Chip packaging test device and packaging test method

Abstract

The invention relates to a chip packaging test device and a chip packaging test method, and belongs to the technical field of chips, the chip packaging test device comprises a workbench and a feeding mechanism penetrating through the workbench, and the feeding mechanism is movably connected to the workbench in the horizontal direction; the feeding mechanism is provided with a plurality of test grooves used for storing packaged chips in the moving direction of the feeding mechanism, and two rows of detection plates corresponding to pins on the two sides of the packaged chips are arranged at the bottoms of the test grooves. The chip packaging testing device further comprises a lifting mechanism arranged on the workbench, the lifting end of the lifting mechanism is connected with a testing mechanism, and the lifting mechanism drives the testing mechanism to move in the vertical direction so that the testing mechanism can stretch into or be separated from the testing groove located under the testing mechanism. The actions of the lifting mechanism and the testing mechanism are controlled through the linkage mechanism, and manual intervention is reduced, so that the safety, the accuracy and the efficiency of the testing process are improved, and meanwhile, the cost loss and the production risk caused by manual operation errors are also reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor testing, and particularly relates to a chip packaging testing device and a packaging testing method. Background Art

[0002] Chip packaging refers to the housing used to install semiconductor integrated circuit chips, which plays the roles of placing, fixing, sealing, protecting the chips and enhancing the electrothermal performance. Moreover, it is also a bridge connecting the internal world of the chips and the external circuit. The contacts on the chips are connected to the pins of the packaging housing by wires, and these pins are further connected to other devices through the wires on the printed circuit board.

[0003] For example, the invention patent with the patent authorization announcement number: CN115144732A discloses a computer chip packaging testing device, including a workbench. A carrier seat for storing chips is arranged on the workbench. A positioning mechanism for positioning the chips is arranged inside the workbench. A lifting mechanism for driving the testing mechanism to lift is arranged on one side of the workbench. The testing mechanism is arranged above the workbench; a plurality of positioning grooves are symmetrically opened on both sides of the carrier seat. In the present invention, by arranging a positioning mechanism inside the workbench, the positioning mechanism is used to adjust the position of the chips on the carrier seat, so that the chips can be centered on the carrier seat, which is convenient for the chip pins to contact the detection board and improves the quality of chip detection; the rotatable object-taking handle arranged on the carrier seat is convenient for taking out the chips from the carrier seat, avoiding the chips being too closely attached to the detection board and being difficult to take out manually by the operator, and improving the detection efficiency of the chips.

[0004] Based on the retrieval of the above patent authorization announcement number and combined with its deficiencies, it is found that: Although the above embodiment has an object-taking handle that can lift the chips from the carrier seat, it still requires manual placement of the chips at the test station or removal from the test station. This manual operation has a risk of being injured by the lifting mechanism due to misoperation. Summary of the Invention

[0005] To solve the existing problems, the present invention provides a chip packaging testing device and a packaging testing method.

[0006] The object of the present invention can be achieved through the following technical solutions: The present invention provides a chip packaging and testing device, comprising a workbench and a feeding mechanism passing through the workbench, the feeding mechanism being movably connected to the workbench in a horizontal direction; the feeding mechanism being provided with a plurality of test slots for storing packaged chips along its moving direction, the bottoms of the test slots being provided with two rows of detection plates corresponding to pins on both sides of the packaged chips; the chip packaging and testing device also comprises a lifting mechanism provided on the workbench, the lifting end of the lifting mechanism being connected to a testing mechanism, the lifting mechanism driving the testing mechanism to move in a vertical direction so that the testing mechanism can enter or exit the test slots directly below it; In which, the chip packaging testing device also includes a linkage mechanism, which has a first state and a second state; when any of the test slots moves to the bottom of the test mechanism, the first state of the linkage mechanism is triggered, and the linkage mechanism responds and drives the lifting mechanism to drive the test mechanism to descend to probe into the corresponding test slot; when any of the test slots moves away from the bottom of the test mechanism, the second state of the linkage mechanism is triggered, and the linkage mechanism responds and drives the lifting mechanism to drive the test mechanism to rise to escape from the corresponding test slot.

[0007] As a preferred technical solution of the present invention, the feeding mechanism includes a movable plate, a transmission gear, and a driving member. The workbench is provided with two symmetrical horizontal slide rails. The two sides of the movable plate are slidably matched with the two horizontal slide rails. The test slot is opened on the upper side of the movable plate. The bottom side of the movable plate is provided with a toothed portion. The transmission gear is rotatably connected to the workbench below the movable plate, and the transmission gear is meshed with the toothed portion. The driving member is transmission-connected to the transmission gear. In which, the driving member includes a manual wheel, which is rotated by operating the manual wheel to drive the transmission gear to rotate, so that the movable plate moves in the horizontal direction; and / or the driving member includes a first stepper motor, which drives the transmission gear to rotate by the first stepper motor to move the movable plate in the horizontal direction.

[0008] As a preferred technical solution of the present invention, a plurality of the test slots are arranged at equal intervals on the upper side of the movable plate along its moving direction.

[0009] As a preferred technical solution of the present invention, the lifting mechanism includes a mounting frame, a second stepping motor, a transmission screw rod, a positioning bearing and a transmission slider. The mounting frame is mounted on the workbench. The second stepping motor and the positioning bearing are mounted on the vertical sides of the mounting frame. Two ends of the transmission screw rod are respectively connected to the second stepping motor and the positioning bearing. The transmission slider is in threaded cooperation with the transmission screw rod, and a vertical slide rail is arranged on the mounting frame. The transmission slider is in sliding cooperation with the vertical slide rail.

[0010] As a preferred technical solution of the present invention, the testing mechanism includes a guiding base and a probe module. The guiding base is fixed to the lifting end of the lifting mechanism, and the probe module is connected to the lower side of the guiding base. Wherein, the probe module includes two rows of elastic probes arranged in parallel. The arrangement pitch of the elastic probes matches the pitch of two rows of pins of the detection board. Each elastic probe is internally provided with a compression spring and a gold-plated contact head is arranged at the end. A testing circuit board is arranged inside the guiding base, and the probe module is electrically connected to the testing circuit board.

[0011] As a preferred technical solution of the present invention, an indicator light is arranged on one side of the guiding base, and the indicator light is electrically connected to the testing circuit board.

[0012] As a preferred technical solution of the present invention, the linkage mechanism includes a controller and a spring plunger. The spring plunger is embedded in the horizontal slide rail. A plurality of clearance holes are arranged on one side of the moving plate corresponding to the horizontal slide rail. The plurality of clearance holes and the plurality of testing slots are in one-to-one correspondence in the horizontal direction perpendicular to the horizontal slide rail. When any one of the testing slots is directly below the testing mechanism, the spring plunger is released and extends into the clearance hole. When all the testing slots are not directly below the testing mechanism, the spring plunger is compressed under the moving plate. Wherein, a pressure sensor is arranged between the spring plunger and the horizontal slide rail. The pressure sensor is electrically connected to the controller, and the controller is electrically connected to the second stepping motor. When the spring plunger is released, the pressure sensed by the pressure sensor is less than a first preset pressure value. The controller transmits a first pulse signal to the second stepping motor, and the lifting mechanism drives the testing mechanism to descend.

[0013] As a preferred technical solution of the present invention, the linkage mechanism further includes a laser emitter and a laser receiver. The laser emitter and the laser receiver are respectively arranged on two sides of the workbench, and the laser beam of the laser emitter relative to the laser receiver is blocked when the testing mechanism extends into the testing slot. The laser receiver and the controller are electrically connected. When the time without laser input to the laser receiver continuously reaches a first preset time, the controller transmits a second pulse signal opposite to the first pulse signal to the second stepping motor, and the lifting mechanism drives the testing mechanism to rise.

[0014] As a preferred technical solution of the present invention, the controller is also electrically connected to the first stepping motor. When the controller transmits the second pulse signal to the second stepping motor, the controller also transmits a third pulse signal to the first stepping motor; wherein, after the first stepping motor receives the third pulse signal, the moving distance of the driven moving plate is the same as the interval distance between two adjacent test slots.

[0015] In a second aspect, the present invention provides a packaging and testing method, which is applied to the chip packaging and testing device described in the first aspect, and includes the following steps: Control the horizontal movement of the feeding mechanism to move the target test slot directly below the testing mechanism; When the target test slot arrives, the linkage mechanism triggers the first state, driving the lifting mechanism to drive the testing mechanism to descend, so that the probe module of the testing mechanism contacts the pins of the detection board; Conduct electrical testing on the packaged chip through the probe module; If the testing is completed and the laser receiver detects that the occlusion signal lasts for a second preset time, the linkage mechanism triggers the second state, driving the lifting mechanism to rise and reset; Control the feeding mechanism to move to the position of the next test slot.

[0016] The beneficial effects of the present invention are as follows: In this solution, the actions of the lifting mechanism and the testing mechanism are controlled by the linkage mechanism, reducing manual intervention, thereby improving the safety, accuracy and efficiency of the testing process. At the same time, it also reduces the cost losses and production risks caused by manual operation errors, and solves the problem that in the prior art, it is necessary to manually place the chip on the test station or take it out from the test station, and such manual operation may cause injury due to misoperation by the lifting mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] For the convenience of those skilled in the art to understand, the present invention will be further described below with reference to the accompanying drawings.

[0018] Figure 1 It is a schematic structural diagram of a chip packaging and testing device of the present invention; Figure 2 is Figure 1 a partially enlarged schematic view of the structure of part A; Figure 3 It is a schematic structural diagram of a spring ball of a chip packaging and testing device of the present invention extending into the clearance hole. Figure 4 Schematic diagram of the moving plate structure of a chip packaging and testing device according to the present invention; Figure 5 Flow chart of the chair packaging and testing method according to the present invention.

[0019] Main symbol description In the figure: 10, workbench; 11, horizontal slide rail; 20, feeding mechanism; 21, moving plate; 211, test slot; 212, detection plate; 213, clearance hole; 22, driving gear; 23, manual runner; 24, first stepping motor; 30, lifting mechanism; 31, mounting bracket; 32, second stepping motor; 33, driving screw; 34, vertical slide rail; 40, testing mechanism; 41, guiding base; 42, probe module; 43, indicator light; 50, controller; 51, spring bead; 52, laser emitter; 53, laser receiver. Specific embodiments

[0020] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0023] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.

[0024] In the present invention, unless otherwise clearly specified or limited, the terms "mounted", "connected", "coupled", "fixed", etc. shall be construed in a broad sense. For example, it may be a connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In the present invention, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than that of the second feature.

[0026] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0027] Please refer to Figures 1 to 4, this embodiment provides a chip packaging and testing device, including a workbench 10 and a feeding mechanism 20 passing through the workbench 10. The feeding mechanism 20 is movably connected to the workbench 10 in the horizontal direction. A number of test slots 211 for storing packaged chips are arranged along the moving direction of the feeding mechanism 20. Detection plates 212 corresponding to the pins on both sides of the packaged chip are arranged at the bottom of the test slots 211. The chip packaging and testing device further includes a lifting mechanism 30 arranged on the workbench 10. The lifting end of the lifting mechanism 30 is connected to a testing mechanism 40. The lifting mechanism 30 drives the testing mechanism 40 to move in the vertical direction so that the testing mechanism 40 can penetrate into or withdraw from the test slot 211 directly below it. Among them, the chip packaging and testing device further includes a linkage mechanism, and the linkage mechanism has a first state and a second state. When any test slot 211 moves to directly below the testing mechanism 40, the first state of the linkage mechanism is triggered, and the linkage mechanism responds and drives the lifting mechanism 30 to drive the testing mechanism 40 to descend to penetrate into the corresponding test slot 211. When any test slot 211 moves away from directly below the testing mechanism 40, the second state of the linkage mechanism is triggered, and the linkage mechanism responds and drives the lifting mechanism 30 to drive the testing mechanism 40 to ascend to withdraw from the corresponding test slot 211.

[0028] In this embodiment, the workbench 10 serves as the support foundation of the entire device. The feeding mechanism 20 passes through the workbench 10 and moves in the horizontal direction for storing and transporting packaged chips. The lifting mechanism 30 drives the testing mechanism 40 to move in the vertical direction to complete the testing operation of the chip. The linkage mechanism has a first state and a second state and can automatically trigger corresponding actions according to the position of the test slot 211. When the test slot 211 moves to directly below the testing mechanism 40, the linkage mechanism is in the first state, driving the lifting mechanism 30 to drive the testing mechanism 40 to descend, so that the testing mechanism 40 penetrates into the test slot 211. When the test slot 211 moves away from directly below the testing mechanism 40, the linkage mechanism switches to the second state, driving the lifting mechanism 30 to drive the testing mechanism 40 to ascend and withdraw from the test slot 211. The testing of the chip is realized in an automated manner, avoiding the risk of being injured by the lifting mechanism 30 when manually placing and removing the chip, ensuring the personal safety of the operator, and realizing the full automation of chip packaging and testing. From the movement of the test slot 211, the lifting control of the testing mechanism 40 to the electrical testing of the chip, the entire process requires no manual intervention, improving production efficiency and testing consistency.

[0029] Furthermore, the feeding mechanism 20 includes a movable plate 21, a transmission gear 22 and a driving member. The workbench 10 is provided with two symmetrical horizontal slide rails 11. The two sides of the movable plate 21 slide in cooperation with the two horizontal slide rails 11, and the test slot 211 is opened on the upper side of the movable plate 21; a toothed portion is provided on the bottom side of the movable plate 21, and the transmission gear 22 is rotatably connected to the workbench 10 below the movable plate 21, and the transmission gear 22 is engaged with the toothed portion; the driving member is transmission-connected to the transmission gear 22; wherein the driving member includes a manual wheel 23, which is driven by operating the manual wheel 23 to rotate the transmission gear 22 so that the movable plate 21 moves horizontally; and / or the driving member includes a first stepper motor 24, which is driven by the first stepper motor 24 to rotate the transmission gear 22 so that the movable plate 21 moves horizontally.

[0030] During dynamic operation, when the test slot 211 needs to be moved, the operator can select manual or automatic mode. In manual mode, the operator rotates the manual wheel 23, which drives the transmission gear 22 to rotate. The transmission gear 22 engages with the toothed portion on the bottom side of the movable plate 21, causing the movable plate 21 to move along the horizontal slide rail 11. In automatic mode, the first stepper motor 24 begins operating after receiving a pulse signal, driving the transmission gear 22 to rotate, thereby moving the movable plate 21. Whether in manual or automatic mode, the movement of the movable plate 21 is achieved through the engagement of the transmission gear 22 and the toothed portion, ensuring smooth and accurate movement.

[0031] Furthermore, a plurality of test slots 211 are arranged at equal intervals on the upper side of the movable plate 21 along its direction of movement. By arranging the test slots 211 at equal intervals, the movable plate 21 moves a fixed distance each time, and the controller 50 can pre-set the movement step length, thereby quickly and accurately moving the next test slot 211 to the test position, reducing positioning time and errors and improving testing efficiency.

[0032] Furthermore, the lifting mechanism 30 includes a mounting frame 31, a second stepper motor 32, a transmission screw 33, a positioning bearing and a transmission slider. The mounting frame 31 is installed on the workbench 10, the second stepper motor 32 and the positioning bearing are installed on the vertical sides of the mounting frame 31, and the two ends of the transmission screw 33 are respectively connected to the second stepper motor 32 and the positioning bearing; the transmission slider is threadedly engaged with the transmission screw 33, and a vertical slide rail 34 is provided on the mounting frame 31, and the transmission slider is slidably engaged with the vertical slide rail 34.

[0033] Specifically, when the linkage mechanism triggers the operation of the lifting mechanism 30, the second stepping motor 32 receives a pulse signal and starts to rotate, driving the transmission screw 33 to rotate. The rotation of the transmission screw 33 causes the transmission slider that is threadedly engaged with it to perform a linear motion under the constraint of the vertical slide rail 34. The upward or downward movement of the transmission slider is transmitted to the test mechanism 40 through the connecting component, realizing the lifting of the test mechanism 40. During the downward movement of the test mechanism 40, the probe module 42 gradually approaches the detection board 212 in the test slot 211 until the elastic probe contacts the pins of the detection board 212, completing the electrical test of the chip; after the test is completed, the second stepping motor 32 rotates in reverse, driving the transmission screw 33 to rotate in the reverse direction, causing the transmission slider to rise and driving the test mechanism 40 to rise and reset.

[0034] Furthermore, the test mechanism 40 includes a guiding base 41 and a probe module 42. The guiding base 41 is fixed to the lifting end of the lifting mechanism 30, and the probe module 42 is connected to the lower side of the guiding base 41; among them, the probe module 42 includes two rows of elastic probes arranged in parallel. The arrangement pitch of the elastic probes matches the pitch of the two rows of pins of the detection board 212. Each elastic probe is internally provided with a compression spring and has a gold-plated contact head at its end; a test circuit board is arranged inside the guiding base 41, and the probe module 42 is electrically connected to the test circuit board.

[0035] Specifically, during the test, when the linkage mechanism triggers the lifting mechanism 30 to drive the test mechanism 40 to descend, the probe module 42 moves downward accordingly. The gold-plated contact head at the end of the elastic probe gradually approaches and finally contacts the pins of the detection board 212. During the contact process, the internally provided compression spring can absorb a certain amount of impact force to ensure stable contact between the probe and the pins. The test circuit board obtains the electrical signals of the chip through the probe module 42 and processes and analyzes them. After the test is completed, the lifting mechanism 30 drives the test mechanism 40 to rise, and the probe module 42 is separated from the pins of the detection board 212, preparing for the next round of test.

[0036] Furthermore, an indicator light 43 is arranged on one side of the guiding base 41, and the indicator light 43 is electrically connected to the test circuit board.

[0037] Specifically, during the testing process, after the probe module 42 of the testing mechanism 40 contacts the pins of the detection board 212 and completes the electrical test, the testing circuit board immediately analyzes the collected signals. If the performance indicators of the chip meet the preset standards, the testing circuit board will light up the green indicator light 43; conversely, if a defect or performance problem is detected in the chip, the red indicator light 43 will be lit. The operator can quickly judge the test result of the chip by observing the color of the indicator light 43. After the test is completed, the lifting mechanism 30 drives the testing mechanism 40 to rise and reset, and the indicator light 43 automatically goes out during the reset process, preparing for the next round of testing. In this embodiment, the intuitive display of the indicator light 43 enables the operator to quickly judge the test result of the chip without having to delve into complex test data or reports, just by observing the color of the indicator light 43. This intuitive feedback method reduces the learning cost and operation time of the operator and improves production efficiency.

[0038] Please refer to Figure 1 , Figure 2 and Figure 3 , further, the linkage mechanism includes a controller 50 and a spring plunger 51. The spring plunger 51 is embedded in the horizontal slide rail 11. A plurality of clearance holes 213 are provided on one side of the moving plate 21 corresponding to the horizontal slide rail 11. The plurality of clearance holes 213 are in one-to-one correspondence with the plurality of test slots 211 in the horizontal direction perpendicular to the horizontal slide rail 11; when any one of the test slots 211 is directly below the testing mechanism 40, the spring plunger 51 is released and extends into the clearance hole 213; when all the test slots 211 are not directly below the testing mechanism 40, the spring plunger 51 is compressed under the lower side of the moving plate 21; wherein, a pressure sensor is provided between the spring plunger 51 and the horizontal slide rail 11, the pressure sensor is electrically connected to the controller 50, and the controller 50 is electrically connected to the second stepping motor 32; when the spring plunger 51 is released, the pressure sensed by the pressure sensor is less than the first preset pressure value, and the controller 50 sends a first pulse signal to the second stepping motor 32, and the lifting mechanism 30 drives the testing mechanism 40 to descend.

[0039] It should be explained that when the test slot 211 moves directly below the testing mechanism 40, the spring plunger 51 extends into the clearance hole 213 under the action of elastic force. At this time, the pressure detected by the pressure sensor decreases to below the first preset pressure value. After receiving the signal from the pressure sensor, the controller 50 determines that the test slot 211 is in place, and then sends a first pulse signal to the second stepping motor 32. The second stepping motor 32 drives the transmission screw 33 to rotate, driving the transmission slider to move downward along the vertical slide rail 34, thereby driving the testing mechanism 40 to descend, so that the probe module 42 contacts the pins of the detection board 212, preparing for the electrical test. After the test is completed, the linkage mechanism triggers the rising signal and drives the testing mechanism 40 to reset.

[0040] Optionally, the first preset pressure value can be 5N. This pressure value is comprehensively determined based on factors such as the elasticity of the spring plunger 51 and the weight of the moving plate 21, ensuring that when the test slot 211 accurately moves to directly below the test mechanism 40, the spring plunger 51 can smoothly extend into the clearance hole 213, and at the same time, the pressure sensor can reliably detect the pressure change.

[0041] Further, the linkage mechanism further includes a laser emitter 52 and a laser receiver 53. The laser emitter 52 and the laser receiver 53 are respectively arranged on both sides of the workbench 10, and the laser beam of the laser emitter 52 relative to the laser receiver 53 is blocked when the test mechanism 40 extends into the test slot 211; the laser receiver 53 is electrically connected to the controller 50. When the duration of no laser input to the laser receiver 53 reaches the first preset time, the controller 50 sends a second pulse signal opposite to the first pulse signal to the second stepping motor 32, and the lifting mechanism 30 drives the test mechanism 40 to rise.

[0042] In this embodiment, the laser emitter 52 and the laser receiver 53 are respectively arranged on both sides of the workbench 10 to make the laser beam pass through the path when the test mechanism 40 extends into the test slot 211. When the test mechanism 40 extends into the test slot 211, the laser beam is blocked; when the test mechanism 40 rises and disengages from the test slot 211, the laser beam resumes; the laser receiver 53 continuously monitors the state of the laser beam. When it detects that the laser beam is blocked and the duration reaches the first preset time, it sends a signal to the controller 50 to trigger the rising and reset action of the test mechanism 40.

[0043] Specifically, during the test, when the probe module 42 of the test mechanism 40 contacts the pins of the detection board 212 and starts the test, the laser beam emitted by the laser emitter 52 is blocked by the test mechanism 40. The laser receiver 53 detects that the laser beam is blocked and starts timing. If the time when the laser beam is blocked reaches the first preset time (for example, 2 seconds), the laser receiver 53 sends a signal to the controller 50. After receiving the signal, the controller 50 sends a second pulse signal to the second stepping motor 32 to drive the lifting mechanism 30 to drive the test mechanism 40 to rise, so that the test mechanism 40 disengages from the test slot 211 and completes the reset action.

[0044] Further, the controller 50 is also electrically connected to the first stepping motor 24. When the controller 50 sends a second pulse signal to the second stepping motor 32, the controller 50 also sends a third pulse signal to the first stepping motor 24; wherein, after receiving the third pulse signal, the first stepping motor 24 drives the moving plate 21 to move a distance equal to the interval distance between two adjacent test slots 211.

[0045] In this embodiment, for the case where the driving member of the feeding mechanism 20 is the first stepping motor 24, the controller 50 is not only connected to the second stepping motor 32 to control the lifting of the testing mechanism 40, but also connected to the first stepping motor 24 for controlling the horizontal movement of the moving plate 21. When the controller 50 sends a second pulse signal (for driving the testing mechanism 40 to rise and reset) to the second stepping motor 32, it simultaneously sends a third pulse signal to the first stepping motor 24. After receiving the third pulse signal, the first stepping motor 24 drives the moving plate 21 to move a distance equal to the interval between two adjacent test slots 211, ensuring that the next test slot 211 accurately moves to directly below the testing mechanism 40. Specifically, after the test is completed, the controller 50 sends a second pulse signal to the second stepping motor 32 to drive the lifting mechanism 30 to drive the testing mechanism 40 to rise and reset. At the same time, the controller 50 sends a third pulse signal to the first stepping motor 24. After receiving the signal, the first stepping motor 24 drives the transmission gear 22 to rotate, causing the moving plate 21 to move along the horizontal slide rail 11, thereby accurately moving the next test slot 211 to be tested directly below the testing mechanism 40 to prepare for the next round of testing.

[0046] The present invention provides a packaging test method, which is applied to the chip packaging test device of the first aspect, and includes the following steps: S100. Control the feeding mechanism to move horizontally so that the target test slot moves to directly below the testing mechanism; S200. When the target test slot arrives, the linkage mechanism triggers the first state, driving the lifting mechanism to drive the testing mechanism to descend, so that the probe module of the testing mechanism contacts the pins of the detection board; S300. Perform electrical testing on the packaged chip through the probe module; S400. If the test is completed and the laser receiver detects that the occlusion signal lasts for a second preset time, the linkage mechanism triggers the second state and drives the lifting mechanism to rise and reset; S500. Control the feeding mechanism to move to the position of the next test slot.

[0047] The above is only a preferred embodiment of the present invention, and does not impose any form of limitation on the present invention. Although the present invention has been disclosed above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make some changes or modifications to the above-disclosed technical content to form an equivalent embodiment with equivalent changes, but as long as it does not depart from the technical content of the present invention, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A chip packaging and testing device, characterized in that: The chip packaging test device includes a workbench and a feeding mechanism passing through the workbench, the feeding mechanism being movably connected to the workbench in a horizontal direction; the feeding mechanism is provided with a plurality of test slots for storing packaged chips along its moving direction, and the bottom of the test slots is provided with two rows of detection plates corresponding to the pins on both sides of the packaged chips; the chip packaging test device also includes a lifting mechanism provided on the workbench, the lifting end of the lifting mechanism being connected to a test mechanism, and the lifting mechanism drives the test mechanism to move in a vertical direction so that the test mechanism can enter or exit the test slot directly below it; In which, the chip packaging testing device also includes a linkage mechanism, which has a first state and a second state; when any of the test slots moves to the bottom of the test mechanism, the first state of the linkage mechanism is triggered, and the linkage mechanism responds and drives the lifting mechanism to drive the test mechanism to descend to probe into the corresponding test slot; when any of the test slots moves away from the bottom of the test mechanism, the second state of the linkage mechanism is triggered, and the linkage mechanism responds and drives the lifting mechanism to drive the test mechanism to rise to escape from the corresponding test slot.

2. The chip package testing device according to claim 1, wherein: The feeding mechanism includes a movable plate, a transmission gear, and a driving member. The workbench is provided with two symmetrical horizontal slide rails. The two sides of the movable plate are slidably engaged with the two horizontal slide rails. The test slot is opened on the upper side of the movable plate. The bottom side of the movable plate is provided with a toothed portion. The transmission gear is rotatably connected to the workbench below the movable plate, and the transmission gear is meshed with the toothed portion. The driving member is transmission-connected to the transmission gear. In which, the driving member includes a manual wheel, which is rotated by operating the manual wheel to drive the transmission gear to rotate, so that the movable plate moves in the horizontal direction; and / or the driving member includes a first stepper motor, which drives the transmission gear to rotate by the first stepper motor to move the movable plate in the horizontal direction.

3. The chip packaging and testing device according to claim 2, characterized in that: A plurality of the test slots are arranged at equal intervals on the upper side of the movable plate along the moving direction thereof.

4. A chip package testing device according to claim 2, wherein: The lifting mechanism includes a mounting frame, a second stepper motor, a transmission screw, a positioning bearing and a transmission slider. The mounting frame is installed on the workbench, the second stepper motor and the positioning bearing are installed on the vertical sides of the mounting frame, and the two ends of the transmission screw are respectively connected to the second stepper motor and the positioning bearing; the transmission slider is threadedly engaged with the transmission screw, and a vertical slide rail is provided on the mounting frame, and the transmission slider is slidably engaged with the vertical slide rail.

5. The chip package testing device according to claim 4, wherein: The test mechanism includes a guiding base and a probe module. The guiding base is fixed to the lifting end of the lifting mechanism, and the probe module is connected to the lower side of the guiding base. Among them, the probe module includes two rows of elastic probes arranged in parallel. The arrangement pitch of the elastic probes matches the pitch of the two rows of pins on the detection board. Each elastic probe is internally provided with a compression spring and has a gold-plated contact head at its end. A test circuit board is arranged inside the guiding base, and the probe module is electrically connected to the test circuit board.

6. The chip package testing device according to claim 5, wherein: An indicator light is arranged on one side of the guiding base, and the indicator light is electrically connected to the test circuit board.

7. The chip packaging and testing device according to claim 4, characterized in that: The linkage mechanism includes a controller and a spring plunger. The spring plunger is embedded in the horizontal slide rail. A plurality of clearance holes are arranged on one side of the moving plate corresponding to the horizontal slide rail. The plurality of clearance holes are in one-to-one correspondence with the plurality of test slots in the horizontal direction perpendicular to the horizontal slide rail. When any one of the test slots is directly below the test mechanism, the spring plunger is released and extends into the clearance hole. When all the test slots are not directly below the test mechanism, the spring plunger is compressed under the moving plate. Among them, a pressure sensor is arranged between the spring plunger and the horizontal slide rail. The pressure sensor is electrically connected to the controller, and the controller is electrically connected to the second stepping motor. When the spring plunger is released, the pressure sensed by the pressure sensor is less than the first preset pressure value, and the controller sends a first pulse signal to the second stepping motor, and the lifting mechanism drives the test mechanism to descend.

8. The chip package testing device according to claim 7, characterized in that: The linkage mechanism further includes a laser emitter and a laser receiver. The laser emitter and the laser receiver are respectively arranged on both sides of the workbench, and the laser beam of the laser emitter relative to the laser receiver is blocked when the test mechanism extends into the test slot. The laser receiver is electrically connected to the controller. When the continuous non-laser input time of the laser receiver reaches the first preset time, the controller sends a second pulse signal opposite to the first pulse signal to the second stepping motor, and the lifting mechanism drives the test mechanism to ascend.

9. The chip package testing device according to claim 8, wherein: The controller is also electrically connected to the first stepping motor. When the controller sends the second pulse signal to the second stepping motor, the controller also sends a third pulse signal to the first stepping motor. Among them, after the first stepping motor receives the third pulse signal, the moving distance of the driven moving plate is the same as the interval distance between two adjacent test slots.

10. A packaging and testing method, characterized in that, Applied to the chip packaging test device according to any one of claims 1-9, it includes the following steps: Control the feeding mechanism to move horizontally so that the target test slot moves directly below the test mechanism. When the target test slot is in place, the linkage mechanism triggers the first state, drives the lifting mechanism to drive the test mechanism to descend, and makes the probe module of the test mechanism contact the pins of the detection board. Conduct electrical tests on the packaged chip through the probe module. If the test is completed and the laser receiver detects that the occlusion signal lasts for the second preset time, the linkage mechanism triggers the second state and drives the lifting mechanism to rise and reset; Control the feeding mechanism to move to the position of the next test slot.

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