemically react with copper and constantan, forming corrosion products on the surface of the thermal resistor, increasing the resistance of the thermal electrode, affecting the temperature measurement accuracy of the thermocouple, and resulting in measurement errors reaching several degrees Celsius or even higher. Summary of the Invention

[0004] The problem to be solved by the present invention is that most existing temperature detection devices will have temperature deviation during detection in a relatively harsh detection environment.

[0005] To solve the above technical problems, the technical solution of the present invention is: a semiconductor module strength detection device, including a high-temperature strength detection equipment body and a semiconductor module body. A detection head body connected by a connecting wire is provided on the high-temperature strength detection equipment body. A temperature sensor body is slidably arranged inside the detection head body. A sensor outer cylinder body slidably connected to the temperature sensor body is fixedly arranged on the inner wall of the detection head body. A side sensor receiver is installed on the arc-shaped outer wall of the sensor outer cylinder body. A wrapped detection component is provided on the detection head body; The wrapped detection component includes a micro-motor body installed on the top of the detection head body. The output end of the micro-motor body is connected to a driving cylinder through a rotating shaft. A pumping piston seat is sleeved inside the driving cylinder. An air pressure cylinder is fixedly arranged on the arc-shaped outer wall of the sensor outer cylinder body. The bottom of the pumping piston seat is axially slidably connected to the inner wall of the air pressure cylinder. A guiding block is fixedly arranged on the arc-shaped inner wall of the driving cylinder. An arc-shaped guiding groove matching the guiding block is opened on the arc-shaped outer wall of the pumping piston seat. The guiding block slides inside the arc-shaped guiding groove. A high-temperature resistant rubber sleeve is fixedly arranged at the bottom end of the side sensor receiver. A plurality of air guide pipes are fixedly arranged between the air pressure cylinder and the high-temperature resistant rubber sleeve. Each air guide pipe penetrates from the inner wall of the air pressure cylinder to the inner wall of the high-temperature resistant rubber sleeve. A plurality of temperature sensing patches are installed on the inner wall of the high-temperature resistant rubber sleeve. A magnetic attraction component is arranged below the driving cylinder.

[0006] Preferably, a metal sensor is installed at the bottom end of the temperature sensor body. A piston piece is fixedly arranged on the side wall of the metal sensor. The piston piece is axially slidably connected to the inner wall of the sensor outer cylinder body.

[0007] Preferably, one end of the connecting wire is connected to the temperature sensor body. An activity groove matching the temperature sensor body is opened inside the sensor outer cylinder body. A spring fixing ring is fixedly arranged on the arc-shaped outer wall of the temperature sensor body. A return spring is fixedly arranged between the bottom of the spring fixing ring and the sensor outer cylinder body. An inner piston groove matching the piston piece is opened inside the sensor outer cylinder body.

[0008] Preferably, an outer piston groove matching the pumping piston seat is opened inside the air pressure cylinder. A plurality of air outlet holes are opened on the air pressure cylinder. The plurality of air outlet holes are respectively communicated with the plurality of air guide pipes. The inner piston groove is communicated with the inside of the high-temperature resistant rubber sleeve.

[0009] Preferably, one end of each temperature sensing patch is connected to the side sensor receiver through a wire. A dragon bone frame is fixedly arranged at the bottom of the side sensor receiver. The high-temperature resistant rubber sleeve is sleeved on the dragon bone frame. A rubber sealing strip is fixedly arranged at the bottom of the high-temperature resistant rubber sleeve.

[0010] Preferably, the driving cylinder is located inside the detection head body, and the outer cylinder of the sensor is located between the outside of the temperature sensor body and the inside of the driving cylinder.

[0011] Preferably, the magnetic attraction assembly includes a connecting cylinder fixed to the arc-shaped outer wall of the driving cylinder. A magnetic attraction movable cylinder is fixedly arranged on the arc-shaped outer wall of the side sensor receiver. The bottom end of the connecting cylinder is fixedly provided with a lower fixing cylinder, and the lower fixing cylinder is located inside the magnetic attraction movable cylinder. A plurality of trapezoidal pushing blocks are fixedly arranged on the circumference of the lower fixing cylinder, and a magnetic attraction ring is axially slidably connected inside the magnetic attraction movable cylinder, and the magnetic attraction ring is slidably connected with the plurality of trapezoidal pushing blocks.

[0012] Preferably, the plurality of trapezoidal pushing blocks are distributed in an annular array on the lower fixing cylinder. The inner wall of the magnetic attraction ring is provided with a pushing clamping groove matching the plurality of trapezoidal pushing blocks. The bottom end of the magnetic attraction movable cylinder is fixedly provided with an isolation thin plate, and the magnetic attraction ring is located above the isolation thin plate.

[0013] Preferably, the semiconductor module body is located inside the high-temperature resistant rubber sleeve. A metal substrate is arranged at the bottom of the semiconductor module body, and the isolation thin plate is in contact with the top of the metal substrate.

[0014] Compared with the prior art, the technical solution of the present invention has the following advantages: (1) During the high-temperature strength detection of the semiconductor module body, the high-temperature resistant rubber sleeve on the detection head body can be placed on the metal substrate on which the semiconductor module body is installed. Then, by starting the micro-motor body, under the cooperation of the wrapped detection assembly, the high-temperature resistant rubber sleeve can wrap the semiconductor module body. The wrapping of the high-temperature resistant rubber sleeve can prevent the erosion of external dust and corrosive liquids, playing a role in protecting the semiconductor module body during high-temperature strength detection. At the same time, a plurality of temperature sensing patches can be closely attached to the side of the semiconductor module, and the metal sensor on the temperature sensor body can be in contact with the top of the semiconductor module, achieving the effect of adapting to semiconductor module bodies of different shapes. Semiconductor modules of different shapes can enter the detection link in sequence, without interrupting the production process due to equipment mismatch, thereby improving the smoothness and efficiency of high-temperature detection of semiconductor modules; (2)By starting the micro-motor body, the present invention can, with the cooperation of the magnetic attraction assembly, enable multiple trapezoidal pushing blocks to simultaneously enter into multiple pushing and clamping grooves opened on the magnetic attraction ring. When this occurs, the bottom of the magnetic attraction ring can contact the top of the isolation thin plate, and the magnetic attraction ring can adsorb the metal substrate, thereby achieving the purpose of improving the stability of the detection head body and simultaneously achieving the purpose of being able to be fixed according to different semiconductor high-temperature strength detection environments. Compared with the vast majority of traditional hand-held fixing methods, the magnetic attraction fixing method will not cause wear or scratches on the surface of the device or the detection environment. This helps to extend the service life of the metal substrate and reduce the maintenance and replacement costs caused by the wear of the metal substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a schematic diagram of the connection structure between the wrapped detection assembly and the magnetic attraction assembly of the present invention; Figure 3 is a schematic diagram of the cross-sectional structure of the detection head body of the present invention; Figure 4 of the present invention Figure 3 is a partial enlarged view of A in; Figure 5 is a schematic diagram of the structure of the wrapped detection assembly of the present invention; Figure 6 of the present invention Figure 5 is a partial enlarged view of B in; Figure 7 is a schematic diagram of the arc-shaped guide groove structure of the present invention; Figure 8 is a schematic diagram of the connection structure between the air duct and the high-temperature resistant rubber sleeve of the present invention; Figure 9 is a bottom view of the high-temperature resistant rubber sleeve of the present invention; Figure 10 is a schematic diagram of the magnetic attraction assembly structure of the present invention; Figure 11 is a schematic diagram of the connection structure between the trapezoidal pushing block and the magnetic attraction ring of the present invention; Figure 12 is a schematic diagram of the magnetic attraction ring structure of the present invention.

[0016] In the figure: 1. High-temperature strength detection equipment body; 11. Detection head body; 12. Connecting wire; 13. Temperature sensor body; 131. Sensor outer cylinder; 132. Return spring; 133. Metal sensor; 134. Piston piece; 14. Side sensor receiver; 15. Temperature sensing patch; 16. Semiconductor module body; 2. Wrapped detection component; 21. Micro motor body; 22. Driving cylinder; 221. Guide block; 23. Pneumatic cylinder; 231. Air duct; 24. Air extraction piston seat; 241. Arc-shaped guide groove; 25. High-temperature rubber sleeve; 3. Magnetic attraction component; 31. Connecting cylinder; 32. Lower fixed cylinder; 321. Trapezoidal extrusion block; 33. Magnetically attracted movable cylinder; 34. Magnetic attraction ring; 341. Extrusion clamping groove. Specific implementation manner

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are a part rather than all of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0018] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the ordinary meanings understood by those of ordinary skill in the art to which the present disclosure pertains. The use of words such as "including" or "comprising" in the present disclosure means that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connection" or "coupling" and other similar words are not limited to physical or mechanical connections, and may also include electrical connections, whether direct or indirect. "Upper", "lower", "left", "right", etc. are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0019] As Figures 1 to 12 As shown, a semiconductor module strength detection device provided by the present invention includes a high-temperature strength detection device body 1 and a semiconductor module body 16. A detection head body 11 connected by a connection line 12 is provided on the high-temperature strength detection device body 1. A temperature sensor body 13 is slidably arranged inside the detection head body 11. A sensor outer cylinder 131 slidably connected to the temperature sensor body 13 is fixedly arranged on the inner wall of the detection head body 11. A side sensor receiver 14 is installed on the arc-shaped outer wall of the sensor outer cylinder 131. A wrapped detection component 2 is provided on the detection head body 11; The wrapped detection component 2 includes a micro-motor body 21 installed on the top of the detection head body 11. The output end of the micro-motor body 21 is connected with a driving cylinder 22 through a rotating shaft. An air extraction piston seat 24 is sleeved inside the driving cylinder 22. An air pressure cylinder 23 is fixedly arranged on the arc-shaped outer wall of the sensor outer cylinder 131. The bottom of the air extraction piston seat 24 is axially slidably connected with the inner wall of the air pressure cylinder 23. A guiding block 221 is fixedly arranged on the arc-shaped inner wall of the driving cylinder 22. An arc-shaped guiding groove 241 matching with the guiding block 221 is formed on the arc-shaped outer wall of the air extraction piston seat 24. The guiding block 221 slides inside the arc-shaped guiding groove 241. A high-temperature resistant rubber sleeve 25 is fixedly arranged at the bottom end of the side sensor receiver 14. A plurality of air guide pipes 231 are fixedly arranged between the air pressure cylinder 23 and the high-temperature resistant rubber sleeve 25. Each air guide pipe 231 penetrates from the inner wall of the air pressure cylinder 23 to the inner wall of the high-temperature resistant rubber sleeve 25. A plurality of temperature sensing patches 15 are installed on the inner wall of the high-temperature resistant rubber sleeve 25. A magnetic attraction component 3 is arranged below the driving cylinder 22; A metal sensor 133 is installed at the bottom end of the temperature sensor body 13. A piston piece 134 is fixedly arranged on the side wall of the metal sensor 133. The piston piece 134 is axially slidably connected with the inner wall of the sensor outer cylinder 131; One end of the connecting wire 12 is connected with the temperature sensor body 13. An activity groove matching with the temperature sensor body 13 is formed inside the sensor outer cylinder 131. A spring fixing ring is fixedly arranged on the arc-shaped outer wall of the temperature sensor body 13. A reset spring 132 is fixedly arranged between the bottom of the spring fixing ring and the sensor outer cylinder 131. An inner piston groove matching with the piston piece 134 is formed inside the sensor outer cylinder 131; An outer piston groove matching with the air extraction piston seat 24 is formed inside the air pressure cylinder 23. A plurality of air outlet holes are formed on the air pressure cylinder 23. The plurality of air outlet holes are respectively communicated with the plurality of air guide pipes 231. The inner piston groove is communicated with the inside of the high-temperature resistant rubber sleeve 25; One end of each temperature sensing patch 15 is connected with the side sensor receiver 14 through a wire. A dragon bone frame is fixedly arranged at the bottom of the side sensor receiver 14. The high-temperature resistant rubber sleeve 25 is sleeved on the dragon bone frame. A rubber sealing strip is fixedly arranged at the bottom of the high-temperature resistant rubber sleeve 25; The driving cylinder 22 is located inside the detection head body 11. The sensor outer cylinder 131 is located between the outside of the temperature sensor body 13 and the inside of the driving cylinder 22; The magnetic attraction component 3 includes a connecting cylinder 31 fixed on the arc-shaped outer wall of the driving cylinder 22. A magnetic attraction activity cylinder 33 is fixedly arranged on the arc-shaped outer wall of the side sensor receiver 14. A lower fixed cylinder 32 is fixedly arranged at the bottom end of the connecting cylinder 31. The lower fixed cylinder 32 is located inside the magnetic attraction activity cylinder 33. A plurality of trapezoidal pushing blocks 321 are fixedly arranged on the periphery of the lower fixed cylinder 32. A magnetic attraction ring 34 is axially slidably connected inside the magnetic attraction activity cylinder 33. The magnetic attraction ring 34 is slidably connected with the plurality of trapezoidal pushing blocks 321; A plurality of trapezoidal pushing blocks 321 are distributed in an annular array on the lower fixed cylinder 32. A pushing clamping groove 341 matching the plurality of trapezoidal pushing blocks 321 is formed in the inner wall of the magnetic attraction ring 34. An isolation thin plate is fixedly arranged at the bottom end of the magnetic attraction movable cylinder 33, and the magnetic attraction ring 34 is located above the isolation thin plate; The semiconductor module body 16 is located inside the high-temperature resistant rubber sleeve 25. A metal substrate is arranged at the bottom of the semiconductor module body 16, and the isolation thin plate is in contact with the top of the metal substrate; When detecting the semiconductor module body 16, the high-temperature resistant rubber sleeve 25 arranged at the bottom of the detection head body 11 can be closely attached to the top end of the metal substrate, and by starting the micro motor body 21, at this time, the driving cylinder 22 can be driven to rotate around the connection position with the detection head body 11 under the connection of the rotating shaft, and then the guiding block 221 fixed on the arc-shaped inner wall of the driving cylinder 22 can make a circular motion. At this time, the guiding block 221 can slide along the arc-shaped guiding groove 241 formed on the arc-shaped outer wall of the air extraction piston seat 24, and at the same time, the air extraction piston seat 24 located inside the air pressure cylinder 23 can slide axially from bottom to top. At this time, the air between the high-temperature resistant rubber sleeve 25 and the semiconductor module body 16 enters the air pressure cylinder 23 through a plurality of air guide pipes 231. At the same time, a negative pressure is generated inside the high-temperature resistant rubber sleeve 25, which can cause the high-temperature resistant rubber sleeve 25 to deform, and finally wrap the semiconductor module body 16. The wrapping of the high-temperature resistant rubber sleeve 25 can prevent the erosion of external dust and corrosive liquids, playing a role in protecting the semiconductor module body 16. At the same time, the temperature sensing patch 15 arranged on the inner wall of the high-temperature resistant rubber sleeve 25 can be in contact with the periphery of the semiconductor module body 16. At the same time, the negative pressure inside the high-temperature resistant rubber sleeve 25 can cause the piston piece 134 to slide from top to bottom, and then drive the metal sensor 133 and the temperature sensor body 13 fixed to the piston piece 134 to move. Finally, the bottom of the metal sensor 133 is closely attached to the top of the semiconductor module body 16. At this time, the temperature sensor body 13 and the side sensor receiver 14 can detect the temperature of the top and the periphery of the semiconductor module body 16, achieving the purpose of adapting to semiconductor module bodies 16 of different shapes; While the driving cylinder 22 is rotating, under the connection of the connecting cylinder 31, the lower fixed cylinder 32 can be driven to rotate around the connection position with the magnetic attraction movable cylinder 33, and at the same time, the plurality of trapezoidal pushing blocks 321 fixedly connected to the lower fixed cylinder 32 can slide inside the magnetic attraction movable cylinder 33. When the plurality of trapezoidal pushing blocks 321 simultaneously enter the plurality of pushing clamping grooves 341 formed on the magnetic attraction ring 34, the bottom of the magnetic attraction ring 34 can be in contact with the top end of the isolation thin plate. At this time, the magnetic attraction ring 34 can adsorb the metal substrate, thereby achieving the purpose of improving the stability of the detection head body 11 and at the same time achieving the purpose of being fixed according to different detection environments.

[0020] Working principle and usage process of the present invention: First, the high-temperature resistant rubber sleeve 25 provided at the bottom of the detection head body 11 is closely attached to the top of the metal substrate. By starting the micro-motor body 21, the driving cylinder 22 can be driven to rotate around the connection position with the detection head body 11 under the connection of the rotating shaft. Subsequently, the guiding block 221 fixed on the arc-shaped inner wall of the driving cylinder 22 makes a circular motion. At this time, the guiding block 221 can slide along the arc-shaped guiding groove 241 opened on the arc-shaped outer wall of the air extraction piston seat 24, and at the same time, push the air extraction piston seat 24 to slide axially upward in the air pressure cylinder 23. At this time, the air between the high-temperature resistant rubber sleeve 25 and the semiconductor module body 16 enters the inside of the air pressure cylinder 23 through a plurality of air guide pipes 231. At the same time, a negative pressure is generated inside the high-temperature resistant rubber sleeve 25, which can cause the high-temperature resistant rubber sleeve 25 to deform, playing a role in protecting the semiconductor module body 16. At the same time, the temperature sensing patch 15 provided on the inner wall of the high-temperature resistant rubber sleeve 25 can be in contact with the periphery of the semiconductor module body 16. Meanwhile, the negative pressure inside the high-temperature resistant rubber sleeve 25 can cause the piston piece 134 to slide from top to bottom, and then drive the metal sensor 133 and the temperature sensor body 13 fixed to the piston piece 134 to move. Finally, the bottom of the metal sensor 133 is closely attached to the top of the semiconductor module body 16. At this time, the temperature sensor body 13 and the side sensor receiver 14 can detect the temperature at the top and the periphery of the semiconductor module body 16. While the driving cylinder 22 is rotating, under the connection of the connecting cylinder 31, the lower fixed cylinder 32 can be driven to rotate around the connection position with the magnetic attraction movable cylinder 33, and at the same time, drive a plurality of trapezoidal pushing blocks 321 fixedly connected to the lower fixed cylinder 32 to slide inside the magnetic attraction movable cylinder 33. When a plurality of trapezoidal pushing blocks 321 simultaneously enter a plurality of pushing and clamping grooves 341 opened on the magnetic attraction ring 34, the bottom of the magnetic attraction ring 34 can be in contact with the top of the isolation thin plate. At this time, the magnetic attraction ring 34 can adsorb the metal substrate.

[0021] The above embodiments are only exemplary embodiments of the present invention and are not used to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art can make various modifications or equivalent replacements within the essence and protection scope of the present invention, and such modifications or equivalent replacements should also be regarded as falling within the protection scope of the present invention.

Claims

1. A semiconductor module strength detection device, comprising a high-temperature strength detection device body (1) and a semiconductor module body (16), characterized in that: The high-temperature strength detection device body (1) is provided with a detection head body (11) connected via a connecting line (12), a temperature sensor body (13) is slidably provided inside the detection head body (11), a sensor outer cylinder (131) slidably connected to the temperature sensor body (13) is fixedly provided on the inner wall of the detection head body (11), a side sensor receiver (14) is installed on the arc-shaped outer wall of the sensor outer cylinder (131), and a wrapped detection component (2) is provided on the detection head body (11); The wrapped detection assembly (2) includes a micro motor body (21) mounted on the top of the detection head body (11), the output end of the micro motor body (21) is connected to a driving cylinder (22) via a rotating shaft, the driving cylinder (22) is internally sleeved with an air pumping piston seat (24), an air pressure cylinder (23) is fixedly provided on the arc-shaped outer wall of the sensor outer cylinder (131), and the bottom of the air pumping piston seat (24) is axially slidably connected to the inner wall of the air pressure cylinder (23), a guide block (221) is fixedly provided on the arc-shaped inner wall of the driving cylinder (22), and a guide block (221) is provided on the arc-shaped outer wall of the air pumping piston seat (24) The guide block (221) is provided with an arc-shaped guide groove (241) matching the guide block (221), and the guide block (221) slides inside the arc-shaped guide groove (241), a high-temperature resistant rubber sleeve (25) is fixedly provided at the bottom end of the side sensor receiver (14), a plurality of air guide tubes (231) are fixedly provided between the air pressure cylinder (23) and the high-temperature resistant rubber sleeve (25), and each air guide tube (231) passes through the inner wall of the air pressure cylinder (23) to the inner wall of the high-temperature resistant rubber sleeve (25), a plurality of temperature sensing patches (15) are installed on the inner wall of the high-temperature resistant rubber sleeve (25), and a magnetic attraction component (3) is provided below the driving cylinder (22).

2. The semiconductor module strength detection device according to claim 1, wherein: A metal sensor (133) is installed at the bottom end of the temperature sensor body (13), and a piston plate (134) is fixedly provided on the side wall of the metal sensor (133), and the piston plate (134) is axially slidably connected to the inner wall of the sensor outer cylinder (131).

3. A semiconductor module strength detection device according to claim 1 or 2, characterized in that: One end of the connecting line (12) is connected to the temperature sensor body (13); a movable groove matching the temperature sensor body (13) is provided inside the sensor outer cylinder (131); a spring fixing ring is fixedly provided on the arc-shaped outer wall of the temperature sensor body (13); a return spring (132) is fixedly provided between the bottom of the spring fixing ring and the sensor outer cylinder (131); an inner piston groove matching the piston plate (134) is provided inside the sensor outer cylinder (131).

4. A semiconductor module strength detection device according to claim 2, characterized in that: The air pressure cylinder (23) is provided with an outer piston groove matching the air extraction piston seat (24), the air pressure cylinder (23) is provided with a plurality of air outlet holes, and the plurality of air outlet holes are respectively connected to a plurality of air guide tubes (231), and the inner piston groove is connected to the interior of the high temperature resistant rubber sleeve (25).

5. The semiconductor module strength detection device according to claim 1, wherein: One end of each of the temperature sensing patches (15) is connected to the side sensor receiver (14) through a wire. A keel frame is fixedly arranged at the bottom of the side sensor receiver (14), and a high-temperature resistant rubber sleeve (25) is sleeved on the keel frame. A rubber sealing strip is fixedly arranged at the bottom of the high-temperature resistant rubber sleeve (25).

6. The semiconductor module strength detection device according to claim 1, characterized in that: The driving cylinder (22) is located inside the detection head body (11), and the sensor outer cylinder (131) is located between the outside of the temperature sensor body (13) and the inside of the driving cylinder (22).

7. A semiconductor module strength detection device according to claim 1, characterized in that: The magnetic attraction assembly (3) includes a connecting cylinder (31) fixed on the arc-shaped outer wall of the driving cylinder (22). A magnetic attraction movable cylinder (33) is fixedly arranged on the arc-shaped outer wall of the side sensor receiver (14). A lower fixed cylinder (32) is fixedly arranged at the bottom end of the connecting cylinder (31), and the lower fixed cylinder (32) is located inside the magnetic attraction movable cylinder (33). A plurality of trapezoidal pushing blocks (321) are fixedly arranged on the circumference of the lower fixed cylinder (32). A magnetic attraction ring (34) is axially slidably connected inside the magnetic attraction movable cylinder (33), and the magnetic attraction ring (34) is slidably connected with the plurality of trapezoidal pushing blocks (321).

8. The semiconductor module strength detection device according to claim 7, wherein: The plurality of trapezoidal pushing blocks (321) are arranged in an annular array on the lower fixed cylinder (32). A pushing clamping groove (341) matching the plurality of trapezoidal pushing blocks (321) is formed on the inner wall of the magnetic attraction ring (34). An isolation thin plate is fixedly arranged at the bottom end of the magnetic attraction movable cylinder (33), and the magnetic attraction ring (34) is located above the isolation thin plate.

9. A semiconductor module strength detection device according to claim 1 or 8, characterized in that: The semiconductor module body (16) is located inside the high-temperature resistant rubber sleeve (25). A metal substrate is arranged at the bottom of the semiconductor module body (16). The isolation thin plate is in contact with the top of the metal substrate.

Images