Wafer flip detection device

Abstract

The present application discloses a wafer flipping detection device, comprising a gripping mechanism, a flipping mechanism and a detection mechanism. The gripping mechanism comprises two robotic arms. The flipping mechanism comprises a flipping platform and a flipping motor. The flipping platform is fixedly connected to the output shaft of the flipping motor, and the output shaft of the flipping motor extends along a first direction. The detection mechanism comprises a camera, a carrying assembly, a first light source assembly, a second light source assembly and a moving assembly; the detection mechanism is located on one side of the flipping mechanism in the second direction; the carrying assembly comprises a mounting plate and a plurality of carrying blocks; the mounting plate is provided with a through hole, and the plurality of carrying blocks are spaced apart in the circumferential direction of the through hole; when the carrying block is in the extended position, the minimum distance from the carrying block to the center of the through hole is less than the radius of the wafer to be tested; when a carrying block is in the retracted position, at least three carrying blocks are in the extended position; the moving assembly is connected to the mounting plate. The wafer flipping detection device can realize unobstructed detection, improve detection efficiency and avoid excessive costs.

Description

Technical Field

[0001] This specification relates to the field of wafer detection technology, and in particular to a wafer flip detection device. Background Art

[0002] A wafer is a circular silicon wafer or substrate used in semiconductor manufacturing, also known as a silicon wafer or liner. It is the fundamental material for manufacturing integrated circuits. Wafers are generally made of single-crystal silicon and have a very flat surface. The process of manufacturing wafers is called wafer fabrication or semiconductor manufacturing and involves multiple process steps such as wafer growth, cutting, polishing, and cleaning. On wafers, the various components and layers of integrated circuits are manufactured through processes such as photolithography, thin film deposition, ion implantation, diffusion, and metal deposition. Multiple chips can be manufactured on a single wafer, and through cutting and packaging, each chip is used as an independent IC product. Wafer manufacturing is a crucial step in the semiconductor industry, affecting the quality, efficiency, and cost of integrated circuits. After wafer fabrication is completed, the wafers need to be inspected. Wafer inspection is a core step in semiconductor manufacturing to ensure chip quality and yield, involving multi-dimensional technologies such as physical defect identification, dimensional measurement, and electrical performance testing.

[0003] In existing technologies, wafer inspection often requires clamping or supporting the wafer, which results in at least partial obstruction of the wafer. This obstructed portion cannot be accurately inspected, resulting in reduced inspection efficiency and poor results, potentially leading to the outflow of defective products. Furthermore, due to varying requirements, some wafers require double-sided inspection, while others only require single-sided inspection. The cameras required for high-precision inspection are expensive, and installing cameras on both sides would also be prohibitively expensive. Summary of the Invention

[0004] In view of the deficiencies in the prior art, one purpose of this specification is to provide a wafer flipping detection device that can achieve unobstructed detection, improve detection efficiency and avoid excessive costs.

[0005] To achieve the above objectives, the embodiments of this specification provide a wafer flip detection device, comprising:

[0006] A gripping mechanism, comprising two robotic arms, wherein the robotic arms are used to grip and move the wafer to be tested;

[0007] A flip mechanism located on one side of the gripping mechanism in the first direction includes a flip platform and a flip motor; the flip platform is fixedly connected to the output shaft of the flip motor, and the output shaft of the flip motor extends along the first direction;

[0008] The detection mechanism located on the same side of the gripping mechanism as the flipping mechanism comprises a camera, a carrying assembly, a first light source assembly, a second light source assembly and a moving assembly; the detection mechanism is located on one side of the flipping mechanism in the second direction, and the first direction is perpendicular to the second direction; the camera is fixed; the carrying assembly is arranged below the camera, and comprises a horizontally arranged mounting plate and a plurality of carrying blocks movably arranged on the mounting plate; the mounting plate is provided with a through hole, and a plurality of the carrying blocks are spaced apart in the circumferential direction of the through hole; the moving direction of the carrying block is parallel to the radial direction of the through hole; the carrying block has an extension an extended position and a retracted position; when the supporting block is in the extended position, the minimum distance from the supporting block to the center of the through hole is less than the radius of the wafer to be measured; when the supporting block is in the retracted position, the minimum distance from the supporting block to the center of the through hole is greater than the radius of the wafer to be measured; the plurality of supporting blocks are configured as follows: when a supporting block is in the retracted position, at least three supporting blocks are in the extended position; the first light source assembly and the second light source assembly are respectively arranged above and below the supporting assembly; the moving assembly is connected to the mounting plate, and can drive the supporting assembly to move in the first direction and the second direction.

[0009] As a preferred embodiment, the supporting block is fixedly connected to a connecting block on a side facing away from the center of the through hole, the mounting plate is fixedly connected to a fixing block and a guide member, the guide member extends radially along the through hole; the connecting block is slidably connected to the guide member; a spring is provided between the connecting block and the fixed block; a limiting member is fixedly provided on the connecting block, the limiting member extends in a direction perpendicular to the radial direction of the through hole; a vertically extending rotating shaft is fixedly connected to the mounting plate; the rotating shaft is rotatably connected to a connecting rod, one end of the connecting rod abuts against a side of the limiting member close to the supporting block, and the other end is fixedly connected to the output end of the first driving member.

[0010] As a preferred embodiment, the number of the supporting blocks is six; the six supporting blocks are evenly spaced and distributed in the circumference of the through hole, and are symmetrically arranged in the first direction and the second direction; the moving directions of the output ends of the multiple first driving members are parallel to the second direction.

[0011] As a preferred embodiment, an opening is provided on one side of the mounting plate in the first direction, and the opening is communicated with the through hole.

[0012] As a preferred embodiment, the detection mechanism further includes a horizontally arranged first fixed plate and a support frame fixedly connected to the first fixed plate; the camera is fixedly connected to the support frame; the carrying assembly is slidably connected to the first fixed plate via the moving assembly; the moving assembly includes:

[0013] Two first slide rails fixedly connected to the upper surface of the first fixing plate, the first slide rails extending along the first direction; the two first slide rails are spaced apart in the second direction;

[0014] a connecting plate slidably connected to the two first slide rails;

[0015] a second driving member connected to the connecting plate, configured to drive the connecting plate to move along the first direction;

[0016] A second slide rail fixedly connected to the upper surface of the connecting plate, the second slide rail extending along the second direction; the mounting plate is slidably connected to the second slide rail;

[0017] A third driving member connected to the mounting plate is used to drive the mounting plate to move along the second direction.

[0018] As a preferred embodiment, the first light source assembly is connected to the support frame through a first adjustable bracket; the second light source assembly is connected to the first fixed plate through a second adjustable bracket; the light emitted by the first light source assembly on the upper surface of the wafer to be tested is staggered with the light emitted by the second light source assembly on the lower surface of the wafer to be tested.

[0019] As a preferred embodiment, the flip mechanism further includes a horizontally arranged second fixing plate, the second fixing plate being aligned with the first fixing plate; the fixed end of the flip motor is fixedly connected to the upper surface of the second fixing plate.

[0020] As a preferred embodiment, a position correction component is also provided on the second fixed plate, including a turntable for carrying the wafer to be tested and a rotating motor connected to the turntable. The turntable is arranged horizontally, and the rotating motor is used to drive the turntable to rotate in a vertical direction.

[0021] As a preferred embodiment, the position correction assembly is located below the flip platform; a plurality of support columns are fixed on the second fixed plate, and the tops of the support columns are connected to horizontally arranged protective plates, which are located between the flip platform and the position correction assembly.

[0022] As a preferred embodiment, the bottom of the gripping mechanism is connected to a third slide rail, and the third slide rail extends along the second direction; the gripping planes of the two robotic arms are located at different heights. Beneficial effects

[0023] The wafer flip detection device provided in this embodiment comprises a detection mechanism including a camera, a carrier assembly, a first light source assembly, a second light source assembly, and a moving assembly. The first light source assembly above the carrier assembly and the second light source assembly below the carrier assembly can illuminate both the upper and lower sides of the wafer to be tested on the carrier assembly, thereby making the image captured by the camera clearer and improving the accuracy of the detection. By driving the carrier assembly to move in a first direction and a second direction by the moving assembly, different parts of the wafer to be tested can be sequentially passed under the bottom of the camera, thereby achieving photographic detection of all positions on one side of the wafer to be tested.

[0024] When the contact position between the wafer to be tested and the carrier block is moved to directly below the camera, the carrier block moves radially from the extended position to the retracted position, thereby changing the contact carrying state with the wafer to be tested to a separated state. The carrier part will not block the second light source assembly, and the camera can capture a clear unobstructed image of the wafer to be tested under the illumination of the first light source assembly and the second light source assembly, thereby realizing unobstructed detection and improving the accuracy of detection.

[0025] At the same time, since multiple supporting blocks are configured as follows: when a supporting block is in the retracted position, at least three supporting blocks are in the extended position, even if some supporting blocks are in the retracted position in order to capture unobstructed images, the other at least three supporting blocks in the extended position can achieve stable support for the wafer to be tested, ensuring that the detection process can be carried out continuously and improving detection efficiency.

[0026] In addition, the wafer flipping inspection device is equipped with a gripping mechanism and a flipping mechanism. The flipping mechanism can flip the wafer to be tested on demand, and the gripping mechanism can move the wafer to the flipping mechanism or the inspection mechanism, avoiding the high cost of setting up two cameras. The gripping mechanism includes two robotic arms, which can greatly shorten the waiting time of the inspection mechanism. After the inspection of a wafer is completed, one robotic arm removes it, and the other robotic arm can immediately place the next wafer to be tested on the support assembly, improving inspection efficiency.

[0027] With reference to the following description and the accompanying drawings, the specific embodiments of the present invention are disclosed in detail, indicating the manner in which the principles of the present invention can be employed. It should be understood that the embodiments of the present invention are not limited in scope thereby.

[0028] Features described and / or illustrated with respect to one embodiment may be used in the same or similar manner in one or more other embodiments, combined with features in other embodiments, or substituted for features in other embodiments.

[0029] It should be emphasized that the term "include / comprising" when used herein refers to the presence of features, integers, steps or components, but does not exclude the presence or addition of one or more other features, integers, steps or components. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative labor.

[0031] Figure 1 Schematic diagram of the three-dimensional structure of a wafer flip detection device provided in this embodiment;

[0032] Figure 2 This is a schematic structural diagram of a gripping mechanism provided in this embodiment;

[0033] Figure 3 This is a schematic structural diagram of a flip mechanism provided in this embodiment;

[0034] Figure 4 This is a schematic structural diagram of a detection mechanism provided in this embodiment;

[0035] Figure 5 This is a schematic structural diagram of a load-bearing assembly provided in this embodiment;

[0036] Figure 6 A top view of a carrier assembly provided in this embodiment;

[0037] Figure 7 This is a schematic structural diagram of a bearing block and a first driving member provided in this embodiment;

[0038] Figure 8 This is a structural diagram of a mobile component provided in this embodiment.

[0039] Description of reference numerals:

[0040] 1. Grasping mechanism; 11. Robotic arm; 12. Third slide rail;

[0041] 2. Flip mechanism; 21. Flip platform; 22. Flip motor; 23. Second fixed plate; 24. Position correction assembly; 241. Turntable; 25. Support column; 26. Protective plate;

[0042] 3. Detection mechanism; 31. Camera; 32. Carrying assembly; 321. Mounting plate; 3211. Through hole; 3212. Opening; 322. Carrying block; 3221. Carrying surface; 3222. Inclined surface; 323. Connecting block; 324. Fixed block; 325. Guide member; 326. Spring; 327. Limiting member; 328. Rotating shaft; 329. Connecting rod; 3210. First driving member; 33. First light source assembly; 331. First adjustable bracket; 34. Second light source assembly; 341. Second adjustable bracket; 35. Moving assembly; 351. First slide rail; 352. Connecting plate; 353. Second driving member; 354. Second slide rail; 355. Third driving member; 356. Intermediate plate; 36. First fixed plate; 37. Support frame;

[0043] 10. Wafer to be tested; F, radial direction; X, first direction; Y, second direction; Z, vertical direction. DETAILED DESCRIPTION

[0044] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0045] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or there may be another element centered thereon. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be another element centered thereon. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0047] See also Figures 1 to 8 The embodiment of the present application provides a wafer flipping detection device, comprising: a gripping mechanism 1 , a flipping mechanism 2 , and a detection mechanism 3 .

[0048] Among them, such as Figure 1As shown, the gripping mechanism 1 includes two robotic arms 11, which are used to grip and move the wafer to be tested 10. The flipping mechanism 2 is located on one side of the gripping mechanism 1 in the first direction X, and includes a flipping platform 21 and a flipping motor 22. The flipping platform 21 is fixedly connected to the output shaft of the flipping motor 22, and the output shaft of the flipping motor 22 extends along the first direction X. The flipping platform 21 is arranged horizontally, and the flipping motor 22 is used to drive the flipping platform 21 to rotate 180° so that the front side or the back side of the wafer to be tested 10 is facing up. The detection mechanism 3 and the flipping mechanism 2 are located on the same side of the gripping mechanism 1. The detection mechanism 3 is located on one side of the flipping mechanism 2 in the second direction Y. The first direction X and the second direction Y are two directions perpendicular to each other in the horizontal plane, and the first direction X and the second direction Y are both perpendicular to the vertical direction Z.

[0049] like Figures 4 to 8 As shown, the detection mechanism 3 includes a camera 31, a carrying assembly 32, a first light source assembly 33, a second light source assembly 34 and a moving assembly 35. The camera 31 is fixed. The carrying assembly 32 is used to carry the wafer 10 to be tested. The carrying assembly 32 is set below the camera 31. Figure 5 As shown, the support assembly 32 includes a horizontally arranged mounting plate 321 and a plurality of support blocks 322 movably mounted on the mounting plate 321. The mounting plate 321 is provided with a through hole 3211, and the plurality of support blocks 322 are spaced apart circumferentially around the through hole 3211. The movement direction of the support blocks 322 is parallel to the radial direction F of the through hole 3211. The support blocks 322 have an extended position and a retracted position. When the support blocks 322 are in the extended position, the minimum distance from the support blocks 322 to the center of the through hole 3211 is less than the radius of the wafer 10 to be tested, and the support blocks 322 can support the wafer 10 to be tested. When the support blocks 322 are in the retracted position, the minimum distance from the support blocks 322 to the center of the through hole 3211 is greater than the radius of the wafer 10 to be tested, and the support blocks 322 are separated from the wafer 10 to be tested. The plurality of support blocks 322 are configured such that when one support block 322 is in the retracted position, at least three support blocks 322 are in the extended position. The first light source assembly 33 and the second light source assembly 34 are respectively disposed above and below the carrier assembly 32. The moving assembly 35 is connected to the mounting plate 321 and can drive the carrier assembly 32 to move in the first direction X and the second direction Y.

[0050] The wafer flip detection device provided in this embodiment is provided with a detection mechanism 3 including a camera 31, a supporting component 32, a first light source component 33, a second light source component 34 and a moving component 35. Through the first light source component 33 above the supporting component 32 and the second light source component 34 below the supporting component 32, the upper and lower sides of the wafer 10 to be tested on the supporting component 32 can be illuminated, so that the image taken by the camera 31 can be clearer and the accuracy of the detection can be improved. By driving the supporting component 32 to move in the first direction X and the second direction Y by the moving component 35, different parts of the wafer 10 to be tested can pass through the bottom of the camera 31 in turn, thereby realizing the photo detection of all positions on one side of the wafer 10 to be tested.

[0051] When the contact position between the wafer to be tested 10 and the supporting block 322 is moved to directly below the camera 31, the supporting block 322 moves from the extended position along the radial direction F to the retracted position, thereby changing the contact supporting state with the wafer to be tested 10 to a separated state. The supporting part will not block the second light source assembly 34, and the camera 31 can capture a clear and unobstructed image of the wafer to be tested 10 under the illumination of the first light source assembly 33 and the second light source assembly 34, thereby realizing unobstructed detection and improving the accuracy of detection.

[0052] At the same time, since multiple supporting blocks 322 are configured as follows: when a supporting block 322 is in the retracted position, at least three supporting blocks 322 are in the extended position, even if some supporting blocks 322 are in the retracted position in order to capture an unobstructed image, the other at least three supporting blocks 322 in the extended position can achieve stable support for the wafer 10 to be tested, ensuring that the detection process can be carried out continuously and improving detection efficiency.

[0053] In addition, the wafer flipping detection device is equipped with a gripping mechanism 1 and a flipping mechanism 2. The flipping mechanism 2 can flip the wafer 10 to be tested whose other side needs to be tested as needed, and the gripping mechanism 1 can move the wafer 10 to be tested to the flipping mechanism 2 or the detection mechanism 3, avoiding the high cost caused by setting up two cameras 31. The gripping mechanism 1 includes two robotic arms 11, which can greatly shorten the waiting time of the detection mechanism 3. When a wafer is inspected, one of the robotic arms 11 removes it, and the other robotic arm 11 can immediately place the next wafer 10 to be tested on the carrier assembly 32, thereby improving detection efficiency.

[0054] In this embodiment, if Figure 7As shown, a connecting block 323 is fixedly connected to the side of the supporting block 322 facing away from the center of the through hole 3211, and a fixing block 324 and a guide member 325 are fixedly connected to the mounting plate 321. The guide member 325 extends along the radial direction F of the through hole 3211. The connecting block 323 is slidably connected to the guide member 325. A spring 326 is provided between the connecting block 323 and the fixing block 324. Under the action of the spring 326, the supporting block 322 is in the extended position. By driving the connecting block 323 by an external force, the connecting block 323 moves along the guide member 325 away from the center of the through hole 3211, compressing the spring 326, and the supporting block 322 can be placed in the retracted position. When the external force is removed, the compressed spring 326 will reset, and under the push of the spring 326, the supporting block 322 returns to the extended position.

[0055] Specifically, a limit member 327 is fixedly provided on the connecting block 323, and the limit member 327 extends in a direction perpendicular to the radial direction F of the through hole 3211. A vertically extending rotating shaft 328 is fixedly connected to the mounting plate 321. The rotating shaft 328 is rotatably connected to a connecting rod 329, and the rotating shaft 328 is roughly located at the center of the connecting rod 329. The connecting rod 329 can rotate around the rotating shaft 328. One end of the connecting rod 329 abuts against the side of the limit member 327 close to the supporting block 322, and the other end is fixedly connected to the output end of the first driving member 3210. The first driving member 3210 is used to drive one end of the connecting rod 329 to move, so that the connecting rod 329 rotates, and the end of the connecting rod 329 abutting against the limit member 327 moves accordingly, thereby applying an external force to the connecting block 323, thereby moving the supporting block 322 from the extended position to the retracted position. By driving the bearing block 322 by means of the first driving member 3210 and the connecting rod 329, the space on the mounting plate 321 can be reasonably utilized. Preferably, the first driving member 3210 is a cylinder.

[0056] Multiple first driving members 3210 can all be electrically connected to the controller, and the controller is electrically connected to the moving component 35. In the process of the moving component 35 driving the supporting component 32 to move, when the position where the wafer to be tested 10 contacts the supporting block 322 is directly below the camera 31, the first driving member 3210 corresponding to the supporting block 322 is started, causing the supporting block 322 to retract and separate from the wafer to be tested 10; when the position where the wafer to be tested 10 contacts the supporting block 322 is not directly below the camera 31, the first driving member 3210 is reset, releasing the force of the connecting rod 329 on the limit member 327, and under the reset force of the spring 326, the supporting block 322 returns to the extended position.

[0057] In this embodiment, an opening 3212 is provided on one side of the mounting plate 321 in the first direction X, and the opening 3212 is connected to the through hole 3211. The opening 3212 can reserve sufficient loading space for the robotic arm 11, so that the robotic arm 11 can move the wafer 10 to be tested to the through hole 3211 and place it on multiple supporting blocks 322.

[0058] Specifically, there are at least four supporting blocks 322. In a preferred embodiment, there are six supporting blocks 322. When one of the supporting blocks 322 is moved to the position directly below the camera 31 and switched to the retracted position, the remaining five supporting blocks 322 can stably support the wafer 10 to be tested.

[0059] like Figure 6 As shown, six bearing blocks 322 are evenly spaced around the circumference of through-hole 3211 and are symmetrically arranged in both the first direction X and the second direction Y. Since opening 3212 is located on one side of mounting plate 321 in the first direction X, two bearing blocks 322 are located at either end of the diameter of through-hole 3211 extending in the second direction Y, and two bearing blocks 322 are located on either side of opening 3212. The angle between two adjacent bearing blocks 322 and the center of through-hole 3211 is 60°.

[0060] Preferably, the moving directions of the output ends of the multiple first driving members 3210 are all parallel to the second direction Y, which facilitates the layout and control of the multiple first driving members 3210.

[0061] like Figure 7 As shown, the bottom of the supporting block 322 is provided with a supporting surface 3221 for supporting the wafer 10 to be tested. The supporting surface 3221 is arranged horizontally, and the supporting surfaces 3221 of multiple supporting blocks 322 are located in the same plane. The end of the supporting surface 3221 facing the center of the through hole 3211 is connected to an inclined surface 3222. The inclined surface 3222 is not higher than the supporting surface 3221. The inclined surface 3222 can prevent the right-angled edge of the supporting surface 3221 from scratching and damaging the wafer 10 to be tested.

[0062] In this embodiment, if Figure 4 As shown, the detection mechanism 3 also includes a horizontally arranged first fixed plate 36 and a support frame 37 fixedly connected above the first fixed plate 36. The detection mechanism 3 can be mounted on a specific work surface via the first fixed plate 36. The camera 31 is fixedly connected to the support frame 37 to avoid vibration caused by movement and ensure detection accuracy. The support assembly 32 is slidably connected to the first fixed plate 36 via the moving assembly 35.

[0063] Specifically, such as Figure 8As shown, the moving assembly 35 includes two first slide rails 351, a connecting plate 352, a second driving member 353, a second slide rail 354, and a third driving member 355. The two first slide rails 351 are fixedly connected to the upper surface of the first fixed plate 36. The first slide rails 351 extend along the first direction X. The two first slide rails 351 are spaced apart in the second direction Y. The connecting plate 352 is slidably connected to the two first slide rails 351. The second driving member 353 is connected to the connecting plate 352 and is used to drive the connecting plate 352 to move along the first direction X. The second slide rail 354 is fixedly connected to the upper surface of the connecting plate 352. The second slide rail 354 extends along the second direction Y. The mounting plate 321 is slidably connected to the second slide rail 354 via the intermediate plate 356. The third driving member 355 is connected to the mounting plate 321 and is used to drive the intermediate plate 356 to cause the mounting plate 321 to move along the second direction Y.

[0064] In this embodiment, the first light source assembly 33 is connected to the support frame 37 via a first adjustable bracket 331. By adjusting the angle between the first adjustable bracket 331 and the horizontal plane, the angle of the first light source assembly 33 can be adjusted. The second light source assembly 34 is connected to the first fixing plate 36 via a second adjustable bracket 341. By adjusting the angle between the second adjustable bracket 341 and the horizontal plane, the angle of the second light source assembly 34 can be adjusted.

[0065] Preferably, the light irradiated by the first light source component 33 on the upper surface of the wafer 10 to be tested is staggered with the light irradiated by the second light source component 34 on the lower surface of the wafer 10 to be tested, that is, the two are located in different vertical planes, so that the irradiated light of the two light source components will not interfere with each other, which can ensure the clarity of the image taken by the camera 31, thereby improving the accuracy of the inspection.

[0066] In this embodiment, if Figure 3 As shown, the flip mechanism 2 also includes a horizontally disposed second fixing plate 23, which is aligned with the first fixing plate 36. Preferably, the second fixing plate 23 is fixedly connected to the first fixing plate 36, which makes the entire device more compact and shortens the travel distance of the robotic arm 11. The fixed end of the flip motor 22 is fixedly connected to the upper surface of the second fixing plate 23.

[0067] Preferably, a position correction assembly 24 is further provided on the second fixing plate 23, comprising a turntable 241 for supporting the wafer 10 to be tested and a rotary motor connected to the turntable 241. The turntable 241 is arranged horizontally, and the rotary motor is used to drive the turntable 241 to rotate about the vertical direction Z, thereby adjusting the wafer 10 to be tested to a desired position within the horizontal plane.

[0068] Specifically, the position correction assembly 24 is located below the flip platform 21, making the device structure more compact and shortening the travel distance of the robot arm 11. A plurality of support columns 25 are fixed to the second fixed plate 23. A horizontally arranged protective plate 26 is connected to the top of the support columns 25. The protective plate 26 is located between the flip platform 21 and the position correction assembly 24 to prevent the flip platform 21 from failing and causing the wafer to fall onto the position correction assembly 24.

[0069] like Figure 2 As shown, the gripping mechanism 1 is connected at its bottom to a third slide rail 12, which extends along the second direction Y. This allows the gripping mechanism 1 to move back and forth between the flipping mechanism 2 and the detection mechanism 3. The two robotic arms 11 can be connected to the same vertical track or to different vertical tracks to achieve lifting and lowering. The gripping planes of the two robotic arms 11 are located at different heights to avoid interference.

[0070] In a specific application scenario, if only the front side of the wafer needs to be inspected, the robotic arm 11 will first move the wafer 10 to be tested to the position correction component 24. After the position correction is completed, the robotic arm 11 will move the wafer 10 to be tested to the supporting component 32 for wafer inspection. After the inspection is completed, the robotic arm 11 will take the wafer away.

[0071] If only the back side of the wafer needs to be inspected, the robot arm 11 will first move the wafer to be tested 10 to the flipping platform 21. After completing the flipping of the wafer, the robot arm 11 will move the wafer to be tested 10 to the position correction component 24. After completing the position correction, the robot arm 11 will move the wafer to be tested 10 to the supporting component 32 for wafer inspection. After the inspection is completed, the robot arm 11 will take the wafer away.

[0072] If it is necessary to inspect the front and back sides of the wafer, the robot arm 11 will first move the wafer to be tested 10 to the position correction component 24. After completing the position correction, the robot arm 11 will move the wafer to be tested 10 to the supporting component 32 for wafer inspection. After the inspection is completed, the robot arm 11 will move the wafer to the flipping platform 21. After completing the flipping of the wafer, the robot arm 11 will move the wafer to be tested 10 to the supporting component 32 for wafer inspection. After the inspection is completed, the robot arm 11 will take the wafer away.

[0073] It should be noted that, in the description of this specification, the terms "first," "second," etc., are used solely for descriptive purposes and to distinguish similar objects. There is no order of precedence between the two, nor should they be understood to indicate or imply relative importance. Furthermore, in the description of this specification, unless otherwise specified, "plurality" means two or more.

[0074] Any numerical value cited herein includes all values ​​of the lower and upper values ​​in increments of one unit from the lower value to the upper value, provided that there is at least a two-unit interval between any lower value and any higher value. For example, if the value of a component quantity or process variable (e.g., temperature, pressure, time, etc.) is stated to be from 1 to 90, preferably from 20 to 80, and more preferably from 30 to 70, it is intended to illustrate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32, etc. are also explicitly listed in this specification. For values ​​less than 1, one unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples intended to be clearly stated, and it is to be understood that all possible combinations of the values ​​listed between the minimum and maximum values ​​are explicitly stated in this specification in a similar manner.

[0075] Unless otherwise indicated, all ranges include the endpoints and all numbers between the endpoints. When used with a range, "about" or "approximately" applies to both endpoints of the range. Thus, "about 20 to 30" is intended to cover "about 20 to about 30," including at least the specified endpoints.

[0076] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for all purposes. The term "consisting essentially of..." when describing a combination should include the identified elements, ingredients, components, or steps and other elements, ingredients, components, or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe a combination of elements, ingredients, components, or steps herein also contemplates embodiments consisting essentially of these elements, ingredients, components, or steps. By using the term "may," it is intended to indicate that any attribute described as "may" be optional.

[0077] Multiple elements, ingredients, parts or steps can be provided by a single integrated element, ingredient, part or step. Alternatively, a single integrated element, ingredient, part or step can be divided into separate multiple elements, ingredients, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, part or step is not intended to exclude other elements, ingredients, parts or steps.

[0078] It should be understood that the above description is for illustration and not for limitation. Many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of the present teachings should not be determined with reference to the above description, but rather with reference to the appended claims and the full scope of equivalents to which such claims are entitled. For the purpose of comprehensiveness, all articles and references, including disclosures of patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein from the foregoing claims is not intended to be a disclaimer of such subject matter, nor should it be assumed that the inventors did not consider such subject matter to be part of the disclosed inventive subject matter.

Claims

1. A wafer flip detection device, characterized in that: include: A gripping mechanism, comprising two robotic arms, wherein the robotic arms are used to grip and move the wafer to be tested; A flip mechanism located on one side of the gripping mechanism in the first direction includes a flip platform and a flip motor; the flip platform is fixedly connected to the output shaft of the flip motor, and the output shaft of the flip motor extends along the first direction; The detection mechanism located on the same side of the gripping mechanism as the flipping mechanism comprises a camera, a carrying assembly, a first light source assembly, a second light source assembly and a moving assembly; the detection mechanism is located on one side of the flipping mechanism in the second direction, and the first direction is perpendicular to the second direction; the camera is fixed; the carrying assembly is arranged below the camera, and comprises a horizontally arranged mounting plate and a plurality of carrying blocks movably arranged on the mounting plate; the mounting plate is provided with a through hole, and a plurality of the carrying blocks are spaced apart in the circumferential direction of the through hole; the moving direction of the carrying block is parallel to the radial direction of the through hole; the carrying block has an extension an extended position and a retracted position; when the carrying block is in the extended position, the minimum distance from the carrying block to the center of the through hole is less than the radius of the wafer to be measured; when the carrying block is in the retracted position, the minimum distance from the carrying block to the center of the through hole is greater than the radius of the wafer to be measured; the plurality of carrying blocks are configured such that when a carrying block is in the retracted position, at least three carrying blocks are in the extended position; the first light source assembly and the second light source assembly are respectively arranged above and below the carrying assembly; the moving assembly is connected to the mounting plate and can drive the carrying assembly to move in the first direction and the second direction; The supporting block is fixedly connected to a connecting block on one side facing away from the center of the through hole, and a fixing block and a guide member are fixedly connected to the mounting plate, and the guide member extends radially along the through hole; the connecting block is slidably connected to the guide member; a spring is provided between the connecting block and the fixed block; a limiting member is fixedly provided on the connecting block, and the limiting member extends in a direction perpendicular to the radial direction of the through hole; a vertically extending rotating shaft is fixedly connected to the mounting plate; a connecting rod is rotatably connected to the rotating shaft, one end of the connecting rod abuts against a side of the limiting member close to the supporting block, and the other end is fixedly connected to the output end of the first driving member.

2. The wafer flip detection device according to claim 1, characterized in that: The number of the bearing blocks is six; the six bearing blocks are evenly distributed around the circumference of the through hole and are symmetrically arranged in the first direction and the second direction; the moving directions of the output ends of the plurality of first driving members are parallel to the second direction.

3. The wafer flip detection device according to claim 1, characterized in that: An opening is provided on one side of the mounting plate in the first direction, and the opening is communicated with the through hole.

4. The wafer flip detection device according to claim 1, wherein: The detection mechanism further includes a first fixing plate arranged horizontally, and a support frame fixedly connected to the first fixing plate; the camera is fixedly connected to the support frame; The bearing assembly is slidably connected to the first fixed plate via the moving assembly; The mobile component includes: Two first slide rails fixedly connected to the upper surface of the first fixing plate, the first slide rails extending along the first direction; the two first slide rails are spaced apart in the second direction; a connecting plate slidably connected to the two first slide rails; a second driving member connected to the connecting plate, configured to drive the connecting plate to move along the first direction; A second slide rail fixedly connected to the upper surface of the connecting plate, the second slide rail extending along the second direction; the mounting plate is slidably connected to the second slide rail; A third driving member connected to the mounting plate is used to drive the mounting plate to move along the second direction.

5. The wafer flip detection device according to claim 4, characterized in that: The first light source assembly is connected to the support frame through a first adjustable bracket; the second light source assembly is connected to the first fixing plate through a second adjustable bracket; the light emitted by the first light source assembly on the upper surface of the wafer to be tested is staggered with the light emitted by the second light source assembly on the lower surface of the wafer to be tested.

6. The wafer flip detection device according to claim 4, characterized in that: The flip mechanism further includes a second fixed plate arranged horizontally, and the second fixed plate is aligned with the first fixed plate; the fixed end of the flip motor is fixedly connected to the upper surface of the second fixed plate.

7. The wafer flip detection device according to claim 6, characterized in that: The second fixed plate is also provided with a position correction component, including a turntable for carrying the wafer to be tested and a rotating motor connected to the turntable. The turntable is arranged horizontally, and the rotating motor is used to drive the turntable to rotate around the vertical direction.

8. The wafer flip detection device according to claim 7, characterized in that: The position correction component is located below the flip platform; a plurality of support columns are fixedly provided on the second fixed plate, the tops of the support columns are connected to horizontally arranged protective plates, and the protective plates are located between the flip platform and the position correction component.

9. The wafer flip detection device according to claim 1, wherein: The bottom of the gripping mechanism is connected to a third slide rail, and the third slide rail extends along the second direction; the gripping planes of the two robotic arms are located at different heights.

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